JP2001270908A - Soldering resist, semiconductor package and method for manufacturing it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a soldering resist which does not need removing a residual flux by washing after soldering, retains the electric insulation even under an environment of high temperature and high humidity, and allows a strong and highly reliable bond of soldering. SOLUTION: The resist comprises (A) a phenol novolac resin having at least one acryloyl or methacryloyl group, (B) a resin as a curing agent, and (C) a photopolymerization initiator.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder joint for mounting a solder ball on a semiconductor package, and more particularly, to a solder for mounting a semiconductor package on which a solder ball is mounted on a printed wiring board by solder joint. The present invention relates to a bonding resist.

[0002]

2. Description of the Related Art In recent years, with the demand for higher functionality and lighter, thinner and smaller electronic devices, high-density integration and high-density mounting of electronic components have been progressing. Semiconductor packages have been increasingly miniaturized and have more pins than ever before.

[0003] With the miniaturization of semiconductor packages,
In a conventional package using a lead frame, the miniaturization has reached its limit. Recently, a BGA (Ball) has been used as a package mounted on a circuit board.
Grid Array), CSP (Chip Sc)
area packaging) has been proposed. In these semiconductor packages, various insulating materials such as plastics and ceramics, which are called semiconductor mounting substrates, having electrodes of a semiconductor chip and a function of a lead frame of a conventional semiconductor package, and terminals of a substrate composed of conductor wiring, Wire connection method and TAB (Tape Automated Bondin)
g) system, and furthermore, an FC (Flip Chip) system and the like are known. Recently, BGA and CSP structures using the FC connection system, which are advantageous for miniaturization of semiconductor packages, have been actively proposed. .

For mounting a BGA or CSP on a printed wiring board, solder bonding using bumps formed of solder balls is employed. A flux is used for this soldering, and a solder paste is sometimes used in combination. In particular, the reason why solder balls are used is that the amount of solder supplied can be easily controlled and a large amount of solder can be supplied, so that the bumps can be made high. In addition, solder bonding is often used also as an electrical connection method between electrodes of a semiconductor chip and terminals of a semiconductor mounting substrate in a BGA or CSP manufacturing process.

[0005] In general, for solder joining, dirt such as oxides on the metal surface of the electrodes facing the solder surface is removed, and reoxidation of the metal surface at the time of solder joining is prevented, so that the surface tension of the solder is reduced. And a soldering flux is used to make the molten solder easily wet the metal surface. As the flux, a flux obtained by adding an activator or the like for removing an oxide film to a thermoplastic resin flux such as rosin is used.

However, if this flux remains, the thermoplastic resin melts at high temperature and high humidity, and the active ions in the activator are also released. Occurs. For this reason, at present, the above-mentioned problem is solved by cleaning and removing the residual flux after the solder bonding, but there are disadvantages such as an environmental problem of the cleaning agent and an increase in cost due to the cleaning process.

As described above, the functions of the flux are to remove the oxide of the solder and the metal surface, prevent re-oxidation, and improve the solder wettability (reduce the surface tension). The flux exists and the metal surface is exposed. If it does, the solder will get wet without restriction. Therefore, in general, a solder resist is used on the circuit surface of a semiconductor package or a printed wiring board in order to introduce solder only into a solder joint and to protect a conductor wiring pattern. However, if the solder resist remains in the solder joint, problems such as a decrease in connection reliability and a failure in solder joint occur. Therefore, great care must be taken in forming the solder resist.

In addition, the miniaturization of semiconductor packages and the increase in the number of pins of semiconductor packages promote the miniaturization of bumps, and there is a concern that bonding strength and reliability may be reduced. Therefore, in order to obtain the reliability of the bump connection portion, studies are being made to fill the gap between the chip and the substrate with an insulating resin called underfill to seal and reinforce the bump connection portion. However, this requires a step of filling and hardening an underfill, which is technically difficult, and has a problem that the manufacturing process is complicated and the manufacturing cost is increased.

[0009]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of solder bonding at the time of mounting a semiconductor package, and has been made in view of the formation of a solder resist, the cleaning and removal of residual flux after solder bonding, and Solder bonding resist that does not require underfill filling, maintains electrical insulation even in a high-temperature, high-humidity atmosphere, enables high-strength, reliable solder bonding, a semiconductor package using the solder resist, and manufacturing thereof The aim is to provide a method.

[0010]

That is, the present invention provides a phenol novolak (A) having at least one acryloyl group or methacryloyl group, a resin (B) acting as a curing agent thereof, and a photopolymerization initiator (C). ) As an essential component, is applied on a circuit pattern having solder ball mounting lands, and is irradiated with active energy rays using the solder balls mounted on the lands as a mask, thereby lowering the fluidity of the active energy ray exposed portion. After solder balls are joined to the lands by solder reflow, the solder balls are cured by heating so as to reinforce the solder ball joints, and further function as a resist for the circuit pattern. It is.

The solder bonding resist of the present invention is preferably a phenol novolak (A) having at least one acryloyl group or methacryloyl group, and a phenol compound having one or two phenolic hydroxyl groups in a molecule. And a formaldehyde with a polyfunctional phenol obtained by condensation under an acidic catalyst as an essential component, and a melt viscosity at a solder bonding temperature of a solder bonding resist obtained by these is preferably 50 Pa · s or less. And

The solder bonding resist of the present invention is applied to the entire surface of the circuit pattern of the semiconductor package on which the solder balls are to be mounted, and the solder balls are placed on the solder ball mounting lands of the circuit pattern. Irradiation of active energy rays with the mask as a mask reduces the fluidity of the solder bonding resist in the active energy ray exposed area, solders the solder balls to the lands by solder reflow, and further heats the solder balls. By curing the resist, forming a resist of the circuit pattern,
Further, the present invention provides a semiconductor package and a method of manufacturing the semiconductor package, wherein the solder ball joint is cured by resin reinforcement.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION The solder bonding resist of the present invention
The phenolic novolak having at least one acryloyl group or methacryloyl group (A), the resin (B) acting as a curing agent thereof, and the photopolymerization initiator (C) are essential components. The phenolic hydroxyl group of the phenol novolak (A) having one acryloyl group or methacryloyl group removes stains such as solder and oxides on the metal surface by its reducing action, and acts as a flux for solder bonding. The phenolic hydroxyl group is not restricted at all. However, in order to enhance the effect as a flux for soldering, phenol novolak (A) having at least one acryloyl group or methacryloyl group has a phenolic hydroxyl group. And those having an electron withdrawing group at the para position and an electron donating group at the meta position are preferred.

Further, a good cured product can be obtained by the resin (B) acting as a curing agent.
It does not require cleaning and removal after soldering, maintains electrical insulation even in a high-temperature, high-humidity atmosphere, and enables soldering with high bonding strength and high reliability.

[0015] The phenol novolak (A) having at least one acryloyl group or methacryloyl group used in the present invention is obtained by reacting a phenol compound having one or two phenolic hydroxyl groups in a molecule with formaldehyde under an acidic catalyst. It is preferable to use a polyfunctional phenol obtained by condensation with an acrylate or methacrylate having a glycidyl group.
In order to reduce the fluidity of the solder bonding resist in the active energy ray exposed portion by photocrosslinking, acrylate or methacrylate having a glycidyl group is reacted at a ratio of 20 to 70% with respect to the phenolic hydroxyl group of phenol novolak. Is appropriate. If it is less than 30%, the photocrosslinking of the active energy ray exposed portion becomes insufficient, and the fluidity of the solder bonding resist cannot be reduced. This particularly leads to agglomeration of the solder balls due to the interfacial tension between the solder bonding resist and the solder balls when the solder balls are mounted in a high-density package (when the solder balls are mounted at a narrow pitch). On the other hand, if the content is more than 70%, the phenolic hydroxyl group exhibiting a reducing action becomes insufficient, so that it becomes impossible to remove stains such as solder and oxides on the metal surface, so that it does not act as a flux for solder bonding.

Examples of the phenol compound having two phenolic hydroxyl groups in a molecule include bisphenol A type, bisphenol F type and bisphenol S type. Novolaks derived from alkylphenol novolaks can also be used. In this case, the alkyl group preferably has about 1 to 4 carbon atoms, such as a methyl group, an ethyl group, an n-butyl group, a sec-butyl group,
It is an rt-butyl group, furthermore an allyl group or the like, and when the number of carbon atoms is more than that, the amount of phenolic hydroxyl group per volume decreases, which is not preferable for solder joining. More preferably, those having a weight average molecular weight of 20,000 or less are good.
If the molecular weight is too large, the fluidity of the unexposed portion of the solder bonding resist at the time of solder bonding is reduced, which undesirably hinders the solder bonding. However, there is no problem if the melt viscosity at the time of solder joining can be controlled to 50 Pa · s or less by using other compounding agents. For this purpose,
You may mix | blend a liquid hardening | curing agent and may add a solvent. There is no lower limit for both molecular weight and melt viscosity.However, if the molecular weight is extremely small or the melt viscosity is too low, the solder joint resist will evaporate or flow out due to preheating of the reflow furnace during solder joint. Is not preferred.

That is, the portion (exposed portion) acting as a protective resist for the circuit pattern reduces the fluidity at the time of soldering, forms and maintains a uniform resist layer, and prevents solder ball aggregation due to interfacial tension. It is important to suppress the flow and to secure the fluidity required for the soldering at the part (unexposed part) involved in the soldering. Therefore, in addition to the means of adjusting the melt viscosity, in order to prevent uniform agglomeration of the resist layer and the solder balls, a leveling agent or the like is added to lower the surface tension or roughen the surface of the base material. Is also good.

As the acrylate or methacrylate having a glycidyl group, for example, glycidyl acrylate and glycidyl methacrylate are preferable due to their reactivity, availability, and the like.

The amount of the phenol novolak (A) having at least one acryloyl group or methacryloyl group is preferably 30 to 90% by weight of the entire solder bonding resist. If the amount is less than 30% by weight, the effect of removing stains such as solder and oxides on the metal surface is reduced, and solder joining cannot be performed. On the other hand, if the content is more than 90% by weight, a sufficient cured product cannot be obtained, and the bonding strength and reliability are reduced. Melt viscosity, due to the composition that balances oxide removal properties and curability, the solder bonding resist of the present invention cures in a form that reinforces the periphery of the solder joint in a ring shape, so that soldering with conventional flux In comparison, the joint strength,
The reliability can be greatly improved.

A phenol novolak (A) having at least one acryloyl or methacryloyl group,
As the resin (B) acting as a curing agent, an epoxy resin, an isocyanate resin, or the like is used. Specifically, all are based on phenol-based compounds such as bisphenol, phenol novolak, alkylphenol novolak, biphenol, naphthol and resorcinol, and skeletons such as aliphatic, cycloaliphatic and unsaturated aliphatic. Examples thereof include modified epoxy compounds and isocyanate compounds. The amount of phenol novolak (A) having at least one acryloyl group or methacryloyl group is equivalent to these functional groups.
Is preferably 0.5 to 2 equivalents of the phenolic hydroxyl group equivalent of the above. If it is less than 0.5 equivalents, a large amount of phenolic hydroxyl groups remain and the chemical resistance is poor, and if it is more than 2 equivalents,
The absolute amount of phenolic hydroxyl groups in the solder joint resist may be insufficient, leading to poor solder joint. Therefore, as the resin (B) acting as a curing agent, a resin having a relatively small functional group equivalent is selected, and it is more preferable to blend the resin (B) in an amount of 1 to 1.5 times equivalent. Further, in order to accelerate the curing of the solder bonding resist of the present invention, a known curing catalyst may be used.

The photopolymerization initiator (C) used in the present invention includes benzophenones such as benzophenone, benzoylbenzoic acid, 4-phenylbenzophenone and hydroxybenzophenone, benzoin, benzoin methyl ether, benzoin dimethyl ether, benzoin ethyl ether and benzoin isopropyl. Ether, benzoin butyl ether, benzoin alkyl ethers such as benzoin isobutyl ether, 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, 4-t-butyl-trichloroacetophenone,
Examples include acetophenones such as diethoxyacetophenone, thioxanthones such as thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone and 2,4-dimethylthioxanthone, and alkylanthraquinones such as ethylanthraquinone and butylanthraquinone. Can be. These may be used alone or as a mixture of two or more. The amount of the photopolymerization initiator added is usually 0.1 to 1 in the solder bonding resist of the present invention.
It is used in the range of 0% by weight. In addition, an ultraviolet inhibitor, a thermal polymerization inhibitor, a plasticizer, a curing accelerator, and the like can be added to the resin composition of the present invention as needed for storage stability.

The resist for solder bonding of the present invention is obtained by mixing and dissolving the above components with an organic solvent such as alcohols, ethers and ketones to form a varnish for the solder bonding resist.
You can also get. When this is used for a semiconductor package, the entire surface of the circuit pattern on which the solder balls of the semiconductor package are mounted is applied by a method such as screen printing or spin coating, and then is applied to the land for mounting the solder balls of the circuit pattern. A solder ball is placed on the substrate and the active ball is irradiated with the active energy beam using the solder ball as a mask, thereby lowering the fluidity of the solder bonding resist in the active energy beam exposure section, and the solder ball is bonded to the land by solder reflow. After that, the solder bonding resist is further cured by heating to form a resist of the circuit pattern.

As described above, the optimum amount of the phenolic hydroxyl group and the amount of the acryloyl group or the methacryloyl group in the solder bonding resist, the melt viscosity, the oxide removability and the curability are balanced. Due to the compounding, the solder bonding resist of the present invention is subjected to active energy ray exposure using a solder ball as a mask in advance, and the solder bonding resist in a portion not involved in solder bonding is photocrosslinked and the fluidity is extremely reduced. Thereby, it is possible to suppress the aggregation of the solder balls caused by the interfacial tension with the solder balls at the time of the solder reflow (which is a problem particularly when the solder balls are mounted at a narrow pitch). In addition, the solder ball resist serving as a mask and the photo-crosslinking resist portion that has not been cross-linked functions as a flux at the time of solder reflow, and also has a shape (meniscus) that reinforces the periphery of the solder bond portion in a ring shape by interfacial tension with the solder ball. ), The bonding strength and reliability can be greatly improved as compared with the conventional solder bonding using a flux.

[0024]

EXAMPLES The present invention will be described in more detail with reference to the following Examples, but it should not be construed that the invention is limited thereto.

First, a phenol novolak having at least one acryloyl group or methacryloyl group (A), a resin (B) acting as a curing agent thereof, and a photopolymerization initiator (C) are blended to form a solder bonding resist. The varnish was prepared, and a solder ball shear strength test, a temperature cycle test, and an insulation resistance test were performed to evaluate its characteristics. The evaluation results of the examples and the comparative examples are shown in Table 1 collectively.

Synthesis Example 1 Phenol novolak (Denippon Ink Chemical Industry Co., Ltd., phenolite TD-2090)
-60M) 70% methyl ethyl ketone (ME
K) 600 g of the solution (about 4 equivalents of OH group) was charged into a 2 liter flask, and 1 g of tributylamine and 0.2 g of hydroquinone were added thereto, followed by heating to 110 ° C. Into it, 284 g (2 mol) of glycidyl methacrylate
Was added dropwise over 30 minutes, and the mixture was stirred and reacted at 110 ° C. for 5 hours to obtain a methacryloyl group-containing phenol novolak a having a nonvolatile content of about 80% (methacryloyl group modification rate 5%).
0%).

Synthesis Example 2 Bisphenol A-type novolak (Phenolite LF-, manufactured by Dainippon Ink and Chemicals, Inc.)
687 g of a MEK solution of about 70%
H group (about 4 equivalents) was charged into a 2 liter flask, into which 0.2 g of hydroquinone and glycidyl methacrylate 2 were added.
84 g (2 mol) was added, and the mixture was heated to 110 ° C. After 1 g of tributylamine was added thereto,
By stirring and reacting for a period of time, phenol novolak b (methacryloyl group modification rate: 50%) containing about 80% of non-volatile content and containing methacryloyl group was obtained.

Embodiment 1 FIG. 100 g of the methacryloyl group-containing phenol novolak a (methacryloyl group modification rate 50%, OH group equivalent 350) obtained in Synthesis Example 1, bisphenol F type epoxy (RE-404S, manufactured by Nippon Kayaku Co., Ltd.)
50 g of epoxy equivalent (165) and 3 g of benzoin dimethyl ether (Irgacure 651 manufactured by Ciba-Geigy) as a photopolymerization initiator were dissolved in 60 g of cyclohexanone, and 0.2 g of 2-phenyl-4,5-dihydroxymethylimidazole was used as a curing catalyst. Was added to prepare a solder varnish for resist bonding.

Embodiment 2 FIG. Instead of 100 g of the methacryloyl group-containing phenol novolak a of Synthesis Example 1 used in Example 1, the methacryloyl group-containing phenol novolak b obtained in Synthesis Example 2 (methacryloyl group modification rate 50%, OH
A resist varnish for solder bonding was produced in the same manner as in Example 1, except that 100 g of the base equivalent 380) was used.

1. Solder ball shear strength test A 125 μm thick copper plate (EFTEC64T, manufactured by Furukawa Electric Co., Ltd.) is used to form an evaluation circuit including a land diameter of 300 μm and a land pitch of 0.5 mm, and the lead frame is sealed with a semiconductor. After being molded and sealed with a material (EME-7372, manufactured by Sumitomo Bakelite Co., Ltd.), it was polished from one side to expose the above-described circuit for evaluation, thereby producing a 10 mm square evaluation package. JIS-R for polishing finish
Water resistant abrasive paper No. 1000 specified in 6252 was used. After washing with isopropyl alcohol,
It dried at 30 degreeC for 30 minutes, and was set as the package for solder joint evaluation. For comparison, an evaluation package in which a land other than a land for solder bonding was covered with a solder resist was also prepared.

The resist varnish for solder bonding obtained in Examples 1 and 2 was applied to the entire exposed surface of the evaluation circuit of the evaluation package, and dried at 80 ° C. for 10 minutes to form a 20 μm-thick. A resist film for solder bonding was formed.
Solder balls having a diameter of 350 μm were placed on the lands of the evaluation package circuit on which the solder bonding resist obtained in Examples 1 and 2 and the commercially available solder flux MSP511 (manufactured by Kyushu Matsushita Electric Co., Ltd.) were applied, respectively. (Sn
After mounting 60 Pb-based eutectic solders (manufactured by Senju Metal Mining Co., Ltd.), in Examples 1 and 2, the irradiation amount was 500 mJ / using a high-pressure mercury lamp exposure apparatus using a solder ball as a mask.
Exposure was performed at ² cm ² , and the solder balls were bonded to the evaluation package through a reflow furnace having a peak temperature set at 240 ° C. Thereafter, in Examples, heat treatment was performed at 150 ° C. for 60 minutes to cure the solder bonding resist. For a commercially available flux, an evaluation package on which a solder resist was formed was also prepared.

Next, the solder ball shear strength (using a universal type bond tester PC2400T manufactured by Daige Co., Ltd.) of the obtained evaluation package with solder balls was measured. The average value was determined for each of the 60 samples, and the results are summarized in Table 1. As a comparative example, an evaluation package with solder balls on which a solder resist was formed was referred to as Comparative Example 2, and a package without a solder resist was referred to as Comparative Example 1.

2. Temperature Cycle Test The commercially available flux was applied to a printed wiring board for a temperature cycle (TC) test, and the evaluation packages with solder balls of Examples and Comparative Examples were mounted, and the peak temperature was set to 240 ° C. Through a reflow furnace, ten package mounting substrates for evaluation were produced. The evaluation package mounting board is designed so that 60 solder ball joints are connected in series via the evaluation package and the test printed wiring board.

After confirming the continuity of the obtained package board for evaluation, a TC test was performed in which one cycle is -50 ° C. for 10 minutes and 125 ° C. for 10 minutes. Temperature cycle (T
C) Table 1 summarizes the results of the number of disconnection failures after 1000 cycles of the test. As a comparative example, an evaluation package with a solder ball on which a solder resist was formed was a comparative example 2, a package without a solder resist was a comparative example 1, and further, a solder resist was formed and an underfill was filled. This was designated as Comparative Example 3. After mounting the evaluation package, the comparative example was washed with isopropyl alcohol before use.

3. Insulation resistance test Using a printed wiring board for insulation reliability test having a solder-plated comb-shaped pattern with a conductor interval of 150 μm, a resist varnish for solder bonding obtained in Examples 1 and 2 on this printed wiring board And dried at 80 ° C. for 10 minutes to form a solder bonding resist film having a thickness of 20 μm.
Exposure was at J / cm ² . As a comparative example, a test printed wiring board coated with the commercially available flux was also prepared. After passing through a reflow furnace set to a peak temperature of 240 ° C,
In Examples 1 and 2, a heat treatment was performed at 150 ° C. for 60 minutes to harden the solder bonding resist to obtain a test printed wiring board.

After measuring the insulation resistance of the printed wiring board, a DC voltage of 50 V was applied in an atmosphere of 85 ° C./85%, and the insulation resistance was measured after 1000 hours. The applied voltage at the time of measurement was 100 V for 1 minute, and the insulation resistance was summarized in Table 1. As Comparative Example, Comparative Example 4 was not cleaned with the flux.

[0037]

[Table 1]

As can be seen from the evaluation results shown in Table 1,
When the solder bonding resist of the present invention is used, the solder ball shear strength shows a high value of 2.3 to 2.5 times as compared with the case where a conventional flux is used.
In the test, the occurrence of disconnection failure was almost eliminated. In the insulation resistance test, there is almost no decrease, and the effect of the solder joint resist of the present invention is clear. Further, the solder balls can be mounted at a fine pitch even though no solder resist is formed.

[0039]

As described above, the solder bonding resist of the present invention does not require cleaning and removal of residual flux after solder bonding.
The semiconductor package retains electrical insulation even in a humid atmosphere, and hardens in such a way that the solder bonding resist hardens in the form of a ring around the solder bonding area, enabling high bonding strength and reliable solder bonding. It is very useful for simplifying the process of mounting the semiconductor device on a printed wiring board, suppressing the manufacturing cost, and improving the reliability of solder bonding in a semiconductor package.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification FI FI Theme Court ゛ (Reference) H05K 3/28 H01L 23/12 L (72) Inventor Kensuke Nakamura 2-5-28 Higashishinagawa, Shinagawa-ku, Tokyo No. Sumitomo Bakelite Co., Ltd. F-term (reference) 4J011 PA86 PA95 PB30 PC02 QB11 QB20 QB22 QB24 SA07 SA22 SA24 SA26 SA32 SA34 SA36 SA63 SA64 UA01 VA01 WA01 WA06 4J027 AH03 CA10 CB10 CC05 CD06 5E314 AA25 GG03 GG04 KK01 LL04 QQ01

Claims (9)

[Claims] 1. A phenol novolak (A) having at least one acryloyl group or methacryloyl group,
A resist for soldering, comprising a resin (B) acting as a curing agent and a photopolymerization initiator (C) as essential components. 2. A phenol novolak (A) having at least one acryloyl or methacryloyl group.
Is a polyfunctional phenol obtained by condensing a phenol compound having one or two phenolic hydroxyl groups in a molecule with formaldehyde in the presence of an acidic catalyst, for use in solder joining according to claim 1. Resist. 3. The melt viscosity at the solder joining temperature is 50 Pa ·
3. The solder bonding resist according to claim 1, wherein the value is not more than s. 4. An active energy ray is applied onto a circuit pattern having a land for mounting a solder ball by using the solder ball mounted on the land as a mask.
The fluidity of the active energy ray exposure part is reduced, and after solder balls are joined to lands by solder reflow, the solder balls are further cured by heating to function as a resist for the circuit pattern. Item 4. The solder bonding resist according to any one of Items 3 to 7. 5. The solder bonding resist according to claim 1, wherein the solder ball bonding portion is cured in a form of resin reinforcement. 6. The solder bonding resist according to claim 1, which is applied to the entire surface of the circuit pattern of the semiconductor package on which the solder balls are to be mounted, and the solder balls of the circuit pattern are mounted. A solder ball is placed on a land for soldering, and the active ball is irradiated with active energy rays using the solder ball as a mask. A semiconductor package formed by soldering to a solder resist and then curing the soldering resist by heating to form a resist of the circuit pattern. 7. The semiconductor package according to claim 6, wherein the solder ball joint is hardened by resin reinforcement. 8. A solder bonding resist according to claim 1, which is applied to the entire surface of the circuit pattern on the surface of the semiconductor package on which the solder balls are to be mounted. A solder ball is placed on the land and the active ball is irradiated with the active energy ray using the solder ball as a mask. A method of manufacturing a semiconductor package, comprising: after solder bonding, further curing the solder bonding resist by heating to form a resist of the circuit pattern. 9. The method for manufacturing a semiconductor package according to claim 8, wherein the solder ball joint is hardened in a form of resin reinforcement.