JP2001274186A5 - - Google Patents
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- Publication number
- JP2001274186A5 JP2001274186A5 JP2000084863A JP2000084863A JP2001274186A5 JP 2001274186 A5 JP2001274186 A5 JP 2001274186A5 JP 2000084863 A JP2000084863 A JP 2000084863A JP 2000084863 A JP2000084863 A JP 2000084863A JP 2001274186 A5 JP2001274186 A5 JP 2001274186A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000084863A JP4088015B2 (ja) | 2000-03-24 | 2000-03-24 | 湾曲状ワイヤの形成方法 |
| TW089126700A TW522497B (en) | 2000-03-24 | 2000-12-14 | Method of forming bent wire |
| KR10-2001-0012329A KR100424166B1 (ko) | 2000-03-24 | 2001-03-09 | 만곡형상 와이어의 형성방법 |
| US09/814,189 US6564453B2 (en) | 2000-03-24 | 2001-03-21 | Bent wire forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000084863A JP4088015B2 (ja) | 2000-03-24 | 2000-03-24 | 湾曲状ワイヤの形成方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001274186A JP2001274186A (ja) | 2001-10-05 |
| JP2001274186A5 true JP2001274186A5 (ja) | 2006-07-27 |
| JP4088015B2 JP4088015B2 (ja) | 2008-05-21 |
Family
ID=18601281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000084863A Expired - Fee Related JP4088015B2 (ja) | 2000-03-24 | 2000-03-24 | 湾曲状ワイヤの形成方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6564453B2 (ja) |
| JP (1) | JP4088015B2 (ja) |
| KR (1) | KR100424166B1 (ja) |
| TW (1) | TW522497B (ja) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7229906B2 (en) * | 2002-09-19 | 2007-06-12 | Kulicke And Soffa Industries, Inc. | Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine |
| JP4509043B2 (ja) * | 2006-02-14 | 2010-07-21 | 株式会社新川 | スタッドバンプの形成方法 |
| US20100186991A1 (en) * | 2006-10-18 | 2010-07-29 | Kulicke And Soffa Industries, Inc. | conductive bumps, wire loops including the improved conductive bumps, and methods of forming the same |
| JP4467631B1 (ja) * | 2009-01-07 | 2010-05-26 | 株式会社新川 | ワイヤボンディング方法 |
| US8177495B2 (en) * | 2009-03-24 | 2012-05-15 | General Electric Company | Method and apparatus for turbine interstage seal ring |
| CN102437111B (zh) * | 2011-12-01 | 2014-03-26 | 中南大学 | 利用线夹制造折点的快速引线成弧方法及装置 |
| US9082753B2 (en) * | 2013-11-12 | 2015-07-14 | Invensas Corporation | Severing bond wire by kinking and twisting |
| US9087815B2 (en) * | 2013-11-12 | 2015-07-21 | Invensas Corporation | Off substrate kinking of bond wire |
| TWI543284B (zh) * | 2014-02-10 | 2016-07-21 | 新川股份有限公司 | 半導體裝置的製造方法以及打線裝置 |
| CN115707348A (zh) * | 2021-06-07 | 2023-02-17 | 株式会社新川 | 半导体装置的制造方法以及打线接合装置 |
| TWI824354B (zh) * | 2021-12-15 | 2023-12-01 | 日商新川股份有限公司 | 打線接合裝置、打線切斷方法以及程式 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5917707A (en) * | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
| US5476211A (en) * | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
| US5813115A (en) * | 1994-08-03 | 1998-09-29 | Matsushita Electric Industrial Co., Ltd. | Method of mounting a semiconductor chip on a wiring substrate |
| US5734546A (en) * | 1994-09-21 | 1998-03-31 | Rohm Co. Ltd. | Capacitor element for solid electrolytic capacitor and process for making the same |
| AU4160096A (en) | 1994-11-15 | 1996-06-06 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
| JP3189115B2 (ja) * | 1996-12-27 | 2001-07-16 | 株式会社新川 | 半導体装置及びワイヤボンディング方法 |
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2000
- 2000-03-24 JP JP2000084863A patent/JP4088015B2/ja not_active Expired - Fee Related
- 2000-12-14 TW TW089126700A patent/TW522497B/zh not_active IP Right Cessation
-
2001
- 2001-03-09 KR KR10-2001-0012329A patent/KR100424166B1/ko not_active IP Right Cessation
- 2001-03-21 US US09/814,189 patent/US6564453B2/en not_active Expired - Fee Related