JP2001300450A - Method and apparatus for cleaning for reticule, and method for producing reticule - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for cleaning the surfaces of reticule, wafer, etc., sufficiently, and an apparatus for the method. SOLUTION: An object X is irradiated with laser beam L2 for laser cleaning, and an atmosphere close to the object X is irradiated with laser beam L1 which can be positioned independent of the laser beams L2 for ozone cleaning so that effective cleaning can be accomplished.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a cleaning apparatus, a cleaning method, and a reticle manufacturing method.

[0002]

2. Description of the Related Art In the process of manufacturing a reticle used for a semiconductor manufacturing stepper or the like, foreign substances such as dust may adhere to the reticle surface. If exposure is performed with such foreign matter adhered, accurate patterning becomes difficult. Therefore, in the reticle manufacturing process, the manufactured reticle is cleaned. Conventionally, as a cleaning method for removing foreign matter on the reticle surface, there have been methods such as a laser cleaning method and an ozone cleaning method. The laser cleaning method is a cleaning method for irradiating a cleaning object such as a reticle with laser light to remove foreign matter. Foreign matter on the surface of the object to be cleaned causes ablation (local destruction of the exposed portion) or the like due to absorption of the laser beam and causes minute vibration, and thus is separated and removed from the substrate surface. Such a laser cleaning method is described in, for example, JP-A-11-26411. The ozone cleaning method is a method in which ozone is sprayed on the surface of the object to be cleaned, and the surface is cleaned by irradiating ultraviolet rays. The ozone blown onto the surface of the object to be cleaned absorbs the energy of the ultraviolet light applied to the object to be cleaned and is decomposed into oxygen molecules and active oxygen. This active oxygen oxidizes with organic contaminants attached to the surface of the object to be cleaned, and chemically changes into carbon monoxide, carbon dioxide, and water,
The air diffuses from the surface of the object to be cleaned. Such an ozone cleaning method is described in JP-A-10-289853 and “Applied Physics”, June 1998, p. 673 etc.

[0003]

However, if minute dust adheres to the reticle surface, it may be difficult to remove the dust in both laser cleaning and ozone cleaning. In the case of laser cleaning, the energy intensity of the laser light to be irradiated is limited so as not to damage the mask on the reticle. However, when the energy intensity of the laser beam is limited, sufficient energy for cleaning is not absorbed, so that a large cleaning effect cannot be obtained. In particular, when minute dust is in close contact with the reticle, the amount of energy absorbed is small because the volume of the dust is small, but the vibration of the dust is suppressed by the close contact, so that the effect of laser cleaning is considerably reduced. For this reason, it often happens that minute dust is not removed. On the other hand, ozone cleaning is intended to oxidize organic substances to remove dust, and therefore has no effect on inorganic dust.
When the flow of the ozone gas has directionality due to the influence of the gas flow and the like, the cleaning effect also has directionality, and unwashing often occurs. SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a cleaning apparatus and a cleaning method capable of removing minute dust adhered to the surface of an object to be cleaned. Another object of the present invention is to provide a reticle manufacturing method capable of increasing the yield by cleaning the reticle using this cleaning method in the reticle manufacturing cleaning step.

[0004]

According to the present invention, there is provided a container for accommodating an object to be cleaned, and a first laser having a wavelength of 200 nm or less in a gas surrounding the object to be cleaned. A first laser light irradiating means for irradiating light, and a second laser light for irradiating the surface of the object to be cleaned with a second laser light having a wavelength of 400 nm or less such that the first laser light can be positioned independently of the first laser light. 2 laser light irradiation means;
A cleaning device comprising: Also,
The first laser light irradiation means is an ArF excimer laser device or an F2 excimer laser device, wherein the cleaning device is provided. Further, the cleaning apparatus is characterized in that the converging points of the first laser light and the second laser light substantially coincide with each other. The object to be cleaned is a reticle, and the laser beam irradiating means is configured to irradiate the first laser beam substantially parallel to a surface of the reticle. It is a washing | cleaning apparatus of description. A laser beam irradiating unit for irradiating a laser beam having a wavelength of 400 nm or less to the surface of the object to be cleaned; a rotating unit for rotating the object to be cleaned around a position irradiated with the laser beam; An incident angle changing means for changing an incident angle of the laser light applied to an object surface. Further, the cleaning apparatus is characterized in that a rotating means for rotating the object to be cleaned is added around a position irradiated by the second laser light. The cleaning apparatus further includes an incident angle changing unit that changes an incident angle of the second laser light applied to the surface of the object to be cleaned. A first laser light irradiation step of irradiating a gas around the object to be cleaned with a first laser light having a wavelength of 200 nm or less, and a second laser light having a wavelength of 400 nm or less that can be positioned independently of the first laser light. And a second laser light irradiating step of irradiating the laser light to the object to be cleaned. 8. The cleaning method according to claim 7, wherein the cleaning is performed such that a focal point of the first laser light and a focal point of the second laser light substantially coincide with each other. 8. The apparatus according to claim 7, wherein the object to be cleaned is a reticle, and the first laser beam irradiates a gas around the object to be cleaned substantially parallel to a surface of the reticle. This is a cleaning method. Also,
An irradiation step of irradiating the surface of the object to be cleaned with laser light having a wavelength of 400 nm or less, a rotation step of rotating the object to be cleaned around the irradiation position while irradiating the laser light, An incident angle changing step of changing an incident angle of the laser beam irradiated on the surface of the object to be cleaned while irradiating the surface of the object to be cleaned. While irradiating the first and second laser beams,
8. The cleaning method according to claim 7, further comprising a rotation step of rotating the object to be cleaned around a position irradiated by the laser light. In addition, an incident angle changing step of changing an incident angle of the second laser light applied to the surface of the cleaning object with respect to the surface of the cleaning object while irradiating the second laser light is added. The cleaning method according to claim 11, wherein A film-forming step of forming a light-shielding film on a transparent substrate; and an etching step of forming a pattern by etching a predetermined portion of the light-shielding film formed in the film-forming step to form a reticle;
A reticle manufacturing method comprising: a cleaning step of cleaning the reticle manufactured by the etching step.
The cleaning step is a method for manufacturing a reticle, wherein the reticle is cleaned by using the cleaning method according to claim 8 or 11.

Embodiments of the present invention will be described below with reference to the drawings. (First Embodiment) FIG. 1 shows a configuration diagram of a cleaning apparatus 10 according to a first embodiment. An outline of cleaning in the cleaning apparatus 10 will be described. First, the ultraviolet laser light L1
And L2 are irradiated. The ultraviolet laser beam L1 is the cleaning object X whose oxygen concentration has been increased by the oxygen supply device 11.
Is irradiated to the surrounding gas to generate ozone for ozone cleaning. On the other hand, the ultraviolet laser beam L2 is
Is irradiated on the surface of the object to be cleaned, thereby performing laser cleaning of dust on the surface of the object X to be cleaned. Therefore, the object X to be cleaned is subjected to laser cleaning and ozone cleaning at the same time.
Hereinafter, each component of the cleaning device 10 will be described.
The ArF laser 13a emits ultraviolet laser light L1 having a wavelength of 193 nm. The ArF laser 13a is mounted beforehand so that the ultraviolet laser beam L1 irradiates a position about 1 mm above the cleaning object X in parallel with the cleaning object X. The output of the ultraviolet laser beam L1 is adjusted by the variable attenuator 17a to an output suitable for generating ozone, for example, 300 W. The ultraviolet laser beam L1 is collected by the condenser lens 14a. The condensing lens 14a has a configuration capable of three-dimensional alignment.

[0005] The total reflection mirror 15 reflects the ultraviolet laser light L2 so that the ultraviolet laser light L2 is irradiated perpendicularly to the object X to be cleaned. The focal point of the ultraviolet laser beam L2 is adjusted in advance by the condenser lens 14b so as to substantially coincide with the focal point of the ultraviolet laser beam L1, that is, about 1 mm above the object X to be cleaned. The output of the ultraviolet laser beam L2 is adjusted by a variable attenuator 17b so that the energy intensity on the surface of the cleaning object X is adjusted to 150 mJ / cm2. The oxygen supply device 11 supplies oxygen molecules into the container 12. The XY table 16 supports the cleaning object X, which is the cleaning object X, and moves the cleaning object X in the horizontal direction so that the dust detected on the cleaning object X is irradiated with the ultraviolet laser beam L2. Let it. The container 12 has a function of preventing dust from adhering to the object X to be cleaned from the outside, preventing diffusion of oxygen molecules supplied from the oxygen supply device 11, and maintaining a constant oxygen concentration in the container 12. Have. In addition, incident windows 15a and 15b made of quartz glass for transmitting the ultraviolet laser beams L1 and L2 are provided on the top and side surfaces of the container 12.

The operation of the cleaning in the above configuration will be described below. First, the cleaning object X is set on the XY table 16. The cleaning object X is a reticle. This reticle has a chromium film pattern formed on quartz glass. Subsequently, the entire surface of the cleaning object X is imaged by a CCD camera (not shown). The image data obtained by imaging is compared with the design data when there is no dust. The presence or absence of dust and the position of the dust are detected by this comparison. Then, the XY table 16 is set based on the image data so that the dust is irradiated with the ultraviolet laser beam L2.
Is driven to move the cleaning object X. Next, the oxygen supply device 11 is activated, and clean oxygen is supplied to the container 12 from the oxygen supply port. Therefore, the oxygen concentration in the container 12 increases. Further, since excess gas is exhausted from the exhaust port, a gas flow is generated from the oxygen supply port toward the exhaust port. Subsequently, the ArF laser beams 13a and 13b are activated. The ultraviolet laser beam L1 emitted from the ArF laser beam 13a passes through the entrance window 15a and is focused 1 mm above the object X to be cleaned. The ultraviolet laser beam L2 emitted from the ArF laser beam 13b passes through the entrance window 15b and irradiates the cleaning object X from above.

The oxygen molecules in the container 12 absorb the ultraviolet laser beams L1 and L2 and chemically change to ozone. The dust on the surface of the cleaning object X is oxidized by the ozone and diffuses from the surface of the cleaning object X. Since the focal points of the ultraviolet laser beams L1 and L2 substantially coincide, the ozone concentration becomes highest near this focal point. For this reason, the ozone cleaning effect is large on the surface of the cleaning object X around the light collection point. On the other hand, since the focal point of the ultraviolet laser light L2 is set in advance so as to be 1 mm above the surface of the object X to be cleaned, the ultraviolet laser light L2 which is slightly spread is applied as shown in FIG. The energy density on the surface of the cleaning object X is 150 mJ / cm2 or less. With this energy intensity, there is no possibility of melting or damaging the chromium film forming the pattern. The dust on the surface of the cleaning object X vibrates minutely by the irradiation of the ultraviolet laser light L2, and is separated and removed from the surface of the cleaning object X. Dust and the like generated by both washings are exhausted from an exhaust port by a gas flow. After the cleaning for a predetermined time, the irradiation of the ultraviolet laser beams L1 and L2 is temporarily stopped. Then, the XY table 16 is driven so that the ultraviolet laser light L2 is irradiated on another dust. Then, ultraviolet laser beams L1 and L2 are irradiated again to perform cleaning.
As described above, cleaning is performed on all dust on the cleaning target X.

As described above, dust on the surface of the cleaning object X is sufficiently cleaned by ozone cleaning and laser cleaning. Ozone for performing ozone cleaning is generated by ultraviolet laser beams L1 and L2. Among them, the ultraviolet laser light L2 irradiated to the object to be cleaned to perform the laser cleaning.
It is necessary to limit the output so as not to damage the object to be cleaned. However, if the output is limited, ozone generation is not performed appropriately, and the effect of ozone cleaning may be small. However, in the case of the cleaning device 10 according to the present invention, a high-output ultraviolet laser beam L1 for generating ozone is used.
Is provided separately and independently from the ultraviolet laser beam L2 for laser cleaning, and the ultraviolet laser beam L1 is applied only to the atmosphere without irradiating the object to be cleaned, thereby achieving an ozone cleaning effect without damaging the object to be cleaned. Can be increased. Further, by making the focal point of the ultraviolet laser beam L1 coincide with the focal point of the ultraviolet laser beam L2 for laser cleaning, the position where the laser cleaning is performed and the position where the ozone cleaning effect is large coincide with each other. And ozone cleaning are performed simultaneously, so that the effects of both cleanings act synergistically to further enhance the cleaning effect. When the object to be cleaned is not easily damaged, the ultraviolet laser light L1 for generating ozone is used.
May be directly applied to the object to be cleaned.

Further, the ultraviolet laser beam L1 for generating ozone may be plural. In this case, a large amount of ozone is generated by using a plurality of ultraviolet laser beams and making the focal points coincide with each other, so that the ozone cleaning effect can be enhanced. Further, instead of the oxygen supply device, a clean gas obtained by filtering air may be supplied. Further, instead of the oxygen supply device, ozone may be supplied by an ozone generation device. In this case, the ozone is decomposed into active oxygen and oxygen molecules by the ultraviolet laser light. Ozone cleaning is performed by the active oxygen. Alternatively, a mechanism may be used in which a split light source is used to split ultraviolet laser light for laser cleaning and ultraviolet laser light for ozone cleaning from the same light source. In this case, the cleaning can be performed by one light source, which is advantageous in cost. Further, the object to be cleaned is not limited to a reticle having a pattern formed with a chromium film. For example, a silicon wafer, a reticle having a pattern formed of a material other than a chromium film, or an optical element such as a lens can be cleaned in the present embodiment. When a pattern or the like is not formed on the surface of the object to be cleaned, it is possible to perform cleaning by increasing the energy density of the surface of the object to be cleaned. For example, when cleaning a lens, cleaning may be performed by concentrating an ultraviolet laser beam on the lens surface.

The ultraviolet laser beam is not limited to the ArF excimer laser beam, but may be a fourth harmonic of an F2 excimer laser beam or a YAG laser beam, or an X-ray or a soft X-ray. However, it is desirable that the wavelength is 240 nm or less in order to perform ozone cleaning suitably. In addition, the repetition frequency and output of each of the ultraviolet laser beams L1 and L2 can be appropriately adjusted depending on a cleaning target. In addition, the effect of ozone cleaning can be enhanced by increasing the output of the ultraviolet laser light. Various other modifications are possible for the same purpose. (Second Embodiment) FIG. 3 shows a configuration diagram of a cleaning apparatus 30 according to a second embodiment. The cleaning device 30 includes a laser device 31 that emits an ultraviolet laser beam L3 for laser-cleaning an object to be cleaned X, a beam homogenizer 32 for adjusting the output of the ultraviolet laser beam L3, and an ultraviolet laser beam L3. A total reflection mirror 33 for positioning the optical axis of the laser beam, and the ultraviolet laser beam L3 is
A condenser lens 34 for condensing light near the surface, an XYZ table 35 for supporting the object X to be cleaned, a table driver 36 for controlling the XYZ table 35, and XY
A table 37 for supporting and fixing the Z table 35, a motor 38 for rotating the cleaning object X, a motor 38 control unit for controlling the motor 38, and a guide for changing the incident angle of the ultraviolet laser beam L3 40, a guide table 41, a guide control unit 42 for controlling the guide 40, and an XY table driver 36, a motor control unit 39, a guide control unit 42, and a main controller 43 for controlling the laser device 31.
And Hereinafter, each component will be described.

The laser device 31 is a KrF excimer laser device. The oscillation repetition number of the emitted laser light is 2
00 Hz. Total reflection mirror 33 and condenser lens 3
4 is an ultraviolet laser beam L emitted from the laser device 31
Adjust the position of the optical axis and the light condensing point of No. 3. As shown in FIG. 4A, the focal point of the ultraviolet laser light L3 is adjusted so as to be about 1 mm directly above a rotation center axis C1 of a guide 40 described later. The optical axis of the ultraviolet laser beam L3 is adjusted to be substantially vertical. As will be described later, the object to be cleaned X is placed such that the rotation center axis C1 is located on the surface of the object to be cleaned X.
For this reason, as shown in FIG. 4B, the surface of the cleaning object X is irradiated with the ultraviolet laser light L3 that has spread slightly. The energy intensity of the ultraviolet laser beam L3 is adjusted in advance by the beam homogenizer 32 on the surface of the cleaning object X so as to be 150 mJ / cm2 or less. The XYZ table 35 has a function of supporting the cleaning target X and moving the cleaning target X to adjust the position where the ultraviolet laser light L3 is irradiated. Further, by adjusting the Z direction of the XYZ table 35, that is, the normal direction of the object X to be cleaned, the rotation center axis C1 is preset on the surface of the object X to be cleaned. The XYZ table 35 is fixed on the table 37.

The motor 38 has a function of rotating the XYZ table 35. The rotation direction is reversed every 360 degrees at 60 rpm. Since there is a position on the rotation axis C2 of the motor 38 where the ultraviolet laser light L3 is irradiated, the object X to be cleaned rotates around the position where the ultraviolet laser light L3 is irradiated. The guide 40 reciprocates around the rotation center axis C1 in the direction of the arrow 50 shown in FIG. 3 from 0 degree to 90 degrees at a cycle of 0.5 Hz. Due to the reciprocating movement of the guide 40, the cleaning object X rotates around the rotation center axis C1. Due to the rotation of the cleaning object X, the cleaning object X of the ultraviolet laser beam L3 is
Angle of incidence from near 90 ° to 0 ° 0.5Hz
Will change periodically. The operations of the XYZ table 35, the motor 38, the guide 40, and the motor 38 are controlled by a table driver 36, a motor control unit 39, and a guide control unit 42, respectively. And
The table driver 36, the motor control unit 39, the guide control unit 42, and the laser device 31 operate based on a command from the main controller 43. With the above configuration, the operation of the cleaning will be described. First, the cleaning object X is set on the XYZ table 35. The object X to be cleaned is a reticle in which a pattern of a chromium film is formed on synthetic quartz glass.

Subsequently, the reticle surface is imaged by a CCD camera (not shown). The captured image data is compared with ideal design data used for forming a pattern, and the position of dust is detected. Then, the XYZ table 35 is driven, and the object X to be cleaned is moved so that the position of the dust is irradiated with the ultraviolet laser beam L3. Laser cleaning is performed under the above initial settings. The ultraviolet laser light L3 emitted from the laser device 31 irradiates the dust D on the surface of the cleaning object X. Simultaneously with this irradiation, the object to be cleaned X is rotated by the motor 38 about the rotation center axis C2.
As shown in FIG. 5A, the dust D is the rotation center axis C2.
Since the dust D is located above, the dust D does not move in translation, and the dust D is constantly irradiated with the ultraviolet laser beam L3. Further, while the dust D rotates, the optical axis of the ultraviolet laser light L3 does not move, so that the ultraviolet laser light L3 is irradiated from all directions of the dust. The guide 40 also rotates about the rotation center axis C1 along with the rotation by the motor 38. As shown in FIG.
With the rotation of, the object X to be cleaned also rotates around the rotation center axis C1. Therefore, the incident angle of the ultraviolet laser beam L3 with respect to the object X to be cleaned continuously changes from 0 degree to nearly 90 degrees. As a result, the ultraviolet laser light L3 is irradiated from all directions of the dust D at all incident angles.

In general, in the case of laser cleaning, it is more effective to irradiate the portion where the dust and the object X to be cleaned are not in close contact with each other with ultraviolet laser light. As shown in FIG. 6A, when the dust D1 is in close contact with the object X to be cleaned on the left side of the paper and the dust D1 is not in close contact with the object X to be cleaned on the right side of the paper, as follows. The dust D1 is separated and removed. When the ultraviolet laser light L3 is irradiated on the left side of the dust D1 as shown in FIG. 6A, the vibration of the dust D1 due to the absorption of the ultraviolet laser light L3 is absorbed by the object X to be cleaned. It does not peel off from the cleaning object X.
However, as shown in FIG. 6B, when the right side of the dust D1 is irradiated with the ultraviolet laser beam L3, the right portion of the dust D1 is not in close contact with the cleaning object X, so that the dust D1
Vibrates. Then, this vibration propagates to the left side of the dust D1 according to the principle of leverage, with the point at which the dust D1 and the cleaning object X are closest to each other as a fulcrum. The dust D1 is separated from the cleaning object X by such vibration. Also,
As shown in FIG. 7, when the central portion of the dust D2 is separated from the object X to be cleaned and is close to the periphery, the dust D2 does not vibrate when the incident angle of the ultraviolet laser beam L3 is about 45 degrees. When the incident angle is about 0 degrees, the dust D2 is separated and removed.

The above laser cleaning is performed for all dust recognized by the CCD camera, and the cleaning is completed. The dust adheres to the cleaning object X without regularity with respect to the cleaning object X. Therefore, when the dust is to be peeled off from the substrate, the incident angle and direction of the laser beam optimal for the peeling and removal do not have regularity. In the present invention, the object to be cleaned X is rotated by using the motor 38 and the guide 40, so that one dust is irradiated with ultraviolet laser light from all directions and all incident angles.
Therefore, it is possible to remove dust that could not be removed by the conventional method. Note that it is also possible to supply oxygen into the container 44 containing the object X to be cleaned, and to simultaneously obtain the effect of ozone cleaning. In addition, this embodiment can be variously modified for the same purpose. (Third Embodiment) The cleaning device according to the third embodiment is a cleaning device that combines the cleaning device according to the first embodiment and the cleaning device according to the second embodiment. is there. That is, the cleaning device 30 according to the second embodiment
In addition, an ultraviolet laser light irradiation unit for cleaning ozone and an oxygen supply unit are added to the embodiment. Specifically, an oxygen supply device for supplying oxygen into the container is added.
In addition, a window made of quartz glass is provided in this container, and an ultraviolet laser beam for generating ozone is irradiated from the window. The optical axis of the ultraviolet laser beam is positioned in a direction substantially parallel to the rotation axis C1 of the object X to be cleaned by the guide, that is, in a direction perpendicular to the plane of FIG. Such positioning prevents the object X to be cleaned from being irradiated with ultraviolet laser light for generating ozone even when the object X to be cleaned is rotated. The focal point of the ultraviolet laser light for generating ozone is adjusted so as to substantially coincide with the focal point of the ultraviolet laser light for laser cleaning.

In the case of cleaning in the above configuration, an ultraviolet laser beam for generating ozone is provided independently of the ultraviolet laser beam for laser cleaning, and the ultraviolet laser beam is not irradiated to the object to be cleaned. It becomes possible to irradiate the atmosphere. Therefore, it is not necessary to limit the output of the laser beam so as not to damage the object to be cleaned, so that the effect of ozone cleaning can be enhanced. Further, by rotating the object to be cleaned X, one laser beam is irradiated with ultraviolet laser light from all directions and all incident angles. Therefore, the effect of laser cleaning is enhanced. Further, the generated ozone is blown from all directions by the rotation of the cleaning object X. Ozone flows along the direction of gas flow in the container. Therefore, in the conventional method, the effect of the ozone cleaning was uneven. However, the rotation of the cleaning object X enables the ozone cleaning to be performed evenly. This embodiment can be variously modified as described above. (Fourth Embodiment) The fourth embodiment relates to a method for manufacturing a reticle. The reticle manufacturing process includes a film forming process of forming a light shielding film on a transparent substrate, an etching process of etching a predetermined portion of the light shielding film formed by the film forming process, and a cleaning process formed by the etching process. A cleaning step of cleaning the object X.

First, a film forming step is performed. As shown in FIG. 8A, a chromium film 82 serving as a light-shielding film is formed to a thickness of about 100 nm on a sufficiently polished and cleaned synthetic quartz glass substrate 81 by a sputtering film forming method. . Next, an etching step is performed. As shown in FIG.
An electron beam resist 83 is applied on the chromium film 82 with a thickness of about 50 nm using a spinner. After exposure to a desired pattern using the electron beam lithography apparatus, development is performed. Subsequently, plasma etching is performed on the chromium film 82 using a chlorine-based gas to form a pattern as shown in FIG. Thereafter, as shown in FIG. 8D, ashing is performed to remove the electron beam resist. Then, the manufactured reticle is cleaned. Cleaning is performed in the same manner as in the first embodiment. That is, the reticle is cleaned by using the cleaning method described in the first embodiment, and dust adhering to the reticle surface is removed. A reticle was manufactured as described above. As a result, fine dust adhering to the reticle can be removed. Therefore, it has become possible to manufacture a reticle with an improved yield. The cleaning object X may be cleaned using the cleaning method described in the second embodiment or the cleaning method described in the third embodiment.

The method of manufacturing a reticle according to the present invention is not limited to the present embodiment, but can be variously modified in the same spirit.

[0019]

As described above in detail, according to the present invention, laser light for performing ozone cleaning and laser light for performing laser cleaning are independently irradiated, so that cleaning more effective than before can be performed. Becomes

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a cleaning device according to a first embodiment of the present invention.

FIG. 2 is a schematic diagram showing an object to be cleaned X irradiated with an ultraviolet laser beam in the first embodiment of the present invention.

FIG. 3 is a configuration diagram of a cleaning device according to a second embodiment of the present invention.

FIG. 4 is a schematic diagram showing a positional relationship between a rotation center axis of an object to be cleaned X and a focal point of an ultraviolet laser beam in the second embodiment of the present invention.

FIG. 5 is a schematic view showing a state in which the cleaning object X rotates around dust on the cleaning object X in the second embodiment of the present invention.

FIG. 6 is a schematic diagram showing that dust on an object to be cleaned X is irradiated with an ultraviolet laser beam in the second embodiment of the present invention.

FIG. 7 is a schematic diagram illustrating that dust on an object to be cleaned X is irradiated with an ultraviolet laser beam in the second embodiment of the present invention.

FIG. 8 is a schematic view showing a reticle manufacturing process according to a fourth embodiment of the present invention.

[Explanation of symbols]

11 ... oxygen supply device, 12 ... container, 13a ...
ArF laser light, 13b ... ArF laser light, 31
... Laser devices 31, 38 ... Motors 38, 40
..Guide, 41 ... Guide stand.

Claims (14)

[Claims] A container for accommodating an object to be cleaned; a first laser light irradiating unit for irradiating a gas around the object to be cleaned with a first laser light having a wavelength of 200 nm or less; Wavelength 4
A second laser beam irradiating unit for irradiating the surface of the object to be cleaned with a second laser beam of not more than 00 nm. 2. The method according to claim 1, wherein the first laser beam irradiating means is ArF
The cleaning device according to claim 1, wherein the cleaning device is an excimer laser device or an F2 excimer laser device. 3. The cleaning apparatus according to claim 1, wherein the focal points of the first laser light and the second laser light substantially coincide with each other. 4. The apparatus according to claim 1, wherein the object to be cleaned is a reticle, and the laser beam irradiating means is configured to irradiate the first laser beam substantially parallel to a surface of the reticle. The cleaning device according to claim 1. 5. A laser beam irradiating unit for irradiating a laser beam having a wavelength of 400 nm or less to a surface of an object to be cleaned, a rotating unit for rotating the object to be cleaned around a position where the laser beam is irradiated, A cleaning device, comprising: an incident angle changing unit configured to change an incident angle of the laser light applied to the surface of the object to be cleaned. 6. The cleaning apparatus according to claim 1, further comprising a rotation unit configured to rotate the object to be cleaned around a position irradiated by the second laser light. 7. The cleaning apparatus according to claim 5, further comprising an incident angle changing means for changing an incident angle of the second laser light irradiated on the surface of the object to be cleaned. 8. A first laser light irradiation step of irradiating a gas around a cleaning object with a first laser light having a wavelength of 200 nm or less, and a wavelength of 400 nm or less which can be positioned independently of the first laser light. And a second laser light irradiation step of irradiating the object to be cleaned with the second laser light. 9. A light-converging point of the first laser beam and the second laser beam
9. The cleaning method according to claim 8, wherein the cleaning is performed so that the focal points of the laser light substantially coincide with each other. 10. The object to be cleaned is a reticle, and the first laser beam irradiates a gas around the object to be cleaned substantially parallel to a surface of the reticle. 9. The washing method according to 8. 11. An irradiation step of irradiating a laser light having a wavelength of 400 nm or less to the surface of the object to be cleaned, and a rotating step of rotating the object to be cleaned around the irradiated position while irradiating the laser light. An incident angle changing step of changing an incident angle of the laser light applied to the surface of the object to be cleaned while irradiating the laser light. . 12. A rotation step for rotating the object to be cleaned around a position irradiated by the second laser light while irradiating the first and second laser lights. The cleaning method according to claim 8, wherein the cleaning method is performed. 13. While irradiating the second laser light,
12. The cleaning method according to claim 11, further comprising an incident angle changing step of changing an incident angle of the second laser beam applied to the cleaning object surface with respect to the cleaning object surface. 14. A film-forming step of forming a light-shielding film on a transparent substrate, and an etching step of forming a pattern by etching a predetermined portion of the light-shielding film formed in the film-forming step to form a reticle. A cleaning step of cleaning the reticle manufactured by the etching step, wherein the cleaning step cleans the reticle using the cleaning method according to claim 8 or 11. A method of manufacturing a reticle.