JP2001237550A - Multilayered printed board and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayered printed wiring board having high parts mounting reliability by improving the strength of adhesion between conducting patterns for external layer and insulating layers, in the mounting of the parts on small-diameter lands represented by a narrow-pitch BGA with a very high arrangement for laying space of wiring. SOLUTION: Internal layer material conducting patterns 2 are formed on both sides of each insulating substrate 3 having conductive holes filled up with conductive paste 4 by screen printing or photography method. Metal foil 5 coated with an insulating resin is superposed upon both surfaces of an internal layer material obtained by laminating the insulating substrates 3 thus obtained upon another and pressurized to the material 1 by heat pressing. Then the metal foil is etched off from the portions where the non-through holes 6 of the outermost layer are formed. Thereafter, the non-through holes 6 are formed with a laser beam having a diameter larger than the inside diameters of the holes 6. After the formation of the holes 6, the whole surface of the laminate is plated with a metal and, thereafter, this multilayered printed wiring board 9 on which SVHs 7 and conductive patterns 8 for external layers are formed is manufactured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board used for various electronic devices such as a personal computer, a mobile communication telephone, and a video camera, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, as electronic devices have become more sophisticated and higher in density, electronic components, especially semiconductors as the center of the electronic components, have tended to become smaller, more highly integrated, operate at higher speeds, and have more pins.

Accordingly, multilayer printed wiring boards are required not only to improve the wiring accommodating property and the surface mounting density, but also to improve the reliability of the joining strength between components and a board due to the reduction in the diameter of a soldering land. I have. Specifically, 0.5
mm pitch ball grid array (hereinafter referred to as BGA)
High-density and small-diameter land (φ0.3m
m or less) (particularly mechanical stress such as drop impact)
There is a demand for a printed wiring board to meet the requirements.

As a means for responding to these problems, a resin multilayer printed wiring board in which all layers are electrically connected by interstitial via holes (hereinafter referred to as IVH) is used as an inner layer material, and a photosensitive resin or a film is provided on both surfaces of the inner layer material. A multi-layer printed wiring board having a structure in which a non-through hole is formed by applying or laminating an insulating layer in a shape, and the layers are electrically connected by metal plating.

A method for manufacturing the multilayer printed wiring board will be described below.

FIGS. 3 (a) to 3 (d) and FIGS. 4 (e) and 4 (f) show a conventional multi-layer printed wiring board having a structure in which a photosensitive resin or the like is coated or laminated on the outermost layer as an insulating layer. It shows the method. 3 and 4,
11 is a conductor pattern for an outer layer, 12 is an insulating layer, 13 is an inner layer material, 14 is an insulating substrate, 11a is a surface via hole (hereinafter referred to as SVH) in which a non-through hole formed in the insulating layer is metal-plated, and 12a is Non-through holes formed by exposure / development or laser on insulating layer 12 to form SVH
4a is a conductor pattern for the inner layer material, 14b is a conductive paste for the inner layer material, 14c is prepreg, 14d is copper foil,
Reference numeral 15 denotes a multilayer printed wiring board having conductor patterns inside and outside. A method for manufacturing the multilayer printed wiring board configured as described above will be described below.

First, as shown in FIG. 3A, a hole is formed in a prepreg 14c, and a conductive paste 14 is formed in the hole.
A copper foil for forming a copper-clad laminate is overlapped on both sides of the insulating substrate 14 filled with b and adhered by a hot press or the like, and then the inner layer material is formed by using a known screen printing method or photographic method. Conductor pattern 14a is formed.

Next, as shown in FIG. 3B, a hole is formed in the prepreg 14c by the same method on the insulating substrate 14 formed in the above step (a), and the hole is filled with the conductive paste 14b. The object and the copper foil 14d are overlapped and heated and pressed by a hot press.

Next, the copper foil of the copper-clad laminate formed in the above (b) is formed into a conductor pattern 14a by using a known method such as a screen method or a photographic method, and FIG. As shown, an inner layer material 13 is obtained.

Next, as shown in FIG.
After an insulating layer 12 of a photosensitive type resin or the like is formed thereon by coating or laminating in a semi-cured state, FIG.
As shown in (e), a non-through hole 12a is formed at a predetermined position by exposure, development, laser, or the like.

Next, as shown in FIG. 4 (f), after a non-through hole is formed, a conductor pattern 11 for an outer layer including an SVH 11a for electrically connecting the inner and outer layers is formed by metal plating, and a multilayer print is formed. The wiring board 15 is obtained.

Thereafter, solder resist formation, outer shape processing, and the like are performed by a known method such as a photographic method.

[0013]

In the structure of the above-mentioned conventional multilayer printed wiring board, the inner layer material has an IVH in all layers and at an arbitrary position, and the outer layer has a non-through hole of 50 to 100 μm.
It can form a hole as small as m, and has very excellent features in terms of wiring accommodation and surface high-density mounting, but the small diameter of the soldering land accompanying the recent high integration and high density of BGA It has become essential to improve the bonding strength between the outer layer conductor pattern and the base material due to the progress of the process.In this conventional structure, the conductor pattern is formed by metal plating on the insulating resin. With only plating, the adhesion to metal is not strong, and this conductor pattern can peel off from the insulating layer due to mechanical stress especially when high-density components are mounted (soldering on small-diameter lands). There was also nature.

Also, the difference in physical characteristics due to the difference in the curing process between the resin forming the inner layer material and the insulating layer 12 forming the outermost layer is large, and the adhesion between the inner layer material and the outermost layer is weak, or the component mounting process is difficult. Heat during soldering
Cracks and delamination between the inner layer material and the outermost layer may occur due to the difference in thermal expansion coefficient.

The present invention solves the above-mentioned conventional problems, and improves the bonding strength between the outer conductor pattern and the insulating layer while maintaining the conventional features in the wiring accommodating property and the surface high-density mounting. It is an object of the present invention to provide a multilayer printed wiring board having good mounting reliability against mechanical stress on highly integrated and high density components such as a 0.5 mm pitch BGA.

[0016]

In order to achieve this object, a multilayer printed wiring board according to the present invention has a strong adhesion to metal, in advance, on both surfaces of the inner layer material of the conventional all-layer IVH structure. After applying and heating and pressing a metal foil with an insulating resin, which is coated with an insulating resin, a non-through hole is provided, metal plating is applied, and the conductive pattern for the inner layer material and the conductive pattern for the outer layer are electrically connected. It has a configuration consisting of steps.

According to the present invention, the inner layer material has a structure in which the IVH is formed not by metal plating but by a conductive paste.
The land of the IVH portion of the inner layer material can be formed flat both up and down, and the SVH by metal plating from the outer layer can be easily formed on this land. Since the metal foil with insulating resin is used as the outer layer material, the adhesive strength between the insulating resin and metal foil is dramatically improved, and good component mounting strength is obtained even when the outer conductor pattern has a small diameter. The feature is that it can be held.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION According to the first aspect of the present invention, a conductive paste is filled in a through-hole formed in a sheet-shaped resin-impregnated base material, and a conductive pattern is formed by a metal foil bonded on both surfaces. An inner layer material formed, a non-through hole formed in a metal foil layer with an insulating resin formed on both surfaces of the inner layer material, a conductive pattern formed on the outer surface of the non-through hole, and a conductive pattern for the inner layer material. The structure is a multi-layer printed wiring board provided with interstitial via holes that connect to each other. With this structure, it has a very high wiring capacity, and the adhesive strength between the outer layer conductive pattern and the base material is improved. The multilayer printed wiring board is extremely strong and realizes high mounting reliability even in a small-diameter land.

According to a second aspect of the present invention, a step of forming a through hole in a sheet-shaped resin-impregnated base material, a step of filling a conductive paste in the through-hole, and a step of forming metal on both surfaces of the resin-impregnated base material are provided. A step of laminating and heating and pressing the foil, a step of forming a circuit to form an inner layer material having conductive patterns on both surfaces, and a step of laminating and heating and pressing a metal foil layer with an insulating resin on both outermost layers of the inner layer material. A step of providing a non-through hole in the outermost metal-insulated metal foil layer with an insulating resin, and a step of electrically connecting a conductive pattern formed in the inner layer material and the outermost metal foil layer through the non-through hole. In this method, the conductive patterns for the inner layer material are electrically connected to each other through the through holes formed by the conductive paste, and the conductive patterns for the inner layer material and the outer layer are formed by this method. By electrically connecting subjected to metal plating on the non-through hole formed by over THE, the inner layer material I
Since the structure in which the SVH of the outer layer can be formed on the VH land becomes easy, there is an effect that a very high wiring accommodating property is obtained. Furthermore, the outer layer material is coated with an insulating resin that has strong adhesiveness to the metal.Since a metal foil with an insulating resin is used, it has the effect of improving the adhesive strength between the outer layer conductor pattern and the insulating resin. Have.

According to a third aspect of the present invention, there is provided a method for manufacturing a multilayer printed wiring board according to the second aspect, wherein the through holes and the non-through holes are formed by laser processing. This has the effect that non-through holes having a smaller diameter can be formed with higher productivity.

According to a fourth aspect of the present invention, when a non-through hole is formed in the outermost metal-laminated metal-laminated layer, the metal-laminated portion is removed in advance. With this method, it is possible to process with a laser diameter larger than the diameter of the non-through hole, and it is not necessary to control the laser processing position accuracy in each non-through hole. Non-through holes can be formed with high productivity.

According to a fifth aspect of the present invention, the step of electrically connecting is metal plating.
According to the method for manufacturing a multilayer printed wiring board described above, the method has an effect of lowering a resistance value by metal plating and improving reliability.

According to a sixth aspect of the present invention, in the step of providing a non-through hole in the outermost metal foil layer with insulating resin, the metal foil in the portion to be formed is removed in advance, and the diameter is larger than the diameter of the hole. 3. The method for manufacturing a multilayer printed wiring board according to claim 2, wherein the laser processing is performed by a laser beam having a laser beam having a laser beam diameter. Is absorbed by increasing the size, and a non-through hole is reliably formed.

According to a seventh aspect of the present invention, there is provided a multilayer printed wiring board and a method of manufacturing, wherein the resin of the sheet-shaped resin-impregnated base material and the resin of the metal foil with the insulating resin are the same material. If the same resin as the prepreg of the inner layer material is used as the epoxy resin using the resin of the metal foil with the insulating resin as the epoxy resin, the most favorable characteristics are the warpage after reflow and the heat resistance (layer separation). It has the effect of being obtained.

According to the ninth and tenth aspects of the present invention, there is provided a multilayer printed wiring board wherein the sheet-shaped resin-impregnated substrate is a compressible porous substrate made of an aromatic polyamide impregnated with a thermosetting resin. The reliability is improved by using a lightweight and highly heat-resistant base material, and the connection reliability between the conductor protrusions and the metal foil is increased by using a compressible porous base material. Has the effect of improving

According to the eleventh aspect of the present invention, a conical or pyramid-shaped conductor projection is formed at a predetermined position of the conductive metal foil, and a sheet-shaped resin-impregnated base material is formed on the conductor projection formation surface. A metal foil is laminated by heating, the conductor protrusion penetrates the resin-impregnated base material, the conductive metal foils on both sides are electrically conducted, and the inner layer plate on which the conductor circuit is formed has a metal with an insulating resin. An interstitial that connects an outer layer conductive pattern and an inner layer material conductive pattern formed on the outer surface of this layer to a non-through hole formed by laser processing in the metal foil with the insulating resin. This is a multilayer printed wiring board provided with via holes. The configuration of the inner layer board is different from the configuration described in claim 1, so that the options are expanded, and the inner layer board is formed by a simple manufacturing process according to required specifications. thing Multilayer printed wiring with very high wiring capacity, extremely strong bonding strength between the outer layer conductive pattern and the base material, and high mounting reliability even in small-diameter lands. It can be a plate.

According to a twelfth aspect of the present invention, there is provided the multilayer printed wiring board according to the eleventh aspect, wherein the conductive protrusions are formed by curing a conductive paste. A multilayer printed wiring board which can be formed and has a uniform and stable protrusion shape can be provided.

According to a thirteenth aspect of the present invention, a step of forming a conical or pyramid-shaped conductor projection at a predetermined position of the conductive metal foil, a sheet-shaped resin-impregnated base material on the conductor projection formation surface, A step of heating and laminating a conductive metal foil to form an inner layer laminate in which the conductor projections penetrate the resin-impregnated base material, and a step of forming an inner layer conductor circuit on the laminate.
A step of laminating a metal foil with an insulating resin on the laminate for the inner layer, a step of forming a non-through hole in the layer of the metal foil with the insulating resin, A method for manufacturing a multilayer printed wiring board, comprising the steps of electrically connecting via a through-hole. In this method, the conductive patterns for the inner layer material are electrically connected to each other by conductive protrusions, and the inner layer material and the outer layer are electrically connected. By applying metal plating to the non-through holes formed by the laser and electrically connecting the conductive patterns, the S layer of the outer layer is placed on the IVH lands of the inner layer material.
Since the structure in which the VH can be formed becomes easy, there is an effect that a very high wiring accommodating property can be obtained. Furthermore, the outer layer material is coated with an insulating resin that has strong adhesiveness to the metal.Since a metal foil with an insulating resin is used, it has the effect of improving the adhesive strength between the outer layer conductor pattern and the insulating resin. Have.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

(Embodiment 1) FIGS. 1A to 1D are cross-sectional views showing a method for manufacturing a multilayer printed wiring board according to an embodiment of the present invention. In FIG. 1, 1 is an inner layer material,
2 is a conductive pattern for the inner layer material, 3 is an insulating substrate for the inner layer material,
4 is a conductive paste for the inner layer material, 5 is a metal foil with an insulating resin, 6 is a non-through hole formed by laser processing a metal foil with an insulating resin, 7 is an SVH in which the non-through hole is plated with metal,
Reference numeral 8 denotes a conductive pattern for an outer layer, 9 denotes a multilayer printed wiring board having an IVH in an inner layer material, an SVH in an outer layer, and a conductive pattern in all layers.

A method for manufacturing the multilayer printed wiring board configured as described above will be described below.

First, according to the present invention, an aramid nonwoven fabric-based epoxy resin prepreg in a semi-cured state and having compressibility is prepared.

Then, as shown in FIG. 1A, a hole is formed in the aramid nonwoven fabric-based epoxy resin prepreg by a carbon dioxide gas laser.

A copper foil for forming a copper-clad laminate is overlapped on both sides of the insulating substrate 3 in which the conductive paste 4 is filled in the holes and bonded by a hot press or the like, and then a known screen printing method or photographic method is used. The conductive pattern 2 for the inner layer material is formed by using such means as described above, and a prepreg hole is formed on the insulating substrate 3 by the same method, and the hole filled with the conductive paste and the copper foil are laminated. Combined and heated and pressed by a hot press. The copper foil of the copper-clad laminate thus formed is formed with a conductor pattern by using a known method such as a screen method or a photographic method to obtain an inner layer material 1 as shown in FIG. .

Next, as shown in FIG. 1B, a metal foil 5 with an insulating resin (a metal foil coated with a semi-cured insulating resin) is laminated on both surfaces of the inner layer material 1 and hot pressed. Heating and pressurizing.

Prior to laminating the inner layer material 1 and the metal foil 5 with insulating resin, the copper foil of the inner layer material 1 is subjected to a surface roughening treatment such as soft etching and a rust prevention treatment, or a baking treatment. It is possible to improve the adhesion and reduce the internal stress due to the heat shrinkage of the inner layer material and the outermost layer.

The internal stress can be further reduced by using the same insulating resin as the epoxy resin of the aramid nonwoven fabric base epoxy resin prepreg constituting the inner layer material.

The reason for adopting the above configuration as an embodiment of the present invention is as follows.

(1) Paper base material-When a normal hard substrate such as phenol, epoxy resin laminate, polyester or the like is used, laser processing is not practical from the viewpoint of productivity.

(2) The excellent laser processability of the aramid nonwoven fabric is utilized. That is, the laser processing hole of the aramid nonwoven fabric can be made smaller than that of the glass nonwoven fabric, and the conductive paste can be stably filled. In particular, small-diameter hole processing and conductive paste filling are significantly superior to glass cloth substrates.

(3) Even if it is possible to form a small diameter non-through hole having a diameter of 30 to 50 μm in the outermost layer of the surface layer, unless the through hole of the inner layer material is processed with a small diameter, the multilayer printed wiring board can be formed. Because it does not improve wiring accommodation,
Laser processing is applied to the aramid nonwoven fabric.

(4) In the present invention, since a metal foil layer with an insulating resin is formed on the outermost layer, an aramid base material having high physical and mechanical strength is used for the inner layer material. Provided is a multilayer printed wiring board suitable for practical use by using an aramid base material having excellent heat resistance so that the influence of thermal stress at the boundary between the outermost layer and the inner layer material can be reduced as much as possible during full curing.

(5) Using an aramid nonwoven fabric epoxy resin prepreg having compressibility, heat and pressure are applied to form an inner layer material, and then a metal foil 5 with an insulating resin is laminated on both surfaces of the inner layer material. It is effective in alleviating the internal stress in a step requiring a plurality of compressions such as heating and pressurizing, and is also effective in reducing the conduction resistance between the conductive paste of the inner layer material and the copper foil.

Next, a photosensitive etching resist is formed on the entire surface of the metal foil 5 with an insulating resin, and the photosensitive etching resist in a portion where a non-through hole is to be formed is removed by exposure and development. As shown in the figure, the metal foil 5 in the portion forming the non-through hole in the outermost layer is removed in advance with an etching solution such as cupric chloride to form a laser beam having a diameter 5 to 10% larger than the hole diameter. To form a non-through hole 6.

Thereafter, the inside of the non-through hole 6 is treated with a permanganate solution or the like to remove the resin on the exposed surface of the metal foil of the inner layer material 1. This processing can be performed a plurality of times as needed.

Then, as shown in FIG. 1 (d), after the laser hole processing, metal plating such as electroless plating and electroplating is applied to the entire surface, and then the SVH7 or the outer layer is formed by using a method such as a screen printing method or a photographic method. Multilayer printed wiring board 9 on which conductive pattern 8 is formed.

The metal plating on the non-through hole can be buried by metal plating when the hole diameter is 30 to 50 μm, and when the hole diameter is 50 to 100 μm, about 50% of the inside of the non-through hole is reduced. By embedding, the adhesive strength between the SVH 7 and the insulating resin layer can be increased, and
H7 can also be used as a conductor pattern constituting a land for soldering for component mounting, and the component mounting density can be increased.

(Embodiment 2) FIGS. 1 (b), (c),
The details of (d) will be described below.

Referring to FIGS. 1B, 1C and 1D, the land of the IVH portion can be formed smoothly because the inner layer material has a structure in which the IVH is formed not by metal plating but by a conductive paste.
SV on the land easily by metal plating from the outer layer
H can be formed. Epoxy resin was used for the insulating resin in the metal foil with the insulating resin. However, the insulating layer was formed on the outermost layer of the conventional structure on both surfaces of the inner layer material, and then the SVH of the non-through hole and the conductive pattern for the outer layer were formed. Compared to those formed by metal plating, SV in the present invention
The bonding strength between the land of the H portion and the insulating layer of the conductive pattern could be realized about 2 to 5 times (see Table 1).

[0050]

[Table 1]

Further, in the present invention, the semi-cured insulating resin is heated and pressurized by a hot press. Therefore, compared with the conventional method of applying or laminating the insulating resin on the surface of the inner layer material, the present invention provides a method of applying the outermost layer during the coating step. And the result was that the flatness of the surface was significantly improved.

Further, when the epoxy resin used had the same composition as the prepreg of the inner layer material, the most favorable characteristics were obtained in the warpage after reflow and the heat resistance (interlaminar peeling).

As described above, according to the present embodiment, it is possible to significantly improve the adhesive strength between the SVH and the conductive pattern and the insulating layer while having a very high wiring accommodating property. It is possible to provide a multilayer wiring board that can achieve high reliability in mounting.

(Embodiment 3) A method of forming an inner layer material different from the above embodiment will be described.

As shown in FIG. 2A, a conical or pyramid-shaped conductor projection 22 is formed at a predetermined position on a copper foil 21a as a conductive metal foil by a printing method or a transfer method. As shown in FIG. 2 (b), the aramid non-woven fabric epoxy resin prepreg 23 and the copper foil 21b are overlapped, and FIG.
An inner layer laminate 24 having a structure in which the conductor projections 22 penetrate the aramid nonwoven fabric epoxy resin prepreg 23 as shown in FIG.

Thereafter, an inner-layer conductor circuit 25 is formed on the inner-layer laminate 24 (FIG. 2D), and the multilayer circuit is formed through the same steps as in FIGS. 1B to 1D shown in the first embodiment. Form a printed wiring board.

By adopting this method, it can be formed by a simple manufacturing process according to the required specifications.
Further, by adopting this configuration, a multilayer printed wiring board having extremely high wiring accommodation capacity, having extremely strong adhesive strength between the outer layer conductive pattern and the base material, and achieving high mounting reliability even in a small-diameter land. can do.

In the above embodiment, the inner-layer laminate 24 has been described as a double-sided structure. However, the conductor protrusions 22 are formed at predetermined positions on the inner-layer laminate 24, and FIG.
By repeating the steps of FIG. 2C, the inner laminate may have a multilayer structure.

[0059]

As described above, according to the present invention, since the inner layer material has a structure in which the IVH is formed by conductive paste instead of metal plating, the land of the IVH portion of the inner layer material can be formed smoothly, and the land can be easily formed on this land. SVH by metal plating from outer layer
It has a very high wiring accommodating capacity and has applied an insulating resin with strong adhesiveness to metal.The metal foil with insulating resin is used as the outer layer material, so the insulating resin The present invention can realize a multilayer printed wiring board capable of dramatically improving the adhesive strength of a metal foil and maintaining good component mounting strength even when the outer layer conductor pattern has a small diameter.

[Brief description of the drawings]

FIGS. 1A to 1D are cross-sectional views illustrating a process of manufacturing a multilayer printed wiring board according to an embodiment of the present invention.

FIGS. 2A to 2D are cross-sectional views illustrating a process of manufacturing a multilayer printed wiring board according to another embodiment of the present invention.

3 (a) to 3 (d) are cross-sectional views of a manufacturing process of a conventional multilayer printed wiring board.

FIGS. 4 (e) and 4 (f) are cross-sectional views of a manufacturing process of a conventional multilayer printed wiring board.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 inner layer material 2 conductive pattern for inner layer material 3 insulating substrate for inner layer material 4 conductive paste for inner layer material 5 metal foil with insulating resin Conductive pattern for outer layer 9 Multilayer printed wiring board 21a, 21b Copper foil 22 Conductive protrusion 23 Aramid non-woven fabric base material epoxy resin prepreg 24 Inner layer laminate 25 Inner layer conductor circuit

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/40 H05K 3/40 K (72) Inventor Kazuya Oishi 1006 Odakadoma, Kadoma City, Osaka Matsushita Electric Industrial F term in reference (reference) 5E317 AA21 AA24 CC25 CD27 CD32 5E346 AA43 CC05 CC10 DD12 EE09 FF04 FF18 FF24 GG15 HH11 HH25

Claims (13)

[Claims] 1. An inner layer material having a conductive pattern formed by filling a through hole formed in a sheet-shaped resin-impregnated base material with a conductive paste and bonding a metal foil to both surfaces, and formed on both surfaces of the inner layer material. Multi-layer printing with a non-through hole formed in a metal foil layer with insulating resin, and an interstitial via hole connecting the conductive pattern formed on the outer surface and the conductive pattern for the inner layer material to the non-through hole Wiring board. 2. A step of forming a through hole in a sheet-shaped resin-impregnated base material, a step of filling the through-hole with a conductive paste, and bonding and heating and pressing metal foils on both surfaces of the resin-impregnated base material. A step of forming an inner layer material having conductive patterns on both surfaces by forming a circuit, a step of bonding a metal foil layer with an insulating resin to the outermost layers on both surfaces of the inner layer material, and applying heat and pressure; Manufacturing a multi-layer printed wiring board comprising the steps of: providing a non-through hole in a metal foil layer with a metal layer; and electrically connecting the conductive pattern formed on the inner layer material and the outermost metal foil layer via the non-through hole. Method. 3. The method according to claim 2, wherein the through holes and the non-through holes are formed by laser processing. 4. The multi-layer printed wiring board according to claim 2, wherein when the non-through hole is formed in the outermost metal-laminated metal foil layer, the metal foil is removed in advance at the portion where the non-through hole is formed. Production method. 5. The method for manufacturing a multilayer printed wiring board according to claim 2, wherein the step of electrically connecting is metal plating. 6. The step of providing a non-through hole in the outermost metal-laminated metal foil layer with an insulating resin includes removing a metal foil in a portion to be formed in advance and using a laser beam having a laser beam having a diameter larger than the diameter of the hole. The method according to claim 2, wherein the method is performed. 7. The multilayer printed wiring board according to claim 1, wherein the resin of the sheet-shaped resin-impregnated base material and the resin of the metal foil with the insulating resin are the same material. 8. The method according to claim 2, wherein the resin of the sheet-shaped resin-impregnated base material and the resin of the metal foil with the insulating resin are the same material. 9. The multilayer printed wiring board according to claim 1, wherein the sheet-shaped resin-impregnated substrate is a compressible porous substrate made of an aromatic polyamide impregnated with a thermosetting resin. 10. The method for producing a multilayer printed wiring board according to claim 2, wherein the sheet-shaped resin-impregnated substrate is a compressible porous substrate made of an aromatic polyamide impregnated with a thermosetting resin. 11. A conical or pyramid-shaped conductor projection is formed at a predetermined position of a conductive metal foil, and a sheet-shaped resin-impregnated base material and a conductive metal foil are heated and laminated on the conductor projection forming surface. The conductor projections penetrate the resin-impregnated base material,
The conductive metal foils on both sides are electrically conducted, the metal foil with the insulating resin is laminated on the inner layer plate on which the conductor circuit is formed, and the metal foil with the insulating resin is formed by laser processing on the metal foil with the insulating resin. A multilayer printed wiring board comprising a through hole provided with an interstitial via hole for connecting a conductive pattern for an outer layer formed on the outer surface of the layer and a conductive pattern for an inner layer material. 12. The multilayer printed wiring board according to claim 11, wherein the conductive protrusions are formed by curing a conductive paste. 13. A step of forming a conical or pyramid-shaped conductor projection at a predetermined position of a conductive metal foil, and heating a sheet-shaped resin-impregnated base material and a conductive metal foil on the conductor projection formation surface. Laminating, forming a laminate for an inner layer in which the conductor protrusions penetrate the resin-impregnated base material, forming a conductor circuit for the inner layer on the laminate, and forming a metal with an insulating resin on the laminate for the inner layer. A step of laminating a foil, a step of forming a non-through hole in the layer of the metal foil with the insulating resin, and a step of electrically connecting the inner layer conductor circuit and the metal foil with the insulating resin through the non-through hole. A method for manufacturing a multilayer printed wiring board comprising: