JP2001284333A - プラズマ処理装置 - Google Patents

プラズマ処理装置

Info

Publication number
JP2001284333A
JP2001284333A JP2001027626A JP2001027626A JP2001284333A JP 2001284333 A JP2001284333 A JP 2001284333A JP 2001027626 A JP2001027626 A JP 2001027626A JP 2001027626 A JP2001027626 A JP 2001027626A JP 2001284333 A JP2001284333 A JP 2001284333A
Authority
JP
Japan
Prior art keywords
plasma
antenna
vacuum vessel
processing apparatus
plasma processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001027626A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001284333A5 (enExample
Inventor
Akira Doi
昭 土居
Manabu Edamura
学 枝村
Masatsugu Arai
雅嗣 荒井
Tsutomu Tetsuka
勉 手束
Kenji Maeda
賢治 前田
Takeshi Yoshioka
健 吉岡
Tsunehiko Tsubone
恒彦 坪根
Saburo Kanai
三郎 金井
Hideyuki Kazumi
秀之 数見
Ryoji Nishio
良司 西尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2001027626A priority Critical patent/JP2001284333A/ja
Publication of JP2001284333A publication Critical patent/JP2001284333A/ja
Publication of JP2001284333A5 publication Critical patent/JP2001284333A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Plasma Technology (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
JP2001027626A 1996-11-27 2001-02-05 プラズマ処理装置 Pending JP2001284333A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001027626A JP2001284333A (ja) 1996-11-27 2001-02-05 プラズマ処理装置

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP31588596 1996-11-27
JP9-173519 1997-06-30
JP8-315885 1997-06-30
JP17351997 1997-06-30
JP2001027626A JP2001284333A (ja) 1996-11-27 2001-02-05 プラズマ処理装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP32579197A Division JP3175672B2 (ja) 1996-11-27 1997-11-27 プラズマ処理装置

Publications (2)

Publication Number Publication Date
JP2001284333A true JP2001284333A (ja) 2001-10-12
JP2001284333A5 JP2001284333A5 (enExample) 2005-07-14

Family

ID=27323792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001027626A Pending JP2001284333A (ja) 1996-11-27 2001-02-05 プラズマ処理装置

Country Status (1)

Country Link
JP (1) JP2001284333A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006253250A (ja) * 2005-03-09 2006-09-21 Samco Inc 誘導結合型プラズマ処理装置
JP2007012734A (ja) * 2005-06-29 2007-01-18 Matsushita Electric Ind Co Ltd プラズマエッチング装置及びプラズマエッチング方法
KR100785373B1 (ko) 2006-04-05 2007-12-18 주식회사 래디언테크 플라즈마 처리 장치
JP2012004000A (ja) * 2010-06-18 2012-01-05 Mitsubishi Heavy Ind Ltd 誘導結合プラズマ発生装置
JP2015015342A (ja) * 2013-07-04 2015-01-22 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ分布調整方法
JP2015062160A (ja) * 2013-08-20 2015-04-02 パナソニックＩｐマネジメント株式会社 プラズマ処理装置及びプラズマ処理方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006253250A (ja) * 2005-03-09 2006-09-21 Samco Inc 誘導結合型プラズマ処理装置
JP2007012734A (ja) * 2005-06-29 2007-01-18 Matsushita Electric Ind Co Ltd プラズマエッチング装置及びプラズマエッチング方法
KR100785373B1 (ko) 2006-04-05 2007-12-18 주식회사 래디언테크 플라즈마 처리 장치
JP2012004000A (ja) * 2010-06-18 2012-01-05 Mitsubishi Heavy Ind Ltd 誘導結合プラズマ発生装置
JP2015015342A (ja) * 2013-07-04 2015-01-22 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ分布調整方法
CN108203816A (zh) * 2013-07-04 2018-06-26 东京毅力科创株式会社 等离子体处理装置和等离子体分布调整方法
CN108203816B (zh) * 2013-07-04 2020-04-07 东京毅力科创株式会社 等离子体处理装置和等离子体分布调整方法
JP2015062160A (ja) * 2013-08-20 2015-04-02 パナソニックＩｐマネジメント株式会社 プラズマ処理装置及びプラズマ処理方法
US9583313B2 (en) 2013-08-20 2017-02-28 Panasonic Intellectual Property Management Co., Ltd. Plasma processing apparatus and plasma processing method

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