JP2001257249A - Method and device for controlling substrate conveyance robot operation - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the unnecessary movement distance of a robot, and to shorten time required for substrate movement. SOLUTION: When the position data for substrate-take-out operation and that for accommodation of the robot are to be set to a data storage part, retreat distance after accommodation operation is specified so that the retreat distance becomes shorter than that after substrate-take-out operation of the robot.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method and an apparatus for controlling the operation of a robot for transferring a substrate. In particular, the present invention relates to a case where a substrate to be processed such as a wafer is etched by plasma or the like, a film is formed by plasma or the like, or ion implantation (including ion doping) is performed. From a station having a cassette in which the substrate is stored), and loaded into another station (for example, a station for loading and / or unloading a substrate connected to a substrate processing apparatus such as an ion implantation apparatus), or from the station. The present invention relates to a method and an apparatus for controlling the operation of a robot for taking out and carrying it into another station (for example, a station having a processed substrate storage cassette).

[0002]

2. Description of the Related Art Such a robot generally includes an arm for holding a substrate, a telescopic drive mechanism for projecting and retracting the arm, a rotary drive mechanism for rotating the arm about a predetermined center axis, and an arm for moving the arm in a predetermined center axis direction (elevation direction). ) Has an elevating drive mechanism.

An example will be described with reference to FIG. FIG. 10 is a plan view showing a schematic configuration of an example of the ion implantation apparatus.

The ion implantation apparatus shown in FIG. 10 comprises an ion source 1, a mass analyzer 2 for selecting a predetermined ion type from an ion beam emitted from the ion source 1, and a predetermined ion type among ions exiting the analyzer 2. An analysis slit 3 selectively passing therethrough, an acceleration tube 4 for accelerating ions passing through the slit 3, a quadrupole lens (so-called Q lens) 5 for converging an ion beam accelerated by the acceleration tube 4, and ion implantation are performed. A scanning device 6 and an end station 7 for performing XY scanning of a predetermined region on the surface of a substrate W (substrate to be processed) with an ion beam are provided.

The end station 7 includes a target chamber 71 for performing an ion implantation process on the substrate W, air lock chambers 721, 722 connected to the target chamber 71, and a substrate transporter connected to the air lock chambers 721, 722. A chamber 73 is provided. In the target chamber 71, a vacuum-side substrate transfer robot 300 and a platen 711 on which a substrate W is set during ion implantation are arranged.
Inside, there are atmosphere-side substrate transfer robots 100 and 200, an orientation flat aligner 733 that can adjust the direction of the substrate W, and cassettes D1 and D2 that can store the substrates in their respective substrate storage units. Are located.

In this ion implantation apparatus, when the ions are implanted into the substrate W to be processed, the substrate storage section D1 of the cassette D1 is used.
The substrate W to be processed, which is stored in the orientation flat aligner 73, is taken out by the substrate transport robot 100 on the atmosphere side.
After being conveyed to the substrate 3, the substrate is placed on the substrate placing portion 733a of the orientation flat aligner 733, where the orientation of the substrate is positioned (orientation flat positioning).

The substrate W positioned by the orientation flat aligner 733 is taken out by the atmospheric-side substrate transfer robot 200, transported to the air lock chamber 721, and then placed in the substrate placement portion 721a of the air lock chamber 721. The pressure in the air lock chamber 721 is reduced to the same level as in the target chamber 7. At this time, the substrate storage section D1 of the cassette D1
The next substrate W to be processed is taken out from the substrate storage unit at the next stage of a by the atmospheric-side substrate transport robot 100 and transported to the orientation flat aligner 733.

The substrate W in the air-lock chamber 721 which has been decompressed is transferred to the platen 711 by the vacuum-side substrate transfer robot 300 and set on the platen 711.
In order to perform ion implantation, the platen 711 raises the substrate W and rotates it steadily. Then, ions are implanted into the substrate W. At this time, the next substrate W is taken out from the orientation flat aligner 733 by the atmosphere-side substrate transfer robot 200, transferred to the air lock chamber 721, and further transferred from the substrate storage portion of the next stage of the substrate storage portion D1a of the cassette D1. The substrate W to be processed is taken out by the atmosphere-side substrate transfer robot 100 and transferred to the orientation flat aligner 733.

The substrate W1 in the target chamber 71 into which the ions have been implanted is transported by the vacuum-side substrate transfer robot 300 to the substrate placement section 722a of the airlock chamber 722, where the airlock chamber 722 is vented to the atmosphere. At the same time, the next substrate W is set on the platen 711 by the vacuum-side substrate transfer robot 300 from the air lock chamber 721 and ion-implanted. Further, at this time, the next substrate W is taken out from the orientation flat aligner 733 by the atmosphere-side substrate transfer robot 200 and transferred to the air lock chamber 721, and at the same time, the substrate storage portion in the next stage of the substrate storage portion D1a of the cassette D1. Then, the next substrate W to be processed is taken out by the atmosphere-side substrate transport robot 100 and transported to the orientation flat aligner 733.

The substrate W1 in the air lock chamber 722 is taken out by the atmospheric-side substrate transfer robot 100, transferred to the cassette D1, and then transferred to the cassette storage portion D of the cassette D1.
Returned to 1a (stored). This operation is performed on cassette D
1 is continuously performed until there is no unprocessed substrate,
The first stage ends. After the first stage,
Move to the second stage.

In the second stage, the substrate W to be processed stored in the cassette D2 is taken out of the cassette D2,
After the ion implantation, the ion-implanted substrate W1 is returned (stored) to the original substrate storage section D2a of the cassette D2. This substrate transfer operation is the same as that of the first stage except that the transfer direction of the substrate is the opposite direction, and therefore the description thereof is omitted here. In the second stage, the robots 100 and 200 perform substantially the same operation as the operations of the robots 200 and 100 in the first stage.

Among the robots for transporting such substrates, at least two stations (for example, a station having a cassette, a station for loading and unloading substrates such as an orientation flat aligner, an air lock chamber, etc.) are provided in accordance with an instruction from the robot operation command section. In some cases, a substrate is transferred based on position data for a substrate transfer operation set for each station. In the example of FIG. 10, the atmospheric-side substrate transfer robots 100 and 200 correspond to this.

Hereinafter, one of the atmosphere-side substrate transfer robots 100 will be described.
The configuration and the substrate transfer operation of the example will be described. However, since the configuration and the substrate transfer operation of the atmosphere-side substrate transfer robot 200 are substantially the same as those of the robot 100, the description is omitted here.

FIG. 11A is a schematic side view of the robot 100, and FIG. 11B is a schematic plan view of the robot 100.

As shown in FIG. 11, the robot 100 includes a substrate holding arm 110 and a telescopic drive mechanism 120 for projecting and retracting the arm 110.

The substrate holding arm 110 has a tip 11
At 0a, the substrate can be supported from below. The telescopic drive mechanism 120 includes two upper and lower arms 121 and 122. The tip of the arm 121 is the substrate holding arm 11.
0 is rotatably connected to the lower surface of the rear end portion, and the rear end portion is rotatably connected to the upper surface of the front end portion of the lower arm 122. The rear end of the lower arm 122 is supported by the shaft 130a. The shaft 130a is the robot driving base 1000
It is supported by.

The robot drive base 1000 has a built-in rotary drive mechanism 130. The rotary drive mechanism 130 can turn the entire telescopic drive mechanism 120 and the substrate holding arm 110 to turn the substrate holding arm 110 to a target station.

The robot driving base 1000 also has a built-in lifting drive mechanism 140 for raising and lowering the shafts 130a supporting the arms 121 and 122 of the telescopic drive mechanism 120 and the substrate holding arm 110.

The telescopic drive mechanism 120 includes a lower arm 122
The motor includes a motor (not shown) that rotates the shaft about the shaft 130a and an interlocking mechanism (not shown) that projects and retracts the substrate holding arm 110 in conjunction with the rotation of the lower arm 122.

According to the telescopic drive mechanism 120, for example, as shown in FIG.
When the upper arm 121 is turned in the
Are turned in the opposite direction CCW in the figure, whereby the substrate holding arm 110 is turned into a horizontal line C orthogonal to the center line of the axis 130a.
It protrudes along L. When the lower arm 122 is turned in the opposite direction, the substrate holding arm 110 retreats along the line CL to a position illustrated by a solid line in FIG.

FIG. 12A shows the state of the arm when the substrate is put on the station, and FIG. 12B shows the state of the arm when the substrate is taken out from the station.

According to the robot 100, when the substrate holding arm 110 supports the substrate W, the substrate W
To go to a certain station,
The arm 110 is turned by the rotation drive mechanism 130 so that the arm 10 is directed toward the station, and is directed to the station. Also, if necessary, the lifting drive mechanism 1
At 40, the arm height is adjusted. Then, FIG.
As shown in FIG.
10 is protruded, and then lowered by a predetermined distance by the elevating drive mechanism 140, whereby the substrate W is mounted on a substrate mounting surface (not shown). After that, the arm 110 further lowers slightly and then retreats.

When the substrate W placed on a certain station is to be taken out, the arm 110 is directed to the station, and then the arm 110 projects as shown in FIG. Get down. Next, the arm 110 is raised to lift the substrate W. In this state, the arm 110 retreats.

The shape of the distal end of the substrate holding arm 110 is not limited to the one shown in the drawings, but may be various types such as a bifurcated type.

FIG. 13 is an enlarged view of the atmosphere-side substrate transfer robot 100 shown in FIGS. 10 and 11 and its peripheral portion.

As shown in FIG. 13, the robot 100 is connected to a robot operation control device 150 (robot controller), and is controlled by the robot controller 150 in accordance with an instruction from the robot operation command unit CONT.

In FIG. 13, the telescopic drive mechanism 120, the rotary drive mechanism 130, and the elevation drive mechanism 140 in the robot 100 are shown in a block diagram. These operate according to the instruction of the controller 150.

The robot controller 150 stores position data (position data set by teaching) for robot operation for each of the stations A, B, and C (that is, the cassette D1, the orientation flat aligner 733, and the airlock chamber 722). It is set in advance.

Then, the rotation driving mechanism 130 stops the rotation of the substrate holding arm 110 based on the position data set for each station described later.

The lifting drive mechanism 140 raises or lowers the substrate holding arm 110 based on position data set for each station described later.

The telescopic drive mechanism 120 projects or retracts the substrate holding arm 110 based on position data set for each station described later.

That is, as the position data for the cassette station A, the robot controller 150 turns the empty substrate holding arm 110 from a predetermined position toward the station A, and takes out the substrate W from a predetermined stage of the cassette D1. The position data for the robot operation to retract and the substrate holding arm 110 holding the processed substrate W1 are directed to the station A, and the robot operation to move the substrate W1 to a predetermined stage of the cassette D1 and to retract is performed. As position data, position data for the orientation flat aligner station B, position data for a robot operation of moving the arm 110 holding the substrate W to the station B, placing the substrate W on the station, and retreating, or a further empty arm 110 toward Station B, The position of the empty arm 110 from a predetermined position to the station C is processed as the position data for the robot operation to move the substrate W to the position and retrieve the substrate W which has been positioned, and the air lock station C is processed from the station. Substrate W1
Position data for a robot operation for taking out and retreating, or a position for a robot operation for moving the arm 110 holding the substrate W to the station C and moving the substrate W to the station C and retreating. Data is set in advance.

The robot operation command unit CONT is not limited to this, but here is an instruction to the robot controller 150 to take out the substrate W from the predetermined stage of the cassette D1 of the station A (or to the predetermined stage of the cassette D1. An instruction to place the substrate W1), and an instruction to place the substrate W to the station B (or the station B)
From the station C), and an instruction to take out the processed substrate W1 from the station C (or an instruction to place the orientated flattened substrate W to the station C) at a predetermined timing and based on one instruction. The robot operation completion signal is sent to the controller 15
Output by receiving from 0.

The positioning data and the operation based on the positioning data described above for the robot 100 are the same for the robot 200.

Thus, based on the sequential command from the robot operation command section CONT, the robot 100
The substrate W is taken out from the predetermined stage, and the orientation flat aligner 7
The wafer W is placed on the wafer 33 and positioned in the orientation flat. The substrate W is taken out by the robot 200 and put into the air lock chamber 721 to be used for ion implantation.

The robot 100 can take out the ion-implanted substrate W1 from the airlock chamber 722 and store it in the original step position of the cassette D1. The same transfer processing and ion implantation processing can be performed on the substrate in the cassette D2.

[0037]

However, the position data at the time of taking out the substrate for the robot operation preset for each station and the position data at the time of placing the substrate are different in the robot operation. The position data is substantially the same except that it becomes. In addition, particularly in the retreat operation of the substrate holding arm, the arm on which the substrate is taken out is retracted, and then the substrate on the arm is retracted to a position where it does not collide with a station or the like when rotating while supporting the substrate. Is the position data determined.

Therefore, when the arm holding the substrate goes back to the empty state after placing the substrate, not only does it retreat to a position where there is no danger of colliding with a station or the like in the next turn, and furthermore, Must be retreated to the same position as in the case where is supported, the next operation cannot be performed.

This will be described with reference to FIG. 14 taking the robot 100 shown in FIGS. 10 and 11 as an example.

FIG. 14A shows a state in which the arm 110 is retracted when the substrate is present at the distal end 110a of the substrate holding arm 110. FIG. 14B shows the distal end 1 of the arm 110.
The state where the arm 110 is retracted when there is no substrate at 10a is shown. In the drawing, E is the turning range of the substrate supported by the arm 110, and F is the turning range of the arm 110 supporting the substrate.

As shown in FIG.
When the 0 arm 110 takes out the substrate W from the substrate storage section D1a of the cassette D1 and retreats, the substrate W supported by the arm 110 collides with an obstacle G such as a part of the station A when the next arm 110 turns. The robot arm 110 is retracted to a position where there is no fear. However, since the position data of the robot operation is substantially the same both when the substrate is taken out and when the substrate is taken out, the robot arm 110
Even when the processed substrate W1 is moved to No. 1 and then retreated, as shown in FIG. 14B, the substrate W1 retreats to the same position as when supporting the substrate. When the substrate W1 is retracted after being stored in the cassette D1, in order to avoid collision with the obstacle G, it is sufficient to retract to the position P1 shown in FIG. Retreating.

As described above, the retreat distance of the empty substrate holding arm that does not hold the substrate is unnecessarily large, and wasteful time is consumed, and the throughput of substrate processing is accordingly reduced. I do.

Therefore, according to the present invention, according to an instruction from the robot operation commanding section, at least two stations are controlled by the substrate transfer robot on the basis of the position data for the substrate transfer robot operation set for each station. A robot operation control method and apparatus for transferring a substrate by operating the same. The robot operation control method and apparatus can reduce an unnecessary moving distance of a robot and reduce a time required for moving a substrate, and can be applied to a substrate processing apparatus (for example, an ion implantation apparatus). When applied, substrate processing capacity of the processing equipment (substrate processing throughput)
It is an object of the present invention to provide a method and an apparatus for controlling the operation of a substrate transfer robot, which can improve the operation speed.

[0044]

According to the present invention, there is provided the following method and apparatus for controlling the operation of a substrate transfer robot. (1) Substrate transfer robot operation control method A substrate transfer robot is provided for at least two stations based on position data for the substrate transfer robot operation set for each of the stations in accordance with an instruction from the robot operation command section. A substrate transport robot operation control method for transporting a substrate by operating the robot. Two pieces of position data are previously set, that is, position data for an unloading operation for unloading a substrate and position data for a storage operation for unloading a substrate in the station, and the position for the unloading operation is set. The position data for the storage operation is obtained from the robot retreat operation distance from the station according to the data. The two position data are set so that the robot retreat operation distance from the station by the robot is reduced, and when the instruction from the robot operation instruction unit is to go to take out the substrate to the station, the removal is performed. When the operation position data is to place a substrate at the station, the storage operation position data is selected, and the substrate transfer robot is operated based on the selected position data to transfer the substrate. Board transfer robot operation control method. (2) Substrate transfer robot operation control device In accordance with an instruction from the robot operation instruction unit, a substrate transfer robot is provided for at least two stations based on position data for the substrate transfer robot operation set for each station. Is a substrate transfer robot operation control device for transferring a substrate by operating a substrate, and for taking out the substrate to each of the unloading and storing stations for performing both of taking out the substrate and placing the substrate by the robot. There are two types of data: a take-out operation data storage unit in which the take-out operation position data to go is set in advance, and a storage operation data storage unit in which the store-out operation position data to go to place the substrate in the station is set in advance. A data storage unit; And a data selection unit for selecting one position data from the two data storage units for the station in response to the instruction to transfer the substrate to the station. The position data and the storage operation position data are set so that the robot retreat operation distance from the station based on the storage operation position data is smaller than the robot retreat operation distance from the station based on the removal operation position data. When the instruction from the robot operation command section is to go to take out the substrate to the take-out / storage station, the position data in the take-out operation data storage section is stored. The position data of the operation data storage unit is selected by the data selection unit, and the selected Substrate transfer robot operation control device, characterized in that the substrate transfer by operating a substrate transport robot based on location data. The method and apparatus for controlling the operation of a substrate transfer robot according to the present invention are applicable to, for example, etching of a substrate to be processed such as a wafer by plasma or the like, film formation by plasma or the like, or ion implantation (including ion doping). A processing substrate is taken out from a certain station (for example, a station having a cassette containing a substrate to be processed), and is loaded into another station (for example, for loading and / or unloading a substrate connected to a substrate processing apparatus such as an ion implantation apparatus). Of the substrate transfer robot that carries the substrate into a new station (for example, a station having a processed substrate storage cassette).

In the method and the apparatus for controlling the operation of a substrate transfer robot according to the present invention, a substrate is removed from a robot operation command section in a removal storage station that performs both removal of a substrate and placement of a substrate by a robot. An instruction to go or an instruction to put the substrate is issued.

When the instruction from the robot operation commanding section is to go to take out the substrate to the take-out / storage station, the instruction for going out to take out the substrate from the two preset position data for that station is given. Select the take-out operation position data. Then, the robot is operated on the basis of the position data for taking out operation to take out the substrate, and the substrate is supported and retracted. The instruction from the robot operation command unit is
When the substrate is to be placed in the take-out / storage station, the storage operation position data for storing the substrate is selected from the two position data preset for the station. Then, the robot is operated based on the storage operation position data, the substrate is set aside, and the substrate is retracted in an empty state.

In the substrate transfer robot operation control device according to the present invention, the take-out operation position data and the storage operation position data are set (stored) in advance in the take-out operation data storage unit and the storage operation data storage unit, respectively. )
Have been. Of the position data for the take-out operation or the position data for the storage operation of the two data storage units,
Either one of the position data is selected in accordance with an instruction from the robot operation instruction unit, and this data selection is performed by the data selection unit.

In the method and apparatus for controlling the operation of the substrate transfer robot according to the present invention, when the two position data are set for each predetermined station, the two position data are set back by the robot retreating from the station by the unloading operation position data. The setting is made so that the robot retreat operation distance from the station based on the storage operation position data is smaller than the operation distance.

According to the method and apparatus for controlling the operation of the substrate transfer robot according to the present invention, for each of the unloading and storing stations, the position data for unloading operation for unloading the substrate to the station and the position of the substrate at the station are set. Since two position data with the storage operation position data for going are set in advance, when the robot is to take out the substrate to the extraction storage station, the robot performs the operation based on the extraction operation position data. The robot can be operated based on the storage operation position data when the substrate is to be placed on the unloading storage station. By doing so, when the robot moves the substrate to the unloading and storing station during the storing operation and retracts, the robot retracting operation distance can be made smaller than the robot retracting operation distance during the unloading operation. A small moving distance can be reduced. Accordingly, the time required for moving the substrate can be reduced, and when applied to a substrate processing apparatus (for example, an ion implantation apparatus), the substrate processing capability (substrate processing throughput) of the processing apparatus can be improved accordingly.

The substrate transfer robot which can be used in the method and apparatus for controlling the operation of the substrate transfer robot according to the present invention is not limited thereto, but includes a substrate holding arm, a telescopic drive mechanism for projecting and retracting the arm, and the arm. A mechanism having a rotary drive mechanism for turning around a predetermined central axis and a lifting drive mechanism for raising and lowering the arm in a predetermined central axis direction (elevation direction) can be exemplified.

The robot operation commanding unit includes:
A routine for operating a predetermined substrate transfer robot may be programmed, or an operator may issue a command to operate the substrate transfer robot. .

[0052]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view showing a schematic configuration of an ion implantation apparatus provided with an example of a substrate transfer robot operation control device (robot controller) for implementing the substrate transfer robot operation control method according to the present invention.

The ion implantation apparatus shown in FIG. 1 comprises an ion source 1, a mass analyzer 2 for selecting a predetermined ion type from an ion beam emitted by the ion source 1, and a predetermined ion type among ions exiting the analyzer 2. An analysis slit 3 selectively passing therethrough, an acceleration tube 4 for accelerating ions passing through the slit 3, a quadrupole lens (so-called Q lens) 5 for converging an ion beam accelerated by the acceleration tube 4, and ion implantation are performed. A scanning device 6 and an end station 7 for performing XY scanning of a predetermined region on the surface of a substrate (substrate to be processed) with an ion beam are provided.

A sequence controller (not shown) is connected to the ion source 1, the mass analyzer 2, the analysis slit 3, the accelerating tube 4, the quadrupole lens 5, and the scanning device 6, and these controllers perform sequence control. Is done. An end station controller 70 is connected to the end station 7, and a machine controller (not shown) is connected to each controller including the controller 70.

This machine controller is mainly composed of a computer, and sends an operation command to each controller to control the entire ion implantation apparatus. That is, in this ion implantation apparatus, an operation command input from the machine controller is input to each controller via communication,
Each controller operates a device connected to the controller in accordance with the instruction to perform ion implantation on the substrate.

The end station 7 includes a target chamber 71 for performing an ion implantation process on the substrate W, air lock chambers 721 and 722 (air lock stations C ₁ and C ₂ ) connected to the target chamber 71, and an air lock chamber. 72
1 and 722 are provided with a substrate transfer chamber 73 connected in series.

In the target chamber 71, the platen 711, the air lock chamber 721, and the platen 71, which can receive the substrate W to be processed, stand up and set it at the ion implantation position.
The vacuum-side substrate transfer robot 300 is capable of transferring a substrate between the airlock chamber 722 and the platen 711 during one period.

The air lock chambers 721 and 722 are provided with substrate placement parts 721a and 722a on which substrates can be placed, respectively. The substrate transfer chamber 73 has atmosphere-side substrate transfer robots 100 and 200 and an orientation flat aligner 733 ( Orientation flat aligner station B) and cassettes D1, D2
(Cassette stations A ₁ and A ₂ ) are arranged.

The orientation flat aligner 733 is mounted on the substrate
3a, the direction of the substrate W can be adjusted.

Each of the cassettes D1 and D2 has a plurality of stages of substrate storage units, and substrates can be stored in the respective substrate storage units. Here, the cassettes D1 and D2 have four upper and lower stages of substrate storage portions D1a, D1b, D1c and D1d, and substrate storage portions D2a, D2b, D2c and D2d, respectively. W is stored one by one.

Any of the stations (cassette stations A ₁ , A ₂ , orientation flat aligner station B, air lock stations C ₁ , C ₂ ) can be a part of the obstacle G to the robot operation.

In this ion implantation apparatus, ions are implanted into the substrate W to be processed in the first stage and the second stage.
That is, in the first stage, the substrate W stored in the cassette D1 is taken out of the cassette D1 by the atmospheric-side substrate transfer robot 100, and the orientation flat aligner 733 is provided.
After being transferred to the platen 711 by the atmosphere-side substrate transfer robot 200, transferred to the air lock chamber 721, transferred to the platen 711 by the vacuum-side substrate transfer robot 300, and then ion-implanted.
The ion-implanted substrate W1 is carried by the robot 300 to the airlock chamber 722, taken out of the airlock chamber 722 by the robot 100, and then returned (stored) to the original position of the cassette D1. This operation is continuously performed until there is no unprocessed substrate in the cassette D1. In the second stage, after the end of the first stage, the substrate W to be processed stored in the cassette D2 is taken out of the cassette D2, ion-implanted, and then the ion-implanted substrate W1 is placed in the original substrate storage portion of the cassette D2. It is returned to D2a (stored). This substrate transfer operation is the same as the case of the first stage except that the transfer direction of the substrate is reverse, and the robots 100 and 200 in the second stage are different from the operations of the robots 200 and 100 in the first stage. A substantially similar operation is performed.

FIG. 2 is a schematic configuration diagram of the atmosphere-side substrate transfer robots 100 and 200 shown in FIG. FIG. 2A is a schematic side view of the robots 100 and 200, and FIG. 2B is a schematic plan view of the robots 100 and 200. The robots 100 and 200 are of the same type, and parts having the same configuration and operation are denoted by the same reference numerals.

As shown in FIG. 2, the robots 100 and 200 include a substrate holding arm 110 and a telescopic drive mechanism 120 for projecting and retracting the arm 110.

The substrate holding arm 110 has its tip 11
A suction mechanism capable of sucking and supporting the substrate at 0a is provided, and the substrate can be supported from below by the tip 110a. The telescopic drive mechanism 120 includes two upper and lower arms 121,
122. The tip of the arm 121 is rotatably connected to the lower surface of the rear end of the substrate holding arm 110, and the rear end is rotatably connected to the upper surface of the tip of the lower arm 122. The rear end of the lower arm 122 is supported by the shaft 130a. The shaft 130a is supported by the robot drive base 1000.

A rotary drive mechanism 130 is built in the robot drive base 1000. The rotary drive mechanism 130 can turn the entire telescopic drive mechanism 120 and the substrate holding arm 110 to turn the substrate holding arm 110 to a target station.

The robot driving base 1000 also has a built-in elevating drive mechanism 140 for raising and lowering the shafts 130a supporting the arms 121 and 122 of the telescopic drive mechanism 120 and the substrate holding arm 110.

The telescopic drive mechanism 120 includes a lower arm 122
The motor includes a motor (not shown) that rotates the shaft about the shaft 130a and an interlocking mechanism (not shown) that projects and retracts the substrate holding arm 110 in conjunction with the rotation of the lower arm 122.

According to the telescopic drive mechanism 120, when the lower arm 122 is rotated in the CW direction in the figure, for example, as shown in FIG. CCW, whereby the substrate holding arm 110 moves the horizontal line CL perpendicular to the center line of the shaft 130a.
Project along. When the lower arm 122 is turned in the opposite direction, the substrate holding arm 110 moves along the line CL in FIG.
(B) retreats to the position exemplified by the solid line.

FIG. 3A shows the state of the arm when the substrate is put on the station, and FIG. 3B shows the state of the arm when the substrate is taken out from the station.

According to the robots 100 and 200, when the substrate W is to be placed on a certain station while the substrate holding arm 110 is supporting the substrate W, the arm 110 is first directed toward the station. Then, the arm 110 is turned by the rotation drive mechanism 130, and is raised or lowered by the lift drive mechanism 140, and is directed to the station. Next, as shown in FIG. 3A, the arm 110 is made to protrude by the telescopic drive mechanism 120 and then lowered by a predetermined distance by the elevating drive mechanism 140, whereby the substrate is placed on the substrate mounting surface (not shown). W is placed thereon, and then the arm 110 is further lowered and then retreated.

When the substrate W placed on a certain station is to be taken out, first, the arm 110 is turned by the rotary drive mechanism 130 so that the arm 110 is directed toward the station, and the lifting drive mechanism 140 is used. It is raised or lowered and directed to the station. Next, as shown in FIG.
At 20, the arm 110 is protruded and enters under the substrate W in the station. Then arm 110
Is slightly raised by the lifting drive mechanism 140, and the substrate W
Lift. In this state, the arm 110 retreats.

The shape of the distal ends of the substrate holding arms 110 and 200 is not limited to the one shown in the figure, but may be various types such as a bifurcated one.

The atmosphere-side substrate transfer robots 100 and 20
0 indicates at least two stations (in this case, the robot 100 is a cassette station A ₁ , an orientation flat aligner station B, an airlock station C ₂ , and a robot 200) in accordance with an instruction from a robot operation instruction section of the end station controller 70, which will be described later.
With respect to cassette station A ₂ , orientation flat aligner station B and airlock station C ₁ )
The substrate is transferred based on position data (for example, position data set by teaching) for the substrate transfer robot operation set for each station.

FIG. 4 is a perspective view of the atmosphere side substrate transfer robots 100 and 200, the cassettes D1 and D2 (cassette stations A ₁ and A ₂ ), and the orientation flat aligner 733 (the orientation flat alignment station B) shown in FIG.
2 shows a schematic block diagram of an end station controller 70 connected to 00, 200. FIG. The robot 10
Since 0 and 200 perform substantially the same operation, the robots 100 and 200 are represented by one robot in the figure.
Similarly cassette D1, D2 (the cassette station A _1, A ₂₎ is also represented by one of the cassette (cassette station).

The end station controller 70 includes a robot operation command unit CONT, and further includes robot controllers 81 and 82 which are examples of a substrate transfer robot operation control device. Robots 100 and 200
Are connected to the robot controllers 81 and 82, respectively, and the robot controllers 81 and 82 are respectively connected to the robot operation command unit CONT. As a result, the robots 100 and 200 move to the robot operation commanding unit CO.
Robot controllers 81, 8 according to instructions from NT
2 is controlled.

The telescopic drive mechanism 120, the rotary drive mechanism 130, and the elevating drive mechanism 140 in the robots 100 and 200 operate according to the instructions of the controllers 81 and 82, respectively.

FIGS. 5 and 6 are block diagrams showing the schematic structure of the robot controllers 81 and 82, respectively.

As shown in FIGS. 5 and 6, the robot controllers 81 and 82 have the robots 100 and 2 respectively.
00, each of the unloading and storing stations (both the robot 100 is a cassette station A ₁ , an orientation flat aligner station B, and an air lock station C) for both unloading and unloading substrates.
_{2. The} robot 200 takes out the data of the cassette station A ₂ , the orientation flat aligner station B, and the air lock station C ₁ ). It includes two data storage units (channels), a storage operation data storage unit (storage operation channel) in which storage operation position data for storing a substrate at the station is set in advance. In.

That is, the robot controller shown in FIG.
La 81 is a cassette station A ₁Retrieval about
Operation position data set in advance.
The channel 811a and the storage operation position data are preset.
Two channels with the stored storage operation channel 811b.
Retrieval of Oriflat Aligner Station B
Operation position data set in advance.
The channel 812a and the storage position data are set in advance.
Two channels with the stored storage operation channel 812b
And Airlock Station C_TwoTake out about
A take-out operation channel whose operation position data is set in advance
The channel 813a and the storage operation position data are set in advance.
Two channels with the storage operation channel 813b
Contains.

[0082] Then as the position data for the cassette station A _1, by lifting with pivoting the empty substrate holding arm 110 from a predetermined position station A
Toward ₁ , the pick-up operation position data for the robot operation of taking out and retreating the substrate W from a predetermined stage of the cassette D1, and the substrate holding arm 110 holding the processed substrate W1 are pivoted from a predetermined position and raised and lowered. is allowed towards the stations a _1, the two position data storage and operation channel 811a extraction each of the storing operation for the position data for the robot operation retracting let go Place the substrate W1 to a predetermined stage of the cassette D1 It is set in advance to two channels of the operation channel 811b.

As position data for the orientation flat aligner station B, a robot operation is performed in which the empty arm 110 is turned and moved up and down from a predetermined position toward the station B, and the station is moved to the station B to retrieve the substrate W on which the orientation flat is positioned, and is retracted. And a storage operation position for a robot operation in which the arm 110 holding the substrate W is turned and moved up and down from a predetermined position to the station B, and the substrate W is set to the station and retracted. Data and two position data are preset in the two channels of the takeout operation channel 812a and the storage operation channel 812b, respectively.

[0084] pivot position data relative to the air lock station C _2, the empty arm 110 from a predetermined position,
By lifting the directed to the station C _2, turning the take-out operation for the position data for the robot operation retracting by taken the processed substrate W1 from the station, the arm 110 holding the orientation flat positioning pre substrate W from the predetermined position, lifting is not directed to the station C _2, the substrate W
Two position data of the storing operation for the position data for the robot operation retracting let go every to station C ₂ is set in advance in the two channels of operation for the channel 813a extraction respectively storing operation channel 813b I have.

The robot controller 8 shown in FIG.
2, the two channels of the storing operation channel 821b that unloading operation for position data is preset dismounting operation channel 821a and the storage operation for position data preset for cassette station A _2,
Orientation flat aligner station B of the take-out operation for position data for the two channels and the air lock station C ₁ of a preset storing operation channel 822b that unloading operation channel 822a and the storage operation for position data is set in advance for It includes two channels: a take-out operation channel 823a in which the take-out operation position data is set in advance, and a storage operation channel 823b in which the take-out operation position data is set in advance.

Then, as position data for the cassette station A ₂ , the empty substrate holding arm 110 is turned from a predetermined position and is moved up and down so that the station A
Toward ₂ , the picking-up operation position data for the robot operation of taking out and retreating the substrate W from the predetermined stage of the cassette D2, and rotating the substrate holding arm 110 holding the processed substrate W1 from the predetermined position and moving up and down is allowed towards the stations a _2, the two position data storage and operation channel 821a extraction each of the storing operation for the position data for the robot operation retracting let go Place the substrate W1 to a predetermined stage of the cassette D2 It is set in advance to two channels of the operation channel 821b.

As position data for the orientation flat aligner station B, a robot operation is performed in which the empty arm 110 is turned and raised and lowered from a predetermined position to the station B, and the station is moved to the station B for retrieving the substrate W on which the orientation flat is positioned. And a storage operation position for a robot operation in which the arm 110 holding the substrate W is turned and moved up and down from a predetermined position to the station B, and the substrate W is set to the station and retracted. Data and two position data are preset in the two channels of the takeout operation channel 822a and the storage operation channel 822b.

[0088] pivot position data relative to the air lock station C _1, the empty arm 110 from a predetermined position,
The arm 110 holding the substrate W with the orientation flat positioned and the arm 110 holding the substrate W with the orientation flat is rotated from a predetermined position by moving up and down to the station C ₁ , and taking out the processed substrate W 1 from the station and moving it back. lifting is not directed to the station C _1, the substrate W
Two position data of the storing operation for the position data for the robot operation retracting let go every to station C ₁ is preset to two channels of operation for the channel 823a extraction respectively storing operation channel 823b I have.

On the basis of the position data set for each station, the rotation drive mechanism 130 stops the rotation of the substrate holding arm 110, and the elevating drive mechanism 140 raises or lowers the substrate holding arm 110.
0 causes the substrate holding arm 110 to protrude or retract.

The two position data for the cassette station A ₁ , the orientation flat aligner station B, and the airlock station C ₂ of the robot controller 81, and the two position data for the cassette station A ₂ , orientation flat aligner station B, and the airlock station C ₁ of the robot controller 82. Each of the two position data is set such that the robot retreat operation distance from the station by the storage operation position data is smaller than the robot retreat operation distance from the station by the removal operation position data. Figure 3
This will be described with reference to FIG.

When the substrate W placed on a certain station is to be taken out, the arm 110 is first directed to that station. At this time, the position of the arm 110 that does not support the substrate W is, as shown in FIG. 3B, a position where the arm 110 does not collide with an obstacle such as a part of the station due to turning or elevating (see FIG. 3B). In the middle Qa).
Next, the arm 110 protrudes and enters under the substrate W in the station, the arm 110 is raised, and lifts the substrate W, and in that state, the arm 110 retreats. At this time, the position of the arm 110 supporting the substrate W is at a position (Qb in the figure) where the substrate does not collide with an obstacle when the next arm 110 rotates or moves up and down.

When the substrate W is to be placed on a certain station while the substrate holding arm 110 is supporting the substrate W, the arm 110 is first directed to that station. Arm 110 supporting substrate W at this time
As shown in FIG. 3A, the position of
It is in a position (Pa in the figure) where there is no risk of colliding with an obstacle such as a part of the station by turning or ascending / descending 10. Next, the arm 110 protrudes and is then lowered a predetermined distance, whereby the substrate W is mounted on a substrate mounting surface (not shown). After that, the arm 110 is further lowered and then retreated. The retracted position of the arm 110 that does not support the substrate W at this time is a position (Pb in the drawing) where the arm 110 does not collide with an obstacle such as a part of the station in the next rotation or up and down movement.

As described above, the robot retreat operation distance from the station to the position Pb based on the storage operation position data is smaller than the robot retreat operation distance from the station to the position Qb based on the removal operation position data.

The robot controller 81 is the same as that shown in FIG.
As shown in (1), one position data is selected from the two channels 811a and 811b in response to the instruction from the robot operation command unit CONT, and the two channels 812a are selected.
And 812b, and a data selection unit 814 for selecting one position data from the two channels 813a and 813b.

As shown in FIG. 6, the robot controller 82 selects one position data from the two channels 821a and 821b in response to the instruction from the robot operation command unit CONT, and selects the two channels 822a and 822b.
A data selector 824 selects one position data from 2b and one position data from two channels 823a and 823b.

The robot operation command unit CONT is, but not limited to, programmed with a routine for operating a predetermined substrate transfer robot, and instructs the robot controller 81 to operate the station A ₁ . An instruction to take out the substrate W from a predetermined stage of the cassette D1 (or to the predetermined stage of the cassette D1
Place the go instruction), an instruction to go to place the substrate W to station B (or instruction to take out the orientation flat positioning pre substrate W from the station B), an instruction is taken out the processed substrate W1 from the station C ₂ (or stations C
An operation command corresponding to the instruction) to go to place the orientation flat positioning pre substrate W to _2, with respect to the robot controller 82, from a predetermined stage of the cassette D2 station A ₂ to a predetermined stage of the instruction (or cassette D2 takes out the substrate W process requires instructions to go place the substrate W1), an instruction to go to place the substrate W to station B (or instruction to take out the orientation flat positioning pre substrate W from the station B), an instruction is taken out the processed substrate W1 from the station C ₁ (or station C An operation command corresponding to an instruction to place the substrate W on which the orientation flat has been positioned at ₁ ) can be output at predetermined timing and by receiving a signal of robot operation completion based on one instruction from the controllers 81 and 82, respectively.

FIG. 7 shows an outline of an operation routine of the robot operation command unit CONT, and FIGS. 8 and 9 show an outline of an operation routine of the robot controllers 81 and 82, respectively.

In the operation routine of the robot operation command section CONT shown in FIG. 7, first, the arm 110 of each of the robots 100 and 200 is returned to the predetermined origin position (Step S).
0), a predetermined operation command is issued to the robots 100 and 200 (step S1). This command is
If the command is for the robot 200 (step S2), an operation command is sent to the controller 81 (step S3). If the command is for the robot 200, an operation command is sent to the controller 82 (step S4). Robot 10
In the case of an operation command command for 0, the controller 81
Waiting for a response from the robot operation completion signal (step S5). At this time, the controller 81 operates the robot 100 according to the operation command. In the case of an operation command command to the robot 200, the operation waits until there is a response to the robot operation completion signal from the controller 82 (step S6). At this time, the controller 8
2 operates the robot 200 according to the operation command. If there is a response from the controller 81 or 82 to the robot operation completion signal, it is determined whether or not the operation command has ended (step S7).
The process returns to the step, and ends when there is no next operation command.

Next, the operation routines of the robot controllers 81 and 82 shown in FIGS. 8 and 9 will be described. These operations are substantially the same, and will be described together below.

In the routine shown in FIG. 8 (FIG. 9), first, an operation command from the robot operation command unit CONT is received (step S31 (S41)). Next, the data selection unit 814 (824) selects one position data from two channels for each station in response to the operation command from the robot operation command unit CONT.

That is, cassette station A₁(A
_Two) Or an orientation flat alignment station
Operation command to air B (B) or air lock station
C _Two(C₁) Is determined to be an operation command (step
S32, S33 (S42, S43)), cassette stay
Option A₁(A_Two), The operation command
Is determined to be a take-out operation or a storage operation (step S32).
1 (S421)), if it is a take-out operation, take-out operation
Channel 811a (821a) (see FIG. 5 (FIG. 6)).
Station A)₁(A_TwoRetrieval for
Operation position data is selected (step S322 (S4
22)), if the storage operation, the storage operation channel 81
Station A at 1b (821b)₁(A_Two)
Select the storage position data for the storage operation (step S3
23 (S423)).

In the case of an operation command to the orientation flat aligner station B (B), it is determined whether the command is a take-out operation or a storage operation (step S331 (S431)).
The position data for the take-out operation for the station B (B) in (822a) is selected (step S332).
(S432)), in the case of the storing operation, the station B (B) in the storing operation channel 812b (822b).
Is selected (step S)
333 (S433)).

In the case of an operation command to the air lock station C ₂ (C ₁ ), it is determined whether the command is a take-out operation or a storage operation (step S341 (S441)).
The pick-up operation position data for the station C ₂ (C ₁ ) in (823a) is selected (step S34).
2 (S442)), in the case of the storing operation, the station C in the storing operation channel 813b (823b).
_{2 The} storage operation position data corresponding to (C ₁ ) is selected (step S343 (S443)).

The robot 100 (200) is operated based on the position data thus selected (step S35).
(S45)), and sends a robot operation completion signal to the robot operation command unit CONT (step S36 (S4)).
6)).

In the above-described ion implantation apparatus, first, the overall operation of implanting ions into a substrate to be processed will be described, and then the substrate transport operation of the atmosphere-side substrate transport robots 100 and 200 by the robot controllers 81 and 82 will be described.

According to this ion implantation apparatus, when the ions are implanted into the substrate W to be processed, the substrates W to be processed stored in the substrate storage portion D1a of the first stage from the top of the cassette D1 are placed.
Is taken out by the atmosphere-side substrate transfer robot 100,
After being conveyed to the orientation flat aligner 733, it is placed on the substrate placement portion 733a of the orientation flat aligner 733, where the orientation of the substrate is positioned (oriflat positioning).

The substrate W positioned by the orientation flat aligner 733 is taken out by the atmospheric-side substrate transfer robot 200, transported to the air lock chamber 721, and then placed in the substrate placement section 721a of the air lock chamber 721. The pressure in the air lock chamber 721 is reduced to the same level as in the target chamber 7. At this time, the next substrate W to be processed is taken out from the substrate storage section D1b of the second stage from the top of the cassette D1 by the atmospheric-side substrate transport robot 100 and transported to the orientation flat aligner 733.

The decompressed substrate W in the air lock chamber 721 is transferred to the platen 711 by the vacuum-side substrate transfer robot 300 and set on the platen 711.
In order to perform ion implantation, the platen 711 raises the substrate W and rotates it steadily. Then, ions are implanted into the substrate W. At this time, the next substrate W is taken out from the orientation flat aligner 733 by the atmosphere-side substrate transfer robot 200, transferred to the air lock chamber 721, and further processed from the third substrate storage portion D1c from the top of the cassette D1. The substrate W is taken out by the substrate transfer robot 100 on the atmosphere side and transferred to the orientation flat aligner 733.

The substrate W1 in the target chamber 71 into which the ions have been implanted is carried by the vacuum-side substrate transfer robot 300 to the substrate disposing portion 722a of the airlock chamber 722, where the airlock chamber 722 is vented to the atmosphere. At the same time, the next substrate W is set on the platen 711 by the vacuum-side substrate transfer robot 300 from the air lock chamber 721 and ion-implanted. At this time, the next substrate W is further taken out from the orientation flat aligner 733 by the atmosphere-side substrate transfer robot 200, transferred to the air lock chamber 721, and further transferred from the fourth substrate storage portion D1d from the top of the cassette D1. The substrate W to be processed is taken out by the atmosphere-side substrate transfer robot 100 and transferred to the orientation flat aligner 733.

The substrate W1 in the air lock chamber 722 is taken out by the atmospheric-side substrate transfer robot 100 and transferred to the cassette D1, and then returned to the original position of the cassette D1, that is, to the first-stage substrate storage section D1a from the top. Returned (stowed). This operation is continuously performed until there is no unprocessed substrate in the cassette D1, and the first stage is completed. When the first stage ends, the process moves to the second stage.

In the second stage, the substrate W to be processed stored in the cassette D2 is moved to the substrate storage section D2 of the cassette D2.
After being taken out from a to D2d and ion-implanted, the ion-implanted substrate W1 is returned (stored) to the original substrate storage units D2a to D2d of the cassette D2. As described above, the substrate transport operation is the same as that of the first stage except that the substrate transport direction is the reverse direction, and thus the description is omitted here.

Next, the substrate transfer operation of the robots 100 and 200 by the controllers 81 and 82 will be described.
Here, in the substrate transfer operation of the robots 100 and 200 in the first stage, the substrate storage section D1a of the cassette D1 is provided.
Of the substrate W stored in the substrate storage portion D1a until the substrate W is returned to the original substrate storage portion D1a, and the description of the other substrate transfer operations is omitted.

First, an operation command for taking out the substrate W to be processed from the substrate storage section D1a of the cassette D1 is sent from the robot operation command section CONT to the controller 81 (see step S3 in FIG. 7).

[0114] The controller 81 determines that the operation command to the cassette station A ₁ (see step S32~S33 in FIG. 8), the cassette channel 811a from the two channels of the channel 811a and the channel 811b (see FIG. 5) selecting the position data for taking out operation for stations a ₁ by the data selection unit 814 (see step S322 of FIG. 8). Pivoting the arm 110 of the first robot 100 based on the positional data so as to face towards the station A _1, and, by lifting, it directs to the station A _1. The position of the arm 110 at this time is a position where the arm 110 is not likely to collide with the obstacle G by turning or lifting (Q in FIG. 3B).
a). Then, enter under the substrate W at station A ₁ is protruded arm 110, the arm 110
Is raised slightly, the substrate W is lifted, and the arm 110 is retracted in that state. The position of the arm 110 at this time is a position where the substrate W is not likely to collide with the obstacle G when the next arm 110 rotates or moves up and down (Qb in FIG. 3B).
It is in. Thereafter, a robot operation completion signal is sent to the robot operation command section CONT (see step S36 in FIG. 8).

Next, the robot operation command section CONT sends to the controller 81 an operation command for placing the substrate W to be processed on the substrate mounting section 733a of the orientation flat aligner 733.

The controller 81 determines that it is an operation command to the orientation flat aligner station B (see steps S32 to S33 in FIG. 8),
12a and channel 812b (FIG. 5
(Refer to step S333 in FIG. 8) from the data selection unit 814 to select the storage operation position data of the channel 812b for the orientation flat aligner station B. Based on the position data, first, the arm 110 is turned and moved up and down so that the arm 110 is directed toward the orientation flat aligner station B, and is directed to the station B. The position of the arm 110 at this time is
Is in a position (Pa in FIG. 3A) where there is no risk of colliding with the obstacle G due to the turning or lifting and lowering of the arm 110. Then
The arm 110 is made to protrude, and then lowered for a predetermined distance, whereby the substrate W is mounted on the substrate mounting portion 733a. After that, the arm 110 is further lowered slightly, and then retracted. The position of the arm 110 at this time is a position (Pb in FIG. 3A) where the arm 110 does not collide with the obstacle G when the next arm 110 rotates or moves up and down.

The orientation of the substrate W placed on the substrate placing portion 733a of the orientation flat aligner 733 in this manner is positioned on the orientation flat.

Next, the robot operation command section CONT sends an operation command to the controller 82 to take out the substrate W on which the orientation flat is positioned in the substrate mounting section 733a of the orientation flat aligner 733.

The controller 82 determines that the command is an operation command for the orientation flat aligner station B (see steps S42 to S43 in FIG. 9).
22a and channel 822b (FIG. 6
9), the data selecting section 824 selects position data for taking out the channel 822a from the orientation flat aligner station B (see step S432 in FIG. 9). Based on the position data, the arm 110 of the robot 200 takes out the orientated flatbed substrate W from the station B in the same manner as the operation based on the above-mentioned position data for the take-out operation (see FIG. 3B), and sends a robot operation completion signal to the robot. Send to operation command part CONT.

Next, the robot operation command section CONT sends the controller 82 the board placement section 72 of the air lock chamber 721.
An operation command for placing the substrate W on which the orientation flat is positioned is transmitted to 1a.

[0121] The controller 82 determines that the operation command for the air lock station C ₁ (FIG. 9
In steps S42 to S43), channel 823a
And channel 823b (see FIG. 6).
From airlock station C _{1 on} channel 823b
Is selected by the data selection unit 824 (see step S443 in FIG. 9). Based on the position data is arranged in the station C ₁ to the orientation flat positioning already substrate W by the arm 110 of the robot 200 in the same manner as the operation by the closing operation for the position data (see FIG. 3 (A)), the robot operation completion signal To the robot operation command unit CONT.

Then, the substrate W to be processed is transferred from the airlock station C ₁ to the platen 711 by the vacuum-side substrate transfer robot 300 and ion-implanted, and then transferred to the air lock station C ₂ .

Next, the robot operation command section CONT sends the controller 81 a board placement section 72 of the airlock chamber 722.
An operation command for taking out the processed substrate W1 in 2a is transmitted.

[0124] The controller 81 determines that the operation command for the air lock station C ₂ (FIG. 8
, Steps S32 to S33), channel 813a
And channel 813b (see FIG. 5).
From air lock station C _{2 on} channel 813a
Data for the take-out operation for
4 is selected (see step S342 in FIG. 8). Removed from the station C ₂ processed substrates W1 by the arm 110 of the robot 100 based on the positional data in the same manner as the operation by the take-out operation for the position data (see FIG. 3 (B)), the robot robot operation completion signal Send to operation command part CONT.

Next, an operation command for placing the processed substrate W1 in the substrate storage section D1a of the cassette D1 is sent from the robot operation command section CONT to the controller 81.

[0126] The controller 81 determines that the operation command to the cassette station A ₁ (see step S32~S33 in FIG. 8), the cassette channel 811b from the two channels of the channel 811a and the channel 811b (see FIG. 5) selecting the position data storing operation for stations a ₁ by the data selection unit 814 (see step S323 of FIG. 8). Based on the position data stored in the station A ₁ and the processed substrate W1 by the arm 110 of the robot 100 in the same manner as the operation by the closing operation for the position data (see FIG. 3 (A)), a robot operation completion signal Robot operation command section CO
Send to NT.

Although the description is omitted here, other substrate transport operations are performed in the same manner.

The robot controller 81 according to the present invention
According to (82), each unloading and storing station A ₁ ,
Regarding B and C ₂ (A ₂ , B and C ₁ ), the position data for unloading operation for unloading the substrate to the station and the position data for storage operation for unloading the substrate to the station are described. Since two position data are set in advance, when the robot 100 (200) goes to the station to take out the substrate, the robot 100 (200) transfers the substrate to the station based on the take-out operation position data. When the robot 100 is to be placed, the robot 100 (200) can be operated based on the storage operation position data. By doing so, the robot 10
When the robot 0 (200) retracts the substrate at the station during the storing operation and retracts, the robot retracting operation distance can be made smaller than the robot retracting operation distance during the unloading operation, and the robot 100 (200) is unnecessary. A small moving distance can be reduced. As a result, the time required for moving the substrate can be reduced, and the substrate processing capability (substrate processing throughput) of the ion implantation apparatus can be improved accordingly.

It is to be noted that the substrate used for the ion implantation apparatus and the like is currently 8 inches in size, but this size is expected to increase in the future. In the method and apparatus for controlling the operation of a substrate transfer robot according to the present invention, when applied to a substrate processing apparatus such as an ion implantation apparatus, a robot for taking out a substrate with a robot and for placing the substrate as the substrate size increases. By increasing the difference between the retreating distances, in other words, reducing the unnecessary moving distance of the robot and shortening the time required for moving the substrate, it is possible to improve the substrate processing capability of the ion implantation apparatus and the like. it can.

[0130]

As described above, according to the present invention, the position data for the operation of the substrate transfer robot set for each of the at least two stations is specified for each of the at least two stations in accordance with the instruction from the robot operation command unit. A robot operation control method and apparatus for operating a substrate transfer robot to transfer a substrate based on a substrate processing apparatus, wherein the unnecessary movement distance of the robot can be reduced to reduce the time required for substrate movement, and a substrate processing apparatus ( For example, when applied to an ion implantation apparatus, a substrate transfer robot operation control method and apparatus capable of improving the substrate processing capability (substrate processing throughput) of the processing apparatus can be provided.

[Brief description of the drawings]

FIG. 1 is a plan view showing a schematic configuration of an ion implantation apparatus provided with an example of a substrate transfer robot operation control device (robot controller) for implementing a substrate transfer robot operation control method according to the present invention.

FIG. 2 is a schematic configuration diagram of an atmosphere-side substrate transfer robot shown in FIG. 1; FIG. 2A is a schematic side view of the robot;
FIG. 2B is a schematic plan view of the robot.

FIG. 3A shows a state of an arm when a substrate is put to a station, and FIG. 3B shows a state of an arm when a substrate is taken out to a station.

4 is a perspective view of an atmosphere-side substrate transfer robot, a cassette (cassette station), and an orientation flat aligner (orient flat alignment station) shown in FIG. 1, and a schematic block diagram of an end station controller connected to the robot.

FIG. 5 is a block diagram of a schematic configuration of a robot controller.

FIG. 6 is a block diagram of a schematic configuration of a robot controller.

FIG. 7 is a flowchart showing an outline of an operation routine of a robot operation command unit.

FIG. 8 is a flowchart showing an outline of an operation routine of the robot controller.

FIG. 9 is a flowchart showing an outline of an operation routine of the robot controller.

FIG. 10 is a plan view illustrating a schematic configuration of an example of an ion implantation apparatus.

11A is a schematic side view of the robot shown in FIG. 10, and FIG. 11B is a schematic plan view of the robot shown in FIG.

FIG. 12A shows a state of an arm when a substrate is put to a station, and FIG. 12B shows a state of an arm when the substrate is taken out to a station.

FIG. 13 is an enlarged view of the atmosphere-side substrate transfer robot shown in FIGS. 10 and 11 and a peripheral portion thereof.

FIG. 14A shows a retreat state of a substrate holding arm when a substrate is present at the tip of the arm, and FIG.
FIG. 7B shows the arm retracted when there is no substrate at the tip of the arm.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Ion source 2 Mass analyzer 3 Analysis slit 4 Accelerator tube 5 Quadrupole lens (so-called Q lens) 6 Scanning device 7 End station 70 End station controller 71 Target room 711 Platen 721,722 Air lock room 721a, 722a Air lock room 721, 722 Substrate placement section 73 Substrate transfer chamber 733 Orifla aligner 733a Substrate placement section of the orientation flat aligner 81, 82 Substrate transfer robot operation control device 811a, 812a, 813a Extraction operation data storage section (channel) 811b, 812b, 813b Storage operation data storage unit (channel) 821a, 822a, 823a Extraction operation data storage unit (channel) 821b, 822b, 823b Storage operation data storage unit (channel) 814 , 824 Data selection unit 100, 200 Atmosphere side substrate transfer robot 110 Substrate holding arm 110a Tip end of substrate holding arm 110 120 Telescopic drive mechanism 121 Upper arm 122 Lower arm 130 Rotary drive mechanism 130a Axis 140 Elevation drive mechanism 300 Vacuum Side substrate transfer robot 1000 Robot drive table A, A ₁ , A ₂ cassette station B Orifice aligner station C, C ₁ , C ₂ air lock station D 1, D 2 cassette D 1 a, D 1 b, D ₁ c, D ₁ d Substrate storage section D 2 a of cassette D 1, D2b, D2c, D2d Substrate storage section of cassette D2 CL Horizontal line orthogonal to the center line of axis 130a CONT Robot operation command section E Rotation range of substrate supported by arm 110 F Rotation range of arm 110 supporting substrate G each Obstacle such as a part of the station H Distance where the arm 110 is retracted uselessly P1 Position where the arm 110 avoids collision with the obstacle G Pa, Qb Position where the substrate W is not likely to collide with the obstacle Pb, Qa Position where the arm 110 does not collide with an obstacle W Plate to be processed W1 Processed substrate

Continued on the front page F term (reference) 3F059 AA01 BA04 BA08 CA06 DA08 FA03 FB02 FC01 FC02 FC08 5F031 CA02 DA08 FA01 FA07 FA11 FA15 GA08 GA45 GA47 GA49 GA50 MA03 MA07 MA31 NA05 NA07 PA02 PA16 PA30 9A001 HH19 HH34

Claims (2)

[Claims] An operation of a substrate transfer robot is performed for at least two stations based on position data for the operation of the substrate transfer robot set for each of the stations in accordance with an instruction from a robot operation instruction section. A method of controlling the operation of a substrate transfer robot for transferring a substrate, wherein, for each of the unloading and storing stations that perform both unloading and unloading of the substrate by the robot, unloading the substrate to the station as the position data. Position data for a take-out operation to go to
Two position data are set in advance with the storage operation position data for placing the substrate in the station, and the storage operation position is determined from the robot retreat operation distance from the station according to the removal operation position data. The two position data are set so that the robot retreat operation distance from the station according to the data is reduced, and when the instruction from the robot operation instruction unit is to go to take out the substrate to the station, the removal is performed. When the operation position data is to place a substrate at the station, the storage operation position data is selected, and the substrate transfer robot is operated based on the selected position data to transfer the substrate. Board transfer robot operation control method. 2. The method according to claim 1, wherein the operation of the substrate transfer robot is performed on at least two stations based on the position data for the operation of the substrate transfer robot set for each of the stations in accordance with an instruction from the robot operation command unit. A substrate transfer robot operation control device for transferring a substrate, wherein the robot is configured to take out the substrate and place the substrate. Two data storage units, a take-out operation data storage unit in which operation position data is set in advance, and a storage operation data storage unit in which storage operation position data for setting a substrate in the station are set in advance. And transporting the substrate from the robot operation command section to any of the take-out and storage stations. And a data selection unit for selecting one position data from the two data storage units for the station in response to the instruction when the instruction is received, the pick-up operation position data and the storage operation position The data is set so that the robot retreat operation distance from the station by the storage operation position data is smaller than the robot retreat operation distance from the station by the removal operation position data. When the instruction is to go to take out the substrate to the take-out / storage station, the position data in the take-out operation data storage section is stored. Data is selected by the data selection unit, and based on the selected position data, Substrate transfer robot operation controller operates the plate transfer robot characterized by the substrate transport.