JP2001198813A5 - - Google Patents
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- Publication number
- JP2001198813A5 JP2001198813A5 JP2000004915A JP2000004915A JP2001198813A5 JP 2001198813 A5 JP2001198813 A5 JP 2001198813A5 JP 2000004915 A JP2000004915 A JP 2000004915A JP 2000004915 A JP2000004915 A JP 2000004915A JP 2001198813 A5 JP2001198813 A5 JP 2001198813A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- friction
- change component
- time
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 10
- 238000005259 measurement Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims 2
- 230000036962 time dependent Effects 0.000 claims 2
- 239000007788 liquid Substances 0.000 claims 1
- 230000000717 retained effect Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000004915A JP2001198813A (ja) | 2000-01-13 | 2000-01-13 | 研磨装置及びその研磨方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000004915A JP2001198813A (ja) | 2000-01-13 | 2000-01-13 | 研磨装置及びその研磨方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001198813A JP2001198813A (ja) | 2001-07-24 |
| JP2001198813A5 true JP2001198813A5 (https=) | 2004-12-24 |
Family
ID=18533641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000004915A Pending JP2001198813A (ja) | 2000-01-13 | 2000-01-13 | 研磨装置及びその研磨方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001198813A (https=) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6431953B1 (en) * | 2001-08-21 | 2002-08-13 | Cabot Microelectronics Corporation | CMP process involving frequency analysis-based monitoring |
| JP4615275B2 (ja) * | 2004-09-21 | 2011-01-19 | 株式会社ディスコ | ウェーハ研磨装置及びウェーハの研磨方法 |
| JP2007190638A (ja) * | 2006-01-18 | 2007-08-02 | Jtekt Corp | 内面研削盤 |
| JP2011040511A (ja) * | 2009-08-10 | 2011-02-24 | Disco Abrasive Syst Ltd | ウエーハの研削方法 |
| JP2013219248A (ja) | 2012-04-10 | 2013-10-24 | Ebara Corp | 研磨装置および研磨方法 |
| JP6030041B2 (ja) | 2013-11-01 | 2016-11-24 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| KR102388170B1 (ko) | 2014-09-02 | 2022-04-19 | 가부시키가이샤 에바라 세이사꾸쇼 | 종점 검출 방법, 연마 장치 및 연마 방법 |
| US10744617B2 (en) | 2015-10-16 | 2020-08-18 | Ebara Corporation | Polishing endpoint detection method |
| JP6775354B2 (ja) | 2015-10-16 | 2020-10-28 | 株式会社荏原製作所 | 研磨装置、及び、研磨方法 |
| CN108145594A (zh) * | 2017-12-21 | 2018-06-12 | 上海华力微电子有限公司 | 研磨垫使用寿命的监测方法及监测设备 |
| WO2019177842A1 (en) * | 2018-03-12 | 2019-09-19 | Applied Materials, Inc. | Filtering during in-situ monitoring of polishing |
-
2000
- 2000-01-13 JP JP2000004915A patent/JP2001198813A/ja active Pending
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