JP2001232559A - Holding member for object to be polished - Google Patents
Holding member for object to be polishedInfo
- Publication number
- JP2001232559A JP2001232559A JP2000044055A JP2000044055A JP2001232559A JP 2001232559 A JP2001232559 A JP 2001232559A JP 2000044055 A JP2000044055 A JP 2000044055A JP 2000044055 A JP2000044055 A JP 2000044055A JP 2001232559 A JP2001232559 A JP 2001232559A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- fiber base
- base material
- polished
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】半導体ウエハー、アルミディ
スク、ガラスディスクや液晶表示用ガラス基板等は表面
平滑性を向上させるために研磨が行われる。本発明は、
前記の研磨において、半導体ウエハー等の被研磨物を保
持するための保持材に関するものである。BACKGROUND OF THE INVENTION Semiconductor wafers, aluminum disks, glass disks, glass substrates for liquid crystal displays, and the like are polished to improve surface smoothness. The present invention
In the above-mentioned polishing, the present invention relates to a holding material for holding an object to be polished such as a semiconductor wafer.
【０００２】[0002]
【従来の技術】上記被研磨物を研磨機内で保持するため
に、従来からＳＫ鋼やステンレス鋼のような金属板や布
基材フェノール樹脂積層板やガラス基材エポキシ樹脂の
積層板の円周に駆動用ギアーを加工し、板内に被研磨物
を保持するための貫通穴を設けたものが多用されてい
た。近年、ガラス繊維積層板を保持材として使用した場
合には保持材そのものの摩減によってガラス粉が発生
し、これが被研磨物の表面のスクラッチ傷の発生原因と
なり、研磨歩留まりの低下を招いていることが明らかに
なり、有機繊維基材を用いた被研磨物保持材が多く提案
されている。2. Description of the Related Art Conventionally, in order to hold the object to be polished in a polishing machine, the circumference of a metal plate such as SK steel or stainless steel, a phenolic resin laminate of a cloth base, or a laminate of a glass base epoxy resin has been conventionally known. In many cases, a driving gear is machined to provide a through hole for holding an object to be polished in a plate. In recent years, when a glass fiber laminate is used as a holding material, glass powder is generated due to abrasion of the holding material itself, which causes scratches on the surface of the object to be polished, and lowers the polishing yield. It has become clear that many holders for polished objects using organic fiber substrates have been proposed.
【０００３】しかし、有機繊維基材を用いた被研磨物保
持材の厚さが１．０ｍｍ以下の場合には研磨機内での負
荷によって保持材そのものが変形し、被研磨物が被研磨
物保持の穴から外れ、クラッシュの発生が多いという欠
点を有していた。また、一方では高弾性率の有機繊維基
材を多く用いた被研磨物保持材はガラス繊維基材エポキ
シ樹脂製保持材に比べて大幅にコストアップとなること
が避けられない。このために、一般のポリエステル繊維
基材を併用すると再び剛直性が低下し、クラッシュ発生
頻度が高くなる欠点がある。特許第２９７４００７号公
報では、パラ系アラミド繊維を主成分とするアラミド繊
維基材を熱硬化性樹脂で含浸した被研磨物保持材が提案
されている。更に、ポリエステル繊維基材を熱硬化性樹
脂で含浸した芯材と、表面がパラ系アラミド繊維を主成
分とするアラミド繊維基材を熱硬化性樹脂で含浸した層
からなる被研磨物保持材が提案されている。しかし、前
者はパラ系アラミド繊維が高価であるため、現実的に使
用できる範囲が限定される。後者は被研磨物保持材の強
度が不十分であるため、被研磨物を研磨するときにクラ
ッシュが発生するという前記記載の問題点を改良できる
ものではなかった。However, when the thickness of the holding material using the organic fiber base material is 1.0 mm or less, the holding material itself is deformed by the load in the polishing machine, and the object to be polished is held. From the holes, and there is a drawback that the crash often occurs. On the other hand, it is inevitable that the holder for the object to be polished using the organic fiber base material having a high modulus of elasticity greatly increases the cost as compared with the glass fiber base material made of epoxy resin. For this reason, when a general polyester fiber base material is used in combination, there is a disadvantage that the rigidity is reduced again and the frequency of occurrence of crashes increases. Japanese Patent No. 2974007 proposes an object-to-be-polished holding material in which an aramid fiber base material containing para-aramid fibers as a main component is impregnated with a thermosetting resin. Furthermore, a core material in which a polyester fiber base material is impregnated with a thermosetting resin, and a polished material holding material having a surface in which an aramid fiber base material having a para-aramid fiber as a main component is impregnated with a thermosetting resin are provided. Proposed. However, in the former case, the para-aramid fiber is expensive, so that the practically usable range is limited. In the case of the latter, the strength of the object-to-be-polished holding material is insufficient, so that the above-mentioned problem that a crash occurs when polishing the object to be polished cannot be solved.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、有機繊維基
材を用いて被研磨物保持材の強度向上を計るべく、鋭意
検討した結果、本発明を完成させたものである。本発明
は、第一に有機繊維基材（ａ）に特定のエポキシ樹脂
（ｂ）を含浸させて得られる被研磨物保持材の強度を著
しく向上させたものであって、特に研磨回転中の強度に
優れ、かつスクラッチ傷の発生がなく、寸法安定性、耐
磨耗性等にも優れた被研磨物保持材を提供するものであ
る。第二にポリエステル繊維基材及びアラミド繊維基材
からなる有機繊維基材（ａ）に特定のエポキシ樹脂
（ｂ）を含浸して得られる被研磨物保持材の強度向上及
びスクラッチ傷の発生の抑制、コスト、寸法安定性等の
高度な要求を総合的に満たしたものであり、特に研磨回
転中の強度に優れた被研磨物保持材を提供するものであ
る。DISCLOSURE OF THE INVENTION The present invention has been completed as a result of intensive studies to improve the strength of a holder for a workpiece to be polished using an organic fiber base material. The present invention is to improve the strength of an object-to-be-polished holding material obtained by first impregnating an organic fiber base material (a) with a specific epoxy resin (b). An object of the present invention is to provide an object-to-be-polished holding material which is excellent in strength, free of scratches, excellent in dimensional stability, abrasion resistance and the like. Second, improvement of the strength of a holding material for a polished object obtained by impregnating an organic fiber base material (a) composed of a polyester fiber base material and an aramid fiber base material with a specific epoxy resin (b) and suppression of generation of scratches The present invention comprehensively satisfies advanced requirements such as cost, dimensional stability, and the like, and provides an object-to-be-polished holding material that is particularly excellent in strength during polishing rotation.
【０００５】[0005]
【課題を解決するための手段】本発明は、有機繊維基材
（ａ）に、ビスフェノール型エポキシ樹脂７５〜３０重
量％及びノボラック型エポキシ樹脂２５〜７０重量％か
らなるエポキシ樹脂（ｂ）を含浸し、これを積層し加熱
加圧してなることを特徴とする被研磨物保持材である。
好ましくは、有機繊維基材（ａ）がポリエステル繊維基
材及びアラミド繊維基材である上記被研磨物保持材であ
る。即ち、本発明は有機繊維基材にエポキシ樹脂を含浸
して得られる被研磨物保持材において、エポキシ樹脂と
してビスフェノール型エポキシ樹脂とノボラック型エポ
キシ樹脂を特定の割合で配合してなることを特徴とする
被研磨物保持材である。According to the present invention, an organic fiber substrate (a) is impregnated with an epoxy resin (b) comprising 75 to 30% by weight of a bisphenol type epoxy resin and 25 to 70% by weight of a novolak type epoxy resin. Then, the object to be polished is characterized by being laminated and heated and pressed.
Preferably, the above-mentioned polished-piece holding material, wherein the organic fiber base material (a) is a polyester fiber base material and an aramid fiber base material. That is, the present invention is characterized in that a polishing material holding material obtained by impregnating an organic fiber base material with an epoxy resin is obtained by mixing a bisphenol type epoxy resin and a novolak type epoxy resin in a specific ratio as an epoxy resin. To be polished.
【０００６】[0006]
【発明の実施の形態】以下、本発明について詳細に述べ
る。本発明に用いる有機繊維基材（ａ）とは、通常アラ
ミド繊維、ポリエステル繊維等からなるペーパー又は、
不織布であるが、これらに限定されるものではない。有
機繊維基材（ａ）は、ポリエステル繊維基材及びアラミ
ド繊維基材の組合せが好ましい。被研磨物保持材のコス
トと他の要求特性である強度（特に研磨回転中の強
度）、スクラッチ傷の発生の抑制等の要求を高度に満た
すからである。有機繊維基材（ａ）は、サイジング処理
を行ったポリエステル繊維基材及びアラミド繊維基材が
好ましい。エポキシ樹脂（ｂ）との接着性に優れ、被研
磨物保持材の強度向上が図れかつ繊維の耐薬品性が向上
し研磨耐久寿命が向上するからである。ここで、サイジ
ング処理とは、繊維処理用水系エポキシ樹脂を用いて繊
維基材に含浸・乾燥して樹脂の付着量が２重量％以上に
したものである。上記アラミド繊維基材は、パラ系アラ
ミド繊維基材がより好ましく用いることができる。他の
特性を維持したまま、被研磨物保持材の強度を顕著に向
上できるからである。有機繊維基材（ａ）は、全芳香族
液晶ポリエステル繊維基材及び又はポリパラフェニレン
ベンゾビスオキサゾール繊維基材（以下，ＰＢＯ繊維基
材）が好ましい。被研磨物保持材の強度を向上すること
ができるからである。また、有機繊維基材（ａ）に上記
のポリパラフェニレンベンゾビスオキサゾール繊維基材
を用いる場合は、エポキシ樹脂はビスフェノール型エポ
キシ樹脂及びノボラック型エポキシ樹脂の組合せに限定
されることなく、一般のエポキシ樹脂を用いることがで
きる。例えば、ビスフェノ−ルＡ型エポキシ樹脂単独で
も十分な強度が得られる。また、全芳香族液晶ポリエス
テル繊維基材もサイジング処理を行うことが好ましい。
本発明の有機繊維基材（ａ）は、引張弾性率が８０Ｇｐ
ａ以上である有機繊維からなることが好ましい。被研磨
物保持材の強度向上を図れるからである。ここで、引張
弾性率は、単繊維の引張弾性率のことであり、ポリパラ
フェニレンテレフタラミド繊維、ポリパラフェニレンベ
ンゾビスオキサゾ−ル繊維、全芳香族液晶ホルリエステ
ル繊維（タイプＩ及びタイプＩＩａ）、ポリイミド繊維
などが挙げられる。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail. The organic fiber substrate (a) used in the present invention is usually a paper made of aramid fiber, polyester fiber, or the like,
Non-woven fabric, but not limited to these. The organic fiber base (a) is preferably a combination of a polyester fiber base and an aramid fiber base. This is because the cost and the other required characteristics of the holder for the object to be polished, such as strength (particularly, the strength during polishing rotation), and the requirement of suppressing the occurrence of scratches are highly satisfied. The organic fiber base (a) is preferably a sizing-treated polyester fiber base or aramid fiber base. This is because the adhesiveness to the epoxy resin (b) is excellent, the strength of the holding material for the object to be polished can be improved, the chemical resistance of the fiber is improved, and the polishing durability life is improved. Here, the sizing treatment is a treatment in which a fiber base material is impregnated with a water-based epoxy resin for fiber treatment and dried to make the resin adhesion amount 2% by weight or more. As the aramid fiber substrate, a para-aramid fiber substrate can be more preferably used. This is because the strength of the holder for the object to be polished can be significantly improved while maintaining other characteristics. The organic fiber base (a) is preferably a wholly aromatic liquid crystal polyester fiber base and / or a polyparaphenylene benzobisoxazole fiber base (hereinafter, PBO fiber base). This is because the strength of the holder for the object to be polished can be improved. When the above-mentioned polyparaphenylene benzobisoxazole fiber substrate is used for the organic fiber substrate (a), the epoxy resin is not limited to a combination of a bisphenol type epoxy resin and a novolak type epoxy resin. Resin can be used. For example, bisphenol A type epoxy resin alone can provide sufficient strength. In addition, it is preferable to perform a sizing treatment on the wholly aromatic liquid crystal polyester fiber base material.
The organic fiber substrate (a) of the present invention has a tensile modulus of 80 Gp.
It is preferable to be composed of an organic fiber having a or more. This is because the strength of the workpiece holding material can be improved. Here, the tensile modulus refers to the tensile modulus of a single fiber, and includes polyparaphenylene terephthalamide fiber, polyparaphenylene benzobisoxazole fiber, wholly aromatic liquid crystal forlyester fiber (type I and type I). IIa) and polyimide fibers.
【０００７】本発明に用いるエポキシ樹脂（ｂ）は、ビ
スフェノール型エポキシ樹脂とフェノールノボラック型
エポキシ樹脂の組合せである。樹脂自体の強度に優れ、
被研磨物保持材の強度向上を図れるからである。ビスフ
ェノール型エポキシ樹脂には、例えば、ビスフェノール
Ｆ型エポキシ樹脂、ビスフェノールＡ型エポキシ樹脂、
ビスフェノールＳ型エポキシ樹脂が挙げられる。これら
の中でも、ビスフェノールＡ型およびビスフェノ−ルＦ
型のエポキシ樹脂が積層板の剛性の点で好ましい。ノボ
ラック型エポキシ樹脂としては、通常フェノールノボラ
ック型エポキシ樹脂及びクレゾールノボラック型エポキ
シ樹脂が使用されるが、これらに限定されるものではな
い。フェノールノボラック型エポキシ樹脂はエポキシ当
量が１７０〜１９０のもの、クレゾ−ルノボラック型エ
ポキシ樹脂はエポキシ当量が１９０〜２３０のものなら
特別なものでなくてもよい。エポキシ樹脂（ｂ）中のビ
スフェノール型エポキシ樹脂とノボラック型エポキシ樹
脂との割合は、ビスフェノール型エポキシ樹脂７５〜３
０重量％、ノボラック型エポキシ樹脂２５〜７０重量％
である。好ましくは、ビスフェノール型エポキシ樹脂７
０〜５０重量％、ノボラック型エポキシ樹脂３０〜５０
重量％である。ビスフェノール型エポキシ樹脂が７５重
量％を越えると、即ちフェノールノボラック型エポキシ
樹脂が２５重量％を下回ると、積層板についての所期の
剛直性が得られない。一方、ビスフェノール型エポキシ
樹脂が３０重量％を下回ると、即ちフェノールノボラッ
ク型エポキシ樹脂が７０重量％を越えると樹脂の硬化物
が脆くなり、被研磨物保持材（キャリア−）としたとき
に研磨耐久寿命を低下させる。また、ビスフェノール型
エポキシ樹脂７０〜５０重量％、ノボラック型エポキシ
樹脂３０〜５０重量％であるとクラッシュの発生が特に
低下するようになる。The epoxy resin (b) used in the present invention is a combination of a bisphenol type epoxy resin and a phenol novolak type epoxy resin. Excellent strength of the resin itself,
This is because the strength of the workpiece holding material can be improved. Examples of the bisphenol type epoxy resin include bisphenol F type epoxy resin, bisphenol A type epoxy resin,
Bisphenol S type epoxy resin is mentioned. Among these, bisphenol A type and bisphenol F
A mold epoxy resin is preferred in terms of the rigidity of the laminate. As the novolak-type epoxy resin, a phenol novolak-type epoxy resin and a cresol novolak-type epoxy resin are generally used, but are not limited thereto. The phenol novolak type epoxy resin need not have a special epoxy equivalent of 170 to 190, and the cresol novolak type epoxy resin may have a special epoxy equivalent of 190 to 230. The ratio of the bisphenol-type epoxy resin to the novolak-type epoxy resin in the epoxy resin (b) is from 75 to 3 for the bisphenol-type epoxy resin.
0% by weight, novolak type epoxy resin 25-70% by weight
It is. Preferably, bisphenol type epoxy resin 7
0 to 50% by weight, novolak type epoxy resin 30 to 50
% By weight. If the bisphenol type epoxy resin exceeds 75% by weight, that is, if the phenol novolak type epoxy resin is below 25% by weight, the desired rigidity of the laminate cannot be obtained. On the other hand, if the bisphenol type epoxy resin is less than 30% by weight, that is, if the phenol novolak type epoxy resin exceeds 70% by weight, the cured product of the resin becomes brittle, and the polishing durability when used as a holder (carrier) for the object to be polished. Reduce life. When the content of the bisphenol-type epoxy resin is 70 to 50% by weight and the content of the novolak-type epoxy resin is 30 to 50% by weight, the occurrence of crashes is particularly reduced.
【０００８】本発明に用いるエポキシ樹脂（ｂ）を硬化
する硬化剤としては、ジシアンシアミド又はフェノール
ノボラックが好ましい。エポキシ樹脂の硬化物の強度向
上、寸法安定性の向上が図れると同時に吸水性が少なく
なり研磨液（ＰＨ２〜１２の水系薬液）進入が抑制され
る。このことが被研磨物保持材としての研磨耐久寿命の
延長に寄与する。As a curing agent for curing the epoxy resin (b) used in the present invention, dicyansamide or phenol novolak is preferable. The strength and dimensional stability of the cured product of the epoxy resin can be improved, and at the same time, the water absorption is reduced and the intrusion of the polishing liquid (aqueous chemicals of PH2 to PH12) is suppressed. This contributes to prolonging the durability life of polishing as a holder for the object to be polished.
【０００９】本発明における被研磨物保持材の成形は、
詳細については後に細述するところのプリプレグ（有機
繊維基材にエポキシ樹脂を含浸・乾燥させたもの）を所
定の枚数積層しこれの上下に離型のためのフィルムを重
ねる。更に、これをステンレス製鏡面板に挟み、プレス
で加熱・加圧する。このときの加熱温度は１７５℃、時
間は７０分、圧力は４５０Ｐａである。此の後、プレス
熱板を冷却してステンレス板と離型フィルムを除去して
被研磨物保持材用の積層板を得る。In the present invention, the material to be polished is formed by:
For details, a predetermined number of prepregs (which are obtained by impregnating and drying an organic fiber base material with an epoxy resin), which will be described in detail later, are laminated, and films for mold release are laminated on and under the prepregs. Furthermore, this is sandwiched between stainless steel mirror plates and heated and pressed by a press. At this time, the heating temperature is 175 ° C., the time is 70 minutes, and the pressure is 450 Pa. Thereafter, the press hot plate is cooled to remove the stainless steel plate and the release film, thereby obtaining a laminate for the holder for the object to be polished.
【００１０】[0010]
【実施例】以下、本発明の被研磨物保持材を実施例、具
体例を挙げて説明する。有機繊維基材として以下のもの
を準備した。 （アラミド繊維基材）ポリパラフェニレンテレフタルア
ミドペーパー 東レデュポン製タイプＮ−７３４ １．
５デニール、３ｍ／ｍカット、単糸引張弾性率８５Ｇｐ
ａ、目付７２ｇ／ｍ2 （全芳香族液晶ポリエステル繊維基材）クラレ製 単糸
２．５デニール、５ｍ／ｍカットパルプを日本バイリー
ン社で乾式抄紙したものＯＸ―６９１３、単糸引張弾性
率９０Ｇｐａ、目付７３ｇ／ｍ2を用いた。 （ポリエステル繊維基材）帝人製単糸織布 Ｔ−１１２
６３、１．５デニール、単糸引張弾性率１５Ｇｐａ、目
付８５ｇ／ｍ2を用いた。 （ガラス繊維基材）カネボウ製 ＫＳ−１６０２、目付
２０８ｇ／ｍ2を用いた。DESCRIPTION OF THE PREFERRED EMBODIMENTS The holder for the object to be polished according to the present invention will be described below by way of examples and specific examples. The following were prepared as organic fiber base materials. (Aramid fiber base material) Polyparaphenylene terephthalamide paper Toray DuPont type N-734
5 denier, 3m / m cut, single yarn tensile elasticity 85Gp
a, Weight per unit area: 72 g / m 2 (whole aromatic liquid crystal polyester fiber base material) Kuraray single denier 2.5 denier, 5 m / m cut pulp made by dry-type paper making at Japan Vilene Co., Ltd. OX-6913, single yarn tensile elastic modulus 90 Gpa And a basis weight of 73 g / m 2 were used. (Polyester fiber base material) Teijin single yarn woven fabric T-112
63, 1.5 denier, single yarn tensile elastic modulus of 15 Gpa, and basis weight of 85 g / m 2 were used. (Glass fiber base material) KS-1602 manufactured by Kanebo Co., Ltd., and a basis weight of 208 g / m 2 were used.
【００１１】繊維基材のサイジングは以下のように実施
した。サイジング剤として、ARALDITE AER ECN 1400水
分散型を用いて、全芳香族ポリエステル繊維基材及びポ
リエステル繊維基材に含浸・乾燥させてサイジング剤の
付着量がそれぞれ３．２％、３．９％のものを得た。乾
燥温度は１５０℃、２０分である。以下、サイジング処
理したものは、ポリエステル繊維基材−Ｓ、全芳香族ポ
リエステル繊維基材−Ｓと示す。The sizing of the fiber substrate was carried out as follows. As a sizing agent, a wholly aromatic polyester fiber base material and a polyester fiber base material are impregnated and dried by using ARALDITE AER ECN 1400 water dispersion type, and the adhesion amount of the sizing agent is 3.2% and 3.9%, respectively. Got something. The drying temperature is 150 ° C. for 20 minutes. Hereinafter, those subjected to the sizing treatment are referred to as polyester fiber base material-S and wholly aromatic polyester fiber base material-S.
【００１２】次に、エポキシ樹脂ワニスについて次のよ
うなものを準備した。使用したエポキシ樹脂は、ビスフ
ェノール型エポキシ樹脂（エポキシ樹脂１：旭チバ製
ＡＥＲ−８００４Ｎ７５ エポキシ当量５００）とフェ
ノールノボラック型エポキシ樹脂（エポキシ樹脂２：旭
チバ製 ＥＰＮ−１１３８Ａ８０ エポキシ当量１７
９）、クレゾールボラック型エポキシ樹脂（エポキシ樹
脂３：東都化成製 ＹＤＣＮ−７０４ＥＫ７５ エポキ
シ当量２０７）を用いた。 （ワニス１） エポキシ樹脂１とエポキシ樹脂２を固形
分比率で７０／３０となるように混合し、硬化剤として
ジシアンジアミド、硬化促進剤として２Ｐ４ＭＺを溶解
してワニス１を得た。 （ワニス２） エポキシ樹脂１とエポキシ樹脂２とを固
形分比率で６０／４０となるように混合し、硬化剤とし
てフェノールノボラック（住友デュレズ製 ＰＲ―ＨＦ
―３）、硬化促進剤として２Ｐ４ＭＺを溶解してワニス
２を得た。 （ワニス３） エポキシ樹脂２に変えて、エポキシ樹脂
３を用い、また硬化促進剤としてトリフェニルホスフィ
ンを用いた以外はワニス２と同様にしてワニス３を得
た。 （ワニス４） エポキシ樹脂１に硬化剤としてジシアン
ジアミド、硬化促進剤として２Ｐ４ＭＺを溶解してワニ
ス４を得た。 （ワニス５） エポキシ樹脂１とエポキシ樹脂２の比率
を８５／１５とした以外は、ワニス１と同様にしてワニ
ス５を得た。 （ワニス６） エポキシ樹脂１とエポキシ樹脂３の比率
を１５／８５になるように混合し、硬化剤としてフェノ
ールノボラック、硬化促進剤としてトリフェニルホスフ
ィンを溶解してワニス６を得た。Next, the following epoxy resin varnish was prepared. The epoxy resin used was a bisphenol-type epoxy resin (epoxy resin 1: made by Asahi Ciba)
AER-8004N75 epoxy equivalent 500) and phenol novolak type epoxy resin (epoxy resin 2: EPN-1138A80 manufactured by Asahi Ciba) epoxy equivalent 17
9), a cresol volac type epoxy resin (epoxy resin 3: YDCN-704EK75, epoxy equivalent 207, manufactured by Toto Kasei) was used. (Varnish 1) Epoxy resin 1 and epoxy resin 2 were mixed at a solid content ratio of 70/30, and dicyandiamide as a curing agent and 2P4MZ as a curing accelerator were dissolved to obtain varnish 1. (Varnish 2) Epoxy resin 1 and epoxy resin 2 are mixed so as to have a solid content ratio of 60/40, and phenol novolak (PR-HF manufactured by Sumitomo Durez) is used as a curing agent.
-3) 2P4MZ was dissolved as a curing accelerator to obtain Varnish 2. (Varnish 3) Varnish 3 was obtained in the same manner as varnish 2 except that epoxy resin 3 was used instead of epoxy resin 2 and that triphenylphosphine was used as a curing accelerator. (Varnish 4) Dicyandiamide as a curing agent and 2P4MZ as a curing accelerator were dissolved in the epoxy resin 1 to obtain Varnish 4. (Varnish 5) Varnish 5 was obtained in the same manner as varnish 1 except that the ratio of epoxy resin 1 to epoxy resin 2 was 85/15. (Varnish 6) The varnish 6 was obtained by mixing the epoxy resin 1 and the epoxy resin 3 in a ratio of 15/85, and dissolving phenol novolak as a curing agent and triphenylphosphine as a curing accelerator.
【００１３】プリプレグとしては、次のものを準備し
た。 （プリプレグ１）アラミド繊維基材にワニス１を含浸・
乾燥させて、樹脂付着量が４２重量％となるようにして
プリプレグ１を得た。 （プリプレグ２）ポリエステル繊維基材にワニス１を含
浸・乾燥させて、樹脂付着量が４０重量％となるように
してプリプレグ２を得た。 （プリプレグ３）アラミド繊維基材にワニス２を含浸・
乾燥させて樹脂付着量が４２重量％となるようにしてプ
リプレグ３を得た。 （プリプレグ４）ポリエステル繊維基材―Ｓにワニス２
を含浸・乾燥させて樹脂付着量が４０重量％（サイジン
グ樹脂を含む）となるようにしてプリプレグ４を得た。 （プリプレグ５）全芳香族ポリエステル繊維基材−Ｓに
ワニス３を含浸・乾燥させて樹脂付着量が４２重量％に
なるようにしてプリプレグ５を得た。 （プリプレグ６）アラミド繊維基材にワニス４を含浸・
乾燥させて樹脂付着量が４２重量％になるようにしてプ
リプレグ６を得た。 （プリプレグ７）ポリエステル繊維基材にワニス４を含
浸・乾燥させて樹脂付着量が４０重量％になるようにし
てプリプレグ７を得た。 （プリプレグ８）アラミド繊維基材にワニス５を含浸・
乾燥させて樹脂付着量が４２重量％になるようにしてプ
リプレグ８を得た。 （プリプレグ９）ポリエステル繊維基材にワニス５を含
浸・乾燥させて樹脂付着量が４２重量％になるようにし
てプリプレグ９を得た。 （プリプレグ１０）アラミド繊維基材にワニス６を含浸
・乾燥させて樹脂付着量が４２重量％になるようにして
プリプレグ１０を得た。 （プリプレグ１１）ポリエステル繊維基材にワニス６を
含浸・乾燥させて樹脂付着量が４２重量％になるように
してプリプレグ１１を得た。 （プリプレグ１２）ガラス繊維基材にワニス４を含浸・
乾燥して樹脂付着量が４０重量％になるようにしてプリ
プレグ１２を得た。The following prepregs were prepared. (Prepreg 1) Aramid fiber base material impregnated with varnish 1
The prepreg 1 was dried to obtain a prepreg 1 such that the resin adhesion amount was 42% by weight. (Prepreg 2) A prepreg 2 was obtained by impregnating and drying the polyester fiber base material with varnish 1 so that the resin adhesion amount was 40% by weight. (Prepreg 3) Impregnating varnish 2 in aramid fiber base material
It dried and the prepreg 3 was obtained so that resin adhesion amount might be set to 42 weight%. (Prepreg 4) polyester fiber base material-S varnish 2
Was impregnated and dried to obtain a prepreg 4 having a resin adhesion amount of 40% by weight (including a sizing resin). (Prepreg 5) Pre-preg 5 was obtained by impregnating and drying the wholly aromatic polyester fiber base material-S with varnish 3 so that the resin adhesion amount became 42% by weight. (Prepreg 6) Aramid fiber base material impregnated with varnish 4
The prepreg 6 was dried so that the resin adhesion amount was 42% by weight. (Prepreg 7) A prepreg 7 was obtained by impregnating and drying a varnish 4 on a polyester fiber base material so that the resin adhesion amount was 40% by weight. (Prepreg 8) Impregnating varnish 5 in aramid fiber base material
It was dried to obtain a prepreg 8 so that the resin adhesion amount became 42% by weight. (Prepreg 9) A prepreg 9 was obtained by impregnating and drying the varnish 5 in a polyester fiber base material so that the resin adhesion amount was 42% by weight. (Prepreg 10) The prepreg 10 was obtained by impregnating and drying the varnish 6 on the aramid fiber base material so that the resin adhesion amount became 42% by weight. (Prepreg 11) A prepreg 11 was obtained by impregnating a polyester fiber base material with varnish 6 and drying so that the resin adhesion amount was 42% by weight. (Prepreg 12) Impregnating varnish 4 in glass fiber base material
It dried and the prepreg 12 was obtained so that resin adhesion amount might be set to 40 weight%.
【００１４】実施例１ プリプレグ２を４枚積層し、その表裏に１枚ずつプリプ
レグ１を積層し、更にその上下に離型フィルムを貼り合
わせ、これをステンレス製のあて板の間に挟み、プレス
熱板間で加熱・加圧して積層成形品を得た。板厚は０．
６１ｍｍであった。 実施例２ プリプレグ４を４枚積層し、その表裏に１枚ずつプリプ
レグ３を積層し、更にその上下に離型フィルムを貼り合
わせ、これを実施例１と同様に操作して積層成形品を得
た。板厚は０．６０ｍｍであった。 実施例３ プリプレグ５を７枚積層して、その表裏に離型フィルム
を貼り合わせ、これを実施例１と同様に操作して積層成
形品を得た。板厚は０．５９ｍｍであった。 比較例１ プリプレグ７を４枚積層し、その表裏に１枚ずつプリプ
レグ６を積層し、更にその上下に離型フィルムを貼り合
わせ、これを実施例１と同様に操作して積層成形品を得
た。板厚は０．６１ｍｍであった。 比較例２ プリプレグ９を４枚積層し、その表裏に１枚ずつプリプ
レグ８を積層し、更にその上下に離型フィルムを貼り合
わせ、これを実施例１と同様に操作して積層成形品を得
た。板厚は０．６２ｍｍであった。 比較例３ プリプレグ１１を４枚積層し、その表裏に１枚ずつプリ
プレグ１０を積層し、更にその上下に離型フィルムを貼
り合わせ、これを実施例１と同様に操作して積層成形品
を得た。板厚は０．６１ｍｍであった。 比較例４ プリプレグ１２を３枚積層し、その表裏に離型フィルム
を貼り合わせたものを実施例１と同様に操作して積層成
形品を得た。板厚は０．５９ｍｍであった。Example 1 Four prepregs 2 were laminated, prepregs 1 were laminated one by one on each of the front and back sides, and release films were laminated on the upper and lower sides of the prepregs. Heating and pressurizing were performed to obtain a laminated molded product. The plate thickness is 0.
It was 61 mm. Example 2 Four prepregs 4 were laminated, prepregs 3 were laminated one by one on the front and back sides, and release films were laminated on the upper and lower sides of the prepregs 4 and the same operation as in Example 1 was performed to obtain a laminated molded product. Was. The plate thickness was 0.60 mm. Example 3 Seven prepregs 5 were laminated, and a release film was adhered to the front and back thereof, and the same operation as in Example 1 was performed to obtain a laminated molded product. The plate thickness was 0.59 mm. Comparative Example 1 Four prepregs 7 were laminated, prepregs 6 were laminated one by one on each of the front and back sides, and release films were laminated on the top and bottom of the prepregs 6, and the same operation as in Example 1 was performed to obtain a laminated molded product. Was. The plate thickness was 0.61 mm. Comparative Example 2 Four prepregs 9 were laminated, prepregs 8 were laminated one by one on each of the front and back sides, and release films were laminated on the top and bottom of the prepregs 8, and the same operation as in Example 1 was performed to obtain a laminated molded product. Was. The plate thickness was 0.62 mm. Comparative Example 3 Four prepregs 11 were laminated, prepregs 10 were laminated one by one on each of the front and back sides, and release films were laminated on the top and bottom of the prepregs 11 and further operated in the same manner as in Example 1 to obtain a laminated molded product. Was. The plate thickness was 0.61 mm. Comparative Example 4 Three prepregs 12 were laminated, and a release film was adhered to the front and back surfaces of the prepreg 12, and the same operation as in Example 1 was performed to obtain a laminated molded product. The plate thickness was 0.59 mm.
【００１５】上記の積層成形物を被研磨保持材として加
工した。最外径が１６インチ被研磨物保持穴は直径２．
５インチのものが１８穴加工された、即ち、１枚のキャ
リアーで１８枚のディスク研磨ができる。実施例、比較
例ともそれぞれ１枚のキャリアーをテストに供し、アル
ミディスクのポリッシングを２８０バッチ繰り返し、そ
こで、テストを打ち切った。異常が認められたものはそ
の時点で、テストを打ちきりとした。その結果を表１に
示した。曲げ弾性率は、ＪＩＳ Ｋ７２０３により準
じ、支点間距離は２０ｍｍ、０．３ｍｍ／ｍｉｎで測定
した。The above-mentioned laminated molded product was processed as a holding material to be polished. The outermost diameter is 16 inches.
A 5-inch one is machined with 18 holes, ie one carrier can grind 18 discs. In each of the Examples and Comparative Examples, one carrier was subjected to the test, and the polishing of the aluminum disk was repeated 280 batches, and the test was stopped there. At that point, the test was terminated. The results are shown in Table 1. The flexural modulus was measured according to JIS K7203, and the distance between the fulcrums was 20 mm and 0.3 mm / min.
【００１６】[0016]
【表１】 [Table 1]
【００１７】[0017]
【発明の効果】本発明は、第一に有機繊維基材（ａ）に
特定のエポキシ樹脂（ｂ）を含浸させて得られる被研磨
物保持材の強度を著しく向上させることが可能となり、
特に研磨回転中の強度に優れ、かつスクラッチ傷の発生
がなく、寸法安定性、耐磨耗性等にも優れる被研磨物保
持材である。第二にポリエステル繊維基材及びアラミド
繊維基材からなる有機繊維基材（ａ）に特定のエポキシ
樹脂（ｂ）を含浸して得られる被研磨物保持材の強度向
上及びスクラッチ傷の発生の抑制、コスト、寸法安定性
等の高度な要求を総合的に満たすものであり、特に研磨
回転中の強度に優れる被研磨物保持材である。According to the present invention, firstly, it is possible to remarkably improve the strength of the holder for a polished work obtained by impregnating the organic fiber base material (a) with the specific epoxy resin (b).
In particular, it is a material to be polished excellent in strength during polishing rotation, free of scratches, excellent in dimensional stability, abrasion resistance and the like. Second, improvement of the strength of a holding material for a polished object obtained by impregnating an organic fiber base material (a) composed of a polyester fiber base material and an aramid fiber base material with a specific epoxy resin (b) and suppression of generation of scratches It is a material that satisfies sophisticated requirements such as cost, dimensional stability, etc., and is particularly excellent in strength during polishing rotation.
Claims (8)
型エポキシ樹脂７５〜３０重量％及びノボラック型エポ
キシ樹脂２５〜７０重量％からなるエポキシ樹脂（ｂ）
を含浸し、これを積層し加熱加圧してなることを特徴と
する被研磨物保持材。1. An epoxy resin (b) comprising 75 to 30% by weight of a bisphenol type epoxy resin and 25 to 70% by weight of a novolak type epoxy resin on an organic fiber base material (a).
Characterized by being impregnated with, and laminating, heating and pressing.
ノボラック型エポキシ樹脂及び又はクレゾールノボラッ
ク型エポキシ樹脂である請求項１記載の被研磨物保持
材。2. The holder according to claim 1, wherein the novolak epoxy resin is a phenol novolak epoxy resin and / or a cresol novolak epoxy resin.
基材及びアラミド繊維基材からなる請求項１又は２記載
の被研磨物保持材。3. The holder for an object to be polished according to claim 1, wherein the organic fiber base (a) comprises a polyester fiber base and an aramid fiber base.
行ったポリエステル繊維基材及びアラミド繊維基材から
なる請求項１又は２記載の被研磨物保持材。4. The holder for an object to be polished according to claim 1, wherein the organic fiber base material (a) comprises a sizing-processed polyester fiber base material and an aramid fiber base material.
ポリエステル繊維基材及びサイジング処理した全芳香族
液晶ポリエステル繊維基材からなる請求項１又は２記載
の被研磨物保持材。5. The holder for a polished object according to claim 1, wherein the organic fiber substrate (a) comprises a sizing-treated polyester fiber substrate and a sizing-treated wholly aromatic liquid crystal polyester fiber substrate.
エステル繊維基材及び又はポリパラフェニレンベンゾビ
スオキサゾール繊維基材である請求項１又は２記載の被
研磨物保持材。6. The holder for a polished object according to claim 1, wherein the organic fiber base material (a) is a wholly aromatic liquid crystal polyester fiber base material and / or a polyparaphenylene benzobisoxazole fiber base material.
繊維からなる有機繊維基材（ａ）を用いる請求項１又は
２記載の被研磨物保持材。7. The holder for an object to be polished according to claim 1, wherein an organic fiber base material (a) comprising an organic fiber having a tensile modulus of 80 Gpa or more is used.
又はフェノールノボラックで硬化されてなる請求項１又
は２記載の被研磨物保持材。8. The holder for an object to be polished according to claim 1, wherein the epoxy resin (b) is cured with dicyandiamide or phenol novolak.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000044055A JP2001232559A (en) | 2000-02-22 | 2000-02-22 | Holding member for object to be polished |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000044055A JP2001232559A (en) | 2000-02-22 | 2000-02-22 | Holding member for object to be polished |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001232559A true JP2001232559A (en) | 2001-08-28 |
Family
ID=18566882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000044055A Pending JP2001232559A (en) | 2000-02-22 | 2000-02-22 | Holding member for object to be polished |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001232559A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013146517A1 (en) * | 2012-03-30 | 2013-10-03 | 住友ベークライト株式会社 | Material for holding item to be polished, and laminate plate using same |
-
2000
- 2000-02-22 JP JP2000044055A patent/JP2001232559A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013146517A1 (en) * | 2012-03-30 | 2013-10-03 | 住友ベークライト株式会社 | Material for holding item to be polished, and laminate plate using same |
| CN104245231A (en) * | 2012-03-30 | 2014-12-24 | 住友电木株式会社 | Material for holding item to be polished, and laminate plate using same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6156362B2 (en) | Material to be polished and laminated board used therefor | |
| JP2974007B1 (en) | Polishing object holding material and method of manufacturing polishing object | |
| US20040224623A1 (en) | Polishing pad for cmp, method for polishing substrate using it and method for producing polishing pad for cmp | |
| JP3135944U (en) | Repair sheet for workpiece holding material and workpiece holding material using the same | |
| JP2004114208A (en) | Carrier material for polishing | |
| JP2001232559A (en) | Holding member for object to be polished | |
| JP2013094884A (en) | Polishing object holding material, method for producing the same and polishing method | |
| JP2010099767A (en) | Method of manufacturing polished article holding material and polishing article | |
| JP3539244B2 (en) | Material to be polished | |
| JP2010142892A (en) | Prepreg laminated body, carrier materials for polishing using the same, and method of manufacturing these | |
| JP4517552B2 (en) | Workpiece holding material | |
| JP4017910B2 (en) | Material to be polished and method for manufacturing the same | |
| JP6470976B2 (en) | Workpiece holding material | |
| JP2008155304A (en) | Holding material for polishing | |
| JP5443777B2 (en) | Pre-preg, laminated board and material to be polished | |
| JP2006298988A (en) | Supporting material for grinding object | |
| JP3812526B2 (en) | Workpiece holding material | |
| JP2008254112A (en) | Polished article holding material and polishing article manufacturing method | |
| JP2008254113A (en) | Polished article holding material and polishing article manufacturing method | |
| JP2003260659A (en) | Manufacturing method of retaining member for object to be polished and manufacturing method of plate-shaped body for retaining member for object to be polished | |
| JP2002052461A (en) | Polished object holding member | |
| JP2012139803A (en) | Polished object holding material, polishing apparatus, and method for polishing polished object | |
| JP2002103210A (en) | Polished object holding member | |
| JP2013094880A (en) | Base material for polishing object holding carrier material and production method of base material | |
| JP2003124163A (en) | Manufacturing method of polishing pad and polishing object |