JP2001257221A - Method of manufacturing electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device, where elements can be mounted on an element mounting surface in a package without causing trouble such as damage and without enhancing a mounting space in area. SOLUTION: An element mounting surface 2a is provided inside a package 1 having a cavity structure, and elements 10 and 20 are fixed on the element mounting surface 2a through the adhesive agent. After the first element 10 is pressed and fixed on the element mounting surface 2a inside the package with a pressing jig, the second element 20 is pressed and fixed on the element mounting surface 2a adjacent to the first element 10 with another pressing jig. A two-plane pyramid collet 30 is used as the pressing jig used for fixing the second element 20 on the element-mounting surface 2a, the position of the collet 30 is so set as to enable the ridge 32 of a tapered plane 31 to make a right angle with the side of the first element 10, and the second element 20 is pressed down by the collect 30 so as to restrain the side 30a of the collect 30 from protruding toward the first element 10 beyond the side of the second element 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic device in which a plurality of devices are fixed on a device mounting surface in a package having a cavity structure.

[0002]

2. Description of the Related Art When two or more elements are bonded and fixed to an element mounting surface in a package having a cavity structure, a flat collet or a two-sided pyramid collet is used as a holding jig for mounting the elements. Sometimes. The flat collet has a flat pressing surface larger than the area of the element, and presses the element against the element mounting surface with the pressing surface. On the other hand, the dihedral pyramid collet has a mountain-shaped tapered surface at the tip end for gripping the element, and is mounted by pressing two opposing side edges of the element with the tapered surface. In particular, in the case of a dihedral pyramid collet, the surface of the element is not pressed, so that if it is applied to a mount of an element having an electrode or the like formed on the surface like a surface acoustic wave element, it has a feature that the electrode is not damaged. . In addition, in the case of the dihedral pyramid collet, since the two side edges of the element are positioned, the collet has a function of preventing the element from laterally shifting when the element is pressed.

[0003]

When a plurality of elements are mounted on a package using such a collet, the first element can be mounted without any problem. However, when mounting the second and subsequent elements, the end of the collet is required. The portion may come into contact with the previously mounted element, causing a defect such as breakage. As a countermeasure, there is a method of increasing the interval between the mounting positions of the elements. However, this has a problem that the mounting space of the elements becomes large and the package becomes large.

Accordingly, an object of the present invention is to mount a plurality of devices on a device mounting surface in a package without causing defects such as breakage and increasing the space for mounting the devices. An object of the present invention is to provide a method for manufacturing an electronic device.

[0005]

According to one aspect of the present invention, there is provided an electronic device in which a plurality of elements are fixed via an adhesive to an element mounting surface in a package having a cavity structure. The step of pressing and fixing the first element on the element mounting surface of the package by the pressing jig, and the step of pressing the second element to the position of the element mounting surface of the package close to the first element. Pressing and fixing with a tool, using a dihedral pyramid collet as a holding jig for fixing the second element to the element mounting surface, the orientation of the collet when pressing the second element, The ridge line of the tapered surface gripping the second element is oriented in a direction perpendicular to the side of the first element, and the side of the collet facing the first element is the first side from the side of the second element. Press without protruding to the element side It provides a method of manufacturing an electronic device according to claim. According to a second aspect of the present invention, there is provided a method of manufacturing an electronic device in which a plurality of elements are fixed via an adhesive to an element mounting surface in a package having a cavity structure. A step of pressing and fixing the second element to the mounting surface by a pressing jig; and a step of pressing and fixing the second element to a position of the element mounting surface of the package adjacent to the first element by the pressing jig. Wherein the thickness of the first element is equal to or greater than the thickness of the first element, and the element mounting surface of the second element is higher than the element mounting surface of the first element. A manufacturing method is provided. Further, according to a third aspect of the present invention, there is provided a method for manufacturing an electronic device in which a plurality of elements are fixed via an adhesive to an element mounting surface in a package having a cavity structure, wherein the first element is mounted on the package. A step of pressing and fixing the second element to the mounting surface by a pressing jig; and a step of pressing and fixing the second element to a position of the element mounting surface of the package adjacent to the first element by the pressing jig. Wherein the thickness of the first element is greater than the thickness of the first element, and the element mounting surface of the first element and the element mounting surface of the second element are substantially at the same height. provide.

In the case of the first aspect of the present invention, when the second element is fixed to the element mounting surface using a dihedral pyramid collet,
The lower edge of the tapered face of the collet will project laterally from the second element. At this time, the direction of the collet is set so that the ridge line of the tapered surface gripping the second element is in a direction perpendicular to the side of the first element, and the side face of the collet facing the first element is the second side. Since the pressing is performed so as not to protrude from the side surface of the element toward the first element side, even if the first element and the second element are arranged close to each other, the danger of the collet contacting the first element can be avoided. . In the case of claim 2, the second
The element thickness of the second element is equal to or greater than the thickness of the first element, and the element mounting surface of the second element is higher than the element mounting surface of the first element. Is higher than the upper surface of the first element. Therefore, when pressing the second element with the collet, it is possible to avoid the risk that the tip of the collet contacts the first element. further,
In the case of claim 3, the element mounting surface of the first element and the element mounting surface of the second element are substantially the same height, but the thickness of the second element is larger than the thickness of the first element. Is thicker, the upper surface of the second element is located higher than the upper surface of the first element, and when the second element is pressed using the collet, the tip of the collet becomes the first element. The risk of contact with the element can be avoided.

As a fourth aspect, it is desirable to use a dihedral pyramid collet as a holding jig for pressing and fixing the element to the position of the element mounting surface of the package. In the case of a dihedral pyramid collet, the surface of the element is not pressed, so that the electrodes on the surface of the element do not need to be damaged, and the side edges of the element are positioned. is there.

Preferably, the element is a surface acoustic wave element. In the case of a surface acoustic wave device, when the back surface of the surface acoustic wave device is adhered to the element mounting surface via an adhesive, it is necessary to press and adhere to the element mounting surface using a pressing jig. In this case, by applying the present invention, there is an advantage that a plurality of surface acoustic wave elements can be efficiently mounted in a narrow space, and the upper surface of the surface acoustic wave element does not have to be damaged. Further, when the first and second elements are surface acoustic wave elements having different characteristics from each other, a dual filter can be configured.

[0009]

1 and 2 show a surface acoustic wave device as an example of an electronic device according to the present invention. This surface acoustic wave device includes a package 1 having a flat element mounting surface 2a.
And two surface acoustic wave elements 10 and 20 fixed to the element mounting surface 2a of the package 1 to constitute a dual filter. The package 1 is formed in a cavity shape by laminating a bottom plate 2 made of ceramic or the like and side walls 4, 5, 6, and extends from an electrode pad formed inside the package 1 to a lower surface outside the package 1. And a plurality of external connection electrodes 7a to 7
j is formed. In this embodiment, the electrode pads of the external connection electrodes 7 a to 7 j are formed on the upper surface of the side wall 4. A cover plate 8 made of ceramic, metal, or the like is fixed to the upper surface of the uppermost side wall portion 6 by bonding, seam welding, brazing, or the like, and the inside is hermetically sealed.

The surface acoustic wave elements 10 and 20 have different characteristics from each other, and are pressed and fixed to the element mounting surface 2a of the package 1 via an adhesive 3. As the adhesive 3, an epoxy-based adhesive, a silicone-based adhesive, or the like can be used. In the surface acoustic wave devices 10 and 20, IDT electrodes 11 and 21 and bonding electrodes 12 and 22 made of aluminum, an aluminum alloy, or the like are formed on the upper surface of a piezoelectric substrate made of a piezoelectric material such as lithium tantalate, lithium niobate, or quartz. The bonding electrodes 12, 22 and the electrode pads 7a to 7j of the package 1
Are individually connected via bonding wires 9. That is, the input / output bonding electrodes 12, 22 and the ground bonding electrodes 12, 22 of the two surface acoustic wave elements 10, 20 are individually connected to the electrode pads 7a to 7j, respectively. Can be configured. The surface acoustic wave devices 10,
20 is not limited to an IDT electrode formed on a piezoelectric substrate, but may be formed on an insulating substrate such as alumina or glass.
Such a piezoelectric thin film may be formed. In this embodiment, as shown in FIG. 2, the vertical and horizontal dimensions L1 and D1 of the first surface acoustic wave element 10 are different from the vertical and horizontal dimensions L2 and D2 of the second surface acoustic wave element 20. In particular, the second element 20
In the case of, the width D2 is set to be a rectangle shorter than the length L2. The second element 20 has a long side that is the first side.
The element 10 is fixed in a direction orthogonal to the side of the element 10.

Here, a method of mounting the surface acoustic wave elements 10 and 20 in the surface acoustic wave device having the above configuration will be described.
This will be described with reference to FIGS. First, the first element 10 is mounted on the element mounting surface 2 a via the adhesive 3. At this time, the element 10 is pressed against the element mounting surface 2a using a holding jig similar to the dihedral pyramid collet 30 described later and mounted. Next, at the position of the element mounting surface 2a of the package 1 close to the first element 10, the adhesive 3 is interposed.
The second element 20 is mounted using a dihedral pyramid collet 30 as shown in FIG. At this time, the direction of the collet 30 is changed to the ridge line 32 of the tapered surface 31 that grips the second element 20.
Is perpendicular to the side of the first element 10. That is, the tapered surface 31 of the collet 30 is set in a direction that does not contact the first element 10. And the first element 1
The side surface 30 a of the collet 30 facing the zero side is the second element 20.
And is pressed so as not to protrude from the side surface 20a toward the first element 10 side. As shown in FIG. 4, the dihedral pyramid collet 30 has a mountain-shaped tapered surface 31 at the lower end thereof, and is mounted by pressing opposite side edges of the element 20 with the tapered surface 31. In this embodiment, the collet 30 does not protrude from the element 20.
The length S of the ridge line 32 of the tapered surface 31 is the length L2 of the element 20.
Designed shorter. The amount of protrusion d of the tapered surface 31 protruding from the element 20 is smaller than the gap between the element 20 and the side wall 4 of the package 1, and is desirably 100 to 350 μm.

When the second element 20 is pressed and adhered to the element mounting surface 2a by the collet 30 as described above, the collet 3
Since only the two side edges of the element 20 are pressed by the zero tapered surface 31 and the surface of the element 20 is not pressed, the IDT electrode 21 formed on the surface is not damaged. In addition, element 2
Since the two side edges of the element 20 are positioned, it is possible to prevent the element 20 from laterally shifting when the element 20 is pressed. Then, the direction of the collet 30 is pressed so that the ridge line 32 of the tapered surface 31 that grips the second element 20 is perpendicular to the side of the adjacent first element 10. Does not project in the direction of the first element, and the side surface 30a of the collet 30
Does not protrude to the element 10 side of the
The risk of contact with the element 10 can be avoided. In particular, by making the dimension S of the collet 30 shorter than the length L2 of the second element 20 as in the embodiment, the side face 30 of the collet 30
a can be reliably prevented from protruding from the second element 20 toward the first element, and interference between the collet 30 and the first element 10 can be prevented. Further, the first element 10 and the second element 2
0 can be mounted close to each other, so that there is an advantage that the mounting space of the element can be reduced and the size of the package can be reduced.

In FIGS. 3 and 4, as a two-sided pyramid collet,
Although the collet 30 having the mountain-shaped tapered surface 31 is shown, the present invention is not limited to this, and as shown in FIG.
4 may be a collet 33 provided only on both sides. In this case, two ridge lines 35 of the tapered surface 34 exist in parallel.

FIG. 6 shows a second embodiment of the mounting method of the two elements 10 and 20. In this embodiment, the thickness of the second element 20 mounted later is larger than that of the first element 10 mounted earlier. In this case, even if the dihedral pyramid collet 30 is pressed with its tapered surface 31 facing the first element 10 and pressing the second element 20,
The contact of the lower end of the collet 30 with the first element 10 can be avoided. In this embodiment, the thickness of the first element 10 is 0.15 mm, the thickness of the second element 20 is 0.35 mm, and a step of 0.2 mm is provided on the upper surfaces of the two elements 10 and 20. . Therefore, if the amount h of the tapered surface 31 of the collet 30 projecting downward from the upper surface of the second element 20 is less than 0.2 mm, the collet 30
Can be prevented from coming into contact with the first element 10. In this case, the space for the amount of protrusion of the tapered surface 31 of the collet 30 from the second element 20 in the lateral direction can be reduced, so that the mounting space between the elements can be reduced, and the size of the package 1 can be reduced. Is possible. Further, since the direction of mounting the collet 30 is not restricted, there is an advantage that the mounting workability is improved.

FIG. 7 shows a third embodiment of the mounting method of the two elements 10 and 20. In this embodiment, the element mounting surface 2c of the second element 20 mounted later is higher than the element mounting surface 2b of the first element 10 mounted earlier. Note that the first element 10 and the second element 2
The thickness of 0 may be the same, or the second element 20 may be thicker than the first element 10. Also in this case, even if the taper surface 31 of the collet 30 is directed toward the first element 10 and the second element 20 is pressed, the lower end of the collet 30 is prevented from contacting the first element 10. be able to. In this embodiment, the element mounting surface 2c is higher than the element mounting surface 2b by 0.2 mm. Therefore,
If the amount h of the tapered surface 31 of the collet 30 projecting downward from the upper surface of the second element 20 is less than 0.2 mm, the lower end of the collet 30 can be prevented from contacting the first element 10. Also in this case, the package 1 can be reduced in size, and the mounting direction of the collet 30 is not restricted, so that there is an advantage that the mounting workability is improved.

In the above embodiment, an example in which the surface acoustic wave element is mounted in the package has been described, but a semiconductor chip or a piezoelectric element may be used instead of the surface acoustic wave element. However, it is desirable to use an element having a portion on the front surface where contact of an electrode or the like is obstructed and a back surface adhered and fixed to a package. Also,
The present invention is not limited to the case where two elements are mounted in the package, and three or more elements may be mounted. In the above embodiment, the device is mounted using a dihedral pyramid collet, but it is also possible to use a planar collet. In particular, when the surface of the element is protected by some kind of coating, there is no problem even if a flat collet is used.

[0017]

As is apparent from the above description, claim 1
According to the invention described in (1), the second facet is formed by using the dihedral pyramid collet
When the element is fixed to the element mounting surface, the orientation of the collet is set so that the ridge line of the tapered surface gripping the second element is in a direction perpendicular to the side of the first element, and Is pressed so that the side face of the collet facing the first element does not protrude from the side face of the second element toward the first element side, so that the danger of the collet contacting the first element can be avoided, and defects such as breakage can be eliminated. . In addition, since the first element and the second element can be arranged close to each other, a plurality of elements can be efficiently arranged in a narrow space, and the package can be downsized. According to the second and third aspects of the present invention, the element mounting surface of the second element is positioned higher than the element mounting surface of the first element, or the thickness of the second element is set to the first element. Thickness is greater than the element thickness, so that when mounting the element with a collet, it is possible to prevent the collet from contacting the element that was mounted first, and to efficiently arrange multiple elements in a narrow space and reduce the size of the package. . Furthermore, since it is not necessary to consider the direction of the collet, there is an advantage that the mounting workability is improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a surface acoustic wave device using a manufacturing method according to the present invention.

FIG. 2 is a plan view of the surface acoustic wave device shown in FIG. 1 with a cover plate removed.

FIG. 3 is a partial perspective view showing a state in which a second element is mounted.

FIGS. 4A and 4B are a front view and a side view showing a state of mounting a second element. FIGS.

FIG. 5 is a front view of another example of the dihedral pyramid collet.

FIG. 6 is a sectional view of a second embodiment of the manufacturing method according to the present invention.

FIG. 7 is a sectional view of a third embodiment of the manufacturing method according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Package 2a, 2b, 2c Element mounting surface 10, 20 Surface acoustic wave element 30 Dihedral pyramid collet 31 Tapered surface 32 Ridge line

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Shingo Iwasa 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto F-term in Murata Manufacturing Co., Ltd. 5F047 FA08 5J097 AA29 AA34 BB11 HA04 HA09 HA10 JJ01 KK10

Claims (6)

[Claims] 1. A method of manufacturing an electronic device in which a plurality of elements are fixed to an element mounting surface in a package having a cavity structure via an adhesive, a jig for holding a first element on an element mounting surface of the package. Press-fixing, and pressing and fixing the second element to the position of the element mounting surface of the package close to the first element by a pressing jig, and placing the second element on the element mounting surface. A dihedral pyramid collet is used as a holding jig for fixing, and the direction of the collet when pressing the second element is set such that the ridge line of the tapered surface that grips the second element is located on the side of the first element. To make a right angle direction,
A method of manufacturing an electronic device, wherein the pressing is performed such that the side of the collet facing the first element does not project from the side of the second element toward the first element. 2. A method for manufacturing an electronic device in which a plurality of elements are fixed to an element mounting surface in a package having a cavity structure via an adhesive, wherein a jig for holding a first element on an element mounting surface of the package is provided. And a step of pressing and fixing the second element to a position of the element mounting surface of the package close to the first element by a pressing jig, wherein the thickness of the second element is the first element. A method for manufacturing an electronic device, wherein the element mounting surface of the second element is equal to or thicker than the element, and the element mounting surface of the second element is higher than the element mounting surface of the first element. 3. A method for manufacturing an electronic device in which a plurality of elements are fixed to an element mounting surface in a package having a cavity structure via an adhesive, wherein a jig for holding a first element on an element mounting surface of the package is provided. And a step of pressing and fixing the second element to a position of the element mounting surface of the package close to the first element by a pressing jig, wherein the thickness of the second element is the first element. A method for manufacturing an electronic device, wherein the thickness is larger than the thickness of the element, and the element mounting surface of the first element and the element mounting surface of the second element are substantially at the same height. 4. The method for manufacturing an electronic device according to claim 2, wherein the holding jig for pressing and fixing the element at the position of the element mounting surface of the package is a dihedral pyramid collet. 5. The method according to claim 1, wherein said first and second elements are surface acoustic wave elements. 6. The method according to claim 1, wherein said first and second elements are surface acoustic wave elements having different characteristics.