JP2001219345A - Cutting/polishing device and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide cutting/polishing device and method capable of continuously executing a cutting work and a polishing work without interruption, and preventing extra labor and time for mounting and demounting a sample or replacing a cutting tool with a polishing tool. SOLUTION: This cutting/polishing device comprises a cutting tool part 24 mounted on a peripheral part of a disc-shaped member 22 for cutting a workpiece 16 by the rotation of the disc-shaped member, a polishing tool part 26 mounted on a face part vertical to the longitudinal direction of a rotary shaft 23 of the disc-shaped member 22 and grinding the workpiece 16 by the rotation of the disc-shaped member 22, and a workpiece holding means 30 for holding the workpiece 16.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, cutting an electronic component or observing a cut surface of the electronic component in order to directly observe a connection state between an electrode and a conductor inside the electronic component mounted on a mounting board. The present invention relates to a cutting / polishing apparatus and method that can be used for polishing or the like.

[0002]

2. Description of the Related Art Conventionally, there is a method of directly observing a cut surface with a transmission electron microscope in order to observe a connection state between an electrode and a conductor inside an electronic component mounted on a mounting board.
For that purpose, the following preparation work was required.

[0003] In order to prevent electronic components and the like observed by a transmission electron microscope from being directly impacted by cutting or polishing, which will be described later, first, FIG.
As shown in (a), the electronic component 10 and the like are placed in a container 12 and a molten synthetic resin 14 is poured into the container 12.

After the molten synthetic resin 14 has solidified after a predetermined time has elapsed, a solid synthetic resin 14A in which the electronic components 10 and the like are sealed is placed in a container as shown in a plan view of FIG. Remove from 12.

Next, the solid synthetic resin 14A, the electronic component 10, and the like are cut by a cutting device along the broken line shown in FIG. The sample 16 is removed and cut into an appropriate size as shown in FIG. Sample 1
6 shows a cut surface where the electronic component 10 and the like are exposed to the outside from the solid synthetic resin 14A as an observation surface 10a.
(C) Observe by a microscope or the like from the direction of the arrow.

Since the cut surface (observation surface 10a) is severely damaged by the cutting blade when the cut surface is cut, it is necessary to polish the surface with a polishing device and finish the mirror surface so that it can be observed with a microscope or the like. There is.

[0007]

However, in the preparation work before the observation of the observation surface 10a of the sample 16, the solid synthetic resin 14A and the electronic component 10
And the like, and the polishing of the observation surface 10a of the sample 16 are required. At this time, since the cutting and the polishing are performed by separate cutting devices and polishing devices, removal of the sample 16 from the cutting device, In addition, there is a problem that extra work and time are required for attaching the sample 16 to the polishing apparatus.

[0008] Further, even if there is a device that can perform cutting and polishing with one device, a method is adopted in which after the cutting is completed, the cutting blade is replaced with a polishing tool and the polishing is performed. Therefore, there is a problem that extra work and time are required for exchanging the cutting blade and the polishing tool. That is, conventionally, there has been no continuity between the two operations of the cutting process and the polishing process, and each process has been performed individually, thus causing the above-described problem.

In view of the above problems, the present invention allows cutting and polishing to be performed continuously without interruption, and also removes or attaches a sample or replaces a cutting tool with a polishing tool. It is an object of the present invention to provide a cutting / polishing apparatus and method capable of preventing troublesome and time-consuming operations.

[0010]

In order to solve the above-mentioned problems, a cutting / polishing apparatus according to the present invention is provided on a peripheral portion of a disk-shaped member and cuts a workpiece by rotating the disk-shaped member. A cutting tool portion for performing a grinding process, a polishing tool portion provided on a surface portion perpendicular to the axis of the disk-shaped member, for performing a grinding process on the workpiece by rotation of the disk-shaped member, and a workpiece holding the workpiece. And a holding means.

According to the cutting / polishing apparatus and method having the above-described configuration, the cutting tool portion cuts the workpiece by the rotation of the disk-shaped member, and the polishing tool portion is coated following the end of the cutting process. Since the workpiece can be polished, cutting and polishing can be performed continuously without interruption, and extra work such as removal and attachment of the sample or replacement of the cutting tool and polishing tool is required. Time can be prevented.

[0012]

Embodiments of the present invention will be specifically described below with reference to the drawings. 1 to 9
FIG. 1 is a diagram referred to for describing a first embodiment of a cutting / polishing apparatus and method according to the present invention.

FIG. 1 is a diagram showing a cutting / polishing apparatus 20 according to a first embodiment of the present invention. The cutting and
The polishing apparatus 20 includes a disc-shaped member 2 inside a main body case 21.
2 and the disk-shaped member 22 is rotatable around a rotation shaft 23. The sample 16 (workpiece) is formed around the disk-shaped member 22 by rotating the disk-shaped member 22.
There is provided a cutting blade portion 24 (cutting tool portion) for performing the cutting process. FIG. 2 showing the disk-shaped member 22 as viewed in the direction of arrow A in FIG.
As shown in FIG. 5, a polishing paper 26 (polishing tool portion) is provided on a surface of the disc-shaped member 22 perpendicular to the longitudinal direction of the rotating shaft 23.

As shown in FIG. 3 (b), the abrasive paper 26 is inserted into a circular recess 22a formed in the disc-shaped member 22 and having a depth slightly smaller than the thickness of the abrasive paper 26, via an adhesive seal. It is provided by sticking.

As shown in FIG. 4, the circular concave portion 22a of the disk-shaped member 22 has four through-holes 28, so that the abrasive paper 26 is transferred from the back side of the disk-shaped member 22 to the through-holes 28.
The adhesive seal on the back surface of the abrasive paper 26 can be easily peeled off by pressing with a finger or a tool through.

As shown in FIG. 5, the abrasive paper 26 is formed by adhering abrasive particles having a plurality of levels of roughness to different regions in the order of roughness on one sheet of paper. That is, the abrasive paper 26
The outermost annular area along the periphery of the surface is coated with the coarsest abrasive particles, the inner intermediate area is coated with intermediate coarse abrasive particles, and the innermost annular area. Has the finest abrasive particles attached to it.

As shown in FIG. 1, near the upper side of the disk-shaped member 22, a sample holder 30 (workpiece holding means) for holding the sample 16 has a rotating shaft 31 as shown in FIG. Is held at the tip of a sample holding arm 32 rotatable around the arm.

As shown in FIG. 6, the sample holder 30 holds the sample 16 between the main body 33 and the holding plate 34,
The sample 16 can be fixed by tightening the screw 36. The body 33 has a screw hole 38 through which a screw for attaching the sample holder 30 to the sample holding arm 32 is inserted.

The sample holding arm 32 can be manually moved in the length direction of the rotating shaft 31 and can move the disk-shaped member 2.
In the longitudinal direction of the rotation shaft 23, the sample holding arm 3
The distance between 2 and the disc-shaped member 22 can be adjusted.

As shown in FIG. 7, a sample holding arm 32 is provided between the sample holding arm 32 and the main body case 21.
A slide bar 41 for supporting the sample is provided. The slide bar 41 can be slid in the direction of the arrow in the figure along the inclined upper side of the main body case 21 in order to change the inclination angle of the sample holding arm 32. Has become.
FIG. 8 is a view of the sample holding arm 32 of FIG.

The operation of the cutting / polishing apparatus 20 having such a configuration will be described below. First, the polishing paper 26 is stuck in the circular concave portion 22 a of the disk-shaped member 22, and the sample holder 30 to which the sample 16 is fixed is attached to the tip of the sample holding arm 32. Then, the sample holding arm 32 is moved in the length direction of the rotating shaft 31 to adjust the cutting position of the sample 16 by the cutting blade 24.

Next, while rotating the disk-shaped member 22, the slide bar 41 is slid downward along the inclined upper side of the main body case 21 to lower the sample holder 30, and the sample 16 is cut by the cutting blade 24. Then, the cutting process of the sample 16 is started. The cutting depth of the sample 16 by the cutting blade 24 is increased while sliding the slide bar 41 downward along the inclined upper side of the main body case 21 in accordance with the cutting state of the sample 16.

When the cutting process of the sample 16 is completed, the slide bar 41 is further slid downward, and the sample 16 is cut.
Is in contact with the abrasive paper 26, and polishing by the abrasive paper 26 starts.

The cut surface of sample 16 is first polished in contact with the coarsest abrasive particles of abrasive paper 26. When polishing with the coarsest particles of the polishing paper 26 is completed, the slide bar 4
The sample 16 is lowered by one slide, and is then polished by contacting abrasive particles having an intermediate roughness of the abrasive paper 26.

After the polishing by the abrasive particles of the intermediate roughness of the abrasive paper 26 is completed, the sample 16 is further lowered by sliding the slide bar 41 and finally comes into contact with the finest abrasive particles of the abrasive paper 26. Polished. Abrasive paper 2
When the polishing of the sample 16 with the finest abrasive particles of No. 6 is completed, the polishing process is completed.

In order to prevent the contact strength between the sample 16 and the abrasive paper 26 from decreasing according to the degree of polishing when the abrasive particles of each roughness are polished, the sample holding arm 32 is connected to the rotating shaft 31.
The sample 16 can be polished while manually pressing in the length direction.

FIG. 9 is a diagram showing the relationship between the slide of the slide bar 41 and the inclination angle of the sample holding arm 32. The slide bar 41 at the position shown in FIG. 9A is slid downward and to the right in the figure. As shown in FIG. 9B, the sample holding arm 32 lowers the sample holder 30 (not shown in FIG. 9) while tilting the tilt angle of the sample holding arm 32.

According to the cutting / polishing apparatus and method having the above-described configuration, the cutting tool performs the cutting of the workpiece by the rotation of the disk-shaped member 22, and after the completion of the cutting, the polishing tool is moved. Since the workpiece can be polished, the cutting and polishing can be performed continuously without interruption, and the removal and attachment of the sample 16 can be performed.
Alternatively, it is possible to prevent unnecessary labor and time such as replacement of the cutting blade and the polishing tool.

That is, since the polishing can be continuously started immediately after the completion of the cutting of the sample 16, the total time required for the cutting and the polishing can be significantly reduced. Conventionally, the cutting blade portion is formed on the periphery of the disk-shaped member, and the surface portion of the disk-shaped member is not used. However, according to the present invention, the surface portion of the disk-shaped member is effectively used. can do.

Further, in the conventional polishing, since only one type of abrasive particles adhere to one piece of polishing paper, the polishing is divided into several steps from polishing with a coarser grain to polishing with a finer grain. In the present invention, extra work and time, such as attaching and detaching a polishing plate, a polishing paper, or a sample, were required at each stage. By gradually moving the abrasive particles from the coarser to the finer ones, it is possible to polish the roughness stepwise, so that it is possible to prevent unnecessary labor and time as in the conventional case described above.

Further, according to the cutting / polishing apparatus 20 of the present invention, when polishing is not required depending on the application, the work of cutting only by the cutting blade portion 24 can be performed without attaching the polishing paper 26. Although both the cutting and the polishing require water, the time required for the cutting and the polishing can be significantly reduced as described above, so that the amount of water to be used can be significantly reduced.

Further, since the moving direction of the sample 16 is constant from the coarser to the finer particles, it is conceivable that the clogging of the abrasive paper 26 can be eliminated. Further, since the adhesion area per abrasive particle of one type of roughness is small and the moving direction of the sample 16 is constant, the unevenness of wear of the abrasive paper 26 is reduced.
Further, it is also possible to arrange a plurality of samples 16 having different progresses in order in the radial direction of the polishing paper 26 and to polish them simultaneously.

FIG. 10 is a diagram showing types of arrangement examples of the abrasive particles on the abrasive paper 26. FIG. 10A shows the distribution width (length on the radius of the polishing paper 26) of the abrasive particles having different roughness is almost the same as in the above embodiment.

FIG. 10 (b) shows a distribution in which the distribution of the abrasive particles in the peripheral part is larger than that in the central part. Since the polishing process using coarse abrasive particles takes more time, the arrangement example takes this into consideration.

FIG. 10 (c) shows a distribution where the distribution width of the abrasive particles in the peripheral part is smaller than that in the central part, contrary to the case of FIG. 10 (b). This is such that the distribution areas of the abrasive particles of each roughness are substantially the same.

FIG. 10D shows a case where the distribution regions of the abrasive particles of each roughness are partially mixed, and the distribution region of the abrasive particles of each roughness is partially mixed. Has substantially the same effect as polishing with abrasive particles having a roughness intermediate between the respective roughnesses.

FIG. 10 (e) is the same as FIG. 10 (a) in that the distribution width of the abrasive particles of each roughness is substantially the same, but contrary to FIG. 10 (a), The particles are arranged at the center and the finest abrasive particles are arranged at the periphery. Also in FIGS. 10B to 10D, the arrangement order can be reversed in this way.

In the above embodiment, the case where the distance between the sample holding arm 32 and the disk-shaped member 22 is manually adjusted has been described. However, such adjustment of the distance is performed using an actuator. It can also be performed by electronic control. In this case, when the control unit detects that the cutting of the sample 16 has been completed, it is possible to control so as to keep applying the force using the actuator so as to always press the sample 16 against the abrasive paper 26.

Also, the sample holding arm 32 can be held down by a jig at the time of polishing, whereby a uniform force can be applied to the sample 16 and uneven polishing can be prevented. There is no need to worry about injuries that can occur when you hold the hand.

Further, in the above-described embodiment, the case where three types of abrasive particles are adhered to one piece of abrasive paper 26 has been described. Abrasive particles of four or more types of roughness can be attached to a piece of abrasive paper.

In the above-described embodiment, the case where the abrasive paper 26 is attached to the circular concave portion 22a of the disk-shaped member 22 via the adhesive seal has been described. However, it is not necessary to limit to such a method. The paper 26 is the disk-shaped member 2
2 may be mechanically detachable by a stopper by a stopper, or any other mounting method such as mounting with a reusable adhesive.

In the above embodiment, the sample 1
6 is held down by screws 36 and the main body 33
Although the description has been given of the case where the sample holder 30 for fixing the sample 16 is used, the present invention is not limited to this. Any other fixing method may be used, such as a vacuum suction method for fixing the sample 16 or a clip method for fixing the sample 16 with a swinging member by a spring force.

Although the embodiments of the present invention have been specifically described above, the present invention is not limited to the above-described embodiments, and may be variously modified based on the technical idea of the present invention. Can be changed.

[0044]

As described above, according to the present invention,
The cutting tool performs the cutting of the workpiece by the rotation of the disk-shaped member, and the polishing tool can perform the polishing of the workpiece following the end of the cutting. It can be performed continuously without interruption, and it is possible to prevent extra work and time, such as removal and attachment of the sample or replacement of the cutting blade and the polishing tool.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing a cutting / polishing apparatus 20 according to a first embodiment of the present invention.

FIG. 2 is a view of the disk-shaped member 22 and the sample holding arm 32 in FIG.

3A and 3B are views showing a disk-shaped member 22, FIG. 3A is a front view thereof, and FIG. 3B is a partial sectional side view thereof.

FIG. 4 is a view on arrow A when the abrasive paper 26 of the disk-shaped member 22 in FIG. 1 is not stuck.

FIG. 5 is a front view showing a distribution area of the abrasive particles of the abrasive paper 26 according to roughness.

6 (a) is a front view, FIG. 6 (b) is a side view, and FIG. 6 (c) is a rear view.

FIG. 7 is a view of the sample holder 30 and the sample holding arm 32 in FIG.

FIG. 8 is a view of the sample holder 30 and the sample holding arm 32 in FIG.

9A and 9B are diagrams illustrating the operation of the sample holding arm 32 when the cutting / polishing apparatus 20 is operating, and FIG. 9A is a diagram illustrating the position of the sample holding arm 32 at the initial operation of the cutting / polishing apparatus 20; FIG. 9B is a diagram showing the position of the sample holding arm 32 when the operation of the cutting / polishing apparatus 20 progresses.

FIGS. 10A to 10E are diagrams illustrating examples of the arrangement of the distribution area of the abrasive particles for each roughness of the abrasive paper 26. FIGS.

FIG. 11 is a diagram showing how to make a sample 16, and FIG.
11A is a side view showing a state in which the electronic component 10 is immersed in the molten synthetic resin 14, FIG. 11B is a plan view showing a cutting position of the solid synthetic resin 14A, and FIG. It is a top view showing sample 16 formed after cutting synthetic resin 14A.

[Explanation of symbols]

Reference numeral 10: electronic component, 10a: observation surface, 12: container, 14 ...
Molten synthetic resin, 14A: solid synthetic resin, 16: sample, 20: cutting / polishing device, 21: body case, 22:
Disc-shaped member, 22a: circular recess, 23: rotating shaft, 24:
Cutting blade part, 26 ... abrasive paper, 28 ... through hole, 30 ... sample holder, 31 ... rotating shaft, 32 ... sample holding arm, 33 ... body, 34 ... holding plate, 36 ... screw, 38 ... screw hole,
41 ... Slide bar

Claims (4)

[Claims] A cutting tool provided on a peripheral portion of the disk-shaped member for cutting a workpiece by rotation of the disk-shaped member; and a cutting tool provided on a surface perpendicular to an axis of the disk-shaped member. A cutting / polishing apparatus comprising: a polishing tool section for polishing a workpiece by rotating a disk-shaped member; and a workpiece holding means for holding the workpiece. 2. A cutting tool portion provided on a peripheral portion of a disk-shaped member for cutting a workpiece by rotation of the disk-shaped member, and a cutting tool portion provided on a surface portion perpendicular to an axis of the disk-shaped member. A cutting / cutting machine provided with a polishing tool for polishing a workpiece by rotating a disk-shaped member, and workpiece holding means for holding the workpiece.
By using a polishing device, the cutting tool portion performs a cutting process of the workpiece by the rotation of the disc-shaped member, and the polishing tool portion performs the polishing process of the workpiece following the end of the cutting process. A cutting / polishing method, characterized in that: 3. The cutting and polishing apparatus according to claim 1, wherein an abrasive paper is used as said polishing tool. 4. The cutting and polishing apparatus according to claim 3, wherein abrasive particles having a plurality of levels of roughness are adhered to regions different from each other in the order of roughness on one sheet of the polishing paper.