JP2012139803A - Polished object holding material, polishing apparatus, and method for polishing polished object - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an economically advantageous polished object holding material shortened in a dressing time for the polished object holding material, suppressed in scratch to the polished object, and improved in warp precision in a thin substrate, substrate thickness precision, and lifetime.SOLUTION: The polished object holding material is formed by joining one layer of a liquid crystal polymer film to both sides including a base layer of a plate-like material 4 of one of a metal plate, a fiber-reinforced plastic plate, and a plastic plate via a thermosetting adhesive, or the polished is formed by stacking one layer of a liquid crystal polymer film on both sides of a glass long fiber base material 2 (prepreg) in which a plurality of thermosetting resins is impregnated.

Description

  The present invention relates to an object holding material for holding an object to be polished, a polishing apparatus using the object to be polished, and an object to be polished in a polishing step of rotating and polishing an object to be polished such as a silicon wafer and a hard disk. The present invention relates to an object polishing method.

Manufacturing processes of silicon wafers, hard disks, and the like include a process of polishing these surfaces. In this polishing process, an object holding material for holding an object to be polished such as a silicon wafer, a hard disk is used. . This object to be polished has a structure in which one or a plurality of through holes for holding an object to be polished are formed in a disk having a driving gear around it. An object to be polished is fitted into the through-hole and mounted on a polishing apparatus, and the object to be polished is driven by driving the object to be polished on a flat surface.
Conventionally, what processed the laminated board for electrical insulation was used as a to-be-polished object holding material. This laminated sheet for electrical insulation is obtained by heat-pressing a layer of a sheet-like base material (prepreg) impregnated and dried with a thermosetting resin. Examples of the laminate for electrical insulation include, for example, a cotton fabric substrate phenolic resin laminate, a glass fiber woven fabric substrate epoxy resin laminate, a glass fiber nonwoven fabric substrate epoxy resin laminate, a glass fiber woven fabric substrate and glass fiber. There are composite epoxy resin laminates that are combined with nonwoven fabric substrates. Among these, cotton cloth base material phenolic resin laminates and glass fiber woven base material epoxy resin laminates are frequently used as materials to be polished.

The properties required for the workpiece holding material are wear resistance, plate thickness accuracy, warpage properties, and the like. Further, in recent years, as the quality and performance required for an object to be polished have increased, there has been a demand for an object holding material in which the occurrence of scratches (polishing scratches) in the object to be polished is suppressed. Conventionally, since the laminate used for the workpiece holding material is inherently for electrical insulation, it is insufficient in terms of the characteristics required for the workpiece holding material, particularly in terms of suppressing the occurrence of scratches in the polishing article. there were.
For these improvements, an aramid fiber, particularly a high-strength para-aramid fiber, is used as a material for forming an object holding material that does not cause scratches on the object to be polished (see, for example, Patent Document 1). ).

  Aramid fibers, which are organic fibers, have a lower hardness than inorganic fibers such as glass fibers. For this reason, when using an object holding material constituted by an aramid fiber base material, scratching of the object to be polished is more effective than using an object holding material constituted by an inorganic fiber base material such as a glass fiber base material. Since the depth is shallow, the rate at which the obtained polished product becomes defective decreases. However, in recent years, there has been a demand for further improvement in wear resistance of the workpiece holding material. Further, with the thinning of the substrate, there is a need for a workpiece holding material with good warpage and plate thickness accuracy with respect to the workpiece holding material.

For such an improvement, those using polyarylate fibers, which are high-strength fibers, as a substrate have been proposed (for example, Patent Documents 2 to 5).
In addition, while using organic fibers with relatively weak mechanical strength compared to glass fibers, etc. as a prepreg, a structure with a film layer laminated on the surface has also been proposed for the purpose of suppressing scratching and maintaining mechanical strength. (For example, Patent Document 6).
Furthermore, the subject of shortening dressing processing time is mentioned with respect to a to-be-polished object holding material. Dressing is a process of removing the resin film on the surface before using the workpiece holding material and exposing the fiber surface and the like. However, since the thickness of the surface resin layer after molding of the workpiece holding material varies, the area ratio of the fiber and the thermosetting resin exposed on the surface after dressing up (end of dressing) may not be constant, In order to avoid them, the polishing rate must be adjusted. In the actual process, the fiber base material is exposed to the surface by excessive dressing, which leads to an increase in processing time in the process.

JP-A-11-309667 JP-A-10-146754 JP 2001-38609 A JP 2003-62749 A JP 2004-114208 A JP 2002-59362 A

  The present invention has been made in view of the above circumstances, and is economically advantageous including improved mechanical properties such as shortening the dressing time of the workpiece holding material, suppressing the occurrence of scratches, warpage accuracy, plate thickness accuracy and service life. An object of the present invention is to provide a workpiece holding material, a polishing apparatus using the same, and a manufacturing method.

As a result of intensive studies, the present inventors have found that a liquid crystal polymer film layer having a thickness of 25 to 150 μm has a base layer composed of a plurality of glass long fiber base materials impregnated with a plate-like material or a thermosetting resin. It has been found that the object can be achieved by a workpiece holding material laminated on both sides. The present invention has been completed based on such findings.
That is, the present invention provides the following materials to be polished, a polishing apparatus using these materials to be polished, and a method for producing a polished material.
(1) A base layer made of a plate material of any one of a metal plate, a fiber reinforced plastic plate and a plastic plate, or a base layer made of a plurality of long glass fibers impregnated with a thermosetting resin, and a film layer laminated on both sides thereof What is claimed is: 1. An object holding material comprising: a liquid crystal polymer film having a film layer thickness of 25 to 150 [mu] m.
(2) A polished article holding material comprising a base layer made of the plate-like material and a film layer laminated on both sides thereof, wherein the base layer and the film layer are joined with a thermosetting adhesive. The workpiece holding material according to the above (1).
(3) The workpiece holding material according to (1) above, comprising a base layer composed of a plurality of long glass fibers impregnated with the thermosetting resin and a film layer laminated on both surfaces thereof.
(4) A planetary motion that revolves around the sun gear while rotating around the sun gear, the object holding material having a sun gear, a sun gear, a plurality of meshing gears, and a through-hole into which the object is fitted. An object to be polished, an internal gear that meshes with the plurality of meshing gears of the object to be polished, and an object to be polished that is fitted in the through hole and rotates by the planetary motion of the object to be polished. A polishing apparatus comprising: a polishing device for polishing, wherein the object holding material is formed of the object holding material according to any one of (1) to (3).
(5) A method for polishing an object to be polished using the polishing apparatus according to (4) above, wherein the object to be polished is fitted into the through-hole, and the object to be polished holding material is moved in a planetary motion. And polishing the object to be polished by the polishing machine.

  According to the present invention, since the film layers made of the liquid crystal polymer are laminated on both surfaces of the base layer of the workpiece holding material, the warpage is reduced, the plate thickness accuracy is good, and the dressing time can be shortened. . In addition, when the polished object holding material of the present invention is used in the production of the polished article, the generation of scratches in the polished object is suppressed because the fiber base material is not exposed on the surface, and the production yield of the polished article is improved. In addition, since the service life is extended, it is possible to provide an object-to-be-polished material that is economically advantageous, such as the cost of the polished object being kept low.

It is sectional drawing which shows typically the cross-sectional structure of the to-be-polished material holding | maintenance material of this invention. It is sectional drawing which shows typically the dressing up of the to-be-polished material holding material of this invention, and a conventional product. It is a top view which shows mounting | wearing to the polisher of the to-be-polished material holding | maintenance material of this invention. It is a front view which shows mounting | wearing to the polisher of the to-be-polished material holding | maintenance material of this invention.

The object holding material of the present invention includes a base layer made of a plate material of any of a metal plate, a fiber reinforced plastic plate, and a plastic plate, or a base layer made of a plurality of glass long fiber base materials impregnated with a thermosetting resin. The film layer is made of a liquid crystal polymer film having a thickness of 25 to 150 μm.
The liquid crystal polymer exhibits liquid crystallinity when thermally melted, and can be classified into a wholly aromatic system and a semi-aromatic system depending on the molecular structure. As the liquid crystal polymer film (molded product) used in the present invention, a wholly aromatic polyester film is preferable, which is basically excellent in rigidity, strength, heat resistance, moldability, and has a linear expansion coefficient as low as that of metal. Is characterized by low water absorption of 1/20 or less. Examples of the wholly aromatic liquid crystal polyester film corresponding to the above include commercially available products such as Bexter (trade name, manufactured by Kuraray Co., Ltd.) and Biaac (trade name, manufactured by Japan Gore-Tex Co., Ltd.). By using these, it is possible to obtain an object holding material having a uniform polishing rate and improved warpage accuracy, plate thickness accuracy and service life.

  The thickness of the liquid crystal polymer film is appropriately selected according to the type of the object to be polished and the polishing conditions, and is usually 25 to 150 μm, preferably 35 to 120 μm, particularly preferably 50 to 100 μm. When the thickness is 25 μm or more, warpage of the object-holding material is suppressed and the service life becomes longer. When the thickness is 150 μm or less, the cost for the film material can be further reduced, which is preferable. Moreover, it is preferable to suppress the thickness of the liquid crystal polymer film to 50% or less with respect to the total thickness because the mechanical strength of the entire holding material can be maintained stronger.

  The liquid crystal polymer film may be subjected to a surface treatment in order to improve adhesion to a plate-like material or a long glass fiber impregnated with a thermosetting resin. Such a surface treatment method is not particularly limited, and examples thereof include corona treatment, plasma treatment, ultraviolet treatment, flame treatment, chemical treatment, and primer treatment.

  As shown in FIG. 1A, the abrasive holding material of the present invention preferably has a thermosetting adhesive 3 on both sides of a base layer made of a plate-like material 4 such as a metal plate, a fiber-reinforced plastic plate, or a plastic plate. And the liquid crystal polymer film 1 is laminated and integrally heated and pressed. The thermosetting adhesive may be used as an adhesive sheet, or may be obtained by applying to the adhesive surface side of the liquid crystal polymer film by a known method and drying.

  Specifically, the thermosetting adhesive is applied onto the liquid crystal polymer film by a known coating method such as a bar coating method, a knife coating method, a roll coating method, a blade coating method, a die coating method, or a gravure coating method. The adhesive layer can be obtained by applying a drying treatment to a semi-cured state after coating.

  The thermosetting adhesive used in the present invention is not particularly limited, but (A) an epoxy resin, (B) an epoxy resin curing agent, (C) a curing accelerator, (D) an elastomer, and (E) an inorganic filler. What consists of an agent is preferable.

  As the epoxy resin of component (A), an epoxy resin having two or more epoxy groups in one molecule can be used. Specifically, bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, glycidyl ether type epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin, or polyfunctional epoxy resin containing biphenyl skeleton Or a mixture of two or more of these epoxy resins can be used.

  (B) Component curing agents include amine curing agents such as dicyandiamide and aromatic diamine, and phenolic curing agents such as phenol novolac resin, cresol novolak resin, triazine-modified phenol novolak resin, and biphenyl skeleton-containing phenol novolac resin. Can be used.

  (C) As a hardening accelerator of a component, imidazole compounds, such as 2-ethyl-4-methylimidazole and 1-benzyl-2-methylimidazole, boron trifluoride amine complex, a triphenylphosphine, etc. can be used.

  As the elastomer of component (D), various synthetic rubbers such as acrylic rubber, acrylonitrile butadiene rubber, carboxyl group-containing acrylonitrile butadiene rubber, rubber-modified high molecular weight compounds, high molecular weight epoxy resins, phenoxy resins, modified polyimides, modified polyamideimides, Any of polyvinyl acetal and the like, or a mixture of two or more of these can be used.

  As the inorganic filler of component (E), known ones can be used without particular limitation. Specifically, aluminum hydroxide, magnesium hydroxide, silicon oxide, alumina and the like can be used.

As the plate-like material of the present invention, a metal plate, a fiber reinforced plastic plate, a plastic plate or the like is used. Specifically, a titanium plate or a stainless steel plate as a metal plate, and an FRP plate such as a glass epoxy plate as a fiber reinforced plastic plate. Examples of plastic plates include engineering plastics and super engineering plastics.
The thickness of the plate-like material is appropriately adjusted depending on the type of polishing object such as a silicon wafer and a hard disk and the polishing conditions.

  As shown in FIG. 1 (A), the polished article holding material of the present invention has a base layer made of a plate-like material 4 and a film layer 1 made of a liquid crystal polymer with a thermosetting adhesive 3 disposed on both sides. It is sandwiched between two mirror plates and heated to 150 to 200 ° C, preferably 150 to 170 ° C, pressure is 5 to 50 MPa, preferably 15 to 35 MPa, and press holding time is 90 to 150 minutes. It is obtained by pressing and molding in one piece.

  In addition, as shown in FIG. 1B, the polished article holding material of the present invention is formed by superposing a plurality of glass long fiber base materials (prepregs) 2 impregnated with a thermosetting resin, and further, the film layer 1 May be arranged on both sides, sandwiched between mirror plates, and heated and pressed between press hot plates.

Although it does not specifically limit about the thermosetting resin impregnated to a glass long fiber, (A) epoxy resin, (B) epoxy resin hardening | curing agent, (C) hardening accelerator, and (D) similarly to the said adhesive composition. What consists of an elastomer is preferable.
The material to be polished is usually formed by hot pressing under a temperature of 170 to 200 ° C., a pressure of 5 to 50 MPa, and a press holding time of 90 to 150 minutes. The number of the glass long fibers impregnated with the thermosetting resin is appropriately adjusted depending on the type of polishing object such as a silicon wafer and a hard disk and the polishing conditions.

  The thickness of the object holding material of the present invention is appropriately selected according to the type of object to be polished and the polishing conditions, and is usually about 0.3 to 2.0 mm, preferably 0.4 to 1.0 mm. It is. The workpiece holding material of the present invention is suitably used in a process of polishing a silicon wafer, a hard disk, or the like. Examples of the form of the object holding material include a carrier disk, but are not particularly limited as long as it can be processed.

As illustrated in FIG. 3, the polishing apparatus according to the present invention includes a sun gear 11, and an object holding material having a sun gear 11, a plurality of meshing gears 8, and a through hole 9 into which the object to be polished 10 is fitted on the outer periphery. An object holding material capable of planetary motion that revolves around the sun gear 11 while the object holding material rotates, and an internal gear meshing with the meshing multiple gears 8 of the object holding material. A polishing apparatus comprising: a lug gear 12; and a polishing device that is fitted in the through-hole 9 and that polishes an object to be polished 10 that rotates by a planetary motion of the object to be polished. Is a polishing apparatus formed of the workpiece holding material according to any one of (1) to (3).
Furthermore, in the polishing machine illustrated in FIG. 4 which is the main component of the polishing apparatus, the rotary plates 14 and 15 facing up and down are arranged, and the respective surfaces of the rotary plates 14 and 15 facing each other are arranged. Abrasive cloths 16 and 17 are affixed, and a polishing agent is supplied to the abrasive cloths 16 and 17 (not shown). The sun gear 11 is arranged at the center of the upper part of the turntable 15, and the internal gear 12 is provided over the entire outer circumference side of the turntables 14, 15 and is fixed by a fixing ring frame 13.
In polishing the object to be polished 10, first, a sufficient distance between the rotating disk 14 and the rotating disk 15 is set, the object to be polished 10 is fitted into the through hole 9 of the carrier disk 7, and the carrier disk is mounted on the polishing machine. . Next, the turntable 14 is lowered vertically, and the surfaces of the polishing cloths 16 and 17 are brought close to and in contact with the surface of the workpiece 10. Subsequently, while supplying slurry-like substances containing abrasives to the polishing cloths 16 and 17 from the outside, the sun gear 11 is rotated to start planetary motion, and at the same time, the rotating disks 14 and 15 are rotated in opposite directions. Then, predetermined polishing is performed.
The present invention further relates to a polishing method for an object to be polished using the polishing apparatus described above, wherein the object to be polished 10 is fitted into the through hole 9 and the object to be polished is caused to perform a planetary motion. There is also provided a method for polishing an object to be polished, in which the object to be polished 10 is polished by the polishing machine.

  The material to be polished of the present invention is dressed up for use. FIG. 2 schematically shows a cross section before dressing up on the left side of the arrow and a cross section after dressing up on the right side (one side surface layer of the workpiece holding material, adhesive layer, and part of the base layer). As shown in FIGS. 2 (1) (base layer is a prepreg) and (2) (base layer is a plate-like material), the material to be polished of the present invention is dressed by polishing from the surface (the right side of (1) and (2) However, since it is covered with a liquid crystal polymer film layer, a smooth and uniform surface is obtained, and dressing can be performed in a short time (small amount). On the other hand, as shown in FIGS. 2 (3) and (4), the conventional product consisting only of the prepreg with no film layer laminated on the surface removes the surface resin layer and exposes the fiber substrate ((3 ) On the right side). However, when the thickness of the surface resin layer is different, there is a difference in the time until the fiber base material is exposed on the surface. For example, when the distance between the resin surface layer and the fiber substrate is shorter than that shown in FIG. 2 (4) as shown in FIG. 2 (3), it is a short time (small amount) according to the object holding material shown in FIG. 2 (3). When the dress-up conditions are set in FIG. 2, when the distance is long as shown in FIG. 2 (4), the fiber base material is not exposed on the surface, so that the polishing rate becomes faster or the object holding material becomes thinner. There is a fear.

  EXAMPLES Next, although an Example demonstrates this invention further in detail, this invention is not limited at all by these examples.

In producing the laminated plates according to Examples 1 and 2 and Comparative Examples 1 and 2, preparation of the thermosetting resin composition 1 for prepreg and the thermosetting resin composition 2 for film layer adhesion was performed.
[Resin composition 1 (for prepreg)]
As a thermosetting resin, bisphenol A type epoxy resin Epicor® 1001 (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.) 70 parts by mass and cresol novolac epoxy resin YDCN-704P (product name, manufactured by Toto Kasei Co., Ltd.) 25 masses Parts, 3 parts by mass of dicyandiamide as a curing agent and 0.07 parts by mass of 2E4MZ (manufactured by Shikoku Kasei Kogyo Co., Ltd., 2-ethyl-4-methylimidazole), Nipol 1072 (manufactured by Nippon Zeon Co., Ltd.) as a carboxyl group-containing acrylonitrile butadiene rubber A resin composition 1 having a solid content of 55% by mass was prepared by adding propylene glycol monomethyl ether as a solvent to a mixture comprising 5 parts of a nitrile content 27).

[Resin composition 2 (for film layer adhesion)]
200 parts of Nipol 1072 (trade name, manufactured by Nippon Zeon Co., Ltd., nitrile content 27) as carboxyl group-containing acrylonitrile butadiene rubber, 320 parts of Epicoat 1001 (trade name, manufactured by Yuka Shell Co., Ltd., epoxy equivalent 470) as bisphenol A type epoxy resin, cresol novolak 147 parts of YDCN-703P (trade name, epoxy equivalent 210, manufactured by Toto Kasei Co., Ltd.) as an epoxy resin, 146 parts of BRG558 (trade name, hydroxyl value 106, manufactured by Showa Polymer Co., Ltd.) as a phenol novolac resin, SPB-100 (as a phenoxyphosphazene oligomer) Otsuka Chemical Co., Ltd. product name, phosphorus content 13%) 65 parts by mass, melamine polyphosphate PHOSMEL200 (Nissan Chemicals product name, phosphorus content 12%) 163 parts, degradation inhibitor 2,6-di-tert − 1 part of chill-4-methylphenol (manufactured by Kawaguchi Chemical Co., Ltd.), 100 parts of H-42I (trade name, manufactured by Showa Denko KK) as aluminum hydroxide, and 0.5 part of 2-ethyl-4-methylimidazole as a curing accelerator Propylene glycol monomethyl ether (PGM) and methyl ethyl ketone (mixing mass ratio 30:70) were added as a solvent to the mixture consisting of the following to prepare resin composition 2 having a solid content of 40%.

[Example 1]
The resin composition 1 was applied to A2116 / AS450 (trade name, manufactured by Asahi Shovel Co., Ltd., 106 g / m ² , plain weave woven fabric having a thickness of 0.1 mm) made of general-purpose E glass long fibers, impregnated and Semi-curing by drying was performed to obtain a prepreg A having a mass ratio of 43%.
Bexter (trade name, manufactured by Kuraray Co., Ltd.) which is an aromatic liquid crystal polyester film having a thickness of 100 μm is laminated on both sides of the prepreg A 6 sheets, and sandwiched between two mirror plates, The laminate 1 was obtained by heating and pressing under conditions of 10 sets, heating rate of 2.0 ° C./min, curing temperature of 175 ° C., time of 60 minutes, pressure of 3.0 MPa.

[Example 2]
On one side of Bexter (trade name, manufactured by Kuraray Co., Ltd.) which is an aromatic liquid crystal polyester film having a thickness of 100 μm, the resin composition 2 is applied with a roll coater so that the thickness after drying becomes 10 μm. The film was dried by heating to form a film layer with an adhesive.

  The film layer with adhesive is laminated on both sides of a base layer made of a glass epoxy substrate TLB-551 (trade name, manufactured by Kyocera Chemical Co., Ltd.) having a thickness of 0.60 mm, which is a plate-like material, and sandwiched between two mirror plates In the same manner as in Example 1, a laminate 2 was obtained.

[Comparative Example 1]
The resin composition 1 is applied to a non-woven fabric having a basis weight of 62 g / m ² using polyarylate short fibers “Vectran HT type” (manufactured by Kuraray Co., Ltd.), semi-cured by impregnation and drying, and the resin content is 60% by mass. Of prepreg B was obtained.
One prepreg B was placed on each side of the base layer composed of 6 prepregs A, and a total of 8 prepregs were sandwiched between two mirror plates to obtain a laminate 3 in the same manner as in Example 1.

[Comparative Example 2]
Eight prepregs A were stacked and sandwiched between two mirror plates, and a laminate 4 was obtained in the same manner as in Example 1.

  The laminates 1 to 4 obtained in Examples 1 and 2 and Comparative Examples 1 and 2 were processed with a router machine to obtain 12B [DP (Diametral Pitch) 12, Number of Teeth 134, Outer Diameter 287.86 mm]. An object to be polished (carrier disk) was produced by forming an outer peripheral shape and 12 holes of 50 mmφ. Note that the above 12B is a gear term and means “B specification category having a size of 12 inches”.

The characteristics of the carrier disks produced from the laminates 1 to 4 obtained in the above examples and comparative examples were evaluated by the methods shown below. The results are shown in Table 1.
(1) The warped carrier disk was laid flat on a flat plate and the lift value was measured.
(2) Plate thickness accuracy The plate thickness at 20 points of the same carrier disk was measured, and the difference between the maximum value and the minimum value was calculated.
(3) Scratch rate (polishing test)
The aluminum wafer having a thickness of 0.8 mm held by the carrier disk was polished for 10 cycles, and then the surface state of the aluminum wafer was observed to calculate the scratch occurrence rate.
(4) Service life Evaluation was made based on the degree of wear of the gear portion of the carrier disk. That is, the number of usable batches at the usable wear level was examined, and expressed as an index when the number of usable batches in Comparative Example 2 was 100.

  When the polished object holding material of the present invention is used in the production of a polished object, scratches in the polished object are reduced, the manufacturing yield of the polished object is improved, the dressing time is shortened, and the life of the polished object holding material is extended. As a result, the cost of the polished material can be reduced. The workpiece holding material of the present invention is suitably used in the form of a carrier disk or the like in a process of polishing a silicon wafer, a hard disk or the like.

DESCRIPTION OF SYMBOLS 1 Liquid crystal polymer film 2 Fiber base material impregnated with thermosetting resin 3 Adhesive layer 4 Plate-like material 5 Fiber base material 6 Part scraped off by dressing up 7 Carrier disk for polishing (object to be polished)
8 meshing multiple gears 9 through-hole 10 object to be polished 11 sun gear 12 internal gear 13 fixing ring frame 14 upper rotating disk 15 lower rotating disk 16 lower polishing cloth 17 upper polishing cloth

Claims (5)

  A base layer made of a plate-like material of a metal plate, a fiber reinforced plastic plate or a plastic plate or a base layer made of a plurality of glass long fiber base materials impregnated with a thermosetting resin, and a film layer laminated on both sides thereof A polished object holding material, wherein the film layer is made of a liquid crystal polymer film having a thickness of 25 to 150 μm.   2. A material to be polished comprising a base layer made of the plate-like material and a film layer laminated on both surfaces thereof, wherein the base layer and the film layer are bonded with a thermosetting adhesive. The material to be polished is described.   The material to be polished according to claim 1, comprising a base layer composed of a plurality of glass long fiber base materials impregnated with the thermosetting resin, and film layers laminated on both surfaces thereof.   A polished object holding material having a sun gear, a gear meshing with the sun gear on the outer periphery, and a through-hole into which the object to be polished is fitted, and capable of planetary motion that revolves around the sun gear while rotating. A polishing object holding material, an internal gear that meshes with the gear of the polishing object holding material, a polisher that is fitted in the through hole and that polishes the polishing object that rotates by planetary motion of the polishing object holding material; A polishing apparatus comprising: the polishing object holding material formed of the polishing object holding material according to claim 1.   A polishing method for an object to be polished using the polishing apparatus according to claim 4, wherein the object to be polished is fitted in the through hole and the object holding material is moved in a planetary motion. A method for polishing an object to be polished, wherein the object is polished by the polishing machine.

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