JP2001250930A - Compact image pickup module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a compact image pickup module that is easily assembled, and can reduce costs by improving structure for mounting a mirror frame body or the like so that a semiconductor device chip for image pickup that is mounted onto a substrate is involved. SOLUTION: This compact image pickup module is equipped with a substrate that is formed by glass or transparent members, a semiconductor device chip for image pickup that includes a two-dimensional C-MOS image sensor that is mounted onto one surface of the substrate or the like, a free sculptured reflection mirror prism that is fitted onto one surface of the substrate, takes in an external optical image that is transmitted from the other side surface of the substrate, and reflects the optical image on the image pickup surface of the semiconductor device chip for image pickup for image-forming, and at least a transparent electrode that is provided on one surface of the substrate, and takes out an image pickup signal from the semiconductor device chip for image pickup.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a small-sized imaging module, and more particularly to a small-sized imaging module in which a lens and a semiconductor device chip for imaging are integrated in a single package.

[0002]

2. Description of the Related Art In recent years, various multimedia fields such as notebook personal computers and mobile phones have been developed.
Further, the demand for small image sensor units for image input devices such as information terminals such as surveillance cameras and video tape recorders is increasing.

As a small-sized image sensor unit suitable for this type of image input device, there is an imaging module in which components such as a solid-state imaging device, a lens member, a filter, and an aperture member are housed in one package and integrated.

In a conventional imaging module as an image sensor unit, after a solid-state imaging device is mounted on a substrate, the substrate is fixed to a package by screwing or bonding, and a lens member is held on the package. It was a structure to attach a support frame.

Due to such a structure, the accuracy of the positional relationship of the lens with respect to the solid-state image sensor cannot be sufficiently ensured.

As described above, in the image pickup module as a conventional image sensor unit, since the positioning accuracy of the lens with respect to the solid-state image pickup device is inferior, a movable focus adjustment mechanism for focusing on the package is incorporated into the package, and each component is mounted on the package. After assembling, the focus adjustment mechanism focuses the lens member on the solid-state imaging device.

However, according to this, a focusing operation for operating the movable adjustment mechanism after assembling the respective parts is required separately, and further, after this focusing, an operation for fixing the lens frame member and the like is required. Was needed.

Further, when a movable focus adjustment mechanism is provided, the structure thereof becomes complicated, and the size of an image pickup module as an image sensor unit tends to increase.

Furthermore, during the focusing operation, dust easily enters the unit from the gap of the movable portion of the focus adjustment mechanism, and measures must be taken. For example, it is necessary to perform the focusing operation in a clean room. And the productivity was poor.

Further, the movable focus adjustment mechanism has a drawback that when subjected to vibration, impact, or the like after completion of the product, the focus position is easily deviated, and the reliability of the product is poor.

Japanese Patent Application Laid-Open No. 9-232548 proposes a solid-state imaging device having a structure in which the position accuracy of the lens with respect to the solid-state imaging device in the optical axis direction can be easily ensured.

In this solid-state imaging device, a plurality of positioning portions are formed in a single support member in a stepwise manner, and components such as a solid-state imaging device, a lens member, a filter, and an aperture member are formed on the separate positioning portions. By attaching separately and separately,
This is for positioning and fixing each member.

However, in such a solid-state imaging device,
Since a plurality of positioning portions are formed in a single supporting member in a stepped manner, a dimensional error between the steps directly and largely affects the positioning accuracy of each member.

Moreover, in order to form a plurality of positioning portions in a single support member in a stepwise manner, it is difficult to control the dimensional accuracy thereof, errors tend to occur, and a plurality of positioning portions are formed in a single support member in a stepwise shape. Advanced production technology is required to form the products.

In particular, when a single support member is made of ceramic, it is very difficult to manufacture it and the product becomes expensive.

Therefore, it is conceivable to manufacture the support member by injection molding using a synthetic resin or the like as a material in many cases.

However, even if the supporting member is formed by injection molding, it is considered that the dimensional error between the positioning portions having steps is likely to be large, and the error is also increased by the subsequent aging, so that the reliability of the product can be increased. It was inferior in sex.

Also, Japanese Patent No. 2559986 discloses that
A conventional technique has been disclosed in which the above-mentioned conventional technology is used in which the device is mounted on a substrate by utilizing a spring effect using a side wall of an enclosure as a support member.

However, the conventional technique disclosed in Japanese Patent No. 2559986 has a problem that rattling occurs due to a creep phenomenon with time.

Japanese Patent Application Laid-Open No. H10-41492 discloses a conventional technique in which a lens cap and a pedestal are positioned and fixed with guide pins. In this structure, the lens cap and the guide pins are fixed. However, there is a problem that the structure is complicated, the productivity is low, and the manufacturing cost increases.

[0021]

As described above, in the conventional solid-state imaging device, errors in dimensions between steps between the positioning portions are apt to occur, and it is difficult to control the dimensions. The position accuracy of the lens in the optical axis direction cannot be sufficiently ensured.

Further, the structure is complicated, the productivity is low, the manufacturing cost is high, and the product is expensive.

The present invention has been made in view of the above circumstances, and has an image pickup semiconductor device chip including a two-dimensional C-MOS image sensor and the like mounted on a substrate, and a mirror frame or the like so as to cover the chip. It is an object of the present invention to provide a small-sized image pickup module in which the assembling work is easy and the cost can be reduced by variously improving the mounting structure.

[0024]

According to the present invention, in order to solve the above problems, (1) a substrate formed of glass or a transparent member, and a substrate mounted on one surface of the substrate.
An imaging semiconductor device chip including a two-dimensional C-MOS image sensor and the like, and an external semiconductor device mounted on one surface of the substrate so as to include the imaging semiconductor device chip and transmitted through the other surface of the substrate. Capture the light image,
A free-form surface reflection mirror prism for reflecting an image on the imaging surface of the imaging semiconductor device chip to form an image, and a transparent electrode provided on one surface of the substrate for extracting an imaging signal from at least the imaging semiconductor device chip And a compact imaging module comprising:

According to the present invention, in order to solve the above problems, (2) a substrate formed of glass or a transparent member, and a two-dimensional CM mounted on one surface of the substrate.
An imaging semiconductor device chip including an OS image sensor and the like, and an external light image attached to one surface of the substrate and including the imaging semiconductor device chip, and transmitted from the other surface of the substrate. A free-form surface reflecting mirror prism for capturing and reflecting on the imaging surface of the imaging semiconductor device chip to form an image, and an imaging signal provided on at least one surface of the substrate and extracting at least the imaging signal from the imaging semiconductor device chip And a transparent electrode for bonding the free-form surface reflection mirror prism on one surface of the substrate.
There is provided a small-sized imaging module characterized by using a potting material used for OB (chip-on-board) mounting.

According to the present invention, in order to solve the above-mentioned problems, (3) a substrate formed of glass or a transparent member, and a two-dimensional CM mounted on one surface of the substrate.
An imaging semiconductor device chip including an OS image sensor and the like, and an external light image attached to one surface of the substrate and including the imaging semiconductor device chip, and transmitted from the other surface of the substrate. A free-form surface reflecting mirror prism for capturing and reflecting on the imaging surface of the imaging semiconductor device chip to form an image, and an imaging signal provided on at least one surface of the substrate and extracting at least the imaging signal from the imaging semiconductor device chip And a transparent electrode for mounting the free-form surface reflection mirror prism on the substrate, wherein a positioning projection is provided at the bottom of the free-form surface reflection mirror prism. At the same time, positioning projections provided on the bottom of the free-form surface reflection mirror prism are fitted to opposing positions on the substrate. Compact image pickup module is provided, characterized in that provided Goana.

According to the present invention, in order to solve the above-mentioned problems, (4) a substrate formed of glass or a transparent member, and a two-dimensional CM mounted on one surface of the substrate.
An imaging semiconductor device chip including an OS image sensor and the like, and an external light image attached to one surface of the substrate and including the imaging semiconductor device chip, and transmitted from the other surface of the substrate. A free-form surface reflecting mirror prism for capturing and reflecting on the imaging surface of the imaging semiconductor device chip to form an image, and an imaging signal provided on at least one surface of the substrate and extracting at least the imaging signal from the imaging semiconductor device chip And a transparent electrode for providing an external connection land and through-hole portion on the substrate, and engaging the other substrate with the land and through-hole portion to provide another substrate. A small-sized imaging module characterized in that electrical connection and mechanical holding with the substrate can be performed.

[0028]

Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIG. 1 is a sectional view showing the structure of a small-sized image pickup module according to a first embodiment of the present invention.

That is, as shown in FIG. 1, a small-sized image pickup module according to the first embodiment of the present invention has a basic structure, a substrate 11 formed of glass or a transparent member, and An imaging semiconductor device chip 12 including a two-dimensional C-MOS image sensor and the like attached on one surface of the substrate 11, and attached to one surface of the substrate 11 so as to include the imaging semiconductor device chip 12; A free-form surface reflection mirror prism 13 which takes in incident light of an external light image transmitted from the other surface side of the substrate 11 and reflects it on the imaging surface of the imaging semiconductor device chip 12 to form an image; Provided at least on one surface, and at least the imaging semiconductor device chip 12
Transparent electrode 1 for extracting imaging (image) signal from
And four groups.

Here, the imaging semiconductor device chip 12
For example, a photoelectric conversion unit (sensor unit) including a two-dimensionally arranged photoelectric conversion element group constituting a two-dimensional C-MOS image sensor, and the photoelectric conversion element group are sequentially driven to generate a signal charge. A driving circuit unit for obtaining the digital signal, an A / D converter for converting the signal charge into a digital signal, a signal processing unit for converting the digital signal into a video signal, and an electrical exposure based on the output level of the digital signal. It is assumed that a semiconductor circuit unit or the like is provided in which exposure control means for controlling time is formed on the same semiconductor chip.

The substrate 11 made of glass or a transparent member holds the semiconductor chip and has a group of transparent electrodes 14 electrically connected to the semiconductor chip.

In this case, the substrate 11 made of glass or a transparent member is, for example, a plate having a rectangular shape and a uniform thickness, and the upper surface thereof is made to be the same flat surface. Is formed.

The small-sized image pickup module according to the first embodiment of the present invention thus configured includes an image pickup semiconductor device chip 12 including a two-dimensional C-MOS image sensor and the like mounted on one surface of a substrate 11. A free-form surface reflecting mirror prism 13 attached to one surface of the substrate 11 includes incident light of an external light image transmitted from the other surface of the substrate 11 so as to be included therein. The light is captured through a light (IR) light-shielding filter and reflected on the imaging surface of the imaging semiconductor device chip 12 to form an image.

Then, by subjecting the subject image formed on the sensor portion of the imaging semiconductor device chip 12 on the substrate 11 to photoelectric conversion, for example, a digital or analog image signal is output from the group of transparent electrodes 14. Works like that.

The small-sized image pickup module according to the first embodiment of the present invention configured as described above comprises a substrate 11 made of glass or a transparent member, and a two-dimensional C-MO.
Due to the presence of the free-form reflecting mirror prism 13 mounted on one surface of the substrate 11 so as to enclose the imaging semiconductor device chip 12 including the S image sensor and the like, the two-dimensional sensor according to the prior art is used alone. It is possible to omit the package stored in the above, and since the sensor section has a completely sealed structure and the optical path length can be shortened, while improving the optical performance,
It is possible to reduce the size, reduce the cost, and improve the mountability.

In addition, since the free-form surface reflection mirror prism 13 is substantially separated from the sensor surface, the size can be reduced without impairing the effect of the microlens on the sensor surface.

(Second Embodiment) FIG. 2 is a sectional view showing a configuration of a small-sized image pickup module according to a second embodiment of the present invention.

That is, as shown in FIG. 2, the small-sized image pickup module according to the second embodiment of the present invention has a basic structure as follows: a substrate 11 formed of glass or a transparent member; An imaging semiconductor device chip 12 including a two-dimensional C-MOS image sensor and the like attached on one surface; and the substrate 11 attached to one surface of the substrate 11 so as to include the imaging semiconductor device chip 12. A free-form surface reflecting mirror prism 13 which takes in incident light of an external light image transmitted from the other surface side of the substrate 11 and reflects it on an imaging surface of the imaging semiconductor device chip 12 to form an image, and one surface of the substrate 11 Provided above,
At least a group of transparent electrodes 14 for taking out an imaging (image) signal from the imaging semiconductor device chip 12 and an adhesive material for adhering the free-form surface reflection mirror prism 13 on one surface of the substrate 11 As C
It is characterized by using potting materials 151 and 152 used for OB (chip-on-board) mounting.

Here, the imaging semiconductor device chip 12
For example, a photoelectric conversion unit (sensor unit) including a two-dimensionally arranged photoelectric conversion element group constituting a two-dimensional C-MOS image sensor, and the photoelectric conversion element group are sequentially driven to generate a signal charge. A driving circuit unit for obtaining the digital signal, an A / D converter for converting the signal charge into a digital signal, a signal processing unit for converting the digital signal into a video signal, and an electrical exposure based on the output level of the digital signal. It is assumed that a semiconductor circuit unit or the like is provided in which exposure control means for controlling time is formed on the same semiconductor chip.

The substrate 11 made of glass or a transparent member holds the semiconductor chip and has a group of transparent electrodes 14 electrically connected to the semiconductor chip.

In this case, the substrate 11 made of glass or a transparent member is, for example, a rectangular plate having a uniform thickness, and the upper surface thereof is made to be the same flat surface. Is formed.

The second embodiment of the present invention constructed as described above has a small-sized image pickup module according to the basic structure.
A free-form surface reflecting mirror prism 13 attached on one surface of the substrate 11 so as to include an imaging semiconductor device chip 12 including a two-dimensional C-MOS image sensor and the like attached on one surface of the substrate 11; The incident light of the external light image transmitted from the other surface side of the substrate 11 is taken in through an aperture (not shown), a lens, and an infrared light (IR) light-shielding filter, and is taken into the imaging surface of the imaging semiconductor device chip 12. An image is formed by reflection.

Then, by subjecting the subject image formed on the sensor portion of the imaging semiconductor device chip 12 on the substrate 11 to photoelectric conversion, for example, a digital or analog image signal is output from the group of transparent electrodes 14. Works like that.

The small imaging module according to the second embodiment of the present invention having the above-described configuration includes a substrate 11 formed of glass or a transparent member, and a two-dimensional C-MO.
Due to the presence of the free-form reflecting mirror prism 13 mounted on one surface of the substrate 11 so as to enclose the imaging semiconductor device chip 12 including the S image sensor and the like, the two-dimensional sensor according to the prior art is used alone. It is possible to omit the package stored in the above, and since the sensor section has a completely sealed structure and the optical path length can be shortened, while improving the optical performance,
It is possible to reduce the size, reduce the cost, and improve the mountability.

In addition, since the free-form surface reflection mirror prism 13 is substantially separated from the sensor surface, the size can be reduced without impairing the effect of the microlens on the sensor surface. In addition, it has the following features.

That is, in the small-sized image pickup module according to the second embodiment of the present invention, COB (chip-on-board) is mounted as an adhesive for adhering the free-form surface reflection mirror prism 13 on one surface of the substrate 11. The potting materials 151 and 152 used for the above are used.

Thus, in the small-sized imaging module according to the second embodiment of the present invention, the sensor portion and the transparent electrode 1 are mounted while being mounted on a chip-on-board (COB).
Since the 4th group is completely shielded from the outside air, it is possible to completely prevent the sensor and the transparent electrode 14 group from being damaged and the silicon surface of the sensor from being oxidized during mounting and assembly of the exterior. In addition, since the transparent electrode 14 group can be completely covered, the same handling as that of a general COB-mounted IC is possible, and the size and cost can be reduced.

(Third Embodiment) FIG. 3 is a sectional view showing a configuration of a small-sized image pickup module according to a third embodiment of the present invention.

That is, as shown in FIG. 3, a small-sized image pickup module according to the third embodiment of the present invention has, as its basic structure, a substrate 11 formed of glass or a transparent member, and An imaging semiconductor device chip 12 including a two-dimensional C-MOS image sensor and the like attached on one surface; and the substrate 11 attached to one surface of the substrate 11 so as to include the imaging semiconductor device chip 12. A free-form surface reflecting mirror prism 13 which takes in incident light of an external light image transmitted from the other surface side of the substrate 11 and reflects it on an imaging surface of the imaging semiconductor device chip 12 to form an image, and one surface of the substrate 11 Provided above,
At least a group of transparent electrodes 14 for taking out an imaging (image) signal from the imaging semiconductor device chip 12 and an attachment structure for attaching the free-form surface reflection mirror prism 13 on the substrate 11 In addition, positioning projections 161 and 162 are provided at the bottom of the free-form surface reflection mirror prism 13, and positioning projections 161 and 162 provided at the bottom of the free-form surface reflection mirror prism at opposing positions on the substrate 11. Are provided with fitting holes 171 and 172 into which are fitted.

Here, the imaging semiconductor device chip 12
For example, a photoelectric conversion unit (sensor unit) including a two-dimensionally arranged photoelectric conversion element group constituting a two-dimensional C-MOS image sensor, and the photoelectric conversion element group are sequentially driven to generate a signal charge. A driving circuit unit for obtaining the digital signal, an A / D converter for converting the signal charge into a digital signal, a signal processing unit for converting the digital signal into a video signal, and an electrical exposure based on the output level of the digital signal. It is assumed that a semiconductor circuit unit or the like is provided in which exposure control means for controlling time is formed on the same semiconductor chip.

The substrate 11 made of glass or a transparent member holds the semiconductor chip and has a group of transparent electrodes 14 electrically connected to the semiconductor chip.

In this case, the substrate 11 made of glass or a transparent member is, for example, a plate having a rectangular shape and a uniform thickness, and the upper surface thereof is made to be the same flat surface. Is formed.

The small-sized image pickup module according to the third embodiment of the present invention thus configured includes an image pickup semiconductor device chip 12 including a two-dimensional C-MOS image sensor and the like mounted on one surface of a substrate 11. A free-form surface reflecting mirror prism 13 attached to one surface of the substrate 11 includes incident light of an external light image transmitted from the other surface of the substrate 11 so as to be included therein. The light is captured through a light (IR) light-shielding filter and reflected on the imaging surface of the imaging semiconductor device chip 12 to form an image.

Then, by subjecting the subject image formed on the sensor section of the imaging semiconductor device chip 12 on the substrate 11 to photoelectric conversion, for example, a digital or analog image signal is output from the group of transparent electrodes 14. Works like that.

The small imaging module according to the third embodiment of the present invention configured as described above comprises a substrate 11 made of glass or a transparent member and a two-dimensional C-MO.
Due to the presence of the free-form reflecting mirror prism 13 mounted on one surface of the substrate 11 so as to enclose the imaging semiconductor device chip 12 including the S image sensor and the like, the two-dimensional sensor according to the prior art is used alone. It is possible to omit the package stored in the above, and since the sensor section has a completely sealed structure and the optical path length can be shortened, while improving the optical performance,
It is possible to reduce the size, reduce the cost, and improve the mountability.

In addition, since the free-form surface reflection mirror prism 13 is substantially separated from the sensor surface, the size can be reduced without impairing the effect of the microlens on the sensor surface. In addition, it has the following features.

That is, the hole for positioning the lens frame in the two-dimensional sensor according to the prior art is not limited to simply making a hole in the substrate, but the shape of the substrate is always formed three-dimensionally in accordance with the lens frame. As a result, the cost was very high.

On the other hand, in the small-sized image pickup module according to the third embodiment of the present invention, the free-form surface reflection mirror is provided as an attachment structure for attaching the free-form surface reflection mirror prism 13 on one surface of the substrate 11. Positioning projections 161 and 162 are provided on the bottom of the prism 13, and positioning projections 161 and 161 provided on the bottom of the free-form surface reflection mirror prism at opposing positions on the substrate 11.
The fitting holes 171 and 172 into which the 162 is fitted are provided.

Thus, in the small-sized image pickup module according to the third embodiment of the present invention, since the substrate 11 remains in a planar shape, it is possible to make the assembly very inexpensive and easy to assemble.

(Fourth Embodiment) FIG. 4 is a sectional view showing a configuration of a small-sized image pickup module according to a fourth embodiment of the present invention.

That is, as shown in FIG. 4, the small-sized image pickup module according to the fourth embodiment of the present invention has, as its basic configuration, a substrate 11 made of glass or a transparent member, and An imaging semiconductor device chip 12 including a two-dimensional C-MOS image sensor and the like attached on one surface; and the substrate 11 attached to one surface of the substrate 11 so as to include the imaging semiconductor device chip 12. A free-form surface reflecting mirror prism 13 which takes in incident light of an external light image transmitted from the other surface side of the substrate 11 and reflects it on an imaging surface of the imaging semiconductor device chip 12 to form an image, and one surface of the substrate 11 Provided above,
At least a group of transparent electrodes 14 for extracting an imaging (image) signal from the imaging semiconductor device chip 12 and a land / through hole portion 18 for external connection are provided on the substrate 11. The other substrate 19 is soldered or engaged with a metal pin 20 at the land / through hole portion 18 to enable electrical connection and mechanical holding with the other substrate 19.

Here, the imaging semiconductor device chip 12
For example, a photoelectric conversion unit (sensor unit) including a two-dimensionally arranged photoelectric conversion element group constituting a two-dimensional C-MOS image sensor, and the photoelectric conversion element group are sequentially driven to generate a signal charge. A driving circuit unit for obtaining the digital signal, an A / D converter for converting the signal charge into a digital signal, a signal processing unit for converting the digital signal into a video signal, and an electrical exposure based on the output level of the digital signal. It is assumed that a semiconductor circuit unit or the like is provided in which exposure control means for controlling time is formed on the same semiconductor chip.

The substrate 11 formed of glass or a transparent member holds the semiconductor chip and has a group of transparent electrodes 14 electrically connected to the semiconductor chip.

In this case, the substrate 11 made of glass or a transparent member is, for example, a plate having a rectangular shape and a uniform thickness, and the upper surface thereof is made to be the same flat surface. Is formed.

The small-sized image pickup module according to the fourth embodiment of the present invention thus configured includes an image pickup semiconductor device chip 12 including a two-dimensional C-MOS image sensor and the like mounted on one surface of a substrate 11. A free-form surface reflecting mirror prism 13 attached to one surface of the substrate 11 includes incident light of an external light image transmitted from the other surface of the substrate 11 so as to be included therein. The light is captured through a light (IR) light-shielding filter and reflected on the imaging surface of the imaging semiconductor device chip 12 to form an image.

Then, by subjecting the subject image formed on the sensor unit of the imaging semiconductor device chip 12 on the substrate 11 to photoelectric conversion, for example, a digital or analog image signal is output from the group of transparent electrodes 14. Works like that.

The small-sized image pickup module according to the fourth embodiment of the present invention configured as described above comprises a substrate 11 made of glass or a transparent member and a two-dimensional C-MO.
Due to the presence of the free-form reflecting mirror prism 13 mounted on one surface of the substrate 11 so as to enclose the imaging semiconductor device chip 12 including the S image sensor and the like, the two-dimensional sensor according to the prior art is used alone. It is possible to omit the package stored in the above, and since the sensor section has a completely sealed structure and the optical path length can be shortened, while improving the optical performance,
It is possible to reduce the size, reduce the cost, and improve the mountability.

In addition, since the free-form surface reflection mirror prism 13 is substantially separated from the sensor surface, the size of the sensor can be reduced without impairing the effect of the microlens on the sensor surface. In addition, it has the following features.

That is, in the two-dimensional sensor according to the prior art, as a means for transmitting a signal from the sensor mounting board to another board, the third board is connected to another board such as a cable, a connector, or a flexible board. Since the transmission is performed via the transmission material, it prevents the generation of noise and the reduction of cost.

On the other hand, in the small-sized imaging module according to the fourth embodiment of the present invention, the substrate 11 is provided with a land / through hole 18 for external connection, and the land / through hole 18 is used for another substrate. 19 is soldered or engaged with metal pins 20 to enable electrical connection and mechanical holding between the substrate 11 and another substrate 21.

As a result, in the small-sized image pickup module according to the fourth embodiment of the present invention, it is possible to directly connect the sensor mounting substrate 11 and the other substrate 19 through the through-hole portion 18. It is possible to reduce the size, reduce the cost, and prevent the generation of noise. In addition, since the through-hole portion 18 is substantially shielded from light by soldering or the metal pin 20, another portion of the through-hole portion 18 which becomes harmful light is used. It is possible to block transmitted light from the back side of the substrate 19 to the sensor front side.

[0073]

According to the first aspect of the present invention, a substrate 11 made of glass or a transparent member, and a two-dimensional CM
The presence of the free-form reflecting mirror prism 13 mounted on one surface of the substrate 11 so as to enclose the imaging semiconductor device chip 12 including the OS image sensor and the like enables the two-dimensional sensor according to the prior art to be used alone. It is possible to omit the package stored in the above, and since the sensor section has a completely sealed structure and the optical path length can be shortened, while improving the optical performance,
The miniaturization, the cost reduction and the improvement of the mountability can be achieved, and the effect of the microlens on the sensor surface is substantially achieved by disposing the free-form surface reflection mirror prism 13 away from the sensor surface. It is possible to reduce the size without impairment.

According to the second aspect of the present invention, the substrate 11 formed of glass or a transparent member, and the two-dimensional C-MO
Due to the presence of the free-form reflecting mirror prism 13 mounted on one surface of the substrate 11 so as to enclose the imaging semiconductor device chip 12 including the S image sensor and the like, the two-dimensional sensor according to the prior art is used alone. It is possible to omit the package stored in the above, and since the sensor section has a completely sealed structure and the optical path length can be shortened, while improving the optical performance,
It is possible to reduce the size, reduce the cost, and improve the mountability, and substantially reflect the free-form surface reflection so as to include the imaging semiconductor device chip 12 including the two-dimensional C-MOS image sensor and the like. By arranging the mirror prism 13 separately from the sensor surface, the size of the sensor can be reduced without impairing the effect of the microlens on the sensor surface. In addition, the mirror prism 13 has the following features. .

That is, according to the second aspect of the present invention, the adhesive for bonding the free-form surface reflection mirror prism 13 on one surface of the substrate 11 is used for chip-on-board (COB) mounting. Potting material 151,1
By using 52, the sensor portion and the transparent electrode 14 group portion are completely shut off from the outside air while being mounted on the COB, so that the sensor portion and the transparent electrode 14 group portion may be damaged during mounting and exterior assembly, Since the silicon surface of the sensor part can be completely prevented from being oxidized, and the transparent electrode 14 group can be completely covered, it can be handled in the same manner as a general COB-mounted IC, and has a small size. And cost can be reduced.

According to the third aspect of the present invention, the substrate 11 made of glass or a transparent member is provided with a two-dimensional C-MO
Due to the presence of the free-form reflecting mirror prism 13 mounted on one surface of the substrate 11 so as to enclose the imaging semiconductor device chip 12 including the S image sensor and the like, the two-dimensional sensor according to the prior art is used alone. It is possible to omit the package stored in the above, and since the sensor section has a completely sealed structure and the optical path length can be shortened, while improving the optical performance,
The miniaturization, the cost reduction and the improvement of the mountability can be achieved, and the effect of the microlens on the sensor surface is substantially achieved by disposing the free-form surface reflection mirror prism 13 away from the sensor surface. It has the following features in addition to being able to be downsized without being damaged.

That is, the hole for positioning the lens frame in the conventional two-dimensional sensor is not simply formed by drilling a hole in the substrate, but the shape of the substrate is always formed three-dimensionally in accordance with the lens frame. However, according to the present invention as set forth in claim 3, as the attachment structure for attaching the free-form surface reflection mirror prism 13 on one surface of the substrate 11, Positioning projections 161 and 16 are provided on the bottom of the free-form surface reflection mirror prism 13.
And a fitting hole 17 into which positioning protrusions 161 and 162 provided on the bottom of the free-form surface reflection mirror prism are fitted at opposite positions on the substrate 11.
By providing 1,172, since the substrate 11 remains in a planar shape, it is possible to make it extremely inexpensive and easy to assemble.

According to the fourth aspect of the present invention, the substrate 11 made of glass or a transparent member is provided with a two-dimensional C-MO
Due to the presence of the free-form reflecting mirror prism 13 mounted on one surface of the substrate 11 so as to enclose the imaging semiconductor device chip 12 including the S image sensor and the like, the two-dimensional sensor according to the prior art is used alone. It is possible to omit the package stored in the above, and since the sensor section has a completely sealed structure and the optical path length can be shortened, while improving the optical performance,
The miniaturization, the cost reduction and the improvement of the mountability can be achieved, and the effect of the microlens on the sensor surface is substantially achieved by disposing the free-form surface reflection mirror prism 13 away from the sensor surface. Has the following effects in addition to being able to be reduced in size without impairment.

That is, in the two-dimensional sensor according to the prior art, as a means for transmitting a signal from the sensor mounting board to another board, a third board is connected to another board such as a cable, a connector, or a flexible board. According to the present invention, according to the present invention, the substrate 11 is provided with a land and a land for external connection. A through hole portion 18 is provided, and another substrate 19 is soldered or metal pin 20 is
To allow electrical connection and mechanical holding between the substrate 11 and the other substrate 21, so that the sensor mounting substrate 11 and the other substrate 19 can be directly connected to each other through the through-hole portion 18. Since connection is possible, miniaturization, cost reduction, and prevention of noise generation are possible. In addition, since the through-hole portion 18 is substantially shielded from light by soldering or a metal pin 20, harmful light is prevented. It is possible to block the transmitted light from the back surface of the other substrate 19 to the front surface of the sensor by the through hole portion 18.

As described above, Japanese Patent No. 25599
In the related art disclosed in Japanese Patent Publication No. 86, the mounting is performed on the substrate by utilizing the spring effect using the side wall of the enclosure. Therefore, there is a problem that rattling occurs due to a creep phenomenon over time. According to the second aspect of the present invention, in order to basically prevent the side walls from being overloaded, COB (chip-on-board) mounting is used as an adhesive for bonding the free-form surface reflection mirror prism on a substrate. By using the potting material used, it is possible to solve the problem that rattling occurs due to the creep phenomenon over time.

Also, as described above,
In the conventional technology disclosed in Japanese Patent Application Publication No. 548, there is a problem that since all components are formed by a single member, the shape and structure are complicated, the productivity is low, and the manufacturing cost is increased. In the present invention described in any one of the items 1 to 4, since all of the members are basically not formed by a single member, the shape and structure of each member are simple, the productivity is good, and the manufacturing cost is reduced. Is possible.

As described above, Japanese Patent Application Laid-Open No. 10-41
In the prior art disclosed in Japanese Patent No. 492, the lens cap and the pedestal are positioned and fixed by the guide pins, so that the lens cap and the guide pins are required. Therefore, the structure is complicated, the productivity is low, and the manufacturing cost increases. However, the present invention according to claims 1 to 4 basically does not require a lens cap and does not necessarily require a guide pin.

Therefore, as described above, according to the present invention, an imaging semiconductor device chip including a two-dimensional C-MOS image sensor and the like are mounted on a substrate, and a mirror frame and the like are covered so as to cover the semiconductor device chip. In the mounting structure, by improving the mounting structure in various ways, it is possible to provide a small-sized imaging module that is easy to assemble and can reduce the cost.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a schematic configuration of a small-sized imaging module according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a schematic configuration of a small-sized imaging module according to a second embodiment of the present invention.

FIG. 3 is a sectional view showing a schematic configuration of a small-sized imaging module according to a third embodiment of the present invention.

FIG. 4 is a sectional view showing a schematic configuration of a small-sized imaging module according to a fourth embodiment of the present invention.

[Explanation of symbols]

 Reference numeral 11 denotes a substrate formed of glass or a transparent member, 12 denotes a semiconductor device chip for imaging, 13 denotes a free-form surface reflection mirror prism, 14 denotes a transparent electrode group, 151, 152 denotes a potting material, 161, 162 denotes a projection for positioning, 171, 172: fitting holes, 18: lands and through holes for external connection, 19: other substrates 21, 20: soldering or metal pins.

Claims (4)

[Claims] 1. A substrate formed of glass or a transparent member, an imaging semiconductor device chip including a two-dimensional C-MOS image sensor mounted on one surface of the substrate, and the imaging semiconductor device chip included therein. A free-form surface attached to one surface of the substrate and taking in an external light image transmitted from the other surface of the substrate and reflecting the image on the imaging surface of the semiconductor device chip for imaging to form an image. A small-sized imaging module comprising: a reflection mirror prism; and a transparent electrode provided on one surface of the substrate and at least for extracting an imaging signal from the imaging semiconductor device chip. 2. A substrate formed of glass or a transparent member, a semiconductor device chip for imaging including a two-dimensional C-MOS image sensor and the like attached on one surface of the substrate, and a semiconductor device chip for imaging included therein. A free-form surface attached to one surface of the substrate and taking in an external light image transmitted from the other surface of the substrate and reflecting the image on the imaging surface of the semiconductor device chip for imaging to form an image. A small-sized imaging module comprising: a reflecting mirror prism; and a transparent electrode provided on one surface of the substrate, at least for extracting an imaging signal from the imaging semiconductor device chip. A potting material used for COB (chip-on-board) mounting is used as an adhesive for adhering the free-form surface reflection mirror prism. Compact image pickup module, wherein the door. 3. A substrate formed of glass or a transparent member, a semiconductor device chip for imaging including a two-dimensional C-MOS image sensor or the like attached on one surface of the substrate, and a semiconductor device chip for imaging included therein. A free-form surface attached to one surface of the substrate and taking in an external light image transmitted from the other surface of the substrate and reflecting the image on the imaging surface of the semiconductor device chip for imaging to form an image. A small-sized imaging module comprising: a reflecting mirror prism; and a transparent electrode provided on one surface of the substrate, at least for extracting an imaging signal from the imaging semiconductor device chip. As a mounting structure for mounting the curved reflecting mirror prism, a positioning projection is provided at the bottom of the free curved reflecting mirror prism, Compact image pickup module and providing a fitting hole in which the free-form surface reflector mirror bottom projection for positioning provided in the prism on opposite positions on the plate is fitted. 4. A substrate formed of glass or a transparent member, a semiconductor device chip for imaging including a two-dimensional C-MOS image sensor or the like attached on one surface of the substrate, and a semiconductor device chip for imaging included therein. A free-form surface attached to one surface of the substrate and taking in an external light image transmitted from the other surface of the substrate and reflecting the image on the imaging surface of the semiconductor device chip for imaging to form an image. A small imaging module comprising: a reflecting mirror prism; and a transparent electrode provided on one surface of the substrate and at least for extracting an imaging signal from the imaging semiconductor device chip. The land and the through-hole portion are provided, and the other substrate is engaged with the land and the through-hole portion, so that electrical connection with the other substrate and Compact image pickup module, characterized in that to enable 械的 retention.