JP2001176934A - Manufactureing method of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To evaluate positioning accuracy of a chip and a tape after flip-chip bonding highly precisely. SOLUTION: A prism-type mirror 2 which can back and a camera 1 for sensing image, etc., of a pad of a chip 3 and a bump 4b of a tape 4 reflected in two reflection surfaces 2b, 2c of the prism-type mirror 2 are arranged between a mount head 5 holding the chip 3 and the tape 4 on a stage. Consequently misregistration amount of a pad of the chip 3 and the bump 4b of the tape 4 immediately before bonding is measured accurately, and defective or non- defective of misregistration of a pad and the bump 4b after completion of flip- chip bonding is judged highly precisely.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing technique, and more particularly, to a technique which is effective when applied to flip chip bonding in a semiconductor device assembling process.

[0002]

2. Description of the Related Art For example, in the process of assembling a semiconductor device, a TAB in which a surface electrode of a semiconductor pellet is collectively flip-chip bonded to a bump electrode of a carrier tape having a mounting electrode pattern formed on an insulating film.
It is known to use a (Tape Automated Bonding) technique.

A flip chip mounter for performing such flip chip bonding mounts the pattern surface of a semiconductor pellet (chip) and the surface of a tape as adhesive surfaces.

[0004]

In the above-described flip-chip bonding, the bonding portion is not visible from the outside after the bonding is completed.
There is a technical problem that it is not possible to measure mounting accuracy such as displacement between the surface electrode of the semiconductor pellet and the corresponding bump electrode on the tape side.

Although the displacement between the chip and the reference surface of the tape can be measured by using the edge surface of the chip and the reference surface of the tape, there is another technical problem that a bonding accuracy higher than the processing accuracy of the chip edge surface cannot be calculated.

An object of the present invention is to provide a semiconductor device which is not affected by the dimensional accuracy of a semiconductor pellet and a bonding object.
It is an object of the present invention to provide a technique capable of evaluating bonding position accuracy of flip chip bonding with high accuracy.

Another object of the present invention is to provide a technique capable of quickly judging the quality of a bonding result after completion of flip chip bonding.

Another object of the present invention is to provide a technique capable of improving the reliability of a semiconductor device by accurately evaluating a bonding result.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0010]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

According to the present invention, there is provided a semiconductor device using a flip chip bonder for bonding a plurality of first electrodes provided on a semiconductor pellet and a plurality of second electrodes provided on an object to be bonded collectively. In the method for manufacturing a semiconductor device for assembling the device, an electrode position observation mechanism for simultaneously observing the first and second electrodes facing each other immediately before bonding is provided on the flip chip bonder.

More specifically, a mechanism is provided which measures the positions of the electrodes of a bonding object such as a chip and a tape immediately before mounting, and theoretically calculates the bonding accuracy between the two electrodes after bonding. Flip chip bonding is performed using a flip chip mounter. With the chip just above the tape mounting surface just before mounting, the bump position of the tape and the pad position of the chip bonded to the bump are measured. It is calculated as the mounting accuracy after bonding from the positional relationship at that time. Thereby, the accuracy after bonding can be calculated more accurately. In addition, the quality of the semiconductor device bonded by flip chip bonding can be determined immediately after mounting.

[0013]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a perspective view showing an example of a configuration of a flip chip assembling apparatus used in a method of manufacturing a semiconductor device according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a part thereof. FIG. 3 is an explanatory diagram showing an example of the operation.

In FIG. 1, 3 is a chip, 4 is a tape,
5 is a mount head, 5a is a bonding arm, 6 is a stage, 7 is a positioning camera, 8 is a loader, 9 is an unloader, 10 is a pre-bake furnace, 11 is an after-bake furnace, 12 is a monitor, 13 is a wafer cassette, and 14 is a wafer cassette. Protection tape.

The tape 4 separated and fed out from the protective tape 14 by the loader 8 passes through a pre-baking furnace 10 and is preheated, and then passes between the stage 6 and the mount head 5 and is positioned by the positioning camera 7. After positioning, the chip 3 is flip-chip bonded by being pinched between the stage 6 and the mount head 5, the chip 3 passes through the after-bake furnace 11, reaches the unloader 9, and is wound up together with the protective tape 14. .

In the case of the present embodiment, the stage 6 and the mount head 5 are positioned so as to be retractable during the bonding operation by a moving mechanism (not shown) between the stage 6 and the mount head 5, and the image of the pad 3a of the chip 3 and the tape The prism-type mirror 2 for simultaneously observing the image of the bump 4b on the mirror 4 via the two reflection surfaces 2b and 2c, and the image reflected on the two reflection surfaces 2b and 2c of the prism-type mirror 2 A camera 1 for capturing is provided.

That is, as illustrated in FIG. 2, an image of each bonding surface of the chip 3 and the tape 4 is captured by the camera 1 and the prism type mirror 2 and is displayed on the monitor 12 and the like, and the pads 3a of both are captured. And the positions of the bumps 4b and the like are measured. After this measurement, the prism type mirror 2 is retracted, and then the mount head 5 is lowered vertically to mount the chip 3 on the tape 4.

In FIG. 2, the position of the chip 3 held by the mount head 5 is a position immediately before mounting. When the chip 3 is lowered vertically and pressure-bonded to the tape 4, the mounting is completed (in FIG. 2, the position of the chip 3 in a bonding completed state is indicated by a broken line).

As described above, in this embodiment, the position immediately before the mounting of the chip 3 and the tape 4 can be simultaneously photographed by using the prism type mirror 2 and the camera 1. In the example of FIG. 2, one camera 1 captures images of the chip 3 and the tape 4 via the two reflecting surfaces 2 b and 2 c of the prism mirror 2.
Two reflecting surfaces 2b and two reflecting surfaces 2 of prism type mirror 2
The images of the chip 3 and the tape 4 reflected on each of the images c may be taken by different cameras.

FIG. 3 shows a camera image 1a of the monitor 12 in the state of FIG. The horizontal position of the chip 3 and the tape 4 according to the positional relationship between the bump 4b serving as a target on the tape surface 4a, the pad 3a serving as a target on the surface of the chip 3, and the prism boundary 2a, and the positional relationship between the prism mirror 2 and the camera 1. The displacement 15 can be measured.

The mounting accuracy can be calculated with high accuracy by adding the horizontal accuracy of the mount head 5 to the measured horizontal displacement 15 of the chip 3 and the tape 4.

FIG. 4 is a perspective view showing a modification of the configuration of the bonding portion of the flip chip assembling apparatus of the present embodiment.

In the case of the modified example of FIG. 4, FIGS.
In place of the prism type mirror 2 and camera 1 in the above, as a configuration for detecting the positions of the chip 3 and the tape 4, the upper camera 18 and the lower camera 19 are arranged so that their optical axes are coaxial and the optical axes are vertical. The upper camera 18 detects the image (position) of the chip 3 and the lower camera 19 detects the image (position) of the tape 4. Has become. Then, after the measurement of FIG. 4, the chip 3 is mounted on the tape 4 by lowering the mount head 5 vertically.

That is, the upper camera 18 and the lower camera 1
The image (position) of the chip 3 and the tape 4 detected at each of the positions 9 is a position immediately before mounting, and after detecting this position, the chip 3 is lowered vertically and pressed onto the tape 4 to complete the mounting. Becomes

As described above, in the modification shown in FIG. 4, since the upper camera 18 and the lower camera 19 can simultaneously photograph the images of the chip 3 and the tape 4 in the positioning completed state immediately before the flip chip bonding, the photographing is performed. The horizontal positional deviation 16 between the chip 3 and the tape 4 can be measured and evaluated with high accuracy from the video. As a result, the upper camera 18 and the lower camera 1
By adding the horizontal precision of the mount head 5 to the horizontal displacement 16 between the chip 3 and the tape 4 measured using the method 9, the mounting precision can be calculated with high precision.

As described above, according to the flip-chip assembling apparatus in the method of manufacturing a semiconductor device of the present embodiment, the positional relationship between the chip 3 and the tape 4 immediately before mounting can be accurately measured. This is obtained by adding the error due to the last mounting operation to the variation in the positional relationship. If the data is output as mounting accuracy before mounting, the bonding accuracy can be accurately evaluated even in flip-chip bonding in which the measurement of mounting accuracy is difficult to understand because bonding sites are not visible from the outside after bonding is completed.

As a result, it is possible to more accurately determine whether the chip 3 is misaligned during the flip chip bonding with respect to the tape 4 and to improve the yield in the flip chip bonding process.

When the prism type mirror 2 is used, the image of the chip 3 and the image of the tape 4 can be simultaneously detected by one camera 1, and it is not necessary to use an unnecessarily large number of cameras. Can be designed smaller.

Further, since the bonding accuracy of the flip chip bonding assembling apparatus can be calculated and evaluated, the reliability of a product such as a semiconductor device assembled using the assembling apparatus is improved.

Further, the configuration of the prism type mirror 2 and the camera 1 or the horizontal displacement 16 between the chip 3 and the tape 4 measured by using the upper camera 18 and the lower camera 19.
Is fed back to the subsequent positioning control system by the positioning camera 7 in real time, whereby the positioning accuracy of the chip 3 and the tape 4 in flip chip bonding can be improved.

In addition, for adjustment of a positioning control system in maintenance management of a flip chip bonding assembly apparatus,
By reflecting the configuration of the prism type mirror 2 and the camera 1 or the horizontal position shift 16 between the chip 3 and the tape 4 measured using the upper camera 18 and the lower camera 19,
High-precision maintenance management of the flip chip bonding assembling apparatus becomes possible.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above-described embodiments, and can be variously modified without departing from the gist thereof. Needless to say, there is.

[0034]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

According to the method of manufacturing a semiconductor device of the present invention,
The effect is obtained that the bonding position accuracy of the flip chip bonding can be evaluated with high accuracy without being affected by the dimensional accuracy of the semiconductor pellet and the bonding object.

According to the method of manufacturing a semiconductor device of the present invention,
After flip-chip bonding is completed, it is possible to quickly determine the quality of the bonding result.

According to the method of manufacturing a semiconductor device of the present invention,
An accurate evaluation of the bonding result has an effect that the reliability of the semiconductor device can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of a configuration of a flip chip assembling apparatus used in a method of manufacturing a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a part thereof.

FIG. 3 is an explanatory diagram showing an example of the operation.

FIG. 4 is a perspective view showing a modification of the configuration of the bonding portion of the flip chip assembling apparatus used in the method of manufacturing a semiconductor device according to one embodiment of the present invention;

[Explanation of symbols]

 Reference Signs List 1 camera 1a camera image 2 prism type mirror 2a prism boundary 2b reflection surface 2c reflection surface 3 chip 3a pad 4 tape 4a tape surface 4b bump 5 mount head 5a bonding arm 6 stage 7 positioning camera 8 loader 9 unloader 10 prebake furnace 11 after Bake furnace 12 Monitor 13 Wafer cassette 14 Protective tape 15 Horizontal position shift 16 Horizontal position shift 18 Upper camera 19 Lower camera

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Osamu Obata 3-3-2 Fujibashi, Ome-shi, Tokyo F-term in Hitachi Tokyo Electronics Co., Ltd. 5F044 KK16 MM31 NN03 PP17

Claims (1)

[Claims] 1. A semiconductor device using a flip chip bonder for bonding a plurality of first electrodes provided on a semiconductor pellet and a plurality of second electrodes provided on an object to be bonded collectively. A method of manufacturing a semiconductor device for performing assembly, wherein the flip chip bonder includes:
A method of manufacturing a semiconductor device, comprising an electrode position observation mechanism for simultaneously observing the first and second electrodes facing each other immediately before bonding.