JP2001217170A - Substrate-baking method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem, where a substrate-baking method in IC manufacturing takes much space since a device is installed in planar manner. SOLUTION: A prescribed number of hot plates 14, 15, and 16 are arranged above, cooling plates 17, 19 are arranged below, and baking process and cooling process are carried out in the upper and lower positions.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for baking a substrate in IC manufacturing.

[0002]

2. Description of the Related Art FIG. 3 is a schematic plan view showing a substrate baking apparatus for performing a conventional substrate baking method. The substrate baking apparatus is provided with a substrate (not shown) unloaded from the loader 1.
However, the first hot plate 2, the second hot plate 3, the third hot plate 4, the first cool plate 5, and the second cool plate 6 stay in that order for a preset time and are stored in the unloader 7.

[0003] Reference numerals 8a to 8d are heat insulating materials.

[0004]

However, in the conventional substrate baking method, (A) the length of the apparatus is increased and space is required, and (B) the temperature difference between the third hot plate and the first cool plate is reduced. Therefore, even if a heat insulating material is inserted between the substrates, there is a problem that the substrates cannot be baked or cooled uniformly due to a temperature difference between the surfaces of the respective plates.

[0005]

In order to solve the above-mentioned problems, the present invention provides a step of placing a substrate on a first hot plate and performing a first bake for a predetermined time. Placing the substrate on a second hot plate located below the plate and performing a second bake for a predetermined time; and placing the substrate on a first cool plate located below the second hot plate. Placing the substrate on and performing a first cooling for a predetermined time;
Placing the substrate on a first cool plate located below the first cool plate and performing a second cooling for a predetermined time.

[0006]

FIG. 1 is a plan view showing a substrate baking apparatus used in an embodiment of the present invention, and FIG. 2 is a side view of FIG.

In FIG. 1, reference numeral 9 denotes a lifter robot having an arm 10 and movable in the left-right direction and the up-down direction.
Reference numeral 1 denotes a first buffer provided to face the loader 1, reference numeral 12 denotes a second buffer provided to face the unloader 7, and reference numeral 13 denotes a bake unit whose details are shown in FIG.

In the baking section 13 (see FIG. 2), a heat insulating material 18 is fixed to the lower surface of each of the first, second and third hot plates 14, 15, 16, and 17. 2 hot plate, 3rd hot plate and 1st cool plate, 19
The second cool plate is arranged below the cool plate 17 at a predetermined interval.

An embodiment of the present invention will be described in the order of steps using the substrate baking apparatus having this configuration. First, a substrate (not shown, hereinafter the same) unloaded from the loader 1 is first
It is transported to the buffer 11. Then, the arm 10 of the lifter robot 9 moved to the position L clamps the substrate.

The lifter robot 9 has its arm 1
After moving to position C in a state where 0 clamps the substrate, it rises to the position of first hot plate 14 (see FIG. 2). When the arm 10 is extended and the clamp is released, the substrate is placed on the first hot plate 14.

In this state, the first baking is performed on the substrate for a predetermined time.

After the specified time has elapsed, the arm 10 clamps the substrate again, retreats, descends to the position of the second hot plate 15, and the arm 10 moves forward, and when the clamp is released, the substrate is moved to the second position. It rests on the hot plate 15.

In this state, a second bake is performed on the substrate for a predetermined time.

In the same manner, the arm 10 operates, the substrate is placed on the third hot plate 16, and the third bake is performed for a predetermined time.

Next, the arm 10 operates in the same manner as described above, places the substrate on the first cool plate 17, performs first cooling for a predetermined time, and thereafter similarly performs the second cool plate 19. Then, the second cooling is performed for a predetermined time.

When the designated time has elapsed, the arm 1
0 clamps the substrate, and the lifter robot 9 moves to the position R. Then, the substrate is transferred to the second buffer 12 by the arm 10 and then stored in the unloader 12.

In the above embodiment, three hot plates and two cool plates are arranged, baking is performed in three steps, and cooling is performed in two steps. However, the present invention is not limited to this. Needless to say, only the steps need to be performed.

As described above, according to the embodiment, a predetermined number of hot plates are arranged at an upper position, and cool plates are arranged at a lower position at a predetermined interval. Therefore, the substrate baking method can be performed without taking up space, and the substrate can be uniformly baked or cooled by providing a heat insulating material between the plates.

[0019]

As described above, according to the present invention, since the baking step and the cooling step are performed at the upper and lower positions, there is an effect that no space is required.

[Brief description of the drawings]

FIG. 1 is a plan view showing a substrate baking apparatus used in an embodiment of the present invention.

FIG. 2 is a side view of FIG.

FIG. 3 is a plan view showing a substrate baking apparatus for performing a conventional substrate baking method.

[Explanation of symbols]

 Reference Signs List 9 lifter robot 10 arm 11 first buffer 12 second buffer 13 bake section 14 first hot plate 15 second hot plate 16 third hot plate 17 first cool plate 18 heat insulating material 19 second cool plate

Claims (1)

[Claims] 1. A substrate is placed on a first hot plate,
Performing a first bake for a predetermined time; placing the substrate on a second hot plate located below the first hot plate and performing a second bake for a predetermined time; Placing the substrate on a first cool plate located below the second hot plate, and performing first cooling for a predetermined time; Placing the substrate on a second cool plate located therein and performing a second cooling for a predetermined time.