JP2001296648A - Mask for exposure and method for producing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mask for exposure, using nickel plating. SOLUTION: In the mask for exposure for forming a circuit pattern obtained, by disposing at least a nickel-containing light-shielding film on a transparent substrate, the light-shielding film is held by a metal oxide layer on the transparent substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an exposure mask for forming a circuit pattern and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventional exposure masks include Isao Tanabe and
According to Yoichi Takebana and Morihisa Homoto, "Story of Photomask Technology," Industrial Research Committee (1996), silver salt emulsion, chromium, silicon, Emulsion masks, hard masks, and the like using metals such as iron oxide and molybdenum silicide as light-shielding films have been known. Hard masks using chromium were well known, such as durability against ultraviolet light, good heat resistance of the light-shielding film, good mechanical strength, and the ability to form fine patterns. Due to the toxicity of chromium effluent, its handling has been restricted.

On the other hand, a technique for applying nickel to various surfaces by electroless plating has been described in A. A. in 1946. Brenner
R & D has been actively conducted since the publication of this research, and a nickel coating with few pinholes and high hardness has been obtained. However, since adhesion and wettability are inferior to chromium on a transparent substrate such as glass, the use of a thin film as an exposure mask has not been studied much.

[0004]

SUMMARY OF THE INVENTION An object of the present invention is to provide an exposure mask using a light-shielding film containing nickel and a method of manufacturing the same.

[0005]

The present inventors have studied and found that, in an exposure mask for forming a circuit pattern in which a light-shielding film containing at least nickel is provided on a transparent substrate, the light-shielding film is An exposure mask, which is held on a transparent substrate by a metal oxide layer.
A light-shielding film containing at least nickel is provided on a transparent substrate.In an exposure mask for forming a circuit pattern, the light-shielding film is formed on a physical development nucleus held on the transparent substrate by a metal oxide layer. An exposure mask formed by electroless plating. A method for manufacturing an exposure mask, wherein a light-shielding film containing at least nickel held on a transparent substrate by a metal oxide layer is etched using a photoresist. The object has been solved by an exposure mask, wherein the light-shielding film contains phosphorus.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.
In the present invention, first, a circuit pattern is formed by a light-shielding film containing at least nickel on a transparent substrate by electroless plating. This circuit pattern is prepared by forming a light-shielding film on the entire surface of a transparent substrate in advance and then removing the light-shielding film with a photoresist, or forming a circuit pattern with a photoresist on a transparent substrate in advance and forming a resist on the transparent substrate. There are two methods for forming and manufacturing a circuit pattern by a light-shielding film by electroless plating on a non-existing portion.

As the transparent substrate, soda lime glass such as soda lime and white crown, low expansion glass such as borosilicate, alkali-free, aluminosilicate, synthetic quartz glass and polyester film can be used. Considering the ultraviolet properties, a transparent substrate using an inorganic glass is appropriate.

The metal oxide in the present invention is a metal oxide having acid resistance or alkali resistance, such as a metal oxide such as titanium oxide, tungsten oxide, strontium oxide, zinc oxide, zirconium oxide, or a hydroxide thereof. Indicates an object. Further, these are composites. These metal oxide layers are formed on a transparent substrate by a sol-gel method or by coating as an organometallic compound and sintering to form an oxide layer, or by sputtering.

The catalyst nucleus includes sulfides of heavy metals, for example, sulfides of antimony, bismuth, cadmium, cobalt, lead, nickel, palladium, platinum, gold, silver, zinc and the like. Further, salts such as selenide, polyselenide, polysulfide, mercaptan and tin (II) halide;
Heavy metals, preferably silver, gold, platinum, palladium, mercury,
Copper, zinc and the like. The catalyst core in the present invention is used while being held on or in the metal oxide layer.

The metal oxide layer on the transparent substrate preferably has a thickness of 10 nm or more because its uniformity is required. However, since titanium oxide, zinc oxide, and the like have an absorption for ultraviolet rays, absorption of the metal oxide layer which is too thick becomes a problem. The thickness of the light shielding film is 0.1 μm or more and 20 μm or more.
It is about 0 μm or less, preferably 0.2 μm or more and 50 μm or less. A small amount of catalyst nuclei is effective.

[0011]

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to Examples, but it should not be construed that the invention is limited thereto without departing from the spirit of the present invention.

Example 1 A mixed solution of titanium n-butoxide and palladium chloride was applied on a glass substrate and heated at 450 ° C. for 2 hours to form a metal oxide layer. Next, the following nickel plating solution was prepared and plated at 80 ° C. for 30 minutes to form a nickel-phosphorus electroless plating layer on a glass substrate.

Nickel chloride 0.06 mol / l Nickel sulfate 0.02 mol / l sodium potassium tartrate 0.1 mol / l sodium hypophosphite 0.1 mol / l ammonia water 3.6 mol / l

Next, a 1.5 μm photoresist layer was applied, and after an ultraviolet ray effect, the uncured portion was removed and the metal nickel portion was chemically etched to form a circuit pattern. The ultraviolet transmittance of the metal nickel portion is 0.1% or less, and the ultraviolet transmittance of the portion where the metal oxide layer appears is 9%.
9% or more.

[0015]

As described above, according to the present invention,
An exposure mask using nickel plating was obtained.

Claims (4)

[Claims] 1. An exposure mask for forming a circuit pattern, comprising a light-shielding film containing at least nickel on a transparent substrate, wherein the light-shielding film is held on the transparent substrate by a metal oxide layer. An exposure mask, characterized in that: 2. An exposure mask for forming a circuit pattern, comprising a light-shielding film containing at least nickel on a transparent substrate, wherein the light-shielding film is held on the transparent substrate by a metal oxide layer. An exposure mask formed by electroless plating on a nucleus. 3. A method for manufacturing an exposure mask, wherein a light-shielding film containing at least nickel, which is held on a transparent substrate by a metal oxide layer, is formed by etching using a photoresist. 4. The exposure mask according to claim 1, wherein the light-shielding film contains phosphorus.