JP2001219443A - Resin member supply mechanism of sealing molding apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent leakage of a resin member from a space (clearance S) between a body part constituting a resin member supply mechanism and a lower mold in a sealing molding of an electronic part. SOLUTION: In order to prevent breakage of the body part 5 of a high hardness metal and the lower mold 2 by collision impact when the resin member 7 is supplied into a pot 21, the clearance S has been formed so far. The body part 5 is divided into a support mechanism part 5A and a body mechanism part 5B, and the part 5A is incorporated with a spring mechanism 5c and suspended from the part 5B. In the supply of the resin member 7, even when the lower mold 2 on which the electronic part 3 is mounted comes in contact with the body part 5 by the elevation of the lower mold 2, the contact is alleviated by the cushioning effect of the spring mechanism 5C to obviate the clearance S, and the scattering/discharge of the resin member 7 in the pot 21 can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin member supply mechanism of a sealing molding apparatus which is preferably used for sealing and molding electronic parts by clamping both upper and lower dies.

[0002]

2. Description of the Related Art In general, electronic parts such as ICs are manufactured through sealing molding (molding) with a resin member while being mounted on a lead frame.

As shown in FIG. 6, a conventional encapsulation / molding apparatus for encapsulating / molding an electronic component such as a semiconductor device includes an upper upper die (upper chase) 1 and a lower lower die (lower chase).
2 are opposed to each other, and a plurality of electronic components 3
A pair of lead frames 41 and 42 having
Is positioned and mounted.

In the upper mold 1 and the lower mold 2, cavities 11, 12 and 22, 23 are formed at corresponding positions of the respective electronic components 3, facing the parting line (PL) which is an opposing surface. The supplied resin member is the cull portion 13 of the upper mold 1.
And through the gate portions 24 and 25 of the lower mold 2 to fill the cavities 11, 12 and 22 and 23. Also, corresponding to the position of the cull portion 13,
(Pot) for storing the resin member supplied to the
to) 21 is formed on the lower mold 2. In addition, pot 2
A plurality of 1 and cull portions 13 are formed along the arrangement direction of the electronic components 3 so as to respectively correspond to the left and right electronic components 3.

[0005] Therefore, the electronic component 3 of the upper and lower molds 1 and 2 is used.
Prior to the formation of the seal, a resin member is supplied to the pot 21 of the lower mold 2 by a supply mechanism.

That is, as shown in the drawing, a resin member 7 is provided in a storage portion (holder) 6 on a main body 5 constituting a supply mechanism.
Is stored in the main body 5 on which the resin member 7 is placed.
Is transported between the opened upper and lower dies 1 and 2, and the supply port 51 of the main body 5 and the pot 21 of the lower die 2 are positioned at corresponding positions.

FIG. 7 is a cross-sectional view taken along the line AA of FIG. 6, and as shown in FIGS.
A plurality of (five in FIG. 7) supply ports 51 are provided in the arrangement direction of the electronic components 3, and the supply ports 51 receive the resin members stored in the storage unit 6 and receive the resin members in the pot 21 of the lower mold 2. Supply.

As shown in FIGS. 6 and 7, the storage section 6 has a funnel-shaped opening 6A which is opened up and down so as to store the resin member 7, and the opening 6A and the main body section are provided. The resin member 7 stored by the upper surface of the cylinder 5
, The resin member 7 can be stored and the stored resin member 7 can be supplied to the supply port 51 by the sliding reciprocating operation in the arrow Y direction.

Then, after the main body 5 is positioned on the lower mold 2, the lower mold 2 is operated by a driving unit (not shown), and
As shown in (a), it moves upward so as to approach the main body 5. Both the main body 5 and the lower mold 2 are made of a high-hardness metal manufactured by heat treatment. At least one of the main body 5 and the lower mold 2 is damaged if the lower mold 2 is pushed up by a driving unit and violently collides. Actually, as shown in FIG. 8A, a slight gap S is formed between the two, and they are configured to be close to and opposed to each other without contact.

As described above, when the cylinder 9 is operated in the direction of arrow Y in a state where the lower mold 2 and the main body 5 are brought close to each other, as shown in FIG. Supply port 5
1. Since the pot 21 is in communication, the resin member 7 in the storage section 6 falls into the pot 21 and is heated and melted by a heater (not shown).

In this manner, the resin member 7 is
After being dropped and stored in the lower mold 2, the lower die 2 is lowered, and then, as shown in FIG.
Pulled out in the direction. After the main unit 5 is carried out, the lower mold 2 in which the lead frames 41 and 42 are placed and the sealing resin member 7 is accommodated in the pot 21 is again moved upward by the operation of a driving unit (not shown). It adheres to the fixed upper mold 1.

The resin member 7 melted in the pot 21 is pushed by the operation of pushing up the plunger 8 in the pot 21 in synchronization with the close contact operation (mold clamping) between the upper mold 1 and the lower mold 2.
Cavities 11, 12, 22, 2 in which the electronic component 3 is located, via the cull portion 13 and the gate portions 24, 25 sequentially.
Feeding and filling toward 3. The resin member 7 covering the electronic component 3 is cured by heating by a heater incorporated in the upper mold 1 and the lower mold 2 to seal and mold the electronic component 3.

The electronic components 3 sealed and molded by the resin member 7 are ejected by the ejector pins of the upper mold 1 and the lower mold 2 shown in FIG. It is taken out by the operation of 1a and 2b.

When the resin member 7 is formed in a granular form,
The supply amount can be easily adjusted according to the shape and size of the electronic component 3, and the generation of dust during transportation is small.

[0015]

By the way, as described above, in the resin member supply mechanism in the conventional sealing molding apparatus, since the gap S exists between the lower mold and the main body, the resin member is placed in the pot. When dropped and supplied at once, air compressed in the pot blows out from the gap S,
A phenomenon occurred in which the resin member in the pot leaked out together with the blowing wind.

As a result, the amount of the resin member in the pot is reduced, and it is not possible to obtain a desired shape of the sealing molding.
There is a possibility that the resin member blown out from the gap S is hardened and solidified on the heated lower mold and may damage the lower mold surface and the lower surface of the main body.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to provide a resin member supply mechanism in which a resin member is prevented from leaking from a gap (a gap S) between a lower die and a main body. Aim.

[0018]

According to a first aspect of the present invention, there is provided a resin member supply mechanism of a sealing and molding apparatus configured to seal and mold an electronic component with a resin member supplied to a lower mold pot. A storage part for storing the resin member, a support mechanism part provided with a first supply port for receiving the resin member falling from the storage part and supplying the same to the lower part, Biased and said first
A main body portion having a second supply port for receiving the resin member from the supply port and further supplying the resin member further downward;
Below the main body, a lower mold provided with the pot for housing the resin member supplied through the second supply port, and vertically moving the lower mold or the support mechanism, A drive unit that drives the lower mold and the support mechanism to move closer to each other against the spring pressure of the spring mechanism, and the resin member that is incorporated into the lower mold pot and that is supplied with the upper resin mold. And a plunger for extruding the formed electronic component into a sealing molding cavity.

According to a second aspect of the present invention, there is provided a resin member supply mechanism of a sealing and molding apparatus configured to seal and mold an electronic component with a resin member similarly supplied to a lower mold pot.
A storage part for storing the resin member, a supply port for receiving the supply of the resin member stored in the storage part and supplying the resin member downward, and a main body part provided with a buffer member on the lower end surface; A lower mold provided below the main body portion and provided with the pot for accommodating the resin member supplied from the supply port, and moving the lower mold or the main body portion in the up-down direction to form the lower mold and the main body. And a drive unit for pressing the buffer member so as to approach the buffer member, and sealing the electronic component formed between the lower mold pot and the supplied resin member and the upper mold. And a plunger for extruding into the stop molding cavity.

According to a third aspect of the present invention, there is provided a resin member supply mechanism of a sealing and molding apparatus configured to seal and mold an electronic component by a resin member also supplied to a lower mold pot. And a supply port for receiving the supply of the resin member stored in the storage section and supplying the resin member downward, and an O-ring that orbits the opening of the supply port on the lower end surface. A main body portion, a lower mold below the main body portion, the lower mold provided with the pot for storing the resin member supplied from the supply port, and moving the lower mold or the main body portion in the up-down direction; A drive unit for driving the mold and the main body unit to press the O-ring so as to come close to each other; and the electronic unit incorporated in the lower mold pot and forming the supplied resin member between the upper mold and the electronic unit. Press into the cavity for sealing molding of the part. Characterized by comprising a plunger issue.

As described above, according to the present invention, the spring mechanism is provided on the main body, or the cushioning member or the O-ring is provided on the bottom of the main body, so that the main body and the mold are directly or indirectly connected. Adhesion can be achieved without providing the gap S, and the problem that the resin member in the pot leaks outside from the gap S between the main body and the lower mold as in the related art can be avoided.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention relating to a resin member supply mechanism of a sealing molding apparatus will be described below in detail with reference to FIGS. Note that the same components as those of the conventional configuration shown in FIGS. 6 to 8 are denoted by the same reference numerals, and detailed description thereof will be omitted.

FIG. 1 is a sectional view showing a first embodiment of a resin member supply mechanism according to the present invention, and corresponds to the sectional view of the conventional resin member supply mechanism shown in FIG.

That is, as shown in FIG.
Is structurally composed of a supporting mechanism 5A having a hollow portion and a main body mechanism 5B fitted in the hollow portion, and the supporting mechanism 5A houses the main body mechanism 5B so as to be vertically movable in the hollow portion. While holding, the main body mechanism 5B is configured to be urged downward by the spring mechanism 5C.

As described above, the main body 5 is provided with the support mechanism 5A.
The main body mechanism 5B, which is separated from the main body mechanism 5B and is supported and suspended by the support mechanism 5A, is constantly urged downward by the spring mechanism 5C and receives the resin member 7 from the storage section 6. The first and second supply ports 5Aa and 5Ba are provided in the support mechanism 5A and the main body mechanism 5B, respectively, so that the supply direction is common to the support mechanism 5A and the main body mechanism 5B so as to be dropped into the pot 21 of the lower mold 2. Reference numeral 5Ca denotes a guide bar (bar) for guiding the main body mechanism 5B in the direction of expansion and contraction of the spring mechanism 5C.

Therefore, according to the first embodiment,
When the resin member 7 is dropped and supplied into the pot 21, FIG.
As shown in (a), the lower die 2 is moved upward by operation of a drive unit (not shown) and pressed against the main body 5, but at this time, the lower die 2 resists the spring pressure of the spring mechanism 5C. As a result, the main body 5 (the main body mechanism 5B) is pressed, so that the lower mold 2 and the main body 5 (the main body mechanism 5B) come into gentle contact with each other.

After the pot 21 communicates with the first and second supply ports 5Aa and 5Ba of the main body 5 due to the rise of the lower die 2, as shown in FIG. Thereby, the resin member 7 in the storage section 6 falls into the pot 21.

Therefore, according to the resin member supply mechanism of this embodiment, the presence of the spring mechanism 5C allows the main body 5
(Main body mechanism section 5B) and lower mold 2 are gently brought into close contact with each other while maintaining buffering properties, and impact collision is avoided.
Even if the (body mechanism part 5B) and the lower mold 2 are made of a high-hardness metal by heat treatment, there is no accident that the contact surfaces of the body 5 (body mechanism part 5B) and the lower mold 2 are damaged. Be avoided.

Therefore, unlike the conventional apparatus, since there is no gap S, there is no leakage of the resin member 7 supplied into the pot 21 to the outside, and the electronic component 3 can be molded with high quality.

In the first embodiment, a funnel-shaped opening 6A provided in the storage section 6 is provided with a partition for dividing the opening 6A into a plurality of sections. That is, FIG. 3A is an enlarged sectional view of a main part of the storage unit 6, FIG. 3B is a plan view thereof, and FIG. 3C is a sectional view taken along line BB of FIG. 3B. , Respectively, in the opening 6A of the storage unit 6,
The cylindrical body 6Aa was inserted, and the cylindrical body 6Aa was configured to be supported by a pair of ribs 6Ab at the lower end. In FIG. 3B, the resin member 7 is omitted.

As described above, the lower end opening of the opening 6A is divided into a plurality of parts by the partition part (cylindrical body 6Aa) toward the first supply port 5Aa of the main body 5, so that the resin member 7 is It was configured to be stored outside the cylindrical body 6Aa so that an air passage communicating vertically with the cylindrical body 6Aa was formed.

Therefore, according to the above configuration, when the resin member 7 is dropped from the storage section 6 into the pot 21 in the state shown in FIG. 2B, even if the air in the pot 21 is likely to be compressed. The air in the pot 21 is gently discharged to the outside from an air passage in the cylindrical body 6Aa of the storage section 6 by a so-called air (air) bleeding action. Therefore, it is possible to prevent the resin member 7 in the pot 21 or the resin member 7 falling from the storage section 6 from blowing out to the outside together with the compressed air as in the related art.

In the first embodiment described above, the spring mechanism 5C is incorporated in the main body 5 so that the main body 5 and the lower mold 2 are in close contact with each other without severe collision. The same effect can be obtained even if a buffer member is separately provided between the lower mold 2 and the lower mold 2.

FIG. 4 is an enlarged sectional view of a main part of a resin member supply mechanism according to a second embodiment of the present invention. In FIG. 4, in the conventional structure shown in FIGS.
The lower end surface of the main body 5 is configured to have a cushioning member 5b for reducing the collision with the lower mold 2.

Therefore, according to the second embodiment, even if the lower mold 2 made of a high-hardness metal and the main body 5 come into contact with each other by being pressed, the damage can be avoided, and at the same time, the main body 5 and Since there is no gap S between the lower mold 2 and the pot 2,
It is possible to prevent the resin member 7 housed inside 1 from being scattered and leaked.

In the second embodiment, the buffer member is interposed between the main body 5 and the lower mold 2. However, the lower end of the main body 5 is formed so as to go around the lower end opening of the supply port 51. Similar effects can be obtained by providing an O-ring.

FIG. 5 is an enlarged sectional view showing a main part of a resin member supply mechanism according to a third embodiment of the present invention. In the conventional structure shown in FIGS. Is provided with a step 5c, the inner wall of which
As shown in FIG. 5, an O-ring 5d made of an elastic material such as rubber was attached to the step 5c.

As a result, as in the second embodiment, the lower mold 2 and the main body 5 are in close contact with each other via the O-ring 5d, so that the resin member 7 in the pot 21 can be prevented from being scattered and leaked. .

In each of the second and third embodiments, the buffer member 5b is used in the resin member supply mechanism of the conventional configuration shown in FIGS.
And the O-ring 5d is attached. However, by applying these buffer mechanisms to the resin member supply mechanism of the first embodiment, the clearance S between the main body 5 and the lower mold 2 is eliminated. Thus, the effect of preventing damage to the main body 5 and the lower mold 2 and the effect of scattering the resin member 7 in the pot 21 to the outside can be further enhanced.

Further, by forming the cushioning member 5b and the O-ring 5d with members having a high heat insulating effect, it is possible to prevent the heat of the lower mold 2 from being transmitted to the storage section 6 through the main body section 5, It is possible to avoid melting and solidification of the resin member 7 housed by heating the storage part 6.

In each of the above-described embodiments, the lower mold 2 below the main body 5 has been described as being raised and in contact with the main body. The same function and effect can be obtained even if the configuration is such that the contact is made.

Similarly, when the mold is clamped or opened between the upper mold 1 and the lower mold 2, the upper mold 1 may be lowered and raised instead of rising and lowering the lower mold 2. It goes without saying that similar functions and effects can be obtained.

As described above, the resin member supply mechanism of the sealing molding apparatus according to the present invention eliminates the gap (gap S) between the main body and the lower mold, thereby preventing the resin member in the pot from scattering and flowing. At the same time, damage to the main body and the lower mold can be avoided, and a remarkable effect can be obtained in practical use.

[0044]

According to the present invention, it is possible to prevent the resin member falling into the inner pot of the lower mold from being scattered and leaking by the close contact between the lower mold into which the resin member is charged and the main body. It is possible to further improve the manufacturing efficiency by the component mold.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a main part of a first embodiment of a resin member supply mechanism of a sealing molding apparatus according to the present invention.

FIGS. 2A and 2B are cross-sectional views each showing a state in which the resin member supply mechanism shown in FIG. 1 is operated.

3 (a) is an enlarged sectional view showing a storage section of the resin member supply mechanism shown in FIG. 1, FIG. 3 (b) is a plan view thereof, and FIG. 3 (c) is a view of FIG. 3 (b). FIG. 3 is a sectional view taken along line BB.

FIG. 4 is a sectional view of a main part showing a second embodiment of a resin member supply mechanism of the sealing molding apparatus according to the present invention.

FIG. 5 is a cross-sectional view of a principal part showing a third embodiment of a resin member supply mechanism of the sealing molding apparatus according to the present invention.

FIG. 6 is a sectional view of a main part showing a resin member supply mechanism of a conventional sealing molding apparatus.

FIG. 7 is an enlarged sectional view of a main part of the resin member supply mechanism of FIG.

FIG. 8 is an enlarged view of a main part showing an operation state of the resin member supply mechanism shown in FIG. 7;

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 upper mold 11, 12 cavity 13 cull part 2 lower mold 21 pot 22, 23 cavity 3 electronic component 41, 42 lead frame 5 main body (supply mechanism) 51 supply port 5A support mechanism section 5Aa first supply port 5B main body mechanism Part 5Ba Second supply port 5C Spring mechanism part 5b Buffer member 5d O-ring 6 Storage part 6A Opening 6Aa Tubular body (partition part) 7 Resin member 8 Plunger 9 Cylinder S Gap

Claims (5)

[Claims] 1. A resin member supply mechanism of a sealing and molding apparatus configured to seal and mold an electronic component with a resin member supplied to a lower mold pot, wherein a storage unit for storing the resin member; A support mechanism provided with a first supply port for receiving the resin member falling from the storage section and supplying the resin member downward; and a first supply port urged downward by a spring mechanism while being suspended by the support mechanism, and A main body portion having a second supply port for receiving the resin member from the port and further supplying the resin member further downward; and a lower supply section provided below the main body section and supplied through the second supply port. A lower mold provided with the pot for accommodating the resin member, and moving the lower mold or the support mechanism in the vertical direction,
A drive unit for driving the lower mold and the support mechanism to move closer to each other against the spring pressure of the spring mechanism; and And a plunger for extruding the formed electronic component into the cavity. 2. The resin member supply mechanism according to claim 1, wherein a buffer member is attached to a lower end surface of the main body facing the lower mold. 3. A resin member supply mechanism of a sealing and molding device configured to seal and mold an electronic component with a resin member supplied to a lower mold pot, wherein a storage unit for storing the resin member; A supply port for receiving the supply of the resin member stored in the storage portion and supplying the resin member downward is provided, and a main body portion provided with a buffer member on a lower end surface. A lower mold provided with the pot for accommodating the resin member supplied from the supply port, and moving the lower mold or the main body in the vertical direction, and pressing the lower mold and the main body against the buffer member. And a plunger that is incorporated into the lower mold pot and pushes the supplied resin member into the electronic component sealing molding cavity formed between the lower mold pot and the upper mold. Sealing characterized by that Resin member supply mechanism of stop molding device. 4. A resin member supply mechanism of a sealing and molding apparatus configured to seal and mold an electronic component with a resin member supplied to a lower mold pot, wherein a storage unit for storing the resin member; A main body part provided with a supply port for receiving the supply of the resin member stored in the storage part and supplying the resin member downward, and an O-ring circling the opening of the supply port on a lower end surface; A lower mold provided with the pot for housing the resin member supplied from the supply port, and moving the lower mold or the main body in the vertical direction, and the lower mold and the main body are A driving unit that presses an O-ring to drive the electronic component close to the electronic component, and the supplied resin member is incorporated into the lower mold pot, and the supplied resin member is formed in the electronic component sealing molding cavity formed between the upper mold and the upper mold. With an extruding plunger Resin member supply mechanism of the sealing molding apparatus according to claim Rukoto. 5. The storage section according to claim 1, wherein the storage section includes a partition section that divides the opening toward the supply port or the first supply port into a plurality of sections. The resin member supply mechanism of the sealing molding device according to claim 1.