JP2001230279A - Film carrier - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film carrier having superior accuracy in a wiring pattern shape and in alignment. SOLUTION: The film carrier 100 includes an insulating film tape 11 having each sprocket hole 12 on both sides, a device hole 13, a slit hole 14, and a wiring pattern 21a inside. An alignment mark 15 is provided at a prescribed position between the sprocket holes 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film carrier which is applied to a film carrier having a single-sided wiring layer or a double-sided wiring layer on which a semiconductor element or the like is mounted, and which improves the shape and position accuracy of a pattern.

[0002]

2. Description of the Related Art Printed wiring boards are used in televisions, mobile phones,
It is widely used in consumer electronic devices such as game machines, radios, audio devices, and VTRs, and industrial electronic devices such as electronic computers, OA devices, electronic applied devices, electric measuring instruments, and communication devices.
In recent years, demands for more compact electronic devices have been increasing. To meet this demand, electronics are designed to be smaller, denser, and more powerful.
Based on this, in the parts used, thinning of wiring, diameter of via holes, diameter of lands, pads, etc.,
Flexible, multi-layer, and high-definition substrates are rapidly advancing.

[0003] In addition, epoxy resin, phenol resin and acrylic resin have conventionally been used as the base material of components used in these electronic devices, but recently, a polyimide film or polyester film having excellent mechanical strength and heat resistance has been used. Film carriers using substrates such as fluororesins, polyphenylene oxides, polysulfones and polyetherimides are being developed for higher performance.

[0004] A general film carrier is manufactured by forming sprocket holes for film transport and positioning at both ends of an insulating film, and using the sprocket holes as a guide to form conductor layers, wiring patterns, electrode pads, and the like. I have.

[0005] In a general film carrier manufacturing process,
It also serves as a sprocket hole for transporting the film carrier and a sprocket hole for alignment. In this case, the shape of the sprocket hole changes while the film carrier is being transported several times in the manufacturing process, and the positioning accuracy with respect to the element pattern is deteriorated. It is a problem.

Further, with the increase in the area of the pattern region including the wiring pattern, the wiring pattern and the like are designed and arranged over a wide area excluding the sprocket hole portion, so that it is difficult to arrange the alignment pattern in the pattern region. Has become.

[0007]

SUMMARY OF THE INVENTION The present invention has been devised in order to solve the above-mentioned problems. Even if the pattern formation range of the film carrier is expanded over a wide area excluding the sprocket hole portion, the wiring pattern shape and An object of the present invention is to provide a film carrier having excellent alignment accuracy.

[0008]

In order to solve the above-mentioned problems in the present invention, a film having a wiring pattern formed along the longitudinal direction of an insulating film and sprocket holes formed at both ends thereof at equal intervals. The carrier is provided with an alignment mark at a predetermined position between the sprocket holes.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1A is a plan view showing an embodiment of a film carrier of the present invention, and FIG. 1B is a sectional view taken along line AA of the film carrier. is there. FIGS. 1A and 1B show the film carrier of the present invention.
As shown in FIG. 2, sprocket holes 12 are provided at both ends of the insulating film tape 11, device holes 13, slit holes 14 and wiring patterns 21a are provided therein, and alignment marks 15 are provided at predetermined positions between the sprocket holes 12.
Are provided respectively. By arranging the alignment mark 15 between the sprocket holes 12, high-precision alignment can be performed without affecting the transport of the insulating film tape. Further, the area in the width direction of the insulating film tape 11 can be effectively used, and the wiring pattern and the like can be effectively arranged over the entire width of the film carrier.

The alignment mark 15 is used not only in a film carrier manufacturing process but also in a mounting process of a semiconductor chip or the like.
It is also used in inspection processes.

Various shapes such as a circle, a cross, a square, and a rectangle can be applied to the shape of the alignment mark 15.
It can be appropriately selected depending on the required accuracy. Considering the productivity of the film carrier, it is desirable to form a circle, a cross, or the like. These alignment marks may be formed not only by a single pattern but also by combining a plurality of pattern shapes. Further, at least one interval between the alignment marks 15 may be provided for each row of sprocket holes arranged at both ends of the film carrier to be singulated, but a plurality of alignment marks may be provided according to the alignment method or the like. good.

The method for producing the film carrier of the present invention will be described. 2 (a) to 2 (d) are cross-sectional views showing the steps of manufacturing the film carrier in the order of steps. First, an insulating film tape 11 is prepared by cutting an insulating film with an adhesive layer into a predetermined width (see FIG. 2A). Next, sprocket holes 12 are formed along the longitudinal direction of both ends of the insulating film tape 11, and device holes 13 and slit holes 14 are formed therein (see FIG. 2B). When the sprocket hole 12 is formed, the sprocket hole 12
An alignment mark 15 is formed at a predetermined position between them (see FIG. 1A). The alignment mark 15 can be formed by patterning means such as printing or photo process in addition to punching and forming at the same time when the sprocket hole 12 is formed. The alignment intervals of the alignment marks 15 are provided between the sprocket holes 12 so that at least one alignment mark is disposed with respect to the row of sprocket holes disposed at the left and right ends of the film carrier to be separated.

Next, a copper foil is adhered to an area of the insulating film tape 11 excluding the sprocket holes 12 and
Is formed (see FIG. 2C).

Next, a dry film is stuck on the conductor layer 21 to form a photosensitive layer, and a predetermined pattern is exposed. At the time of this pattern exposure, the pattern is positioned using the alignment mark 15. Further, a resist pattern is formed by a development process, and the conductor layer 21 is etched using the resist pattern as a mask to form a wiring pattern 21a.
To form The film carrier 100 of the present invention in which the sprocket holes 12, the device holes 13, the slit holes 14, the wiring patterns 21a, and the alignment marks 15 are formed in the insulating film tape 11 in the above steps.
(See FIGS. 2D and 1A).

Further, high-precision positioning can be performed using the alignment marks 15 provided on the film carrier 100 of the present invention in the mounting of the semiconductor chip and the like, the resin sealing step and the inspection step.

[0016]

The present invention will be described in detail with reference to the following examples.
First, an insulating film made of a polyimide film having a thickness of 50 μm (UPILEX S: manufactured by Ube Industries, Ltd.)
An adhesive layer having a thickness of 2 μm (# 7100, manufactured by Toray Industries, Inc.) was formed and cut to a width of 48 mm to produce an insulating film tape 11 with an adhesive layer.

Next, at both ends of the insulating film tape 11, a sprocket hole 12 and a cross-shaped alignment mark 15 having a width of 100 μm and both a vertical and a horizontal length of 300 μm, a device hole 13 and a slit hole 14 are formed by punching. did.

Next, an 18 μm-thick copper foil (SLP, manufactured by Nippon Electrolysis Co., Ltd.) was bonded to one surface of the insulating film 11 except for the sprocket holes 12 to form a conductor layer 21.

Next, a dry film resist (RY3025: manufactured by Hitachi Chemical Co., Ltd.) was laminated on the conductor layer 21 to form a photosensitive layer. Next, the photomask on which the predetermined pattern was formed was aligned at a predetermined position using the alignment mark 15, and was subjected to close contact exposure at an exposure amount of 50 mJ / cm ² using an ultra-high pressure mercury lamp. After exposure, an alkaline developer at a temperature of 20 ° C. is ejected at a pressure of 9.8 × 10 ⁴ P
a) Spray development was performed for 90 seconds to form a resist pattern. Further, using the resist pattern as a mask resist, a ferric chloride solution heated to 60 ° C. was jetted at a pressure of 4.9.
Etching process at × 10 ⁴ Pa and wiring pattern 21a
And sprocket hole 1 in insulating film 11
2. A film carrier 100 of the present invention in which device holes 13, slit holes 14, wiring patterns 21a, and alignment marks 15 were formed was obtained.

Comparative Example A sprocket hole 12, a device hole 13, a slit hole 14, and a wiring pattern 2 were formed in an insulating film 11 under the same materials and conditions as in Example 1.
A comparative film carrier on which 1a was formed was prepared.

In the case of the film carrier for comparison, the sprocket holes are used for conveyance and positioning in the manufacturing process of the film carrier, so that the alignment accuracy of the alignment was poor as compared with the film carrier 100 of the present invention. In addition, mounting failure due to misalignment in the mounting process of the semiconductor chip and the like occurred, and bonding failure and disconnection of the wiring were confirmed in the inspection process.

[0022]

As described above, by using the film carrier of the present invention, excellent alignment accuracy can be obtained in the film carrier manufacturing process, the semiconductor chip mounting process, and the inspection process, and the film carrier manufacturing process can be performed. The yield is improved, and excellent practical effects are exhibited in the film carrier field.

[Brief description of the drawings]

FIG. 1 (a) is a plan view showing one embodiment of a film carrier of the present invention. (B) is a cross-sectional view of the configuration of the film carrier of the present invention cut along the line AA.

FIGS. 2A to 2D are cross-sectional views showing the steps of manufacturing the film carrier of the present invention in the order of steps.

[Explanation of symbols]

 11 ... insulating film tape 12 ... sprocket hole 13 ... device hole 14 ... slit hole 15 ... alignment mark 21 ... conductor layer 21a ... wiring pattern 100 ... film carrier

Claims (1)

[Claims] 1. A film carrier having a wiring pattern formed along a longitudinal direction of an insulating film and sprocket holes formed at both ends thereof at equal intervals, wherein alignment marks are provided at predetermined positions between the sprocket holes. A film carrier, characterized in that: