JP2001267723A - Method for manufacturing printed substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed board which can manufacture a circuit pattern with higher accuracy than that of a resist to be printed and formed by silk printing, or can use a high viscosity resist as the resist is printed on copper surface of the printed board by a gravure printing roll to be then etched or plated. SOLUTION: There is contained a step that a recess part is formed in a gravure printing roll so as to correspond to a part except for a circuit pattern 1 of a printed board, and a resist is piled up in the recess part formed in the gravure printing roll, so that the resist is transferred to the printed substrate, and then a part in which the resist of the printed board is not coated is etched or plated. The recess part corresponding to a part except for the circuit pattern 1 of the printed board formed in the gravure printing roll is a carve that a contour part 2 is formed in a grooved manner, and an inward part 3 enclosed with the contour part is occupied by cells having an aperture ratio as a full black printing, and the cells in a marginal part of the inward part are fused with the contour part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention makes it possible to produce a circuit pattern with a high silk printing principle by printing a resist on a printed circuit board with a gravure printing roll and then etching or plating. And a method of manufacturing a printed circuit board that can use a high-viscosity resist.

[0002]

2. Description of the Related Art A conventional method of manufacturing a printed circuit board is to form a concave portion on a silk screen corresponding to a portion other than a circuit pattern of a printed circuit board, and apply a resist to the concave portion formed on the gravure printing roll to form the resist. To a printed circuit board, and thereafter, etching or plating portions of the printed circuit board that are not covered with the resist.

[0003]

The circuit width of a printed circuit board is 15 microns, and the printing of resist by screen printing has reached its limit.

The present invention has been made in view of the above points, and a resist pattern is printed on a printed circuit board by a gravure printing roll, and then etched or plated to form a resist pattern by silk printing. It is an object of the present invention to provide a method of manufacturing a printed circuit board that can manufacture a circuit pattern with higher definition than that required, and can use a high-viscosity resist.

[0005]

According to the present invention, the above objects can be attained by the following constitution. (1) A concave portion is formed in the gravure printing roll corresponding to a portion other than the circuit pattern of the printed board, a resist is applied to the concave portion formed in the gravure printing roll, and the resist is transferred to the printed board. A method of manufacturing a printed circuit board, comprising a step of etching or plating a portion of the printed circuit board that is not covered with a resist. (2) A recess is formed in the gravure printing roll corresponding to a portion other than the circuit pattern of the printed board, a resist is applied to the recess formed in the gravure printing roll, and the resist is transferred to the printed board. A method of manufacturing a printed board, comprising etching or plating a portion of the printed board that is not coated with a resist, wherein the circuit pattern of the printed board formed on the gravure printing roll is provided. The concave portion corresponding to the portion other than the above, the contour portion is formed in a groove shape, the inner portion surrounded by the contour portion is occupied by cells of the aperture ratio to be solid printing, the cells of the peripheral portion of the inner portion A method for manufacturing a printed circuit board, characterized by engraving that fuses a contour and a contour.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a printed circuit board according to an embodiment of the present invention will be described. As shown in FIG. 1, (1) a concave portion is formed in a gravure printing roll corresponding to a portion other than a circuit pattern of a printed board. The recess is
A groove-shaped contour portion 2 and an inner portion 3 surrounded by the groove-shaped contour portion 2 and filled with cells having an aperture ratio to be solid printing.
The cell at the peripheral edge of the inner portion 3 is formed by engraving with the contour portion 2. Preferably, the cell of the inner part 3 is configured such that the screen line is divided near the intersection of the vertical and horizontal screen lines and connected to an adjacent cell. The concave portion is formed by applying a negative photosensitive film to a gravure printing roll, irradiating a portion corresponding to a circuit pattern on a printed circuit board with a laser exposure device, developing the film, etching the film, removing the photosensitive film, and removing chrome. Created by plating. In addition, the formation of the concave portion is also performed by using a black coat-laser exposure device on a gravure printing roll, by laser ablation-etching-black coat peeling-chrome plating on a portion other than the circuit pattern of the printed circuit board. . (2) A resist is laid on the concave portion formed on the gravure printing roll, and the resist is transferred to the copper surface of the printed circuit board. Since the resist applied to the contour 2 of the concave portion is formed with the circuit pattern (circuit line or the like) 1 of the printed board sandwiched therebetween, the circuit pattern (circuit line or the like) 1 of the printed board is notwithstanding gravure printing. The portion corresponding to the gravure screen line does not protrude in the line width direction. Since the resist laid on the inner portion surrounded by the contour portion 2 of the concave portion is filled with cells having an opening ratio to be solid printing, two circuit lines are formed between one circuit line and an adjacent circuit line. Solid printing is performed with a groove-shaped outline resist. If the cells of the inner part 3 are connected to adjacent cells by dividing the screen line near the intersection of the vertical and horizontal screen lines, the resist mounted on the cells of the area of the inner part 3 is entirely And the circuit patterns, line 1 and line 1
Are close to each other, and at this time, even if the transfer of the resist on the contour portion 2 to the printed circuit board is incomplete, the line is a circuit pattern formed on the cells of the inner portion 3. 1 and the wire 1 can be prevented from being short-circuited. (3) Manufacture of a printed circuit board characterized in that a gravure printing roll is heated to a required temperature higher than room temperature, and a high-viscosity resist is used to fill a recess formed in the gravure printing roll and print on a printed board. Method.

The method of manufacturing a printed circuit board according to the present invention can use a laser exposure apparatus when forming a concave portion in a gravure printing roll corresponding to a portion other than a circuit pattern of the printed circuit board. Since the light diameter can be reduced to 5 microns, the width of the circuit pattern line 1 can be made smaller than 15 microns.

In the method of manufacturing a printed circuit board according to the present invention, a gravure printing roll is heated to 40 ° C. to 50 ° C. and is filled in a concave portion formed in the gravure printing roll using a high-viscosity resist. A high-viscosity resist can be satisfactorily possessed and transfer as a circuit pattern to a printed board is extremely good, and a thick high-viscosity resist film transferred to a printed board and dried can be secured.

[0009]

The method for manufacturing a printed circuit board according to the present invention is as follows.
Since the resist is printed on the copper surface of the printed circuit board by gravure printing rolls and then etched or plated, it is necessary to produce a circuit pattern with higher definition than printing the resist pattern by silk printing And a high-viscosity resist can be used.

[Brief description of the drawings]

FIG. 1 is an enlarged view of a circuit pattern according to an example for explaining a method of manufacturing a printed circuit board according to the present invention;

[Explanation of symbols]

1 ... Circuit pattern of printed circuit board (circuit line etc.),
2 ... Contour portion forming a recess formed in the gravure printing roll, 3 ... Inner portion 3 forming a recess formed in the gravure printing roll,

Continued on the front page F term (reference) 2H113 AA01 AA04 AA05 AA06 BA03 BB07 BB17 BB22 BC00 BC10 CA17 EA12 FA10 FA48 5E314 AA21 CC02 CC06 EE02 GG24 GG26 5E339 AD01 AD03 BD03 BD05 BE11 CE13 CE18 EE10 FF03 A11 BB BB03 A02 BB02

Claims (3)

[Claims] 1. A concave portion is formed on a gravure printing roll corresponding to a portion other than a circuit pattern of a printed board, a resist is applied to the concave portion formed on the gravure printing roll, and the resist is transferred to a printed board. Thereafter, a method of etching or plating a portion of the printed circuit board that is not covered with the resist is provided. 2. A concave portion is formed on the gravure printing roll corresponding to a portion other than the circuit pattern of the printed board, a resist is applied to the concave portion formed on the gravure printing roll, and the resist is transferred to the printed board. Thereafter, a method of manufacturing a printed circuit board characterized by including a step of etching or plating a part of the printed circuit board that is not coated with a resist, wherein the printed circuit board formed on the gravure printing roll is provided. The concave portion corresponding to the portion other than the circuit pattern has a contour portion formed in a groove shape, and the inner portion surrounded by the contour portion is occupied by cells having an opening ratio that becomes solid printing, and the peripheral portion of the inner portion A method for manufacturing a printed circuit board, characterized by engraving a cell and a contour part. 3. A printed circuit board characterized in that a gravure printing roll is heated to a required temperature higher than room temperature, and a high-viscosity resist is used to fill a recess formed in the gravure printing roll and print on a printed board. Manufacturing method.