JP2001185528A - Jig for etching, and apparatus and method for etching - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the destruction of an etched object held by a jig for etching even if the object is dipped in a high temperature etchant when etching the object using the jig for etching which holds the object, so that one surface of the flat etched object may face an airtight space and the other surface may be brought into contact with the etchant. SOLUTION: The jig for etching holds the flat etched object 20 so that one surface 22 may face an airtight space S and the other surface 21 may be brought into contact with an etchant 30. The volume of the airtight space can be changed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an etching jig, an etching apparatus and an etching method used for etching one surface of a flat object to be etched such as a wafer, and more particularly to a flat object to be etched. When performing etching using an etching jig that holds one surface of the object to face the enclosed space and holds the other surface of the object to be etched in contact with the etching solution, It is characterized in that an object is prevented from being destroyed.

[0002]

2. Description of the Related Art Conventionally, when performing etching on one side of a flat plate-shaped object to be etched such as a wafer,
It has been practiced to provide a protective film on a surface of an object to be etched which is not etched.

However, when a protective film is provided on the surface of the object to be etched which is not etched, it is necessary to select an appropriate material which is not eroded by an etchant. There are also problems such as damage, pinholes and the like being formed when the protective film is formed, and the etchant contacting a part of the surface not to be etched.

For this reason, in recent years, FIG.
As shown in (B), a circular recess 2a is provided in the receiving table 2, an O-ring 3 is attached around the circular recess 2a, and the surface 4a of the workpiece 4 to be etched is opposite to the surface 4a. The object to be etched 4 is placed on the O-ring 3 so that the surface 4b faces the recess 2a. The pressing member 6 is placed, and the pressing member 6 and the receiving table 2 are fixed with screws 7 so that the peripheral portion of the object 4 to be etched is sandwiched between the O-rings 3 and 5. Tool 1 came to be used.

Then, the etching jig 1 holding the object 4 to be etched is immersed in an etching tank 8 containing an etching solution 8a as shown in FIG. The etching solution 8a is brought into contact with only the surface 4a of the object 4 to be etched through the pressing member 6 to etch only one surface 4a of the object 4 to be etched.

In recent years, in order to shorten the etching time, a heating device 8b such as a heater is provided at the bottom of the etching tank 8 as shown in FIG. The temperature of the etching solution 8a has been increased.

However, when the etching jig 1 holding the object 4 to be etched as described above is immersed in the etching solution 8a having a high liquid temperature, the object 4 and the O-ring 3 A gas, such as air, in the closed space s formed by the recess 2a expands and pushes the object 4 to be etched, thereby causing a problem that the object 4 is destroyed.

For this reason, as shown in JP-A-11-191551, in the etching jig 1 shown in FIGS. 1A and 1B, the object 4 to be etched, the O-ring 3, Space s formed by the location 2a
Is filled with a substance having a low coefficient of thermal expansion such as a liquid other than a gas, and when the substance is immersed in the etching solution 8a having a high liquid temperature, the filling in the closed space s is suppressed from expanding. In order to prevent the object to be etched 4 from being destroyed, a method has been proposed.

However, the object 4 to be etched and the O
It is troublesome to fill the sealed space s formed by the ring 3 and the recess 2a with a filler such as a liquid, and in order to properly fill the filled space into the sealed space s, an etching treatment is required. There was a problem that the structure of the tool 1 was complicated and the cost was high.

Also, as a filling material such as a liquid to be filled in the closed space s, it does not affect the surface 4b of the object 4 to be etched which is not etched, and is immersed in the etching solution 8a having a high temperature. There is a troublesome problem such as selecting a material that does not boil when used.

[0011]

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problem in etching one surface of a flat object to be etched such as a wafer. When performing etching using an etching jig that holds one surface of the etched object so as to face the enclosed space and holds the other surface of the object to be etched in contact with the etchant, the liquid temperature is reduced. Even when immersed in a raised etching solution, the object to be etched held by the etching jig is prevented from being broken, and one side of the flat object to be etched can be easily etched. The task is to make

[0012]

In order to solve the above-mentioned problems, the etching jig of the present invention holds one side of a flat object to be etched so as to face a closed space, In the etching jig for holding the other surface of the object to be etched so as to be in contact with the etchant, the volume of the closed space can be changed.

Here, in order to change the volume of the closed space in the etching jig as described above, a flexible film is provided in a portion where the closed space is formed. Etc. can be used.
Here, as the flexible film used for the portion forming the closed space, a film made of a material that is not attacked by the etchant is used, and for example, according to the type of the etchant, for example, a polyfluoroethylene-based resin is used. Or a material composed of polyimide resin or the like.

In the etching apparatus according to the present invention, the etching jig according to the present invention for holding an object to be etched and an etching solution containing an etching solution for immersing the etching jig holding the object to be etched are provided. A tank was used.

Further, in the etching method according to the present invention, the object to be etched is held by the above-mentioned etching jig of the present invention, and the etching jig is immersed in an etching solution contained in an etching tank. It was done.

Then, by using the above-described etching jig of the present invention and holding the object to be etched in the etching jig and immersing the object in an etching solution contained in an etching tank, the object to be etched is obtained. In this case, only the surface to be etched which does not face the closed space comes into contact with the etching solution, so that only one surface of the object to be etched is etched.

In performing etching while holding the object to be etched on the etching jig in this manner, the present invention allows the volume of the closed space in the etching jig to be changed. When performing etching by immersing in a high-etching solution, even if the gas or the like in the closed space expands, the volume of the closed space becomes large and the pressure in the closed space is prevented from increasing. This prevents the object to be etched from being destroyed.

[0018]

Embodiments of the present invention will be specifically described below with reference to the accompanying drawings.

In the etching jig 10 according to the embodiment of the present invention, as shown in FIGS. 3 and 4, an O-ring 12 is provided on a receiving base 11 provided with a through hole 11a at the center. The disk-shaped object to be etched 20 is placed on the O-ring 12 with the surface 21 to be etched facing up, and the ring-shaped holding member 13 is arranged on the object to be etched 20. This holding member 13
An upper lid 14 having an opening at the center is disposed on the upper lid 1.
4 is mounted on the outer periphery of the receiving table 11, and the peripheral portion of the above-described etching target 20 is sandwiched between the O-ring 12 and the pressing member 13. Here, when the peripheral portion of the object to be etched 20 is sandwiched between the O-ring 12 and the pressing member 13 in this manner, compared to the case where the peripheral portion of the object to be etched 20 is sandwiched between the O-rings, The area in contact with the pressing member 13 is increased, so that the stress in the peripheral portion of the etching target 20 is relaxed, and the damage of the peripheral portion of the etching target 20 is suppressed.

Further, under the above-mentioned cradle 11,
A Teflon film 15 is disposed as a flexible film 15, and a ring-shaped pressing member 16 is provided below the Teflon film 15. The Teflon film 15 is disposed between the pressing member 16 and the support 11. While holding and holding the peripheral part,
A lower lid 17 having a center opened below the pressing member 16.
And the lower lid 17 is attached to the outer periphery of the receiving stand 11.

In this manner, the surface 22 of the above-mentioned object 20 to be etched which is not etched and the O-ring 1
2, the pedestal 11 and the Teflon film 15 to form a closed space S
Is formed.

Next, in etching the workpiece 20 held by the etching jig 10 as described above, as shown in FIG. 6, a heater or the like provided at the bottom of the etching bath 30 is used. The etching solution 31 contained in the etching bath 30 is heated by the device 32, and the etching jig 10 holding the object 20 to be etched in the heated etching solution 31 as described above is used as a cord material. As shown in FIG. 7, a mounting table 34 is provided in an etching tank 30 in which an etching solution 31 is accommodated, and the etching object 20 is held on the mounting table 34. The etching jig 10 is placed in such a manner that the etching jig 10 is immersed in an etching solution 31.

Here, as described above, the etching target 20
Is immersed in the etching solution 31, the etching solution 31 comes into contact with the surface 21 of the object 20 to be etched.
The etching liquid 31 does not come into contact with the surface 22 of the etching target 20 on which the etching is not performed, and only the etching surface 21 of the etching target 20 is etched.

Here, the object to be etched 20 is
Is immersed in the etching solution 31, the Teflon film 15 is pushed toward the workpiece 20 by the pressure of the etching solution 31, and the Teflon film 15 is Surface 22 that is suppressed by
The surface 22 of the etching target 20 on which the etching is not performed is prevented from being stained, and the etching target 20 is prevented from being cracked by being pushed by the Teflon film 15.

Further, while the etching jig 10 holding the object 20 to be etched is immersed in the heated etching solution 31, gas such as air in the closed space S is heated. Even if the gas expands, the gas pushes the Teflon film 15 to increase the volume of the sealed space S, thereby preventing the pressure in the sealed space S from increasing, and the etching target 20 is broken by the gas pressure. Is prevented.

In this embodiment, a gas such as air is stored in the closed space S in the etching jig 10, but it is also possible to store a liquid or the like.

[0027]

As described above in detail, according to the present invention, when a flat object to be etched is held by an etching jig and etching is performed, one surface of the flat object to be etched faces the closed space. While holding
The other surface of the object to be etched is held in contact with the etchant so that the volume of the closed space can be changed, so that only one surface of the object to be etched can be etched, and etching at a high liquid temperature can be performed. In the case of performing etching by immersing in a liquid, even if gas or the like in the closed space expands, the volume of the closed space is increased and the pressure in the closed space is suppressed from increasing, and the object to be etched is suppressed. Is prevented from being destroyed.

As a result, according to the present invention, only one side of the object to be etched can be efficiently etched without destroying the object to be etched.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view and a cross-sectional explanatory view showing a state in which an object to be etched is held by a conventional etching jig.

FIG. 2 is a schematic explanatory view showing a state in which etching is performed while an object to be etched is held by a conventional etching jig.

FIG. 3 is a schematic explanatory view showing a state in which an object to be etched is attached to an etching jig in the embodiment of the present invention.

FIG. 4 is an explanatory cross-sectional view showing a state where an object to be etched is attached to an etching jig in the embodiment.

FIG. 5 is a schematic explanatory view showing a state in which an etching jig holding an object to be etched is suspended by a string material and immersed in an etching solution in the embodiment.

FIG. 6 is a schematic view showing a state in which an etching jig holding an object to be etched is mounted on a mounting table provided in an etching tank containing an etching liquid and etching is performed in the embodiment; FIG.

[Explanation of symbols]

 Reference Signs List 10 Jig for etching 15 Flexible film (Teflon film) 20 Object to be etched 21 Surface to be etched 22 Surface not to be etched 30 Etching tank 31 Etching solution S Closed space

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yasuhisa Fujii 2-3-13 Azuchicho, Chuo-ku, Osaka-shi Osaka International Building Minolta Co., Ltd. F term (reference) 5F031 CA02 DA13 HA72 MA24 5F043 EE15 EE21 EE35 EE40

Claims (4)

[Claims] 1. An etching jig for holding one side of a flat object to be etched facing an enclosed space and holding the other side of the object to be etched in contact with an etching solution. An etching jig characterized in that the volume of the closed space can be changed. 2. The etching jig according to claim 1, wherein a flexible film is provided on a portion forming the closed space in order to change the volume of the closed space. Jig. 3. An etching jig according to claim 1 for holding an object to be etched, and an etching tank containing an etching solution for immersing the etching jig holding the object to be etched. An etching apparatus characterized by the above-mentioned. 4. An etching method comprising: holding an object to be etched by the etching jig according to claim 1; and immersing the etching jig in an etching solution contained in an etching tank. .