JP2001282146A - Laminated display panel and method for manufacturing the same, holding device, compression bonding jig as well as drive element packaging method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated display panel which is formed by laminating a plurality of panel elements and allows the easy packaging of driving ICs and the connection of junction substrates after laminating the panel elements. SOLUTION: The display panel DP 1 laminated with the three panel elements PEb, PEg and PEr. A brazing substrate Sbr formed with brazing electrodes, column substrate Sbc formed with the column substrate, column substrate Sgc, brazing substrate Sgr, brazing substrate Srr and column substrate Src are laminated in this order. The extension directions of connecting segments SbrC and SgcC for packaging the driving ICs and are made the same. The extension directions of connecting segments SgrC and SrrC of the adjacent substrates are made the same. The extension direction of the connecting segment SbrC, the extension direction of the connecting segment SbcC, the extension direction of the connecting segment SgrC and the extension direction of the connecting segment SrcC are offset by 90 deg. each in this order. The electrode forming surfaces of all the connecting segments are exposed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a stacked display panel in which a plurality of panel elements are stacked.

[0002] The present invention also relates to a method for manufacturing a multilayer display panel.

[0003] The present invention also relates to a holding device that can be used in a method of manufacturing a multilayer display panel.

[0004] The present invention also relates to a pressing jig for a driving element which can be used in a method of manufacturing a multilayer display panel.

[0005] The present invention also relates to a method for mounting a driving element which can be used in a method for manufacturing a multilayer display panel.

[0006]

2. Description of the Related Art As a display panel, a liquid crystal display panel, an electroluminescence (EL) display panel, a plasma display panel (PDP) and the like are known. In recent years, display panels such as a liquid crystal display panel, an EL display panel, and a PDP have been widely used in place of the CRT.

A stacked display panel in which a plurality of display panels (panel elements) are stacked for performing color display or the like has been proposed. In a multi-layer display panel, adjacent panel elements are usually bonded together using an adhesive.

[0008] In a display panel including only one panel element or in a stacked display panel in which a plurality of panel elements are stacked, each panel element is connected to a driving device and driven by the driving device to perform display. I do.

In order to drive a panel element with a driving device,
An electrode is provided on the substrate of the panel element. The electrodes on the panel element substrate are usually connected to a driving element (for example, a driving IC) of a driving device. Then, the control unit of the driving device applies a voltage to the electrodes of the panel element via the driving element, and the panel element is driven to perform display.

The driving element is mounted directly on a substrate of the panel element, for example, and is directly connected to an electrode on the panel element substrate. When a driving element is directly mounted on a panel element substrate, usually, a relay board for connecting the driving element to a control unit of a driving device is further connected to the panel element substrate.

By connecting a substrate on which a driving element such as a TCP (Tape Carrier Package) is mounted to the panel element substrate, an electrode on the panel element substrate may be connected to the driving element.

[0012]

When manufacturing a display panel having only one panel element, usually,
After the panel elements are formed, mounting of the driving elements and connection of the relay board or connection of the board on which the driving elements are mounted are performed.

However, no method has been proposed yet for mounting a drive element when manufacturing a multi-layer display panel in which a plurality of panel elements are stacked.

In manufacturing a multi-layer display panel, for example, it is conceivable to mount a driving element after stacking panel elements.

However, when such a method is employed, since a plurality of panel elements are stacked in the multilayer display panel, the mounting surface of the driving element of the panel element substrate may be hidden by other panel elements. is there. Also, the connection surface of the relay board may be hidden by another panel element. Then, it becomes very difficult to mount the driving element and connect the relay board.

Further, when fabricating a multi-layer display panel, before overlapping the panel elements, a driving element is mounted on each panel element in advance, and a relay board is connected to each panel element in advance. It is also possible.

However, when such a method is adopted, bubbles may remain between the panel elements when the panel elements are overlapped and the adjacent panel elements are bonded. This is because the driving IC and the relay board already mounted on the panel element are in the way, and a method for preventing bubbles from remaining between the panel elements cannot be adopted.

Such a problem occurs not only when a driving IC is directly mounted on a panel element substrate in a multi-layer display panel, but also when a substrate on which driving elements are mounted is connected to the panel element substrate.

Accordingly, the present invention provides a multilayer display panel which can easily perform mounting of a driving element (mounting of a driving element, connection of a relay board, and / or connection of a board on which a driving element is mounted). The task is to provide.

Another object of the present invention is to provide a multi-layer display panel capable of easily mounting a drive element and the like after the panel elements are overlapped.

It is another object of the present invention to provide a method of manufacturing a multi-layer display panel that can easily mount a driving element and the like.

Another object of the present invention is to provide a method of manufacturing a multi-layer display panel in which driving elements can be easily mounted after the panel elements are overlaid.

Another object of the present invention is to provide a holding device which can be used for holding a multilayer display panel when manufacturing a multilayer display panel and when mounting a driving element or the like. I do.

In addition, the present invention holds the multi-layer display panel so that the multi-layer display panel can be easily mounted when the multi-layer display panel is manufactured and when the driving element is mounted. An object of the present invention is to provide a holding device that can perform the above-described operations.

Another object of the present invention is to provide a crimping jig which can be used when manufacturing a multi-layer display panel and mounting a driving element.

It is another object of the present invention to provide a crimping jig for mounting a driving element while suppressing damage to electrodes of a panel element substrate when manufacturing a multi-layer display panel.

Another object of the present invention is to provide a crimping jig capable of mounting a driving element while suppressing damage to electrodes on a substrate.

Another object of the present invention is to provide a driving element mounting method capable of easily and reliably mounting a driving element when manufacturing a multilayer display panel.

[0029]

Means for Solving the Problems [1] Multilayer Display Panel The present invention provides first, second and third types of multilayer display panels in order to solve the above problems.

First, common items of the first, second and third types of the multi-layer display panel according to the present invention will be described. After that, characteristic items of each type of the multilayer display panel will be described in order.

Each type of multi-layer display panel according to the present invention has a plurality of panel elements (panel cells), and these panel elements are stacked. The first type of stacked display panel has three panel elements that are sequentially stacked. Each of the second and third types of the multi-layer display panel has two panel elements that are sequentially stacked.

Panel elements adjacent to each other so as not to be displaced from each other include, for example, an adhesive film, a double-sided adhesive tape,
What is necessary is just to bond using adhesives, such as a liquid adhesive. By bonding at least the display areas of adjacent panel elements to eliminate the air layer, the amount of transmitted light increases and the display quality improves. The plurality of stacked panel elements are held by a holding member or the like.
You may hold | maintain so that mutual positional relationship may not shift.

As the panel element, for example, a transmitted light type liquid crystal display panel, a reflected light type liquid crystal display panel, an organic electroluminescence display panel (organic EL display panel),
An inorganic electroluminescence display panel (inorganic EL display panel) and a plasma display panel (PDP) can be given.

In any type of multi-layer display panel according to the present invention, the plurality of panel elements may be all the same type of panel elements or different types of panel elements. Any type of multi-layer display panel may be, for example, a stack of a plurality of reflective light type liquid crystal display panels.

The first having three panel elements stacked
The type of stacked display panel may be, for example, a laminate of three panel elements, a panel element for red display, a panel element for green display, and a panel element for red display. In this way, full-color or multi-color display can be performed.

Each of the panel elements has a first and a second pair of substrates. These substrates face each other at a predetermined interval. Each of these substrates may be, for example, a resin substrate or a glass substrate. The resin substrate may be, for example, a film or a sheet.
If a resin film substrate is used as the substrate, the entire laminated display panel can be made thinner and lighter. The material of the resin substrate is, for example, polyether sulfone (PES), polycarbonate (PC), polyethylene terephthalate (PET), polyarylate (P
A), polyetheretherketone (PEEK), acrylic (PMMA), ABS, or the like.

A column electrode is formed on the first substrate. A row electrode is formed on the second substrate. These column and row electrodes are
It is provided for driving a panel element to perform display. In the following description, the first substrate on which the column electrodes are formed may be referred to as a column substrate. Further, the second substrate on which the row electrodes are formed may be referred to as a row substrate.

The column substrate (first substrate) may be provided with an insulating layer, an alignment film and the like, if necessary, in addition to the column electrodes. Similarly, an insulating layer, an alignment film, and the like may be provided on the row substrate (second substrate) as necessary in addition to the row electrodes.

The column electrode may include, for example, a plurality of strip electrodes arranged in parallel with each other at a predetermined pitch interval at least in the display area. Row electrodes, for example, at a predetermined pitch interval at least in the display area,
What is necessary is just to include a plurality of strip-shaped electrodes arranged in parallel with each other. Then, for example, a so-called matrix structure in which the strip electrodes forming the column electrodes and the strip electrodes forming the row electrodes are orthogonal to each other may be used.

The column electrodes and row electrodes (row electrodes and column electrodes, X electrodes and Y electrodes) are provided, for example, to drive the panel elements in a simple matrix.

The column electrode and the row electrode are, for example, MI
It may be provided for performing an active matrix drive using an M (metal insulator metal) element. In this case, for example, a plurality of MIM elements are connected to one of the column electrode and the row electrode (a strip electrode constituting the column electrode or the row electrode), and the other is placed at a position facing each MIM element. What is necessary is just to arrange | position the strip | belt-shaped electrode of this electrode. The MIM element may be formed on the substrate on which the electrode connecting the MIM element is formed.

The column electrode and the row electrode may be provided for displaying 7 segments, characters, and the like.

For the column electrode and the row electrode, for example, one of them may be used as a so-called data electrode (signal electrode) and the other may be used as a so-called scanning electrode.

In any case, the column electrode is formed on the row substrate (second substrate) of the panel element to which the column substrate belongs, of the two surfaces of the column substrate (first substrate) on which the column electrode is formed. It is formed on the surface on the facing side. Also,
The row electrode is formed on one of two surfaces of the row substrate on which the row electrode is formed, the surface facing the column substrate of the panel element to which the row substrate belongs.

The column electrodes are connected to driving elements for driving the panel elements. The row electrodes are also connected to driving elements for driving the panel elements. The driving element is, for example,
It is a drive IC (driver IC).

The driving elements connected to the column electrodes and the driving elements connected to the row electrodes are both part of the driving device for driving the panel elements. The driving device includes, for example, a control unit that controls driving of the driving element in addition to the driving element. A driving device having a driving element connected to a column electrode and a driving element connected to a row electrode is independent of driving other panel elements even if the driving device drives the entire multilayer display panel. The driving device may drive the panel element by using the driving device.

The column electrodes may be connected directly to the driving elements on the column substrate on which the column electrodes are formed, for example. That is, the driving element connected to the column electrode may be directly mounted on the column substrate and directly connected to the column electrode. Similarly, the row electrodes may be directly connected to the driving elements on the row substrate. When the drive elements are directly mounted on the board as described above, for example, a relay board for connecting the mounted drive elements to a control unit of the drive device may be further connected to the board.

The column electrode is a TCP (Tape Carrier Pac).
kage) may be indirectly connected to the driving elements by connecting the substrate on which the driving elements are mounted to the column substrate.
Similarly, the row electrode may be indirectly connected to the driving element by connecting a substrate on which the driving element such as TCP is mounted to the row substrate. When connecting the substrate on which the driving elements are mounted to the panel element substrate in this way, for example, a relay substrate for connecting the driving elements to the control unit of the driving device is provided on the substrate on which the driving elements are mounted. What is necessary is just to connect further.
Alternatively, the board on which the drive elements are mounted may be directly connected to the control unit of the drive device without passing through the relay board.

In any type of multi-layer display panel according to the present invention, some (three in the first type and two in the second or third type) of panel elements are partially (all) Not some) overlap each other. In the stacked display panel, at least a part (typically, most) of a part where all the panel elements overlap each other is used as a display area. The part where these panel elements overlap each other is
Typically, a square shape may be used. In addition, the display region may be typically formed in a square shape.

More specifically, in any type of multi-layer display panel according to the present invention, the column substrate (first substrate) on which the column electrodes are formed has an overlapped portion overlapping with all other substrates. Thus, the row substrate (second substrate) on which the row electrodes are formed also has an overlapping portion that overlaps with all other substrates.

The first having three stacked panel elements
In the type of stacked display panel, the overlapping portion of the column substrate is a portion that overlaps with the other five substrates (two other column substrates and three row substrates). Also,
The overlap portion of the row substrate is a portion that overlaps the other five substrates (three other column substrates and two row substrates).

The second having two panel elements stacked
Alternatively, in the third type of stacked display panel, the overlapping portion of the column substrate is a portion overlapping with the other three substrates (one other column substrate and two row substrates). The overlap portion of the row substrate is a portion that overlaps with the other three substrates (two other column substrates and one row substrate).

In any type of the multi-layer display panel according to the present invention, the column substrate is used to connect not only the overlap portion but also the column electrode extending in a predetermined direction from the overlap portion to the driving element. Connection portion. Similarly, the row substrate also has, in addition to the overlap portion, a connection portion for connecting a row electrode extending in a predetermined direction from the overlap portion to a drive element.

The extending direction of the connection portion of the column substrate from the overlap portion may be, for example, a direction parallel to the direction in which the column electrode extends in the display area. Similarly,
The extending direction of the connection portion of the row substrate from the overlap portion may be, for example, a direction parallel to the direction in which the row electrode extends in the display region.

At a connection portion of the column substrate, an electrode pattern for connecting the column electrode to the driving element is formed on the column electrode formation surface. When the driving element is directly mounted on the column substrate, this electrode pattern is, for example, a pattern for converting a column electrode pitch in a display area into an output lead pitch of the driving element. Similarly, an electrode pattern for connecting the row electrode to the driving element is formed on the row electrode forming surface in the connection portion of the row substrate.

The connection portion of the column substrate does not overlap with all of the other substrates. The connection portions of the row substrates do not overlap with all of the other substrates. The connection portion of the column substrate and the connection portion of the row substrate may overlap with one or more but not all of the other substrates.

The column substrate and the row substrate of the same panel element partially overlap each other. The overlap portion of the column substrate (the column substrate portion that overlaps with all other substrates including the substrate of another panel element) is at least a part of the portion that overlaps with the row substrate of the same panel element as the column substrate (typically, , All or most). Similarly, the overlapping portion of the row substrate (the row substrate portion overlapping with all other substrates including the substrate of another panel element) is at least a part (representative) of the portion overlapping with the column substrate of the same panel element as the row substrate. Typically, all or most).

The column substrate and the row substrate of the same panel element may be, for example, both rectangular, and may be overlapped in an “L” shape. In this case, a portion of the column substrate that does not overlap with the row substrate is used as a connection portion for connecting to the drive element, and a portion of the row substrate that does not overlap with the column substrate is used as a connection portion for connecting to the drive element. I just need.

For example, the column substrate and the row substrate of the same panel element may have a rectangular shape, and may be overlapped in a “+” shape. In this case, for example,
One of the two separated portions not overlapping the row substrate of the column substrate is used as a connection portion, and one of the separated two portions not overlapping the column substrate of the row substrate is connected. It can be used as In this case, however, the width of a portion of the two portions of the column substrate not overlapping with the row substrate that is not used as a connection portion is limited as described later in detail.
Similarly, there is a limitation on the width of a portion of the row substrate that is not used as a connection portion between the two portions that do not overlap with the column substrate.

In any type of the multi-layer display panel according to the present invention, the extension of the connection portion of the same panel element with respect to the column substrate is centered on the portion where all panel elements overlap (centering on the overlap portion). The setting direction and the extending direction of the connection portion of the brazing board form an angle of 90 °. In the following description, the extending direction of the connecting portion of the column substrate or the row substrate around the portion where all the panel elements overlap is simply referred to as the extending direction of the connecting portion of the column substrate or the row substrate. is there.

Each type of the multi-layer display panel according to the present invention is characterized by the order of lamination of the column substrate and the row substrate of each panel element, the extending direction of the connecting portion of each substrate, and the like.

Hereinafter, the first, second and third types of multilayer display panels will be described in order. [1-1] First-type multilayer display panel The first-type multilayer display panel includes first, second, and third three panel elements that are stacked, and the respective panel elements are mutually connected. A pair of first and second substrates opposed to each other, and a column electrode formed on a surface of the first substrate facing the second substrate of each of the panel elements;
A row electrode is formed on a surface of the second substrate facing the first substrate, and the first substrate of each of the panel elements has an overlapping portion overlapping with the other five substrates; A connecting portion extending from the portion to connect a column electrode on the first substrate to a driving element, wherein the second substrate of each of the panel elements overlaps with the other five substrates. The first, second, and third panels having an overlap portion and a connection portion extending from the overlap portion to connect a row electrode on the second substrate to a driving element. The element is the first panel element.
A substrate, a second substrate of the first panel element, a second substrate of the second panel element, a first substrate of the second panel element, a first substrate of the third panel element, and a second substrate of the third panel element. Are arranged so as to be lined up, and the extending direction of the connecting portion of the second substrate of the first panel element around the overlapping portion of the first, second and third panel elements, and The connecting portion of the second substrate of the second panel element adjacent to the substrate extends in the same direction, and the second panel element of the second panel element centering on the overlapping part of the first, second, and third panel elements. The direction in which the connection portion of the first substrate extends,
The connecting portions of the first substrate of the third panel element adjacent to the first substrate extend in the same direction, and the first, second and third panel elements are centered on the overlapping portions of the first panel element. The extending direction of the connecting part of the first element of the panel element, the extending direction of the connecting part of the second element of the first panel element and the connecting part of the second substrate of the second element, the first substrate of the second element The extending direction of the connecting portion of the third panel element and the connecting portion of the first substrate of the third panel element and the extending direction of the connecting portion of the third panel element on the second substrate are shifted by 90 ° in this order. It is a stacked display panel.

The first type of stacked display panel has first, second and third three panel elements which are sequentially stacked.

Either the first panel element or the third panel element may be arranged on the observation side. That is,
The first panel element may be a panel element arranged at a position closest to the observation side among the three panel elements, or may be a panel element arranged at a position farthest from the observation side. In any case, of these three panel elements, the second panel element is located in the middle.

In the first type of multi-layer display panel, the first, second and third panel elements have a column substrate (first substrate) and a row substrate (second substrate) of the panel elements in the following order. They are superimposed so that they are lined up.

Column substrate of first panel element, row substrate of first panel element, row substrate of second panel element, column substrate of second panel element, column substrate of third panel element, row substrate of third panel element These substrates are arranged in this order. Furthermore, a column substrate, a row substrate, a row substrate,
The column substrate, the column substrate, and the row substrate are arranged in this order.
When viewed from the opposite side, the rows are arranged in the order of a row substrate, a column substrate, a column substrate, a row substrate, a row substrate, and a column substrate.

That is, two adjacent substrates of two adjacent panel elements are either row substrates or both are column substrates.

In the multilayer display panel of the first type, the extending directions of the connecting portions of two adjacent substrates of two adjacent panel elements are the same. More specifically, the extending direction of the connection portion of the row substrate of the first panel element is the same as the extending direction of the connection portion of the row substrate of the second panel element. The extending direction of the connecting portion of the second panel element to the column substrate is the same as the extending direction of the connecting portion of the third panel element to the column substrate.

Further, in the first type of multi-layer display panel, 1) the extending direction of the connecting portion of the first panel element to the column substrate, 2) the extending direction of the connecting portion of the first panel element to the row substrate (= 3) the extending direction of the connecting portion of the column substrate of the second panel element (= extending direction of the connecting portion of the column substrate of the third panel element); 4) The extending directions of the connection portions of the row substrates of the third panel element are shifted by 90 ° in this order, and are different from each other.

That is, in the direction in which the connection portion of the first panel element extends to the connection portion of the column substrate, the connection portion of another substrate does not extend. This allows the connection portion of the first panel element of the column substrate to be exposed so as not to overlap with another substrate. More specifically, it is possible to expose the column electrode formation surface of the connection portion of the first panel element to the column substrate.

Similarly, in the direction in which the connection portions of the row substrates of the third panel element extend, the connection portions of the other substrates do not extend. Thereby, the connection portion of the third panel element to the row substrate can be exposed. Furthermore, the third
The row electrode formation surface of the connection portion of the row substrate of the panel element can be exposed.

Although the connecting portions of the row substrate of the first panel element and the row substrate of the second panel element which are adjacent to each other have the same extending direction, the connection of the row substrate of the first panel element is performed for the following reason. The row electrode formation surface of the portion and the row electrode formation surface of the connection portion of the row substrate of the second panel element can be exposed. Further, even if the connecting portions having the same extending direction have the same width in the extending direction, the electrode forming surfaces of the connecting portions can be exposed.

This is because the row electrodes of the first panel element
This is because the row electrodes of the second panel element are formed on the row substrate surface of the second panel element facing the column substrate, while being formed on the row substrate surface of the panel element facing the column substrate. In other words, these row electrodes are not arranged between the row substrate of the first panel element and the row substrate of the second panel element.

The extending direction of these connection portions is the same on both the column electrode formation surface of the connection portion of the column substrate of the second panel element and the column electrode formation surface of the connection portion of the column substrate on the third panel element. However, it can be exposed for the same reason as described above. Further, even if the connecting portions having the same extending direction have the same width in the extending direction, the electrode forming surfaces of the connecting portions can be exposed.

That is, in the first type of multi-layer display panel, any of the electrode forming surfaces of the six connection portions of the first, second, and third panel elements can be exposed.

In the first type of multi-layer display panel, at least one of the electrode forming surfaces of the connection portions of any substrate of each panel element is not hidden by the substrate of another panel element. The part (typically, most or all) may be exposed.

Thus, when the driving element is directly mounted on the electrode forming surface of the connection portion, the mounting can be easily performed in a state where the first, second, and third panel elements are stacked. . Driving elements can be easily mounted on any of the connection portions. Repair of the mounting of the driving element can be easily performed. In this case, the relay board for connecting the drive element to the control unit of the drive device can be easily connected to the connection portion. Repair of the connection of the relay board can also be easily performed.

Also, when a substrate on which a driving element such as a TCP is mounted is connected to a connection portion, this connection can be easily performed in a state where three panel elements are stacked. The connection of the substrate on which the drive element is mounted at any of the connection portions can be easily performed. This connection can be easily repaired.

In the first type of multi-layer display panel, the width of each connection portion in the extending direction is limited to the mounting of the driving element, etc., even though the electrode formation surfaces of the connection portions of all the substrates are exposed. The minimum required width is sufficient. Therefore, the frame width can be reduced accordingly.

For example, within a range that does not overlap with all the connection portions of the first panel element on the column substrate,
For example, when a drive element is directly mounted on the connection portion, any one or more of the other five substrates may be attached to the first panel element from the overlap portion of the substrate within a range that does not hinder the mounting. There may be an extension portion extending in the same direction as the extension direction of the connection portion of the column substrate. The same applies to the extending direction of the connection portion of another substrate. The same can be said for any of the second and third types of multilayer display panels. [1-2] Second-Type Multilayer Display Panel A second-type multilayer display panel includes first and second two panel elements that are stacked, and each of the panel elements faces each other. A first electrode and a second pair of substrates. Each of the panel elements has a column electrode formed on a surface of the first substrate facing the second substrate.
A row electrode is formed on a surface of the substrate facing the first substrate, and the first substrate of each of the panel elements has an overlapping portion overlapping with the other three substrates and extending from the overlapping portion. A connection portion for connecting a column electrode on the first substrate to a driving element, wherein the second substrate of each of the panel elements has an overlapping portion overlapping with the other three substrates. And a connection portion extending from the overlap portion and connecting a row electrode on the second substrate to a driving element, wherein a substrate inside the first panel element adjacent to each other is provided. The substrate inside the second panel element may be a first substrate on which column electrodes are formed, or a second substrate on which row electrodes are formed.
A substrate, each of a substrate inside the first panel element and a substrate inside the second panel element, which are adjacent to each other, centered on an overlapping portion of the first panel element and the second panel element. The extending direction of the connecting portion is the same, and the extending direction of the connecting portion of the substrate outside the first panel element around the overlapping portion of the first panel element and the second panel element is the first direction. The extending direction of the connecting portion of the substrate inside the panel element and the connecting portion of the substrate inside the second panel element, and the extending direction of the connecting portion of the substrate outside the second panel element are shifted by 90 ° in this order. A stacked display panel.

The second type of stacked display panel has first and second two panel elements which are sequentially stacked.

The second type of multi-layer display panel has the same structure as that of the first type of multi-layer display panel except for the first panel element or the third panel element, as described below. .

In the second type of multi-layer display panel, both the inner substrate of the first panel element and the inner substrate of the second panel element adjacent to each other are the first substrate on which column electrodes are formed. (A column substrate) or a second substrate (a row substrate) on which row electrodes are formed.

More specifically, in the second type of stacked display panel, the four substrates are stacked as follows. These substrates are stacked in the order of a column substrate of the first panel element, a row substrate of the first panel element, a row substrate of the second panel element, and a column substrate of the second panel element.
Alternatively, these substrates are stacked in the order of the row substrate of the first panel element, the column substrate of the first panel element, the column substrate of the second panel element, and the row substrate of the second panel element.

Also in the second type of multi-layer display panel, similarly to the first type of multi-layer display panel, the extending direction of the connection portion of the substrate inside the first panel element and the second The extending direction of the connecting portion of the substrate inside the panel element is the same.

Further, in the second type of multi-layer display panel, similarly to the first type of multi-layer display panel, 1) the extending direction of the connecting portion of the substrate outside the first panel element, 2) the first panel Extension direction of the connection portion of the substrate inside the element (= extension direction of the connection portion of the substrate inside the second panel element); 3) extension direction of the connection portion of the substrate outside the second panel element. In this order, they are shifted by 90 ° and are different from each other.

Thus, also in the second type of multi-layer display panel, similarly to the first type of multi-layer display panel, the electrode formation surface of the connection portion of each substrate can be exposed.

In the multi-layer display panel of the second type, similarly to the multi-layer display panel of the first type, all of the electrode forming surfaces of the connection portions of the substrates of each panel element are connected to other panels. Without being hidden by the element substrate,
At least a part thereof (typically, most or all) may be exposed.

Thus, in any connection portion, when the driving element is directly mounted on the electrode forming surface of the connection portion, the mounting can be easily performed in a state where the two panel elements are overlapped. In addition, the relay board can be easily connected in a state where the two panel elements are overlapped. Also when connecting a substrate on which a drive element such as TCP is mounted to a connection portion, the connection can be easily performed in a state where the two panel elements overlap. Further, repair such as mounting of a driving element can be easily performed at any connection portion.

Also, in the second type of multi-layer display panel, as in the case of the first type of multi-layer display panel, despite the fact that the electrode forming surfaces of all the connection portions of the substrates are exposed, the connection portions of each connection portion are exposed. The width in the extending direction may be the minimum width necessary for mounting the driving element and the like. Therefore, the frame width can be reduced accordingly.

In the second type of multi-layer display panel, the connection portion of each substrate extends in only three directions, so that the frame width and frame size can be further reduced. [1-3] Third-Type Laminated Display Panel A third-type laminated display panel includes first and second two panel elements that are laminated, and each of the panel elements faces each other. A first electrode and a second pair of substrates. Each of the panel elements has a column electrode formed on a surface of the first substrate facing the second substrate.
A row electrode is formed on a surface of the substrate facing the first substrate, and the first substrate of each of the panel elements has an overlapping portion overlapping with the other three substrates and extending from the overlapping portion. A connection portion for connecting a column electrode on the first substrate to a driving element, wherein the second substrate of each of the panel elements has an overlapping portion overlapping with the other three substrates. And a connection portion extending from the overlap portion and connecting a row electrode on the second substrate to a drive element, wherein the first panel element and the second panel element overlap each other. The extending direction of the connecting portion of the first panel element on the first substrate, the extending direction of the connecting portion of the first panel element on the second substrate, the third direction of the second panel element, Extension direction and front of connecting part of one board Extending direction of the second connecting portion of the substrate of the second panel element is a multi-layer display panel, characterized in that are shifted by 90 ° in a predetermined order.

The third type of stacked display panel has first and second panel elements stacked.

In the third type of multi-layer display panel, 1) the extending direction of the connecting portion of the first panel element to the column substrate 2) the extending direction of the connecting portion of the first panel element to the row substrate; The extending direction of the connecting portion of the column substrate of the two-panel element, and 4) the extending direction of the connecting portion of the row substrate of the second panel element are shifted by 90 ° in a predetermined order and are different from each other.

Thus, in the third type of multi-layer display panel as well, similarly to the first type of multi-layer display panel, the electrode formation surface of the connection portion of each substrate can be exposed.

In the third type of multi-layer display panel as well, similarly to the first type of multi-layer display panel, all of the electrode forming surfaces of the connection portions of any of the panel elements are connected to other panels. Without being hidden by the element substrate,
At least a part thereof (typically, most or all) may be exposed.

Thus, also in the third type of multi-layer display panel, the electrode formation surface of any of the substrate connection portions can be exposed, similarly to the first type of multi-layer display panel. Thus, in any connection portion, when the driving element is directly mounted on the electrode forming surface of the connection portion, the mounting can be easily performed with the two panel elements overlapping. In addition, the relay board can be easily connected in a state where the two panel elements are overlapped. Also when connecting a substrate on which a drive element such as TCP is mounted to a connection portion, the connection can be easily performed in a state where the two panel elements overlap. Further, repair such as mounting of a driving element can be easily performed at any connection portion.

Also, in the third type of multi-layer display panel, as in the case of the first type of multi-layer display panel, although the electrode formation surface of any of the substrate connection portions is exposed, the extension of each connection portion is also possible. The width in the installation direction is the minimum width required for mounting the driving element and the like. Therefore, the frame width can be reduced accordingly.

In the third type of multi-layer display panel, the substrate inside the first panel element and the substrate inside the second panel element adjacent to each other may be a column substrate, and both are row substrates. One of them may be a column substrate and the other may be a row substrate.

More specifically, in the third type of multi-layer display panel, the four substrates are as follows:
The layers may be laminated as described in (d). (A) For example, these substrates may be stacked in the order of a column substrate of the first panel element, a row substrate of the first panel element, a row substrate of the second panel element, and a column substrate of the second panel element. (B) These substrates may be stacked in the order of the row substrate of the first panel element, the column substrate of the first panel element, the column substrate of the second panel element, and the row substrate of the second panel element. (C) These substrates may be stacked in the order of the column substrate of the first panel element, the row substrate of the first panel element, the column substrate of the second panel element, and the row substrate of the second panel element. (D) These substrates may be stacked in the order of the row substrate of the first panel element, the column substrate of the first panel element, the row substrate of the second panel element, and the column substrate of the second panel element. [1-4] First, Second or Third Type Multilayer Display Panels (a) In any of the first, second and third types of multilayer display panels, in order to reduce the frame width, The width of each connection portion in the extending direction may be, for example, the minimum width required for mounting the driving element.

In the multilayer display panel of the first or second type having connection portions having the same extending direction, the widths of the connection portions having the same extending direction in the extending direction may be the same, for example. Even if the widths of the connecting portions having the same extending direction are the same, as described above, all of the electrode forming surfaces of these connecting portions can be exposed, so that the mounting of the drive element and the like can be easily performed. . (B) In any of the first, second, and third types of multilayer display panels, at least the overlapping portion of two substrates adjacent to each other may be bonded with, for example, an adhesive.

In the multilayer display panel of the first or second type having connection portions extending in the same direction, not only the overlapping portion of two substrates adjacent to each other but also the connection portion may be bonded with an adhesive. Good.

Examples of the adhesive include an adhesive film,
A double-sided adhesive tape, a liquid adhesive, or the like may be used. (C) In any of the first, second and third types of multi-layer display panels, the first and second substrates (column substrate and row substrate) are used to reduce the thickness and weight as described above. May be, for example, a resin film substrate.

A resin film used as a substrate is usually wound around a reel (roll) or the like, and the film is cut into a predetermined shape, and the cut film is used as a substrate. For this reason, the resin film substrate has an effect of being wound on a reel,
It may have a curl.

As described above, when the resin film substrate is curled, the column electrode may be formed, for example, on the convex side of the substrate (column substrate) formed by curling. Similarly, the row electrode may be formed, for example, on the convex side of a substrate (row substrate) formed by winding. The advantage of forming the electrodes on the convex side of the substrate in this way will be described in the description of the method for manufacturing a multilayer display panel according to the present invention. (D) In any of the first, second and third types of multilayer display panels, for example, a drive element may be directly mounted on the connection portion of the substrate as described above.

For mounting this driving element (for example, driving IC), for example, ACF (Anisotoropic Conductive Film:
An anisotropic conductive adhesive such as an anisotropic conductive paste or an anisotropic conductive paste may be used.

In the first or second type of multi-layer display panel having connection portions extending in the same direction, the mounting portion is mounted on one of two adjacent substrates having the same connection portion extending direction. The driving element to be mounted may be mounted, for example, at a position that does not overlap the driving element mounted on the other substrate.

A driving element mounted on one of two adjacent substrates having the same extending direction of the connection portion may be mounted at a position overlapping a driving element mounted on the other substrate. Good. (E) In any of the first, second, and third types of multilayer display panels, when the driving element is directly mounted on the connection portion of the substrate as described above, the connection portion of the substrate includes, for example, Further, a relay board for connecting the mounted driving element to the control unit of the driving device may be further connected.

For connection of the relay board, for example, ACF
Or the like may be used.

The relay board may be, for example, a flexible board. If a flexible relay board is adopted, the relay board can be folded back to the side opposite to the observation side of the multilayer display panel, and the frame width can be reduced. (F) In any of the first, second, and third types of multilayer display panels, as described above, the connection portion of the substrate has a substrate (for example, TCP) on which a drive element is mounted.
May be connected.

For connection of the substrate on which the drive elements are mounted, for example, an anisotropic conductive adhesive such as ACF may be used.

The substrate on which the driving elements are mounted may be, for example, a flexible substrate. If a flexible substrate is adopted, the frame width can be reduced by folding the substrate toward the side opposite to the observation side of the multilayer display panel. (G) The first-type multilayer display panel may further include one or two or more panel elements stacked thereon in addition to the three panel elements sequentially stacked having the above-described structure. .

The second or third type of multi-layer display panel further includes one or two or more panel elements laminated thereon in addition to the two panel elements sequentially laminated with the above-described structure. You may. (H) In any of the first, second, and third types of multilayer display panels, each panel element is, for example, between a column substrate on which a column electrode is formed and a row substrate on which a row electrode is formed. A liquid crystal panel element in which liquid crystal is disposed may be used.

The liquid crystal (liquid crystal composition) disposed between the substrates is:
For example, a liquid crystal composition including a liquid crystal exhibiting a cholesteric phase (eg, a liquid crystal exhibiting a cholesteric phase at room temperature) may be used. Liquid crystals exhibiting a cholesteric phase selectively reflect light having a wavelength corresponding to the helical pitch of the liquid crystal. Therefore, a liquid crystal panel element including a liquid crystal exhibiting a cholesteric phase can be used as a reflective liquid crystal panel element.

As the liquid crystal exhibiting a cholesteric phase, for example, a cholesteric liquid crystal exhibiting a cholesteric phase itself, a chiral nematic liquid crystal obtained by adding a chiral material to a nematic liquid crystal, or the like may be used. The chiral nematic liquid crystal has an advantage that the helical pitch can be adjusted by the amount of the chiral material added, and the selective reflection wavelength can be easily adjusted. [2] Method of Manufacturing Multilayer Display Panel The present invention also provides a method of manufacturing first, second, and third three types of multilayer display panels.

The manufacturing methods of the first, second and third types are as follows.
These are methods for manufacturing the first, second and third types of multilayer display panels, respectively.

A method for manufacturing the first, second and third types of multilayer display panel will be described below. [2-1] Method for Manufacturing First-Type Multilayer Display Panel The first method for manufacturing a multi-layer display panel is a multi-layer display panel in which first, second, and third panel elements are stacked. A panel element forming step of forming each of the panel elements using a first substrate on which a column electrode is formed and a second substrate on which a row electrode is formed; The first substrate of each of the panel elements finally has an overlapping portion overlapping with the other five substrates, and an overlapping portion extending from the overlapping portion. hand,
A connection portion for connecting a column electrode on the first substrate to a driving element; and a second substrate of each of the panel elements includes:
Eventually, an overlap portion overlapping with the other five substrates and a connection portion extending from the overlap portion and connecting a row electrode on the second substrate to a drive element are provided, In the panel element forming step, the first and second substrates are overlapped so that the column electrode and the row electrode are both arranged inside the substrate. substrate,
The second substrate of the first panel element, the second substrate of the second panel element, the first substrate of the second panel element, and the first substrate of the third panel element
The first, second, and third panel elements are overlapped so that these substrates are arranged in the order of a substrate and a second substrate of a third panel element.
And the extension direction of the connection portion of the second panel of the first panel element centering on the overlapping portion of the third panel element and the connection portion of the second substrate of the second panel element adjacent to the second substrate The first, second, and third panel elements are overlapped so that the extending directions of the first, second, and third panel elements are the same, and in the overlapping step, the overlapping portions of the first, second, and third panel elements overlap each other. So that the extending direction of the connecting portion of the first substrate of the second panel element and the extending direction of the connecting portion of the first substrate of the third panel element adjacent to the first substrate are the same. The first, second, and third panel elements are overlapped, and in the overlapping step, the first panel element of the first panel element is centered on the overlapping part of the first, second, and third panel elements. Extension direction of the connection part of the board, Extending direction of the second second connecting portion of the substrate of the connecting portion and the second panel element substrate Le element, the second
The direction in which the connecting portion of the panel element on the first substrate and the connecting portion of the third panel element on the first substrate extend;
A method for manufacturing a multilayer display panel, wherein the first, second, and third panel elements are overlapped so that the extending direction of a connection portion of a substrate is shifted by 90 ° in this order. [2-2] Method of Manufacturing Second-Type Multilayer Display Panel The second method of manufacturing a multilayer display panel is a method of manufacturing a multilayer display panel in which first and second two panel elements are stacked. A panel element forming step of forming each of the panel elements using a first substrate on which a column electrode is formed and a second substrate on which a row electrode is formed; and forming the formed panel elements in a predetermined order. The first substrate of each of the panel elements includes an overlap portion that eventually overlaps the other three substrates, and a first portion extending from the overlap portion, and First
A connection portion for connecting a column electrode on the substrate to the drive element; and a second substrate of each of the panel elements has an overlap portion that eventually overlaps the other three substrates; A connecting portion extending from the portion to connect a row electrode on the second substrate to a driving element, wherein in the panel element forming step, both the column electrode and the row electrode are disposed inside the substrate. The first and second substrates are overlapped so that the substrate inside the first panel element and the substrate inside the second panel element adjacent to each other are both column electrodes in the overlapping step. The first and second panel elements are overlapped so as to form a first substrate on which a first electrode is formed, or so as to form a second substrate on which a row electrode is formed. In the above, each of a substrate inside the first panel element and a substrate inside the second panel element which are adjacent to each other, centering on the overlapping part of the first panel element and the second panel element. The first and second panel elements are overlapped so that the connecting portions extend in the same direction. In the overlapping step, the overlapping portions of the first panel element and the second panel element are overlapped with each other. The extension direction of the connection portion of the substrate outside the first panel element at the center, the extension direction of the connection portion of the substrate inside the first panel element and the connection portion of the substrate inside the second panel element,
The extending direction of the connecting portion of the substrate outside the second panel element is
A method of manufacturing a multilayer display panel, wherein the first and second panel elements are overlapped so as to be shifted by 90 ° in this order. [2-3] Method of Manufacturing Third-Type Multilayer Display Panel The third method of manufacturing a multilayer display panel is a method of manufacturing a multilayer display panel in which first and second two panel elements are stacked. A panel element forming step of forming each of the panel elements using a first substrate on which a column electrode is formed and a second substrate on which a row electrode is formed; and forming the formed panel elements in a predetermined order. The first substrate of each of the panel elements includes an overlap portion that eventually overlaps the other three substrates, and a first portion extending from the overlap portion, and First
A connection portion for connecting a column electrode on the substrate to the driving element; and a second substrate of each of the panel elements has an overlap portion that finally overlaps with the other three substrates; A connecting portion extending from the portion to connect a row electrode on the second substrate to a driving element, wherein in the panel element forming step, both the column electrode and the row electrode are disposed inside the substrate. The first and second substrates are superimposed on each other, and in the superimposing step, the first panel element and the second panel element have a first panel element centered on an overlapping part. The extending direction of the connecting portion of one substrate, the extending direction of the connecting portion of the first panel element on the second substrate, the extending direction of the connecting portion of the second panel element on the first substrate, and the direction of the second panel element 2nd group Extending direction of the connection portion, to be shifted by 90 ° in a predetermined order, a method of fabricating the multilayer display panel, characterized in that superimposing the first and second panel elements. [2-4] According to the first, second, and third types of manufacturing methods according to the present invention, the above-described first, second, and third types of multilayer display panels can be manufactured, respectively. 1st, 2nd
Alternatively, what has been described regarding the third type of multi-layer display panel can be similarly applied to the corresponding first, second, and third types of manufacturing methods.

In each of the first, second, and third types of manufacturing methods, the column substrate (first substrate) and the row substrate (second substrate) are used.
A substrate element) using a (substrate), and an overlapping step of overlapping the formed panel elements.

The shape of the column substrate (row substrate) used in the panel element forming step is described in detail below.
It may be different from the final shape of the substrate. Similarly,
The shape of the column substrate (row substrate) in the overlapping step may be different from the final shape of the substrate.

In any of the first, second, and third types of manufacturing methods, the column substrate of each panel element is provided with an overlap portion that eventually overlaps all the other substrates, A connection portion extending from the portion to connect the column electrode to the driving element.
In addition, the row substrate of each panel element has an overlap portion that eventually overlaps all other substrates, and a connection portion that extends from the overlap portion and connects the row electrode to the drive element. Are provided.

As described above, the orientation of the electrode forming surface of the substrate in the panel element forming step, the stacking order of each substrate of each panel element in the overlapping step, and / or the extending direction of the connection portion in the overlapping step are as described above. By doing so, a multilayer display panel in which the electrode formation surfaces of all the substrate connection portions are finally exposed can be manufactured.

In any of the first, second, and third types of manufacturing methods, finally, the electrode formation surface of the connection portion of any substrate of each panel element is entirely replaced by another panel element. So that at least a part (typically, most or all) is exposed without being hidden by the substrate,
The panel element forming step and the overlapping step may be performed. (A) Thus, when the driving elements are directly mounted on the connection portions of the panel element substrate, the driving elements can be mounted after the panel elements are superimposed (after the superposition step). Also, when connecting the relay board to the connection portion, the connection can also be made after the overlapping step. Repair such as mounting of the driving element can also be performed after the overlapping step.

In any of the first, second, and third types of manufacturing methods, the mounting step of mounting the driving element on the connection portion of the substrate and connecting the electrodes on the substrate to the driving element includes, for example, It may be performed after the overlapping step. Also,
The connection step of connecting the relay board to the board connection portion may be performed, for example, in a superposition step. If the mounting step and the connecting step are performed after the overlapping step, the driving elements and the relay board do not interfere, and thus the panel elements can be easily overlapped. (B) When a substrate on which a drive element is mounted is connected to a connection portion of the panel element substrate, the connection can also be made after the overlapping step.

In any of the first, second, and third types of manufacturing methods, the connection step of connecting a substrate (drive element mounting substrate) on which a drive element such as TCP is mounted to a substrate connection portion of a panel element is performed. For example, it may be performed after the overlapping step. If the connection step for connecting the driving element mounting boards is performed after the overlapping step, the driving element mounting boards do not become a hindrance, so that the panel elements can be easily overlapped. [2-5] In any of the first, second, and third types of manufacturing methods, in the panel element forming step, the column substrate on which the column substrate is formed;
If a liquid crystal is arranged between the row substrates on which the row electrodes are formed, a liquid crystal panel element can be formed.

When the liquid crystal sandwiched between the substrates is a chiral nematic liquid crystal as described above, a reflection type liquid crystal panel element can be manufactured. [2-6] In any of the first, second, and third types of manufacturing methods, in the overlapping step, at least an overlapping portion between two adjacent substrates is an adhesive film, a double-sided adhesive tape, a liquid adhesive. And the like.

Further, in the first or second type of manufacturing method in which a multi-layer display panel having connection portions extending in the same direction is formed, in the case where two adjacent panel elements overlap each other between two adjacent substrates. Both the wrap portion and the connection portion may be bonded with an adhesive.

In any of the first, second, and third types of manufacturing methods, in the overlapping step, for example, the panel elements may be positioned and the panel elements may be overlapped. For this positioning, for example, an alignment mark (registration mark) is provided on a column substrate and / or a row substrate of each panel element.
What is necessary is just to perform using this alignment mark. For the positioning, a conventionally known image processing method may be adopted. The alignment mark may be formed of, for example, an electrode material. The alignment mark may be formed, for example, outside the display area of the substrate. The alignment mark may be formed on a portion of the substrate that is ultimately removed. One or more predetermined dots (pixels) on the panel element
May be displayed, and the display may be used as an alignment mark. [2-7] In any of the first, second, and third types of manufacturing methods, as described above, each substrate of each panel element finally has an overlying layer that overlaps with all other substrates. A wrap portion and a connection portion extending from the overlap portion for connecting an electrode on the substrate to a driving element are provided. As described in the description of the multilayer display panel, the connection portion of each substrate does not ultimately overlap with all the other substrates.

What is important here is that each substrate of each panel element has an overlapping portion that overlaps with all other substrates and a connection portion that does not overlap with all other substrates.
That is, it is only necessary to finally provide each substrate.

Therefore, the portion that will eventually become the connection portion (the extension portion that extends from the overlap portion) may overlap with all the other substrates in the process of manufacturing the multilayer display panel. In this case, the substrate portion covering the electrode formation surface of the connection portion of the other substrate (the portion overlapping the electrode formation surface of the connection portion of the other substrate) is typically at a predetermined timing (for example, in a panel element formation process). Before, after the panel element forming step, before the overlapping step, after the overlapping step, etc.), at least a part (typically, most of the electrode forming surface) of the connection portion. Or all) may be exposed. More specifically, the substrate portion covering the electrode forming surface of the connection portion of another substrate may be cut at a predetermined timing so as not to hinder the mounting of the driving element on the connection portion.

In any of the first, second and third types of manufacturing methods, for example, the following [2-7-1], [2-7-1]
As described in [7-2] or [2-7-3], a multi-layer display panel may be manufactured by providing a cutting step of cutting unnecessary portions of each substrate. [2-7-1] For example, an after-cut process of removing an unnecessary portion (a portion to be cut) from each of the first and second substrates of the superposed panel elements may be performed after the superposition process.

In this case, for example, a substrate having the following shape is used as each of the first and second substrates in the panel element forming step, and the next portion of the substrate may be removed in the aftercutting step.

Each of the first substrates includes, for example, an overlap portion that finally overlaps with another substrate, and four extension portions extending in four directions at 90 ° center angle intervals from the overlap portion. May be used. Similarly, as each second substrate, for example, an overlap portion that eventually overlaps with another substrate, and four extension portions that extend in four directions at 90 ° center angle intervals from the overlap portion, May be used.

Then, in the after-cutting step,
Of the four extending portions of the first substrate, the extending portions other than the extending portions used as the connecting portions are removed, and the extending portions used as the connecting portions of the four extending portions of the second substrate are removed. What is necessary is just to remove the extension part other than a part.

In this way, the extended portion used as the connection portion and the extended portion removed in the after-cutting step can be used for holding the panel element in the overlapping step or the like, so that the overlapping step can be easily performed. Can be. [2-7-2] Alternatively, in the panel element forming step, substrates having the following shapes may be used as the first and second substrates, and the following portions of the substrates may be removed in the aftercutting step.

As each of the first substrates, for example, an overlap portion that finally overlaps with another substrate, an extension portion that extends from the overlap portion and is used as a connection portion, and an extension portion that extends from the overlap portion. It is sufficient to use a substrate provided with an extended portion used as a holding portion for holding the panel element in the overlapping step. Similarly, each of the second substrates includes, for example, an overlap portion that eventually overlaps with another substrate, an extension portion that extends from the overlap portion and is used as a connection portion, and an extension portion that extends from the overlap portion. It is sufficient to use a substrate provided with an extended portion used as a holding portion for holding the panel element in the overlapping step.

Then, in the aftercutting step,
Of the extended portions of the first substrate, the extended portions other than the extended portion used as the connection portion are removed, and the extended portions of the extended portion of the second substrate other than the extended portion used as the connection portion are removed. What is necessary is just to remove a set part.

The extended portion used as the connecting portion and the extended portion used as the holding portion may be the same extended portion. In the after-cut process, the extended portion used as the holding portion in the overlapping process, which is not used as the connection portion, may be removed.

In this case, similarly to the method described in the above section [2-7-1], the extended portion used as the connection portion and the extended portion removed in the after-cutting step are:
It can be used as a holding portion in a superposition process or the like, and the superposition process can be easily performed. [2-7-3] A precut step of removing unnecessary portions from each first substrate and each second substrate is performed before the overlapping step, and each first substrate and each second substrate of each overlapped panel element is performed. After-cutting step of removing unnecessary portions from the superposition step may be further performed after the overlapping step.

In this case, for example, a substrate having the following shape is used as each of the first and second substrates in the panel element forming step, the next portion of the substrate is removed in the pre-cut step, and the substrate is removed in the after-cut step. The next part of may be further removed.

In the panel element forming step, for example,
Each of the first substrates has an overlapping portion that eventually overlaps with another substrate, and 90 ° from the overlapping portion.
A substrate having four extending portions extending in four directions at the center angle interval of may be used. Similarly, each second substrate has an overlap portion that finally overlaps with another substrate, and four extension portions that extend in four directions from the overlap portion at a 90 ° center angle interval. A substrate may be used.

Then, in the precut step, the first
An extension part used as a connection part among the four extension parts of the substrate and an extension part other than the extension part used as a holding part for holding the panel element in the overlapping step are removed, and It is only necessary to remove an extended portion used as a connection portion of the four extended portions of the two substrates and an extended portion other than the extended portion used as a holding portion for holding the panel element in the overlapping step.

Further, in the after-cutting step,
The extension of the first substrate other than the extension used as the connection may be removed, and the extension of the second substrate other than the extension used as the connection may be removed.

In this case as well, as described in [2-7-2], the extended portion used as the connection portion and the extended portion used as the holding portion are the same extended portion. Is also good. Also in this case, in the after-cutting step, the extension part used as the holding part in the overlapping step, which is not used as the connection part, may be removed.

Even in this case, the extended portion used as the connecting portion and the extended portion removed in the after-cutting step can be used as a holding portion in the overlapping step or the like, and the overlapping step can be easily performed. . [2-7-4] The above [2-7-1], [2-7-2]
And in any of the methods shown in [2-7-3],
Half-cutting may be performed in advance on the boundary between the substrate portion to be removed in the after-cutting step and the substrate portion to be left. If the half-cut is performed in this manner, it is easy to remove unnecessary substrate portions in the after-cut process. This half-cut step may be performed, for example, at a timing at which the half-cut can be easily performed before the after-cut step. This half-cutting step is performed, for example, before the overlapping step, before the panel element forming step, or in the middle of the panel element forming step (for example, after forming electrodes on the substrate. (Before formation).

[2-7-3] Performing the Precut Step
Similarly, in the method described above, a half-cut may be performed in advance on the boundary between the substrate portion to be removed in the pre-cut step and the remaining substrate portion. If the half cut is performed in this manner, it is easy to remove unnecessary substrate portions in the half cut step. The half-cut for the pre-cut step may be performed, for example, at a timing at which the half-cut can be easily performed on the substrate before the pre-cut step. This half-cut step may be performed, for example, before the overlapping step, before the panel element forming step, or in the middle of the panel element forming step.

The half-cut step for the pre-cut step and the half-cut step for the after-cut step may be performed simultaneously (at the same timing).

In any case, the half cut may be performed, for example, on the exposed surface of the substrate. When two or more portions to be removed from the substrate overlap, the exposed surface of the substrate is the surface that is exposed after removing the already exposed substrate portion. [2-7-5] In any of the methods described in [2-7-1] and [2-7-3] using a substrate provided with four extended portions in the panel forming step, The following may be used as the substrate.

Each of the first elements used in the panel element forming process
The substrate may be such that, for example, an extension portion used as a connection portion around the overlap portion of the first substrate and used as a connection portion can also be used as a connection portion for connecting to the drive element. Similarly, each of the second substrates used in the panel element forming step has an extension portion used as a connection portion around the overlap portion of the second substrate as a connection portion. It may be used as a connection part.

If the above-mentioned substrate is used as each first substrate (each column substrate), the extension direction of the extension portion used as a connection portion of each column substrate may be any direction. Can be the same. Similarly,
The row substrate of each panel element can be the same regardless of the extension direction of the extension portion used as a connection portion of the substrate. This allows the parts to be shared.

Each of the first elements used in the panel element forming process
The substrate and each of the second substrates may be all rectangular substrates having the same size. If the first substrate and the second substrate have the same size and shape, a panel element can be easily manufactured.

Each of the first elements used in the panel element forming process
On the substrate, all the column electrodes having the same pattern may be formed. With this configuration, a column electrode having a predetermined shape can be formed on each first substrate using, for example, the same mask. Similarly, each of the second substrates used in the panel element forming step may have row electrodes formed in the same pattern. In this way, a row electrode having a predetermined shape can be formed on each second substrate, for example, using the same mask. [2-7-6] The above [2-7-1], [2-7-2]
And in any of the methods shown in [2-7-3],
In the after-cutting step or the pre-cutting step, at least a part of the unnecessary extended portion may be removed.

In other words, a part of the extension part that is not finally used as the connection part may remain.

In other words, as long as the mounting of the drive element on the extension part used as the connection part of another board, the connection of the relay board, and the connection of the drive element mounting board are not hindered,
A part of the extension part not used as the connection part may remain. [2-8] Of course, without performing the cutting process as described in [2-7] above, from the stage of the panel element forming step, each panel element is formed using the column substrate and the row substrate of the final shape. Then, a stacked display panel may be manufactured by overlapping them. [2-9] Driving Element Mounting Step As described above, when a driving element (for example, a driving IC) is directly mounted on the connection portion of the substrate, this mounting step may be performed, for example, as follows. (A) This mounting step may be performed, for example, after the overlapping step. (B) For mounting the driving element, for example, an anisotropic conductive adhesive such as an anisotropic conductive film (ACF) or an anisotropic conductive paste may be used. By arranging this anisotropic conductive adhesive between the drive element and the board connection part, and applying heat and pressure,
A driving element can be mounted. (C) In the first or second type of manufacturing method for producing a multilayer display panel having connection portions extending in the same direction, drive elements may be mounted on these two connection portions, for example, as follows. .

A driving element mounted on one of two adjacent substrates having the same extending direction of the connection portion is mounted, for example, at a position not overlapping with a driving element mounted on the other substrate. I just need. For example, these drive elements may be mounted so as to be arranged in a staggered manner. In this way, for example, when mounting the driving element using the ACF, it is easy to apply heat and pressure to the ACF and the driving element to be mounted.

The driving element mounted on one of the two adjacent substrates having the same extending direction of the connecting portion may be mounted at a position overlapping the driving element mounted on the other substrate. .

When two driving elements are mounted at positions overlapping each other as described above, for example, these driving elements may be mounted as follows.

For example, after temporarily attaching at least one of the two drive elements respectively mounted on the two connection parts having the same extending direction to the connection part, the two drive elements may be simultaneously permanently attached at the same time. For example, when mounting the drive element using the ACF, the drive element can be temporarily bonded by applying heat and pressure that are smaller than the heat and pressure applied during the actual bonding.

The two driving elements mounted at positions overlapping each other may be permanently bonded one by one. That is, one drive element may be permanently bonded, and then the other drive element may be permanently bonded.

Regardless of whether the driving element is mounted at any of the overlapping position and the non-overlapping position, it is a matter of course that an electrode pattern is formed at each connection portion so that the driving element can be mounted at such a position. Good. (D) When the driving element to be mounted has a bump, the periphery of the connection surface of the bump of the driving element to the electrode on the panel element substrate may be rounded before the mounting step. The connection surface of the bump to the electrode on the panel element substrate is A
When the driving element is mounted using the CF, the surface is connected to the electrode on the panel element substrate via the conductive particles of the ACF. By performing such a bump rounding step, damage (cracks and the like) of the electrode during mounting can be suppressed as compared with a case where the edge of the contact surface of the bump with the electrode has an edge.

For example, the periphery of the bump may be rounded by etching or mechanical polishing.

As a matter of course, the mounting may be performed by using a drive element which is rounded in advance so that the peripheral edge of the bump has no edge. If bumps are formed by plating or the like, the periphery of the bumps can be rounded at the time of bump formation. The same effect can be obtained. (E) If the drive element to be mounted has bumps, the drive element may be mounted using, for example, the following crimping jig.

For example, thermocompression bonding may be performed using a crimping jig including a crimping base member arranged on the side opposite to the mounting surface of the connection portion of the substrate on which the drive element is to be mounted.

By providing a raised portion at a position facing the bump of the pressure-bonding base member, deformation (dent) at the time of mounting a substrate (for example, a resin film substrate) can be balanced between the mounting surface and the opposite surface. In addition, damage to the electrodes on the substrate during mounting can be suppressed. If the outer periphery of the raised portion of the pressure-bonding base member is smaller than the outer periphery of the bump of the drive element, damage to the electrodes on the substrate can be further suppressed. (F) When the column substrate is a resin film substrate, the column electrode may be formed on the convex side of the column substrate formed by winding. Similarly, when the solder substrate is a resin film substrate, the solder electrode may be formed on the convex surface side of the solder substrate formed by winding.

If the electrodes are formed on the convex surface of the substrate as described above, the electrodes (for example, ITO electrodes) can be used when the substrate is flat.
Is subjected to compressive stress. When mounting the driving element on the connection portion of the substrate, even if the electrode is pressed by a bump of the driving element and the electrode is deformed, the deformation is applied in a direction to release the compressive stress, so that the crack is generated. Etc. can be suppressed. [2-10] Connecting Step of Relay Board As described above, when a drive element (for example, a drive IC) is directly mounted on a connection portion of the board, for example, the drive element is connected to a control unit of a drive device. May be further connected to the connection portion. This connection step of the relay board may be performed, for example, as follows. (A) This connecting step may be performed, for example, after the overlapping step. (B) For connection of the relay substrate, for example, an anisotropic conductive adhesive such as an anisotropic conductive film (ACF) or an anisotropic conductive paste may be used. (C) As the relay substrate, for example, a flexible substrate may be used.

The flexible relay substrate may be folded back to the side opposite to the observation side of the multilayer display panel. By folding back in this way, the frame width can be reduced. [2-11] Connection Step of Connecting Substrate on Which Driving Elements are Mounted As described above, TC
When connecting a substrate on which a driving element such as P (for example, a driving IC) is mounted, this connection step may be performed, for example, as follows. (A) This connecting step may be performed, for example, after the overlapping step. (B) An anisotropic conductive adhesive such as an anisotropic conductive film (ACF) or an anisotropic conductive paste may be used to connect the substrate on which the driving elements are mounted. (C) As the substrate on which the driving element is mounted, for example,
A flexible substrate may be used.

This flexible substrate may be folded back to the side opposite to the observation side of the multilayer display panel. By folding back in this way, the frame width can be reduced. [2-12] When the drive element is directly mounted on the connection part of the board, when the relay board is connected to the connection part, and
In any case of connecting the substrate on which the driving element is mounted to the connection portion, the mounting of the driving element and the like may be performed as follows. (A) In the mounting process, for example, the alignment marks (registration marks and target marks) provided at the connection portions of the panel element substrate and the alignment marks provided at the driving elements are used to position these alignment marks. What is necessary is just to perform alignment, and to mount a drive element in the predetermined position of a connection part.

Similarly, in the connecting step of the relay board,
For example, by using an alignment mark provided on a connection portion of the panel element substrate and an alignment mark provided on the relay substrate, the alignment marks are aligned, and the relay substrate is connected to a predetermined position of the connection portion. I just need.

Similarly, in the connection step of the substrate on which the drive elements are mounted (drive element mounting board), for example, an alignment mark provided on a connection portion of the panel element substrate and an alignment mark provided on the drive element mounting board are provided. The alignment of these alignment marks may be performed using the marks, and the driving element mounting substrate may be connected to a predetermined position of the connection portion.

For such alignment, a conventionally known method such as image processing may be employed. The alignment mark may be read by a reading device such as a CCD or a microscope.

The alignment mark provided on the connection portion of the substrate of the panel element is, for example, an electrode material (for example, IT
O).

In the case of manufacturing the first or second type of multi-layer display panel, when the mounting step is performed after the overlapping step, the alignment marks provided at the two connecting portions having the same extending direction are simultaneously formed. , May be visible in a close position.

In such a case, the drive element cannot be mounted at a correct position without reading an alignment mark provided at a connection portion where the drive element is to be mounted.
A correct alignment mark can be read as follows. For example, reading may be performed by a reading device (for example, a CCD, a microscope, or the like) having a shallow depth of field. By making the depth of field shallow, it is possible to focus only on the alignment mark to be read, and to read the correct alignment mark. The depth of field can be reduced by increasing the magnification and / or by opening the aperture.

In the connecting step of the relay board or the connecting step of the board on which the driving elements are mounted, similarly, the connection may be performed by reading the alignment mark with a reading device having a small depth of field. The same effect can be obtained. (B) When mounting a drive element, connecting a relay board, connecting a board on which a drive element is mounted, and the like after the overlapping step, for example, while holding the stacked panel element using the next holding device, The mounting of the driving element may be performed.

The holding device may have the following holding jig, for example.

The holding jig includes, for example, a first surface for mounting a connection portion of a substrate on which a drive element is to be mounted and a second surface for mounting a portion where the panel elements overlap. What is necessary is just to have.

When the drive element is directly mounted on the connection part, the connection part of the substrate on which the drive element is to be mounted is the connection part on which the drive element is to be mounted. When connecting the relay board to the connection part, the connection part of the board on which the drive element is to be mounted or the like is the connection part to which the relay board is to be connected. When a board on which a drive element is mounted is mounted on a connection part, a connection part on which the drive element is to be mounted is a connection part on which the drive element mounting board is to be connected.

The first surface of the holding jig is used to mount a drive element on one of two connection parts extending in the same direction when the drive element is mounted on the other connection part. This is the surface on which the connection to be made is placed.

The first surface of the holding jig may be, for example, a flat surface. Similarly, the second surface of the holding jig may be, for example, a flat surface.

[0178] Between the first surface and the second surface of the holding jig,
A step may be provided.

The height of this step is determined, for example, by the holding jig first.
The maximum height including a manufacturing error in the height from the surface of the multilayer display panel directly mounted on the surface to the surface of the multilayer display panel directly mounted on the second surface may be set to be larger than that.

When a driving element is mounted on one connection portion (first connection portion) of two connection portions having the same extending direction, the first connection portion is connected via the other connection portion (second connection portion). Since the connection portion is placed on the first surface, the first holding jig is provided.
The surface of the stacked display panel directly mounted on the surface is the second connection portion surface.

If a holding jig having such a step of height is used, when mounting a drive element on a connection portion or the like, when the connection portion is pressed against the first surface, the connection of the substrate is made. Damage due to buckling or the like of the portion, its vicinity, and electrodes on these portions can be suppressed.

[0182] The holding device may further include a suction device for sucking the stacked display panel surface directly mounted on the first surface of the holding jig to the first surface. The holding device may further include a suction device for sucking the stacked display panel surface directly mounted on the second surface of the holding jig to the second surface. The suction device may be, for example, air suction.

By mounting the drive elements while adsorbing the surface of the multi-layer display panel to the first surface and / or the second surface by the suction device, it is possible to prevent the position of the multi-layer display panel from being displaced, and to thereby achieve high precision It is possible to mount a driving element or the like.

The holding device further includes a pressing member for pressing the connection portion of the substrate of the panel element on which the driving element mounted on the first surface of the holding jig is to be mounted or the like toward the first surface. It may be provided.

If the driving element is mounted while the connecting portion is pressed against the first surface of the holding jig by the pressing member, the positioning of the driving element and the like becomes easy, and the mounting of the driving element can be performed with high accuracy.

The holding member may have, for example, a window for exposing a region where the drive element is to be mounted at a connection portion where the drive element is to be mounted or the like, or a connection portion avoiding the already mounted drive element. A window for pressing down on the first surface may be provided.

The holding member may be provided with a window (notch) for exposing a connection area of a relay board at a connection portion where a drive element is to be mounted or the like or a relay board already connected. A window for pressing the connection portion to the first surface may be provided.

In addition, a window (notch) for exposing a connection region of a substrate on which a drive element is mounted at a connection portion where the drive element is to be mounted or the like, or a connection member that has already been connected to the holding member. A window for pressing the connection portion to the first surface may be provided avoiding the substrate.

The driving element may be mounted while holding the connecting portion against the first surface with the holding member while holding the suction device.

In the case where the driving element is mounted on one of the two connecting portions having the same extending direction,
Even if the connecting portion on which the drive element is to be mounted is suctioned to the first surface by the suction device via the other connection portion, the connection portion on which the drive element is to be mounted cannot be sufficiently suctioned to the first surface. Even at this time, if the pressing member is employed, the mounting of the driving element and the like can be performed accurately.

As described above, if two connecting portions extending in the same direction are adhered with an adhesive, the drive element should be mounted via the other connecting portion without using a holding member. The connection portion can be reliably attracted to the holding jig first surface. As a result, it is possible to mount the driving element with high accuracy.

After the drive element is mounted on one of the two connection parts having the same extending direction, when the drive element is mounted on the other connection part, the already mounted drive element is obstructed. In order to avoid this, a recess may be provided on the first surface of the holding jig for fitting the already mounted drive element.

Similarly, after connecting the relay board or the board on which the drive element is mounted to one of the two connection parts extending in the same direction, the drive element is mounted on the other connection part. Furthermore, a concave portion for fitting the already mounted substrate may be provided on the first surface of the holding jig so that the already connected substrate does not interfere. [3-1] Holding Device The holding device described above can also be used for holding a multilayer display panel other than the first to third types of multilayer display panels according to the present invention.

The holding device provided by the present invention is as follows.

The holding device according to the present invention is a holding device for holding a multi-layer display panel in which a plurality of panel elements each having a pair of substrates are stacked, and the panel elements protrude from an overlapping portion. On the protruding part of the board,
A holding device for holding the multi-layer display panel when mounting a drive element or connecting another substrate,
A holding jig having a first surface for mounting the substrate projecting portion and a second surface for mounting a portion where the panel element overlaps, and a first surface and a second surface of the holding jig; Between the two surfaces, the maximum height including a manufacturing error in the height from the surface of the multilayer display panel directly mounted on the first surface to the surface of the multilayer display panel directly mounted on the second surface. A holding device provided with a step larger than that.

This holding device can be used when mounting a drive element or when connecting another board (for example, a relay board or a board on which a drive element is mounted).

The substrate protruding portion is a substrate connecting portion for connecting a driving element in the first to third types of the multi-layer display panels according to the present invention.

As described above, the holding device may further include a suction device for sucking the stacked display panel surface directly mounted on the first surface of the holding jig to the first surface. .

Further, the holding device may further be provided with a pressing member for pressing the substrate projecting portion mounted on the first surface of the holding jig toward the first surface. The holding member may be provided with a window for exposing the drive element mounting area of the protruding portion of the substrate placed on the first surface of the holding jig. The pressing member may be provided with a window for exposing a connection region of another substrate (such as a relay substrate) at a portion of the substrate protruding portion mounted on the first surface of the holding jig. [3-2] Crimping jig The above-described crimping jig can also be used for mounting a drive element in a multilayer display panel other than the first to third types of multilayer display panels according to the present invention.

The crimping jig provided by the present invention is as follows.

The crimping jig according to the present invention is a crimping jig used for mounting a driving element having bumps on a substrate, and includes a crimping base member arranged on the side of the substrate opposite to the mounting surface of the driving element. And a crimping jig characterized in that the crimping base member has a raised portion at a position facing the bump.

As described above, the outer periphery of the raised portion of the pressure-bonding base member may be smaller than the outer periphery of the bump of the driving element. [3-3] Driving Element Mounting Method The driving element mounting method described above is the first to third methods according to the invention.
The present invention can also be used for mounting a drive element in a multilayer display panel other than the third type of multilayer display panel.

The driving element mounting method provided by the present invention is as follows.

The method for mounting a driving element according to the present invention is a mounting method for mounting a driving element at a position where two substrate surfaces overlap each other, and temporarily bonding at least one of the driving elements to a substrate. A driving element mounting method including a step and a main bonding step of main bonding two driving elements simultaneously.

[0205] The two substrate surfaces may be two substrate surfaces of different substrates or two substrate surfaces of the same substrate.

As described above, the temporary bonding step and the final bonding step may be performed, for example, by disposing an anisotropic conductive adhesive between the drive element and the substrate surface and applying heat and pressure. The heat and pressure applied in the temporary bonding step may be, for example, smaller than the heat and pressure applied in the main bonding step.

[0207]

[4] Embodiments of the present invention will be described below with reference to the drawings. [4-1] FIG. 1 is a schematic perspective view of an example of a multi-layer liquid crystal display panel (multi-layer liquid crystal display panel DP1) according to the present invention.
(A) and (B). FIG. 1A shows a display panel DP.
1 is a view from the observation side (front side), and FIG. 1B is a view of the display panel DP1 as viewed from the side opposite to the observation side (back side).

FIGS. 2A and 2B are plan views of the multilayer display panel DP1 as viewed from the front side and the back side, respectively.
FIGS. 3A and 3B are schematic cross-sectional views of the display panel DP1 taken along lines 3A-3A and 3B-3B in FIG.
It is shown in FIG.

[0209] The multilayer display panel DP1 is a reflective liquid crystal display panel.

As shown in FIG. 3 and the like, the multi-layer liquid crystal display panel DP1 has three panel elements PEb,
It has PEg and PEr.

The panel elements PEb, PEg and PEr are all reflection type liquid crystal display panels. Panel element PE
b, PEg, and PEr are for blue, green, and red display, respectively. As will be described in detail later, the panel elements PEb, PEg, and PEr include liquid crystals having selective reflection wavelengths in blue, green, and red regions, respectively.

The display by the multi-layer liquid crystal display panel DP1 is on the panel element PEb side (the upper side in FIG. 3A).
Observe from. That is, the panel element PEb is arranged at a position closest to the observation side, and the panel element PEr is arranged at a position farthest from the observation side.

In the following description, the side seen from the observation side may be called the front side, and the side seen from the side opposite to the observation side may be called the back side. In FIG. 2A, the upper side, the lower side, the left side, and the right side of the multi-layer liquid crystal display panel DP1 and the components (for example, panel elements) constituting the same are referred to as north (N).
Side, south (S) side, west (W) side, east (E) side.

A black light absorbing layer BK is provided on the back side of the panel element PEr located farthest from the observation side. In the drawings other than FIGS. 3A and 3B, the light absorbing layer BK is not shown.

In the multilayer liquid crystal display panel DP1,
There is a portion where the panel elements PEb, PEg, and PEr overlap each other. As shown in FIG. 4, the central portion of the overlapping portion is used as a display area. The display area has a rectangular shape. FIG. 4 is a plan view of the display panel DP1 as viewed from the front side.

As shown in FIGS. 3A and 3B, adjacent panel elements are bonded to each other with an adhesive 2. In the drawings other than FIGS. 3A and 3B, the illustration of the adhesive 2 is omitted. In this example, an adhesive film is used as the adhesive 2. As the adhesive, a double-sided adhesive tape or a liquid adhesive may be used instead of the adhesive film. As the double-sided adhesive tape, for example, a tape containing an acrylic pressure-sensitive adhesive can be adopted.
As the liquid adhesive, for example, an ultraviolet curable resin or a thermosetting silicone-based adhesive can be employed. The liquid adhesive may be cured by stacking the panel elements and then performing a predetermined process (for example, an ultraviolet irradiation process, a heating process, or the like) according to the used adhesive. Since the adhesive film does not have a base film unlike the double-sided adhesive tape, the transparency of the entire display panel DP1 can be increased accordingly.

Each panel element has a pair of substrates, and the liquid crystal is sandwiched between these substrates in a layered manner. Electrodes are provided on the substrates of all the panel elements so that the panel elements can be driven in a simple matrix. [4-2] The basic structure of the blue panel element PEb will be described below.

The panel element PEb has a pair of substrates Sbr and Sbc arranged at a predetermined interval.

In this example, the substrates Sbr and Sbc are both films made of polycarbonate (PC).
The substrates Sbr and Sbc are different in size but are both square.

On the substrate Sbc, a column electrode Ec, an insulating film I1, and an alignment film A1 are sequentially formed. The substrate Sbc on which the column electrodes Ec are formed may be referred to as a column substrate in the following description.

On the substrate Sbr, a row electrode Er, an insulating film I2, and an alignment film A2 are sequentially formed. Row electrode E
The substrate Sbr on which r is formed may be referred to as a row substrate in the following description.

In this example, both the column electrode Ec and the row electrode Er are made of ITO.

The column electrode Ec is composed of a plurality of strip electrodes arranged in parallel at a predetermined pitch in the display area.
The row electrode Er also includes a plurality of strip electrodes arranged in parallel at a predetermined pitch in the display area. Column electrode Ec
And the row electrodes Er are orthogonal to each other in the display area.

The column electrodes Ec and the like on the column substrate Sbc are formed on the surface of the substrate Sbc on the side facing the row substrate Sbr. Similarly, the row electrode Er on the row substrate Sbr
Are formed on the surface of the substrate Sbr on the side facing the column substrate Sbc.

The substrate Sbc on which the column electrode Ec is formed
And a substrate Sbr on which the row electrodes Er are formed, a liquid crystal layer LCLb is sandwiched.

The liquid crystal layer LCLb contains the liquid crystal LCb having a selective reflection wavelength in the above-mentioned blue region. Liquid crystal LCb
Is a chiral nematic liquid crystal exhibiting a cholesteric phase at room temperature in this example. The liquid crystal layer LCLb includes a liquid crystal LC
In addition to b, the spacer SP and the columnar resin structure 3 are included.

The spacer SP is arranged between the substrates Sbc and Sbr to control the thickness of the liquid crystal layer LCLb (the thickness of the liquid crystal LCb).

The columnar resin structure 3 is fused to both the alignment film A1 on the substrate Sbc and the alignment film A2 on the substrate Sbr. Thereby, the substrates Sbc and Sbr are bonded to each other. The columnar resin structure 3 allows the panel element P
The strength of the whole Eb is also increased.

At the periphery of the liquid crystal layer LCLb, a sealing wall SW made of resin is provided, and the substrates Sbc and Sbr
Liquid crystal leakage from between the two is prevented. [4-3] The basic structure of the blue panel element PEb has been described above.
r also has the same basic structure as the blue panel element PEb. The basic structures of the green panel element PEg and the red panel element PEr will be briefly described below.

The green panel element PEg has a column substrate Sgc on which a column electrode Ec is formed, and a row substrate Sgr on which a row electrode Er is formed. Green panel element PEg
In this case, an insulating film I1 and an alignment film A1 are formed on the column substrate Sgc in addition to the column electrodes. Also,
On the row substrate Sgr, in addition to the row electrodes, an insulating film I2,
An alignment film A2 is formed. In the green panel element PEg, a liquid crystal layer LCLg is disposed between the substrates Sgc and Sgr. The liquid crystal layer LCLg includes a liquid crystal LCg having a selective reflection wavelength in a green region.

The red panel element PEr has a column substrate Src on which a column electrode Ec is formed and a row substrate Srr on which a row electrode Er is formed. Red panel element PEr
Also, in addition to the column electrodes, an insulating film I1 and an alignment film A1 are formed on the column substrate Src. Also,
On the row substrate Srr, in addition to the row electrodes, an insulating film I2,
An alignment film A2 is formed. In the red panel element PEr, a liquid crystal layer LCLr is arranged between the substrates Src and Srr. The liquid crystal layer LCLr includes a liquid crystal LCr having a selective reflection wavelength in a red region. [4-4] As described above, each panel element is provided with a column electrode and a row electrode for performing simple matrix driving.

When each panel element is driven in a simple matrix, the column electrode of each panel element is used as a scanning electrode in this example. The row electrodes of each panel element are used as signal electrodes (data electrodes).

Here, FIG. 5 is a schematic block diagram of an example (drive device 8) of a drive device of the multi-layer liquid crystal display panel DP1 for performing full color display by driving each panel element in a simple matrix.

The driving device 8 comprises panel elements PEb, PE
Scan electrode drive ICs 81b, 81g, and 81r for driving the row electrodes (scan electrodes) Er of g and PEr, respectively. The driving device 8 includes a panel element PEb,
Scan electrode drive ICs 82b, 82g, and 8 for driving column electrodes (signal electrodes) Ec of PEg and PEr, respectively.
2r.

The drive of these drive ICs is controlled by the control unit 83. The control unit 83 drives each panel element by applying a voltage between the column electrode and the row electrode of each panel element via the drive IC, and performs image display. Details of a method of driving each panel element by the driving device 8 will be described later. [4-5] In the multilayer liquid crystal display panel DP1,
As shown in FIG. 6, both the scanning electrode driving IC and the signal electrode driving IC are directly mounted on the substrate of the corresponding panel element. That is, the multilayer liquid crystal display panel DP1 employs a so-called COF (Chip On Film) structure.

Note that FIG. 1 and the like show the display panel DP1 in which no drive IC is mounted, and
The position where each drive IC is mounted is indicated by a dotted line.

By directly mounting the drive IC on the panel element substrate, the electrodes on the substrate are connected to the drive IC.

Each drive IC mounted on the board of each panel element is connected to a relay board connected to each board.
It is connected to the control unit 83.

Relay boards 841b and 842b are connected to the board Sbr on which the drive IC 81b of the blue panel element PEb is mounted and the board Sbc on which the drive IC 82b is mounted, respectively.

A driving IC 81 for the green panel element PEg
The relay boards 841 g and 842 g are connected to the board Sgr on which g is mounted and the board Sgc on which the drive IC 82 g is mounted, respectively.

The driving IC 81 for the red panel element PEr
The relay boards 841r and 842r are connected to the board Srr on which r is mounted and the board Src on which the drive IC 82r is mounted, respectively. [4-6] Multilayer liquid crystal display panel DP1 according to the present invention
In (2), each substrate of each panel element overlaps as follows in order to mount a drive IC directly on each substrate. Also, three panel elements PEb, PEg, PE
r overlaps as follows.

In each of the panel elements, the square column substrate and the square row substrate are set to “L” through a liquid crystal layer.
They overlap in a letter shape.

Between the portion of the column substrate overlapping the row substrate and the portion of the row substrate overlapping the column substrate,
A liquid crystal layer is disposed.

The three panel elements PEb, PEg, PEr
Are overlapped so that the portions where the column substrate and the row substrate in each panel element overlap each other. In this example, the portions where the column substrate and the row substrate overlap in each panel element are all the same size, and the three panel elements overlap so that these portions do not shift.

As a result, each substrate of each panel element is
Each has the following parts. This will be described with reference to FIG. FIG. 7 is an exploded view of the multilayer liquid crystal display panel DP1. In FIG. 7, only the substrate of each panel element is shown, and the liquid crystal layer and the like are not shown.

The row substrate Sbr of the blue panel element PEb is:
The other five substrates (substrates Sbc, Sgc, Sgr, Sr
r, Src) overlapped portion S overlapping all
brO and a connection portion SbrC extending from the overlap portion and connecting the row electrode Er on the substrate to the drive IC.

Similarly, the column substrate Sbc of the blue panel element PEb has an overlap portion SbcO overlapping all the other five substrates, and extends from the overlap portion, and the column electrode Ec on the substrate is connected to the driving IC. Has a connection portion SbcC for connecting to the.

The column substrate Sgc of the green panel element PEg
Has an overlap portion SgcO overlapping all of the other five substrates, and a connection portion SgcC extending from the overlap portion and connecting the column electrode Ec on the substrate to the drive IC.

The row substrate Sgr of the green panel element PEg is:
It has an overlapping portion SgrO overlapping all of the other five substrates, and a connecting portion SgrC extending from the overlapping portion and connecting the row electrode Er on the substrate to the driving IC.

The row substrate Srr of the red panel element PEr is:
It has an overlapping portion SrrO overlapping all of the other five substrates, and a connecting portion SrrC extending from the overlapping portion and connecting the row electrode Er on the substrate to the driving IC.

Column substrate Src of red panel element PEr
Has an overlapping portion SrcO overlapping all of the other five substrates, and a connecting portion SrcC extending from the overlapping portion and connecting the column electrode Ec on the substrate to the driving IC.

The connection portion SbrC of the blue substrate element PEb to the row substrate Sbr is formed in the overlap portion Sbr in the direction in which the row electrode Er on the row substrate Sbr extends in the display area.
It is extended from brO. The connection portion SbrC is a board portion for mounting the scan electrode driving IC 81b and for connecting the relay board 841b. Connection part S
An electrode pattern for connecting the row electrode Er to the output lead of the drive IC 81b is formed on brC. More specifically, an electrode pattern for converting the pitch of the row electrodes Er in the display area to the output lead pitch of the drive IC 81b is formed in the connection portion SbrC.
Further, an electrode pattern for connecting the input lead of the drive IC 81b to the relay board 841b is also formed on the connection portion SbrC. The same applies to the connection portions of other substrates.

In the blue panel element PEb, the extending direction of the connecting portion SbrC of the row substrate Sbr around the portion where the row substrate Sbr and the column substrate Sbc overlap,
The connection portion SbcC of the column substrate Sbc forms an angle of 90 °. The same applies to other panel elements.

When the entire display panel DP1 is viewed (see FIG. 1 and the like), the connection portion of each substrate is a substrate protruding portion that protrudes outward from a portion where each panel element overlaps.

The substrate of each panel element is laminated in the following order.

From the viewpoint of the observer, the row substrate Sbr of the blue panel element PEb and the column substrate Sb of the blue panel element PEb
c, a column substrate Sgc of the green panel element PEg, a row substrate Sgr of the green panel element PEg, a row substrate Srr of the red panel element PEr, and a column substrate Src of the red panel element PEr.
These substrates are stacked in this order.

As described above, in the multi-layer liquid crystal display panel DP1 according to the present invention, two adjacent substrates of two adjacent panel elements are either column substrates or are both row substrates. is there.

A multilayer liquid crystal display panel DP1 according to the present invention.
In the above, the extending direction of the connecting portion between the two substrates adjacent to each other is the same.

More specifically, the blue panel element PEb
The direction in which the connection portion SbcC of the column substrate Sbc extends,
The extending direction of the connecting portion SgcC of the column substrate Sgc of the green panel element PEg adjacent to the column substrate Sbc is the same. These connection portions SbcC, SgcC extending in the same direction
Are the same in the extending direction. The widths of these connection portions are set to minimum widths necessary for mounting the driving IC and connecting the relay board. The width of the connection portion of the other substrate is set to the same width.

Further, the row substrate Sg of the green panel element PEg
r and the connection portion SrrC of the row substrate Srr of the red panel element PEr adjacent to the row substrate Sgr.
Extend in the same direction. These connection portions SgrC and SrrC having the same extending direction have the same width in the extending direction.

A liquid crystal display panel DP1 according to the present invention.
In the above, the extending directions of the connecting portions of the respective substrates are shifted by 90 ° as follows. 1) Connection part S of row substrate Sbr of blue panel element PEb
extension direction of brC (= east side), 2) extension direction of connection portion SbcC of column substrate Sbc of blue panel element PEb (= extension direction of connection portion SgcC of column substrate Sgc of green panel element PEg = south side), 3) Connection part S of row substrate Sgr of green panel element PEg
direction of extension of grC (= row substrate S of red panel element PEr
The direction of extension of the connection portion SrrC of rr = west side) and the direction of extension of the connection portion SrcC of the column substrate Src of the red panel element PEr (= north side) are shifted by 90 ° in this order.

As a result, in the multilayer display panel DP1 according to the present invention, the electrode formation surface (drive IC mounting surface) of any of the substrate connection portions is exposed without being hidden by the other substrate.

As shown in FIG. 2A, on the front side, a connection portion SbcC of the column substrate Sbc of the blue panel element PEb is provided.
, The electrode formation surface of the connection portion SgrC of the row substrate Sgr of the green panel element PEg, and the electrode formation surface of the connection portion SrcC of the column substrate Src of the red panel element PEr are exposed.

As shown in FIG. 2B, on the back side, the electrode formation surface of the row substrate Srr of the red panel element PEr, the electrode formation surface of the connection portion SgcC of the column substrate Sgc of the green panel element PEg, and The electrode formation surface of the connection portion SbrC of the row substrate Sbr of the blue panel element PEb is exposed.

Since the connection portion other than the connection portion SbrC of the row substrate Sbr of the blue panel element PEb does not protrude to the east, the electrode forming surface of the connection portion is exposed.

Similarly, since the connection portion other than the connection portion SrcC of the column substrate Src of the red panel element PEr does not protrude to the north side, the electrode forming surface of the connection portion is exposed.

On the south side, a connection portion SbcC of the column substrate Sbc of the blue panel element PEb and a connection portion SgcC of the column substrate Sgc of the green panel element PEg protrude. Since the formation surfaces are the front side and the back side, respectively, these two electrode formation surfaces are exposed. Although the widths of these two connection portions are the same, the electrode forming surfaces of these two connection portions are exposed.

The connection portion SgrC of the row substrate Sgr of the green panel element PEg and the connection portion SrrC of the row substrate Srr of the red panel element PEr also protrude on the west side for the same reason. The electrode forming surfaces of the connection portions are all exposed. Although the widths of these two connection portions are the same, the electrode forming surfaces of these two connection portions are exposed.

Therefore, when manufacturing the multi-layer liquid crystal display panel DP1 of the present invention, as will be described later in the description of the manufacturing method, after the respective panel elements are overlapped,
A drive IC can be connected to each substrate. Further, the relay board can be connected to each board. Accordingly, the multi-layer liquid crystal display panel DP1 of the present invention can be easily manufactured.

In the multi-layer liquid crystal display panel DP1,
The shape and size of the row substrates Sbr, Sgr, Srr of each panel element are the same, and the pattern of the row electrodes formed on the substrates is the same. Similarly, the shape and size of the column substrates Sbc, Sgc, and Src of each panel element are the same, and the pattern of the column electrodes formed on the substrates is the same. Therefore, the number of components (substrates and the like) required for manufacturing the display panel DP1 can be reduced accordingly. That is why the manufacturing efficiency is good.

After the drive IC is mounted on each connection part as shown in FIG. 6 and the relay board is connected, the relay board is mounted on the back side as shown in FIG. 8 in order to reduce the frame width and the frame size. It may be turned back. By adopting, for example, a flexible substrate as the relay substrate, it can be folded in this way. [5] Each substrate of each panel element is an extended portion that extends from an overlapped portion overlapping all of the other substrates, and connects an electrode on the substrate to a driving element (for example, a driving IC). There may be an extension part that is not used as a connection part.

FIG. 9 shows a multilayer liquid crystal display panel having such an extended portion.

The laminated liquid crystal display panel DP2 shown in FIG. 9 differs from the laminated liquid crystal display panel DP1 shown in FIG.

In the multi-layer liquid crystal display panel DP2,
The row substrate Sbr of the blue panel element PEb has an overlapping portion SbrO overlapping with all the other substrates and a connecting portion Sb extended to the east side and used for mounting a drive IC.
In addition to rC, it has an extended portion SbrW extending to the west.

The extending portion SbrW has the same extending direction as the connecting portion SgrC of the substrate Sgr.
It has only a width that does not hinder the mounting of the drive IC on the grC and the connection of the relay board. Therefore, the connection portion Sgr
There is no problem in mounting the drive IC on C.

As long as it does not hinder the mounting of the driving IC or the like due to the convenience of manufacturing the multi-layer liquid crystal display panel DP2, it is not used as a connection portion on the substrate of the panel element. There may be an extension part. [6] In the multi-layer liquid crystal display panel DP1 shown in FIG. 1 and the like, adjacent substrates of adjacent panel elements are bonded only to the overlapping portions of these substrates with the adhesive 2, but the multi-layer liquid crystal display panel shown in FIG. Like the display panel DP3, not only the overlapping portions of the adjacent substrates but also the connecting portions having the same extending direction may be bonded with an adhesive.

In FIG. 10, the connection portion SgrC of the substrate Sgr and the connection portion SrrC of the substrate Srr are formed by the adhesive 2
FIG. Similarly, the connection parts having the same extending direction (not shown) are bonded with an adhesive.

By bonding the connecting portions having the same extending direction, the strength of these connecting portions can be increased. Thereby, damage to the electrodes can also be suppressed. In addition, as will be described in detail in the description of the manufacturing method, when the drive IC is mounted on each of the two connection portions having the same extending direction, the mounting can be easily performed. [7] In the multilayer liquid crystal display panel DP1 shown in FIG. 6, the electrodes on the substrate are connected to the drive IC by mounting the drive IC directly on each substrate. By connecting to the panel element substrate, the electrodes of the panel element substrate may be connected to the driving IC.

FIG. 11 shows a multilayer liquid crystal display panel having such a structure.

A multi-layer liquid crystal display panel DP4 shown in FIG.
In, a substrate 89 on which a drive IC is mounted is connected to each substrate of each panel element. Substrate 89
Is called TCP (Tape Carrier Package). The board 89 is a flexible board.

A relay board 88 is further connected to each board 89, and the drive IC on the board 89 is connected to the control unit 83 of the driving device 8 by the relay board 88.

By folding back the substrate 89 like the relay substrate of FIG. 8, the frame width of the multi-layer liquid crystal display panel DP4 can be reduced.

In the multi-layer liquid crystal display panel DP4,
Since only the substrate 89 needs to be connected to the connection portion of each substrate, the width of each connection portion can be reduced as compared with the multi-layer liquid crystal display panel DP1 of FIG. 6, and the frame width can be reduced accordingly. it can. [8] FIGS. 12A and 12B are schematic perspective views of still another example of the multilayer liquid crystal display panel according to the present invention.

The multi-layer liquid crystal display panel DP5 shown in FIGS. 12A and 12B has two liquid crystal panel elements PEb and a liquid crystal panel element PEg which are sequentially stacked.

The basic structure of panel elements PEb and PEg of display panel DP5 is the same as that of display panel DP1 of FIG.

In the multilayer liquid crystal display panel DP5,
From the observation side, the row substrate Sb of the blue panel element PEb
r, a column substrate Sbc of the blue panel element PEb, a column substrate Sgc of the green panel element PEg, and a row substrate Sgr of the green panel element PEg.

Thus, in the multi-layer liquid crystal display panel DP5, the substrate Sbc inside the blue panel element PEb is
The substrates Sgc inside the green panel elements PEg are all column substrates.

Also in the multi-layer liquid crystal display panel DP5,
The extending directions of the connecting portions of the two substrates adjacent to each other are the same.

In the multi-layer liquid crystal display panel DP5,
The extending direction of the connection portion of each substrate is shifted by 90 ° as follows. 1) Connection part S of row substrate Sbr of blue panel element PEb
extension direction of brC, 2) extension direction of connection portion SbcC of column substrate Sbc of blue panel element PEb (= extension direction of connection portion SgcC of column substrate Sgc of green panel element PEg), 3) green panel element PEg Connection part S of the row substrate Sgr
The direction of extension of grC is shifted by 90 ° in the following order.

Thus, the multi-layer liquid crystal display panel DP
Also in 5, the electrode formation surface of any of the substrate connection portions is exposed, similarly to the display panel DP1 of FIG.

Therefore, the multi-layer liquid crystal display panel DP5
Can be connected to each other after the respective panel elements are superimposed. Also,
A relay board can be connected to each board. that's all,
The multilayer liquid crystal display panel DP5 can be easily manufactured.

In the multilayer liquid crystal display panel DP5,
Since the connecting portions extend in only three directions, the frame width can be made smaller than that of display panels DP6 and DP7 described later in which two panel elements are stacked similarly to the display panel DP5.

The multilayer liquid crystal display panel DP5 has the same structure as the multilayer liquid crystal display panel DP1 shown in FIG. 1 except that the panel element PEr disposed farthest from the observation side is removed.

The display panel DP5 shown in FIG. 1 also includes a stacked display panel (not shown) in which two panel elements having the same structure as the display panel DP5 except for the panel element PEb closest to the observation side are stacked. Similarly to the above, the electrode formation surfaces of any connection portions can be exposed, and the four connection portions can be extended in only three directions. [9] FIGS. 13A and 13B are schematic perspective views of still another example of the multilayer liquid crystal display panel according to the present invention.

The multilayer liquid crystal display panel DP6 shown in FIGS. 13A and 13B has two liquid crystal panel elements PEb and a liquid crystal panel element PEr that are sequentially laminated.

The basic structure of panel elements PEb and PEr of display panel DP6 is the same as that of display panel DP1 of FIG.

The substrate of each panel element is laminated in the following order.

From the viewpoint of the observer, the row substrate Sbr of the blue panel element PEb and the column substrate Sb of the blue panel element PEb
c, the row substrate Srr of the red panel element PEr, and the column substrate Src of the red panel element PEr are stacked in this order.

In the multilayer liquid crystal display panel DP6,
Each connection portion of each substrate is shifted by 90 ° in a predetermined order and is different from each other.

More specifically, 1) the connection portion S of the row substrate Sbr of the blue panel element PEb
direction of extension of brC, 2) direction of extension of connection part SbcC of column substrate Sbc of blue panel element PEb, 3) connection part S of row substrate Srr of red panel element PEr
The direction of extension of rrC, and 4) the direction of extension of connection portion SrcC of column substrate Src of red panel element PEr, are shifted by 90 ° in this order.

Thus, the multi-layer liquid crystal display panel DP
6, the electrode formation surfaces of any of the substrate connection portions are also exposed, similarly to the display panel DP1 of FIG.

Accordingly, the multi-layer liquid crystal display panel DP6
Can be connected to each other after the respective panel elements are superimposed. Also,
A relay board can be connected to each board. that's all,
The multilayer liquid crystal display panel DP6 can be easily manufactured.

Note that the multi-layer liquid crystal display panel DP6 has the same structure as the multi-layer liquid crystal display panel DP1 of FIG. 1 except that the panel element PEg disposed in the middle is removed. [10] FIGS. 14A and 14B are schematic perspective views of still another example of the multilayer liquid crystal display panel according to the present invention.

The multi-layer liquid crystal display panel DP7 shown in FIGS. 14A and 14B has two liquid crystal panel elements PEb and PEg which are sequentially stacked, like the display panel DP5 of FIG. are doing.

The basic structure of panel elements PEb and PEg of display panel DP5 is the same as that of display panel DP1 of FIG.

In the multi-layer liquid crystal display panel DP7,
From the observation side, the row substrate Sb of the blue panel element PEb
r, a column substrate Sbc of the blue panel element PEb, a column substrate Sgc of the green panel element PEg, and a row substrate Sgr of the green panel element PEg.

The order of stacking the substrates in the multi-layer liquid crystal display panel DP7 is the same as that of the display panel DP5 in FIG.

In the display panel DP7, unlike the display panel DP5, the extending directions of the connecting portions of the substrates are shifted by 90 ° in a predetermined order, and are different from each other.

More specifically, in the display panel DP7, the extending direction of the connection portion of each substrate is shifted by 90 ° in the following order. 1) Connection part S of row substrate Sbr of blue panel element PEb
direction of extension of brC, 2) direction of extension of connection portion SbcC of column panel Sbc of blue panel element PEb, 3) connection portion S of row substrate Sgr of green panel element PEg
The direction of extension of grC, and the direction of extension of connection portion SgcC of column panel Sgc of green panel element PEg are shifted by 90 ° in this order.

Thus, the multi-layer liquid crystal display panel DP
7, the electrode formation surfaces of any of the substrate connection portions are also exposed, similarly to the display panel DP1 of FIG.

Therefore, the multi-layer liquid crystal display panel DP7
Can be connected to each other after the respective panel elements are superimposed. Also,
A relay board can be connected to each board. that's all,
The multilayer liquid crystal display panel DP7 can be easily manufactured. [11] A method of driving the multi-layer liquid crystal display panel DP1 of FIG. 1 by simple matrix driving will be described with reference to FIG.

FIG. 15 shows the driving device 8 of the display panel DP1 together with the column electrodes Ec and the row electrodes Er of the blue panel element PEb. In FIG.
Although the electrodes of the green panel element PEg and the red panel element PEr are not shown, these panel elements are also
It is driven similarly to the blue panel element described below.

The column electrode (signal electrode) Ec is composed of a plurality of strip electrodes as described above, and the strip electrodes forming these column electrodes correspond to Ec1 to Ecn (n is a natural number) in FIG.

Similarly, the row electrode (scanning electrode) Er includes a plurality of strip electrodes as described above, and the strip electrodes constituting these row electrodes are Er1 to Erm in FIG.
(M is a natural number).

In the blue panel element PEb, the arrangement state of the liquid crystal can be changed in a liquid crystal unit in a region where one scanning electrode and one signal electrode intersect and a region near the periphery thereof. In the blue panel element PEb, an area where the scanning electrode and the signal electrode intersect and an area near the periphery thereof are defined as one pixel. A pixel at a position where the scanning electrode Erp and the signal electrode Ecq intersect is referred to as a pixel P _pq . Where p is 1 ≦
q is a natural number satisfying p ≦ m, and q is a natural number satisfying 1 ≦ q ≦ n.

The blue panel element PEb can display an image corresponding to the image data based on the image data written by the image processing device 833 and the central processing device 835 in the image memory 834 as follows. .

The scan electrode driving IC 81b is connected to the scan electrode Er.
A selection signal is output to a predetermined scanning electrode from 1 to Erm to set that scanning electrode to a selected state, and a non-selection signal is output to the remaining scanning electrodes to set that scanning electrode to a non-selected state. The scan electrode driving IC 81b switches the scan electrodes to be selected at predetermined time intervals, and each scan electrode is sequentially selected. Such control is performed by the scan electrode drive controller 831.

On the other hand, the signal electrode drive IC 82b simultaneously outputs a signal voltage corresponding to the image data of each pixel to each signal electrode in order to rewrite each pixel on the scanning electrode in the selected state. At the same time according to the image data. For example, the scanning electrode Er
1 when it is selected, changing the alignment state of the liquid crystal of the pixel P ₁₁ to P _1n on the scanning electrode Er1 in accordance with the image data of each pixel. Since a voltage difference between a voltage applied to the scan electrode of the driving target pixel and a voltage corresponding to image data applied to the signal electrode is applied to the liquid crystal of the driving target pixel,
The alignment state of the liquid crystal of the driving target pixel changes according to the image data.

[0319] The signal electrode drive IC 82b changes the arrangement state of the liquid crystal of the drive target pixel in accordance with the image data each time the selected scan electrode is switched. Such control is performed while the signal electrode drive controller 832 reads image data from the image memory 834.

As described above, the voltage corresponding to the image data (gradation data) of the pixel to be driven is applied to the liquid crystal of the pixel to be driven. Therefore, according to the image data of the driving target pixel, the liquid crystal of the driving target pixel can be brought into a planar state, a focal conic state, or a state in which these states are mixed at a ratio corresponding to the display gradation. Therefore, gradation display according to the image data can be performed.

The green panel element PEg and the red panel element PE
Similarly for r, gradation display can be performed by driving according to the image data in the same manner. Therefore, full-color display can be performed by driving the three panel elements PEb, PEg, and PEr according to image data.

The controllers 831 and 832, the image processing device 833, the image memory 834, and the central processing unit 835 of the driving device 8 in FIG. 15 correspond to the control unit 83 of the driving device 8 in FIG.

Note that simple matrix driving can be performed for other multi-layer liquid crystal display panels in the same manner as described above. [12] Hereinafter, a method for manufacturing a multilayer display panel according to the present invention will be described. 6. The multi-layer liquid crystal display panel D of FIG.
A method of manufacturing P1 will be described.

First, an example of a method of manufacturing the multi-layer liquid crystal display panel DP1 will be schematically described with reference to a flowchart shown in FIG.

In the panel element forming step, blue, green,
Three panel elements of red panel elements PEb, PEg, and PEr are respectively formed. In this panel element forming step,
Each panel element is formed using a resin substrate on which electrodes and the like are formed.

Next, in the superposing step, the produced panel elements are superposed in a predetermined order. After the alignment, each panel element is overlapped. Adjacent panel elements are bonded using an adhesive.

Next, in the after-cutting step,
Unnecessary portions (portions to be cut) are removed from the respective substrates of the superposed panel elements. The portion to be cut (unnecessary portion) of each substrate will be described later. The part to be cut is determined by the shape of the substrate used in the panel element forming step. Typically, an unnecessary portion (a portion to be cut in order to expose the electrode forming surface of the connection portion) is exposed from each substrate in order to expose an electrode formation surface of a connection portion for connecting a driving element of each substrate. remove. Of course, when there is no portion to be cut on each substrate, it is not necessary to perform this aftercutting step.

The shape and structure of the multi-layer liquid crystal display panel DP1 at the end of the aftercutting step are as shown in FIG. In the following description, the shape of the substrate of the panel element at the stage when the after-cut process is completed, in other words, at the stage of performing the next driving IC mounting process and the relay substrate connecting process, is referred to as the final substrate shape. There is.

Next, in the driving IC mounting step, the driving IC is mounted on the connection portion of each substrate. In the relay board connecting step, a relay board is connected to a connection portion of each board. Either the drive IC mounting step or the relay board connecting step may be performed first, and these steps may be mixed.
For example, the mounting of the drive IC on the same board connection portion and the connection of the relay board may be performed at the same timing, and after that, the mounting or the like on the next connection portion may be performed. In any case, the mounting of the driving IC and the connection of the relay board may be performed in an order that can be easily and efficiently performed.

The shape of the multi-layer liquid crystal display panel DP1 at the time when the driving IC mounting step and the relay board connecting step are completed,
The structure is as shown in FIG.

Next, in the folding step, the relay boards (flexible relay boards) connected to the respective boards are folded back to reduce the frame width.

At one or more predetermined timings, such as after the panel element forming step, the operation inspection of the panel elements may be performed. If the operation inspection of the panel element is performed during the manufacture, the multilayer liquid crystal display panel DP1 can be manufactured with a higher yield. Needless to say, the operation inspection of the entire display panel DP1 may be performed even after the folding step is completed.

Hereinafter, a method of manufacturing the multi-layer liquid crystal display panel DP1 having the shape and structure shown in FIG.
Several examples of a method of manufacturing the multi-layer liquid crystal display panel DP1 before mounting of C will be described. There are several methods depending on the shape of the substrate used in the panel element forming step. [13] Hereinafter, a method of manufacturing the multi-layer liquid crystal display panel DP1 of FIG. 1 using a substrate having the following overall shape in the panel element forming step will be described. [13-1] Panel Element Forming Step In the panel element forming step, three panel elements of blue, green, and red panel elements PEb, PEg, and PEr are respectively formed.

With reference to FIGS. 17A and 17B, description will be made mainly on the procedure for manufacturing the blue panel element PEb. The green panel element PEg and the red panel PEr are also manufactured in the same manner as the blue panel element PEb except that the liquid crystal arranged between the substrates is different. [13-1-1] Preparation Step First, a resin substrate Sbc for forming column electrodes and the like
Then, a resin substrate Sbr for forming a row electrode and the like is prepared (# 101). In this example, a polycarbonate film is used as the substrates Sbr and Sbc.

At this time, the shapes of the substrates Sbc and Sbr
The size is different from the final shape and size, and each substrate has the following parts.

The column substrate Sbc has an overlapped portion SbcO which finally overlaps the other five substrates, and four extended portions Sbc1 extending from the overlapped portion in four directions at a center angle interval of 90 °. Sbc2, Sb
c3 and Sbc4, and corners Sbc5 and S
bc6, Sbc7 and Sbc8. More specifically, the column substrate Sbc at this point has an overlapping portion SbOc and an annular portion surrounding the overlapping portion SbcO. At this point, the column substrate Sbc has a square shape. This column substrate Sbc is referred to as a full-type column substrate.

Similarly, the row substrate Sbr finally has an overlapped portion SbrO overlapping with the other five substrates.
And four extending portions Sbr1 and Sbr extending in four directions from the overlapping portion at 90 ° center angle intervals.
2, Sbr3 and Sbr4, and corner portion Sb
r5, Sbr6, Sbr7 and Sbr8.
More specifically, the column substrate Sbr at this point has an overlapped portion SbrO and an overlapped portion SbrO.
It has an annular portion surrounding brO. At this time, the row substrate Sbr has a square shape. This row substrate Sbr is referred to as a full-shaped row substrate Sbr.

A similar substrate is prepared as a column substrate and a row substrate of another panel element.

At this point, the column substrate Sbr of the blue panel element and the row substrate Sbc have the same size, and there is no difference. Furthermore, the column substrate and the row substrate of any panel element are of the same size, and there is no difference. Therefore, it is possible to use common components for the display panel DP1.

In the blue panel element PEb, the extended portion Sbc3 of the column substrate Sbc is used as a connection portion SbcC for mounting a drive IC. Further, the extended portion Sbr4 of the row substrate Sbr is used as a connection portion SbrC. Extended portions and corner portions not used as connection portions of these substrates are removed in a later cutting step. [13-1-2] Electrode Forming Step Next, a column electrode Ec is formed on the column substrate Sbc of the blue panel element PEb, and a row electrode Er is formed on the row substrate Sbr (# 102). Similarly, a column electrode and a row electrode are respectively formed on a column substrate and a row substrate of another panel.

The column electrode Ec may be formed on the column substrate Sbc of the blue panel element PEb as follows, for example. First, a conductive film (ITO film in this example) is formed uniformly on the column substrate Sbc. This conductive film is etched into a predetermined shape by using a photolithography method to form a predetermined electrode pattern including the pattern of the column electrode Ec. For example, a photosensitive resist film is uniformly formed on a conductive film, and the resist film is exposed through a mask having holes of a pattern (positive pattern) corresponding to an electrode pattern to be formed. By removing the resist film while leaving the layer, and etching the conductive film portion not covered with the resist film, a predetermined electrode pattern can be formed.

More specifically, the overlap portion Sbc
On O, a plurality of strip-shaped electrode patterns arranged in parallel at a predetermined pitch are formed.

An electrode pattern for connecting the column electrode Ec on the overlap portion SbcO to the output lead of the drive IC is formed on the extension portion Sbc3 used as the connection portion SbcC. More specifically, the extension S
On bc3, an electrode pattern for converting the electrode pitch on the overlap portion SbcO to the output lead pitch of the drive IC is formed. An electrode pattern for connecting the input lead of the drive IC to the relay board is also formed on the extended portion Sbc3.

In this example, the extended portion Sbc1 on the opposite side to the extended portion Sbc3 used as the connection portion SbcC is also provided.
An electrode pattern that can be used as a connection portion is formed in advance. That is, the electrode pattern for connecting the column electrode Ec on the overlapped portion SbcO to the output lead of the drive IC and the electrode pattern for connecting the input lead of the drive IC to the relay board are also formed on the extended portion Sbc1. Keep it.

By forming an electrode pattern that can be used as a connection part on the opposite side of the extended part used as a connection part, the following advantages can be obtained. The column substrate manufactured as the column substrate Sbr of the blue panel element PEb as described above can be used as a column substrate of another panel element. Furthermore, even in a panel element in which the extended portion Sbc1 is used as a connection portion, the column substrate on which the electrode pattern is formed as described above can be used. That is, an electrode pattern can be formed on the column substrate of any panel element in the same procedure and using the same mask.
As a result, the efficiency of column electrode formation is improved. In addition, it is possible to use common components for the display panel DP1.

On the column substrate Sbc, in addition to the above-described electrode patterns, alignment marks (registration marks, target marks) used for alignment in a later step are also formed. In this example, the alignment mark is formed of an electrode material (ITO in this example) at the same time when the above-described electrode pattern is formed.

As the alignment mark, a mark for the next alignment is formed. When the column substrate Sbc and the row substrate Sbr are overlapped with each other via a liquid crystal to form a blue panel element PEb, an alignment mark for positioning these substrates is formed. Further, in the overlapping step, when each panel element is sequentially overlapped, an alignment mark for positioning each of the panel elements is formed. In addition, an alignment mark for positioning the mounting position of the driving IC when the driving IC is mounted on the substrate connection portion of the panel element is also formed. Further, an alignment mark for positioning the connection position of the relay board when connecting the relay board to the board connection portion of the panel element is also formed.

The alignment mark used when superposing the column substrate and the row substrate and the alignment mark used when superposing the panel elements may be the same. These alignment marks may be formed on the overlapping portion SbcO of the column substrate Sbc, may be formed on the connecting portion SbcC, or may be formed on an extended portion or a corner portion which is finally removed.

The alignment mark used for mounting the driving IC may be formed, for example, in the mounting area of the driving IC. Further, the alignment mark used for connecting the relay board may be formed, for example, in a connection area of the relay board.

The same applies to the row substrate Sbr in the same manner as described above.
A row electrode Er is formed. On the overlapping portion SbrO of the row substrate Sbr, a plurality of strip-shaped electrode patterns arranged in parallel with each other at a predetermined pitch are formed. Connection part SbrC
The electrode pattern for connecting the row electrode Er on the overlap portion SbrO to the output lead of the drive IC and the electrode pattern for connecting the input lead of the drive IC to the relay board are provided in the extended portion Sbr4 used as Form. Extension portion Sbc4 used as connection portion SbrC
An electrode pattern that can be used as a connection portion is also formed on the extension portion Sbc2 on the side opposite to the above. An alignment mark similar to that of the column substrate Sbc is also formed on the row substrate Sbr. [13-1-3] Step of forming insulating film and alignment film On the column electrode Ec of the column substrate Sbc,
An insulating film I1 and an alignment film A1 are sequentially formed. Further, an insulating film I2 is further formed on the row electrode Er of the row substrate Sbr.
And an alignment film A2 are sequentially formed. [13-1-4] Columnar resin structure forming step A columnar resin structure (columnar resin structure) 3 is formed on one of the column substrate Sbc and the row substrate Sbr (on the alignment film). Form. In this example, the column substrate S
The columnar resin structure 3 is formed on bc.

As the resin structure material, for example, a material that softens when heated and solidifies when cooled may be used.
As the resin structure material, an organic substance which does not cause a chemical reaction with a liquid crystal material to be used and has appropriate elasticity is preferable. Examples of such a resin structure material include a thermoplastic polymer material. As such a thermoplastic polymer material, for example, polyvinyl chloride resin, polyvinylidene chloride resin, polyvinyl acetate resin, polymethacrylate resin, polyacrylate resin, polystyrene resin, polyamide resin, polyethylene resin, polypropylene resin, Fluororesins, polyurethane resins, polyacrylonitrile resins, polyvinyl ether resins, polyvinyl ketone resins, polyether resins, polyvinyl pyrrolidone resins, saturated polyester resins, polycarbonate resins, chlorinated polyether resins, and the like. The resin structure may be formed of, for example, a material containing one or more of these resin materials.

As the resin structure, for example, a material containing a paste-like resin (for example, a material obtained by dissolving a resin in a solvent) is used.
It can be formed by a printing method in which the material is extruded onto a substrate with a squeegee via a screen plate or a metal mask. The resin structure can also be formed by using a dispenser method, an inkjet method, or the like, and discharging the resin from the tip of the nozzle onto the substrate. The resin structure can also be formed by a transfer method in which a resin is supplied onto a flat plate or a roller and then transferred onto a substrate. At this point, the height of the resin structure is preferably larger than a desired thickness of the liquid crystal layer in consideration of bonding the two substrates with the resin structure. [13-1-5] Spacer Spraying Step A spacer SP is sprayed on one of the column substrate Sbc and the row substrate Sbr (on the alignment film). In this example, spacers SP are scattered on the column substrate Sbc.

The spacer is preferably a particle made of a hard material that does not deform by heating or pressing. The spacer may be, for example, a finely divided glass fiber, a ball-shaped silicate glass, an inorganic material such as alumina powder, an organic synthetic spherical particle such as a divinylbenzene crosslinked polymer, or a polystyrene crosslinked polymer. .

The spacers may be sprayed on the substrate by, for example, a wet spraying method or a dry spraying method. [13-1-6] Seal Wall Forming Step A seal wall SW is formed on one of the column substrate Sbc and the row substrate Sbr. In this example, the seal wall SW is formed on the column substrate Sbc.

[0355] The seal wall SW is formed in an annular shape in the overlap portion SbcO of the column substrate Sbc.

The seal wall SW may be formed using a resin such as an ultraviolet curable resin or a thermosetting resin.

[0357] The resin seal wall can be formed, for example, by discharging resin onto the substrate from the tip of a nozzle by using a dispenser method or an ink jet method. The resin seal wall can also be formed by a printing method using a screen plate, a metal mask, or the like. The resin seal wall can also be formed by a transfer method in which the resin is supplied onto a flat plate or a roller and then transferred onto a substrate.

Note that the columnar structure forming step, the spacer dispersing step, and the seal wall forming step may be performed in any order. [13-1-7] Substrate Bonding Step Next, the liquid crystal LCb is dropped on the column substrate Sbc region surrounded by the seal wall SW, and the column substrate Sbc and the row substrate Sbr are bonded via the liquid crystal LCb (# 10).
3).

More specifically, the column substrate Sbc is mounted on the flat surface 711 of the holding member 71. In order to prevent the column substrate Sbc from being displaced on the plane 711, the substrate Sbc may be air-adsorbed toward the plane 711.

Next, a liquid crystal LCb having a selective reflection wavelength in the blue region is dropped on the column substrate Sbc at the end of the region.

Next, only one end of the row substrate Sbr is overlaid on the column substrate Sbc via the liquid crystal LCb. The other end of the row substrate Sbr is bent by bending the substrate,
At this time, it does not overlap the column substrate Sbc.
By holding both ends of the row substrate Sbr with the holding members 721 and 722, the row substrate Sbr can be arranged as described above. Since the row substrate Sbr is provided with extended portions on both sides of the overlap portion SbrO, portions other than the overlap portion SbrO can be held by the holding members 721 and 722 in this manner.

Next, a roller 73 incorporating a heater 74
Then, the row substrate Sbr is sequentially pressed from one end to the other end toward the column substrate Sbc. The roller 7
3 or the substrate may be moved.

As a result, the column substrate Sbc and the row substrate Sbr are overlapped via the liquid crystal while spreading the liquid crystal LCb. The heat of the heater 74 causes the resin structure 3
And the sealing wall SW is connected to the column substrate Sbc and the row substrate Sb
r, and the substrates are bonded together. By superimposing the two substrates sequentially from the ends while spreading the liquid crystal LCb, it is possible to suppress the incorporation of bubbles into the liquid crystal. The thickness of the liquid crystal is adjusted to a predetermined thickness by the spacer SP. Instead of dispersing the spacers on the substrate in advance, the spacers may be dispersed in the liquid crystal dropped on the substrate.

As described above, the overlap portion SbrO
Since the extended portions other than the above are held, pressure can be applied in order from the end of the overlap portion SbrO by the roller 73, and the two substrates can be stuck together exactly. When the overlapping portion SbrO is held by the holding member, the holding member hinders the relative movement of the roller 73, and thus it is difficult to apply pressure to the entire overlapping portion SbrO.

In this bonding step, the column substrate Sbc and the row substrate Sbr are bonded so that both the column electrode Ec and the row electrode Er are arranged inside the substrate. These substrates are bonded together so that the column electrodes Ec and the row electrodes Er have a matrix structure. Using the alignment marks, the positions of these substrates are aligned, and these substrates are bonded.

Thus, a blue panel element PEb is obtained (# 104). Other panel elements can be manufactured in the same manner.

[0367] By employing the whole-shaped substrate, any panel element can be formed only by changing the liquid crystal dropped on the substrate using the same panel element manufacturing apparatus.

After the column substrate and the row substrate are bonded together with a spacer or the like in the same manner as described above, liquid crystal is injected by a vacuum injection method from an injection port provided on the seal wall, and the injection port is closed, thereby obtaining a panel element. May be formed. [13-2] Panel Element Laminating Step The three panel elements PEb and PE thus produced
The superposition step of sequentially laminating g and PEr will be described with reference to FIG.

First, the red panel element PEr and the green panel element PEg are overlapped, and they are bonded together with the adhesive 2 (# 201). In this example, an adhesive film is used as the adhesive 2.

More specifically, first, the red panel element PEr is mounted on the flat surface 751 of the holding member 75. In order to prevent the displacement of the panel element PEr on the plane 751, the panel element PEr may be air-adsorbed toward the plane 751.

Next, the row substrate S of the red panel element PEr
The adhesive film 2 is attached to the overlap portion SrrO of rr. That is, an adhesive film is attached to the bonding surface of the red panel element PEr with the green panel element PEg.

Next, only one end of the green panel element PEg is overlapped with the red panel element PEr via the adhesive film 2. The other end of the green panel element PEg is bent so that it does not overlap the red panel element PEr at this time. The green panel element P is held by the holding members 761 and 762.
By holding both ends of the Eg, the green panel elements PEg can be arranged as described above. Green panel element PE
Since both the column substrate Sgc and the row substrate Sgr of g have extended portions on both sides of the overlap portion, the holding members 761 and 762 remove portions other than the overlap portions SgcO and SgrO. Can hold. That is, the substrate portion other than the adhesive surface can be held.
The green panel element PEg may be held by holding only one of the column substrate Sgc and the row substrate Sgr.

Then, the green panel element PE is
g is sequentially pressed from one end to the other end via the adhesive film 2 toward the red panel element PEr. In addition,
The roller 77 or the panel element may be moved. Thereby, the row substrate Srr of the red panel element PEr
Overlap portion SrrO and green panel element PEg
Is bonded to the overlapped portion SgrO of the row substrate Sgr. As described above, the panel elements P are sequentially arranged from one end.
By adhering Eg and PEr, it is possible to suppress bubbles from remaining between these panel elements.

Since the driving IC and the relay board are not mounted on any connection portion of the green panel element PEg, the green panel element PEg can be uniformly bent, and thus the air bubbles remain between the panel elements. Can be suppressed.

As described above, the substrate portions other than the overlapping portion of the green panel element PEg are held by the holding members 761 and 762.
Because it is held in the overlap part (adhesion part)
Pressure can be applied in order from end to end by the roller 77, and the two panel elements PEg and PE
r can be bonded together. When the overlapping portion is held by the holding member, the holding member hinders the relative movement of the roller 77, and thus it is difficult to apply pressure to the entire overlapping portion.

As a result, a red panel element PEr and a green panel element PEg bonded together with the adhesive film 2 are obtained (# 202).

In the same manner, the blue panel element PEb is further pasted on the green panel element PEg with the adhesive film 2 (# 203).

With these, the blue, green, and red panel elements PE
A multilayer display panel DP1 in which b, PEg, and PEr are sequentially laminated is obtained (# 204).

In the step of superposing the panel elements, the panel elements are bonded by using the alignment marks to align the positions of the panel elements.

Also, three panel elements are overlapped so that the substrates of each panel element are arranged in the order shown in FIG. The order of stacking the substrates shown in FIG. 19 is the same as the order of stacking the substrates shown in FIG.

Further, as described above, the three panel elements are superimposed such that the extending directions of the extended portions used as connection parts of the panel elements are shifted by 90 ° in a predetermined order as described above. In this example, since a full-sized substrate is employed, and extended portions that can be used as connection portions are provided on both sides of the overlap portion.
The direction of extension of the extended portion that can be used as a connection portion is as described above even when the substrate is rotated 180 ° from the substrate direction shown in FIG.
It is possible to overlap the panel elements with less error. [13-3] Aftercutting Step In the aftercutting step, unnecessary portions (portions to be cut) are removed from the substrates of the panel elements sequentially stacked.

At the stage before removing unnecessary portions, the electrode forming surface of the extension portion used as a connection portion of each substrate overlaps with the extension portion of another substrate and is not exposed. Therefore, in this after-cut process,
This is performed in order to expose the electrode formation surface of the extended portion used as a connection portion of each substrate. More specifically, of the four extended portions of each substrate, three extended portions not used as connection portions and four corner portions are removed.

FIG. 20 shows a portion to be removed from each substrate. In FIG. 20, a portion to be removed from each substrate is hatched.

By removing the portion to be cut from each substrate, the multi-layer liquid crystal display panel DP1 of FIG. 1 in which the electrode formation surfaces of all the connection portions are exposed is obtained.

Depending on the cutting mechanism and accuracy of the cutting device when performing cutting, when cutting cannot be performed well on the boundary between the extended portion (extended portion not used as a connection portion) of each substrate and the overlapped portion In this case, a part of the extended portion that is not used as the connection portion may remain as long as the mounting of the drive IC on the connection portion of another substrate is not hindered. For example, the blue panel element PE shown in FIG.
An extended portion that is not used as a connection portion, such as the west extended portion SbrW of the row substrate Sbr of b, may remain.

That is, after cutting is performed in the after-cutting step, a part of the extended portion not used as a connection portion is used as long as it does not hinder mounting of the drive IC on a connection portion of another substrate. May remain.

In order to easily perform such a cut or the like, a half cut may be performed in advance on a boundary line between the substrate portion to be removed and the substrate portion to be left. The half-cutting step may be performed, of course, before the after-cutting step of actually removing unnecessary portions of the substrate. For example, the half-cutting step may be performed before the panel element overlapping step or during the panel element forming step. If the half-cutting step is performed, for example, before the substrate overlapping step (for example, before the electrode forming step or after the electrode forming step) in the panel element forming step, the half-cutting step itself can be easily performed.

The half-cut may be performed at the stage of performing the after-cut process, that is, in a state where the panel elements are stacked, for example, on the exposed substrate surface as shown in FIG.

FIG. 21 shows the extended portion on the south side of the multilayer liquid crystal display panel DP1 before the after-cutting step is performed. In FIG. 21, a groove HC for half cutting is formed on the exposed surface of each substrate. When two or more portions of the substrate to be removed overlap, the exposed substrate surface is the surface that is exposed after removing the already exposed substrate portion.

More specifically, the outermost substrate Sb
The exposed surfaces of r and Src are surfaces on which no electrodes are formed, respectively.

The exposed surface of the substrate Srr is an electrode formation surface that is exposed after removing the south-side extending portion SrcS of the substrate Src. The exposed surface of the substrate Sgr is a surface on which no electrode is formed after removing the south-side extending portion SrrS of the substrate Srr.

By performing the half-cut on each substrate as described above, the after-cut process can be performed efficiently. [13-4] Driving IC Mounting Step and Relay Board Connection Step After the multilayer liquid crystal display panel DP1 of FIG. 1 is manufactured in this way, the driving IC is mounted on the electrode forming surface of the exposed connection portion of each substrate. Connect the relay board.

By performing the driving IC mounting step and the relay board, the multilayer liquid crystal display panel DP1 shown in FIG. 6 is obtained. The drive IC mounting step and the relay board connecting step will be described later in detail. [14] Another method of manufacturing the multilayer liquid crystal display panel DP1 in FIG. 1 will be described.

As described in the above [13], extended portions of each substrate (including extended portions used as connection portions)
Can be used for holding a substrate in a substrate laminating step when forming a panel element. Further, the extended portion of each substrate can also be used for holding the panel element in the panel element overlapping step. The substrate extension portion used for holding the substrate or (and) holding the panel element in this manner is referred to as a holding portion.

[0395] Among the four extending portions of the full board, there are extending portions that are not used as connection portions or holding portions.

Thus, from the stage of forming each panel element, a multi-layer liquid crystal display panel DP1 is manufactured in the same manner as described above, using a substrate having no extended portion not used as a connection portion or a holding portion. You may.

More specifically, as a substrate used in the panel element forming step, an overlap portion, an extension portion used as a connection portion extending from the overlap portion, and an extension portion extending from the overlap portion are used. By using a substrate having an extended portion used as a holding portion, three panel elements are formed in the same manner as described above, and the three panel elements are overlapped to form a multilayer liquid crystal display panel DP1. May be.

[0398] The substrate used in the panel element forming step may further have the corner portion. As a substrate used in the panel element forming step, a substrate having, for example, one or two extended portions used as holding portions may be employed. In the substrate used in the panel element forming step, an extended portion used as a holding portion,
The extension part used as the connection part may be the same.

For example, each panel element may be formed by adopting six substrates having the shape shown in FIG. 22, and the panel elements may be overlapped to form a multilayer liquid crystal display panel DP1.

In this example, since the west and east extensions are used as holding portions, each substrate has at least the west and east extensions. More specifically,
Each substrate is as follows.

The row substrate Sbr of the blue panel element PEb is
Overlap portion SbrO, east extension portion SbrE used as connection portion SbrC and holding portion SbrH
And the west extension Sb used as the holding portion SbrH
rW.

The column substrate Sbc of the blue panel element PEb
Indicates an overlapped portion SbcO, a south-side extending portion SbcS used as a connection portion, and east-side and west-side extending portions SbcE and SbcW used as holding portions SbcH.
And a corner portion.

The column substrate Sgc of the green panel element PEg
Are the overlap portion SgcO and the connection portion SgcC
Extension part SgcS to be used as
East and West extensions SgcE, S used as cH
gcW and a corner portion.

The row substrate Sgr of the green panel element PEg is:
Overlap portion SgrO, west extension portion SgrW used as connection portion SgrC and holding portion SgrH
And the east-side extension portion Sg used as the holding portion SgrH
rE.

The row substrate Srr of the red panel element PEr is:
Overlap portion SrrO, west extension portion SrrW used as connection portion SrrC and holding portion SrrH
And the east-side extending portion Sr used as the holding portion SrrH
rE.

The column substrate Src of the red panel element PEr
Are the overlap portion SrcO and the connection portion SrcC
North extension part SrcN used as
East and west extensions SrcE, S used as cH
rcW and a corner portion.

In the case where such a substrate is used from the panel element forming step, in the aftercutting step after the panel element overlapping step, the extension part and the corner part which are not used as the connection part are removed, whereby the structure shown in FIG. Can be manufactured. Also in this case, the half cut may be performed in advance. [15] Still another method for manufacturing the multilayer liquid crystal display panel DP1 in FIG. 1 will be described.

First, in the panel element forming step, each panel element is formed using the substrate having the full shape described in the above [13].

Next, before overlapping the panel elements,
An extension portion that is not used as a connection portion or a holding portion is removed from each substrate. By performing such a pre-cut process, the shape of each substrate is made the shape described in the above [14] (for example, the shape shown in FIG. 22) before the panel elements are stacked.

[0410] Thereafter, as described in the above [14], after the respective panel elements are overlapped, the extension portions and corner portions not used as connection portions are removed.

[0411] Also in this manner, the multi-layer liquid crystal display panel DP1 of Fig. 1 can be manufactured. [16] Driving IC Mounting Step and Relay Board Connection Step After the multilayer liquid crystal display panel DP1 of FIG. 1 is manufactured in this way, that is, after the panel element overlapping step, the driving IC mounting step and the relay board are connected. The step of connecting the substrates is performed.

[0412] Since the electrode formation surface (the drive IC mounting surface and the relay substrate connection surface) of the connection portion of any of the substrates is also exposed, the drive IC can be mounted after the panel elements are overlaid. [17] Hereinafter, the substrate connection portion on the south side of the multilayer liquid crystal display panel DP1 (the column substrate Sbc of the blue panel element PEb)
The connection method of the drive IC to the connection portion SbcC of the green panel element PEg and the connection portion SgcC of the column substrate Sgc of the green panel element PEg and the connection method of the relay substrate will be mainly described. The same applies to the mounting of a drive IC on another substrate connection part.

As shown in FIG. 23, two alignment marks (registration marks, target marks) M1 are formed in the mounting area of the connection portion SbcC of the column substrate Sbc indicated by the dashed line in the drawing of the drive IC 82b. . Further, an alignment mark M2 is formed in a connection region of the relay board 842b in the connection portion SbcC, which is indicated by a dashed line in the drawing. Although only one alignment mark M2 is shown in FIG. 23, two marks M2 are provided at the connection portion SbcC.

[0414] Alignment mark M1 at substrate connection
Then, the alignment is performed using the alignment mark M3 provided on the drive IC 82b, and the drive IC 82b is mounted on a predetermined area of the connection portion. Thereby, the driving IC
The output lead of 82b is connected to the column electrode Ec on the substrate SbcC.
Is connected to each of the strip electrodes.

[0415] Alignment mark M for mounting drive element
1, M3 is read by a reading device (not shown) such as a CCD camera or a microscope. Based on the position of the alignment mark read by the reading device or the like, the position of the driving IC 82b is adjusted by using a conventionally known method such as image processing.

[0416] The alignment mark M1 of the connection portion SbcC of the substrate Sbc is read from the front side of the connection portion SbcC. When reading the alignment mark M1, the connection portion SgcC of the substrate Sgc having the same extending direction as the connection portion is read.
The alignment mark M1 on the connection portion SbcC may be seen near the alignment mark (not shown). In such a case, by increasing the magnification of a reading device such as a CCD camera or a microscope, or by opening the aperture to reduce the depth of field, the alignment mark M to read the focal point of the reading device can be obtained.
Can be adjusted to only one. Thereby, the driving IC
82b can be mounted in the correct position.

In the same manner as the mounting of the driving IC,
42b is also connected. Using the alignment mark M2 on the connection portion SbcC and the alignment mark provided on the relay substrate 842b, the same alignment is performed, and the relay substrate 842 is positioned at a predetermined position of the substrate connection portion SbcC.
b is connected. Thereby, the electrode pattern of the relay board 842b is connected to the electrode pattern following the input lead of the drive IC 82b. [18] In this example, the drive IC 82b is mounted on an ACF
(Anisotropic conductive film). This will be further described with reference to FIG.

[0418] First, A with the separator on one side peeled off
The CF4 is temporarily bonded on the electrode Ec to be connected to the bump BP of the driving IC 82b (see FIG. 24A). ACF4
Has a binder resin 41 made of a thermosetting resin or a thermoplastic resin, and conductive particles 42 dispersed in the binder resin. Due to the tackiness of the binder resin 41, A
CF4 can be temporarily bonded. If a temporary pressure is applied by applying a lower temperature and pressure than at the time of the actual bonding, the temporary bonding can be performed more reliably.

Next, the other separator 43 of the ACF 4 is peeled off.

Next, the drive IC 82b is positioned and
The bump BP of the driving IC 82b is placed on the ACF 4 (see FIG. 24B).

Thereafter, the drive IC 82b is pressed toward the substrate Sbc, and heat is applied to the ACF 4. As a result, the respective bumps BP of the drive IC 82b are connected to the respective strip electrodes constituting the column electrodes Ec via the conductive particles 42 (see FIG. 24C). When the binder resin 41 is a thermosetting resin, the binder resin 41 is heated and cured, and the drive IC 82b is bonded to the substrate Sbc. When the binder resin 41 is a thermoplastic resin, the driving IC 82b is cooled by heating and cooling the substrate Sb.
Adhere to c.

[0422] The device is heated and press-bonded as described above, and the driving IC is connected to the ACF.
When mounting is performed by using the ACF, a predetermined pressure and a predetermined heat (temperature) corresponding to the ACF may be applied for a predetermined time.

The connection of the relay board 842b is also performed using the ACF in the same manner as described above. [19] The mounting of the drive IC and the connection of the relay board may be performed while holding the multilayer liquid crystal display panel DP1, for example, using the holding device 5 shown in FIG.

[0424] The holding device 5 includes a holding jig 51 and a suction device 52. The holding jig 51 is used when mounting the drive IC on the board Sbc and connecting the relay board.

[0425] The holding jig 51 is used to mount a first surface 511 for mounting a connection portion SbcC of a substrate Sbc on which a driving IC is mounted, and a portion where three panel elements are overlapped. It has a second surface 512. Holding jig 5
The first first surface 511 is a pressure-receiving crimp for receiving pressure during the heat-compression bonding using the ACF of the driving IC (when mounting the driving IC) or the heat-compression bonding using the ACF of the relay substrate (when connecting the relay substrate). It can also be used as a base member surface.

The first surface 511 of the holding jig 51 has a connection portion Sg of the substrate Sgc extending in the same direction as the connection portion SbcC.
The connection portion SbcC is placed via the cC.

The first surface 511 and the second surface 51 of the holding jig 51
There is a step of height Ds between the two.

The height Ds of the step depends on the surface of the display panel DP1 directly mounted on the first surface 511 (ie, the connection portion S1).
gcC) to the surface of the display panel DP1 directly mounted on the second surface 512 (ie, the back surface of the light absorbing layer BK).
Up to the height Dp. The step height Ds is equal to or larger than the maximum height including a manufacturing error of the height Dp. In this example, the step height Ds is equal to the maximum height including a manufacturing error of the height Dp. The height Dp varies due to a manufacturing error in the height of the seal wall SW and the like, and the maximum value is defined as the step height Ds.

Thus, when the multi-layer display panel DP1 is set on the holding jig 51, as shown in FIGS. 26 and 28, the position of the first surface 511 is determined by the connection directly mounted on the first surface 511. The position is slightly higher or the same as the position on the back surface of the portion SgcC.

On the contrary, when the step height Ds is smaller than the height Dp, as shown in FIG. 27, the position of the holding jig first surface 511 is lower than the position of the back side surface of the connection portion SgcC.
In this case, the driving IC is connected to the connection portion SbcC of the substrate Sbc.
In order to mount 82b, the driving IC is connected to the connection part SbcC.
When pressed, the amount of deformation of the substrate Sbc increases,
The electrode on the substrate Sbc (ITO electrode in this example) is easily damaged. Further, if the position of the drive IC is adjusted before the connection portion SbcC is deformed, the position is largely shifted due to deformation of the connection portion SbcC and the like when the drive IC is pressed.

When the step height Ds is equal to or greater than the height Dp, the deformation of the substrate Sbc can be smaller than when the step height Ds is smaller than the height Dp, and the electrodes on the substrate Sbc can be damaged (cracks, etc.). Can be suppressed.

[0432] The suction device 52 is for suctioning a connection portion placed on the first surface 511 of the holding jig to the first surface 511 by air.

The adsorption device 52 has a vacuum pump 52p. The pump 52p is connected to the first surface 51 of the holding jig 51.
An exhaust hole 51v extending from 1 to the side is connected via a tube 52t. By operating the pump 52p,
The connection portion SgcC can be suctioned to the first surface 511 by air.

[0434] By positioning the connection portion SgcC toward the first surface 511 by air suction, the displacement of the connection portion SgcC when the driving IC is mounted or the relay board is connected, and the displacement of the connection portion SbcC can be suppressed. As a result, it is possible to mount the driving IC with high accuracy and ease.

When Ds is larger than Dp, the substrate is deformed as shown by a dashed line in FIG. 26, or when the resin film substrates Sbc and Sgc are rolled when the resin film is stored as shown in FIG. At the time of bending or the like, the connection portion SbcC may be pressed toward the first surface 511 by the pressing member 53 shown in FIGS. By pressing the connection portion SbcC toward the first surface 511 via the connection portion SgcC with the pressing member 53, the connection portion SbcC can be kept flat,
The driving IC can be easily mounted. Further, after the connection portion SbcC is pressed by the pressing member 53, the position of the drive IC or the like is adjusted, so that the displacement of the drive IC or the like can be suppressed.

The holding member 53 has a connection portion Sbc
A window 531 for exposing the drive IC mounting area of C is provided. The holding member 53 includes the relay board 8.
A window (notch) 532 for exposing the relay board connection area of the 42b connection portion SbcC is also provided. Accordingly, even if the connecting portion SbcC is pressed by the pressing member 53, there is no problem in mounting the drive IC.

In the above-described panel element overlapping step, as shown in FIG.
Adhesive 2 with cC and SgcC together with overlap
In this case, the connection portion SbcC can be kept flat without the pressing member 53. If the connection portion SgcC is suctioned by the suction device 52 with air, the connection portion Sbc
C is also adsorbed toward the first surface 511, so that Ds
> Dp, the connecting portion SbcC can be made flat. Thus, mounting of the driving IC can be performed easily.

After the mounting of the drive IC on the connection portion SbcC and / or the connection of the relay board, when the drive IC is mounted on the connection portion Sgc extending in the same direction as the connection portion, for example, What is necessary is just to perform using the holding jig 54 shown in FIG.

The holding jig 54 also has a first surface 541 and a second surface 54.
2, a step having the same height as the step height Ds of the holding jig 51 is provided.

[0440] The drive I is provided on the first surface 541 of the holding jig 54.
Via the connection part SbcC where the mounting of C82b is completed,
The connection portion SgcC is placed.

The first surface 541 has a concave portion 54 for fitting the drive IC 82b already mounted on the connection portion SbcC.
11 and a concave portion 5412 for fitting the relay board 842b already connected to the connection portion SbcC. Thus, mounting of the drive IC on the connection portion SgcC can be easily performed. [20] The following may be performed in order to suppress electrode damage (cracks, etc.) on the panel element substrate when mounting the drive IC. [20-1] As shown in FIG.
If there is an edge at the periphery of the electrode connection surface of the bump BP b, the electrode is likely to be damaged, such as a crack, as shown in FIG. When the drive IC 82b is pressed and mounted toward the substrate Sbc, a force is locally applied to the electrode due to the edge of the bump BP, and the electrode is easily damaged.

Therefore, as shown in FIG.
By making the periphery of the electrode connection surface BPs of the bump BP of C round, it is possible to suppress the application of a local force to the electrode. Thereby, as shown in FIG. 32B, damage to the electrodes can be suppressed and the driving IC can be mounted.

The bump BP of the driving IC is rounded (R
Of course, the rounding step may be performed before mounting the drive IC.

For example, the bumps may be rounded by chemical etching or mechanical polishing.

Of course, a drive IC having bumps which are rounded in advance may be employed. [20-2] As shown in FIG. 33A, the next pressure bonding base member 6 may be arranged on the side opposite to the mounting surface of the substrate on which the driving IC is mounted, and the driving IC may be mounted.

[0446] In the pressure bonding base member 6, a raised portion 61 is provided at a position facing the bump of the drive IC. As shown in FIG. 33B, the raised portion 61 can balance the deformation (dent) at the time of mounting the substrate Sbr on the mounting surface and the surface on the opposite side. Thereby, damage to the electrodes on the substrate can be suppressed.

As shown in FIG. 33B, by making the outer periphery of the raised portion 61 smaller than the outer periphery of the bump BP of the driving IC, damage to the electrodes can be further suppressed. [20
-3] As shown in FIG. 34, the resin film substrate Sbc
Even if electrodes are formed on the convex surface side formed by winding, damage to the electrodes at the time of mounting a driving IC or the like can be suppressed.

If electrodes are formed on the convex surface side of the substrate formed by winding, compressive stress is applied to the electrodes (ITO electrodes in this example) when the substrate is flat. Then, when the drive IC is mounted on the connection portion of the substrate, even if the electrodes are deformed by being pushed by the bumps of the drive IC, the deformation acts in a direction to release the compressive stress. Thereby, damage to the electrodes can be suppressed. [21] Two connection portions adjacent to each other in the same extending direction include, for example, a drive IC mounted on one connection portion,
These drive ICs may be mounted at positions where the drive ICs mounted on the other connection portion overlap each other.

The mounting of the driving ICs at the positions overlapping each other as described above may be performed, for example, as follows. FIG.
With reference to the connection portions SbcC and Sg
A method for mounting the driving IC on the cC will be described.

First, the ACF is connected to the electrode on the connection portion SbcC.
4 is temporarily bonded, and a drive IC 82b is temporarily bonded thereon (see FIG. 35A). The temporary bonding of the drive IC 82b may be performed by applying heat (temperature) and pressure smaller than the heat (temperature) and pressure applied during the actual bonding. AC used
Although it depends on F, the temporary bonding of the driving IC is, for example,
Heat of about 80 ± 10 ° C and pressure of about 1MPa for 5s
ec may be added.

Next, ACF4 was temporarily bonded to the electrode on the other connection portion SgcC, and the driving IC was further formed thereon.
82 g is temporarily bonded (see FIG. 35B). Drive IC 8
The temporary bonding of 2 g may be performed in the same manner as described above.

After the drive ICs are temporarily bonded to the respective connection portions as described above, the drive ICs 82b and 8 on these connection portions are temporarily bonded.
2 g are permanently bonded simultaneously (see FIG. 35 (C)). This actual bonding may be performed by applying, for example, heat of about 150 ± 10 ° C. and a pressure of about 2 MPa for about 10 seconds.

By mounting the driving IC in this manner, the driving IC can be mounted efficiently. [22] When the drive ICs are mounted on the two connection portions having the same extending direction at positions overlapping each other, the drive IC is permanently bonded (first bonded) to one connection portion, and then the other connection portion is connected. When the driving IC is permanently bonded to the portion (second bonding), the following problem may occur.

Since the two drive ICs are mounted at positions overlapping each other, the heat and pressure applied during the second actual bonding may also be applied to the previously permanently bonded driving IC or ACF.

[0455] Therefore, for example, the time for applying pressure to the conductive particles of the ACF used at the time of the first actual bonding becomes too long, and the conductive particles may be crushed. When the conductive particles are crushed, electrical connection failure (conductive failure) is likely to occur.

Also, the heat applied at the time of the second actual bonding may change the state of the ACF between the driving IC and the substrate that have been previously bonded, and the position of the driving IC that has been previously bonded may be shifted.

In particular, if the binder resin of the ACF is a thermoplastic resin, such a problem is likely to occur.

[0458] As described in the above [21], such problems can be suppressed by permanently bonding the drive ICs at positions overlapping each other at the same time. [23] When mounting the drive IC using the ACF, in order to mount the drive IC with high accuracy, the parallelism of the pressure bonding base member disposed on the opposite side of the mounting surface of the board connection portion and the pressure bonding head is accurately maintained. It is highly preferred.

As described in the above [21], it is difficult to maintain the parallelism between the crimping head and the crimping base member when mounting the driving ICs on the two connecting portions having the same extending direction at the positions overlapping each other. There is. When the parallelism between the pressure bonding head and the pressure bonding base member is not maintained,
When C is mounted, conduction failure and electrode damage are likely to occur.

In order to suppress such a problem, two connecting portions having the same extending direction are provided as shown in FIG.
The drive elements may be mounted at positions that do not overlap each other.

In FIG. 36, one connection portion Sbc
The driving IC 82b mounted on the other connection portion Sg
It is arranged at a position that does not overlap the drive IC 82g of cC. Therefore, it is not necessary to mount the drive IC on any of the connection portions via the already mounted drive IC or ACF, and any of the drive ICs can be accurately performed.

[0460] The driving I
When mounting C, of course, the electrode pattern of each connection portion may be formed so that such mounting can be performed. [24] In addition, if the mounting of the driving IC or the connection of the relay board is performed before the respective panel elements are overlapped after the respective panel elements are formed, the following problems may occur.

If a driving IC or / and a relay board are connected before the panel elements are superimposed, the panel elements can be flexed evenly when the panel elements are superimposed as shown in FIG. It is difficult to overlap. In that case, air bubbles are likely to remain between the panel elements, and the display quality deteriorates.

After the above-described overlapping step, drive I
In the method of mounting C or the like, when the panel elements are overlapped, the driving IC and the relay board are not connected to each panel element, so that the panel elements can be bonded while uniformly bending the panel elements. As described above, it is possible to suppress the residual air bubbles between the panel elements and to overlap the panel elements. [25] In the multi-layer liquid crystal display panel DP1 in FIG. 6, the mounting of the drive IC to each connection portion and the connection of the relay board to each connection portion may be performed in any order.

The step of turning the relay substrate back may be performed, for example, after the mounting of the driving IC and the connection of the relay substrate are completed. Each time the relay board is connected, the relay board may be folded back. [26] When a board on which a drive IC is mounted is connected to the board connection portion, as in the multilayer liquid crystal display panel DP4 in FIG. 11, the connection of the board may be made in the same manner as the connection of the relay board.

[0466]

As described above, according to the present invention, it is possible to easily carry out mounting of a driving element (mounting of a driving element, connection of a relay board or connection of a board on which a driving element is mounted). It is possible to provide a stackable display panel that can be used.

[0467] Further, the present invention can provide a stacked display panel in which a driving element can be easily mounted after the panel elements are overlapped.

[0468] The present invention can also provide a method of manufacturing a multilayer display panel in which a driving element can be easily mounted.

Further, the present invention can provide a method of manufacturing a multi-layer display panel in which drive elements can be easily mounted after the panel elements are superimposed.

Further, the present invention can provide a holding device which can be used for holding a multilayer display panel when manufacturing a multilayer display panel, for example, when mounting a driving element or the like.

The present invention also relates to a case where the multi-layer display panel is held so that the multi-layer display panel can be easily mounted when the multi-layer display panel is manufactured and when the multi-layer display panel is mounted. A holding device capable of being provided can be provided.

[0472] Further, the present invention can provide a crimping jig which can be used when mounting a driving element when manufacturing a multilayer display panel.

[0473] The present invention can provide a crimping jig in which a drive element can be mounted while suppressing damage to electrodes of a panel element substrate when manufacturing a multi-layer display panel.

Further, the present invention can provide a crimping jig capable of mounting a drive element while suppressing damage to electrodes on a substrate.

[0475] Further, the present invention can provide a driving element mounting method capable of easily and reliably mounting driving elements when manufacturing a multilayer display panel.

[Brief description of the drawings]

FIG. 1A is a schematic perspective view of an example of a multi-layer liquid crystal display panel according to the present invention in which three panel elements are stacked, as viewed from the front side, and FIG. It is the schematic perspective view seen from the back side.

2A is a schematic plan view of the multilayer liquid crystal display panel of FIG. 1A as viewed from the front side, and FIG. 2B is a schematic plan view of the multilayer liquid crystal display panel as viewed from the back side thereof. is there.

FIG. 3A is a schematic cross-sectional view of the multi-layer liquid crystal display panel taken along line 3A-3A shown in FIG. 2A;
(B) is a schematic sectional view of the display panel along a 3B-3B line.

FIG. 4 is a plan view showing a display area of the multilayer liquid crystal display panel of FIG.

FIG. 5 is a schematic block diagram of an example of a driving device.

FIG. 6 is a schematic perspective view of the multi-layer liquid crystal display panel of FIG. 1A with a drive IC mounted.

FIG. 7 is an exploded view of the multilayer liquid crystal display panel of FIG.

FIG. 8 is a side view of the multi-layer liquid crystal display panel of FIG. 6 showing a state in which the relay board is folded.

FIG. 9 is a schematic perspective view of another example of the multilayer liquid crystal display panel according to the present invention in which three panel elements are stacked.

FIG. 10 is a schematic cross-sectional view of still another example of a multilayer liquid crystal display panel according to the present invention in which three panel elements are stacked.

FIG. 11 is a schematic perspective view of still another example of a multilayer liquid crystal display panel according to the present invention in which three panel elements are stacked.

FIG. 12A is a schematic perspective view of an example of a multilayer liquid crystal display panel according to the present invention in which two panel elements are stacked, as viewed from the front side, and FIG. It is the schematic perspective view seen from the back side.

FIG. 13A is a schematic perspective view of another example of the multi-layer liquid crystal display panel according to the present invention in which two panel elements are stacked, as viewed from the front side, and FIG. It is the schematic perspective view seen from the back side of the panel.

FIG. 14A is a schematic perspective view of another example of the multilayer liquid crystal display panel according to the present invention in which two panel elements are stacked, as viewed from the front side, and FIG. FIG. 3 is a schematic perspective view as viewed from the back side of the display panel.

FIG. 15 is a schematic block diagram of an example of a driving device.

FIG. 16 is a schematic flowchart of an example of a method for manufacturing a multilayer liquid crystal display panel according to the present invention.

FIG. 17 is a schematic step diagram of one example of a panel element forming step.

FIG. 18 is a schematic process diagram of an example of a panel element overlapping process.

FIG. 19 is a diagram showing a substrate stacking order in a panel element stacking step.

FIG. 20 is a diagram showing a portion to be removed in an aftercutting step.

FIG. 21 is a diagram showing a substrate on which half cutting has been performed.

FIG. 22 is a diagram showing another example of the substrate shape used in the panel element forming step.

FIG. 23 is a view showing an alignment mark provided at a connection portion of a substrate.

FIGS. 24 (A) to (C) show an example in which the driving IC is an ACF.
It is a figure showing signs that it is mounted using.

FIG. 25 is a schematic sectional view showing an example of a holding device and a holding jig according to the present invention.

26 is a diagram showing a state in which a multilayer liquid crystal display panel is set on the holding jig of FIG. 25 when Ds ≧ Dp.

FIG. 27 is a diagram showing a state in which a multilayer liquid crystal display panel is set on the holding jig in FIG. 25 when Ds <Dp.

FIG. 28A is a diagram showing a state in which the panel element substrate is curved by being wound, and FIG.
FIG. 28 is a diagram illustrating a state in which the substrate is pressed by the pressing member of the holding device, and FIG. 28C is a schematic plan view of the pressing member.

FIG. 29 is a diagram showing a state where the multilayer liquid crystal display panel is set on the holding jig in FIG. 25 when connection portions having the same extending direction are bonded with an adhesive.

FIG. 30 is a schematic sectional view of another example of the holding device and the holding jig according to the present invention.

FIGS. 31A and 31B are diagrams showing a state in which an electrode on a substrate is damaged by a bump of a driving IC.

FIG. 32A is a diagram showing a state in which bumps of a driving IC are rounded, and FIG. 32B is a diagram showing the driving IC;
It is a figure showing signs that C was mounted.

FIGS. 33 (A) and (B) are views showing a state in which a drive IC is mounted using the pressure-bonding base member according to the present invention.

FIG. 34 is a diagram showing a state in which electrodes are formed on a convex surface formed by winding a substrate.

FIGS. 35 (A) to (C) are views showing a state in which drive ICs are mounted at positions overlapping each other on two board connection portions having the same extending direction.

FIG. 36 is a diagram showing a state in which drive ICs are mounted on two board connection portions having the same extending direction at positions not overlapping with each other.

[Explanation of symbols]

DP1 to DP7 Multilayer liquid crystal display panel PEb, PEg, PEr Panel element (liquid crystal panel element) Sbc, Sgc, Src Column substrate (first substrate) Sbr, Sgr, Srr Row substrate (second substrate) SbcO, SgcO, SrcO, SbrO, SgrO,
SrrO Overlap portion of substrate SbcC, SgcC, SrcC, SbrC, SgrC,
Connection part of SrrC substrate SbcH, SgcH, SrcH, SbrH, SgrH,
SrrH Substrate holding part SbcN, SbcS, SbcW, SbcE Substrate Sbc
Extension part of SbrN, SbrS, SbrW, SbrE Substrate Sbr
SgcN, SgcS, SgcW, SgcE Substrate Sgc
SgrN, SgrS, SgrW, SgrE Substrate Sgr
SrcN, SrcS, SrcW, SrcE Substrate Src
SrrN, SrrS, SrrW, SrrE Substrate Srr
Extension part of Sbc1, Sbc2, Sbc3, Sbc4 Substrate Sbc
Extension part of Sbc5, Sbc6, Sbc7, Sbc8 Substrate Sbc
Ec column electrode Ec1 to Ecn Strip electrode constituting column electrode Ec Er row electrode Er1 to Erm Strip electrode constituting row electrode Er I1, I2 insulating film A1, A2 Alignment film LCLb, LCLg, LCLr Liquid crystal layer LCb, LCg, LCr Liquid crystal HC Groove for half cut SP Spacer SW Seal wall 2 Adhesive 3 Columnar resin structure 4 ACF 41 Binder resin 42 Conductive particles 43 Separator 5 Holding device 51 Holding jig 511 First surface of holding jig 51 512 Second surface of the holding jig 51 51v Exhaust hole 52 Suction device 52p Vacuum exhaust pump 52t Tube 6 Crimping base member 61 Raised portion of the crimping base member 6 71, 75 Holding members 721, 722, 761, 762 Holding members 73, 77 Roller 74 Heater 8 Drive 1b, 81g, 81r Scan electrode drive IC (drive element) 82b, 82g, 82r Signal electrode drive IC (drive element) 83 Controller 831 of drive device 831 Scan electrode drive controller 832 Signal electrode drive controller 833 Image processing device 834 Image memory 835 central processing units 841b, 841g, 841r, 842b, 842g,
842r Relay board 88 Relay board 89 Board on which drive IC is mounted

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Masakazu Okada 2-3-13 Azuchicho, Chuo-ku, Osaka-shi, Osaka Inside Osaka International Building Minolta Co., Ltd. (72) Inventor Hideo Hotomi Azuchi, Chuo-ku, Osaka-shi, Osaka 2-13, Machi, Osaka International Building Minolta Co., Ltd. F-term (reference) 2H088 FA01 FA06 FA07 FA16 FA17 FA30 HA05 HA06 2H089 HA32 KA17 NA53 NA60 QA16 TA03 TA07 TA12 5C094 AA36 AA43 AA48 AA55 BA07 BA12 BA27 BA24 DA09 DA12 DA13 DB01 DB03 DB05 EA04 EA05 EB02 EC02 EC03 EC04 FA01 FA02 FB01 FB12 FB14 FB15 GB01 GB10 5G435 AA17 BB00 BB05 BB06 BB12 BB15 BB16 CC09 CC12 EE12 EE32 EE36 EE37 EE40 EK42 KKH

Claims (69)

[Claims] A first, a second, and a third panel element which are stacked, each of which has a first and a second pair of substrates facing each other, A column electrode is formed on a surface of the first substrate facing the second substrate of each of the panel elements, and a row electrode is formed on a surface of the second substrate facing the first substrate. The first substrate of each of the panel elements has an overlapping portion overlapping with the other five substrates, and extends from the overlapping portion to connect a column electrode on the first substrate to a driving element. A second substrate of each of the panel elements, an overlap portion overlapping the other five substrates, and a row electrode on the second substrate extending from the overlap portion. And a connection portion for connecting the Wherein the first, second and third panel elements are a first substrate of a first panel element, a second substrate of a first panel element, a second substrate of a second panel element, and a first substrate of a second panel element. A substrate, a first substrate of a third panel element, and a second substrate of a third panel element are superimposed so that these substrates are arranged in this order, and a portion where the first, second, and third panel elements overlap each other is The extension direction of the connection portion of the second panel of the second panel element adjacent to the second substrate and the extension direction of the connection portion of the second substrate adjacent to the second substrate are the same. Extending direction of the connection portion of the first substrate of the second panel element around the overlapping portion of the second and third panel elements, and the first substrate of the third panel element adjacent to the first substrate The extending directions of the connecting portions are the same, and the first, second and third panels are Extension direction of the connection portion of the first panel element on the first substrate, the connection portion of the connection portion on the second substrate of the first panel element, and the connection of the second substrate on the second panel element around the overlapping part of the panel elements The direction in which the portion extends, the direction in which the connection portion of the second panel element on the first substrate and the direction in which the connection portion of the third panel element on the first substrate extends, and the direction in which the connection portion of the third panel element on the second substrate extends. , In this order 90 °
A stacked display panel, wherein the display panels are shifted from one another. 2. A display device comprising: a first and a second panel elements stacked on each other; wherein each of the panel elements has a first and a second pair of substrates facing each other; A column electrode is formed on a surface of the element facing the second substrate of the first substrate, and a row electrode is formed on a surface of the second substrate facing the first substrate. The first substrate of the panel element has an overlapping portion overlapping the other three substrates, and a connecting portion extending from the overlapping portion to connect a column electrode on the first substrate to the driving element. The second substrate of each of the panel elements has an overlapping portion overlapping with the other three substrates, and extends from the overlapping portion to drive row electrodes on the second substrate. And a connecting portion for connecting to The substrate inside the first panel element and the substrate inside the second panel element which are adjacent to each other are either a first substrate on which a column electrode is formed or a substrate on which a row electrode is formed. A first substrate element and an inner substrate of the second panel element adjacent to each other, centering on an overlapping portion of the first panel element and the second panel element. The extending direction of each connecting portion is the same, and the extending direction of the connecting portion of the substrate outside the first panel element centering on the overlapping portion of the first panel element and the second panel element, The extending direction of the connecting portion of the substrate inside the first panel element and the extending direction of the connecting portion of the substrate inside the second panel element, and the extending direction of the connecting portion of the substrate outside the second panel element are shifted by 90 ° in this order. Is characterized by That multi-layer display panel. 3. A panel comprising: a first panel element and a second panel element, wherein each panel element has a pair of first and second substrates facing each other; A column electrode is formed on a surface of the element facing the second substrate of the first substrate, and a row electrode is formed on a surface of the second substrate facing the first substrate. The first substrate of the panel element has an overlapping portion overlapping the other three substrates, and a connecting portion extending from the overlapping portion to connect a column electrode on the first substrate to the driving element. The second substrate of each of the panel elements has an overlapping portion overlapping with the other three substrates, and extends from the overlapping portion to drive row electrodes on the second substrate. And a connecting portion for connecting to A first panel element of the first panel element centering on an overlapping part of the first panel element and the second panel element;
The direction of extension of the connecting portion of the substrate, the second direction of the first panel element;
The direction of extension of the connecting portion of the substrate, the first direction of the second panel element;
A stacked display panel, wherein the extending direction of the connecting portion of the substrate and the extending direction of the connecting portion of the second panel element of the second substrate are shifted by 90 ° in a predetermined order. 4. An electrode forming surface of any connection portion of each of the substrates is at least partially exposed.
A multilayer display panel according to any one of the above. 5. The multi-layer display panel according to claim 1, wherein the connecting portions of the substrate having the same extending direction have the same width in the extending direction. 6. The multi-layer display panel according to claim 1, wherein at least overlapping portions of two adjacent substrates of two adjacent panel elements are bonded with an adhesive. 7. An overlapping portion and a connecting portion of two adjacent substrates of two adjacent panel elements,
The multi-layer display panel according to claim 1, wherein both are bonded with an adhesive. 8. The first substrate is a resin film substrate,
The column electrode is formed on the convex side of the substrate formed by winding, the second substrate is a resin film substrate, and the row electrode is formed on the convex side of the substrate formed by winding. The multi-layer display panel according to any one of claims 1 to 7, wherein: 9. The multi-layer display panel according to claim 1, wherein said drive element is mounted on a connection portion of said substrate. 10. A driving element mounted on one of two adjacent substrates having the same extending direction of the connecting portion does not overlap with a driving element mounted on the other substrate. The multilayer display panel according to claim 9, wherein the display panel is mounted at a position. 11. A driving element mounted on one of two adjacent substrates having the same extending direction of the connecting portion and overlapping with a driving element mounted on the other substrate. The multilayer display panel according to claim 9, wherein the display panel is mounted on a panel. 12. The multi-layer display panel according to claim 1, wherein a relay board for connecting the driving element to a control unit of a driving device is connected to a connection portion of the substrate. 13. The multilayer display panel according to claim 12, wherein the relay substrate is a flexible substrate, and the relay substrate is folded toward a side opposite to an observation side of the multilayer display panel. 14. The multi-layer display panel according to claim 1, wherein a substrate on which said drive element is mounted is connected to a connection portion of said substrate. 15. The multi-layer display panel according to claim 14, wherein the substrate on which the driving elements are mounted is a flexible substrate, and the substrate is folded toward the side opposite to the observation side of the multi-layer display panel. 16. A method of manufacturing a multi-layer display panel in which first, second and third panel elements are stacked, wherein a first substrate on which column electrodes are formed and a first substrate on which row electrodes are formed. A panel element forming step of forming each of the panel elements using two substrates; and a superimposing step of superposing the formed panel elements in a predetermined order. The first substrate of each of the panel elements includes Finally, an overlap portion overlapping the other five substrates, and a connection portion extending from the overlap portion and connecting the column electrode on the first substrate to the drive element are provided, The second substrate of each of the panel elements finally has an overlapping portion overlapping with the other five substrates, and a row electrode on the second substrate extending from the overlapping portion and serving as a driving element. To connect In the panel element forming step, the first and second substrates are overlapped so that both the column electrode and the row electrode are arranged inside the substrate. In the overlapping step, A first substrate of the first panel element, a second substrate of the first panel element, a second substrate of the second panel element, a first substrate of the second panel element, a first substrate of a third panel element, and a third panel element The first, second, and third panel elements are overlapped so that these substrates are arranged in the order of the second substrate. In the overlapping step, the first, second, and third panel elements overlap each other. Extension direction of the connection portion of the second substrate of the first panel element around the portion where
The first, second, and third panel elements are overlapped so that the connecting portions of the second substrate of the second panel element adjacent to the second substrate extend in the same direction. A direction in which a connection portion of the first substrate of the second panel element extends around the overlapping portion of the first, second, and third panel elements;
The first, second, and third panel elements are overlapped so that the connecting direction of the first substrate of the third panel element adjacent to the first substrate extends in the same direction. The direction in which the connection portion of the first panel element on the first substrate extends around the overlapping portion of the first, second and third panel elements, the connection portion of the second panel of the first panel element, and The extending direction of the connecting portion of the second panel element on the second substrate, the extending direction of the connecting portion of the second panel element on the first substrate and the extending direction of the connecting portion of the third panel element on the first substrate, the third panel element A method of manufacturing a multi-layer display panel, wherein the first, second, and third panel elements are overlapped so that the extending direction of a connection portion between two substrates is shifted by 90 ° in this order. 17. A method of manufacturing a multilayer display panel in which first and second two panel elements are stacked, wherein a first substrate on which column electrodes are formed and a second substrate on which row electrodes are formed. A panel element forming step of forming each of the panel elements by using the same, and a superposing step of superposing the formed panel elements in a predetermined order. Each of the panels includes an overlapping portion overlapping with the other three substrates, and a connecting portion extending from the overlapping portion and connecting a column electrode on the first substrate to a driving element. The second substrate of the element has an overlap portion that eventually overlaps the other three substrates, and extends from the overlap portion to connect the row electrode on the second substrate to the drive element. Connection The first and second substrates are overlapped so that both the column electrode and the row electrode are arranged inside the substrate in the panel element forming step, and are adjacent to each other in the overlapping step. The first that fits
A substrate inside a panel element and a substrate inside the second panel element are both a first substrate on which a column electrode is formed, or a second substrate on which a row electrode is formed. The first and second panel elements are overlapped with each other, and in the overlapping step, the first and second panel elements are adjacent to each other around a portion where the first and second panel elements overlap each other. The first and second panel elements are overlapped so that the connecting portions of the substrate inside the one panel element and the substrate inside the second panel element extend in the same direction. The direction in which the connecting portion of the substrate outside the first panel element extends around the overlapping portion of the first panel element and the second panel element, and the connecting portion of the substrate inside the first panel element. The first and second panels are arranged such that the extending direction of the connecting portion of the substrate inside the second panel element and the extending direction of the connecting portion of the substrate outside the second panel element are shifted by 90 ° in this order. A method for manufacturing a multilayer display panel, comprising stacking elements. 18. A method for manufacturing a multi-layer display panel in which first and second two panel elements are stacked, wherein a first substrate on which column electrodes are formed and a second substrate on which row electrodes are formed. A panel element forming step of forming each of the panel elements by using the same, and a superposing step of superposing the formed panel elements in a predetermined order. Each of the panels includes an overlapping portion overlapping with the other three substrates, and a connecting portion extending from the overlapping portion and connecting a column electrode on the first substrate to a driving element. The second substrate of the element has an overlap portion that eventually overlaps the other three substrates, and extends from the overlap portion to connect the row electrode on the second substrate to the drive element. Connection The first and second substrates are overlapped so that both the column electrode and the row electrode are disposed inside the substrate in the panel element forming step, and in the overlapping step, The extension direction of the connecting portion of the first panel element on the first substrate, the extension direction of the connecting portion of the first panel element on the second substrate, centering on the overlapping portion of the first panel element and the second panel element. Setting direction, the extending direction of the connecting portion of the second panel element on the first substrate and the extending direction of the connecting portion of the second panel element on the second substrate are shifted by 90 ° in a predetermined order. A method for manufacturing a multi-layer display panel, wherein a first and a second panel element are overlapped. 19. The method of manufacturing a multi-layer display panel according to claim 16, wherein at least a part of an electrode forming surface of each connection portion of each of said substrates is exposed. 20. The method according to claim 10, further comprising an aftercutting step of removing unnecessary portions from each of the first and second substrates of each of the superposed panel elements, the step being performed after the superposing step. In the element forming step, as each of the first substrates, an overlapping portion that finally overlaps with another substrate; an extending portion that is extended from the overlapping portion and used as the connection portion; And a substrate having an extended portion used as a holding portion for holding the panel element in the overlapping step in the overlapping step, and as each of the second substrates, an overlayer that finally overlaps with another substrate An overlap portion, an extension portion extending from the overlap portion and used as the connection portion, and An extended portion used as a holding portion for holding the panel element in the overlapping step, wherein the substrate is extended, and in the after-cutting step, of the extended portion of the first substrate, 17. An extension portion other than the extension portion used as the connection portion is removed, and an extension portion of the extension portion of the second substrate other than the extension portion used as the connection portion is removed.
20. The method for manufacturing a multi-layer display panel according to any one of the above items. 21. A pre-cutting step of removing unnecessary portions from each of the first and second substrates, the pre-cutting step being performed before the superposing step, and the pre-cutting step being performed after the superposing step. The method further includes an after-cut step of removing an unnecessary portion from each of the first and second substrates of each of the superposed panel elements. In the panel element forming step, the first and second substrates are finally used as the first substrates. A substrate having an overlapping portion overlapping with the substrate of the above and four extending portions extending in four directions at 90 ° center angle intervals from the overlapping portion is used. And an overlap portion overlapping with another substrate, and 90
A substrate having four extending portions extended in four directions at a center angle interval of ° is used in the pre-cutting step as the connecting portion of the four extending portions of the first substrate. An extended portion and an extended portion other than an extended portion used as a holding portion for holding the panel element in the overlapping step are removed, and the extending portion of the four extending portions of the second substrate is removed. In the after-cutting step, the extension part except for the extending part used as a connecting part and the extending part used as a holding part for holding the panel element in the overlapping step is removed. An extension portion other than the extension portion used as the connection portion of the substrate is removed, and an extension portion other than the extension portion used as the connection portion of the second substrate is removed. The method of fabricating the multilayer display panel according to any one of claims 16 19, excluding. 22. A step performed before the after-cutting step, further comprising a half-cutting step of performing a half-cut on a boundary line between a substrate portion to be removed in the after-cutting step and a substrate portion to be left. Item 20
Or a method of manufacturing a multilayer display panel according to 21. 23. The method according to claim 22, wherein the half-cutting step is performed before the overlapping step. 24. A step performed before the precut step, further comprising a halfcut step of performing a halfcut on a boundary line between a substrate portion to be removed in the precut step and a substrate portion to be left. From 2
3. The method for manufacturing a multi-layer display panel according to any one of items 3. 25. The method according to claim 24, wherein the half-cut step for the pre-cut step and the half-cut step for the after-cut step are performed simultaneously. 26. The method of manufacturing a multi-layer display panel according to claim 22, wherein the half-cut in the half-cut step is performed on an exposed surface of the substrate. 27. Each of the first substrates used in the panel element forming step also drives an extended portion opposite to the extended portion used as the connection portion with the overlap portion of the first substrate as a center. The second substrate used in the panel element forming step may be used as a connection part for connecting to an element, and the extension used as the connection part around an overlapping part of the second substrate. 27. The method of manufacturing a multi-layer display panel according to claim 21, wherein the extending portion opposite to the portion can also be used as a connecting portion for connecting to the driving element. 28. The method according to claim 27, wherein the first substrate and the second substrate used in the panel element forming step are all rectangular substrates of the same size. 29. A column electrode having the same pattern is formed on each of the first substrates used in the panel element forming step, and all of the column electrodes are formed on each of the second substrates used in the panel element forming step. 29. The method according to claim 28, wherein the row electrodes having the same pattern are formed. 30. The method for manufacturing a multi-layer display panel according to claim 16, wherein in the overlapping step, at least overlapping portions of two substrates adjacent to each other are bonded with an adhesive. 31. The method according to claim 16, wherein in the superposing step, both the overlapping portion and the connecting portion of two adjacent substrates of two adjacent panel elements are bonded with an adhesive. A method for manufacturing the multilayer display panel according to the above. 32. The first substrate used in the panel element forming step is a resin film substrate, and the column electrode is formed on a convex side of the first substrate formed by winding, and the second substrate 32. The method of manufacturing a multi-layer display panel according to claim 16, wherein is a resin film substrate, and wherein the row electrodes are formed on a convex side of the second substrate formed by winding. 33. The lamination according to claim 16, further comprising a mounting step of mounting the driving element on a connection portion of the substrate and connecting an electrode on the substrate to the driving element. Method of manufacturing a type display panel. 34. The method according to claim 33, wherein said mounting step is performed after said overlapping step. 35. In the mounting step, the drive element is mounted using an anisotropic conductive adhesive.
5. The method for manufacturing a multilayer display panel according to item 4. 36. In the mounting step, the driving element mounted on one of two adjacent substrates having the same extending direction of the connecting portion is mounted on the other substrate. 34. Mounting in a position not overlapping with
36. The method for manufacturing a multilayer display panel according to any one of items 35 to 35. 37. In the mounting step, the driving element mounted on one of two adjacent substrates having the same extending direction of the connection portion is mounted on the other substrate. 34. Mounting at a position overlapping with.
36. The method for manufacturing a multilayer display panel according to any one of items 35 to 35. 38. In the mounting step, after temporarily attaching at least one of the two drive elements mounted on the two connection parts having the same extending direction to the connection part, the two drive elements are simultaneously attached. The method for manufacturing a multilayer display panel according to claim 37, wherein the permanent bonding is performed. 39. The driving element mounted on the connection portion of the substrate in the mounting step has a bump, and before the mounting step, the periphery of the connection surface of the driving element to the electrode of the bump is rounded. The method for manufacturing a multi-layer display panel according to any one of claims 33 to 38, further comprising a rounding step of applying a bump. 40. A driving element mounted on a connection portion of the substrate in the mounting step, having a bump. In the mounting step, a side opposite to a mounting surface of the connection portion of the substrate on which the driving element is to be mounted. The multilayer die according to any one of claims 35 to 39, wherein thermocompression is performed using a crimping jig including a crimping base member arranged at a position where the crimping base member has a raised portion at a position facing the bump. Display panel manufacturing method. 41. The method of manufacturing a multi-layer display panel according to claim 40, wherein said press-fit base member has an outer periphery of said raised portion smaller than an outer periphery of a bump of said drive element. 42. In the mounting step, the alignment of the alignment mark is performed by using an alignment mark provided on a connection portion of the substrate and an alignment mark provided on the drive element. Is mounted at a predetermined position of the connection portion.
The method for manufacturing a multilayer display panel according to any one of the above. 43. The method according to claim 42, wherein in the mounting step, the alignment mark provided on the connection portion of the substrate is read by a reading device having a reduced depth of field. 44. The lamination according to claim 16, further comprising a connecting step of connecting a relay board for connecting the driving element to a control unit of a driving device at a connecting portion of the substrate. Method of manufacturing a type display panel. 45. The method according to claim 44, wherein the connecting step is performed after the overlapping step. 46. The method of manufacturing a multi-layer display panel according to claim 44, wherein in the connecting step, the relay substrate is connected to a connection portion of the substrate using an anisotropic conductive adhesive. 47. In the connecting step, using the alignment mark provided on the connection portion of the substrate and the alignment mark provided on the relay substrate, the alignment of these alignment marks is performed. 47 is connected to a predetermined position of the connecting portion.
The method for manufacturing a multilayer display panel according to any one of the above. 48. The method according to claim 47, wherein in the connecting step, the alignment mark provided at the connecting portion of the substrate is read by a reading device having a reduced depth of field. 49. The connecting step further includes a folding step of using a flexible board as the relay board, and folding the relay board toward a side opposite to an observation side of the multilayer display panel.
49. The method for manufacturing a multilayer display panel according to any one of items 4 to 48. 50. The method of manufacturing a multi-layer display panel according to claim 16, further comprising a connection step of connecting a substrate on which the driving element is mounted to a connection portion of the substrate. 51. The method according to claim 50, wherein said connecting step is performed after said overlapping step. 52. The multi-layer display panel according to claim 50, wherein, in the connecting step, a substrate on which the driving elements are mounted is connected to a connection portion of the substrate using an anisotropic conductive adhesive. Production method. 53. In the connecting step, alignment of these alignment marks is performed using an alignment mark provided on a connection portion of the substrate and an alignment mark provided on a substrate on which the driving element is mounted. 53. The method of manufacturing a multi-layer display panel according to claim 50, wherein the substrate is connected to a predetermined position of the connection portion. 54. The method of manufacturing a multi-layer display panel according to claim 53, wherein in the connecting step, the alignment mark provided on the connecting portion of the substrate is read by a reading device having a reduced depth of field. 55. The method according to claim 55, further comprising a folding step of folding the substrate on which the drive elements to be connected in the connecting step are mounted, and folding the substrate toward the side opposite to the observation side of the multilayer display panel. A method for manufacturing a multilayer display panel according to any one of claims 50 to 54. 56. The mounting step or the connecting step, wherein a connecting portion of a substrate on which the drive element is to be mounted is mounted.
A first surface for mounting a connection portion of a substrate to which the relay substrate is to be connected or a connection portion of a substrate to which a substrate on which the driving element is mounted is to be mounted; Is carried out by holding the multilayer display panel with a holding device including a holding jig having a second surface for placing an overlapped portion, and between the first surface and the second surface of the holding jig. A step having a height equal to or greater than the maximum height including a manufacturing error in height from the surface of the multilayer display panel directly mounted on the first surface to the surface of the multilayer display panel directly mounted on the second surface; The method for manufacturing a multilayer display panel according to any one of claims 33 to 55, wherein: 57. The holding device further includes a suction device for sucking the stacked display panel surface directly mounted on the first surface of the holding jig to the first surface. 57. The multi-layer display panel according to claim 56, wherein the connecting step is performed while the multi-layer display panel surface directly mounted on the first surface of the holding jig is adsorbed to the first surface by the suction device. Production method. 58. The holding device further includes a pressing member for pressing a connection portion of the substrate of the panel element mounted on the first surface of the holding jig toward the first surface. 58. The method of manufacturing a multi-layer display panel according to claim 56, wherein the mounting step or the connecting step is performed while pressing the connection portion against the first surface with the pressing member. 59. The stacking mold according to claim 58, wherein the pressing member is provided with a window for exposing a drive element mounting area of the connection portion mounted on the first surface of the holding jig. Display panel manufacturing method. 60. A window for exposing a connection area of a relay board connection area of the connection portion mounted on the first surface of the holding jig or a connection area of a board on which a drive element is mounted, wherein the holding member has a window. The method for manufacturing a multilayer display panel according to claim 58 or 59, wherein 61. A holding device for holding a multi-layer display panel in which a plurality of panel elements each having a pair of substrates are stacked, wherein said panel element is driven by a substrate projecting portion projecting from an overlapping portion. A holding device for holding the multilayer display panel when mounting an element or connecting another substrate, wherein the first surface for mounting the substrate protruding portion and the panel element overlap each other. A holding jig having a second surface for mounting the same, between the first surface and the second surface of the holding jig, a stacked display panel directly mounted on the first surface. A holding device comprising a step having a height equal to or larger than a maximum height including a manufacturing error of a height from a surface to a surface of a multilayer display panel directly mounted on the second surface. 62. The holding device further comprises a suction device for sucking the stacked display panel surface directly mounted on the first surface of the holding jig to the first surface. A holding device as described. 63. The holding device further comprises a pressing member for pressing the substrate protruding portion mounted on the first surface of the holding jig toward the first surface.
63. The holding device according to 62. 64. The holding member according to claim 63, wherein the holding member is provided with a window for exposing a drive element mounting area of the protruding portion of the substrate placed on the first surface of the holding jig. apparatus. 65. The holding member according to claim 63 or 64, wherein a window is provided for exposing a substrate connection region of the substrate protruding portion mounted on the first surface of the holding jig. Holding device. 66. A crimping jig used when mounting a driving element having a bump on a substrate, comprising a crimping base member arranged on a side of the substrate opposite to a mounting surface of the driving element. A crimping jig, wherein the base member has a raised portion at a position facing the bump. 67. The crimping jig according to claim 66, wherein an outer periphery of a raised portion of the crimping base member is smaller than an outer periphery of a bump of the driving element. 68. A mounting method for mounting driving elements at positions where two substrate surfaces overlap each other, wherein a temporary bonding step of temporarily bonding at least one of the driving elements to the substrate is performed simultaneously with the two driving elements. And a permanent bonding step of performing permanent bonding. 69. The temporary bonding step and the final bonding step are performed by disposing an anisotropic conductive adhesive between a driving element and a substrate surface and applying heat and pressure, and applying heat and pressure in the temporary bonding step. Is smaller than the heat and pressure applied in the main bonding step.
9. The driving element mounting method according to 8.