JP2013094880A - Base material for polishing object holding carrier material and production method of base material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a base material for a polishing object holding carrier material allowing leftover material to be recycled.SOLUTION: The base material for a polishing object holding carrier material is constituted of a formed sheet body which comprises at least one of a thermosetting resin and a thermoplastic resin, and a fibrous filling agent. The base material for the polishing object holding carrier material is obtained by a production method including: a mixing step of adding at least one of the thermosetting resin and thermoplastic resin, and the fibrous filling agent to a dispersion medium and mixing them to obtain slurry; a sheet making step of subjecting the slurry obtained in the mixing step to sheet making and to drying for removing the dispersion medium to obtain a formed sheet; and a processing step of processing the obtained formed sheet into a predetermined shape to obtain a raw formed body; and heating/pressurizing the raw formed body.

Description

  The present invention relates to a substrate for a workpiece holding carrier material, and a manufacturing method.

  The object-holding carrier material is used as a means for holding an object to be polished when a disk-shaped object such as a semiconductor wafer, liquid crystal display glass, or hard disk is polished by a flat polishing machine. This object-holding carrier material has a holding hole for holding the object to be polished, and is processed into a shape that matches the polishing machine to be mounted.

  In recent years, the carrier holding carrier material has been increased in size (increase in area) to improve the productivity of the object to be polished, and a material that suppresses the processing strain generated with this increase in size has been developed. . (See Patent Document 1)

  Further, in recent years, the diameter of the workpiece has been increased, and this has increased the amount of scrap material produced when manufacturing a single workpiece holding carrier material. The increase in the amount of offcuts may lead to inefficiency in the process of manufacturing the object-holding carrier material, and may ultimately increase the manufacturing cost of the material to be polished.

JP2001-038609

  The objective of this invention is providing the base material for to-be-polished object holding | maintenance carrier materials which can recycle an end material.

Such an object is achieved by the present invention described in the following (1) to (6).
(1) A base material for an object-holding carrier material comprising a paper product of at least one of a thermosetting resin and a thermoplastic resin, and a fibrous filler.
(2) The papermaking material according to (1), wherein the papermaking product contains a fibrous filler in an amount of 10% by weight to 90% by weight.
(3) The base material for an object-holding carrier material according to (1) or (2), wherein the fibrous filler has an average fiber length of 0.5 mm or more and 20 mm or less.
(4) The substrate for an object-holding carrier material according to (3), wherein the fibrous filler contains glass fiber.
(5) The base material for an object-holding carrier material according to any one of (1) to (4), wherein the thermosetting resin is an epoxy resin.
(6) A mixing step of obtaining a slurry by adding and mixing at least one of a thermosetting resin and a thermoplastic resin and a fibrous filler and mixing the slurry obtained by the mixing step. A papermaking step of obtaining a papermaking sheet by drying the dispersion medium, a processing step of obtaining a shaped body by processing the papermaking sheet into a predetermined shape, and a step of heating and pressurizing the shaped body are characterized. A method for producing a substrate for an object-holding carrier material.

  ADVANTAGE OF THE INVENTION According to this invention, the base material for to-be-polished object holding | maintenance carrier materials which can recycle a scrap can be provided.

It is a schematic diagram of 1st embodiment of the base material for to-be-polished objects holding | maintenance carrier materials of this invention. It is a schematic diagram of 2nd embodiment of the base material for to-be-polished objects holding | maintenance carrier materials of this invention.

  Hereinafter, the base material for a workpiece-supporting carrier material and the manufacturing method of the present invention will be described in detail based on specific embodiments.

  The substrate for an object-holding carrier material of the present invention is a substrate for an object-holding carrier material comprising a paper product of at least one of a thermosetting resin and a thermoplastic resin, and a fibrous filler. is there.

  The method for producing a substrate for a workpiece-supporting carrier material according to the present invention comprises mixing at least one of a thermosetting resin and a thermoplastic resin and a fibrous filler by adding to a dispersion medium and mixing to obtain a slurry. A papermaking process for obtaining a papermaking sheet by papermaking the slurry obtained by the mixing step and drying the dispersion medium, a processing step for obtaining a green body by processing the papermaking sheet into a predetermined shape, It is a manufacturing method of the base material for to-be-polished object carrier materials characterized by including the process of heating-pressing a preform.

<Manufacturing Method of Substrate for Carrier Material Carrier>
First, the manufacturing method of the base material for to-be-polished object carrier materials of this invention is demonstrated.

  The method for producing a substrate for a workpiece-supporting carrier material according to the present invention comprises mixing at least one of a thermosetting resin and a thermoplastic resin and a fibrous filler by adding to a dispersion medium and mixing to obtain a slurry. A papermaking process for obtaining a papermaking sheet by papermaking the slurry obtained by the mixing step and drying the dispersion medium, a processing step for obtaining a green body by processing the papermaking sheet into a predetermined shape, It is a manufacturing method of the base material for to-be-polished object carrier materials characterized by including the process of heating-pressing a preform.

(Mixing process)
In the mixing step, a slurry is obtained by adding and mixing at least one of a thermosetting resin and a thermoplastic resin and a fibrous filler to the dispersion medium. The order of addition to the dispersion medium when preparing the slurry composition is not particularly limited, and the slurry composition can be sequentially added to the dispersion medium while confirming the dispersion state of the composition. The mixing method is not particularly limited, and a known mixer such as a pulper can be used. In this step, a known antifoaming agent generally used in papermaking can be used for the purpose of suppressing the generation of bubbles. The mixing conditions can be appropriately selected so that a uniform slurry composition can be obtained. For example, a resin and a fibrous filler are added to a dispersion medium so as to have a concentration of 0.5% by weight, and the mixture is mixed at 1500 rpm for 30 minutes. After stirring, a fixing agent previously dissolved in a dispersion medium is added by 0.05 wt%, and stirred at 500 rpm for 1 minute to prepare a slurry composition.

  The thermosetting resin includes at least one selected from the group consisting of phenol resin, epoxy resin, diallyl phthalate resin, unsaturated polyester resin, vinyl ester resin, melamine resin, xylene resin, furan resin, polyimide resin, and the like. It is preferable to use it. Among these, it is preferable to use an epoxy resin because of its high chemical resistance to the polishing liquid, but it can be appropriately selected and used according to other necessary characteristics.

  Examples of the thermoplastic resin include polyethylene resins such as polytetrafluoroethylene and ultrahigh molecular weight polyethylene, polyether resins such as polyoxymethylene, polyetheretherketone and polyetherimide, polyamide resins such as nylon, and polyamideimide. Use at least one selected from the group consisting of resins, polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polypropylene, polyarylate, polyethersulfone, polysulfone, acrylonitrile-butadiene-styrene copolymer, polyphenylene sulfide, etc. Are preferably selected and used according to the required properties such as chemical resistance to the polishing liquid.

  Although the thermosetting resin and the thermoplastic resin are not particularly limited, it is desirable that the thermosetting resin and the thermoplastic resin are in particulate form at room temperature and insoluble in the dispersion medium because they are combined with the fibrous filler by papermaking.

  The fibrous filler is not particularly limited, but is inorganic fiber such as glass fiber, carbon fiber, steel fiber, alumina fiber, polyparaphenylene benzobisoxazole fiber, polyarylate fiber, nylon fiber, aramid fiber, polyester fiber, acrylic fiber It is preferable to use at least one selected from the group consisting of fibers, vinylon fibers, cellulose fibers and the like. The organic fiber may be a fibrillated purple fiber. Among these, it is more preferable that glass fiber is included because rigidity necessary for the substrate for the object-holding carrier material is easily obtained.

  The average fiber length of the fibrous filler is preferably 0.5 mm or more and 20 mm or less, more preferably 1 mm or more and 15 mm. If it is less than the lower limit, the reinforcing effect may be insufficient. If the upper limit is exceeded, uniform dispersion cannot be achieved, resulting in non-uniform mechanical properties, and processing distortion such as warpage or twisting may occur. Here, when two or more fibrous fillers are used, it is preferable that any one or more of them satisfy the above range.

  The dispersion medium is not particularly limited as long as it can uniformly disperse the papermaking composition, and examples thereof include water, methanol, and ethanol. The dispersion may contain the following components. For example, curing agent, antioxidant, flame retardant, light resistance, ultraviolet absorber, light stabilizer, coating surface improver, thermal polymerization inhibitor, leveling agent, surfactant, colorant, storage stabilizer, dispersant, Plasticizers, lubricants, fillers, inorganic particles, deterioration inhibitors, wettability improvers, antistatic agents, conductive agents, viscosity modifiers, antibacterial agents, and the like.

  The fixing agent is used for aggregating the components constituting the papermaking body with weak chemical bonds or the like, and may contain the required characteristics in a range that does not extremely impair, and is not particularly limited. Examples thereof include polyethylene oxide, cationic polyacrylamide, anionic polyacrylamide, Hoffman acrylamide, mannic polyacrylamide, amphoteric copolymerized polyacrylamide, cationized starch, and amphoteric starch.

(Paper making process)
In the papermaking step, the paper obtained by the mixing step is made and dried by a dispersion medium to obtain a papermaking sheet. Paper making can be performed using a known paper making apparatus such as a box type paper machine, a continuous paper machine such as a long paper machine or a round paper machine, and a batch type paper machine such as a box paper machine is used. In this case, the paper-like material after paper making is held on a metal frame or the like and dried with a dryer or the like. When a continuous paper machine is used, it can be wound on a roller through a drying process as it is. The papermaking conditions can be appropriately selected so that the material in the slurry composition and the dispersion medium can be separated. For example, a slurry composition prepared using water as the dispersion medium is used as a base for a carrier material for holding an object in a papermaking band. After making up the material amount corresponding to the thickness of the material, it is dehydrated and dried at 105 ° C. for 30 minutes to produce a paper sheet.

  In addition, the thickness of a papermaking sheet | seat can be suitably adjusted with the frequency | count of papermaking.

  The papermaking sheet is a sheet composed of a papermaking body, and since fibers are randomly dispersed and formed, the papermaking sheet does not have directionality and has characteristics with almost equal strength and rigidity in all directions. it can. This is considered to lead to the suppression of the occurrence of “sledge” accompanying the increase in the size of the carrier material.

  The papermaking body preferably contains 10 to 90% by weight of fibrous filler, and more preferably 20 to 80% by weight.

  The papermaking product has a fixing agent, a curing agent for curing the thermosetting resin, a curing accelerator, a filler, a silane coupling agent, a colorant, a difficult agent, and the like within a range that does not extremely impair the required characteristics. Additives such as flame retardants and mold release agents can be included.

(Processing process)
In the processing step, the papermaking sheet obtained in the drying step is processed into a predetermined shape using an NC processing machine or the like to obtain a body. The predetermined shape is close to the final shape (a shape that matches the object to be polished and the polishing machine to be mounted) and is slightly larger than that. Specifically, the shape may be larger than the final shape by taking into account the shrinkage rate in the heating and pressurizing step described later.

  The end material generated by the processing step can be easily recycled once more as a raw material of the base material by adding it to the dispersion medium. This is because the mill ends are made by papermaking at least one of a thermosetting resin and a thermoplastic resin and a fibrous filler, so that these compositions can be easily separated simply by adding them to the dispersion medium. Because. Thereby, it is thought that the base material for to-be-polished object holding | maintenance carrier materials obtained by the manufacturing method of this invention can improve a manufacturing yield. On the other hand, when the carrier material base material is made by impregnating a fiber woven fabric such as glass cloth with a resin, it is difficult to restore the fiber woven fabric remaining on the end material, and the nonwoven fabric made of fibers is made of resin. Even in the case of making it impregnated, it is difficult to remove the resin from the mill ends, which is considered unsuitable for recycling.

(Heating and pressing process)
Although it does not specifically limit in a heating-pressing process, The papermaking sheet obtained at the said papermaking process is shape | molded by the heat compression molding by a hot press or a metal mold | die. The method for the hot press is not particularly limited, and can be performed by using a known press machine. The pressure applied in the pressure heating molding at this time is appropriately set according to the conditions in consideration of the resin composition, the curing temperature, and the final thickness of the base material, and is preferably 0.5 MPa or more, for example. The pressure is more preferably about 1 to 50 MPa, and further preferably about 2 to 30 MPa. By setting the applied pressure within the above range, the mechanical strength of the composite material can be sufficiently increased. And it becomes possible to manufacture a carrier material base material with high dimensional accuracy and suppressed deformation after solidification or curing. Further, after-curing can be performed for the purpose of completely curing the resin. The post-curing is not particularly defined and can be appropriately determined in consideration of the curing temperature of the resin used.

  The substrate for the object to be polished holding carrier can be processed into a final shape according to the object to be polished and the polishing machine to be mounted by using an NC processing machine or the like after the heating and pressing step.

  The substrate for a workpiece-supporting carrier material composed of the papermaking product thus obtained may have a coating layer formed on one side or both sides.

<Base material for carrier material to be polished>
Next, the base material for a workpiece holding carrier material obtained by the above-described manufacturing method will be described.

<First embodiment>
First, a first embodiment of the substrate for a workpiece-supporting carrier material of the present invention will be described.

  FIG. 1 is a diagram (longitudinal sectional view) for explaining a substrate for a workpiece holding carrier according to a first embodiment of the present invention. In the following description, for convenience of explanation, the upper side of FIG. 1 is referred to as “upper” and the lower side is referred to as “lower”.

  In 1st embodiment of this invention, it has the 1st coating layer 1 on the base material 2 for a to-be-polished object holding carrier material comprised with the papermaking body mentioned above, and has the 2nd coating layer 3 below.

  The 1st coating layer 1 will not be specifically limited if it is resin, such as a thermosetting resin, a photocurable resin, and a thermoplastic resin, Although these may contain 2 or more types, what is comprised from a thermoplastic resin. preferable. By comprising with a thermoplastic resin, it is not necessary to include the process of hardening, the 1st coating layer 1 can be comprised simply, and the assembly of the base material for to-be-polished objects holding | maintenance carrier materials becomes easy.

  The thermoplastic resin is preferably a resin having good wear resistance against the polishing liquid so that the service life as a base material for an object-holding carrier material is extended. For example, polytetrafluoroethylene, ultrahigh molecular weight polyethylene, etc. Examples thereof include polyether resins such as polyethylene resins, polyoxymethylenes, polyether ether ketones, and polyether imides, polyamide imide resins, and polyphenylene sulfide. Among these, polyethylene-based resins, polyether-based resins, and polyamide-imide-based resins are preferable. By selecting these, wear resistance is further improved.

  The thickness of the first coating layer 1 is not particularly limited as long as it has a thickness equal to or greater than that of the object to be polished in the chemical mechanical polishing process, but is preferably 10 μm or more and 100 μm or less, and more preferably 25 μm. As mentioned above, it is preferable that it is 85 micrometers or less. It exists in the point that it is easy to coat | cover with the thickness accuracy of a coating layer because it exists in the said range.

  The 2nd coating layer 3 will not be specifically limited if it is resin, such as a thermosetting resin, a photocurable resin, and a thermoplastic resin, Although these may contain 2 or more types, what is comprised from a thermoplastic resin. preferable. Moreover, the 2nd coating layer 3 may use the same resin structure as the 1st coating layer 1, or another resin structure. From the viewpoint of polishing accuracy, it is preferable to use those having the same resin configuration.

  As a method for coating the surface of the substrate 2 for the object-holding carrier material 2 with the first coating layer 1, a solution obtained by dissolving the resin of the first coating layer 1 in a solvent is applied to the substrate 2 for the object-holding carrier material 2. A method of applying and drying the solvent to coat the resin, or bonding the resin film of the resin used for the first coating layer 1 to the substrate 2 for the object-holding carrier material via the adhesive layer The method of coating can be used.

  For the pressure-sensitive adhesive layer, for example, a double-sided tape such as an acrylic pressure-sensitive adhesive, a urethane-based pressure-sensitive adhesive, or a rubber-based pressure-sensitive adhesive can be used, and a pressure-sensitive adhesive is applied to both surfaces of a core material such as a nonwoven fabric, a foamed body, and a resin film. May be a double-sided tape coated with, or a double-sided tape only having an adhesive without a film substrate. Here, it is preferable to use a double-sided tape having adhesive properties excellent in chemical resistance and removability to the polishing liquid.

  As a method of coating the surface layer of the substrate 2 for a workpiece holding carrier material 2 with the second coating layer 3, it can be coated by the same method as the first coating layer 1.

  The thickness of the object-holding carrier material 10 in the first embodiment is not particularly limited as long as it is a polishing target thickness of the object to be polished, but is preferably 500 μm or more and 1200 μm or less, and particularly preferably 600 μm or more and 1000 μm or less. By being in the said range, a to-be-polished object can be hold | maintained stably and a to-be-polished object with a sufficient precision can be obtained.

  In the first embodiment, the thickness ratio of the first coating layer 1, the substrate 2 for the workpiece holding carrier material, and the second coating layer 3 is such that the thickness of the first coating layer 1 is A, and the workpiece holding carrier material. Assuming that the thickness of the base material 2 is B and the thickness of the second coating layer 3 is C, the ranges are 0.8 <A / C <1.2 and 0.01 <(A + C) / B <2.0. It is more preferable that 0.9 <A / C <1.1 and 0.015 <(A + C) / B <1.0. By being in the said range, the base material 10 for a workpiece holding carrier material having a coating layer will have sufficient rigidity, and its life will be sufficient.

  An object-holding carrier material 10 in which the first covering layer 1 and the second covering layer 3 are provided on the surface layer of the substrate 2 for the object-holding carrier material 2 holds an object to be polished using an NC processing machine or the like. For example, it is obtained by drilling a holding hole for processing and processing according to the shape according to the polishing machine to be mounted.

  Further, as a method of restoring the polished object holding carrier material 10 used for the chemical mechanical polishing process to the form before use, the first coating layer 1 and / or the second coating layer 3 is polished. There is a method of covering and restoring the substrate, or a method of taking out the substrate 2 for holding the object to be polished and reusing it and reconstituting the first coating layer 1 and / or the second coating layer 3.

  As a method for covering and restoring the polished portion of the first coating layer 1, a solution obtained by dissolving the resin of the first coating layer 1 in a solvent is used, or the surface of the used first coating layer 1 or the object to be polished is taken out. There is a method of coating the resin by applying it on the upper surface of the substrate 2 for holding carrier material and drying the solvent. In addition, as a method for newly forming the first coating layer 1 on the upper surface of the substrate 2 for the workpiece holding carrier material taken out, a resin resin film used for the first coating layer 1 is used as the substrate for the workpiece holding carrier material. A method can be used in which the resin is coated by processing into the shape of the material 2 and bonding it to the upper surface of the substrate 2 for the object-holding carrier material 2 via an adhesive layer. When unnecessary resin of the first coating layer 1 remains after the resin coating, a finishing process for removing the unnecessary resin is performed to restore the form before use.

  As a method for covering and restoring the polished portion of the second coating layer 3, the same method as that for the first coating layer 1 can be used. That is, a solution obtained by dissolving the resin of the second coating layer 3 in a solvent is applied to the surface of the used second coating layer 3 or the lower surface of the taken-out substrate for carrier holding carrier material 2 and the solvent is dried. There is a method of coating the resin. In addition, as a method for newly forming the second coating layer 3 on the lower surface of the substrate 2 for the object-holding carrier material taken out, a resin film of a resin used for the second coating layer 3 is used as the substrate for the object-holding carrier material. A method can be used in which the resin is coated by processing into the shape of the material 2 and bonding the lower surface of the substrate 2 for the object-holding carrier material 2 via an adhesive layer. When the resin of the unnecessary 2nd coating layer 3 remains after resin coating, the finishing process for removing unnecessary resin is performed, and it restores to the form before use.

  The object-holding carrier material thus obtained holds the object to be polished in a holding hole for holding the object to be polished, such as a semiconductor wafer, a hard disk aluminum disk or glass disk, and a liquid crystal display glass substrate. It can be mounted on a commercially available polishing apparatus and subjected to chemical mechanical polishing. At this time, the polishing apparatus may be single-side polishing or double-side polishing.

<Second embodiment>
Next, 2nd embodiment of the base material for to-be-polished objects holding | maintenance carrier materials of this invention is described.

  FIG. 2 is a diagram (longitudinal sectional view) for explaining a substrate for an object-holding carrier material according to the second embodiment of the present invention. 2nd embodiment is the base material for to-be-polished object holding | maintenance carrier materials comprised with the papermaking body mentioned above, and the base material for to-be-polished objects holding | maintenance carrier materials which has the coating layer 5 on the one surface.

  Hereinafter, although a second embodiment will be described, the description will focus on the differences from the first embodiment, and the description of the same matters will be omitted. In FIG. 2, the same components as those in the first embodiment are denoted by the same reference numerals as those in FIG.

  In the present embodiment, the substrate 4 for the object-holding carrier material can be the same as the substrate 2 for the object-holding carrier material of the first embodiment. It is the same as the 1st coating layer 1 and the 2nd coating layer 3 of a form.

  The thickness of the workpiece holding carrier material 20 is not particularly limited as long as it is the thickness of the polishing target thickness of the workpiece, but is preferably 500 μm or more and 1200 μm or less, and particularly preferably 600 μm or more and 1000 μm or less. By being in the said range, a to-be-polished object can be hold | maintained stably and a to-be-polished object with a sufficient precision can be obtained.

  The thickness ratio between the substrate for polishing object holding carrier material 4 and the coating layer 5 in the substrate for polishing object holding carrier material 20 is D, and the thickness of the substrate for polishing object holding carrier material 4 is D. When the thickness is E, the range is preferably 0.005 <E / D <1.0, and more preferably 0.01 <E / D <0.5. By being in the said range, the base material 20 for to-be-polished object holding | maintenance carrier materials will become sufficient, and the life will become sufficient.

  The object-holding carrier material of the present embodiment holds the object to be polished in a holding hole for holding the object to be polished such as a semiconductor wafer, an aluminum disk for hard disk, a glass disk, a glass substrate for liquid crystal display, and the like. It can be mounted on a polishing apparatus and subjected to chemical mechanical polishing. At this time, the polishing apparatus is preferably a single-side polishing apparatus.

  The substrate for a workpiece holding carrier material in the first embodiment and the second embodiment has a coating layer, but the substrate for a workpiece holding carrier material of the present invention is not limited thereto. Further, it can be used as an object-holding carrier material that does not have a coating layer.

  EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited by these examples.

Example 1
1) Manufacture of base material for object holding carrier material <mixing process>
285 parts by weight of biphenyl type epoxy resin (YX4000, manufactured by Mitsubishi Chemical), 1 part by weight of 2-phenylimidazole (Cureazole 2PZ-PW, manufactured by Shikoku Kasei), and Kevlar pulp (1F303, manufactured by Toray DuPont) as a fibrous filler 165 parts by weight (solid content 89 parts by weight), glass fiber (CS3J-888, 11 μm diameter, 3 mm length, manufactured by Nittobo) were added 270 parts by weight (solid content 245 parts by weight), and the solid content concentration was 0.5. After being dispersed in water to a mass%, an aqueous solution of 800 ppm of polyethylene oxide was added to prepare a slurry.
<Paper making process>
The slurry was made, dehydrated, dried at 80 ° C. for 2 hours, and then heat-treated at 105 ° C. for 30 minutes to produce a paper sheet having a length of 300 mm × width of 300 mm × thickness of 5 mm.
<Processing process>
The papermaking sheet was punched using a Thomson blade produced in a circular shape to obtain a shaped body processed into a circle having an outer diameter of 220 mm.
<Heating and pressing process>
The above-mentioned shaped body is overlaid with release paper having a thickness of 35 μm on the uppermost surface and the lowermost surface, and subjected to heat and pressure molding for 30 minutes at a pressure of 10 MPa and a set temperature of 160 ° C., and a base for an object holding carrier material having a thickness of 720 μm. The material was obtained.
In addition, the mill material generated in the processing step is used as a recycled raw material, supplemented with the raw material used in the mixing step, and a slurry is prepared in the same manner as the mixing step. Similarly, a papermaking sheet and a body were obtained.

2) Formation of coating layer A double-sided tape (DF8365K) was used to form a 25 μm-thick polyetherimide film prepared by extrusion molding of polyetherimide (Ultem 1000, manufactured by GE Plastics) on both surfaces of the above-mentioned substrate for the object-holding carrier material. 115 μm thick, core material 25 μm PET, acrylic pressure-sensitive adhesive, manufactured by Toyo Ink Industries, Ltd.), and both surfaces were polished 2.5 μm at a time to obtain a 995 μm thick carrier holding carrier material.
From the above-described object-holding carrier material, five objects-holding carrier materials processed into a circle having an outer diameter of 200 mm and having seven holding holes (50-mm diameter) for the object to be polished were produced. 7 aluminum discs with a thickness of 1.0 mm are held for each carrier holding carrier material, and 5 chemical mechanical polishing processes are performed under the following polishing conditions using a single-side polishing apparatus (Model 6EC, manufactured by STRASBAUGH). When a total of 35 aluminum disks were polished, no object was detached from the object holding carrier material during the polishing process.
(Polishing conditions)
Surface pressure: 700 gf / cm2
Table rotation speed: 40 rpm
Chuck rotation speed: 40rpm
Polishing liquid: colloidal silica (NALCO2371) having a particle size of 70 nm or more, pH 12, solid content concentration: 5%
Polishing fluid flow rate: 150 ml / min
Polishing time: 120 min

(Example 2)
As a fibrous filler, it was coated in the same manner as in Example 1 except that the glass fiber was para-aramid fiber (Technola T32PNW, 12 μm diameter, 3 mm length, manufactured by Teijin Techno Products) 168 parts by weight (solid content 134 parts by weight). A substrate for an abrasive holding carrier material was prepared.

(Example 3)
Except for the epoxy resin of Example 1 being 100 parts by weight of bisphenol A type epoxy resin (jER1001, manufactured by Mitsubishi Chemical) and 185 parts by weight of novolac type phenolic resin (PR-50731, manufactured by Sumitomo Bakelite), the same as in Example 1. A substrate for an object-holding carrier material was prepared.
Example 4
A carrier material for holding an object to be polished in the same manner as in Example 1 except that the fiber filler (CS6J-888, 11 μm diameter, 6 mm length, manufactured by Nittobo) was 270 parts by weight (solid content: 245 parts by weight). The base material for manufacture was produced.

(Comparative Example 1)
Dimethylformamide is added to 100 parts by weight of a bisphenol A type epoxy resin (Epiclon 850, manufactured by DIC), 3.6 parts by weight of dicyandiamide (manufactured by Nippon Carbide Industries) and 0.1 part by weight of 2-methylimidazole (Curesol 2MZ, manufactured by Shikoku Chemicals). In addition, an epoxy resin varnish was prepared so as to have a nonvolatile content concentration of 55% by weight.
The resin varnish is impregnated with 80 parts by weight of a solid content with respect to 100 parts by weight of a glass fabric (WEA-116E, plain weave, thickness 95 μm, manufactured by Nittobo), and dried in a drying oven at 150 ° C. for 5 minutes. A sheet-like epoxy resin composite having a resin content of 44% by weight was produced.
10 sheets of the above-mentioned epoxy resin composite material are stacked, release paper having a thickness of 35 μm is stacked on the uppermost surface and the lowermost surface, and heat-pressure molding is performed at a pressure of 4 MPa and a set temperature of 200 ° C. for 120 minutes, and a glass of 1029 μm in thickness. A woven fabric base epoxy resin laminate was obtained.
Both sides of the glass woven fabric base epoxy resin laminate were polished 17 μm at a time to obtain a laminate for an object-holding carrier material having a thickness of 995 μm.
In the same manner as in Example 1, the laminate for the object-holding carrier material was processed in the outer shape and the holding hole of the object to obtain the object-holding carrier material. When the mechanical mechanical polishing of the aluminum disk was performed in the same manner as in Example 1, there was a thing in which the object to be polished was detached from the object holding carrier material during the polishing process, and the polishing process was interrupted.
Further, the end material generated in the processing of the laminate for holding an object-carrying carrier material could not completely separate the glass woven fabric and the molded resin, and a material that could be used as a recycling raw material was not obtained.

  Table 1 shows the results of evaluating the possibility of recycling and the presence or absence of processing strain. The presence or absence of processing strain was visually evaluated. In Table 1, in the possibility of recycling, ◯ indicates that recycling is possible, × indicates that recycling is not possible, and in the presence or absence of processing strain, ◯ indicates that the polishing process can be performed, and X indicates that the polishing process cannot be performed.

  As is clear from the results in Table 1, the substrate for a workpiece-supporting carrier material of the present invention can suppress processing strain and recycle the end material.

  The base material for an object-holding carrier material for an end material of the present invention is a base material for an object-holding carrier material that can be recycled.

DESCRIPTION OF SYMBOLS 1 1st coating layer 2 base material for to-be-polished object holding carrier material 3 2nd coating layer 4 base material for to-be-polished object holding carrier material 5 coating layer 10 to-be-polished object holding carrier material 20 to-be-polished object holding carrier material

Claims (6)

  A base material for an object-carrying carrier material comprising a papermaking product of at least one of a thermosetting resin and a thermoplastic resin, and a fibrous filler.   The base material for an object-holding carrier material according to claim 1, wherein the papermaking body contains 10% by weight or more and 90% by weight or less of a fibrous filler.   The substrate for an object-holding carrier material according to claim 1 or 2, wherein an average fiber length of the fibrous filler is 0.5 mm or more and 20 mm or less.   The base material for an object-holding carrier material according to claim 3, wherein the fibrous filler contains glass fibers.   The base material for an object-holding carrier material according to any one of claims 1 to 4, wherein the thermosetting resin is an epoxy resin.   A mixing step of obtaining a slurry by adding and mixing at least one of a thermosetting resin and a thermoplastic resin and a fibrous filler to the dispersion medium, and papermaking the slurry obtained by the mixing step to remove the dispersion medium A workpiece to be polished, comprising: a papermaking step of obtaining a papermaking sheet by drying; a processing step of obtaining a basic shape by processing the papermaking sheet into a predetermined shape; and a step of heating and pressurizing the basic shape. A method for producing a substrate for a holding carrier material.

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