JP2001291078A - Non-contact type ic card and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact type IC card in which the thickness of the central part and peripheral part of a card can be made uniform by providing frame materials at the peripheral part of a wiring board and the appearance is not damaged by colored polyimide resin constituting the wiring board. SOLUTION: A layer of a wiring board on which an IC chip is loaded and a frame member formed at the peripheral edge part of the wiring board and having the same thickness as that of the wiring board is laminated on a first protecting layer constituting the lowermost layer, and a chip protecting layer having a hole capable of housing the IC chip is laminated on the layer of the wiring board and the frame member, and a second protecting layer is laminated on the chip protecting layer, and adhesive layers are laminated among those layers. Then, thermo-compression bonding is carried out by a pressing machine.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC card excellent in smoothness and a method of manufacturing the same, and more particularly, to a non-contact type IC card in which the appearance loss from the side of the IC card due to a colored wiring board is considered. The present invention relates to an IC card and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, non-contact type IC cards having a uniform thickness, a smooth surface without warpage, and a non-contact type IC card due to their high convenience and beautiful appearance. A manufacturing method is required.

In the prior art made in view of such a demand, there is, for example, a non-contact type IC card manufactured by a method of sealing the periphery of an IC module with a thermosetting resin composition.

The method of manufacturing a non-contact type IC card according to the prior art uses a resin-sealed module in which an IC module is previously sealed with a thermosetting resin composition such as an epoxy resin, or is formed on an IC card body. After the IC module and the liquid resin were inserted and filled in the recesses, they were cured and sealed.

When an IC card is manufactured by a method using a resin-sealed module, for example, a resin module formed by sealing an IC module with a thermosetting resin composition such as epoxy resin, and a resin-sealed resin module A card body having a recess having the same size as the module and a sheet material made of thermoplastic resin are used. Then, after inserting the resin sealing module into the recess formed in the card body, a sheet material made of a thermoplastic resin is heated and welded to the card body so as to close the recess.

When an IC card is manufactured by inserting and filling an IC module and a liquid resin into a concave portion, and then curing and sealing the IC card, for example, an IC card is formed in a concave portion formed in a card body. After inserting the module, the recess and IC
After inserting and filling the liquid thermosetting resin composition between the module and heating and then curing, a sheet material made of a thermoplastic resin is heat-welded to the card body so as to close the recess. Being manufactured.

However, when manufacturing by a method using a resin-sealed module, the resin-sealed module used is
Due to the curing shrinkage of the thermosetting resin composition, the shape of the IC module emerges on the surface to form irregularities, and the resulting I
The C card has a problem that a portion corresponding to the concave portion into which the resin sealing module is inserted may not be flat.

[0008] Also, in the case where the IC module and the thermosetting resin composition are inserted and filled into the concave portions, and then cured and sealed, the obtained IC card is also made of a liquid thermosetting resin. There is a problem that a portion corresponding to the concave portion may not be flat due to curing shrinkage of the composition.

As a conventional technique for solving these problems, there is one disclosed in Japanese Patent Application Laid-Open No. Hei 10-272870.

In this prior art, a card body having a recess formed therein is filled with an IC module and a liquid thermosetting resin composition containing granules in the recess, and then the thermoplastic resin is added to the card body. There is disclosed a manufacturing method in which a resin sheet material is overlapped, the opening surface of the concave portion is closed with the sheet material, and then heated to bond the sheet material to the card body to manufacture.

According to this conventional technique, when the thermosetting resin composition cures, the particles contained therein are unlikely to shrink, so that the curing shrinkage rate of the thermosetting resin composition as a whole decreases. In addition, since the particles are contained, the particles are easily dispersed uniformly in the liquid thermosetting resin composition, and the curing shrinkage hardly varies depending on the position in the thermosetting resin composition.
Therefore, a portion where the ratio of the thermosetting resin composition caused by the presence of the IC module is low in the concave portion,
The difference in the amount of shrinkage in the portion where the ratio of the thermosetting resin composition is high due to the absence of the module is reduced, and the difference in cure shrinkage depending on the position in the concave portion is reduced, so that an IC card with excellent flatness can be obtained. And

However, in the above-mentioned prior art, the IC
Since the module is exposed to high temperatures, there are problems in that the parts used and the manufacturing method of the IC module are limited, the productivity is difficult, and the cost is limited.

As a conventional technique for solving such problems and providing a non-contact card having no irregularities on its surface and a method for manufacturing the same, Japanese Patent Laid-Open No. 10-1 is disclosed.
There is one disclosed in Japanese Patent No. 75388.

In the non-contact IC card described in this prior art, the core sheet, the underlay sheet, or the underlay sheet laminated on both sides of the core sheet, It discloses that an ultraviolet curable resin is used as an adhesive between the overlay sheet and a filler of the IC module, and a manufacturing process including a step of curing the adhesive and the filler by ultraviolet irradiation is disclosed. .

As described above, according to the above-mentioned prior art, an ultraviolet-curable resin is used instead of the thermosetting resin composition as the adhesive between the sheets and the filler in the gaps where the IC modules are inserted, and the ultraviolet irradiation is performed. By curing the UV-curable resin, the IC module is not exposed to a high temperature, and a non-contact card having no irregularities on the surface is manufactured.

However, in the above-described method of filling the concave portion with the IC module and the thermosetting resin composition or the ultraviolet curable resin, and curing and sealing the same, in any case, the concave portion is filled with the thermosetting resin composition and the thermosetting resin composition. There has been a problem that the step of filling the ultraviolet curable resin uniformly or a step of removing the surplus after filling has to be required, which is a negative factor in terms of productivity.

Therefore, the contactless IC card according to the prior art shown in FIGS.
1b, an adhesive layer 1103, a wiring board 1102 (including an antenna or the like), an IC chip and a filling resin layer 1104 (also serving as an adhesive layer), and a protective layer 1101a. There is known a simplified one in which the laminated card component layers are pressed to produce a card.

[0018]

However, in the above-mentioned manufacturing method according to the prior art, in order to prevent damage to the IC chip at the time of pressing and to make a card having a standard thickness, a press capable of precise thickness control. There is a problem that an apparatus is required.

Further, for the wiring board of the non-contact type IC card, a polyimide resin excellent in workability such as insulating property and through hole is often used, and this polyimide resin is generally colored, as shown in FIG. If a wiring board 1102 having the same area as the card body is provided on the card, the appearance of the side surface of the card is impaired by the colored polyimide resin. Therefore, as shown in FIG. 11, the wiring board 1102 is slightly smaller than the card body. However, there is a problem that a difference in thickness occurs between the central portion and the peripheral portion of the card due to an insufficient area of the wiring board with respect to the card body.

The present invention has been made in view of the above problems, and provides a frame material on the periphery of a wiring board slightly smaller than the card body so that the thickness of the central portion and the peripheral portion of the card can be made uniform. In addition, a colored polyimide resin does not impair the appearance, and furthermore, it is not necessary to adjust the thickness at the time of pressing, and a conventional press machine that only controls with pressure is sufficient, and the IC used by the pressing at this time is sufficient.
An object of the present invention is to provide a non-contact type IC card for preventing damage to a chip and a method for manufacturing the same.

[0021]

In order to achieve the above object, according to the first aspect of the present invention, there is provided a non-contact type IC card having a wiring board on which an IC chip is mounted. It is characterized by having.

According to a second aspect of the present invention, in the first aspect of the present invention, the area of the layer formed by the wiring board and the frame member is substantially the same as the area of the non-contact type IC card body. And

The invention according to claim 3 is the invention according to claim 1 or 2
In the described invention, the thickness of the frame material is substantially the same as the thickness of the wiring board.

According to a fourth aspect of the present invention, in the first aspect of the present invention, there is provided a chip protection capable of accommodating an IC chip on a layer formed by a wiring board and a frame member. It is characterized by having a layer.

According to a fifth aspect of the present invention, in the fourth aspect of the invention, the chip protection layer has a through hole capable of accommodating the IC chip, and the wiring board is formed so as to accommodate the IC chip in the through hole. It is characterized in that it is laminated on a layer formed by the frame material.

According to a sixth aspect of the present invention, in the fifth aspect of the present invention, the wiring board and the frame member are formed between the layer formed by the wiring board and the frame member and the chip protection layer. A bonding layer for bonding the layer and the chip protection layer, and after bonding the wiring board and the frame material with the bonding layer, the upper surface of the IC chip housed in the through-hole is
It is characterized in that the surface is substantially smooth with respect to the upper surface of the chip protection layer.

According to a seventh aspect of the present invention, the first protective layer provided on the lowermost layer, the first adhesive layer provided on the first protective layer, and the first adhesive layer A wiring board provided with an IC chip mounted thereon, a layer having the same thickness as the wiring board, a frame material provided at a peripheral portion of the wiring board, and an upper layer of the wiring board and the frame material Provided in
A second adhesive layer having a through hole having an area equal to or larger than the IC chip;
A chip protective layer provided on the second adhesive layer and having a through hole capable of accommodating an IC chip, a third adhesive layer provided on the chip protective layer, and a third adhesive layer A second protective layer provided on the layer.

[0028] The invention according to claim 8 is the first layer which is the lowermost layer.
Laminating a first adhesive layer on the protective layer, and a wiring board on which an IC chip is to be mounted, and a peripheral portion of the wiring board having the same thickness as the wiring board on which the IC chip is mounted. A step of laminating a layer with a frame material provided in the above, and a step of laminating a second adhesive layer having a through-hole having an area equal to or larger than an IC chip on an upper layer of the layer of the wiring board and the frame material. A step of laminating a chip protective layer having a through hole capable of accommodating an IC chip on the second adhesive layer, a step of laminating a third adhesive layer on the chip protective layer, Laminating a second protective layer on the upper layer of the adhesive layer, and sandwiching the layers laminated in each step from both upper and lower directions,
It is characterized by pressing by only pressure control and thermocompression bonding.

[0029]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a contactless card and method according to the present invention will be described in detail with reference to the accompanying drawings.

FIGS. 1 and 2 show a configuration example of a non-contact IC card according to a first embodiment of the present invention. 1 and 2
The non-contact IC card according to the present invention includes a protective layer 101a, 101b serving as the front and back surfaces of the IC card, and a wiring board 102 having an area slightly smaller than the area of the protective layer 101a, 101b and having an IC chip mounted at a predetermined position. , Wiring board 1
02 and a chip protection layer 10 having a through-hole having an area capable of accommodating an IC chip on the wiring board 102, and a frame material 103 which fits in the peripheral portion of the wiring board 102.
4 and a plurality of adhesive layers 105 for laminating and compressing the above layers. In the adhesive layer 105,
I on the wiring board 102 in the same manner as the chip protection layer 104
The second having a through hole with an area that can accommodate the C chip
, A first adhesive layer for bonding the protective layer 101a and the chip protective layer 104, and a third adhesive layer for bonding the protective layer 101b to the wiring substrate 102 and the frame material 103.
And an adhesive layer.

The wiring board 102 is generally made of a polyimide resin having excellent workability such as insulating properties and through holes. However, since this polyimide resin is generally colored, the wiring board 102 is made of the same material as the card body. If the area is large, the appearance of the side surface of the card after manufacturing is impaired. Therefore, usually, the area of the wiring board 102 is set to be slightly smaller than the area of the card body. In the present invention, a frame member 103 having the same thickness as the wiring board 102 is provided on the peripheral edge of the wiring board 102. The colored wiring board 102 can prevent the appearance of the side of the card from being impaired.

Furthermore, the frame member 103 can compensate for the insufficient area of the wiring board 102 with respect to the card body, thereby producing a smooth card having a uniform thickness at the central portion and the peripheral portion of the card. be able to. Further, an IC chip is mounted on the wiring substrate 102, and the mounted position is preferably an eccentric position of the card body where bending stress due to deformation is less likely to occur.

The thickness of the chip protection layer 104 is set so that the top surface of the IC chip and the top surface of the chip protection layer 104 are smooth by pressure bonding by the adhesive layer 105. The load on the IC chip can be reduced, and the thickness can not be adjusted at the time of pressing, and the IC chip can be easily manufactured by a conventional press machine controlled only by pressure.

The area of the through hole for accommodating the IC chip in the chip protection layer 104 is slightly larger than the area of the IC chip, and the bending stress applied to the IC chip can be reduced. The IC chip can be protected.

Further, since the material of the chip protective layer 104 is polyethylene terephthalate (PET), the core material embedded in the card can improve the mechanical strength against bending of the card itself. At this time, as a material of the chip protection layer 104, other materials such as polypropylene, nylon, polystyrene, polycarbonate, polyvinyl chloride, PETG (non-crystalline polyester), and the like can be considered.

The second adhesive layer 105 as an adhesive is laminated on the layers of the wiring board 102 and the frame member 103, and has a through hole enough to accommodate an IC chip mounted on the wiring board 102. I have. The through hole also has a chip protective layer 104 laminated on the second adhesive layer 105. When the second adhesive layer 105 and the chip protective layer 104 are laminated, the thickness becomes The IC chip is accommodated by the through-holes of the two layers, 105 and the chip protection layer 104, and the thickness is such that the upper surfaces of the chip protection layer 104 and the IC chip become smooth after pressure bonding.

The first adhesive layer 105 is formed on the chip protection layer 10.
4 is an adhesive for pressing the upper surface of the wiring substrate 4 and the protective layer 101a, and the third adhesive layer 105 is for pressing the lower surface of the layer of the wiring board 102 and the frame member 103 to the protective layer 101b. Adhesive.

The material of the adhesive layer 105 is, for example, a thermoplastic polyester resin having a melt viscosity of 100,000 cps to 150,
000 cps (190 ° C.) and a melting point of 100 to 120 ° C. are preferable, but the material is not limited to this as long as it functions as an adhesive.

The melt viscosity has good followability to irregularities such as an IC chip and an antenna, and the melting point is very important in producing a card without applying a very high temperature. The reason is that there is a possibility that the built-in IC portion is destroyed by applying a high temperature.

The protective layer 101a forms the front surface of the card body, and the protective layer 101b forms the back surface of the card body. It is preferable that the protective layer 101a and the protective layer 101b have the same thickness. If the thicknesses are different from each other, there is a problem that "warping" occurs when the card is formed. Note that the protective layers 101a and 101b
In this embodiment, polyethylene terephthalate is used as a material, but a layer using another material such as a polyvinyl chloride resin, a polystyrene resin, a melamine resin, or an epoxy resin may be used.

FIG. 2 is a diagram for explaining a manufacturing process of the non-contact IC card according to the embodiment of the present invention.

As shown in FIG. 2, the protective layer 101b, the adhesive layer 105c, the frame material 103, and the
No. 02, the adhesive layer 105b, the chip protective layer 104, the adhesive layer 105a, and the protective layer 101a. The non-contact IC according to the embodiment of the present invention is obtained by performing thermocompression bonding using a sandwich structure that sandwiches the layer from above and below. Cards can be formed. At this time, before the thermocompression treatment, the protective layer 10
A printing process may be performed on the outer portions of 1a and 101b to form a card.

In the thermocompression bonding, the pressure is initially reduced while the temperature is raised, and when the adhesive layer 105 starts to soften, the pressure is increased and the pressure is increased.
It is preferable that the pressure treatment be terminated when the temperature reaches room temperature. This makes it possible to adapt the adhesive layer 105 to the irregularities of the IC chip or the wiring substrate 102 while preventing the unsoftened adhesive layer 105 from breaking the IC chip or the wiring substrate 102 at the start of the processing.

FIG. 3 is a graph showing a specific example of a change in pressure and a change in temperature in the thermocompression bonding of the embodiment of the non-contact IC card of the present invention.

Referring to FIG. 3, a pressure of 5 kg / cm ² is continuously applied for 8 minutes while the thermocompression bonding is started. At the beginning of the treatment, the adhesive layer 105 is not softened, so that the pressure is kept low in order to protect the IC chip and the wiring board 102 and to adjust the surface irregularities.

When eight minutes have elapsed after the start of the treatment, the adhesive layer 10
Since 5 starts to soften gradually, the pressure is increased to 15 kg / cm ² , and the temperature is further increased. At this point, a large pressure is applied to correct the card surface to be flat.

At 18 minutes after the start of the process, the temperature that has continued to rise reaches 120 ° C., and the process proceeds to the cooling process. This cooling is performed by a water pipe provided in the thermocompression bonding apparatus.
kg / cm ² ) can continue to be applied.

At 58 minutes after the start of the process, the pressurizing process is terminated, and the temperature of the card is gradually cooled to a normal temperature by the cooling process.

Non-contact IC constituted by the above manufacturing method
Since the thickness of the card is about 800 μm, the card itself can have flexibility. Therefore,
By constructing a printing device by providing a curve in the transport path for performing the printing process, the size of the printing device can be reduced.

Next, one embodiment of the wiring board 102 will be specifically described with reference to FIGS.

As a second embodiment of the present invention, a reversible thermosensitive recording layer may be provided on the entire surface or a part of the surface of the card body.

Embodiments in which a reversible thermosensitive recording layer is provided on the surface of the card body are shown in FIGS. In the drawings described below, an adhesive layer for bonding each layer is omitted.

When the reversible thermosensitive recording layer is provided on the card body, the reversible thermosensitive recording layer is pressed on the upper surface of the lower layer portion (hereinafter referred to as the base material 201) of the chip protective layer by an adhesive layer, so that reversible recording and recording can be performed. Perform erasure. The reversible thermosensitive recording layer 202a is a layer composed of a leuco dye, a color-reducing agent, and a binder resin, and reversibly repeats coloring / decoloring by heat. Leuco dyes are generally referred to as colorless or pale color electron-donating dye precursors. Further, the color-reducing agent is called an electron-accepting compound, and causes a reversible color change in the dye precursor due to a difference in cooling rate after heating, and is an aliphatic hydrocarbon having 6 or more carbon atoms. Phenolic compounds having at least one group are used.

When the reversible thermosensitive recording layer 202a is provided on the surface of the non-contact IC card, it is preferable to arrange a one-sided mat film on the upper surface of the reversible thermosensitive recording layer 202a. This one-sided mat film has fine irregularities on the surface in contact with the reversible thermosensitive recording layer 202a. The reason for this is that, when dust or the like is present on the surface of the reversible thermosensitive recording layer 202a, if printing is performed using a thermal head, dust adheres to the tip of the thermal head, making printing difficult. In order to prevent this, by providing fine irregularities on the surface of the reversible thermosensitive recording layer 202a, dust and the like enter the irregularities, and the running of the thermal head when performing printing processing is made smooth.

Next, a specific example of forming the reversible thermosensitive recording layer 202a on the substrate 201a will be described. In the following, for convenience of explanation, a laminate having a reversible thermosensitive recording layer 202a on a substrate will be described as a rewritable film layer.

FIG. 7 is a sectional view showing in detail a first example of the rewrite film layer according to the second embodiment of the present invention.

In FIG. 7, the rewritable film layer comprises a substrate 201, a reversible thermosensitive recording layer 202a, and a protective layer 101c for protecting the surface of the reversible thermosensitive recording layer 202a.
These layers are pressed by the adhesive layer 105. The protective layer 101c prevents scratches and the like on the surface of the non-contact IC card main body.

FIG. 8 is a sectional view showing in detail a second example of the rewrite film layer according to the second embodiment of the present invention.

The rewritable film layer shown in FIG. 8 is different from the structure shown in the first example in FIG. 7 in that a concealing layer 203a is further provided between the reversible thermosensitive recording layer 202a and the substrate 201. Has become. The configuration other than the provision of the concealing layer 203a is the same as that of the first example.

The concealing layer 203a is used to visually conceal the color of the base material and obtain a beautiful card appearance, and at the same time to make the characters printed on the reversible thermosensitive recording layer 202a easy to see.

The concealing layer 203a is a layer formed of an ink or a dye containing a metal powder and a resin. Metal powders include aluminum, tin, zinc, gold, silver, copper,
Aluminum oxide, sodium oxide, etc. can be used,
As the resin, for example, a polyamide-based, epoxy-based, acrylic-based, phenol-based, unsaturated polyester-based, polyurethane-based, diallyl phthalate-based resin can be used.

Further, in the heat-resistant layer paint absorbed in the concealing layer 203a, the curing agent reacts with the resin having active hydrogen of the concealing layer 203 to improve the heat resistance of the concealing layer 203a.
The adhesion between the concealing layer 203a and the anchor layer 204a is also improved.

FIG. 9 is a sectional view showing in detail a third example of the rewritable film layer according to the second embodiment of the present invention.

The rewrite film layer shown in FIG. 9 is different from the structure shown in the second example in FIG. 8 in that the anchor layer 204a is further provided with a reversible thermosensitive recording layer 202a and a concealing layer 20.
3a. Anchor layer 20
The configuration other than the provision of 4a is the same as the second example.

The function required as a resin usable for the anchor layer 204a is firstly required to have heat resistance for maintaining the physical strength of the concealing layer 203a from the heating shear stress at the time of printing and erasing by the thermal head.

Second, low oxidation properties are required to prevent the leuco dye in the reversible thermosensitive recording layer 202a from irreversibly coloring. The low oxidizing property is preferably 5KOHmg / g or less.

Specifically, an electron beam-curable urethane acrylate resin having the first required heat resistance, an electron beam-curable epoxy acrylate resin having the second required low oxidation property, It is also possible to configure by mixing the above resins.

The thickness of the anchor layer 204 a
The thickness may be sufficient to impregnate 3a and form a thin film on the surface. This thickness is preferably comprised in the range of 0.1 to 10 μm. If the anchor layer 204a is formed thick, it may not be able to withstand the bending stress generated when the card is bent, and may cause cracks or breakage.

By providing the anchor layer 204a, the unevenness of the concealing layer 203a can be made flat,
Since the UV curable resin is used as the constituent material, the heat resistance is very good.

Further, in the present invention, as a third embodiment, a magnetic recording layer may be provided on a substrate as shown in FIG. FIG. 10 is a schematic sectional view of one embodiment of the non-contact type IC card according to the present invention.

Referring to FIG. 10, a non-contact type IC card according to this embodiment includes a magnetic recording layer 301 for performing magnetic recording, a concealing layer 203b, an ultraviolet curable resin, An anchor layer 204b containing an agent as a main component, a reversible thermosensitive recording layer 202b for performing reversible thermosensitive recording, and a protective layer 101d for protecting the surface of the reversible thermosensitive recording layer 202b are sequentially laminated. Structure.

As the magnetic recording layer 301, a layer generally used as a magnetic recording layer in this type of magnetic recording medium can be used. For example, Ba-ferrite, Sr-ferrite, Co-coated γ-Fe ₂ O _{3 having} a particle size of 10 μm or less, preferably 0.01 to 5 μm as a magnetic material,
A polyester resin, an alkyd resin, a vinyl resin, a polyurethane resin, or a mixed resin thereof which is generally used as a binder resin using γ-Fe ₂ O ₃ , acicular iron powder, and CrO ₂ can be used.

The mixing ratio between the binder resin and the magnetic material is appropriately set in consideration of the adhesion to the base material, the strength of the coating film, the voltage detected by the magnetic head, and the like. Usually, the former / latter = 1/1 to 1/10 by weight ratio, preferably 1/2 to 1/1.
8 is appropriate.

The thickness of the magnetic recording layer is usually 5 to 20 μm.
m.

The concealing layer 203b has such a color as to visually conceal the color of the magnetic recording layer 301 and to give a sufficient contrast to the color of the reversible thermosensitive recording layer 202b described later. Therefore, the opaque layer 203b contains a light-opaque pigment such as a non-magnetic metal such as aluminum powder or a non-magnetic metal oxide such as titanium oxide powder as a main component.

As described above, the properties of the material used to form the concealing layer 203b are such that the material is sufficiently cured by a crosslinking agent contained as a main component in the anchor layer 204b, which will be described later. This is a property of improving the adhesion between the layer 204b and the concealing layer 203b.

Therefore, a resin having an active hydrogen such as a hydroxyl group or a carboxyl group is essential as a resin to be contained as a main component in the concealing layer 203b, and specific examples of the resin having an active hydrogen include vinyl chloride / vinyl acetate. / Vinyl maleic anhydride copolymer, vinyl chloride / vinyl acetate / vinyl alcohol copolymer, or nitrocellulose, and two or more of them may be used in combination. The thickness of the concealing layer 203b is, for example, 0.1 mm.
It is about 05 to 3 μm.

The anchor layer 204b improves the durability of the reversible thermosensitive magnetic recording medium to heat and pressure in the non-contact type IC card of the present invention shown in FIG. In order to
An ultraviolet curable resin and a crosslinking agent are contained as main components.

As the ultraviolet-curable resin, for example, the physical strength of the concealing layer 203b can be maintained from the heat shear stress when printing and erasing by a thermal head.
Further, in order to suppress the reaction with the leuco dye contained in the reversible thermosensitive recording layer 202b, it is preferable to use an ultraviolet curable resin having an acid value of 5 KOH mg / g or less, and specifically, for example, urethane acrylate resin, epoxy resin An acrylate resin or a mixed resin thereof can be used.

The cross-linking agent may be any one that cures the resin having active hydrogen in the concealing layer 203b when the heat-resistant layer coating material is impregnated into the concealing layer 203b during the formation of the heat-resistant layer. For example, an isocyanate-based curing agent, carbodiimide A system curing agent or the like can be used.

The thickness of the anchor layer 204b is as follows.
As in the second embodiment, the concealing layer 203 is formed when the heat-resistant layer is formed.
b may be impregnated to a thickness such that a thin film is formed on the surface, and specifically 0.1 to 10 μm. When the thickness is larger than this thickness, it is impossible to follow the bending of the reversible thermosensitive magnetic recording medium, and a crack may be generated.

Therefore, by irradiating the anchor layer 204b with ultraviolet rays, the hardness of the anchor layer 204b becomes sufficiently high to withstand heating and pressure during printing and erasing, and furthermore, the crosslinking agent impregnated in the concealing layer 203b. Thereby, the resin having active hydrogen contained as a main component in the concealing layer 203b is cured,
As the hardness of the concealing layer 203b increases, the anchor layer 2
Since the adhesion between the cover layer 04b and the concealing layer 203b is improved, the durability of the reversible thermosensitive magnetic recording medium for repeated printing and erasing can be improved.

The protective layer 101d contains an ultraviolet curable resin in order to make its hardness sufficient. Also,
The protective layer 101d is formed with appropriate irregularities on the surface of the protective layer 101d to prevent glare on the surface of the protective layer, prevent scratches on the surface of the protective layer, and provide a self-cleaning property of the thermal head. It is preferred that silica be contained in the silica.

Next, a method of manufacturing the reversible thermosensitive magnetic recording medium shown in FIG. 10 will be described. First, the substrate 201
After forming the magnetic recording layer 301 thereon, the magnetic recording layer 3
01, a coating containing a light-opaque pigment and a resin having active hydrogen as a main component is applied and dried to form a concealing layer 20.
3b is formed.

Thereafter, a coating material containing an ultraviolet-curable resin and a crosslinking agent as main components is applied on the concealing layer 203b.
The anchor layer 204b is formed by drying and curing by irradiating ultraviolet rays.

After forming the anchor layer 204b, aging is performed immediately without forming the reversible thermosensitive recording layer 202b. This aging is performed, for example, by heating to 60 ° C. and allowing 24 hours to elapse.
Since the cross-linking agent contained as a main component in the anchor layer 204b is used to sufficiently cure the concealing layer 203, the aging for sufficiently curing the opaque layer 203 is particularly limited to the aging under these conditions. Not something.

After performing this aging, a reversible thermosensitive recording layer 202b containing a leuco dye, a color-reducing agent and a resin as main components is formed, and then a protective layer 101d is formed on the reversible thermosensitive recording layer 202b. Form.

Therefore, according to the method for manufacturing a reversible thermosensitive magnetic recording medium, when the reversible thermosensitive magnetic recording medium having the structure shown in FIG. 10 is manufactured, aging is performed after forming the anchor layer 204b. Because the anchor layer 2
The cross-linking agent contained in the opaque layer 04b sufficiently cures the concealing layer 203b, so that the hardness of the concealing layer 203b can be made sufficient and the adhesion between the concealing layer 203b and the anchor layer 204b can be improved. Can be improved.

Here, the color-reducing agents in the second and third embodiments include 4,4'-isopropylidenephenol, benzyl-p-hydroxybenzoate, and 4,4 '.
-Dihydroxy-3,5'-diallyldiphenylsulfone, methyl-bis (hydroxyphenyl) acetate, gallic acid ester, p-phenylphenol and the like. Examples of leuco dyes include crystal violet lactone, 3-indolino-3-p-dimethylaminophenyl-6-dimethylaminophthalide, 3-diethylamino-7-chlorofluoran, and 2- (2-chlorophenylamine) -diethylaminofluoran. , 2- (2-fluorophenylamino) -6-diethylaminofluoran, 2- (2-fluorophenylamino) -6-di-n
-Butylaminofluoran, 3-diethylamino-7-
Cyclohexylaminofluoran, 3-diethylamino-5-methyl-7-t-butylfluoran, 3-diethylamino-6-methyl-7-anilinofluoran, 3-
Diethylamino-6-methyl-7-p-butylanilinofluoran, 3-cyclohexylamino-6-chlorofluoran, 2-anilino-3-methyl-6- (N-ethyl-p-toluidino) -fluoran, -Pyrrolidino-
6-methyl-7-anilinofluoran, 3-pyrrolidino-7-cyclohexylaminofluoran, 3-N-methylcyclohexylamino-6-methyl-7-anilinofluoran, 3-N-ethylpentylamino-6 -Methyl-7-anilinofluoran and the like.

The above usually colorless or light-colored electron-donating dye precursors may be used alone or as a mixture of two or more.

Examples of the binder resin include starches, hydroxyethylcellulose, methylcellulose, carboxymethylcellulose, gelatin, casein, polyvinyl alcohol, modified polyvinyl alcohol, sodium polyacrylate, acrylamide / acrylate copolymer, acrylamide / Water-soluble polymers such as acrylate / methacrylic acid terpolymer, alkali salt of styrene / maleic anhydride copolymer, alkali salt of ethylene / maleic anhydride copolymer, polyvinyl acetate, polyurethane, polyacryl Latexes such as acid esters, styrene / butadiene copolymer, acrylonitrile / butadiene copolymer, methyl acrylate / butadiene copolymer, ethylene / vinyl acetate copolymer and the like can be mentioned.

In a reversible thermosensitive recording material, rapid cooling following heating is sufficient for color development, and a slow cooling rate after heating is sufficient for color erasing. For example, when heating with a suitable heat source (thermal head, laser light, heat roll, heat stamp, high frequency heating, radiant heat from an electric heater, hot air, etc.) for a relatively long time, not only the recording layer but also the support is heated. As a result, the cooling rate is low, resulting in a phase separation state (decoloring state). A color-developed state and a decolored state can be arbitrarily expressed.

Here, the reversible thermosensitive recording layer 202 is 3 to 1
It is formed to a thickness of 0 μm.

[0094]

(Example 1) Protective layer 101, chip protective layer 104, frame material 103-PET material ("Lumirror E-22" manufactured by Toray Industries, Inc.) Wiring board 102-Polyimide material Adhesive layer 105-Hot melt material ( "PES-111EE" manufactured by Toagosei Co., Ltd.

The thickness of each layer after bonding in Example 1 was 100 μm for the protective layers 101a and 101b.
The thickness of the chip protection layer 104 is 250 μm, the thickness of the frame member 103 is 50 μm, the thickness of the wiring board 102 is 50 μm, and the adhesive layers 105a, 105b, and 10
5c, and the thickness of the card body after manufacture is 800 μm.

(Example 2) <First specific example of rewrite film layer> Next, a first specific example of the rewrite film layer shown in FIG. 3 will be described.

Reversible thermosensitive recording layer 202 Leuco dye (3-diethylamino-6-methyl-7-
Anilino Fluoran, manufactured by Yamamoto Kasei Co., Ltd.
B)-Color-reducing agent (N- (4-hydroxyphenyl) -N'-
n-octadecyl urea)-Thermoplastic resin (acrylic resin, manufactured by Mitsubishi Rayon Co., Ltd., product name: Dianal BR-80)-Ultraviolet-curable resin (product name, LAR manufactured by BASF Co., Ltd.)
OMER LR8864) Photopolymerization initiator (Darocur 1173, trade name, manufactured by Ciba-Geigy Co., Ltd.) Solvent (MEK: toluene = 1: 1) Put the above materials in a container, add 2 mmφ zirconia beads, and disperse with a paint shaker for 60 minutes. Then, it was applied on the above substrate with a # 26 wire bar, dried at 80 ° C. for 5 minutes, and irradiated with ultraviolet light at 160 W / cm, 30 m / min and 1 pass. Thereby, the reversible thermosensitive recording layer 2 having a thickness of 6 μm was formed.
02 was formed.

Protective layer 101-UV-curable paint (manufactured by Dainippon Ink & Chemicals, Inc., trade name: Unidick 17-806, solid content: 80%)-Silica (trade name: Sylysia 436, manufactured by Fuji Silysia Chemical Ltd.) Silicone oil (Shin-Etsu Chemical Co., Ltd. product name K
F96) Solvent (MEK: toluene 1: 1) The above materials were put in a container, 2 mmφ zirconia beads were added, and the mixture was dispersed with a paint shaker for 10 minutes. Next, this was coated on the reversible thermosensitive recording layer with a # 4 wire bar, dried at 80 ° C. for 5 minutes, and then heated at 160 W / cm and 30 m / m.
For one minute, one pass of ultraviolet irradiation was performed. Thereby, the film thickness 2
A protective layer having a thickness of μm was formed.

<Second Specific Example of Rewrite Film Layer> Next, a second specific example of the rewrite film layer shown in FIG. 4 will be described.

Hiding layer 203-Aluminum paste (trade name: MH8803, manufactured by Asahi Kasei Corporation)-Polyester resin (trade name: RV-, manufactured by Toyobo Co., Ltd.)
200) Solvent (MEK: toluene 1: 1) The above materials were stirred for 30 minutes with a stirrer. Next, this was coated on a first base material similar to the first specific example of the rewrite film layer using a # 10 wire bar, and dried at 80 ° C. for 5 minutes to form a 3 μm-thick concealing layer 203. Concealment layer 20
3, a reversible thermosensitive recording layer 202 and a protective layer 101 were formed in the same manner as in the first specific example of the rewritable film layer.

<Third Specific Example of Rewrite Film Layer> Next, a third specific example of the rewrite film layer shown in FIG. 5 will be described.

Anchor layer 204 UV curable resin (trade name Unidick 17-806, manufactured by Dainippon Ink and Chemicals, Inc.) Photopolymerization initiator (trade name Irgacure 184 manufactured by Ciba Geigy, Inc.) Isocyanate-based curing agent (Coronate L, trade name, manufactured by Nippon Polyurethane Industry Co., Ltd.) Solvent (MEK: toluene 1: 1) Concealment formed on the first base material in the same manner as in the second specific example of the relite film layer # 14 on layer 203
Apply with a wire bar, dry at 80 ° C for 5 minutes,
W / cm, 30 m / min, UV irradiation in one pass, 60 ° C /
Aging was performed for 24 hours to form an anchor layer 204 having a thickness of 2 μm. The reversible thermosensitive recording layer 20 is formed on the anchor layer 204 in the same manner as in the first specific example of the rewritable film layer.
2. The protective layer 101 was formed.

Next, an embodiment in which a card is formed in a state where the thicknesses of the two adhesive layers are respectively changed will be described.
The material of the adhesive layer used at this time is a thermoplastic polyester hot melt, which is performed under the conditions of a melt viscosity of 130,000 cps and a resin melting point of 105 to 120 ° C.

(Example 3) Magnetic recording layer 301 A material having the following composition was dispersed in a ball mill for 8 hours to obtain a paint, and this paint was coated with an isocyanate-based curing agent (Coronate L, trade name, manufactured by Nippon Polyurethane Industry Co., Ltd.). Is added by 3 parts by weight, coated with a wire bar, subjected to a magnetic field orientation treatment,
After drying (100 ° C, 2 minutes), aging (60 ° C,
96 hours) to form a dry film thickness of 10 μm.・ Barium ferrite (made by Toda Kogyo Co., Ltd., trade name MC)
-127) ・ Carbon black (manufactured by Mitsubishi Chemical Corporation, trade name MA1
00) Polyester resin (manufactured by Toyobo Co., Ltd., trade name: Byron 200) Polyester resin (manufactured by Toyobo Co., Ltd., trade name: Byron 500) Solvent (MEK: toluene: MIBK = 1: 2: 1 mixture)

Hiding layer 203 A material having the following composition was stirred with a stirrer for 30 minutes to form a coating, applied with a wire bar, and dried (100 ° C., 1 minute) to form a dry film thickness of 2 μm.・ Aluminum paste (manufactured by Asahi Kasei Kogyo Co., Ltd., trade name: MH8803) ・ Nitrocellulose resin (manufactured by Asahi Kasei Kogyo Co., Ltd., trade name: BT-SL) ・ Solvent (MEK: toluene = 1: 1 mixture)

Anchor layer 204 A paint having the following composition is applied with a wire bar, dried (100 ° C., 1 minute), and irradiated with ultraviolet rays (160 W / cm 3).
Light, 30 m / min) and then aging (60 ° C, 2
4 hours) to form a dry film thickness of 1 μm.・ Ultraviolet curable resin (Dainippon Ink & Chemicals, Inc.)
Product name Unidick 17-806, urethane acrylate resin, acid value, below the measurement limit ・ Photopolymerization initiator (Ciba Geigy Co., Ltd., trade name Irgacure 184) ・ Isocyanate crosslinker (Nippon Polyurethane Industry Co., Ltd.) Solvent (MEK: toluene = 1: 1 mixture)

Reversible thermosensitive recording layer 202 A material having the following composition was dispersed in a paint shaker for 1 hour to obtain a paint, which was then coated with a wire bar and dried (80
(C, 1 minute) and a dry film thickness of 6 µm. -Leuco dye (3-diethylamino-6-methyl-7-
Anilino Fluoran, manufactured by Yamamoto Kasei Co., Ltd., trade name OD
B)-Color-reducing agent (N- (4-hydroxyphenyl) -N'-
n-octadecyl urea, JP-A-6-210954) Acrylic resin (manufactured by Mitsubishi Rayon Co., Ltd., trade name BR-)
83) Solvent (MEK: toluene = 1: 1 mixture)

Protective Layer 101 A material having the following composition was dispersed with a paint shaker for 10 minutes to obtain a paint, which was then coated with a wire bar and dried (80)
° C, 1 minute), UV irradiation (160W / cm3 lamp, 30
m / min), and then formed into a dry film thickness of 1 μm.・ Ultraviolet curable paint (Dainippon Ink and Chemicals Co., Ltd.)
• Silica (trade name: P-603, manufactured by Mizusawa Chemical Co., Ltd.) • Solvent (MEK: toluene = 1: 1 mixed solvent)

[0109]

As is apparent from the above description, according to the present invention, the appearance from the side of the card is impaired by the colored polyimide resin by providing the frame material at the periphery of the wiring board slightly smaller than the card body. In addition, the thickness of the central portion and the peripheral portion of the card can be made uniform.

The non-contact type IC card according to the present invention is
Since it has a chip protection layer for protecting the chip, it does not require thickness adjustment at the time of pressing, and can be easily manufactured by a conventional press machine controlled only by pressure. This makes it possible to realize an efficient manufacturing process in which an IC card is manufactured by performing multi-stage pressing on the stacked layers, and it is also possible to reduce damage to the IC chip by the pressing at this time. .

Further, since the periphery of the IC chip is protected by a layer of a hard material such as PET, it is possible to provide a non-contact type IC card which is resistant to destruction such as bending deformation.

[Brief description of the drawings]

FIG. 1 shows a first example of a non-contact type IC card according to the present invention.
1 is a schematic sectional view showing an embodiment of the present invention.

FIG. 2 is a view for explaining a method of manufacturing a non-contact type card according to the present invention.

FIG. 3 is a graph showing a specific example of a change in pressure and a change in temperature in a thermocompression bonding process of the embodiment of the non-contact card according to the present invention.

FIG. 4 is a first schematic plan view illustrating a wiring board according to an embodiment of the present invention.

FIG. 5 is a second schematic plan view for explaining the wiring board according to the embodiment of the present invention.

FIG. 6 is a schematic sectional view illustrating a wiring board according to the embodiment of the present invention.

FIG. 7 is a schematic sectional view showing a first example of a second embodiment of the non-contact card according to the present invention.

FIG. 8 is a schematic sectional view showing a second example of the second embodiment in the non-contact type card according to the present invention.

FIG. 9 is a schematic sectional view showing a third example of the second embodiment in the non-contact type card according to the present invention.

FIG. 10 is a schematic configuration diagram showing a third embodiment of the non-contact type card according to the present invention.

FIG. 11 is a schematic configuration diagram showing a first embodiment of a non-contact card according to the related art.

FIG. 12 is a schematic configuration diagram showing a second embodiment of a contactless card according to the related art.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 101 Protective layer 102 Wiring board 103 Frame material 104 Chip protective layer 105 Adhesive layer 201 Base material 202 Reversible thermosensitive recording layer 203 Concealment layer 204 Anchor layer 301 Magnetic recording layer

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Shinya Mogi 4-14-12 Koishikawa, Bunkyo-ku, Tokyo Kyodo Printing Co., Ltd. F-term (reference) 2C005 MA07 MA12 MA14 MA19 MA39 PA01 PA05 PA11 PA15 PA17 PA19 PA20 PA25 PA29 PA40 QB03 QB05 RA04 RA11 RA15 5B035 BA03 BA05 BB09 CA01 CA23

Claims (8)

[Claims] 1. A non-contact type IC card including a wiring board on which an IC chip is mounted, wherein a non-contact type IC card has a frame material at a peripheral portion of the wiring board. 2. The non-contact type IC according to claim 1, wherein an area of a layer formed by the wiring board and the frame material is substantially the same as an area of the non-contact type IC card main body. card. 3. The non-contact type IC card according to claim 1, wherein the thickness of the frame material is substantially the same as the thickness of the wiring board. 4. The semiconductor device according to claim 1, further comprising a chip protection layer capable of accommodating the IC chip, above a layer formed by the wiring board and the frame member. The non-contact type IC card described in the above. 5. The chip protection layer has a through hole capable of accommodating the IC chip, and is a layer formed by the wiring board and the frame material so as to accommodate the IC chip in the through hole. The non-contact type IC card according to claim 4, wherein the non-contact type IC card is laminated on an upper layer. 6. A chip formed between the wiring board and the frame material and the chip protection layer are bonded between a layer formed by the wiring board and the frame material and the chip protection layer. After bonding the wiring board and the frame material with the adhesive layer, the upper surface of the IC chip housed in the through hole is substantially equal to the upper surface of the chip protection layer. The non-contact type IC card according to claim 5, wherein the non-contact type IC card has a smooth surface. 7. A first protective layer provided on a lowermost layer, a first adhesive layer provided on an upper layer of the first protective layer, and a first adhesive layer provided on an upper layer of the first adhesive layer. A wiring board on which the IC chip is mounted, a layer of a frame material provided at the periphery of the wiring board having the same thickness as the wiring board, and a layer provided on an upper layer of the wiring board and the frame material; IC
A second adhesive layer having a through-hole having an area equal to or larger than a chip; a chip protective layer provided above the second adhesive layer and having a through-hole capable of accommodating the IC chip; A non-contact type IC card, comprising: a third adhesive layer provided on an upper layer; and a second protective layer provided on the third adhesive layer. 8. A step of laminating a first adhesive layer on an upper layer of a first protective layer serving as a lowermost layer, a wiring board for mounting an IC chip on the upper layer of the first adhesive layer, and the wiring board Laminating a layer with a frame material provided on the periphery of the wiring board having the same thickness as the wiring board; and having a through-hole having an area equal to or larger than the IC chip in an upper layer of the wiring board and the frame material. A step of laminating a second adhesive layer; a step of laminating a chip protective layer having a through hole capable of accommodating the IC chip on the second adhesive layer; 3) a step of laminating an adhesive layer, and a step of laminating a second protective layer on top of the third adhesive layer. A method for manufacturing a non-contact type IC card, wherein the non-contact type IC card is pressed and thermocompression-bonded.