JP2001289917A - Inspection device for circuit board and inspection method of circuit board - Google Patents
Inspection device for circuit board and inspection method of circuit boardInfo
- Publication number
- JP2001289917A JP2001289917A JP2000100720A JP2000100720A JP2001289917A JP 2001289917 A JP2001289917 A JP 2001289917A JP 2000100720 A JP2000100720 A JP 2000100720A JP 2000100720 A JP2000100720 A JP 2000100720A JP 2001289917 A JP2001289917 A JP 2001289917A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- electro
- electric field
- optical element
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、回路基板の回路パ
ターンを電気試験する装置及び方法に関するものであ
り、特に、高密度な回路パターンを非接触で電気試験す
る装置及び方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and method for electrically testing a circuit pattern on a circuit board, and more particularly to an apparatus and method for electrically testing a high-density circuit pattern in a non-contact manner.
【０００２】[0002]
【従来の技術】回路基板は高集積化が進み、従来の専用
治具のスプリングプローブを回路パターンのパッドへ接
触させて電気的性質を検査する方法では、確実な物理的
接触が難しくなってきている。また、パッド数の増加、
高集積化とともに治具の値段が高騰している。更には、
鋭利なスプリングプローブをパッドに接触することによ
るパッドの損傷も問題となっており、専用治具を用い
ず、非接触で電気的性質を検査する装置及び方法が望ま
れる。2. Description of the Related Art As circuit boards have become more highly integrated, it has become difficult to make reliable physical contact with the conventional method of inspecting electrical properties by contacting a spring probe of a dedicated jig with a pad of a circuit pattern. I have. Also, an increase in the number of pads,
The cost of jigs is increasing with the increase in integration. Furthermore,
Pad damage due to the contact of the sharp spring probe with the pad is also a problem, and an apparatus and method for inspecting electrical properties in a non-contact manner without using a dedicated jig are desired.
【０００３】従来の非接触で電気試験をする装置として
は、例えば、特開平６−１８０３５３号公報に開示され
ているように、検査対象となる回路基板の回路パターン
に電圧を加え、回路基板に対向し隣接して配置した、誘
電体反射膜を堆積させた電気光学変調手段に偏光した光
を照射して、電気光学変調手段によって変調された偏光
を検出することにより電気試験するものがある。As a conventional non-contact electrical test apparatus, for example, as disclosed in Japanese Patent Application Laid-Open No. 6-180353, a voltage is applied to a circuit pattern of a circuit board to be inspected to apply a voltage to the circuit board. There is an electric test in which polarized light is applied to an electro-optic modulator on which a dielectric reflection film is deposited, which is disposed to be opposed to and adjacent to, and an electric test is performed by detecting the polarization modulated by the electro-optic modulator.
【０００４】また、例えば、特開平５−２５６７９２号
公報に開示されている検査装置においては、検査対象と
なる液晶基板と電気光学素子との間に通電すると、液晶
基板における欠陥の有無や状況に応じて各画素電極が発
生させる電場が変化し、それに伴って電気光学素子の光
学的性質が種々に変化し、照射された光の反射光を解析
することによって液晶基板の欠陥の有無や状況を知り得
るものである。Further, for example, in the inspection apparatus disclosed in Japanese Patent Application Laid-Open No. 5-256792, when a current is applied between a liquid crystal substrate to be inspected and an electro-optical element, the presence or absence of a defect in the liquid crystal substrate and the situation are checked. The electric field generated by each pixel electrode changes accordingly, the optical properties of the electro-optical element change accordingly, and the presence or absence of defects in the liquid crystal substrate is analyzed by analyzing the reflected light of the irradiated light. You can know.
【０００５】しかし、特開平５−２５６７９２号公報で
は、一方向の電界のベクトル成分を検出するものであ
り、平面内で電界のベクトル成分を検出することができ
ない。そのため、電界の各ベクトル成分が異常でも、光
の変調の度合いが等しければ電気試験では異常と判定さ
れないものとなる。また、例えば、高集積化された回路
基板の回路パターンの電気的性質を非接触で、平面内の
各ベクトル成分ごとの試験が必要な際には、回路基板と
電気光学素子の相対的な向きを変えて２回測定する必要
があった。However, Japanese Patent Application Laid-Open No. Hei 5-256792 detects a vector component of an electric field in one direction, and cannot detect a vector component of an electric field in a plane. Therefore, even if each vector component of the electric field is abnormal, if the degree of light modulation is equal, it is not determined to be abnormal in the electrical test. Further, for example, when it is necessary to conduct a test for each vector component in a plane without contacting the electrical properties of a circuit pattern of a highly integrated circuit board, the relative orientation of the circuit board and the electro-optical element is required. It was necessary to perform the measurement twice with different values.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、上記の問題
点を解決するためになされたものであり、その課題とす
るところは、高集積化された回路基板の電気試験におい
て、非接触で電界のベクトル成分を検出する際に、平面
内で電界の各ベクトル成分ごとに容易に検出することが
できる回路基板の検査装置、及び回路基板の検査方法を
提供することにある。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a non-contact electric test for a highly integrated circuit board. An object of the present invention is to provide a circuit board inspection apparatus and a circuit board inspection method that can easily detect each vector component of an electric field in a plane when detecting a vector component of the electric field.
【０００７】[0007]
【課題を解決するための手段】本発明は、１）電気光学
結晶に誘電体反射膜を堆積させた電気光学素子と、 ２）該電気光学素子の誘電体反射膜に対向するように設
けられた回路基板の載置部と、 ３）該回路基板の回路パターン間に電圧を印加する電圧
印加装置と、 ４）該電気光学素子に光を照射するレーザ光源及びビー
ムエキスパンダと、 ５）該ビームエキスパンダと電気光学素子の間に設けら
れた第一偏光板と、 ６）該誘電体反射膜で反射された光を検出する光検出部
（ＣＣＤカメラ）と、 ７）該電気光学素子と該光検出部（ＣＣＤカメラ）の間
に設けられた第二偏光板と、 ８）上記第一偏光板及び第二偏光板を回転させ偏光状態
を制御する偏光制御機構と、 ９）光検出部（ＣＣＤカメラ）で検出された光の偏光状
態から回路パターン間の電界のベクトル成分を得る画像
処理装置と、 １０）得られた回路パターン間の電界のベクトル成分
と、予め用意された電界のベクトル成分の情報とを比較
し、回路基板が良品か否かを判定する判定装置と、 １１）上記電圧印加装置、光検出部、偏光制御機構、画
像処理装置、判定装置を制御する制御装置と、 を具備することを特徴とする回路基板の検査装置であ
る。The present invention provides: 1) an electro-optical element in which a dielectric reflection film is deposited on an electro-optic crystal; and 2) an electro-optical element provided so as to face the dielectric reflection film. 3) a voltage applying device for applying a voltage between circuit patterns on the circuit board, 4) a laser light source and a beam expander for irradiating the electro-optical element with light, and 5) the A first polarizing plate provided between the beam expander and the electro-optical element, 6) a light detection unit (CCD camera) for detecting light reflected by the dielectric reflection film, and 7) the electro-optical element A second polarizing plate provided between the light detecting units (CCD cameras); 8) a polarization control mechanism for rotating the first polarizing plate and the second polarizing plate to control a polarization state; and 9) a light detecting unit. Circuit pattern from the polarization state of light detected by (CCD camera) An image processing apparatus for obtaining a vector component of an electric field between the circuit patterns; and 10) comparing the obtained vector component of the electric field between the circuit patterns with information of the vector component of the electric field prepared in advance to determine whether or not the circuit board is non-defective. And 11) a control device for controlling the voltage application device, the photodetector, the polarization control mechanism, the image processing device, and the determination device. 11) A circuit board inspection device, comprising: .
【０００８】また、本発明は、電気光学素子を回路基板
に対向配置し、回路基板の回路パターン間に電圧を印加
した状態で複数の偏光状態の光を電気光学素子に照射
し、反射光の偏光状態から該回路パターン間の平面での
電界のベクトル成分を各ベクトル成分ごとに検出して検
査を行うことを特徴とする回路基板の検査方法である。Further, according to the present invention, an electro-optical element is arranged opposite to a circuit board, and a plurality of polarized light beams are irradiated to the electro-optical element in a state where a voltage is applied between circuit patterns on the circuit board, and reflected light is reflected. An inspection method for a circuit board, wherein an inspection is performed by detecting a vector component of an electric field in a plane between circuit patterns from a polarization state for each vector component.
【０００９】[0009]
【発明の実施の形態】以下に本発明の実施の形態を詳細
に説明する。図１は、本発明による回路基板の検査装置
の一実施例の概念を示す説明図である。図１に示すよう
に、本発明による回路基板の検査装置は、電気光学素子
（５）、回路基板の載置部（１８）、電圧印加装置
（７）、レーザ光源（１）及びビームエキスパンダ
（２）、第一偏光板（４）、誘電体反射膜で反射された
光を検出する光検出部（ＣＣＤカメラ）（１０）、第二
偏光板（８）、偏光状態を制御する偏光制御機構
（３）、光検出部（ＣＣＤカメラ）で検出された光の偏
光状態から回路パターン間の電界のベクトル成分を得る
画像処理装置（１１）、回路基板が良品か否かを判定す
る判定装置（１２）、上記電圧印加装置、光検出部、偏
光制御機構、画像処理装置、判定装置を制御する制御装
置（９）で構成されたものである。Embodiments of the present invention will be described below in detail. FIG. 1 is an explanatory view showing the concept of an embodiment of a circuit board inspection apparatus according to the present invention. As shown in FIG. 1, a circuit board inspection device according to the present invention includes an electro-optical element (5), a mounting portion (18) of a circuit board, a voltage applying device (7), a laser light source (1), and a beam expander. (2), a first polarizing plate (4), a light detection unit (CCD camera) (10) for detecting light reflected by the dielectric reflection film, a second polarizing plate (8), a polarization control for controlling a polarization state Mechanism (3), an image processing device (11) for obtaining a vector component of an electric field between circuit patterns from a polarization state of light detected by a light detection unit (CCD camera), and a determination device for determining whether or not a circuit board is non-defective (12) A control device (9) configured to control the voltage application device, the light detection unit, the polarization control mechanism, the image processing device, and the determination device.
【００１０】まず、レーザ光源（１）から発するレーザ
光をビームエキスパンダ（２）によって面状の光とす
る。偏光制御機構（３）で第一偏光板（４）を制御する
ことにより、電気光学素子（５）へ照射する光の偏光状
態を制御する。電圧印加装置（７）で回路基板（６）に
電圧を印加することにより回路基板から電界が発生す
る。回路基板と電気光学素子は、数十μｍ程度の微少間
隔をおいて配置する。First, laser light emitted from a laser light source (1) is converted into planar light by a beam expander (2). By controlling the first polarizing plate (4) by the polarization control mechanism (3), the polarization state of the light irradiated to the electro-optical element (5) is controlled. An electric field is generated from the circuit board by applying a voltage to the circuit board (6) with the voltage applying device (7). The circuit board and the electro-optical element are arranged at a minute interval of about several tens of μm.
【００１１】電気光学素子（５）は、電気光学結晶（５
ａ）に誘電体反射膜（５ｂ）を堆積させている。レーザ
光源（１）から発するレーザ光が電気光学結晶（５ａ）
で変調を受け、誘電体反射膜（５ｂ）で反射されるよう
にする。電気光学結晶（５ａ）には、光と垂直な電界に
感度を有するＬｉＮｂＯ3 やＬｉＴａＯ3 の他、同様の
効果を有する電気光学結晶を用いることができる。The electro-optical element (5) includes an electro-optical crystal (5).
The dielectric reflection film (5b) is deposited on a). The laser light emitted from the laser light source (1) is an electro-optic crystal (5a)
And is reflected by the dielectric reflection film (5b). As the electro-optic crystal (5a), besides LiNbO 3 or LiTaO 3 having sensitivity to an electric field perpendicular to light, an electro-optic crystal having the same effect can be used.
【００１２】回路基板（６）から発生した電界が微少間
隔をおいて配置した電気光学素子（５）に染み出し、電
気光学結晶（５ａ）は、電気光学効果により複屈折率が
変化する。レーザ光源（１）から照射されたレーザ光は
第一偏光板（４）によって偏光となり、電気光学結晶
（５ａ）を透過して誘電体反射膜（５ｂ）によって反射
される際に偏光状態が変化する。第二偏光板（８）によ
って、電気光学素子（５）で位相変調されたレーザ光を
振幅変調する。光検出部（ＣＣＤカメラ）（１０）によ
って電気光学素子から反射されたレーザ光を撮像し、画
像処理装置（１１）にて回路基板（６）から放射された
電界画像を得る。The electric field generated from the circuit board (6) seeps into the electro-optical element (5) arranged at a minute interval, and the birefringence of the electro-optical crystal (5a) changes due to the electro-optical effect. The laser light emitted from the laser light source (1) becomes polarized by the first polarizing plate (4), and changes its polarization state when transmitted through the electro-optic crystal (5a) and reflected by the dielectric reflection film (5b). I do. The laser light phase-modulated by the electro-optical element (5) is amplitude-modulated by the second polarizing plate (8). The laser light reflected from the electro-optical element by the light detection unit (CCD camera) (10) is imaged, and the image processing device (11) obtains an electric field image emitted from the circuit board (6).
【００１３】すなわち、第一偏光板（４）で直線偏光の
光を作りだし、入射させると、電気光学結晶（５ａ）で
位相がずれ、楕円偏光となった光を第一偏光板（４）の
偏光と直交する偏光を作りだすように配置された第二偏
光板（８）によってベクトル成分を検出するものであ
る。That is, when linearly polarized light is produced by the first polarizing plate (4) and made incident, the light is shifted in phase by the electro-optic crystal (5a) and becomes elliptically polarized light. A vector component is detected by a second polarizing plate (8) arranged so as to produce polarized light orthogonal to polarized light.
【００１４】次に、偏光制御機構（３）で制御して複数
の偏光状態を入射し、複数の電界画像を得ることによっ
て平面での電界のベクトル成分を検出する。そして、判
定装置（１２）において良品の回路基板の電界画像と比
較することによって、回路基板の電気試験が実施できる
ものとなる。Next, a plurality of polarization states are incident upon being controlled by the polarization control mechanism (3), and a plurality of electric field images are obtained to detect a vector component of the electric field in a plane. Then, an electrical test of the circuit board can be performed by comparing the electric field image of the non-defective circuit board with the determination device (12).
【００１５】回路基板の回路パターンにおいて、隣接す
る電気的に絶縁されている回路パターン間に電位を発生
させると、隣接する回路パターン間の距離に反比例し
て、回路パターンが密集しているほど高い電界が発生す
るため高感度で測定できる。しかし、従来の、電界と光
の進行方向が平行な場合の非接触の電気試験方法では、
回路パターンが密集すると、電圧を印加した回路パター
ンと隣接する回路パターンとの間の電界を分解能よく測
定することが難しくなる。本発明によれば、同一のシス
テム構成で、偏光方向を変えるだけで電界のベクトル成
分が容易に検出できる。In a circuit pattern on a circuit board, when a potential is generated between adjacent electrically insulated circuit patterns, the higher the density of the circuit patterns, the higher the density in inverse proportion to the distance between the adjacent circuit patterns. Measurement can be performed with high sensitivity because an electric field is generated. However, in the conventional non-contact electrical test method when the traveling direction of the electric field and the light is parallel,
When the circuit patterns are dense, it becomes difficult to measure an electric field between a circuit pattern to which a voltage is applied and an adjacent circuit pattern with high resolution. According to the present invention, with the same system configuration, the vector component of the electric field can be easily detected only by changing the polarization direction.
【００１６】[0016]
【実施例】以下実施例により本発明を詳細に説明する。 ＜実施例１＞電気光学結晶には、ＬｉＮｂＯ3 やＬｉＴ
ａＯ3 などのＣ３Ｖ形の晶族の結晶を用いる。ここで
は、ＬｉＮｂＯ3 を例に説明する。ｙカットのＬｉＮｂ
Ｏ3 に、ｙ方向からレーザ光を入射する。このとき、ｘ
−ｚ面において屈折率楕円体は以下に示す数式（１）に
て表される。 （１／ｎ0 2＋γ13ＥZ ）ｘ2 ＋（１／ｎe 2 ＋γ33ＥZ ）ｚ2 ＋２γ51ＥX ｘｚ ＝１ ・・・・・・・・・・・（１）The present invention will be described in detail with reference to the following examples. <Example 1> LiNbO 3 or LiT was used for the electro-optic crystal.
A C3V type crystal group crystal such as aO 3 is used. Here, LiNbO 3 will be described as an example. y-cut LiNb
Laser light is incident on O 3 from the y direction. At this time, x
The refractive index ellipsoid on the −z plane is represented by the following equation (1). (1 / n 0 2 + γ 13 E Z) x 2 + (1 / n e 2 + γ 33 E Z) z 2 + 2γ 51 E X xz = 1 ··········· (1)
【００１７】図２（ａ）に示すように、数式（１）の関
係より、ｘ−ｚ面において自然複屈折率によって生ずる
屈折率１３に対して、電界Ｅｚが印加されると、電界Ｅ
ｚ印加時の屈折率１４となる。ｘ軸から４５度の偏光状
態でレーザ光を入射すると、電界Ｅｚによって、ｘ軸方
向の屈折率差１５と、ｚ軸方向の屈折率差１６が生じ、
レーザ光の楕円偏光の状態が変化するので電界Ｅｚを検
出することができる。As shown in FIG. 2A, when the electric field Ez is applied to the refractive index 13 generated by the natural birefringence on the xz plane, the electric field E
The refractive index becomes 14 when z is applied. When a laser beam is incident in a polarization state of 45 degrees from the x-axis, a refractive index difference 15 in the x-axis direction and a refractive index difference 16 in the z-axis direction are generated by the electric field Ez,
Since the state of the elliptical polarization of the laser light changes, the electric field Ez can be detected.
【００１８】図２（ｂ）に示すように、数式（１）の関
係より、電界Ｅｘは屈折率楕円体の楕円の主軸の方向を
変化させる。そこで、レーザ光の偏光状態をｘ軸方向、
またはｚ軸方向に平行に入射しても、電気光学結晶を透
過したレーザ光は、電界Ｅｘによって主軸方向が変化す
る。この効果は電界Ｅｘだけの影響を受け、電界ベクト
ルの成分である電界Ｅｘの検出が可能となる。このよう
に複数の偏光状態の光を照射することによって、電界の
ベクトル成分を検出することができる。As shown in FIG. 2B, the electric field Ex changes the direction of the principal axis of the ellipsoid of the refractive index ellipsoid according to the relationship of the equation (1). Therefore, the polarization state of the laser light is changed to the x-axis direction,
Alternatively, even if the laser light is incident parallel to the z-axis direction, the laser light transmitted through the electro-optic crystal changes its principal axis direction due to the electric field Ex. This effect is affected only by the electric field Ex, and the electric field Ex, which is a component of the electric field vector, can be detected. By irradiating light in a plurality of polarization states in this manner, a vector component of an electric field can be detected.
【００１９】次に、用意した電界のベクトル成分と比較
することにより、回路基板が良品か否かを判定する。電
界のベクトル成分の情報は、例えば、複数の回路基板を
検査し、そのうち多数が一致する電界のベクトル成分の
情報を良品の情報とみなして基準としてもよい。Next, it is determined whether or not the circuit board is non-defective by comparing with the vector component of the prepared electric field. The information on the electric field vector component may be, for example, a plurality of circuit boards inspected, and the information on the electric field vector component having a large number of coincidences may be regarded as non-defective information and used as a reference.
【００２０】従来の、非接触での電気的性質に関する試
験方法は、数式（１）の関係において、ｘ軸に対して４
５度の偏光状態で光を電気光学結晶に入射するだけなの
で、平面内で電界のベクトル成分を検出することができ
ない。そのため、電界の各ベクトル成分が異常でも、数
式（１）の複屈折率の変化によって生ずる光の変調の度
合いが等しければ電気試験では異常と判定されない。本
発明によれば、ＬｉＮｂＯ3 のような電気光学結晶で、
カット面、光の入射方向、偏光方向を工夫することによ
り電界の各ベクトル成分を容易に検出できる。A conventional test method for non-contact electrical properties is based on the following equation (1).
Since only light is incident on the electro-optic crystal in the polarization state of 5 degrees, the vector component of the electric field cannot be detected in a plane. Therefore, even if each vector component of the electric field is abnormal, if the degree of the light modulation caused by the change in the birefringence in equation (1) is equal, it is not determined to be abnormal in the electrical test. According to the present invention, an electro-optic crystal such as LiNbO 3
By devising the cut surface, the incident direction of light, and the polarization direction, each vector component of the electric field can be easily detected.
【００２１】[0021]
【発明の効果】本発明は、電気光学素子、回路基板の載
置部、電圧印加装置、レーザ光源及びビームエキスパン
ダ、第一偏光板、誘電体反射膜で反射された光を検出す
る光検出部（ＣＣＤカメラ）、第二偏光板、偏光状態を
制御する偏光制御機構、検出された光の偏光状態から回
路パターン間の電界のベクトル成分を得る画像処理装
置、回路基板が良品か否かを判定する判定装置、制御装
置を具備する回路基板の検査装置であるので、高集積化
された回路基板の電気試験において、非接触で電界のベ
クトル成分を検出する際に、平面内で電界の各ベクトル
成分ごとに容易に検出することができる回路基板の検査
装置となる。The present invention provides an electro-optical element, a mounting portion for a circuit board, a voltage applying device, a laser light source and a beam expander, a first polarizing plate, and a light detection device for detecting light reflected by a dielectric reflection film. Unit (CCD camera), second polarizing plate, polarization control mechanism for controlling the polarization state, image processing device for obtaining the vector component of the electric field between the circuit patterns from the polarization state of the detected light, and whether the circuit board is non-defective Since it is a circuit board inspection device including a determination device and a control device, when detecting a vector component of an electric field in a non-contact manner in an electrical test of a highly integrated circuit board, each of the electric fields in a plane is detected. The circuit board inspection apparatus can easily detect each vector component.
【００２２】また、本発明は、電気光学素子を回路基板
に対向配置し、回路基板の回路パターン間に電圧を印加
した状態で複数の偏光状態の光を電気光学素子に照射
し、反射光の偏光状態から回路パターン間の平面での電
界のベクトル成分を各ベクトル成分ごとに検出して検査
を行うので、高集積化された回路基板の電気試験におい
て、非接触で電界のベクトル成分を検出する際に、平面
内で電界の各ベクトル成分ごとに容易に検出することが
できる回路基板の検査方法となる。Further, according to the present invention, an electro-optical element is disposed opposite to a circuit board, and a plurality of polarized light beams are irradiated on the electro-optical element in a state where a voltage is applied between circuit patterns on the circuit board, and reflected light is reflected. Since the inspection is performed by detecting the vector component of the electric field in the plane between the circuit patterns from the polarization state for each vector component, in the electrical test of the highly integrated circuit board, the vector component of the electric field is detected in a non-contact manner. In this case, the circuit board inspection method can easily detect each vector component of the electric field in the plane.
【図１】本発明による回路基板の検査装置の一実施例の
概念を示す説明図である。FIG. 1 is an explanatory view showing the concept of an embodiment of a circuit board inspection apparatus according to the present invention.
【図２】（ａ）、（ｂ）は、実施例１の説明図である。FIGS. 2A and 2B are explanatory diagrams of the first embodiment.
１…レーザ光源 ２…ビームエキスパンダ ３…偏光制御機構 ４…第一偏光板 ５…電気光学素子 ５ａ…電気光学結晶 ５ｂ…誘電体反射膜 ６…回路基板 ７…電圧印加装置 ８…第二偏光板 ９…制御装置 １０…光検出部（ＣＣＤカメラ） １１…画像処理装置 １２…判定装置 １３…自然複屈折率によって生ずる屈折率 １４…電界Ｅz 印加時の屈折率 １５…ｘ軸方向の屈折率差 １６…ｚ軸方向の屈折率差DESCRIPTION OF SYMBOLS 1 ... Laser light source 2 ... Beam expander 3 ... Polarization control mechanism 4 ... First polarizing plate 5 ... Electro-optic element 5a ... Electro-optic crystal 5b ... Dielectric reflective film 6 ... Circuit board 7 ... Voltage applying device 8 ... Second polarization Plate 9 Control device 10 Photodetector (CCD camera) 11 Image processing device 12 Judgment device 13 Refractive index generated by natural birefringence index 14 Refractive index when electric field Ez is applied 15 Refraction in x-axis direction Index difference 16: Refractive index difference in z-axis direction
Claims (2)
せた電気光学素子と、 ２）該電気光学素子の誘電体反射膜に対向するように設
けられた回路基板の載置部と、 ３）該回路基板の回路パターン間に電圧を印加する電圧
印加装置と、 ４）該電気光学素子に光を照射するレーザ光源及びビー
ムエキスパンダと、 ５）該ビームエキスパンダと電気光学素子の間に設けら
れた第一偏光板と、 ６）該誘電体反射膜で反射された光を検出する光検出部
（ＣＣＤカメラ）と、 ７）該電気光学素子と該光検出部（ＣＣＤカメラ）の間
に設けられた第二偏光板と、 ８）上記第一偏光板及び第二偏光板を回転させ偏光状態
を制御する偏光制御機構と、 ９）光検出部（ＣＣＤカメラ）で検出された光の偏光状
態から回路パターン間の電界のベクトル成分を得る画像
処理装置と、 １０）得られた回路パターン間の電界のベクトル成分
と、予め用意された電界のベクトル成分の情報とを比較
し、回路基板が良品か否かを判定する判定装置と、 １１）上記電圧印加装置、光検出部、偏光制御機構、画
像処理装置、判定装置を制御する制御装置と、 を具備することを特徴とする回路基板の検査装置。1. An electro-optical element in which a dielectric reflective film is deposited on an electro-optical crystal, and 2) a mounting portion of a circuit board provided to face the dielectric reflective film of the electro-optical element. 3) a voltage applying device for applying a voltage between circuit patterns on the circuit board; 4) a laser light source and a beam expander for irradiating the electro-optical element with light; and 5) a beam expander and an electro-optical element. A first polarizing plate provided therebetween, 6) a light detection unit (CCD camera) for detecting light reflected by the dielectric reflection film, 7) the electro-optical element and the light detection unit (CCD camera) 8) a polarization control mechanism that rotates the first and second polarizers to control the polarization state; and 9) is detected by a light detector (CCD camera). From the polarization state of light, the vector component of the electric field between the circuit patterns An image processing device, and 10) a determination device that compares the obtained vector component of the electric field between the circuit patterns and the information of the vector component of the electric field prepared in advance to determine whether the circuit board is non-defective. 11) A circuit board inspection apparatus comprising: the voltage application device, a light detection unit, a polarization control mechanism, an image processing device, and a control device that controls a determination device.
路基板の回路パターン間に電圧を印加した状態で複数の
偏光状態の光を電気光学素子に照射し、反射光の偏光状
態から該回路パターン間の平面での電界のベクトル成分
を各ベクトル成分ごとに検出して検査を行うことを特徴
とする回路基板の検査方法。2. An electro-optical device according to claim 1, wherein the electro-optical element is disposed opposite to the circuit board, and a plurality of polarized light beams are applied to the electro-optical element while a voltage is applied between circuit patterns on the circuit board. An inspection method for a circuit board, wherein an inspection is performed by detecting a vector component of an electric field in a plane between circuit patterns for each vector component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000100720A JP4003371B2 (en) | 2000-04-03 | 2000-04-03 | Circuit board inspection apparatus and circuit board inspection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000100720A JP4003371B2 (en) | 2000-04-03 | 2000-04-03 | Circuit board inspection apparatus and circuit board inspection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001289917A true JP2001289917A (en) | 2001-10-19 |
| JP4003371B2 JP4003371B2 (en) | 2007-11-07 |
Family
ID=18614879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000100720A Expired - Fee Related JP4003371B2 (en) | 2000-04-03 | 2000-04-03 | Circuit board inspection apparatus and circuit board inspection method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4003371B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100416962B1 (en) * | 2000-11-14 | 2004-02-05 | 이주현 | Non contact type voltage sensing apparatus |
| JP2016050784A (en) * | 2014-08-28 | 2016-04-11 | ニッカ電測株式会社 | Optical pumped atom magnetometer, and metal detector |
| US9835565B2 (en) | 2014-12-29 | 2017-12-05 | Samsung Display Co., Ltd. | Inspection device of display device and inspection method of display device |
| CN111103529A (en) * | 2018-10-29 | 2020-05-05 | 三星电子株式会社 | Apparatus and method for testing wiring circuit |
| CN112198374A (en) * | 2020-09-30 | 2021-01-08 | 武汉大学 | High-frequency high-precision space electric field measurement system and method |
| CN113409251A (en) * | 2021-05-31 | 2021-09-17 | 广西格思克实业有限责任公司 | Data processing method for integrated circuit manufacturing |
-
2000
- 2000-04-03 JP JP2000100720A patent/JP4003371B2/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100416962B1 (en) * | 2000-11-14 | 2004-02-05 | 이주현 | Non contact type voltage sensing apparatus |
| JP2016050784A (en) * | 2014-08-28 | 2016-04-11 | ニッカ電測株式会社 | Optical pumped atom magnetometer, and metal detector |
| US9835565B2 (en) | 2014-12-29 | 2017-12-05 | Samsung Display Co., Ltd. | Inspection device of display device and inspection method of display device |
| CN111103529A (en) * | 2018-10-29 | 2020-05-05 | 三星电子株式会社 | Apparatus and method for testing wiring circuit |
| KR20200048293A (en) * | 2018-10-29 | 2020-05-08 | 삼성전자주식회사 | Apparatus and method for testing interconnect circuit |
| KR102611983B1 (en) * | 2018-10-29 | 2023-12-08 | 삼성전자주식회사 | Apparatus and method for testing interconnect circuit |
| CN112198374A (en) * | 2020-09-30 | 2021-01-08 | 武汉大学 | High-frequency high-precision space electric field measurement system and method |
| CN112198374B (en) * | 2020-09-30 | 2021-10-22 | 武汉大学 | High-frequency high-precision space electric field measurement system and method |
| CN113409251A (en) * | 2021-05-31 | 2021-09-17 | 广西格思克实业有限责任公司 | Data processing method for integrated circuit manufacturing |
| CN113409251B (en) * | 2021-05-31 | 2022-06-21 | 广西格思克实业有限责任公司 | Data processing method for integrated circuit manufacturing |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4003371B2 (en) | 2007-11-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5459409A (en) | Testing device for liquid crystal display base plate | |
| JPH06213975A (en) | Apparatus and method for observation of voltage in many positions on surface of panel under test | |
| US4658148A (en) | Inspection method for magnetic head utilizing the Kerr effect | |
| JP4003371B2 (en) | Circuit board inspection apparatus and circuit board inspection method | |
| US7271900B2 (en) | Magneto-optical imaging method and device | |
| KR100826505B1 (en) | Circuit pattern detecting device and circuit pattern detecting method | |
| JPH0580083A (en) | Method and apparatus for testing integrated circuit | |
| JPH0792236A (en) | Inspecting apparatus for voltage distribution on surface of substrate | |
| JP4403701B2 (en) | Circuit board inspection equipment | |
| JP2007503575A (en) | Non-invasive electric field detection and measurement device and method | |
| US20030094938A1 (en) | Circuit pattern detecting apparatus and circuit pattern inspecting method | |
| US7307444B2 (en) | Testing method and testing apparatus for liquid crystal panel | |
| JPH06258368A (en) | Surface potential measuring device | |
| JPH07181211A (en) | Surface potential measuring apparatus | |
| JP2002014131A (en) | Method and device for inspecting circuit board | |
| JP3855080B2 (en) | Optical characteristic measuring method for liquid crystal element and optical characteristic measuring system for liquid crystal element | |
| JPH0212852A (en) | Integrated circuit diagnosing apparatus | |
| JPH03167490A (en) | Apparatus for testing mounted printed circuit board | |
| JP2009085887A (en) | Measuring device and method | |
| JPH08128946A (en) | Optical characteristic measuring method and measuring equipment | |
| JPH08146051A (en) | Eo probe | |
| JP2003185696A (en) | Circuit pattern detector, circuit pattern detecting method and circuit pattern inspecting method | |
| JP2006126026A (en) | Apparatus for inspecting disconnection of wire of circuit board | |
| JPH08122415A (en) | Inspection equipment for printed board | |
| JPH07253453A (en) | Printed board inspecting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040318 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20050304 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060411 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060531 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20070731 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20070813 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100831 Year of fee payment: 3 |
|
| LAPS | Cancellation because of no payment of annual fees |