JP2001267371A5 - - Google Patents
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- JP2001267371A5 JP2001267371A5 JP2000077402A JP2000077402A JP2001267371A5 JP 2001267371 A5 JP2001267371 A5 JP 2001267371A5 JP 2000077402 A JP2000077402 A JP 2000077402A JP 2000077402 A JP2000077402 A JP 2000077402A JP 2001267371 A5 JP2001267371 A5 JP 2001267371A5
- Authority
- JP
- Japan
- Prior art keywords
- bump electrode
- semiconductor chip
- liquid crystal
- terminal
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Description
【発明の名称】液晶表示装置および半導体チップ Patent application title: Liquid crystal display device and semiconductor chip
Claims (8)
この半導体チップはそのバンプ電極が前記信号線の端子に接続され、該バンプ電極の該端子と接続される面に導電性の突起が形成されていることを特徴とする液晶表示装置。A semiconductor chip for supplying a signal to a signal line formed on the liquid crystal side surface of at least one of the substrates opposed to each other through the liquid crystal,
This semiconductor chip is characterized in that its bump electrode is connected to the terminal of the signal line, and a conductive projection is formed on the surface of the bump electrode connected to the terminal.
この半導体チップはそのバンプ電極が前記信号線の端子に接続され、該端子の該バンプ電極と接続される面に導電性の突起が形成されていることを特徴とする液晶表示装置。A semiconductor chip for supplying a signal to a signal line formed on the liquid crystal side surface of at least one of the substrates opposed to each other through the liquid crystal,
This semiconductor chip is characterized in that its bump electrode is connected to the terminal of the signal line, and a conductive projection is formed on the surface of the terminal connected to the bump electrode.
前記第１のバンプ電極と前記第２のバンプ電極の表面には導電性の突起が形成されており、前記第１のバンプ電極が形成された前記下地膜の前記半導体基板上における高さと、前記第２のバンプ電極が形成された下地膜の前記半導体基板上における高さとは異なっていることを特徴とする半導体チップ。Conductive protrusions are formed on the surfaces of the first bump electrode and the second bump electrode, and the height of the base film on the semiconductor substrate on which the first bump electrode is formed, and A semiconductor chip characterized in that the height of the base film on which the second bump electrode is formed on the semiconductor substrate is different.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000077402A JP2001267371A (en) | 2000-03-21 | 2000-03-21 | Liquid crystal display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000077402A JP2001267371A (en) | 2000-03-21 | 2000-03-21 | Liquid crystal display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001267371A JP2001267371A (en) | 2001-09-28 |
| JP2001267371A5 true JP2001267371A5 (en) | 2005-01-06 |
Family
ID=18594978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000077402A Pending JP2001267371A (en) | 2000-03-21 | 2000-03-21 | Liquid crystal display |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001267371A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040050245A (en) * | 2002-12-09 | 2004-06-16 | 삼성전자주식회사 | Thin film transistor substrate, method of manufacturing the same, liquid crystal display device having the same and method of manufacturing the same |
| JP5334814B2 (en) * | 2009-11-27 | 2013-11-06 | 京セラ株式会社 | Wiring board and electronic component mounting board |
| JP2013214557A (en) * | 2012-03-30 | 2013-10-17 | Olympus Corp | Electrode forming body, wiring board, and semiconductor device |
-
2000
- 2000-03-21 JP JP2000077402A patent/JP2001267371A/en active Pending
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