JP2001237266A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2001237266A5 JP2001237266A5 JP2000045689A JP2000045689A JP2001237266A5 JP 2001237266 A5 JP2001237266 A5 JP 2001237266A5 JP 2000045689 A JP2000045689 A JP 2000045689A JP 2000045689 A JP2000045689 A JP 2000045689A JP 2001237266 A5 JP2001237266 A5 JP 2001237266A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000045689A JP2001237266A (ja) | 2000-02-23 | 2000-02-23 | 半導体チップ及びその実装方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000045689A JP2001237266A (ja) | 2000-02-23 | 2000-02-23 | 半導体チップ及びその実装方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001237266A JP2001237266A (ja) | 2001-08-31 |
| JP2001237266A5 true JP2001237266A5 (enrdf_load_html_response) | 2007-01-11 |
Family
ID=18568229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000045689A Pending JP2001237266A (ja) | 2000-02-23 | 2000-02-23 | 半導体チップ及びその実装方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001237266A (enrdf_load_html_response) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5151053B2 (ja) * | 2006-03-30 | 2013-02-27 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
| JP5533367B2 (ja) * | 2010-07-07 | 2014-06-25 | 日本電気株式会社 | 電子部品の実装構造及び実装方法 |
| US10274270B2 (en) | 2011-10-27 | 2019-04-30 | Applied Materials, Inc. | Dual zone common catch heat exchanger/chiller |
| WO2013158949A1 (en) | 2012-04-20 | 2013-10-24 | Rensselaer Polytechnic Institute | Light emitting diodes and a method of packaging the same |
| JP6334945B2 (ja) * | 2014-02-17 | 2018-05-30 | スタンレー電気株式会社 | 半導体発光装置、半導体発光素子、及び、半導体発光装置の製造方法 |
| JP2016018966A (ja) * | 2014-07-11 | 2016-02-01 | スタンレー電気株式会社 | 半導体光学素子、及び、素子分散溶液 |
| US10224308B2 (en) * | 2015-07-14 | 2019-03-05 | Goertek, Inc. | Transferring method, manufacturing method, device and electronic apparatus of micro-LED |
| KR102260638B1 (ko) * | 2019-09-26 | 2021-06-04 | 엘지전자 주식회사 | 반도체 발광소자의 자가조립 장치 |
| WO2021054550A1 (en) | 2019-09-19 | 2021-03-25 | Lg Electronics Inc. | Device for self-assembling semiconductor light-emitting diodes |
| JP6842783B1 (ja) * | 2019-10-31 | 2021-03-17 | アルディーテック株式会社 | マイクロｌｅｄディスプレイの製造方法およびマイクロｌｅｄディスプレイ |
| US12176463B2 (en) | 2019-10-31 | 2024-12-24 | Uldtec Co., Ltd. | Semiconductor chip integrated device manufacturing method, semiconductor chip integrated device, semiconductor chip integrated device assembly, semiconductor chip ink, and semiconductor chip ink ejection device |
-
2000
- 2000-02-23 JP JP2000045689A patent/JP2001237266A/ja active Pending