JP2001192632A - Flame-retardant adhesive and circuit material using the same - Google Patents
Flame-retardant adhesive and circuit material using the sameInfo
- Publication number
- JP2001192632A JP2001192632A JP34271199A JP34271199A JP2001192632A JP 2001192632 A JP2001192632 A JP 2001192632A JP 34271199 A JP34271199 A JP 34271199A JP 34271199 A JP34271199 A JP 34271199A JP 2001192632 A JP2001192632 A JP 2001192632A
- Authority
- JP
- Japan
- Prior art keywords
- flame
- retardant
- parts
- weight
- polyester resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims abstract description 67
- 239000003063 flame retardant Substances 0.000 title claims abstract description 67
- 239000000853 adhesive Substances 0.000 title claims abstract description 40
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 40
- 239000000463 material Substances 0.000 title claims abstract description 33
- 229920001225 polyester resin Polymers 0.000 claims abstract description 29
- 239000004645 polyester resin Substances 0.000 claims abstract description 29
- 229920006395 saturated elastomer Polymers 0.000 claims abstract description 28
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 9
- 239000002253 acid Substances 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052698 phosphorus Inorganic materials 0.000 claims description 7
- 239000011574 phosphorus Substances 0.000 claims description 7
- 229920000877 Melamine resin Polymers 0.000 description 12
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical group NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 11
- -1 melamine salt compound Chemical class 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229910052736 halogen Inorganic materials 0.000 description 5
- 150000002367 halogens Chemical class 0.000 description 5
- 230000032683 aging Effects 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 238000002485 combustion reaction Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000004114 Ammonium polyphosphate Substances 0.000 description 2
- 229920000388 Polyphosphate Polymers 0.000 description 2
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 2
- 229920001276 ammonium polyphosphate Polymers 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000001205 polyphosphate Substances 0.000 description 2
- 235000011176 polyphosphates Nutrition 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101001028400 Homo sapiens Keratin, type I cytoskeletal 40 Proteins 0.000 description 1
- 102100037157 Keratin, type I cytoskeletal 40 Human genes 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000012757 flame retardant agent Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/5205—Salts of P-acids with N-bases
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
- C08K5/5333—Esters of phosphonic acids
- C08K5/5353—Esters of phosphonic acids containing also nitrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/28—Non-macromolecular organic substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Fireproofing Substances (AREA)
- Adhesive Tapes (AREA)
- Insulated Conductors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えば電子機器等
に用いられる回路材を製造するための難燃性接着剤の技
術に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flame-retardant adhesive for producing a circuit material used in, for example, electronic equipment.
【０００２】[0002]
【従来の技術】近年、例えばパーソナルコンピュータ等
の電子機器においては、異なる基板の接続端子同士を接
続するためのコネクタとして、フラットケーブル等の回
路材が用いられている。2. Description of the Related Art In recent years, in electronic devices such as personal computers, circuit materials such as flat cables have been used as connectors for connecting connection terminals of different substrates.
【０００３】この種の回路材は、一対の被覆材の間に所
定数の導体を配置し、熱圧着等によって被覆材同士を貼
り合わせたものであるが、一般に電子機器においては機
器内の温度がかなり高くなることから、被覆材を貼り合
わせるため接着剤としては、難燃性を有するものが求め
られている。[0003] This type of circuit material is obtained by arranging a predetermined number of conductors between a pair of covering materials and bonding the covering materials together by thermocompression bonding or the like. Therefore, a flame-retardant adhesive is required for bonding the coating material.
【０００４】従来、この種の回路材用の接着剤の材料と
しては、ハロゲン系の難燃剤を含むものや、ポリリン酸
アンモニウムを含むものが知られている。Heretofore, as materials for this type of circuit material adhesive, those containing a halogen-based flame retardant and those containing ammonium polyphosphate have been known.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、このよ
うな従来の回路材用の接着剤のうちハロゲン系の難燃剤
を用いたものは、燃焼時にハロゲンガスが発生するた
め、環境に対して悪影響を及ぼすという問題がある。However, among the conventional adhesives for circuit materials using a halogen-based flame retardant, halogen gas is generated at the time of combustion, which has an adverse effect on the environment. There is a problem that.
【０００６】一方、ポリリン酸アンモニウムを含む難燃
剤を用いたものは、環境に対して悪影響は及ぼさない
が、耐熱湿電気特性が良くないというという問題があ
る。On the other hand, the use of a flame retardant containing ammonium polyphosphate does not adversely affect the environment, but has a problem that the heat-resistant wet electrical properties are not good.
【０００７】また、これらの問題を解決すべく、窒素化
合物とホウ酸亜鉛を含む難燃剤を用いた接着剤も提案さ
れているが、この接着剤は、難燃性がやや低いという問
題がある。To solve these problems, an adhesive using a flame retardant containing a nitrogen compound and zinc borate has also been proposed, but this adhesive has a problem that its flame retardancy is rather low. .
【０００８】本発明は、このような従来の技術の課題を
解決するためになされたもので、環境に優しく、かつ、
耐熱湿電気特性に優れ、しかも高い難燃性を有する難燃
性接着剤及びこれを用いた回路材を提供することを目的
とする。[0008] The present invention has been made to solve the problems of the prior art, and is environmentally friendly.
An object of the present invention is to provide a flame-retardant adhesive having excellent heat-resistance and wet-electric properties and high flame retardancy, and a circuit material using the same.
【０００９】[0009]
【課題を解決するための手段】上記目的を達成するため
になされた請求項１記載の発明は、飽和ポリエステル樹
脂と、分子中にＰ−Ｃ結合を含む成分と、分子中に窒素
を含む成分とを含有する難燃剤とを含み、前記飽和ポリ
エステル樹脂１００重量部に対して前記難燃剤を９０重
量部以上配合してなることを特徴とする難燃性接着剤で
ある。Means for Solving the Problems The invention according to claim 1, which has been made to achieve the above object, comprises a saturated polyester resin, a component containing a PC bond in a molecule, and a component containing a nitrogen in a molecule. And a flame retardant containing: 90 parts by weight or more of the flame retardant with respect to 100 parts by weight of the saturated polyester resin.
【００１０】また、請求項２記載の発明は、請求項１記
載の発明において、前記飽和ポリエステル樹脂１００重
量部に対して前記難燃剤を９０重量部以上１２０重量部
以下配合してなることを特徴とする。The invention according to claim 2 is characterized in that, in the invention according to claim 1, the flame retardant is blended in an amount of 90 parts by weight or more and 120 parts by weight or less with respect to 100 parts by weight of the saturated polyester resin. And
【００１１】一方、請求項３記載の発明は、飽和ポリエ
ステル樹脂と、分子中にＰ−Ｃ結合を含む成分と、分子
中に窒素を含む成分と、分子中にリンを有しない酸成分
とを含む難燃剤とを含有することを特徴とする難燃性接
着剤である。On the other hand, the invention according to claim 3 comprises a saturated polyester resin, a component having a PC bond in a molecule, a component having a nitrogen in a molecule, and an acid component having no phosphorus in a molecule. And a flame-retardant agent.
【００１２】また、請求項４記載の発明は、請求項３記
載の発明において、前記飽和ポリエステル樹脂１００重
量部に対して前記難燃剤を８０重量部以上配合してなる
ことを特徴とする。The invention according to a fourth aspect is characterized in that, in the invention according to the third aspect, the flame retardant is blended in an amount of 80 parts by weight or more with respect to 100 parts by weight of the saturated polyester resin.
【００１３】さらに、請求項５記載の発明は、請求項３
又は４のいずれか１項記載の発明において、前記飽和ポ
リエステル樹脂１００重量部に対して前記難燃剤を８０
重量部以上１２０重量部以下配合してなることを特徴と
する。Further, the invention according to claim 5 is the invention according to claim 3.
Or the flame retardant is added to the saturated polyester resin in an amount of 80 parts by weight based on 100 parts by weight of the saturated polyester resin.
It is characterized by being blended in an amount of at least 120 parts by weight.
【００１４】他方、請求項６記載の発明は、所定の回路
形成用の導体と、該導体を被覆するための被覆材とを有
し、この被覆材が、請求項１乃至請求項５のいずれか１
項記載の難燃性接着剤を用いて接着されていることを特
徴とする回路材である。On the other hand, the invention according to claim 6 has a conductor for forming a predetermined circuit and a covering material for covering the conductor, and the covering material is any one of claims 1 to 5. Or 1
A circuit material characterized by being adhered using the flame-retardant adhesive described in the above item.
【００１５】本発明の難燃性接着剤は、難燃剤の材料に
ハロゲンを使用していないので、燃焼時にハロゲンガス
が発生せず、環境に対して悪影響を及ぼすことがない。Since the flame-retardant adhesive of the present invention does not use halogen as a material of the flame retardant, no halogen gas is generated at the time of combustion, and there is no adverse effect on the environment.
【００１６】その一方、本発明の難燃性接着剤は、分子
中にＰ−Ｃ結合を含む成分と、分子中に窒素を含む成分
とを含有するものを用いたことによって、燃焼時のリン
の縮合反応による表面コーティング膜（断熱及び酸素遮
断効果がある）の生成を促進させる相乗効果が発揮さ
れ、また水に溶解されない塩を生成することで耐加水分
解性が向上するため、耐熱湿特性及び難燃性を向上させ
ることが可能になる。On the other hand, the flame-retardant adhesive of the present invention uses a component containing a component containing a PC bond in a molecule and a component containing nitrogen in a molecule, so that the phosphorus used during combustion can be reduced. Has the synergistic effect of accelerating the formation of a surface coating film (having an insulating and oxygen-blocking effect) by the condensation reaction of, and also has a resistance to hydrolysis due to the formation of a salt that is not dissolved in water, thereby improving the heat and humidity resistance. And the flame retardancy can be improved.
【００１７】また、本発明にあっては、かかる難燃剤
に、分子中にリンを有しない酸成分を加えることによっ
て、より窒素の含有量を増加させることができるため、
より少ない量の難燃剤で所望の耐熱湿特性及び難燃性を
有する難燃性接着剤を得ることができる。In the present invention, the nitrogen content can be further increased by adding an acid component having no phosphorus in the molecule to the flame retardant.
It is possible to obtain a flame-retardant adhesive having desired heat and moisture resistance and flame retardancy with a smaller amount of flame retardant.
【００１８】[0018]
【発明の実施の形態】以下、本発明に係る難燃性接着剤
及びこれを用いた回路材の実施の形態を図面を参照して
詳細に説明する。図１は、本発明に係る回路材であるフ
ラットケーブルの一例を示す断面図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a flame-retardant adhesive and a circuit material using the same according to the present invention will be described below in detail with reference to the drawings. FIG. 1 is a sectional view showing an example of a flat cable which is a circuit material according to the present invention.
【００１９】図１に示すように、本実施の形態のフラッ
トケーブル１は、所定数の回路形成用の導体２を、一対
の被覆材３、４によって被覆することにより構成されて
いる。ここで、一対の被覆材３、４は、後述する本発明
の難燃性接着剤５を用いて貼り合わされている。As shown in FIG. 1, a flat cable 1 according to the present embodiment is configured by covering a predetermined number of conductors 2 for forming a circuit with a pair of covering materials 3 and 4. Here, the pair of coating materials 3 and 4 are bonded using a flame-retardant adhesive 5 of the present invention described later.
【００２０】本発明の場合、導体２としては、例えば銅
（Ｃｕ）からなり、長尺で角板形状のものが用いられ
る。なお、導体２の厚さは、１８μｍ〜１００μｍ程度
である。In the case of the present invention, the conductor 2 is made of, for example, copper (Cu) and has a long rectangular plate shape. In addition, the thickness of the conductor 2 is about 18 μm to 100 μm.
【００２１】また、被覆材３、４の材料は特に限定され
ることなく種々のものを用いることができるが、コスト
等の観点からは、ポリエステルからなるものを用いるこ
とが好ましい。The materials of the coating materials 3 and 4 are not particularly limited, and various materials can be used. From the viewpoint of cost and the like, it is preferable to use a material made of polyester.
【００２２】被覆材３、４の厚さについても特に限定さ
れるものではないが、作業性の観点からは、数μｍ〜数
百μｍとすることが好ましく、より好ましい被覆材３、
４の厚さは、１２μｍ〜２５０μｍである。The thickness of the coating materials 3 and 4 is not particularly limited, but is preferably from several μm to several hundred μm from the viewpoint of workability, and more preferably from 3 to 100 μm.
4 has a thickness of 12 μm to 250 μm.
【００２３】一方、本発明の難燃性接着剤５は、飽和ポ
リエステル樹脂と難燃剤とを含有するものである。本発
明の場合、飽和ポリエステル樹脂の種類は特に限定され
ることなく種々のものを用いることができるが、難燃性
の観点からは、リン酸基を有する多価カルボン酸を含む
ものを用いることが好ましい。On the other hand, the flame retardant adhesive 5 of the present invention contains a saturated polyester resin and a flame retardant. In the case of the present invention, the type of the saturated polyester resin is not particularly limited, and various types can be used.However, from the viewpoint of flame retardancy, a resin containing a polycarboxylic acid having a phosphate group is preferably used. Is preferred.
【００２４】このようなポリエステル樹脂としては、例
えば、ユニチカ社製 ＵＥ２０００があげられる。An example of such a polyester resin is UE2000 manufactured by Unitika.
【００２５】他方、本発明の難燃性接着剤５に含有され
る難燃剤は、分子中にＰ（リン）−Ｃ（炭素）結合を含
む成分と、分子中に窒素（Ｎ）を含む成分とを含む。On the other hand, the flame retardant contained in the flame retardant adhesive 5 of the present invention includes a component containing a P (phosphorus) -C (carbon) bond in a molecule and a component containing nitrogen (N) in a molecule. And
【００２６】ここで、分子中にＰ−Ｃ結合を含む成分と
しては、例えば、式（１）で表されるニトリロトリスメ
チレンホスホン酸があげられる。The component containing a PC bond in the molecule is, for example, nitrilotrismethylenephosphonic acid represented by the formula (1).
【００２７】[0027]
【化１】 Embedded image
【００２８】また、分子中に窒素を含む成分としては、
例えば、式（２）で表されるメラミンがあげられる。The components containing nitrogen in the molecule include:
For example, there is melamine represented by the formula (2).
【００２９】[0029]
【化２】 Embedded image
【００３０】そして、本発明においては、上記ニトリロ
トリスメチレンホスホン酸とメラミンのイオンが結合し
た塩化化合物を好適に用いることができる。In the present invention, a chloride compound in which the ion of nitrilotrismethylenephosphonic acid and melamine is bonded can be suitably used.
【００３１】一方、本発明にあっては、飽和ポリエステ
ル樹脂１００重量部に対して、上述した難燃剤を９０重
量部以上配合することが好ましい。On the other hand, in the present invention, it is preferable that 90 parts by weight or more of the above-mentioned flame retardant is added to 100 parts by weight of the saturated polyester resin.
【００３２】難燃剤の配合量が飽和ポリエステル樹脂１
００重量部に対して９０重量部より少ないと、十分な難
燃性を得ることができない。The amount of the flame retardant is a saturated polyester resin 1
If the amount is less than 90 parts by weight, sufficient flame retardancy cannot be obtained.
【００３３】その一方、難燃剤の配合量は、飽和ポリエ
ステル樹脂１００重量部に対して１２０重量部以下とす
ることが好ましい。On the other hand, the compounding amount of the flame retardant is preferably 120 parts by weight or less based on 100 parts by weight of the saturated polyester resin.
【００３４】難燃剤の配合量が飽和ポリエステル樹脂１
００重量部に対して１２０重量部より多いと、剥離強度
が低下するという不都合がある。The amount of the flame retardant is saturated polyester resin 1
If the amount is more than 120 parts by weight with respect to 00 parts by weight, there is a disadvantage that the peel strength is reduced.
【００３５】さらに、本発明の難燃性接着剤５の難燃剤
には、分子中にリンを有しない酸成分を含ませることも
できる。Further, the flame retardant of the flame retardant adhesive 5 of the present invention may contain an acid component having no phosphorus in the molecule.
【００３６】ここで、分子中にリンを有しない酸成分と
しては、例えば、上述したメラミンと、式（３）で表さ
れるシアヌル酸とを含む化合物があげられる。The acid component having no phosphorus in the molecule includes, for example, a compound containing the above-mentioned melamine and cyanuric acid represented by the formula (3).
【００３７】[0037]
【化３】 Embedded image
【００３８】そして、本発明においては、例えばメラミ
ン・シアヌル酸付加物を好適に用いることができる。こ
のメラミン・シアヌル酸付加物は、安価である点で有利
なものである。In the present invention, for example, melamine / cyanuric acid adduct can be suitably used. This melamine / cyanuric acid adduct is advantageous in that it is inexpensive.
【００３９】本発明の場合、飽和ポリエステル樹脂１０
０重量部に対して、難燃剤を８０重量部以上配合するこ
とが好ましい。In the case of the present invention, the saturated polyester resin 10
It is preferable to blend the flame retardant in an amount of 80 parts by weight or more with respect to 0 parts by weight.
【００４０】難燃剤の配合量が飽和ポリエステル樹脂１
００重量部に対して８０重量部より少ないと、十分な難
燃性を得ることができない。The amount of the flame retardant compounded is a saturated polyester resin 1
If the amount is less than 80 parts by weight, sufficient flame retardancy cannot be obtained.
【００４１】その一方、難燃剤の配合量は、飽和ポリエ
ステル樹脂１００重量部に対して１２０重量部以下とす
ることが好ましい。On the other hand, the compounding amount of the flame retardant is preferably 120 parts by weight or less based on 100 parts by weight of the saturated polyester resin.
【００４２】難燃剤の配合量が飽和ポリエステル樹脂１
００重量部に対して１２０重量部より多いと、剥離強度
が低下するという不都合がある。The amount of the flame retardant is a saturated polyester resin 1
If the amount is more than 120 parts by weight with respect to 00 parts by weight, there is a disadvantage that the peel strength is reduced.
【００４３】なお、本発明の難燃性接着剤５には、目的
に応じて、架橋剤、顔料、無機充填剤、酸化防止剤、老
化防止剤、カップリング等の添加剤を添加することも可
能である。Incidentally, additives such as a crosslinking agent, a pigment, an inorganic filler, an antioxidant, an antioxidant, and a coupling may be added to the flame-retardant adhesive 5 of the present invention according to the purpose. It is possible.
【００４４】本発明の難燃性接着剤５は、例えば、ま
ず、飽和ポリエステル樹脂をメチルエチルケトン等の溶
剤に溶解し、次いで、難燃剤を添加し、十分に攪拌して
分散させることによって得られる。The flame-retardant adhesive 5 of the present invention can be obtained, for example, by first dissolving a saturated polyester resin in a solvent such as methyl ethyl ketone, then adding a flame retardant, and sufficiently stirring and dispersing.
【００４５】[0045]
【実施例】以下、本発明の実施例を比較例とともに詳細
に説明する。 （難燃性接着剤の調製）Hereinafter, examples of the present invention will be described in detail along with comparative examples. (Preparation of flame retardant adhesive)
【００４６】＜実施例１＞飽和ポリエステル樹脂（ＵＥ
２０００）１００重量部に、溶剤トルエンを用い、ニト
リロトリスメチレンホスホン酸メラミン塩化合物（日本
化学工業社製 Ｎ６ＭＥ）１００重量部を混合・分散さ
せることによって、目的とする難燃性接着剤を得た。Example 1 Saturated polyester resin (UE
2000) 100 parts by weight of a solvent toluene and 100 parts by weight of a nitrile trismethylenephosphonic acid melamine salt compound (N6ME manufactured by Nippon Chemical Industry Co., Ltd.) were mixed and dispersed to obtain a target flame-retardant adhesive. .
【００４７】＜実施例２＞飽和ポリエステル樹脂（ＵＥ
２０００）１００重量部に、溶剤トルエンを用い、実施
例１と同様のホスホン酸メラミン塩化合物６０重量部
と、メラミン・シアヌル酸付加物（日産化学社製 ＭＣ
６１０）２０重量部とを混合して、目的とする難燃性接
着剤を得た。Example 2 A saturated polyester resin (UE
2000) 60 parts by weight of a melamine phosphonate compound and a melamine / cyanuric acid adduct (Nissan Chemical Industries, Ltd.
610) and 20 parts by weight to obtain a desired flame-retardant adhesive.
【００４８】＜実施例３＞ホスホン酸メラミン塩化合物
の配合量を４０重量部とし、メラミン・シアヌル酸付加
物の配合量を４０重量部とした以外は実施例２と同様の
方法によって難燃性接着剤を得た。Example 3 Flame retardancy was obtained in the same manner as in Example 2, except that the amount of the melamine phosphonate compound was 40 parts by weight and the amount of the melamine / cyanuric acid adduct was 40 parts by weight. An adhesive was obtained.
【００４９】＜実施例４＞ホスホン酸メラミン塩化合物
の配合量を２０重量部とし、メラミン・シアヌル酸付加
物の配合量を６０重量部とした以外は実施例２と同様の
方法によって難燃性接着剤を得た。Example 4 Flame retardancy was obtained in the same manner as in Example 2 except that the amount of the melamine phosphonate compound was 20 parts by weight and the amount of the melamine / cyanuric acid adduct was 60 parts by weight. An adhesive was obtained.
【００５０】＜比較例１＞ホスホン酸メラミン塩化合物
の代わりにメラミン・シアヌル酸付加物を１００重量部
配合した以外は実施例１と同様の方法によって難燃性接
着剤を得た。Comparative Example 1 A flame-retardant adhesive was obtained in the same manner as in Example 1, except that 100 parts by weight of a melamine / cyanuric acid adduct was used instead of the melamine phosphonate compound.
【００５１】＜比較例２＞ホスホン酸メラミン塩化合物
の代わりに硫酸メラミン塩化合物（三和ケミカル社製
アピノン−９０１）を１００重量部配合した以外は実施
例１と同様の方法によって難燃性接着剤を得た。<Comparative Example 2> A melamine sulfate compound (manufactured by Sanwa Chemical Co., Ltd.) was used instead of the phosphonic acid melamine salt compound.
A flame-retardant adhesive was obtained in the same manner as in Example 1 except that 100 parts by weight of Apinone-901) was blended.
【００５２】＜比較例３＞ホスホン酸メラミン塩化合物
の代わりにポリリン酸メラミン塩化合物を１００重量部
配合した以外は実施例１と同様の方法によって難燃性接
着剤を得た。Comparative Example 3 A flame-retardant adhesive was obtained in the same manner as in Example 1 except that 100 parts by weight of a melamine polyphosphate compound was used instead of the melamine phosphonate compound.
【００５３】（評価） 〔難燃性〕上記実施例及び比較例の難燃性接着剤を用い
てフラットケーブルを作成し、ＵＬ規格の垂直難燃試験
（ＶＷ−１）を行うことによって、難燃性を評価した。
その結果を表１に示す。(Evaluation) [Flame Retardancy] A flat cable was prepared using the flame retardant adhesives of the above Examples and Comparative Examples, and subjected to a UL standard vertical flame retardancy test (VW-1). The flammability was evaluated.
Table 1 shows the results.
【００５４】ここでは、良好な難燃性を示したものを
◎、やや難燃性は劣るが十分に実用可能なものを○、実
用上問題のあるものを×とする。Here, those showing good flame retardancy are marked with ◎, those with slightly inferior flame retardancy but sufficiently practicable are marked with ○, and those with practical problems are marked with x.
【００５５】〔熱湿エージング後の電気特性〕上記実施
例及び比較例の難燃性接着剤を用い、ＪＩＳ Ｃ６４７
１に基づく所定の試験を行うことにより、熱湿エージン
グ後の電気特性を評価した。その結果を表１に示す。[Electrical properties after hot and wet aging] The flame-retardant adhesives of the above Examples and Comparative Examples were used in accordance with JIS C647.
By performing a predetermined test based on No. 1, the electrical characteristics after hot-humid aging were evaluated. Table 1 shows the results.
【００５６】ここでは、実用可能なレベル（１×１０8
〜１×１０10Ω）を○、実用上問題のあるもの（１×１
０8Ω未満）を×とする。Here, a practical level (1 × 10 8)
To 1 × 10 10 Ω), those having a practical problem (1 × 1
(Less than 0 8 Ω).
【００５７】[0057]
【表１】 [Table 1]
【００５８】表１から明らかなように、実施例１〜４の
難燃性接着剤は、難燃性及び熱湿エージング後の電気特
性ともに良好な結果が得られた。As is evident from Table 1, the flame-retardant adhesives of Examples 1 to 4 exhibited good results in both flame retardancy and electrical properties after hot and wet aging.
【００５９】特に、難燃剤としてホスホン酸メラミン塩
化合物のみを含む実施例１のものは、難燃性が優れてい
た。In particular, the composition of Example 1 containing only a melamine phosphonate compound as a flame retardant was excellent in flame retardancy.
【００６０】一方、ニトリロトリスメチレンホスホン酸
メラミン塩化合物の代わりにメラミン・シアヌル酸付加
物を用いた比較例１と、硫酸メラミン塩化合物を用いた
比較例２のものは、難燃性が劣っていた。On the other hand, Comparative Example 1 using the melamine / cyanuric acid adduct instead of the nitrilotrismethylene phosphonic acid melamine salt compound and Comparative Example 2 using the melamine sulfate compound were inferior in flame retardancy. Was.
【００６１】さらに、この比較例２と、ポリリン酸メラ
ミン塩化合物を用いた比較例３のものは、熱湿エージン
グ後の電気抵抗が低下した。Further, in Comparative Example 2 and Comparative Example 3 using the melamine polyphosphate compound, the electric resistance after hot and wet aging was reduced.
【００６２】[0062]
【発明の効果】以上説明したように本発明によれば、環
境に対して悪影響を及ぼすことなく、耐熱湿電気特性に
優れ、しかも高い難燃性を有する回路材用の難燃性接着
剤を提供することができる。As described above, according to the present invention, a flame-retardant adhesive for circuit materials having excellent heat-resistance and wet-electric properties and high flame retardancy without adversely affecting the environment is provided. Can be provided.
【図１】本発明に係る回路材であるフラットケーブルの
一例を示す断面図である。FIG. 1 is a sectional view showing an example of a flat cable which is a circuit material according to the present invention.
１ フラットケーブル（回路材） ２ 導体 ３ 被覆材 ４ 被覆材 ５ 難燃性接着剤 Reference Signs List 1 flat cable (circuit material) 2 conductor 3 covering material 4 covering material 5 flame-retardant adhesive
───────────────────────────────────────────────────── フロントページの続き (72)発明者 熊倉 正幸 栃木県鹿沼市さつき町12−３ ソニーケミ カル株式会社第２工場内 Ｆターム(参考） 4J004 AA15 AA17 CA08 CC02 FA05 4J040 ED071 GA27 HD24 KA36 LA08 LA09 NA19 NA20 5G311 CA01 CB01 CC01 CD03 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Masayuki Kumakura 12-3 Satsukicho, Kanuma-shi, Tochigi Sony Chemical Co., Ltd. 2nd factory F-term (reference) 4J004 AA15 AA17 CA08 CC02 FA05 4J040 ED071 GA27 HD24 KA36 LA08 LA09 NA19 NA20 5G311 CA01 CB01 CC01 CD03
Claims (6)
成分とを含有する難燃剤とを含み、 前記飽和ポリエステル樹脂１００重量部に対して前記難
燃剤を９０重量部以上配合してなることを特徴とする難
燃性接着剤。1. A flame retardant comprising a saturated polyester resin, a component containing a PC bond in a molecule, and a component containing a nitrogen in a molecule, wherein the flame retardant contains 100 parts by weight of the saturated polyester resin. A flame-retardant adhesive comprising at least 90 parts by weight of a flame retardant.
対して前記難燃剤を９０重量部以上１２０重量部以下配
合してなることを特徴とする請求項１記載の難燃性接着
剤。2. The flame-retardant adhesive according to claim 1, wherein the flame retardant is blended in an amount of 90 to 120 parts by weight with respect to 100 parts by weight of the saturated polyester resin.
成分と、分子中にリンを有しない酸成分とを含む難燃剤
とを含有することを特徴とする難燃性接着剤。3. A flame retardant containing a saturated polyester resin, a component containing a PC bond in a molecule, a component containing nitrogen in a molecule, and an acid component containing no phosphorus in a molecule. A flame-retardant adhesive characterized by the following.
対して前記難燃剤を８０重量部以上配合してなることを
特徴とする請求項３記載の難燃性接着剤。4. The flame-retardant adhesive according to claim 3, wherein the flame retardant is blended in an amount of 80 parts by weight or more with respect to 100 parts by weight of the saturated polyester resin.
対して前記難燃剤を８０重量部以上１２０重量部以下配
合してなることを特徴とする請求項３又は４のいずれか
１項記載の難燃性接着剤。5. The flame retardant according to claim 3, wherein the flame retardant is blended in an amount of 80 to 120 parts by weight based on 100 parts by weight of the saturated polyester resin. Adhesive.
するための被覆材とを有し、 該被覆材が、請求項１乃至請求項５のいずれか１項記載
の難燃性接着剤を用いて接着されていることを特徴とす
る回路材。6. A flame-retardant material according to claim 1, further comprising a conductor for forming a predetermined circuit, and a covering material for covering the conductor. A circuit material which is adhered using an adhesive.
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34271199A JP3598033B2 (en) | 1999-10-28 | 1999-12-02 | Flame-retardant adhesive and circuit material using the same |
| TW089121286A TW501389B (en) | 1999-10-28 | 2000-10-12 | Flame-retardant adhesion agent and circuit components using same |
| US09/688,151 US6753476B1 (en) | 1999-10-28 | 2000-10-16 | Flame-retardant adhesives and circuit materials with the use of the same |
| MYPI20004859A MY122527A (en) | 1999-10-28 | 2000-10-17 | Flame-retardant adhesive and circuit materials with the use of the same |
| IDP20000903D ID27939A (en) | 1999-10-28 | 2000-10-19 | MATERIALS ADHESIVE ADHESIVE AND CIRCUIT MATERIALS USING THE SAME ADHESIVE MATERIALS |
| EP00122892A EP1095975B1 (en) | 1999-10-28 | 2000-10-20 | Flame-retardant adhesives and circuit materials with the use of the same |
| DE60009229T DE60009229T2 (en) | 1999-10-28 | 2000-10-20 | Flame retardant adhesive materials and electrical materials with their use |
| KR1020000063416A KR100796966B1 (en) | 1999-10-28 | 2000-10-27 | Flame-retardant adhesives and circuit materials with the use of the same |
| CNB001331809A CN1179014C (en) | 1999-10-28 | 2000-10-27 | Fire resistant adhesion agent and circuit components using same |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11-306699 | 1999-10-28 | ||
| JP30669999 | 1999-10-28 | ||
| JP34271199A JP3598033B2 (en) | 1999-10-28 | 1999-12-02 | Flame-retardant adhesive and circuit material using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001192632A true JP2001192632A (en) | 2001-07-17 |
| JP3598033B2 JP3598033B2 (en) | 2004-12-08 |
Family
ID=26564829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34271199A Expired - Fee Related JP3598033B2 (en) | 1999-10-28 | 1999-12-02 | Flame-retardant adhesive and circuit material using the same |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6753476B1 (en) |
| EP (1) | EP1095975B1 (en) |
| JP (1) | JP3598033B2 (en) |
| KR (1) | KR100796966B1 (en) |
| CN (1) | CN1179014C (en) |
| DE (1) | DE60009229T2 (en) |
| ID (1) | ID27939A (en) |
| MY (1) | MY122527A (en) |
| TW (1) | TW501389B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002155210A (en) * | 2000-09-06 | 2002-05-28 | Toyobo Co Ltd | Flame-retardant resin composition and flame-retardant laminate to which the composition is applied or laminated |
| JP2003064339A (en) * | 2001-08-27 | 2003-03-05 | Fujikura Ltd | Adhesive |
| WO2016021409A1 (en) * | 2014-08-04 | 2016-02-11 | 住友電気工業株式会社 | Adhesive composition, insulating film, insulating film production method, and flat cable |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040256139A1 (en) * | 2003-06-19 | 2004-12-23 | Clark William T. | Electrical cable comprising geometrically optimized conductors |
| US20100258344A1 (en) * | 2005-02-09 | 2010-10-14 | Laird Technologies, Inc. | Flame retardant emi shields |
| DE102007036465A1 (en) | 2007-08-01 | 2009-02-05 | Catena Additives Gmbh & Co. Kg | Phosphorus-containing triazine compounds as flame retardants |
| US9200122B2 (en) | 2007-08-01 | 2015-12-01 | J. M. Huber Corporation | Triazine compounds containing phosphorous as flame retardants |
| CN103694922B (en) * | 2013-12-12 | 2015-06-03 | 江阴伟韬塑料新材料有限公司 | Halogen-free flame-retardant hot melt adhesive membrane applied to electronics industry and preparation method of membrane |
| EP2883904A1 (en) * | 2013-12-13 | 2015-06-17 | Nexans | Flame retardant polymeric material |
| US10462928B2 (en) * | 2017-11-24 | 2019-10-29 | Super Micro Computer Inc. | Composite cable assembly and server having the same |
| CN112331856B (en) * | 2020-11-03 | 2022-06-07 | 华东理工大学华昌聚合物有限公司 | Lithium ion battery electrode binder and preparation method and application thereof |
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| JP3438611B2 (en) * | 1998-10-06 | 2003-08-18 | ソニーケミカル株式会社 | Flame retardant adhesive film and flat cable |
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1999
- 1999-12-02 JP JP34271199A patent/JP3598033B2/en not_active Expired - Fee Related
-
2000
- 2000-10-12 TW TW089121286A patent/TW501389B/en not_active IP Right Cessation
- 2000-10-16 US US09/688,151 patent/US6753476B1/en not_active Expired - Lifetime
- 2000-10-17 MY MYPI20004859A patent/MY122527A/en unknown
- 2000-10-19 ID IDP20000903D patent/ID27939A/en unknown
- 2000-10-20 DE DE60009229T patent/DE60009229T2/en not_active Expired - Lifetime
- 2000-10-20 EP EP00122892A patent/EP1095975B1/en not_active Expired - Lifetime
- 2000-10-27 CN CNB001331809A patent/CN1179014C/en not_active Expired - Fee Related
- 2000-10-27 KR KR1020000063416A patent/KR100796966B1/en not_active IP Right Cessation
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002155210A (en) * | 2000-09-06 | 2002-05-28 | Toyobo Co Ltd | Flame-retardant resin composition and flame-retardant laminate to which the composition is applied or laminated |
| JP2003064339A (en) * | 2001-08-27 | 2003-03-05 | Fujikura Ltd | Adhesive |
| WO2016021409A1 (en) * | 2014-08-04 | 2016-02-11 | 住友電気工業株式会社 | Adhesive composition, insulating film, insulating film production method, and flat cable |
| JP2016035033A (en) * | 2014-08-04 | 2016-03-17 | 住友電気工業株式会社 | Adhesive composition, insulation film, method for manufacturing insulation film, and flat cable |
| KR20170041694A (en) * | 2014-08-04 | 2017-04-17 | 스미토모 덴키 고교 가부시키가이샤 | Adhesive composition, insulating film, insulating film production method, and flat cable |
| KR101979516B1 (en) * | 2014-08-04 | 2019-05-16 | 스미토모 덴키 고교 가부시키가이샤 | Adhesive composition, insulating film, insulating film production method, and flat cable |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1095975A2 (en) | 2001-05-02 |
| CN1294165A (en) | 2001-05-09 |
| CN1179014C (en) | 2004-12-08 |
| ID27939A (en) | 2001-05-03 |
| US6753476B1 (en) | 2004-06-22 |
| TW501389B (en) | 2002-09-01 |
| EP1095975B1 (en) | 2004-03-24 |
| KR20010051281A (en) | 2001-06-25 |
| JP3598033B2 (en) | 2004-12-08 |
| DE60009229T2 (en) | 2005-02-24 |
| DE60009229D1 (en) | 2004-04-29 |
| MY122527A (en) | 2006-04-29 |
| EP1095975A3 (en) | 2001-05-09 |
| KR100796966B1 (en) | 2008-01-22 |
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