JP2001177027A - Heat dissipating structure of electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable an electronic part fixed on a heat dissipating plate to be enhanced in heat dissipating effect and to protect the soldered part of the electronic part against cracking. SOLUTION: A heat dissipating plate 2 is composed of a heat dissipating plate body 2a which is nearly M-shaped in cross section and composed of a center bent part 2d and two shoulder bent parts 2e, a first flat plate 2b and a second flat plate 2c which are provided integrally to the edges of the heat dissipating plate body 2a, and a pair of mounting legs 2f and 2h which are provided to the lower edges of the flat plates 2b and 2c. The heat dissipating plate 2 is mounted on the printed board 1 with the mounting legs 2f and 2h making the center bent part 2d and the two shoulder bent parts 2e nearly parallel with the printed board 1 and the flat plates 2b and 2c nearly vertical to the printed board 1, and electronic parts 3 and 4 are fixed on the first flat plate 2b and/or the second flat plate 2c.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiation structure for electronic components mounted on a printed circuit board.

[0002]

2. Description of the Related Art FIG. 5 is a perspective view for explaining a state in which a heat radiating plate having a heat radiating structure for a conventional electronic component and an electronic component are mounted on a printed circuit board. Hereinafter, a conventional technique will be described with reference to FIG.

[0005] A circuit pattern (not shown) is formed on the printed board 11, and electronic components 13 that generate heat during operation are mounted on the printed board 11 and connected (soldered) to the circuit pattern. . The printed circuit board 11 has a heat sink 1 near the electronic component 13.
2 are provided with a plurality of mounting holes (not shown).

The heat radiating plate 12 is formed of, for example, aluminum having excellent thermal conductivity, and has a substantially rectangular heat radiating plate main body 12a and the heat radiating plate main body 12a near both ends of one side thereof with respect to the heat radiating plate main body 12a. It comprises a pair of mounting legs 12b provided substantially vertically. Also, the heat sink 12 is attached to the mounting board 12b by the printed circuit board 11.
Is provided with a mounting hole 12c.

The heat radiating plate 12 is attached to the printed board 11 with, for example, mounting screws (not shown) in a state where a plurality of mounting holes (not shown) provided in the printed board 11 and the mounting holes 12c are aligned. ) Is installed almost vertically. An electronic component 13 that generates heat during operation is fixed to the heat sink body 12a.

Thus, the electronic component 13 is connected to the heat sink 1
By directly fixing the electronic component 2, heat generated from the electronic component 13 during operation is transmitted to the heat radiating plate 12, and the heat is radiated to the outside from the heat radiating plate 12, whereby a rise in the temperature of the electronic component 13 can be suppressed.

FIG. 6 is a perspective view for explaining a state in which a heat radiating plate and an electronic component of another conventional electronic component heat radiating structure are mounted on a printed circuit board. Hereinafter, another conventional technique will be described with reference to FIG.

FIG. 6 shows another conventional heat radiating structure for an electronic component, as compared with FIG. 5 described above, in which a printed circuit board 11 is provided at the end opposite to the pair of mounting legs 12b of the heat radiating plate main body 12a.
The flat plate portion 12d is provided integrally with the electronic component, and the heat radiating structure of the electronic component other than the flat plate portion 12d is the same as that of FIG. 5, and the same reference numerals as in FIG.

That is, the heat radiating plate 12 has a heat radiating plate main body 12a and a flat plate portion 12d provided integrally with each other, and is formed so that its cross section is substantially L-shaped.
Even if the height of the mounted component on the first device is limited to a low level, the heat dissipation structure is easy to secure a heat dissipation area.

[0010]

In the heat dissipation structure of the conventional electronic component shown in FIG. 5, when the electronic component 13 mounted on the printed circuit board 11 generates a large amount of heat during operation, the heat dissipation area of the heat dissipation plate 12 is increased. It is necessary to increase the number of radiators to make it easier to radiate heat from the radiator plate 12 to the outside. However, when the mounting height on the printed circuit board 11 is restricted,
Since the required height of 2a cannot be secured, the heat radiation area is insufficient, and the heat generated from the electronic component 13 during operation cannot be sufficiently radiated to the outside from the radiator plate 12, so that the temperature of the electronic component 13 rises. There is a problem that the electronic component 13 may be deteriorated and its life may be shortened.

In another conventional heat dissipation structure for an electronic component shown in FIG. 6, the heat dissipation plate 12 has a heat dissipation plate main body 12a and a flat plate portion 12d provided integrally with each other.
Even when the mounting height on the top 1 is limited, the heat radiation area can be increased by the portion having the flat plate portion 12d as compared with the heat radiation structure of the electronic component of the conventional example of FIG. However, heat sink 1
2 is a pair of mounting legs 1 provided at both ends of one side of the heat sink body 12a substantially perpendicular to the heat sink body 12a.
2b is attached to the printed circuit board 11 only. Therefore, when an external force is applied to the flat plate portion 12d on the side remote from the radiator plate body 12a, the mounting leg portion 12b or the radiator plate body 12
A stress is applied to the circuit pattern connection (soldering) between the electronic component 13 and the printed circuit board 11 fixed to a, causing cracks in the printed circuit board 11 or connecting the circuit pattern between the electronic component 13 and the printed circuit board 11 (soldering). There is a problem that a crack may occur in the portion.

[0012]

According to the present invention, there is provided a heat radiating structure for an electronic component, comprising: an electronic component mounted on a printed board; and a radiating plate attached to the printed board along the electronic component. In the heat radiating structure of an electronic component in which an electronic component is fixed to the heat radiating plate, the heat radiating plate is bent into a substantially M-shaped cross section at a center bent portion and both shoulder bent portions, and the heat radiating plate has the center bent portion. A plate body, and a first flat plate portion and a second flat plate portion formed integrally with the heat sink body at both end sides of the heat sink body, and the first flat plate portion and the second flat plate portion respectively. A pair of mounting legs are provided near both ends of the lower end of the radiator, and the radiator plate is mounted on the printed circuit board by the mounting legs.

Further, in the heat dissipation plate of the electronic component heat dissipation structure of the present invention, the center bent portion and the shoulder bent portions are substantially parallel to the printed circuit board, and the first flat plate portion and the second flat plate portion are connected to each other. Attached to the printed circuit board such that the flat plate portion is substantially perpendicular to the printed circuit board,
The electronic component is fixed to one of the first flat plate portion and the second flat plate portion, or to both the first flat plate portion and the second flat plate portion.

Further, the heat radiating plate of the heat radiating structure for an electronic component according to the present invention is characterized in that a plurality of heat radiating holes are provided at or near the both shoulder bent portions.

Further, the heat radiating plate of the heat radiating structure for an electronic component according to the present invention is characterized in that a plurality of heat radiating holes are provided in or near the central bent portion.

In the heat radiating plate of the electronic component heat radiating structure of the present invention, the center bent portion and the shoulder bent portions are substantially perpendicular to the printed circuit board, and the first flat plate portion and the second flat plate portion are connected to each other. Attached to the printed circuit board such that the flat plate portion is substantially perpendicular to the printed circuit board,
The electronic component is fixed to one of the first flat plate portion and the second flat plate portion, or to both the first flat plate portion and the second flat plate portion.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] FIG. 1 shows a state in which a heat radiating plate and an electronic component of a heat radiating structure for an electronic component according to a first embodiment of the present invention are mounted on a printed circuit board. FIG. 1A is a perspective view, and FIG.
(B) is a side view.

Referring to FIG. 1, the heat dissipation structure of the electronic component of the present invention will be described below. A circuit pattern (not shown) is formed on the printed board 1, and electronic components 3 and 4 that generate heat during operation are mounted on the printed board 1 and connected (soldered) to the circuit pattern. I have. The printed circuit board 1 includes the electronic component 3.
In addition, a plurality of mounting holes (not shown) for mounting the heat sink 2 are provided near the electronic component 4.

The heat radiating plate 2 is formed of, for example, aluminum or the like having excellent thermal conductivity, and is bent into a substantially M-shaped cross section by a center bent portion 2d and both shoulder bent portions 2e. Heat sink body 2 having
a and the radiator plate main body 2a at both ends of the radiator plate main body 2a.
The first flat plate portion 2b and the second flat plate portion 2c are formed integrally with the first heat sink plate body 2a. One side of each of the first flat plate portion 2b and the second flat plate portion 2c is It is shared by both shoulder bent portions 2e.

A pair of mounting legs 2f are provided in the vicinity of both ends of the lower end of the first flat plate 2b, substantially perpendicular to the first flat plate 2b. An attachment hole 2g for attaching the heat sink 2 to the printed circuit board 1 is provided. A pair of mounting legs 2h are provided near both ends of the lower end of the second flat plate 2c, substantially perpendicular to the second flat plate 2c. An attachment hole 2i for attachment to the printed circuit board 1 is provided.

The radiator plate 2 includes a plurality of mounting holes (not shown) provided in the printed circuit board 1 and the mounting holes 2.
g, 2i, the center bent portion 2d and the shoulder bent portions 2e are substantially parallel to the printed circuit board 1, and the first flat plate portion 2b and the second flat plate portion 2c are aligned. The mounting screws 5 are attached so as to be substantially perpendicular to the printed circuit board 1. An electronic component 3 that generates heat during operation is fixed to the first flat plate portion 2b of the heat sink 2, and an electronic component 4 that generates heat during operation is fixed to the second flat plate portion 2c.

In this manner, the electronic component 3 is directly fixed to the first flat plate portion 2b of the heat sink 2, and the electronic component 4 is
Of the electronic component 3 and the electronic component 4 during operation, the heat generated by the
By transmitting the heat to the whole and radiating the heat to the outside from the radiator plate 2, the temperature rise of the electronic components 3 and 4 can be suppressed.

In this embodiment, an example is shown in which the electronic component 3 is directly fixed to the first flat plate portion 2b of the heat sink 2, and the electronic component 4 is directly fixed to the second flat plate portion 2c of the heat sink 2. However, only the electronic component 3 is the first flat plate portion 2 of the heat sink 2.
b, and the electronic component 4 may not be fixed to the second flat plate portion 2c of the heat sink 2. Alternatively, only the electronic component 4 may be directly fixed to the second flat plate portion 2c of the heat sink 2, and the electronic component 3 may not be fixed to the first flat plate portion 2b of the heat sink 2.

In this embodiment, the electronic component 3 and the electronic component 4 are fixed to the outer surfaces of the first flat plate portion 2b and the second flat plate portion 2c of the heat sink 2, respectively. The electronic component 4 may be fixed to the inner surfaces of the first flat plate portion 2b and the second flat plate portion 2c of the heat sink 2, respectively.

In this embodiment, the heat sink body 2a of the heat sink 2 is provided with one central bent portion 2d having a substantially M-shaped cross section. However, the present invention is not limited to this. A plurality may be provided.

In this embodiment, the first flat plate portion 2b
A pair of mounting legs 2f are provided near both ends of the lower end, and a pair of mounting legs 2h are provided near both ends of the lower end of the second flat plate portion 2c. Legs may be provided.

In the heat radiation structure for an electronic component having the above-described structure, the heat radiation plate 2 is bent into a substantially M-shaped cross section at the center bent portion 2d and the shoulder bent portions 2e. Therefore, by radiating the heat radiating plate body 2a at the central bent portion 2d, the heat radiating area can be increased as compared with the state of a flat plate having no bent portion.

That is, the flat plate portion 12d formed so as to be substantially parallel to the printed board 11 in the heat dissipation structure of the conventional electronic component shown in FIG. 6 and the heat dissipation structure of the electronic component of the present invention shown in FIG. Compared to the heat radiating plate body 2a formed so as to be substantially parallel to the printed circuit board 1, the latter heat radiating plate body 2a is bent at the center bent portion 2d to form the former flat plate portion 12d having no bent portion. In comparison, the heat radiation area can be increased, and the heat radiation effect of the electronic component 3 and the electronic component 4 can be improved.

The radiating plate 2 includes a pair of mounting legs 2f provided near both ends of the lower end of the first flat plate portion 2b,
Are fixed to the printed circuit board 1 at four points by a pair of mounting legs 2h provided near both ends of the lower end of the flat plate portion 2c. Therefore, even when an external force is applied to the heat sink 2,
The printed circuit board 1 is hardly cracked.
The electronic component 3 and the electronic component 4 fixed to the flat plate portion 2b and the second flat plate portion 2c and the circuit pattern connection (soldering) portion of the printed circuit board 1 can be made less likely to crack.

The first flat plate portion 2b and the second flat plate portion 2c support the radiator body 2a from both sides so as to be substantially parallel to the printed circuit board 1, and the electronic component 3 and the electronic component 3a. The electronic part 3 also serves as a fixing part of the part 4.
Further, the electronic component 4 can be fixed to both sides of the heat sink body 2a. Therefore, compared to the case where the electronic component 13 only on one side of the flat plate portion 12d formed so as to be substantially parallel to the printed circuit board 11 in the other conventional heat dissipation structure of the electronic component in FIG. A large number of electronic components can be fixed to the heat sink in a small space,
The heat radiation structure of the electronic component can be made compact.

[Second Embodiment] FIG. 2 is a view for explaining a state in which a heat radiating plate and an electronic component of a heat radiating structure for an electronic component according to a second embodiment of the present invention are mounted on a printed circuit board. FIG. 2A is a perspective view, and FIG. 2B is a side view.

The heat radiating structure of the electronic component of the present invention will be described below with reference to FIG. The heat dissipating structure of the electronic component of FIG. 2 is different from the heat dissipating structure of the electronic component according to the first embodiment of FIG.
And a radiating plate main body 2a having the center bent portion 2d and a first flat plate portion formed integrally with the radiating plate main body 2a at both ends of the radiating plate main body 2a. 2b and the second flat plate portion 2c, the radiator plate 2 is provided at or near the both shoulder bent portions 2e.
The only difference is that a plurality of heat radiation holes 2j are provided. The heat radiating structure of the electronic component except that a plurality of heat radiating holes 2j are provided is as follows.
The same parts as those in FIG. 1 are denoted by the same reference numerals as those in FIG.

In this embodiment, an example is shown in which the electronic component 3 is directly fixed to the first flat plate portion 2b of the heat sink 2, and the electronic component 4 is directly fixed to the second flat plate portion 2c of the heat sink 2. However, only the electronic component 3 is the first flat plate portion 2 of the heat sink 2.
b, and the electronic component 4 may not be fixed to the second flat plate portion 2c of the heat sink 2. Alternatively, only the electronic component 4 may be directly fixed to the second flat plate portion 2c of the heat sink 2, and the electronic component 3 may not be fixed to the first flat plate portion 2b of the heat sink 2.

In this embodiment, the electronic component 3 and the electronic component 4 are fixed to the outer surfaces of the first flat plate portion 2b and the second flat plate portion 2c of the heat sink 2, respectively. The electronic component 4 may be fixed to the inner surfaces of the first flat plate portion 2b and the second flat plate portion 2c of the heat sink 2, respectively.

Further, in this embodiment, a plurality of rectangular heat radiation holes 2j are provided in the heat radiation plate 2 at or near the both shoulder bent portions 2e, but the present invention is not limited to this. It may be elliptical or the like.

In the heat radiating structure for an electronic component thus constructed, the heat radiating plate body 2a having the center bent portion 2d and the both shoulder bent portions 2e is bent into a substantially M-shaped cross section. And a radiator plate 2 composed of a first flat plate portion 2b and a second flat plate portion 2c formed integrally with the radiator plate main body 2a at both ends of the radiator plate main body 2a. By providing a plurality of heat radiating holes 2j in or near the shoulder bent portion 2e which is the highest position, the air heated by the heat generated inside the heat radiating plate 2 rises and the inside of the heat radiating plate 2 In this case, the air escapes to the outside of the heat radiating plate 2 from the heat radiating hole 2j at the highest position, so that the air permeability inside the heat radiating plate 2 can be improved.

As a result, the heat radiation effect of the electronic component 3 and the electronic component 4 can be improved, and when the electronic component 6 mounted on the printed circuit board 1 located inside the heat sink 2 is provided, Without impairing the heat dissipation of
The surrounding temperature rise can be suppressed.

[Third Embodiment] FIG. 3 is a view for explaining a state in which a heat radiating plate and an electronic component of a heat radiating structure for an electronic component according to a third embodiment of the present invention are mounted on a printed circuit board. FIG. 3A is a perspective view, and FIG. 3B is a side view.

The heat radiating structure of the electronic component of the present invention will be described below with reference to FIG. The heat dissipating structure of the electronic component of FIG. 3 is different from the heat dissipating structure of the electronic component according to the first embodiment of FIG.
And a radiating plate main body 2a having the center bent portion 2d and a first flat plate portion formed integrally with the radiating plate main body 2a at both ends of the radiating plate main body 2a. 2b and the second flat plate portion 2c, the heat sink 2 is provided at or near the center bent portion 2d.
The only difference is that a plurality of heat radiation holes 2k are provided. The heat radiating structure of the electronic component except that a plurality of heat radiating holes 2k are provided is as follows.
The same parts as those in FIG. 1 are denoted by the same reference numerals as those in FIG.

In this embodiment, an example is shown in which the electronic component 3 is directly fixed to the first flat plate portion 2b of the heat sink 2, and the electronic component 4 is directly fixed to the second flat plate portion 2c of the heat sink 2. However, only the electronic component 3 is the first flat plate portion 2 of the heat sink 2.
b, and the electronic component 4 may not be fixed to the second flat plate portion 2c of the heat sink 2. Alternatively, only the electronic component 4 may be directly fixed to the second flat plate portion 2c of the heat sink 2, and the electronic component 3 may not be fixed to the first flat plate portion 2b of the heat sink 2.

In the present embodiment, the electronic component 3 and the electronic component 4 are fixed to the outer surfaces of the first flat plate portion 2b and the second flat plate portion 2c of the heat sink 2, respectively. The electronic component 4 may be fixed to the inner surfaces of the first flat plate portion 2b and the second flat plate portion 2c of the heat sink 2, respectively.

In the present embodiment, a plurality of rectangular heat dissipation holes 2k are provided in or near the center bent portion 2d of the heat dissipation plate 2, but the invention is not limited to this. It may be circular or the like.

In the heat dissipating structure of the electronic component thus constructed, the heat dissipating plate body 2a having the central bent portion 2d and the shoulder bent portions 2e is bent into a substantially M-shaped cross section. And a radiator plate 2 composed of a first flat plate portion 2b and a second flat plate portion 2c formed integrally with the radiator plate main body 2a at both ends of the radiator plate main body 2a. However, the first electronic component 3 is fixed by providing a plurality of heat radiation holes 2k at or near the central bent portion 2d which is the position farthest from each position fixed to the heat radiating plate 2. And the second part to which the electronic component 4 is fixed.
The flat plate portion 2c and the heat radiating plate main body 2a are continuously connected at both shoulder bent portions 2e, so that the heat generated from the electronic components 3 and 4 is transferred to the first flat plate portion 2b and the second It facilitates transmission from the flat plate portion 2c to the heat sink body 2a, and
The air heated by the heat generated inside the heat radiating plate 2 rises and escapes to the outside of the heat radiating plate 2 through the heat radiating hole 2k, so that the air permeability inside the heat radiating plate 2 can be improved.

As a result, the heat radiation effect of the electronic component 3 and the electronic component 4 can be improved, and when the electronic component 6 mounted on the printed circuit board 1 located inside the heat sink 2 is provided, Without impairing the heat dissipation of
The surrounding temperature rise can be suppressed.

[Fourth Embodiment] FIG. 4 is a perspective view illustrating a state in which a heat radiating plate and an electronic component of a heat radiating structure for an electronic component according to a fourth embodiment of the present invention are mounted on a printed circuit board. It is.

Referring to FIG. 4, the heat dissipation structure of the electronic component according to the present invention will be described below. A circuit pattern (not shown) is formed on the printed board 1, and electronic components 3 and 4 that generate heat during operation are mounted on the printed board 1 and connected (soldered) to the circuit pattern. I have. The printed circuit board 1 includes the electronic component 3.
In addition, a plurality of mounting holes (not shown) for mounting the heat sink 2 are provided near the electronic component 4.

The heat radiating plate 2 is formed of, for example, aluminum and the like having excellent thermal conductivity, and is bent into a substantially M-shaped cross section at the center bent portion 2d and the shoulder bent portions 2e. Heat sink body 2 having
a and the radiator plate main body 2a at both ends of the radiator plate main body 2a.
The first flat plate portion 2b and the second flat plate portion 2c are formed integrally with the first heat sink plate body 2a. One side of each of the first flat plate portion 2b and the second flat plate portion 2c is It is shared by both shoulder bent portions 2e.

A pair of mounting legs 2f are provided in the vicinity of both ends of the lower end of the first flat plate portion 2b, substantially perpendicular to the first flat plate portion 2b. An attachment hole 2g for attaching the heat sink 2 to the printed circuit board 1 is provided. A pair of mounting legs 2h are provided near both ends of the lower end of the second flat plate 2c, substantially perpendicular to the second flat plate 2c. An attachment hole 2i for attachment to the printed circuit board 1 is provided.

The radiator plate 2 is provided with a plurality of mounting holes (not shown) provided in the printed circuit board 1 and the mounting holes 2.
g, 2i, the center bent portion 2d and the shoulder bent portions 2e are substantially perpendicular to the printed circuit board 1, and the first flat plate portion 2b, the second flat plate portion 2c, Are mounted with mounting screws (not shown) so as to be substantially perpendicular to the printed circuit board 1. An electronic component 3 that generates heat during operation is fixed to the first flat plate portion 2b of the heat sink 2, and an electronic component 4 that generates heat during operation is fixed to the second flat plate portion 2c.

In this way, the electronic component 3 is directly fixed to the first flat plate portion 2b of the heat sink 2, and the electronic component 4 is
Of the electronic component 3 and the electronic component 4 during operation, the heat generated by the
By transmitting the heat to the whole and radiating the heat to the outside from the radiator plate 2, the temperature rise of the electronic components 3 and 4 can be suppressed.

In this embodiment, an example is shown in which the electronic component 3 is directly fixed to the first flat plate portion 2b of the heat sink 2, and the electronic component 4 is directly fixed to the second flat plate portion 2c of the heat sink 2. However, only the electronic component 3 is the first flat plate portion 2 of the heat sink 2.
b, and the electronic component 4 may not be fixed to the second flat plate portion 2c of the heat sink 2. Alternatively, only the electronic component 4 may be directly fixed to the second flat plate portion 2c of the heat sink 2, and the electronic component 3 may not be fixed to the first flat plate portion 2b of the heat sink 2.

In this embodiment, the electronic component 3 and the electronic component 4 are fixed to the outer surfaces of the first flat plate portion 2b and the second flat plate portion 2c of the heat sink 2, respectively. The electronic component 4 may be fixed to the inner surfaces of the first flat plate portion 2b and the second flat plate portion 2c of the heat sink 2, respectively.

In this embodiment, the heat sink body 2a of the heat sink 2 is provided with one central bent portion 2d having a substantially M-shaped cross section. However, the present invention is not limited to this. A plurality may be provided.

In this embodiment, the first flat plate portion 2b
A pair of mounting legs 2f are provided near both ends of the lower end, and a pair of mounting legs 2h are provided near both ends of the lower end of the second flat plate portion 2c. Legs may be provided.

In the heat radiating structure of the electronic component thus configured, the heat radiating plate 2 is bent into a substantially M-shaped cross section at the center bent portion 2d and the shoulder bent portions 2e. Therefore, by radiating the heat radiating plate body 2a at the central bent portion 2d, the heat radiating area can be increased as compared with the state of a flat plate having no bent portion, and the heat radiating effect of the electronic components 3 and 4 can be improved. it can.

The radiator plate 2 includes a pair of mounting legs 2f provided near both ends of the lower end of the first flat plate portion 2b,
Are fixed to the printed circuit board 1 at four points by a pair of mounting legs 2h provided near both ends of the lower end of the flat plate portion 2c. Therefore, even when an external force is applied to the heat sink 2,
The printed circuit board 1 is hardly cracked.
The electronic component 3 and the electronic component 4 fixed to the flat plate portion 2b and the second flat plate portion 2c and the circuit pattern connection (soldering) portion of the printed circuit board 1 can be made less likely to crack.

Further, the first flat plate portion 2b and the second flat plate portion 2c support the heat sink main body 2a from both sides so as to be substantially perpendicular to the printed circuit board 1, and the electronic component 3 and the electronic The electronic part 3 also serves as a fixing part of the part 4.
Further, the electronic component 4 can be fixed to both sides of the heat sink body 2a. Therefore, compared to the case where the electronic component 13 only on one side of the flat plate portion 12d formed so as to be substantially parallel to the printed circuit board 11 in the other conventional heat dissipation structure of the electronic component in FIG. A large number of electronic components can be fixed to the heat sink in a small space,
The heat radiation structure of the electronic component can be made compact.

[0058]

According to the heat dissipation structure for electronic parts of the present invention,
An electronic component mounted on a printed board, and a heat sink attached to the printed board along the electronic component, wherein the electronic component is fixed to the heat sink. The plate is bent into a substantially M-shaped cross section at a central bent portion and both shoulder bent portions, and a heat sink main body having the central bent portion, and the heat sink main body integrally formed on both end sides of the heat sink main body. The first flat plate and the second flat plate are formed. A pair of mounting legs are provided near both ends of lower ends of the first flat plate and the second flat plate. It is characterized by being attached to the printed circuit board by an attachment leg.

Therefore, in the heat radiating structure of the electronic component thus configured, the heat radiating plate is formed by bending the heat radiating plate into a substantially M-shaped cross section at the center bent portion and the both shoulder bent portions. By bending at the bent portion, the heat radiation area can be increased as compared with the state of a flat plate without the bent portion, and the heat radiation effect of the electronic component fixed to the heat radiation plate can be improved.

According to the heat radiating structure for an electronic component of the present invention, the heat radiating plate has the central bent portion and the both shoulder bent portions substantially parallel to the printed circuit board, and the first flat plate portion and the first flat plate portion. The electronic component is attached to the first flat plate portion or the second flat plate portion so that the second flat plate portion is substantially perpendicular to the printed board.
One of the flat portions, or the first flat portion and the second flat portion.
Are fixed to both of the flat plate portions.

Therefore, in the heat radiating structure for an electronic component thus configured, the heat radiating plate is formed by bending the heat radiating plate into a substantially M-shaped cross section at the center bent portion and the both shoulder bent portions. By bending at the bent portion, the heat radiation area can be increased as compared with the state of a flat plate without the bent portion, and the heat radiation effect of the electronic component fixed to the heat radiation plate can be improved.

The radiator plate includes a pair of mounting legs provided near both ends of the lower end of the first flat plate portion and a pair of mounting legs provided near both ends of the lower end of the second flat plate portion.
By being fixed to the printed circuit board at four points, even when an external force is applied to the heat sink, the printed circuit board is unlikely to crack, and further fixed to the first flat plate section and the second flat plate section. It is possible to make it difficult for cracks to occur in the circuit pattern connection (soldering) portion of the printed electronic component and the printed circuit board.

Further, the first flat plate portion and the second flat plate portion are
The heat sink body is supported from both sides so as to be substantially parallel to the printed circuit board, and also serves as a fixing part for electronic components.By fixing the electronic components to both sides of the heat sink body, a large number of The electronic component can be fixed to the heat radiating plate in a small space, and the heat radiating structure of the electronic component can be made compact.

Further, according to the heat radiating structure for an electronic component of the present invention, the heat radiating plate is provided with a plurality of heat radiating holes at or near the both shoulder bent portions.

Accordingly, in the heat dissipation structure of the electronic component configured as described above, the heat dissipation plate main body having the center bent portion and the center bent portion and the shoulder bent portion is formed into a substantially M-shaped cross section. In the radiator plate comprising a first flat plate portion and a second flat plate portion formed integrally with the radiator plate main body at both ends of the radiator plate main body, the two shoulders located at the highest positions above the surface of the printed circuit board By providing a plurality of heat radiation holes in the bent part or its vicinity, the air heated by the heat generated inside the heat sink rises,
The heat radiation hole located at the highest position inside the heat sink escapes to the outside of the heat sink, so the air permeability inside the heat sink is improved, and the heat dissipation effect of the electronic components can be improved, and the heat sink inside the heat sink It is possible to suppress an increase in the ambient temperature without impairing the heat radiation of the electronic components mounted on the printed circuit board separately from the heat radiation plate.

Further, according to the heat radiating structure for an electronic component of the present invention, the heat radiating plate is provided with a plurality of heat radiating holes at or near the central bent portion.

Therefore, in the heat radiating structure for an electronic component configured as described above, the heat radiating plate main body having the center bent portion and the center bent portion and the both shoulder bent portions is formed into a substantially M-shaped cross section. In a radiator plate comprising a first flat plate portion and a second flat plate portion formed integrally with the radiator plate main body at both ends of the radiator plate main body, the radiator plate is fixed to the first flat plate portion and the second flat plate portion. A plurality of heat radiating holes provided at or near the central bent portion, which is the position farthest from the position of each of the electronic components, and a first flat plate portion to which the electronic component is fixed; Because the flat plate part and the radiator plate body are connected continuously at both shoulder bending parts, the heat generated from each electronic component is
Since the air heated by the heat generated inside the heat sink rises easily from the first flat plate portion and the second flat plate portion to the heat sink body, and escapes from the heat sink to the outside of the heat sink, The air permeability inside the heat sink is improved and the heat dissipation effect of the electronic components can be improved, and the heat dissipation of the electronic components located inside the heat sink and mounted on the printed circuit board separately from the heat sink is not impaired Thus, an increase in the ambient temperature of the electronic component can be suppressed.

According to the heat radiating structure for an electronic component of the present invention, the heat radiating plate has the central bent portion and the both shoulder bent portions substantially perpendicular to the printed circuit board, and the first flat plate portion has The electronic component is attached to the first flat plate portion or the second flat plate portion so that the second flat plate portion is substantially perpendicular to the printed board.
One of the flat portions, or the first flat portion and the second flat portion.
Are fixed to both of the flat plate portions.

Therefore, in the heat radiating structure of the electronic component thus configured, the heat radiating plate is bent into a substantially M-shaped cross section at the center bent portion and the both shoulder bent portions. By bending at the bent portion, the heat radiation area can be increased as compared with the state of a flat plate without the bent portion, and the heat radiation effect of the electronic component fixed to the heat radiation plate can be improved.

Further, the heat radiating plate includes a pair of mounting legs provided near both ends of the lower end of the first flat plate portion and a pair of mounting legs provided near both ends of the lower end of the second flat plate portion.
By being fixed to the printed circuit board at four points, even when an external force is applied to the heat sink, the printed circuit board is unlikely to crack, and further fixed to the first flat plate section and the second flat plate section. It is possible to make it difficult for cracks to occur in the circuit pattern connection (soldering) portion of the printed electronic component and the printed circuit board.

Further, the first flat plate portion and the second flat plate portion are
The heat sink body is supported from both sides so as to be substantially perpendicular to the printed circuit board, and also serves as a fixing part for electronic components.By fixing the electronic components to both sides of the heat sink body, a large number of The electronic component can be fixed to the heat radiating plate in a small space, and the heat radiating structure of the electronic component can be made compact.

[Brief description of the drawings]

FIGS. 1A and 1B are diagrams illustrating a state in which a heat radiating plate and an electronic component of a heat radiating structure of an electronic component according to a first embodiment of the present invention are mounted on a printed circuit board; FIG.
(B) is a side view.

FIGS. 2A and 2B are diagrams illustrating a state in which a heat radiating plate and an electronic component of a heat radiating structure for an electronic component according to a second embodiment of the present invention are mounted on a printed circuit board; FIG.
(B) is a side view.

3A and 3B are diagrams illustrating a state in which a heat radiating plate and an electronic component of a heat radiating structure for an electronic component according to a third embodiment of the present invention are mounted on a printed circuit board, and FIG.
(B) is a side view.

FIG. 4 is a perspective view illustrating a state where a heat radiating plate and an electronic component of a heat radiating structure for an electronic component according to a fourth embodiment of the present invention are mounted on a printed circuit board.

FIG. 5 is a perspective view illustrating a state in which a heat radiating plate having a heat radiating structure for a conventional electronic component and an electronic component are mounted on a printed circuit board.

FIG. 6 is a perspective view illustrating a state in which a heat radiating plate and an electronic component of another conventional electronic component heat radiating structure are mounted on a printed circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Heat sink 2a Heat sink main body 2b 1st flat plate part 2c 2nd flat plate part 2d Center bending part 2e Double shoulder bending part 2f, 2g Mounting leg part 2h, 2i Mounting hole 2j, 2k Heat radiation hole 3, 4 Electronic components 5 Mounting screws 6 Electronic components

Claims (5)

[Claims] An electronic component mounted on a printed circuit board;
A heat dissipation plate attached to the printed circuit board along the electronic component, wherein the heat dissipation structure of the electronic component in which the electronic component is fixed to the heat dissipation plate, wherein the heat dissipation plate has a substantially M-shaped cross section. A radiator plate body having a center bent portion and both shoulder bent portions and having the center bent portion; a first flat plate portion formed integrally with the radiator plate body at both ends of the radiator plate body; A pair of mounting legs are provided near both ends of the lower end of each of the first flat plate and the second flat plate, and the radiator plate is mounted to the printed circuit board with the mounting legs. A heat dissipating structure for electronic components, characterized in that: 2. The heat radiation plate, wherein the central bent portion and the both shoulder bent portions are substantially parallel to the printed board, and the first flat plate portion and the second flat plate portion are aligned with the printed board. The electronic component is attached to the printed circuit board so as to be substantially vertical, and the electronic component is one of the first flat plate portion and the second flat plate portion, or the first flat plate portion and the second flat plate portion. The heat radiating structure for an electronic component according to claim 1, wherein the heat radiating structure is fixed to both of the portions. 3. The heat radiating structure for an electronic component according to claim 2, wherein the heat radiating plate has a plurality of heat radiating holes provided at or near the shoulder bent portions. 4. The heat radiating structure for an electronic component according to claim 2, wherein the heat radiating plate has a plurality of heat radiating holes provided at or near the central bent portion. 5. The heat radiation plate, wherein the center bent portion and the both shoulder bent portions are substantially perpendicular to the printed circuit board, and the first flat plate portion and the second flat plate portion are positioned relative to the printed circuit board. The electronic component is attached to the printed circuit board so as to be substantially vertical, and the electronic component is one of the first flat plate portion and the second flat plate portion, or the first flat plate portion and the second flat plate portion. The heat radiating structure for an electronic component according to claim 1, wherein the heat radiating structure is fixed to both of the portions.