JP2001239203A - Film forming device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the generation of hindrance even if a coating liquid discharge nozzle is moved at a high speed and to make the nozzle freely changeable. SOLUTION: A holder 100 for holding the discharge nozzle 85 is formed into a L-shape when discharging a resist liquid. An adsorption recessed part 100c is formed on the inside surface of the vertical part 100a of the L-shape and a suction port 100d is provided near the center. A suction passage 100e communication with the section port 100d is provided vertically inside the vertical 100a. A suction pipe 100f communicated with the suction passage 100e is provided at the upper part of the vertical part 100a. The discharge nozzle 85 is sucked and held by sucking from the suction pipe 100f. Projection parts 100g and 100h are provided in the vertical direction and the horizontal direction to the moving direction of the discharge nozzle 85 and are engaged with the recessed part of the discharge nozzle 85.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an apparatus for forming a film on a substrate.

[0002]

2. Description of the Related Art For example, in a photolithography process in a semiconductor device manufacturing process, a resist solution is applied to a wafer surface to form a resist film, a resist is exposed to a pattern on the wafer, and an exposed wafer is exposed. Is performed to form a predetermined circuit pattern on the wafer.

At present, as a method of applying a resist solution in the resist coating process, a spin coating method is mainly used. According to this spin coating method, a coating liquid discharge nozzle held by an arm is disposed at the center of a wafer, and a resist liquid is discharged from the coating liquid discharge nozzle, and at the same time, the wafer is rotated. Thus, the resist solution applied on the wafer is diffused by centrifugal force, and a uniform resist film can be formed over the entire surface of the wafer.

[0004]

However, in the spin coating method, since the wafer is rotated at a high speed, a large amount of the resist solution is scattered from the peripheral portion of the wafer, so that much of the resist solution is wasted. In addition, since the apparatus is contaminated by the scattering of the resist solution, there are problems such as frequent cleaning.

Therefore, instead of the spin coating method, a method of applying the resist liquid while moving the application liquid discharge nozzle and the wafer relatively, that is, applying the resist liquid in a so-called one-stroke manner can be considered. In this case, it is desirable to move the application liquid discharge nozzle at a high speed in order to improve the throughput.

Incidentally, even in the method of applying a resist solution in a so-called one-stroke manner, it may be necessary to replace the nozzle in order to apply a different resist solution according to a wafer recipe.

In such a case, the arm of the conventional apparatus for performing the spin coating method has a mechanism in which the arm itself can move three-dimensionally and mechanically grips the coating liquid discharge nozzle or separates the nozzle. As a result, it is relatively heavy and structurally complex. Therefore, if the conventional arm having such a mechanism is applied as it is to the apparatus for applying the resist solution in the manner of one stroke described above, it may not be possible to move at a high speed. There is a possibility that the resist solution cannot be uniformly applied to a predetermined film thickness.

The present invention has been made in view of the above point, and there is no problem even if the coating liquid discharge nozzle is moved at a high speed under a method of applying the coating liquid in a so-called one-stroke manner. It is an object of the present invention to provide a substrate film forming apparatus in which a nozzle can be exchanged.

[0009]

According to the first aspect of the present invention, a coating liquid is discharged from a coating liquid discharge nozzle onto a substrate.
A film forming apparatus for forming a film on the surface of the substrate, comprising a coating liquid discharge nozzle holding member for holding the coating liquid discharge nozzle reciprocally movable in a predetermined direction parallel to the substrate; A substrate, wherein a liquid discharge nozzle and the coating liquid discharge nozzle holding member are detachably configured, and the coating liquid discharge nozzle holding member has suction means for sucking a part of the coating liquid discharge nozzle. Is provided. Here, the application liquid discharge nozzle does not indicate a part near the discharge port but means the entire member having a function of discharging the application liquid.

As described above, the suction means is provided on the coating liquid discharge nozzle holding member, and a part of the coating liquid discharge nozzle is sucked to hold the nozzle. Therefore, the nozzle is held by a lighter mechanism than in the related art, and high-speed movement is possible. In addition, since the nozzle is held by suction even at a high speed, the nozzle does not shift or come off due to inertial force. Furthermore, since the coating liquid discharge nozzle is detachable from the coating liquid discharge nozzle holding member, the nozzle can be replaced.

According to the first aspect of the present invention, the holding means for sucking a part of the application liquid discharge nozzle is provided on the coating liquid discharge nozzle holding member. You may provide the solenoid which adsorbs a part. Thus, by providing a so-called electromagnet,
The coating liquid discharge nozzle holding member can attract and hold the coating liquid discharge nozzle by the magnetic force generated by the electromagnet. Therefore, similarly to the first aspect, the holding mechanism of the nozzle is reduced in weight and can be moved at high speed. Further, even if the nozzle is moved at a high speed, there is no trouble such as detachment from the nozzle holding member, and the nozzle can be replaced.

Further, as in claim 3, the coating liquid discharge nozzle holding member has a gripping member for gripping the coating liquid discharge nozzle from outside, and the coating liquid is supplied to the gripping member by inflow and outflow of air. A pressing member that can expand and contract with respect to the discharge nozzle may be provided. As described above, by providing the gripping member provided with the pressing member, the pressing member can be expanded and the nozzle can be pressed and held from outside the application liquid discharge nozzle. Therefore, similarly to the first aspect, the nozzle holding member is reduced in weight, and the nozzle can move at high speed. Further, even if the nozzle is moved at a high speed, trouble such as detachment from the nozzle holding member is eliminated, and the nozzle can be replaced.

Further, the coating liquid discharging nozzle holding member itself is formed in a substantially cylindrical shape having upper and lower surfaces opened corresponding to the outer shape of the coating liquid discharging nozzle. You may make it have the support part which supports a nozzle. In this way, by forming the coating liquid discharge nozzle holding member into a so-called pocket shape, the coating liquid discharge nozzle can be accommodated and held in the pocket. Therefore, similarly to the first aspect, the weight of the coating liquid discharge nozzle holding member is reduced, and the nozzle can move at high speed.
Further, even if the nozzle is moved at a high speed, there is no trouble such as detachment from the nozzle holding member due to inertial force, and the nozzle can be preferably replaced. The support portion here includes a locking member such as a stopper, for example.

According to the fifth aspect, the coating liquid discharge nozzle holding member has a convex portion projecting in a direction perpendicular to the predetermined direction, and the coating liquid discharge nozzle is fitted to the convex portion. An apparatus for forming a film on a substrate, comprising: The invention according to claim 6 is characterized in that conversely, a concave portion is provided on the coating liquid discharge nozzle holding member, and a convex portion is provided on the coating liquid discharge nozzle.

As described above, by providing the convex portion and the concave portion to be fitted thereto in a direction perpendicular to the predetermined direction, when the application liquid discharge nozzle moves at a high speed in the predetermined direction, these fitting portions are fitted. The engagement by the joining member prevents the nozzle from shifting or detaching due to inertial force. Therefore, even if the coating liquid is discharged onto the substrate while moving the nozzle at a high speed, the coating liquid is appropriately discharged to a predetermined position to form a predetermined film.

In the fifth or sixth aspect of the present invention, the projection may be provided so as to protrude in the horizontal direction. As described above, when the convex portion is provided in the horizontal direction, when the application liquid discharge nozzle is attached / detached, the means for transporting the nozzle, for example, the transfer direction of the transfer arm to the application liquid discharge nozzle in the transfer direction is horizontal. Is enough,
There is no need to move in complicated directions such as diagonal directions. In particular, by providing the suction means as described in claims 1 and 2 in a direction perpendicular to the projection, after the two have approached to some extent, only the suction force of the suction means is used to apply the suction means. And the recess can be fitted. By doing so, the load applied to the coating liquid discharge nozzle holding member when fitting the convex portion to the concave portion is minimized, and the influence on the coating liquid discharge nozzle holding member and its peripheral members is suppressed. it can.

According to an eighth aspect of the present invention, there is provided a transfer means for transferring the coating liquid discharge nozzle movably at least within a moving range of the coating liquid discharge nozzle, wherein the transfer means controls the coating liquid discharge nozzle to move the coating liquid discharge nozzle. An apparatus for forming a film on a substrate, characterized in that the apparatus is configured to be freely transferable to a holding member for holding a coating liquid discharge nozzle.

According to the eighth aspect, the transport means moves to the coating liquid discharge nozzle, where the nozzle can be delivered to the coating liquid discharge nozzle holding member. Therefore, at the time of replacement of the nozzle, it is possible to preferably replace the application liquid discharge nozzle by using this transport means.

According to a ninth aspect of the present invention, there is provided a nozzle standby member capable of supporting a plurality of the coating liquid discharge nozzles, and the nozzle standby member is provided within a moving range of the transfer means. There is provided an apparatus for forming a film on a substrate, wherein the apparatus is configured to be able to deliver the application liquid discharge nozzle to a nozzle standby member.

In this way, the transfer means enables the transfer of the coating liquid discharge nozzle also to the nozzle standby member, thereby receiving the coating liquid discharge nozzle from the nozzle holding member and transferring the nozzle to the nozzle standby member. can do. Further, one application liquid discharge nozzle can be selected from the plurality of application liquid discharge nozzles supported by the standby member, and can be transported to the nozzle holding member and delivered. Therefore, it is possible to preferably exchange the application liquid discharge nozzle. In addition, the nozzle standby member may be configured to be movable to a position where the application liquid discharge nozzle can be freely transferred to the application liquid discharge nozzle holding member. This eliminates the need for a transport unit that transports the discharge nozzle.

According to an eleventh aspect of the present invention, the nozzle standby member has a receiving portion for receiving and supporting a discharge port of the coating liquid discharge nozzle, and the inside of the receiving portion is maintained in a solvent atmosphere of the coating liquid. It is characterized by being constituted.

Before or after the application liquid discharge nozzle is used, when the nozzle is made to stand by at the nozzle standby member, the discharge port of the coating liquid discharge nozzle dries, and contaminants are contaminated in this discharge port. It is necessary to prevent adhesion. Therefore, by maintaining the receiving portion where the nozzle is supported in a solvent atmosphere, the discharge port of the nozzle is set in a solvent atmosphere, and drying of the nozzle is prevented.

Further, as in the twelfth aspect of the present invention, a solvent storage section for storing a solvent of the coating liquid is provided below the nozzle standby member, and an atmosphere of the storage section is introduced into the receiving section. An introduction path may be provided. In this way, by introducing the solvent from the solvent storage section to the receiving section, the receiving section is maintained in a solvent atmosphere, and further, the discharge port of the nozzle supported by the receiving section is placed in the solvent atmosphere. Can be supported. Therefore, the drying of the nozzle is prevented.

According to a thirteenth aspect of the present invention, the apparatus further comprises a temperature adjusting means for adjusting the temperature of the solvent in the solvent storage section. Thus, by adjusting the temperature of the solvent, the amount of evaporation of the solvent can be adjusted. Therefore, the concentration of the solvent in the atmosphere of the receiving portion can be adjusted, and the concentration of the solvent can be adjusted according to the type of the coating liquid, so that the drying of the coating liquid discharge nozzle can be prevented.

According to a fourteenth aspect, instead of the solvent storage part, a solvent flow path through which the solvent of the coating liquid flows is provided below the standby member, and the atmosphere of the solvent flow path is introduced into the receiving part. It is characterized by having an introduction path. In this way, by providing the solvent flow path through which the solvent flows below the nozzle standby member, a fresh solvent atmosphere can be always introduced into the receiving portion. Therefore, the coating liquid discharge nozzle supported by the receiving portion can be kept on standby in a fresh solvent atmosphere.

Further, according to the invention of claim 15, there is provided an apparatus for forming a film on a substrate, characterized by having a temperature adjusting means capable of adjusting the solvent temperature of the solvent flow path. As described above, by changing the solvent temperature and changing the solvent concentration in the receiving section, the coating liquid discharge nozzle supported by the receiving section waits in an atmosphere having a solvent concentration suitable for the coating liquid to be used. be able to.

According to a sixteenth aspect of the present invention, there is provided an apparatus for forming a film on a substrate, wherein an openable and closable lid is provided at a receiving portion of the nozzle standby member. In this manner, by providing the openable and closable lid in the receiving portion, for example, when one application liquid discharge nozzle is carried out of the reception portion, the one application liquid discharge nozzle is supported. The receiving part can be covered. Therefore, the filled solvent atmosphere is discharged from the receiving portion, and is prevented from affecting the atmosphere of the entire film forming apparatus.

According to a seventeenth aspect of the present invention, there is provided an apparatus for forming a film on a substrate, comprising a cleaning liquid supply unit for supplying a cleaning liquid to a discharge port of a coating liquid discharge nozzle supported by a receiving part of the nozzle standby member. Is provided. Note that the cleaning liquid mentioned here also includes a solvent of the coating liquid.

As described above, the nozzle standby member is provided with the cleaning liquid supply section for supplying the cleaning liquid to the discharge port of the nozzle, whereby the nozzle is actively cleaned while the nozzle standby member is on standby, and is separately cleaned. Even if no device is provided, the application liquid discharge nozzle is cleaned and used at all times while keeping it clean.

In each of these film forming apparatuses,
As shown in 8, the application liquid discharge nozzle is formed on a substantially cylindrical support member, a thin plate provided on the substrate side surface of the support member to close the substrate side surface, and formed on the thin plate. A discharge port having a predetermined diameter and a pressing member for fixing the thin plate to the support member from outside may be provided.

By using such a coating liquid discharge nozzle, a discharge port having a smaller hole diameter can be easily processed. Therefore, it is possible to supply the coating liquid to the substrate from an extremely small discharge port. As a result, when applying the coating liquid on the substrate in a so-called one-stroke manner, the coating liquid is necessarily discharged outside the substrate. , The amount of the coating solution becomes smaller. In addition, since the diameter of the discharge port can be reduced, the discharge amount and discharge portion of the coating liquid can be strictly controlled.

Further, in each of these film forming apparatuses,
As in claim 19, the coating liquid discharge nozzle holding member is
It may be attached to a belt movable in the predetermined direction.

As described above, by attaching the coating liquid holding member to a belt movable in a predetermined direction, for example, the belt reciprocates on the substrate, and at this time, the coating liquid is supplied from the coating liquid discharge nozzle. be able to. Therefore, while moving the substrate in the direction perpendicular to the reciprocating direction,
By moving the belt as described above, a coating method of supplying a resist solution in a so-called one-stroke manner is suitably performed.

[0034]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below. FIG. 1 is a plan view of a coating and developing processing system 1 having a resist coating apparatus according to the present embodiment, FIG. 2 is a front view of the coating and developing processing system 1, and FIG. FIG.

As shown in FIG. 1, for example, the coating and developing system 1 carries 25 wafers W into and out of the coating and developing system 1 from the outside in units of cassettes and carries wafers W into and out of the cassette C. A cassette station 2 for unloading, a processing station 3 in which various processing apparatuses for performing predetermined processing in a single-sheet type in a coating and developing processing step are arranged in multiple stages, and provided adjacent to the processing station 3. An interface unit 4 for transferring a wafer W to and from an exposure apparatus (not shown) is integrally connected.

In the cassette station 2, a plurality of cassettes C can be mounted in a row in the X direction (up and down direction in FIG. 1) at predetermined positions on a cassette mounting table 5 serving as a mounting portion. Then, the cassette arrangement direction (X direction) and the wafer arrangement direction (Z
(A vertical direction) is provided movably along a transfer path 8 so that each cassette C can be selectively accessed.

The wafer carrier 7 has an alignment function for positioning the wafer W. The wafer carrier 7 is configured so as to be able to access the extension devices 32 belonging to the third processing device group G3 on the processing station 3 side as described later.

In the processing station 3, a main transfer unit 13 is provided at the center thereof, and various processing units are arranged in multiple stages around the main transfer unit 13 to form a processing unit group. In the coating and developing system 1,
Four processing unit groups G1, G2, G3, and G4 are disposed. The first and second processing unit groups G1 and G2 are disposed on the front side of the development processing system 1, and the third processing unit group G3 is disposed.
Is located adjacent to the cassette station 2 and the fourth
The processing unit group G4 is disposed adjacent to the interface unit 4. Further, a fifth processing unit group G5 indicated by a broken line as an option can be separately arranged on the back side. The main transfer device 13 is provided with these processing device groups G1.
Wafers W can be loaded and unloaded to and from various processing apparatuses described below arranged at G5.

In the first processing unit group G1, for example, as shown in FIG.
7 and a developing apparatus 18 for supplying a developing solution to the wafer W for processing are arranged in two stages from the bottom. Similarly, in the case of the second processing unit group G2, the resist coating unit 19
And the development processing device 20 are stacked in two stages in order from the bottom.

In the third processing unit group G3, for example, as shown in FIG.
0, an adhesion device 31 for improving the fixability between the resist solution and the wafer W, an extension device 32 for holding the wafer W on standby, a vacuum drying device 33 for drying the solvent in the resist solution under reduced pressure, a pre-baking device 34, and after the development processing. The post-baking devices 35, 36, etc., which perform the above heat treatment, are stacked, for example, in seven stages from the bottom.

In the fourth processing unit group G4, for example, a cooling device 40, an extension cooling device 41 for naturally cooling the mounted wafer W, an extension device 42, a cooling device 43, and a post-exposure for performing a heating process after the exposure process. Baking equipment 44,4
5, post-baking devices 46, 47, etc. are stacked in, for example, eight stages from the bottom.

A wafer carrier 50 is provided at the center of the interface section 4. The wafer transfer body 50 is configured to freely move in the X direction (vertical direction in FIG. 1), the Z direction (vertical direction), and rotate in the θ direction (rotation direction about the Z axis). , Fourth processing unit group G4
, An extension cooling device 41, an extension device 42, a peripheral exposure device 51, and an unshown exposure device.

Next, the configuration of the above-described resist coating apparatus 17 will be described. Here, a resist liquid discharging means for discharging the resist liquid applies the resist liquid while moving relatively to the wafer W, that is, a so-called resist liquid. A resist coating device capable of implementing a one-stroke application method is adopted.

As shown in FIGS. 4 and 5, a substantially box-shaped outer container 61 which is long in the Y direction (the vertical direction in FIG. 5) is provided in the casing 60 of the resist coating device 17. The outer container 61 has an open upper surface. This outer container 61
Inside, an inner container 62 for processing the wafer W therein is provided. The inner container 62 has an open upper surface,
The inner container drive mechanism 64 is configured to be movable on two rails 63 extending in the Y direction provided on the bottom surface of the outer container 61. Therefore, the wafer W is transferred to the inner container 6.
When carrying in and out of the container 2, the inner container 62 is
To the transfer section L on the positive side in the Y direction (upper in FIG. 5), and to apply the wafer W to the processing section R on the negative side in the Y direction (lower in FIG. 5). be able to.
Further, even while the resist solution is being applied to the wafer W, the inner container 62 can be moved in the Y direction by a predetermined distance at a predetermined timing.

Further, inside the inner container 62, the wafer W
There is provided a mounting table 65 for adsorbing and holding, and a rotary drive 6 for rotatably mounting the mounting table 65 is provided below the mounting table 65.
6 are provided. Further, an ultrasonic vibrator 67 is attached to the mounting table 65, for example.
Can be vibrated at a high frequency. On the bottom surface of the inner container 62, a solvent tank 68 for storing a solvent for maintaining the inside of the inner container 62 at a solvent atmosphere of a predetermined concentration is provided.

The bottom of the inner container 62 has an outlet 73.
Is provided, from which air is exhausted to generate an air flow in the inner container 62 so that the periphery of the wafer W can be maintained at a predetermined solvent concentration.

Further, a mask member 70 that covers the wafer W and limits the coating range Wa of the wafer W is provided above the wafer W. The mask member 70 is a mask provided on the inner side wall of the inner container 62. It is supported by the support member 71. The mask member 70 can be transported in the X direction by a transport mechanism (not shown). Therefore, the mask member 70 is kept on standby in the cleaning section on the negative side in the X direction of the outer container 61 (leftward in FIG. 5), and after the inner container 62 having the wafer W moves to the processing section R, the transfer is performed. By the mechanism, the mask member 70 is moved to the mask supporting member 7 in the inner container 62.
1 can be carried in.

The outer container 61 described above is fixedly provided with a lid 80 for covering the processing unit R side of the outer container 61. When the inner container 62 moves to the processing unit R side, the lid 80 is closed. When the upper part is covered with the lid 80, a predetermined atmosphere can be easily maintained. The lid 80 has a heater 8 which can be adjusted in temperature.
1 is built in to prevent the solvent in the solvent tank 68 from condensing on the lower surface of the lid 80. The lid 80 is provided with a slit 80a extending in the X direction. The slit 80a is formed so that a discharge nozzle 85 as a coating liquid discharge nozzle described later can move in the range.
It suffices that the moving range necessary for supplying the resist solution to the wafer W of No. 5, that is, from one end to the other end of the diameter of the wafer W, is opened. However, in this embodiment,
The discharge nozzle 8 is provided from the outer side of the inner container 62 in the positive X direction.
Since the nozzle transfer arm 130 for replacing the nozzle 5 is provided, the length of the slit 80a is extended in the positive X direction so that the discharge nozzle 85 can move to the replacement position S.

In the slit 80a of the lid 80 described above,
The discharge nozzle 85 is provided so that the resist liquid can be discharged while moving to the lower wafer W. As shown in FIG. 6, the discharge nozzle 85 is fixed to a holder 100 to be described later.
0 is attached to the slider 91. Slider 9
1 is fixedly provided on a part of the drive belt 92 extending in the X direction. The drive belt 92 is connected to the lid 8.
The drive pulley 96 is hung between the drive pulley 96 and the driven pulley 97 provided on the base plate 93a on the
Is rotated forward / reversely by the rotation drive motor 98. Accordingly, the slider 91 moves with the movement of the driving pulley 96 and the driven pulley 97, and as a result, the discharge nozzle 85 reciprocates in the slit 80a of the lid 80.

When the slider 91 moves, the slider 9 moves.
Guide shafts 105a and 105 for preventing and guiding the swing of the first shaft 105
b. The guide shafts 105 a and 105 b are provided vertically above and below the drive belt 92, penetrate through the slider 91, and have a drive pulley 96 and a driven pulley 97.
Are connected to the brackets 107 and 108. The contact surface between the slider 91 and the guide shafts 105a and 105b is
A gap for supplying air is provided. By supplying air, the slider 91 and the guide shafts 105a, 105
The configuration is such that the contact resistance b can be eliminated.

On the other hand, a balance weight 110 having the same mechanism as that of the slider 91 is also provided on the drive belt 92 on the side that does not hold the discharge nozzle 85. The balance is 91 with weight.

By the above-described mechanism for moving the discharge nozzle 85, the discharge nozzle 85 discharges the resist liquid while relatively moving with respect to the lower wafer W, and the inner container 62 moves intermittently in the Y direction. Accordingly, the resist liquid can be supplied to the entire surface of the wafer W in a so-called one-stroke manner. Further, when replacing the discharge nozzle 85, the discharge nozzle 85 can be moved to the replacement position S outside the inner container 62 described above.

As shown in FIG. 7, the discharge nozzle 85 for discharging the resist solution onto the wafer W has a substantially cylindrical inner body 126 as a support member and a nozzle plate 125 as a thin plate for closing the lower surface thereof. And a discharge port 124 is formed at the center of the nozzle plate 125. The nozzle plate 125 has an inner body 126
Body 127 as a holding member screwed on the outside of the body
Thereby, the inner body 126 is closely fixed to the lower surface.

The side surface of the substantially cylindrical outer body 127 is formed flat, and the discharge nozzle 8
5 is held in close contact with a holder 100 described later. In addition, FIG.
As shown in FIG. 2, two concave portions 127a and 127b are formed, and convex portions 100g and
It fits with 100h at the time of suction. Also,
A hole is provided near the center of the lower end surface of the outer body 127 so as not to hinder the discharge of the resist solution.

As shown in FIG. 7, a nozzle plate 125 and a Peltier element 129, which make it possible to set the temperature of the resist liquid to be discharged to a predetermined temperature, are attached to the discharge nozzle 85, for example. I have.

The outer surface of the inner body 126 and the inner surface of the outer body 127 are threaded, and the nozzle plate 125 can be removed by removing the outer body 127 from the inner body 127. Accordingly, it is possible to quickly and easily cope with a case where the nozzle plate 125 is contaminated or a case where the nozzle plate 125 is replaced with a material having a different diameter such as various materials and shapes.

Here, the holder 100 will be described in detail with reference to FIG. First, the outer shape of the holder 100 is formed in a substantially L-shape including a vertical portion 100a and a horizontal portion 100b. The outer surface of the vertical portion 100a
It is formed flat, and is attached in close contact with the slider 91 described above.

An elliptical shallow suction concave portion 100c is formed on the inner surface of the vertical portion 100a.
A plurality of suction ports 100d are opened near the center of 00c. Further, a suction path 100e leading to the suction port 100d is provided in the vertical portion 100a in the vertical direction so that gas can be sucked from a suction pipe 100f mounted on the upper surface of the vertical portion 100a by a suction device (not shown). It is configured. Therefore, a part of the discharge nozzle 85 described above can be sucked and held by this suction. When the discharge nozzle 85 is to be replaced, the suction nozzle can be easily removed by releasing the suction. The suction recess 100c
An O-ring 101 is provided at the periphery of the O-ring so that gas does not flow in during adsorption.

Also, on the inner surface of the vertical portion 100a,
The recess 12 of the outer body 127 of the discharge nozzle 85 described above
Protrusions 100g and 100h fitted to 7a and 127b are formed to protrude in the horizontal direction (the negative direction in the Y direction). By fitting the convex portions 100g and 100h into the concave portions 127a and 127b, the discharge nozzle 85 is prevented from being displaced or detached from the holder 100 even when the discharge nozzle 85 reciprocates.

On the other hand, the horizontal portion 100b of the holder 100
It is formed flat so as to support the lower end surface of the outer body 127 of the discharge nozzle 85 from below, and has a substantially semicircular cutout 100i so as not to hinder the discharge of the resist solution from the discharge port 124 of the discharge nozzle 85. Is open.

When replacing the discharge nozzle 85 held by the holder 100, as described above,
0 is moved to the exchange position S.
The nozzle transfer arm 130 for transferring the discharge nozzle 85 from the nozzle to a nozzle box 135 serving as a nozzle standby member, which will be described later.
1 are provided.

At the tip of the nozzle transfer arm 130,
As shown in FIG. 10, a grip portion 130a for gripping the discharge nozzle 85 from above is provided, and the discharge nozzle 85 can be gripped or separated. Further, the nozzle transfer arm 130 is provided with a cylinder unit 130 that can be moved up and down.
b. Further, the nozzle transfer arm 130 is provided with a nozzle transfer rail 131 provided along the outer container 61.
The upper part is movable in the Y direction. Therefore, the nozzle transfer arm 130 is movable in the vertical direction and the Y direction,
The discharge nozzle 85 can be received from the holder 100, transferred to the nozzle box 135, and delivered. In this embodiment, since the moving function in the X direction is not provided, the replacement position S, the holding portion 130a, and the receiving portion 1 supporting the discharge nozzle of the nozzle box 135 described later are used.
37 need to be arranged on the same Y axis. However,
The nozzle transfer arm 130 may be provided with a movement mechanism that allows the nozzle transfer arm 130 to freely move in the X direction. In this case, it is not necessary to arrange the nozzle transfer arm 130 on the same Y axis as described above.

The nozzle box 135 for holding the above-mentioned replacement discharge nozzle 85 is supported by a support 136 fixed to the inner wall surface of the outer container 61 as shown in FIGS. It is provided between the inner containers 62.

As shown in FIGS. 11 and 12, the nozzle box 135 has a receiving portion 137 for supporting and receiving the lower portion of the plurality of discharge nozzles 85 on its upper surface. The receiving portion 137 is formed in a concave shape corresponding to the outer shape of the outer body 127 so as to be able to receive a portion below the discharge nozzle 85. The bottom of the receiving portion 137 is formed in a tapered shape that tapers downward. The bottom of the receiving portion 137 has the receiving portion 137.
A solvent introduction port 138 for maintaining the pressure in a solvent atmosphere is provided. This solvent atmosphere is set in the receiving part 137
A solvent provided below is supplied through a solvent atmosphere introduction path 139 from a solvent flow path 140 in which the solvent flows. The solvent atmosphere introduction path 139 is provided for each solvent introduction port 138 of each receiving part 137. The discharge nozzle 8 received by the receiving portion 137 by the solvent atmosphere.
5 is maintained in the solvent atmosphere,
4 is prevented from drying.

Further, each receiving portion 137 has a discharge port 13.
A cleaning liquid supply port 141 as a cleaning liquid supply unit for supplying a cleaning liquid to the nozzle 4 is provided, and the discharge nozzle 85 directly supplies the cleaning liquid to the discharge port 124 during standby to clean the discharge port 124. can do. The cleaning liquid used for cleaning can be discharged from the above-described solvent flow path 140.

The receiving portion 137 is provided with the receiving portion 137.
The lid 142 returns to a closed state when the external force is removed by an elastic body such as a spring. When the discharge nozzle 85 waits at the receiving part 137, the receiving part is closed. The cover 142 is opened, and when the discharge nozzle 85 is carried out, the receiving portion cover 142 is closed. Therefore, the atmosphere of the solvent introduced into the receiving portion 137 is released into the resist coating device 17 and is prevented from affecting the coating process.

Next, the operation of the resist coating apparatus 17 configured as described above will be described together with the photolithography process performed in the coating and developing processing system 1.

First, the wafer carrier 7 takes out one unprocessed wafer W from the cassette C and carries it into the adhesion unit 31 belonging to the third processing unit group G3. Then, the wafer W coated with, for example, HMDS for improving the adhesion of the resist solution is transferred to the cooling device 30 by the main transfer device 13 and cooled to a predetermined temperature. After that, the wafer W is transferred to the resist coating device 17 or 19.

The wafer W coated with the resist liquid by the resist coating device 17 or 19 in a so-called one-stroke manner described later is then moved by the main transfer device 13 to a vacuum drying device 33, a pre-baking device 34, a cooling device. It is sequentially conveyed to 40. Then wafer W
In each of the processing apparatuses, a series of predetermined processes such as an exposure process and a development process are performed, and the coating and developing process ends.

The operation of the resist coating device 17 will be described in detail. First, the wafer W cooled to a predetermined temperature in the cooling device 30 is transferred to the main transfer device 13.
Is carried into the casing 60 of the resist coating device 17. At this time, the inner container 62 in the outer container 61 is on standby in the transfer unit L in advance, and the wafer W is directly mounted on the mounting table 65 by the main transfer device 13 and is suction-held. Here, a notch or orientation flat of the wafer W is detected by a rotation mechanism 66 by an alignment mechanism (not shown), and the wafer W is positioned at a predetermined position. Next, the inner container 62 is moved to the processing position R by the inner container driving mechanism 64. Thereafter, the mask member 70 waiting in the cleaning unit is transported from outside the outer container 61 into the inner container 62 by a transport mechanism (not shown), and is placed on the mask support member 71.

Next, the gas inside the inner container 62 is exhausted at a predetermined speed from the exhaust port 73, and the inside of the inner container 62 is maintained at a predetermined atmosphere. Then, in the inner container 62, the holder 1
The resist liquid is applied while the discharge nozzle 85 held at 00 is moved relative to the wafer W, and a resist film is formed on the wafer W.

FIG. 13 shows an example of the application route of the resist solution. For example, as shown in FIG.
Discharges the resist liquid onto the wafer W while moving at a predetermined speed from the START position in the positive X direction (rightward in FIG. 13). At this time, in the discharge nozzle 85, a resist solution pressure-fed from a resist solution supply source (not shown) at a predetermined pressure passes through the inner body 126 and is discharged from the discharge port 124 of the nozzle plate 125. Further, the Peltier element 129 attached to the discharge nozzle 85 maintains the discharge port 124 at a predetermined temperature and a predetermined diameter.
, A resist solution having a predetermined diameter is discharged in a thread form.

Thereafter, the discharge nozzle 85 advances to a distance longer than the diameter of the wafer W, that is, to a position always outside the end of the wafer W, and temporarily stops on the mask member 70. Also at this time, the resist liquid continues to be discharged, and the resist liquid discharged to a place other than the wafer W is applied to the mask member 70.
And is drained. Then, the inner container 62 is shifted by a predetermined distance in the Y direction by the inner container driving mechanism 64,
The wafer W also shifts in the Y direction. After that, the discharge nozzle 85
Is turned back, and while continuing to apply the resist solution,
It moves in the negative direction of the X direction, and similarly advances to the outside of the wafer W and stops. Then, the wafer W is displaced in the Y direction by a predetermined distance, and the discharge nozzle 85 again applies the resist liquid to the folded wafer W.

By repeating the above steps, the discharge nozzle 85
However, when it reaches the END position shown in FIG. 13, the discharge is stopped, and the application is completed. Thereby, the discharge nozzle 85
13 is as shown in FIG. 13, and the resist liquid is applied to the entire surface of the wafer W in a so-called one-stroke manner. Thereafter, the high-frequency vibrator 67 attached to the mounting table 65
As a result, the wafer W is vibrated, and the resist liquid on the wafer W is flattened. Finally, the resist solution is applied evenly to the application area on the wafer W, and a resist film having a predetermined thickness is formed.

After completion of the application of the resist solution, the mask member 7
0 is carried out of the outer container 61 by a transport mechanism (not shown), and then the inner container 62 is moved to the transport unit L by the inner container drive mechanism 64. Then, it is carried out of the casing 60 by the main carrying device 13, carried to the vacuum drying device 33 where the next step is performed, and subjected to a reduced pressure drying process.

The discharge nozzles 85 used in the above-described coating process are provided at every predetermined number of processed wafers W, or
It is exchanged every recipe or every predetermined time. Hereinafter, this exchange process will be described.

First, as shown in FIG. 10, the discharge nozzle 85 having completed the coating process on the wafer W is moved to the replacement position S by the drive belt 92 while being suction-held by the holder 100. At this time, the nozzle transfer arm 130 that has been waiting at the predetermined position also moves along the nozzle transfer rail 131 to above the replacement position S and stands by. Then, the suction force from the suction pipe 109f is locked in the holder 100, and the suction of the discharge nozzle 85 is released. Thereafter, the nozzle transfer arm 130 is lowered by the cylinder portion 130b, and the discharge nozzle 85 is gripped from above by the grip portion 130a. next,
The nozzle transfer arm 130 moves horizontally in the negative Y direction. Then, the nozzle box 135 moves as it is along the nozzle transport rail 131, and stops above the empty receiving portion 137 where nothing is supported in the nozzle box 135. Then, the nozzle transfer arm 130 is lowered by the cylinder part 130b, and the lower part of the discharge nozzle 85 is delivered into the receiving part 137 as shown in FIG. At this time, the receiving portion cover 142 provided on the receiving portion 137 shown in FIG. Thereafter, the grip 130 a releases the discharge nozzle 85, and the discharge nozzle 85 is supported by the receiving portion 137.

The nozzle transfer arm 130 grips another selected ejection nozzle 150 and moves up. Thereafter, the route is followed in reverse, moves in the positive direction of the Y direction, and moves to just before the exchange position S. Thereafter, the concave portions 150a and 150b of the discharge nozzle 150 are slowly fitted into the convex portions 100g and 100h of the holder 100. At this time, immediately before the side surface of the discharge nozzle 150 and the inner side surface of the vertical portion 100a of the holder 100 come into contact with each other, for example, it is temporarily stopped at about a few mm before the discharge nozzle 15
At the same time as suctioning 0, the gripper 130a of the nozzle transfer arm 130 may separate the discharge nozzle 150. By doing so, the nozzle transfer arm 130
When the ejection nozzle 150 is fitted to the holder 100, the pressing force of the ejection nozzle 150 prevents a load on the moving mechanism of the slider 91, for example, the guide shafts 105a and 105b, thereby preventing damage.

Thereafter, the discharge nozzle 150 is completely sucked and held by the holder 100, and the nozzle transfer arm 130 is
Move to a predetermined position and wait for the next nozzle replacement.

On the other hand, the receiving portion 13 of the nozzle block 135
The discharge nozzle 85 supported by the nozzle 7 is maintained in a solvent atmosphere by the solvent evaporated from the solvent flow path 140, and drying of the discharge port 124 of the discharge nozzle 85 is prevented. Thereafter, the cleaning liquid is supplied to the receiving portion 137 from the cleaning liquid supply port 141, and the discharge port 124 is cleaned. The cleaning liquid is discharged together with the solvent from the solvent flow path 140 through the solvent atmosphere introduction path 139. Then, the discharge nozzle 8 after the cleaning is completed.
In a step 5, a dummy dispensing of the resist solution, that is, a trial dispensing is performed, and the process waits until the next use.

According to the above embodiment, the discharge nozzle 8
By sucking and holding the holder 5 on the holder 100 having the suction means, the holder 5 can be strongly held by a lightweight mechanism, so that the discharge nozzle 85 can be suitably moved at high speed. In addition, since the nozzle can be easily attached and detached, the nozzle can be replaced.

The projection 1 of the holder 100 projecting in the direction perpendicular to the moving direction (X direction) of the discharge nozzle 85
00g and 100h are provided in the recesses 127a and 1 of the discharge nozzle 85, respectively.
The fitting to 27b prevents the ejection nozzle 85 from being displaced or detached from the holder 100 due to the inertial force applied during movement. Note that a concave portion may be provided in the discharge nozzle 85 and a convex portion may be provided in the holder 100.

Further, since the projections 100g and 100h are provided so as to protrude in the horizontal direction which is the same direction as the suction direction, the final mounting of the discharge nozzle 85 to the holder 100 is performed by the suction force of the suction means. Can be. Therefore, when the discharge nozzle 85 is held by the holder 100, an unnecessary mechanical load is prevented from being applied. The projections 100g and 100h are provided by discharging in the horizontal direction. However, if the protrusions are perpendicular to the moving direction of the discharge nozzle 85, the protrusions may be in other directions such as a vertical direction depending on the shape of the holder 100. Is also good.

On the other hand, when replacing the discharge nozzle 85, the discharge nozzle 85 is moved from the holder 100 to the nozzle box 135.
To the other discharge nozzles 1 from the nozzle box 135.
A nozzle transfer arm 130 is separately provided as a unit for transferring and transferring the 50 to the holder 100. Therefore,
Compared with the related art in which the nozzle conveying means is attached to a portion corresponding to the holder 100, the holder 100 is reduced in weight and the high-speed movement of the discharge nozzle 85 is realized.

A plurality of receiving portions 137 are provided in the nozzle box 135, and a plurality of discharging nozzles are supported by the receiving portions 137, so that the discharging nozzles can be automatically replaced as necessary, and can be continuously used for a long time. Then, a coating process of a resist liquid can be performed. The vapor of the solvent of the coating solution evaporated from the solvent flow path 140 is supplied into the receiving section 137 and the receiving section 1
The discharge nozzle in 37 can be placed in a solvent atmosphere. Therefore, drying of the discharge port of the discharge nozzle is prevented. The solvent flow path 140 is provided in the nozzle box 135.
Temperature adjusting means for adjusting the temperature of the solvent inside, for example, a heater may be attached to the solvent flow path 140, for example. Thus, the temperature of the solvent in the solvent flow path 140 is changed, and as a result, the evaporation amount of the solvent is changed. Therefore, the solvent concentration in the receiving portion 137 is changed, and a solvent atmosphere can be created according to the type of the coating liquid. Although the solvent of the coating liquid is supplied from the solvent flow path 140 in which the solvent always flows, a solvent storage section for storing the solvent may be provided below the nozzle box 135 and supplied from there. Further, a temperature adjusting means may be provided as in the case of the solvent flow path 140.

Further, the nozzle box 135 is provided with a cleaning liquid supply port 141 for supplying a cleaning liquid to the discharge port 124 of the discharge nozzle 85, and actively cleans the discharge nozzle 85 supported by the receiving portion 137. As a result, the dirt on the discharge nozzle 85 is more completely cleaned, and can be prepared for the next use.

Although the holder 100 of the above embodiment is provided with a suction means for attaching and detaching the discharge nozzle 85, other attaching and detaching means may be used. Hereinafter, other attachment / detachment means will be described.

First, a so-called electromagnet may be used instead of the suction means for sucking a part of the discharge nozzle 85.
Thus, by using an electromagnet, it is possible to change the voltage applied to the electromagnet, to change the attraction force, and to detach the electromagnet.

Next, as shown in FIG.
Is provided with a holding portion 155a for holding the discharge nozzle 85 from the outside, and an air damper 155 as a pressing member which can expand and contract by the inflow and outflow of air is provided inside the holding portion 155a.
b may be provided. Thus, when the air damper 155b expands, the discharge nozzle 85 is held, and when the air damper 155b contracts, the discharge nozzle 85 is released. Therefore, by changing the amount of air to the air damper 155b, the discharge nozzle 8
5 can be attached and detached.

Further, as shown in FIG.
May correspond to the outer shape of the discharge nozzle 85, and may have a substantially cylindrical shape with upper and lower surfaces opened. Further, the discharge nozzle 85 may be provided with a stopper 160a for supporting the discharge nozzle 85. By making the holder 160 into such a so-called pocket shape, the four surfaces of the discharge nozzle 85 can be held by the holder 16.
Thus, even if the discharge nozzle 85 moves at high speed, the discharge nozzle 85 is prevented from being displaced or detached from the holder 160. When replacing the discharge nozzle 85,
Since it is necessary to move the discharge nozzle 85 in the vertical direction and attach and detach it, the nozzle transfer arm 130 needs a moving mechanism in the vertical direction.

Although the discharge nozzle 85 has a structure in which the discharge port 124 is provided on a nozzle plate 125 as a thin plate, a nozzle having another shape, for example, the tip of the nozzle is tapered, and the inner body 126 Outer body 127
May be integrally formed.

The example shown in FIG.
5 is driven by an appropriate driving mechanism (not shown) to, for example, Y
Box 13 to a position where the discharge nozzle can be transferred to the holder 170.
5 shows a configuration in which the discharge nozzle 85 can be replaced by moving the nozzle 5.

In this case, it is appropriate to provide the holder 170 with a gripping member 171 that can be chucked by inflow and outflow of air. Thereby, delivery of the discharge nozzle 85 can be performed more smoothly. FIG.
Reference numeral 71 denotes a state in which the ejection nozzle 85 is gripped. In the same figure, the state of the broken line shows the state where the gripping member is opened. Of course, not limited to the gripping member 171,
The holder holding mechanism described in each of the above embodiments can be employed.

In the above embodiment, the resist liquid is discharged from above the wafer W, but the present invention is directed upward from below the wafer W with the surface of the wafer W facing down. It can also be applied to the case of discharging and forming a resist film. Further, the resist liquid is applied in a so-called one-stroke manner, but the present invention can be applied to other methods such as spin coating in which the wafer W is rotated to apply the resist liquid.

Further, in the above embodiment, a film forming apparatus for applying a resist liquid to the wafer W to form a resist film is described. However, the present invention provides another film forming apparatus such as an insulating film, for example, SOD. , SOG film forming apparatus.
The present invention is also applied to a film forming apparatus for a substrate other than the wafer W, for example, an LCD substrate.

[0096]

According to the first to fourth aspects, the application liquid discharge nozzle is held by a lighter mechanism than in the prior art, and high-speed movement is possible. Further, since the application liquid discharge nozzle is strongly held even when it moves at high speed, the application liquid discharge nozzle does not shift or come off due to inertial force. Therefore, the coating film can be suitably formed on the substrate even under the method of applying the coating liquid in a so-called one-stroke manner.
Furthermore, since the coating liquid discharge nozzle is detachable from the coating liquid discharge nozzle holding member, the nozzle can be replaced, and for example, can be replaced with a predetermined nozzle according to the recipe of the substrate.

According to the fifth to seventh aspects, a projection is provided on one of the coating liquid discharge nozzle or the coating liquid discharge nozzle holding member so as to project in a direction perpendicular to the moving direction of the coating liquid discharge nozzle. On the other hand, since the concave portion that fits with the convex portion is provided, when the application liquid discharge nozzle moves at a high speed in a predetermined direction, these fitting members are locked, and the nozzle is displaced due to inertial force. , Is prevented from coming off. Therefore, even if the coating liquid is discharged onto the substrate while moving the nozzle at a high speed, the coating liquid is appropriately discharged to a predetermined position to form a predetermined film.

In particular, according to the seventh aspect, since the convex portion is provided in the horizontal direction, when the application liquid discharge nozzle is attached / detached, means for transporting the nozzle, for example, the moving direction of the transport arm is horizontal. There is no need to move in a complicated direction such as a diagonal direction. Further, by providing the suction means as described in claims 1 and 2 in a direction perpendicular to the projection, after the two have approached to some extent, only the suction force of the suction means allows the projection and the projection to be connected to each other. The recess can be fitted. By doing so, the load applied when the convex portion is pressed into the concave portion is minimized, and the influence on the peripheral members can be suppressed.

According to the present invention, since the transport means for transporting the coating liquid discharge nozzle is provided, it is possible to preferably exchange the coating liquid discharge nozzle using the transport means when replacing the coating liquid discharge nozzle. it can.

Further, according to the ninth aspect, the transfer means for transferring the coating liquid discharge nozzle from the coating liquid discharge nozzle holding member to the nozzle standby member is provided, so that the coating liquid discharge nozzle can be suitably replaced. . In the case of claim 10, such a transporting means is unnecessary.

According to the eleventh aspect, since the discharge port of the coating liquid discharge nozzle is maintained in a predetermined solvent atmosphere, drying of the coating liquid discharge nozzle is prevented, and contaminants do not adhere to the discharge port. Accordingly, a predetermined coating liquid is discharged onto the substrate, and a predetermined film is formed.

According to the twelfth aspect, a solvent storage section for storing the solvent of the coating liquid is provided, and an atmosphere introduction path for introducing the atmosphere of the storage section to the receiving section of the nozzle standby member is provided. The discharge port of the coating liquid discharge nozzle supported by the section can be maintained in the solvent atmosphere. Therefore, drying of the application liquid discharge nozzle is prevented.

According to the thirteenth aspect, since the temperature adjusting means capable of adjusting the temperature of the solvent in the solvent storing section is provided,
The evaporation amount of the solvent in the coating liquid can be adjusted. Therefore, the concentration of the solvent in the receiving portion of the nozzle standby member can be adjusted, and the concentration of the solvent can be adjusted according to the type of the coating liquid, so that the drying of the coating liquid discharge nozzle can be prevented.

According to the fourteenth aspect, a solvent flow path through which the solvent of the coating liquid flows is provided, and an atmosphere introduction path for introducing the atmosphere of the solvent flow path into the receiving portion of the nozzle standby member is provided. In order to prevent the liquid discharge nozzle from drying,
At any time, fresh solvent can be introduced into the receptacle. Therefore, the coating liquid discharge nozzle supported by the receiving portion can be maintained in a fresh solvent atmosphere, and can prevent drying.

According to the fifteenth aspect, in order to adjust the temperature of the solvent in the solvent flow path, the coating solution discharge nozzle supported by the receiving portion is operated in an atmosphere having a solvent concentration suitable for the coating solution to be used. You can wait.

According to the sixteenth aspect, since the cover which can be opened and closed is provided at the receiving portion of the nozzle standby member, the receiving portion is covered when the coating liquid discharge nozzle is not supported by the receiving portion. It is possible to prevent the solvent atmosphere from being discharged from the section and affecting the atmosphere of the entire film forming apparatus.

According to the seventeenth aspect, since the cleaning liquid supply unit for supplying the cleaning liquid is provided at the discharge port of the coating liquid discharge nozzle, the nozzle is actively cleaned during standby. Therefore, there is no need to separately provide a cleaning device, and a simpler film forming apparatus is provided.

According to the eighteenth aspect, since a thin plate capable of easily forming a small hole diameter is used for the coating liquid discharge nozzle, the coating liquid can be supplied to the substrate from an extremely small discharge port. As a result, for example, the amount of the coating liquid that is constantly discharged to the outside of the substrate is reduced. In addition, since the diameter of the discharge port can be reduced, the discharge amount and discharge portion of the coating liquid can be strictly controlled. Therefore, cost reduction and improvement in yield can be achieved.

According to the nineteenth aspect, since the coating liquid discharge nozzle holding member is attached to a belt movable in a predetermined direction, a coating method for discharging the coating liquid to the substrate while moving the coating liquid discharge nozzle is used. Even in such a case, the film formation processing of the substrate is suitably performed.

[Brief description of the drawings]

FIG. 1 is a plan view showing an appearance of a coating and developing system according to an embodiment.

FIG. 2 is a front view of the coating and developing system of FIG.

FIG. 3 is a rear view of the coating and developing system of FIG. 1;

FIG. 4 is an explanatory view of a longitudinal section of the resist coating apparatus according to the present embodiment.

FIG. 5 is an explanatory diagram of a cross section of the resist coating apparatus according to the exemplary embodiment;

FIG. 6 is a perspective view showing a moving mechanism of a discharge nozzle.

FIG. 7 is an explanatory view showing a vertical end surface of a discharge nozzle used in the resist coating device.

FIG. 8 is a perspective view showing the appearance of a discharge nozzle.

FIG. 9 is a perspective view showing a holder of the discharge nozzle.

FIG. 10 is a perspective view showing a discharge nozzle moving mechanism, a nozzle transfer arm, and a nozzle box.

FIG. 11 is an explanatory diagram showing a vertical end surface of a nozzle box.

FIG. 12 is a perspective view showing the appearance of a nozzle box.

FIG. 13 is an explanatory diagram showing a coating route of a resist liquid according to the present embodiment.

FIG. 14 is a perspective view showing another form of the holder.

15A and 15B are explanatory views of another form of a holder, wherein FIG. 15A is a plan view, FIG. 15B is a longitudinal sectional view, and FIG. 15C is a bottom view.

FIG. 16 is a perspective view showing a nozzle box that can be moved to a position where a discharge nozzle can be delivered to a holder.

[Explanation of symbols]

 Reference Signs List 1 coating / developing processing system 17 resist coating device 62 inner container 85 discharge nozzle 100 holder 100a vertical portion 100b horizontal portion 100c suction concave portion 100d suction port 100e suction path 100f suction pipe 100g, 100h convex portion 130 nozzle transfer arm 135 nozzle box S replacement position W wafer

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Yukihiko Ezaki 2655 Tsukurei, Kikuyo-cho, Kikuchi-gun, Kumamoto Tokyo Inside the Electron Kyushu Co., Ltd. Inside Electron Kyushu Kumamoto Office (72) Inventor Nohisa Koga 2655 Tsukurei, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Tokyo Electron Kyushu Corporation Kumamoto Office, 2655 No. 2655 Tsukurei, Kikuyo-cho, Kikuchi-gun, Kumamoto Tokyo Electron Kyushu Co., Ltd.Kumamoto Office (72) Inventor Hirofumi Okuma 2655 Tsukurei, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Tokyo Electron Kyushu Corporation Kumamoto Office, 2655 Address Tokyo Electron Kyushu Kuma Co., Ltd. Business house

Claims (19)

[Claims] 1. A film forming apparatus for forming a film on a surface of a substrate by discharging a coating liquid from a coating liquid discharge nozzle to a substrate, wherein the film forming apparatus is capable of reciprocating in a predetermined direction parallel to the substrate. A coating liquid discharge nozzle holding member for holding the coating liquid discharge nozzle, wherein the coating liquid discharge nozzle and the coating liquid discharge nozzle holding member are configured to be detachable; An apparatus for forming a film on a substrate, comprising: suction means for sucking a part of a coating liquid discharge nozzle. 2. A film forming apparatus for forming a film on the surface of a substrate by discharging a coating liquid from a coating liquid discharge nozzle onto a substrate, wherein the film forming apparatus is reciprocally movable in a predetermined direction parallel to the substrate. A coating liquid discharge nozzle holding member for holding the coating liquid discharge nozzle, wherein the coating liquid discharge nozzle and the coating liquid discharge nozzle holding member are configured to be detachable; A film forming apparatus for a substrate, comprising: a solenoid for adsorbing a part of a coating liquid discharge nozzle. 3. A film forming apparatus for discharging a coating liquid onto a substrate from a coating liquid discharging nozzle to form a film on the surface of the substrate, wherein the film forming apparatus is reciprocally movable in a predetermined direction parallel to the substrate. A coating liquid discharge nozzle holding member for holding the coating liquid discharge nozzle, wherein the coating liquid discharge nozzle and the coating liquid discharge nozzle holding member are configured to be detachable; It has a gripping member for gripping the coating liquid discharge nozzle from the outside, and the gripping member is provided with a pressing member that can expand and contract with respect to the coating liquid discharge nozzle by the inflow and outflow of air. Do,
Substrate film forming equipment. 4. A film forming apparatus for forming a film on a substrate by discharging a coating liquid onto a substrate from a coating liquid discharge nozzle, wherein the film forming apparatus is reciprocally movable in a predetermined direction parallel to the substrate. A coating liquid discharge nozzle holding member for holding the coating liquid discharge nozzle, wherein the coating liquid discharge nozzle and the coating liquid discharge nozzle holding member are configured to be detachable; It has a substantially cylindrical shape with upper and lower surfaces opened corresponding to the outer shape of the coating liquid discharge nozzle.
The coating liquid discharge nozzle holding member has a support portion for supporting the coating liquid discharge nozzle, and is a substrate film forming apparatus. 5. The coating liquid discharge nozzle holding member has a convex portion projecting in a direction perpendicular to the predetermined direction, and the coating liquid discharge nozzle has a concave portion fitted to the convex portion. 4. The substrate film forming apparatus according to claim 1, wherein: 6. The coating liquid discharge nozzle has a convex portion projecting in a direction perpendicular to the predetermined direction, and the coating liquid discharge nozzle holding member has a concave portion fitted to the convex portion. 4. The substrate film forming apparatus according to claim 1, wherein: 7. The substrate film forming apparatus according to claim 5, wherein the convex portion protrudes in a horizontal direction. 8. A transfer means for transferring the coating liquid discharge nozzle movably at least within a moving range of the coating liquid discharge nozzle, wherein the transfer means holds the coating liquid discharge nozzle to hold the coating liquid discharge nozzle. 4. The method according to claim 1, wherein the member is configured to be freely delivered to a member.
8. The substrate film forming apparatus according to any one of 3, 4, 5, 6 and 7. 9. A nozzle standby member capable of supporting a plurality of the application liquid discharge nozzles, wherein the nozzle standby member is provided within a moving range of the transfer means, and the transfer means is provided with respect to the nozzle standby member. 9. The apparatus according to claim 8, wherein the application liquid discharge nozzle is configured to be able to be delivered.
A film forming apparatus for a substrate according to claim 1. 10. A nozzle standby member capable of supporting a plurality of the coating liquid discharge nozzles, and the nozzle standby member moves to a position where the coating liquid discharge nozzle can be transferred to the coating liquid discharge nozzle holding member. The substrate film forming apparatus according to any one of claims 1, 2, 3, 4, 5, 6, and 7, wherein the apparatus is configured to be capable of being configured. 11. The nozzle standby member has a receiving portion for receiving and supporting a discharge port of the coating liquid discharge nozzle, and the receiving portion is configured to be maintained in a solvent atmosphere of the coating liquid. 11. The substrate film forming apparatus according to claim 9, wherein: 12. A method according to claim 1, further comprising: a solvent storage section for storing a solvent of the coating liquid below the nozzle standby member, and an atmosphere introduction path for introducing the atmosphere of the storage section to the receiving section. An apparatus for forming a film on a substrate according to claim 11. 13. The apparatus according to claim 12, further comprising a temperature control means for controlling a temperature of the solvent in the solvent storage section.
A film forming apparatus for a substrate according to claim 1. 14. A method according to claim 14, further comprising: a solvent flow path through which the solvent of the coating liquid flows, and an atmosphere introduction path for introducing the atmosphere of the solvent flow path into the receiving section below the nozzle standby member. An apparatus for forming a film on a substrate according to claim 11. 15. The apparatus for forming a film on a substrate according to claim 14, further comprising a temperature control means for controlling a temperature of the solvent in the solvent flow path. 16. The apparatus according to claim 10, further comprising a cover capable of opening and closing said receiving portion.
16. The film forming apparatus for a substrate according to any one of 4 and 15. 17. A cleaning liquid supply part for supplying a cleaning liquid to a discharge port of a coating liquid discharge nozzle supported by the receiving part.
17. The substrate film forming apparatus according to any one of 4, 15 and 16. 18. The coating liquid discharge nozzle is provided on a substantially cylindrical support member, a thin plate provided on the surface of the support member on the substrate side to close the surface on the substrate side, and formed on the thin plate. A discharge port having a predetermined diameter, and a holding member for fixing the thin plate to the support member from the outside. 9,1
The film forming apparatus for a substrate according to any one of 0, 11, 12, 13, 14, 15, 16 and 17. 19. The apparatus according to claim 1, wherein said coating liquid discharge nozzle holding member is attached to a belt movable in said predetermined direction.
8, 9, 10, 11, 12, 13, 14, 15, 16,
19. The substrate film forming apparatus according to any one of 17 and 18.