JP2001170852A - Machining method, machining device, tool and die - Google Patents
Machining method, machining device, tool and dieInfo
- Publication number
- JP2001170852A JP2001170852A JP36012699A JP36012699A JP2001170852A JP 2001170852 A JP2001170852 A JP 2001170852A JP 36012699 A JP36012699 A JP 36012699A JP 36012699 A JP36012699 A JP 36012699A JP 2001170852 A JP2001170852 A JP 2001170852A
- Authority
- JP
- Japan
- Prior art keywords
- tool
- mold
- machining
- processing
- effective area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、加工方法、加工装
置、工具及び金型に関し、詳細には、光学素子用の金型
を高精度に加工する加工方法、加工装置、工具及びこれ
らの加工方法、加工装置及び工具で加工された金型に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a machining method, a machining apparatus, a tool, and a mold, and more particularly, to a machining method, a machining apparatus, a tool, and a machining method for machining a mold for an optical element with high accuracy. The present invention relates to a method, a processing apparatus, and a mold processed by a tool.
【0002】[0002]
【従来の技術】金型、特に、光学素子用の金型は、高精
度が要求され、切削と研磨、研削と研磨、切削のみ、あ
るいは、研削のみ等々の加工工程で製造されている。2. Description of the Related Art A mold, particularly a mold for an optical element, is required to have high precision, and is manufactured by a machining process such as cutting and polishing, grinding and polishing, cutting only, or grinding only.
【0003】そして、金型を加工するときの加工の開始
点、終了点及び加工方向の切換位置は、金型外か金型上
であると、通常考えられる。[0003] It is generally considered that the starting point, the ending point, and the switching position of the processing direction when processing the die are outside the die or on the die.
【0004】上記切換位置が金型外である場合、工具
が、金型外と金型上との境界、すなわち、外周エッジと
接触することになり、加工が断続的となる。If the switching position is outside the mold, the tool comes into contact with the boundary between the outside of the mold and the top of the mold, that is, the outer peripheral edge, and the machining is intermittent.
【0005】ところが、工具が外周エッジと接触する
と、工具に急激な負荷が加わり、工具がチッピングした
り、傷ついたりするという損傷を受けやすい。このよう
な損傷を受けた工具で金型を加工すると、加工物の加工
面に傷やスクラッチが発生したり、所望の形状精度を得
ることができないという問題が発生する。[0005] However, when the tool comes into contact with the outer peripheral edge, a sharp load is applied to the tool, and the tool is easily damaged by chipping or damage. When the mold is machined with such a damaged tool, there arises a problem that scratches or scratches occur on the machined surface of the workpiece, and a desired shape accuracy cannot be obtained.
【0006】また、切換位置が金型上である場合、加工
の開始点、終了点、加工方向の切換位置を削り過ぎてし
まうという現象が生じる。すなわち、金型の研磨におい
ては、研磨の開始、終了あるいは加工方向の切換位置で
は、研磨時間が長くなったり、研磨回数が多くなるた
め、図5に示すように、金型1の光学有効領域2の境界
線L部分に、削り過ぎによる溝3が形成されてしまう。Further, when the switching position is on the die, there occurs a phenomenon that the starting point, the ending point, and the switching position of the processing direction are excessively cut. In other words, in the polishing of the mold, the polishing time becomes longer or the number of times of polishing increases at the start and end of the polishing or at the switching position of the processing direction. Therefore, as shown in FIG. The groove 3 due to excessive cutting is formed at the boundary line L of No. 2.
【0007】この削り過ぎの溝3の除去量が他の部分に
比較して大きくなれば大きくなるほど、有効に使用する
ことのできる範囲が小さくなってしまうという問題があ
る。There is a problem that as the removal amount of the excessively cut groove 3 becomes larger as compared with other parts, the range where it can be used effectively becomes smaller.
【0008】そこで、従来、特開昭62−246467
号公報に記載されているように、金型の周囲にこの金型
の周囲と同じ高さの補助型(ヤトイ)を嵌合し、研磨作
業の開始、終了あるいは加工方向の切り換えを補助型上
で行わせる研磨法が提案されている。In view of the above, conventionally, Japanese Patent Application Laid-Open No. 62-246467
As described in Japanese Patent Application Laid-Open Publication No. H10-260, an auxiliary die (jatoy) having the same height as the periphery of the die is fitted around the die, and the start and end of the polishing operation or switching of the processing direction are performed on the auxiliary die. There has been proposed a polishing method for performing the above.
【0009】[0009]
【発明が解決しようとする課題】しかしながら、上記公
報記載の技術にあっては、被加工面の外側に疑似金型
(ヤトイ)が必要であるとともに、疑似金型は、本来の
レンズ型とほとんど同一の工程を経て製作されるため、
型製作の総加工時間を大きく増大させる要因となってい
る。さらに、金型とヤトイを一体のものとして加工する
必要があり、金型とヤトイの両方に対してほぼ同等の高
精度な加工が要求される。その結果、加工面積が増え
て、加工時間が長くなるとともに、工具の損耗が激しく
なり、さらに、ヤトイを必要とし、製作コストが高くな
るという問題がある。However, according to the technology described in the above publication, a pseudo mold is required outside the surface to be processed, and the pseudo mold is almost the same as the original lens mold. Because it is manufactured through the same process,
This is a factor that greatly increases the total processing time of mold production. Furthermore, it is necessary to process the mold and the toy as an integral unit, and almost the same high-precision processing is required for both the mold and the toy. As a result, there is a problem that the machining area increases, the machining time becomes longer, the wear of the tool becomes severe, and furthermore, a toy is required and the production cost is increased.
【0010】そこで、請求項1記載の発明は、所定の軸
を中心として回転される工具と光学素子用の金型を所定
のツールパスに沿って相対移動させて、工具の加工作用
面で金型を加工するに際して、ツールパスとして、工具
の加工作用面が金型の外周エッジに接触しない位置であ
って、かつ、金型の光学的な有効域外で、加工の開始、
加工方向の切り換え及び加工の終了を行う移動経路を設
定することにより、ヤトイを使用することなく、短時間
に加工して工具の損耗を抑制し、かつ、工具にダメージ
を与えることを防止し、所望の形状精度で効率的に金型
を加工することのできる加工方法を提供することを目的
としている。In view of the above, according to the first aspect of the present invention, a tool which is rotated about a predetermined axis and a mold for an optical element are relatively moved along a predetermined tool path, and the tool is turned on the working surface of the tool. When machining the mold, as a tool path, start machining at a position where the machining action surface of the tool does not contact the outer peripheral edge of the mold, and outside the optically effective area of the mold.
By setting a movement path for switching the processing direction and terminating the processing, processing can be performed in a short time without using a toy, thereby suppressing wear of the tool, and preventing damage to the tool, An object of the present invention is to provide a processing method that can efficiently process a mold with a desired shape accuracy.
【0011】請求項2記載の発明は、所定の軸を中心と
して回転される工具と光学素子用の金型を所定のツール
パスに沿って相対移動させて、工具の加工作用面で金型
を加工するに際して、ツールパスとして、工具の加工作
用面が金型の外周エッジに接触しない位置であって、か
つ、金型の光学的な有効域外で、加工の開始、加工方向
の切り換え及び加工の終了を行う移動経路を設定するこ
とにより、ヤトイを使用することなく、短時間に加工し
て工具の損耗を抑制し、かつ、工具にダメージを与える
ことを防止し、所望の形状精度で効率的に金型を加工す
ることのできる加工装置を提供することを目的としてい
る。According to a second aspect of the present invention, a tool rotated about a predetermined axis and a mold for an optical element are relatively moved along a predetermined tool path, and the mold is moved on a working surface of the tool. At the time of machining, as the tool path, the machining operation surface of the tool does not contact the outer peripheral edge of the mold, and is outside the optically effective area of the mold. By setting the movement path for the end, it is possible to process the tool in a short period of time without using a toy, to suppress wear of the tool, and to prevent damage to the tool, and to achieve efficient with desired shape accuracy. It is an object of the present invention to provide a processing apparatus capable of processing a metal mold.
【0012】請求項3記載の発明は、ツールパスに沿っ
ての加工の開始、加工方向の切り換え及び加工の終了に
際して、工具の回転速度を加工時に比較して減速させる
ことにより、加工の開始、加工方向の切り換え及び加工
の終了の際の工具による金型の除去量を減少させ、金型
の有効域外での削りすぎで光学的な有効域が狭くなるこ
とを防止して、金型をより一層良好な形状精度で加工す
ることのできる加工方法または加工装置を提供すること
を目的としている。[0012] The invention according to claim 3 is that, at the start of machining along the tool path, switching of the machining direction, and at the end of machining, the rotation speed of the tool is reduced as compared with that at the time of machining, thereby starting machining, Switching the processing direction and reducing the amount of removal of the mold by the tool at the end of the processing, preventing the optical effective area from being narrowed by excessive cutting outside the effective area of the mold, It is an object of the present invention to provide a processing method or a processing apparatus capable of performing processing with better shape accuracy.
【0013】請求項4記載の発明は、加工に際して工具
に所定の荷重を付加して加工を行い、ツールパスに沿っ
ての加工の開始、加工方向の切り換え及び加工の終了に
際して、荷重を加工時よりも低減させることにより、加
工の開始、加工方向の切り換え及び加工の終了の際の工
具による金型の除去量を減少させ、金型の有効域外での
削りすぎで光学的な有効域が狭くなることを防止して、
金型をより一層良好な形状精度で加工することのできる
加工方法または加工装置を提供することを目的としてい
る。According to a fourth aspect of the present invention, a predetermined load is applied to a tool at the time of machining, and machining is performed. When starting machining along a tool path, switching a machining direction, and ending machining, a load is applied during machining. By reducing the amount of removal of the die by the tool at the start of processing, switching of the processing direction and at the end of processing, the optical effective area is narrowed due to excessive cutting outside the effective area of the die. To prevent
It is an object of the present invention to provide a processing method or a processing apparatus capable of processing a mold with better shape accuracy.
【0014】請求項5記載の発明は、金型の有効域外に
所定のマスキングを施すことにより、加工の開始、加工
方向の切り換え及び加工の終了の際の工具による金型の
除去量をより一層適切に減少させ、金型の有効域外での
削りすぎで光学的な有効域が狭くなることをより一層防
止して、金型をより一層良好な形状精度で加工すること
のできる加工方法または加工装置を提供することを目的
としている。According to a fifth aspect of the present invention, by performing predetermined masking outside the effective area of the mold, the amount of removal of the mold by the tool at the start of processing, switching of the processing direction, and completion of processing is further improved. A processing method or process capable of appropriately reducing the size of the mold with even better shape accuracy by further preventing the optical effective range from being narrowed due to excessive cutting outside the effective range of the mold. It is intended to provide a device.
【0015】請求項6記載の発明は、工具を、金型の有
効域の加工に関与する有効域工具部と、金型の有効域外
の加工に関与する不要域工具部と、を備え、有効域工具
部が有効域の加工に適した所定の切れ味を有する部材で
形成され、不要域工具部が有効域工具部の切れ味よりも
所定量切れ味の落ちる部材で形成されたものとすること
により、加工の開始、加工方向の切り換え及び加工の終
了の際の工具による金型の除去量をより一層適切に減少
させ、金型の有効域外での削りすぎで光学的な有効域が
狭くなることをより一層防止して、金型をより一層良好
な形状精度で加工することのできる加工方法または加工
装置を提供することを目的としている。According to a sixth aspect of the present invention, a tool is provided with an effective area tool portion involved in machining the effective area of the mold and an unnecessary area tool portion involved in machining outside the effective area of the mold. The area tool part is formed of a member having a predetermined sharpness suitable for processing of the effective area, and the unnecessary area tool part is formed of a member having a predetermined amount of sharpness lower than the sharpness of the effective area tool part, The amount of removal of the die by the tool at the start of processing, switching of the processing direction and at the end of processing is more appropriately reduced, and the optical effective area is narrowed due to excessive cutting outside the effective area of the die. It is an object of the present invention to provide a processing method or a processing apparatus capable of processing a die with even better shape accuracy by further preventing the die.
【0016】請求項7記載の発明は、砥粒として遊離砥
粒を使用し、工具を、金型の有効域の加工に関与する有
効域工具部と、金型の有効域外の加工に関与する不要域
工具部と、を備え、有効域工具部が遊離砥粒を保持可能
な微細穴または繊維が表面に存在する部材で形成され、
不要域工具部が遊離砥粒を保持可能な微細穴または繊維
が表面に存在しない部材で形成されたものとすることに
より、加工の開始、加工方向の切り換え及び加工の終了
の際の工具による金型の除去量をより一層適切に減少さ
せ、金型の有効域外での削りすぎで光学的な有効域が狭
くなることをより一層防止して、金型をより一層良好な
形状精度で加工することのできる加工方法または加工装
置を提供することを目的としている。According to a seventh aspect of the present invention, free abrasive grains are used as abrasive grains, and a tool is involved in machining of the effective area of the mold and an outside of the effective area of the mold. Unnecessary area tool part, and the effective area tool part is formed of a member having fine holes or fibers on the surface capable of holding loose abrasive grains,
The unnecessary area tool portion is formed by a member having no fine holes or fibers on its surface capable of holding loose abrasive grains, so that the tool can be used to start machining, switch the machining direction, and finish machining. The removal amount of the mold is more appropriately reduced, the optical effective area is prevented from being narrowed due to excessive shaving outside the effective area of the mold, and the mold is machined with better shape accuracy. It is an object of the present invention to provide a processing method or a processing apparatus that can perform the processing.
【0017】請求項8記載の発明は、所定の軸を中心と
して回転されながら光学素子用の金型と所定のツールパ
スに沿って相対移動されて、金型を加工するに際して、
ツールパスとして、工具の加工作用面が金型の外周エッ
ジに接触しない位置であって、かつ、金型の光学素子と
しての有効域外で、加工の開始、加工方向の切り換え及
び加工の終了を行う移動経路が設定され、金型の有効域
の加工に関与する有効域工具部と、金型の有効域外の加
工に関与する不要域工具部と、を備え、有効域工具部が
有効域の加工に適した所定の切れ味の部材で形成され、
不要域工具部が有効域工具部の切れ味よりも所定量切れ
味を有する落ちる部材で形成されたものとすることによ
り、加工の開始、加工方向の切り換え及び加工の終了の
際の金型の除去量を減少させ、ヤトイを使用することな
く、短時間に加工して損耗やダメージを抑制しつつ、所
望の形状精度で効率的に金型を加工することのできる工
具を提供することを目的としている。According to an eighth aspect of the present invention, when the mold is processed by being relatively moved along a predetermined tool path with a mold for an optical element while being rotated about a predetermined axis.
As a tool path, the start of processing, the switching of the processing direction, and the end of processing are performed at a position where the working surface of the tool does not contact the outer peripheral edge of the mold and outside the effective area of the mold as an optical element. A movement path is set, and an effective area tool part involved in machining of the effective area of the mold and an unnecessary area tool part involved in machining outside the effective area of the mold are provided. It is formed of a member with a predetermined sharpness suitable for
Since the unnecessary area tool portion is formed of a falling member having a predetermined amount of sharpness more than the sharpness of the effective area tool portion, the removal amount of the mold at the start of processing, switching of the processing direction, and at the end of processing. It is an object of the present invention to provide a tool capable of efficiently processing a mold with a desired shape accuracy while reducing wear and damage by performing processing in a short time without using a toy. .
【0018】請求項9記載の発明は、遊離砥粒を使用し
た加工に使用され、工具を、有効域工具部が遊離砥粒を
保持可能な微細穴または繊維が表面に存在する部材で形
成され、不要域工具部が遊離砥粒を保持可能な微細穴ま
たは繊維が表面に存在しない部材で形成されたものとす
ることにより、加工の開始、加工方向の切り換え及び加
工の終了の際の工具による金型の除去量をより一層適切
に減少させ、ヤトイを使用することなく、損耗やダメー
ジを受けることが少なく、金型の有効域外での削りすぎ
で光学的な有効域が狭くなることをより一層防止しつ
つ、所望の形状精度でより一層効率的に金型を加工する
ことのできる工具を提供することを目的としている。According to the ninth aspect of the present invention, the tool is formed of a member having fine holes or fibers on its surface where the effective area tool portion can hold the free abrasive grains. The unnecessary area tool portion is formed by a member having no fine holes or fibers on the surface capable of holding loose abrasive grains, so that the processing can be started, the switching of the processing direction and the tool at the end of the processing can be performed. The amount of removal of the mold has been reduced more appropriately, and less wear and damage has been achieved without using a toy. It is an object of the present invention to provide a tool capable of processing a mold more efficiently with a desired shape accuracy while further preventing the die.
【0019】請求項10記載の発明は、工具を、有効域
工具部を中心として、不要域工具部がその両脇に接合さ
れているものとすることにより、加工の開始、加工方向
の切り換え及び加工の終了の際の金型の除去量をより一
層適切に減少させ、ヤトイを使用することなく、短時間
に加工して損耗やダメージを抑制しつつ、有効域での加
工を高精度に行うとともに、有効域外での削りすぎで光
学的な有効域が狭くなることを防止して、所望の形状精
度で効率的に金型を加工することのできる工具を提供す
ることを目的としている。According to a tenth aspect of the present invention, the tool is formed such that the unnecessary area tool portion is joined to both sides of the effective area tool portion around the effective area tool portion, thereby starting the machining, switching the machining direction and The amount of removal of the mold at the end of processing is reduced more appropriately, and processing is performed in the effective range with high precision while suppressing wear and damage by processing in a short time without using a toy. It is another object of the present invention to provide a tool capable of efficiently processing a mold with desired shape accuracy by preventing the optical effective area from being narrowed due to excessive cutting outside the effective area.
【0020】請求項11記載の発明は、所定の軸を中心
として回転される工具に対して所定のツールパスに沿っ
て相対移動して、工具の加工作用面で加工するに際し
て、ツールパスとして、工具の加工作用面が金型の外周
エッジに接触しない位置であって、かつ、金型の光学的
な有効域外で、加工の開始、加工方向の切り換え及び加
工の終了を行う移動経路を設定して加工することによ
り、ヤトイを使用することなく、また、短時間の加工で
工具に損耗やダメージを与えることなく、所望の形状精
度で効率的に加工され、高精度な光学素子を成形するこ
とのできる金型を提供することを目的としている。According to an eleventh aspect of the present invention, when the tool is relatively moved along a predetermined tool path with respect to a tool rotated about a predetermined axis and is machined on a machining operation surface of the tool, the tool path is used as a tool path. A movement path for starting machining, switching the machining direction, and ending machining is set at a position where the working surface of the tool does not contact the outer peripheral edge of the mold and outside the optically effective area of the mold. By using a tool, it is possible to form a high-precision optical element that can be efficiently processed with the desired shape accuracy without using a toy and without abrasion or damage to the tool in a short time. The purpose is to provide a mold that can be used.
【0021】[0021]
【課題を解決するための手段】請求項1記載の発明の加
工方法は、工具を所定の軸を中心として回転させながら
工具と光学素子用の金型を所定のツールパスに沿って相
対移動させて、前記工具の加工作用面で前記金型を加工
する加工方法において、前記ツールパスとして、前記工
具の加工作用面が前記金型の外周エッジに接触しない位
置であって、かつ、前記金型の光学的な有効域外で、前
記加工の開始、加工方向の切り換え及び前記加工の終了
を行う移動経路を設定することにより、上記目的を達成
している。According to a first aspect of the present invention, there is provided a machining method wherein a tool and a mold for an optical element are relatively moved along a predetermined tool path while rotating the tool about a predetermined axis. In the machining method for machining the mold with the machining operation surface of the tool, the machining path of the tool is a position not in contact with an outer peripheral edge of the mold, and the mold is used as the tool path. The above object is achieved by setting a movement path for starting the processing, switching the processing direction, and ending the processing outside the optically effective range of the above.
【0022】上記構成によれば、所定の軸を中心として
回転される工具と光学素子用の金型を所定のツールパス
に沿って相対移動させて、工具の加工作用面で金型を加
工するに際して、ツールパスとして、工具の加工作用面
が金型の外周エッジに接触しない位置であって、かつ、
金型の光学的な有効域外で、加工の開始、加工方向の切
り換え及び加工の終了を行う移動経路を設定しているの
で、ヤトイを使用することなく、短時間に加工して工具
の損耗を抑制し、かつ、工具にダメージを与えることを
防止することができ、所望の形状精度で効率的に金型を
加工することができる。According to the above arrangement, the tool rotated about a predetermined axis and the mold for the optical element are relatively moved along the predetermined tool path, and the mold is machined on the working surface of the tool. In this case, as a tool path, the working surface of the tool is a position that does not contact the outer peripheral edge of the mold, and
A movement path for starting machining, switching machining direction, and ending machining is set outside the optical effective area of the mold, so machining can be done in a short time without using a toy to reduce tool wear. It is possible to suppress the damage and prevent the tool from being damaged, and it is possible to efficiently process the mold with desired shape accuracy.
【0023】請求項2記載の発明の加工装置は、工具を
所定の軸を中心として回転させながら前記工具と光学素
子用の金型を所定のツールパスに沿って相対移動させ
て、前記工具の加工作用面で前記金型を加工する加工装
置において、前記ツールパスとして、前記工具の加工作
用面が前記金型の外周エッジに接触しない位置であっ
て、かつ、前記金型の光学的な有効域外で、前記加工の
開始、加工方向の切り換え及び前記加工の終了を行う移
動経路を設定することにより、上記目的を達成してい
る。According to a second aspect of the present invention, in the processing apparatus, the tool and the mold for an optical element are relatively moved along a predetermined tool path while rotating the tool about a predetermined axis. In a processing apparatus for processing the mold with a working surface, the tool path is a position where the working surface of the tool does not contact an outer peripheral edge of the mold, and the optically effective shape of the mold is used as the tool path. The above object is achieved by setting a movement route for starting the processing, switching the processing direction, and ending the processing outside the region.
【0024】上記構成によれば、所定の軸を中心として
回転される工具と光学素子用の金型を所定のツールパス
に沿って相対移動させて、工具の加工作用面で金型を加
工するに際して、ツールパスとして、工具の加工作用面
が金型の外周エッジに接触しない位置であって、かつ、
金型の光学的な有効域外で、加工の開始、加工方向の切
り換え及び加工の終了を行う移動経路を設定しているの
で、ヤトイを使用することなく、短時間に加工して工具
の損耗を抑制し、かつ、工具にダメージを与えることを
防止することができ、所望の形状精度で効率的に金型を
加工することができる。According to the above configuration, the tool rotated about a predetermined axis and the mold for the optical element are relatively moved along the predetermined tool path, and the mold is machined on the working surface of the tool. In this case, as a tool path, the working surface of the tool is a position that does not contact the outer peripheral edge of the mold, and
A movement path for starting machining, switching machining direction, and ending machining is set outside the optical effective area of the mold, so machining can be done in a short time without using a toy to reduce tool wear. It is possible to suppress the damage and prevent the tool from being damaged, and it is possible to efficiently process the mold with desired shape accuracy.
【0025】上記各場合において、例えば、請求項3に
記載するように、前記ツールパスに沿っての前記加工の
開始、前記加工方向の切り換え及び前記加工の終了に際
して、前記工具の回転速度を前記加工時に比較して減速
させてもよい。In each of the above cases, for example, at the time of starting the machining along the tool path, switching the machining direction, and ending the machining, the rotation speed of the tool is set at The speed may be reduced as compared with the time of processing.
【0026】上記構成によれば、ツールパスに沿っての
加工の開始、加工方向の切り換え及び加工の終了に際し
て、工具の回転速度を加工時に比較して減速させている
ので、加工の開始、加工方向の切り換え及び加工の終了
の際の工具による金型の除去量を減少させることがで
き、金型の有効域外での削りすぎで光学的な有効域が狭
くなることを防止して、金型をより一層良好な形状精度
で加工することができる。According to the above configuration, at the time of starting machining along the tool path, switching the machining direction, and ending the machining, the rotational speed of the tool is reduced as compared with the time of machining. It is possible to reduce the amount of removal of the mold by the tool at the time of switching the direction and at the end of the processing, and to prevent the optical effective area from being narrowed due to excessive shaving outside the effective area of the mold. Can be processed with even better shape accuracy.
【0027】また、例えば、請求項4に記載するよう
に、前記加工に際して前記工具に所定の荷重を付加して
前記加工を行い、前記ツールパスに沿っての前記加工の
開始、前記加工方向の切り換え及び前記加工の終了に際
して、前記荷重を前記加工時よりも低減させてもよい。Further, for example, as described in claim 4, during the machining, the machining is performed by applying a predetermined load to the tool, the machining is started along the tool path, and the machining direction is changed. At the time of the switching and the end of the processing, the load may be smaller than that at the time of the processing.
【0028】上記構成によれば、加工に際して工具に所
定の荷重を付加して加工を行い、ツールパスに沿っての
加工の開始、加工方向の切り換え及び加工の終了に際し
て、荷重を加工時よりも低減させているので、加工の開
始、加工方向の切り換え及び加工の終了の際の工具によ
る金型の除去量を減少させることができ、金型の有効域
外での削りすぎで光学的な有効域が狭くなることを防止
して、金型をより一層良好な形状精度で加工することが
できる。According to the above configuration, a predetermined load is applied to the tool at the time of machining, and machining is performed. At the start of machining along the tool path, switching of the machining direction, and at the end of machining, the load is reduced compared to the time of machining. Because of the reduction, the amount of removal of the mold by the tool at the start of processing, switching of the processing direction and the end of processing can be reduced, and the optical effective area due to excessive cutting outside the effective area of the mold Can be prevented from narrowing, and the mold can be machined with better shape accuracy.
【0029】さらに、例えば、請求項5に記載するよう
に、前記金型の前記有効域外に所定のマスキングを施し
てもよい。Further, for example, as described in claim 5, a predetermined masking may be performed outside the effective area of the mold.
【0030】上記構成によれば、金型の有効域外に所定
のマスキングを施しているので、加工の開始、加工方向
の切り換え及び加工の終了の際の工具による金型の除去
量をより一層適切に減少させることができ、金型の有効
域外での削りすぎで光学的な有効域が狭くなることをよ
り一層防止して、金型をより一層良好な形状精度で加工
することができる。According to the above configuration, since the predetermined masking is performed outside the effective area of the mold, the amount of removal of the mold by the tool at the time of starting the processing, switching the processing direction, and ending the processing is more appropriate. It is possible to further prevent the optical effective area from being narrowed due to excessive shaving outside the effective area of the mold, and to process the mold with even better shape accuracy.
【0031】また、例えば、請求項6に記載するよう
に、前記工具は、前記金型の前記有効域の加工に関与す
る有効域工具部と、前記金型の前記有効域外の加工に関
与する不要域工具部と、を備え、前記有効域工具部が前
記有効域の加工に適した所定の切れ味を有する部材で形
成され、前記不要域工具部が前記有効域工具部の切れ味
よりも所定量切れ味の落ちる部材で形成されていてもよ
い。In addition, for example, as described in claim 6, the tool is involved in machining of the effective area of the mold, and is involved in machining of the mold outside the effective area. Unnecessary area tool part, the effective area tool part is formed of a member having a predetermined sharpness suitable for machining of the effective area, and the unnecessary area tool part is a predetermined amount greater than the sharpness of the effective area tool part. It may be formed of a member with sharpness.
【0032】上記構成によれば、工具を、金型の有効域
の加工に関与する有効域工具部と、金型の有効域外の加
工に関与する不要域工具部と、を備え、有効域工具部が
有効域の加工に適した所定の切れ味を有する部材で形成
され、不要域工具部が有効域工具部の切れ味よりも所定
量切れ味の落ちる部材で形成されたものとしているの
で、加工の開始、加工方向の切り換え及び加工の終了の
際の工具による金型の除去量をより一層適切に減少させ
ることができ、金型の有効域外での削りすぎで光学的な
有効域が狭くなることをより一層防止して、金型をより
一層良好な形状精度で加工することができる。According to the above configuration, the tool is provided with an effective area tool portion involved in machining the effective area of the mold and an unnecessary area tool portion involved in machining outside the effective area of the mold. Since the portion is formed of a member having a predetermined sharpness suitable for machining of the effective area, and the unnecessary area tool portion is formed of a member having a predetermined amount of sharpness lower than the sharpness of the effective area tool portion, the machining is started. In addition, the amount of removal of the mold by the tool at the time of switching the machining direction and at the end of the machining can be more appropriately reduced, and the optical effective area is narrowed due to excessive cutting outside the effective area of the mold. It is possible to process the mold with even better shape accuracy by further preventing the die.
【0033】さらに、例えば、請求項7に記載するよう
に、前記加工方法または前記加工装置は、砥粒として遊
離砥粒を使用し、前記工具は、前記金型の前記有効域の
加工に関与する有効域工具部と、前記金型の前記有効域
外の加工に関与する不要域工具部と、を備え、前記有効
域工具部が前記遊離砥粒を保持可能な微細穴または繊維
が表面に存在する部材で形成され、前記不要域工具部が
前記遊離砥粒を保持可能な微細穴または繊維が表面に存
在しない部材で形成されていてもよい。Further, for example, as set forth in claim 7, the processing method or the processing apparatus uses loose abrasive grains as abrasive grains, and the tool is involved in processing the effective area of the mold. An effective area tool part, and an unnecessary area tool part involved in processing outside the effective area of the mold, wherein the effective area tool part has fine holes or fibers on its surface capable of holding the loose abrasive grains. The unnecessary area tool portion may be formed of a member having no fine holes or fibers on its surface capable of holding the loose abrasive grains.
【0034】上記構成によれば、砥粒として遊離砥粒を
使用し、工具を、金型の有効域の加工に関与する有効域
工具部と、金型の有効域外の加工に関与する不要域工具
部と、を備え、有効域工具部が遊離砥粒を保持可能な微
細穴または繊維が表面に存在する部材で形成され、不要
域工具部が遊離砥粒を保持可能な微細穴または繊維が表
面に存在しない部材で形成されたものとしているので、
加工の開始、加工方向の切り換え及び加工の終了の際の
工具による金型の除去量をより一層適切に減少させるこ
とができ、金型の有効域外での削りすぎで光学的な有効
域が狭くなることをより一層防止して、金型をより一層
良好な形状精度で加工することができる。According to the above configuration, free abrasive grains are used as the abrasive grains, and the tool is divided into an effective area tool portion involved in machining the effective area of the mold and an unnecessary area involved in machining outside the effective area of the mold. And a tool part, wherein the effective area tool part is formed of a member having fine holes or fibers that can hold loose abrasive grains on the surface, and the unnecessary area tool part has fine holes or fibers that can hold loose abrasive grains. Because it is assumed to be formed of members that do not exist on the surface,
The amount of removal of the mold by the tool at the start of processing, switching of the processing direction and at the end of processing can be more appropriately reduced, and the optical effective area is narrowed due to excessive cutting outside the effective area of the mold. It is possible to further prevent the die from being deformed and process the mold with a better shape accuracy.
【0035】請求項8記載の発明の工具は、所定の軸を
中心として回転されながら光学素子用の金型と所定のツ
ールパスに沿って相対移動されて、前記金型を加工する
工具において、前記ツールパスとして、前記工具の加工
作用面が前記金型の外周エッジに接触しない位置であっ
て、かつ、前記金型の前記光学素子としての有効域外
で、前記加工の開始、加工方向の切り換え及び前記加工
の終了を行う移動経路が設定され、前記金型の前記有効
域の加工に関与する有効域工具部と、前記金型の前記有
効域外の加工に関与する不要域工具部と、を備え、前記
有効域工具部が前記有効域の加工に適した所定の切れ味
の部材で形成され、前記不要域工具部が前記有効域工具
部の切れ味よりも所定量切れ味を有する落ちる部材で形
成されていることにより、上記目的を達成している。According to a eighth aspect of the present invention, there is provided a tool for processing a mold for an optical element which is relatively moved along a predetermined tool path while being rotated about a predetermined axis. As the tool path, at the position where the working surface of the tool does not contact the outer peripheral edge of the mold, and outside the effective area of the mold as the optical element, start the machining and switch the machining direction. And a movement path for ending the machining is set, an effective area tool part involved in machining the effective area of the mold, and an unnecessary area tool part involved in machining of the mold outside the effective area. The effective area tool portion is formed of a member having a predetermined sharpness suitable for machining of the effective area, and the unnecessary area tool portion is formed of a falling member having a predetermined amount of sharpness than the sharpness of the effective area tool portion. To be Ri, has achieved the above object.
【0036】上記構成によれば、所定の軸を中心として
回転されながら光学素子用の金型と所定のツールパスに
沿って相対移動されて、金型を加工するに際して、ツー
ルパスとして、工具の加工作用面が金型の外周エッジに
接触しない位置であって、かつ、金型の光学素子として
の有効域外で、加工の開始、加工方向の切り換え及び加
工の終了を行う移動経路が設定され、金型の有効域の加
工に関与する有効域工具部と、金型の有効域外の加工に
関与する不要域工具部と、を備え、有効域工具部が有効
域の加工に適した所定の切れ味の部材で形成され、不要
域工具部が有効域工具部の切れ味よりも所定量切れ味を
有する落ちる部材で形成されたものとしているので、加
工の開始、加工方向の切り換え及び加工の終了の際の金
型の除去量を減少させることができ、ヤトイを使用する
ことなく、短時間に加工して損耗やダメージを抑制しつ
つ、所望の形状精度で効率的に金型を加工することがで
きる。According to the above configuration, the optical element mold is relatively moved along the predetermined tool path while being rotated about the predetermined axis, and when the mold is processed, the tool path is used as a tool path. At a position where the working surface is not in contact with the outer peripheral edge of the mold, and outside the effective area of the mold as an optical element, a movement path for starting the processing, switching the processing direction and ending the processing is set, An effective area tool part involved in machining the effective area of the mold and an unnecessary area tool part involved in machining outside the effective area of the mold, the effective area tool part having a predetermined sharpness suitable for machining the effective area. Since the unnecessary area tool portion is formed by a falling member having a predetermined amount of sharpness greater than the sharpness of the effective area tool portion, the machining is started, the machining direction is switched, and the machining is terminated. Reduces mold removal So that it is, without using the lens holder unit, while suppressing wear and damage by processing in a short time, can be processed efficiently mold a desired shape accuracy.
【0037】この場合、例えば、請求項9に記載するよ
うに、前記工具は、遊離砥粒を使用した加工に使用さ
れ、前記有効域工具部が前記遊離砥粒を保持可能な微細
穴または繊維が表面に存在する部材で形成され、前記不
要域工具部が前記遊離砥粒を保持可能な微細穴または繊
維が表面に存在しない部材で形成されていてもよい。In this case, for example, as described in claim 9, the tool is used for machining using loose abrasive grains, and the effective area tool portion can hold fine loose holes or fibers capable of holding the loose abrasive grains. May be formed of a member present on the surface, and the unnecessary area tool portion may be formed of a member having no fine holes or fibers capable of holding the loose abrasive grains on the surface.
【0038】上記構成によれば、遊離砥粒を使用した加
工に使用され、工具を、有効域工具部が遊離砥粒を保持
可能な微細穴または繊維が表面に存在する部材で形成さ
れ、不要域工具部が遊離砥粒を保持可能な微細穴または
繊維が表面に存在しない部材で形成されたものとしてい
るので、加工の開始、加工方向の切り換え及び加工の終
了の際の工具による金型の除去量をより一層適切に減少
させることができ、ヤトイを使用することなく、損耗や
ダメージを受けることが少なく、金型の有効域外での削
りすぎで光学的な有効域が狭くなることをより一層防止
しつつ、所望の形状精度でより一層効率的に金型を加工
することができる。According to the above construction, the tool used for machining using the free abrasive grains is formed by a member in which the effective area tool portion has fine holes or fibers on the surface capable of holding the free abrasive grains. Since the tool portion is formed of a member having no fine holes or fibers on the surface capable of holding loose abrasive grains, the tool is used to start the machining, switch the machining direction, and finish the machining with the tool. The removal amount can be reduced more appropriately, the wear and damage are less likely to occur without using a toy, and the optical effective area is narrowed due to excessive shaving outside the effective area of the mold. The mold can be more efficiently processed with a desired shape accuracy while further preventing the die.
【0039】また、例えば、請求項10に記載するよう
に、前記工具は、前記有効域工具部を中心として、前記
不要域工具部がその両脇に接合されていてもよい。Further, for example, in the tool, the unnecessary area tool part may be joined to both sides of the tool centering on the effective area tool part.
【0040】上記構成によれば、工具を、有効域工具部
を中心として、不要域工具部がその両脇に接合されてい
るものとしているので、加工の開始、加工方向の切り換
え及び加工の終了の際の金型の除去量をより一層適切に
減少させることができ、ヤトイを使用することなく、短
時間に加工して損耗やダメージを抑制しつつ、有効域で
の加工を高精度に行うことができるとともに、有効域外
での削りすぎで光学的な有効域が狭くなることを防止し
て、所望の形状精度で効率的に金型を加工することがで
きる。According to the above configuration, the tool is configured such that the unnecessary area tool part is joined to both sides of the effective area tool part with the center as the center, so that the processing is started, the processing direction is switched, and the processing is ended. In this case, the amount of removal of the mold can be reduced more appropriately, and processing can be performed in a short period of time without using a toy, and processing in the effective area can be performed with high accuracy while suppressing wear and tear. In addition to this, it is possible to prevent the optical effective area from being narrowed by excessive shaving outside the effective area, and to efficiently process the mold with desired shape accuracy.
【0041】請求項11記載の発明の金型は、所定の軸
を中心として回転される工具に対して所定のツールパス
に沿って相対移動されて、前記工具の加工作用面で加工
される光学素子用の金型において、前記ツールパスとし
て、前記工具の加工作用面が前記金型の外周エッジに接
触しない位置であって、かつ、前記金型の光学的な有効
域外で、前記加工の開始、加工方向の切り換え及び前記
加工の終了を行う移動経路が設定されて加工されている
ことにより、上記目的を達成している。According to a twelfth aspect of the present invention, there is provided an optical tool which is relatively moved along a predetermined tool path with respect to a tool which is rotated about a predetermined axis, and is processed on a working surface of the tool. In the mold for an element, as the tool path, a position where the working surface of the tool is not in contact with the outer peripheral edge of the mold, and the start of the machining outside the optically effective area of the mold. The above object is achieved by performing the processing by setting a moving path for switching the processing direction and ending the processing.
【0042】上記構成によれば、所定の軸を中心として
回転される工具に対して所定のツールパスに沿って相対
移動して、工具の加工作用面で加工するに際して、ツー
ルパスとして、工具の加工作用面が金型の外周エッジに
接触しない位置であって、かつ、金型の光学的な有効域
外で、加工の開始、加工方向の切り換え及び加工の終了
を行う移動経路を設定して加工しているので、ヤトイを
使用することなく、また、短時間の加工で工具に損耗や
ダメージを与えることを防止することができるととも
に、所望の形状精度で効率的に加工され、高精度な光学
素子を成形することができる。According to the above arrangement, when the tool is relatively moved along a predetermined tool path with respect to a tool rotated about a predetermined axis and is machined on the working surface of the tool, the tool path is defined as a tool path. Processing is performed by setting a movement path for starting processing, switching a processing direction, and ending processing, at a position where the working surface does not contact the outer peripheral edge of the mold and outside the optically effective area of the mold. As a result, it is possible to prevent the tool from being worn or damaged in a short period of time without using a toy, and to efficiently process with the desired shape accuracy, and to achieve high-precision optics. The element can be molded.
【0043】[0043]
【発明の実施の形態】以下、本発明の好適な実施の形態
を添付図面に基づいて詳細に説明する。なお、以下に述
べる実施の形態は、本発明の好適な実施の形態であるか
ら、技術的に好ましい種々の限定が付されているが、本
発明の範囲は、以下の説明において特に本発明を限定す
る旨の記載がない限り、これらの態様に限られるもので
はない。Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. It should be noted that the embodiments described below are preferred embodiments of the present invention, and therefore, various technically preferable limitations are added. However, the scope of the present invention is not limited to the following description. The embodiments are not limited to these embodiments unless otherwise specified.
【0044】図1〜図3は、本発明の加工方法、加工装
置、工具及び金型の第1の実施の形態を示す図であり、
図1は、本発明の加工方法、加工装置、工具及び金型の
第1の実施の形態を適用した加工装置10の要部正面図
である。FIGS. 1 to 3 are views showing a first embodiment of a processing method, a processing apparatus, a tool and a mold according to the present invention.
FIG. 1 is a front view of a main part of a processing apparatus 10 to which a first embodiment of a processing method, a processing apparatus, a tool, and a mold according to the present invention is applied.
【0045】図1において、加工装置10は、モータ1
1の回転軸11aの先端に工具12が取り付けられてお
り、工具12は、例えば、球状の研削砥石が用いられて
いる。モータ11は、工具12をその回転軸11aの周
りに所定の回転速度で回転駆動する。In FIG. 1, a processing apparatus 10 includes a motor 1
A tool 12 is attached to the tip of one rotating shaft 11a, and the tool 12 is, for example, a spherical grinding wheel. The motor 11 drives the tool 12 to rotate around a rotation axis 11a thereof at a predetermined rotation speed.
【0046】工具12は、例えば、砥石として、粒度♯
8000のダイヤモンド砥粒を用いた研削砥石等が使用
される。The tool 12 is, for example, a grindstone having a particle size
A grinding wheel using 8000 diamond abrasive grains is used.
【0047】加工装置10は、工具12と図示しないテ
ーブル上に設置された加工対象である金型13との相対
位置を調整しながら、回転する工具12により金型13
を加工する。The processing apparatus 10 adjusts the relative position between the tool 12 and a mold 13 to be machined set on a table (not shown) while rotating the mold 13 with the rotating tool 12.
To process.
【0048】金型13は、樹脂レンズやミラー等の光学
素子を作製するのに使用され、通常、光学素子では、そ
の光学面は1つの面内で光学的有効域(光学的な有効
域)とその外側の光学的不要域を設定して設計製作され
る。これは、樹脂を成形して光学面を形成する際、光学
面の輪郭稜線まで精度を確保するのが困難なためであ
る。The mold 13 is used for producing an optical element such as a resin lens or a mirror, and the optical surface of the optical element is usually an optically effective area (optically effective area) in one plane. It is designed and manufactured by setting the optically unnecessary area outside of it. This is because when forming an optical surface by molding a resin, it is difficult to ensure accuracy up to the contour ridge of the optical surface.
【0049】したがって、光学素子を作製する金型13
は、光学素子の光学的有効域と光学的不要域となる領域
が存在し、例えば、図2で、金型13の加工面上に、二
点差線で示す境界線Lの内側が、光学的有効域Aiであ
り、境界線Lの外側が、光学的不要域Aoである。Therefore, the mold 13 for producing the optical element
In FIG. 2, there is a region serving as an optically effective region and an optically unnecessary region of the optical element. For example, in FIG. The effective area Ai, and the area outside the boundary line L is the optically unnecessary area Ao.
【0050】次に、本実施の形態の作用を説明する。加
工装置10は、工具12で金型13の加工を行う際、工
具12の加工作用部が金型13の外周エッジに接触しな
い位置であって、かつ、光学的有効域Aiの外側、すな
わち、光学的不要域Aoで、工具12による金型13の
加工の開始、終了及び加工方向の切り換えを行って加工
するすなわち、加工装置10は、工具12で金型13の
加工を行う際、球状の工具12を、その回転軸11aを
所定角度傾斜させて金型13に接触させるとともに、図
2に破線で示すようなツールパス14で工具12と金型
13を相対移動させて金型13を工具12で加工する。Next, the operation of the present embodiment will be described. When processing the die 13 with the tool 12, the processing device 10 is located at a position where the processing action portion of the tool 12 does not contact the outer peripheral edge of the die 13, and outside the optically effective area Ai, that is, In the optically unnecessary area Ao, processing is performed by starting and ending the processing of the mold 13 by the tool 12 and switching the processing direction. That is, when the processing of the mold 13 is performed by the tool 12, The tool 12 is brought into contact with the mold 13 with its rotating shaft 11a inclined at a predetermined angle, and the tool 12 and the mold 13 are relatively moved by a tool path 14 shown by a broken line in FIG. Process at 12.
【0051】このツールパス14は、図2に示すよう
に、例えば、金型13の図2で境界線Lよりも外側の左
上端位置を加工開始位置Psとして、工具12による金
型13の加工を開始し、金型13の両サイドの図2の境
界線Lよりも外側の光学的不要域Aoにある方向切換位
置Phで工具12による金型13の加工方向の切り換え
を行う。As shown in FIG. 2, the tool path 14 is formed by, for example, machining the mold 13 with the tool 12 by setting the upper left position of the mold 13 outside the boundary line L in FIG. Is started, and the machining direction of the mold 13 is switched by the tool 12 at the direction switching position Ph located outside the boundary line L in FIG. 2 on both sides of the mold 13 in the optically unnecessary area Ao.
【0052】すなわち、工具12による金型13の加工
を、加工開始位置Psから金型13の幅方向に開始し、
境界線Lよりも外側の右側の光学的不要域Aoである方
向切換位置Phまで加工を行うと、工具12と金型13
の相対移動方向を縦方向に変更して加工方向の切り換え
を行って、所定のピッチ分だけ縦方向に工具12と金型
13の相対位置を移動させ、当該位置を方向切換位置P
hとして工具12と金型13の相対移動方向を幅方向に
変更して、再度、工具12による金型13の加工を行
う。That is, the machining of the mold 13 by the tool 12 is started in the width direction of the mold 13 from the machining start position Ps,
When processing is performed to the direction switching position Ph which is the optically unnecessary area Ao on the right side outside the boundary line L, the tool 12 and the mold 13
Is changed to the vertical direction to switch the machining direction, and the relative position of the tool 12 and the mold 13 is moved in the vertical direction by a predetermined pitch, and the position is changed to the direction switching position P.
As h, the relative movement direction of the tool 12 and the mold 13 is changed in the width direction, and the machining of the mold 13 by the tool 12 is performed again.
【0053】加工装置10は、工具12で金型13の左
側の光学的不要域Aoである方向切換位置Phまで加工
を行うと、工具12と金型13の相対移動方向を縦方向
に変更して加工方向の切り換えを行って、所定のピッチ
分だけ縦方向に工具12と金型13の相対位置を移動さ
せ、当該位置を方向切換位置Phとして工具12と金型
13の相対移動方向を幅方向に変更して、再度、工具1
2による金型13の加工を行う。When processing is performed by the tool 12 to the direction switching position Ph which is the optically unnecessary area Ao on the left side of the mold 13 with the tool 12, the relative movement direction of the tool 12 and the mold 13 is changed to the vertical direction. The relative position between the tool 12 and the mold 13 is moved in the vertical direction by a predetermined pitch in the vertical direction, and the relative position in the relative movement direction between the tool 12 and the mold 13 is set as the direction switching position Ph. Change the direction, and again
Processing of the mold 13 by 2 is performed.
【0054】上記工具12と金型13の相対移動を図2
に示すツールパス14に沿って行って、工具12による
金型13の加工を順次行い、工具12と金型13の相対
位置が加工終了位置Poまでくると、加工を終了する。The relative movement between the tool 12 and the mold 13 is shown in FIG.
When the relative position between the tool 12 and the mold 13 reaches the machining end position Po, the machining is finished.
【0055】そして、上述のように、工具12は、金型
13の加工面を移動する際に、金型13の外周エッジに
接触しない位置をツールパス14として移動している。As described above, when the tool 12 moves on the processing surface of the mold 13, the tool 12 moves as a tool path 14 at a position not in contact with the outer peripheral edge of the mold 13.
【0056】このように、本実施の形態の加工装置10
は、工具12で金型13を加工するに際して、工具12
は、金型13に対して金型13の外周エッジに接触しな
い位置であって、かつ、金型13の加工の開始、終了、
あるいは、加工方向の切り換えを、光学的有効域Ai外
の光学的不要域Aoで行っている。As described above, the processing apparatus 10 of the present embodiment
When machining the mold 13 with the tool 12,
Is a position where the outer peripheral edge of the mold 13 is not in contact with the mold 13 and the start, end, and
Alternatively, the processing direction is switched in the optically unnecessary area Ao outside the optically effective area Ai.
【0057】したがって、金型13は、図4に示した従
来の加工装置で加工した金型1のように、境界線L付近
に溝3が形成されることなく、図3に示すように、境界
線Lを挟んで、光学的有効域Aiから光学的不要域Ao
に滑らかな加工面を高精度に形成することができる。Therefore, unlike the mold 1 machined by the conventional machining apparatus shown in FIG. 4, the mold 13 is not formed with the groove 3 near the boundary line L, as shown in FIG. From the optically effective area Ai to the optically unnecessary area Ao across the boundary line L
A highly smooth processed surface can be formed with high precision.
【0058】そして、金型13を加工する際、加工装置
10は、工具12の回転数を、光学的有効域Aiでは、
光学的有効域Aiを所望の加工精度を得るのに最適な回
転数、例えば、2500rpmに制御し、光学的不要域
Aoでは、回転数に対する除去深さの関係を実験で求め
た回転数、例えば、300rpmに制御するようにして
もよい。When the mold 13 is machined, the machining apparatus 10 controls the rotation speed of the tool 12 in the optically effective area Ai.
The optically effective area Ai is controlled to the optimum rotational speed for obtaining a desired processing accuracy, for example, 2500 rpm, and in the optically unnecessary area Ao, the relationship between the rotational speed and the removal depth is experimentally obtained, for example, the rotational speed. , 300 rpm.
【0059】この工具12の回転数は、光学的有効域A
iから光学的不要域Aoに工具12が移動した際に、光
学的有効域Aiの回転数から光学的不要域Aoの回転数
に急に切り換えることができないため、工具12が光学
的有効域Aiから光学的不要域Aoに移動した後、ある
いは、工具12が光学的不要域Aoから光学的有効域A
iに移動する手前で、光学的不要域Aoにおいて速やか
にかつ連続的に移行させる。なお、この工具12の回転
数の切り換えを、加工開始位置Ps、方向切換位置Ph
及び加工終了位置Poで行うようにしてもよい。The number of revolutions of the tool 12 is determined by the optical effective area A
When the tool 12 moves from i to the optically unnecessary area Ao, the rotational speed of the optically effective area Ai cannot be suddenly switched from the rotational speed of the optically unnecessary area Ao to the optically effective area Ao. From the optically unnecessary area Ao to the optically unnecessary area Ao, or the tool 12 moves from the optically unnecessary area Ao to the optically effective area Ao.
Prior to moving to i, the transition is made quickly and continuously in the optically unnecessary area Ao. The switching of the rotation speed of the tool 12 is performed by changing the processing start position Ps and the direction switching position Ph.
And at the processing end position Po.
【0060】このようにすると、加工の開始、加工方向
の切り換え及び加工の終了の際の工具12による金型1
3の除去量を減少させることができ、金型13の光学的
不要域Aoでの削りすぎで光学的有効域Aiが狭くなる
ことを防止して、金型13をより一層良好な形状精度で
加工することができる。In this manner, the mold 1 by the tool 12 at the start of machining, switching of the machining direction, and the end of machining.
3 can be reduced, and the optical effective area Ai is prevented from being narrowed due to excessive shaving of the mold 13 in the optically unnecessary area Ao, and the mold 13 can be formed with better shape accuracy. Can be processed.
【0061】さらに、工具12として本実施の形態のよ
うな球状の工具12使用し、図1に示したように、工具
軸である回転軸11aを所定角度傾斜させて加工する場
合、工具12のうち、図1の左側の領域の加工を行う際
に関与する部分の収束が、右側の領域の加工を行う際に
関与する部分の収束よりも大きい。Further, when a spherical tool 12 as in the present embodiment is used as the tool 12 and as shown in FIG. Of these, the convergence of the part involved in processing the left area of FIG. 1 is greater than the convergence of the part involved in processing the right area.
【0062】そのため、このような工具12の加工に関
与する部分の収束差が金型13の全面で生じないように
工具12の回転数の制御を行うと、より一層高精度に金
型13の加工を行うことができる。Therefore, if the rotation speed of the tool 12 is controlled so that such a difference in convergence of the parts involved in the processing of the tool 12 does not occur on the entire surface of the mold 13, the mold 13 can be more precisely controlled. Processing can be performed.
【0063】この場合、例えば、図1の左側の光学的不
要域Aoを加工する際の工具12の回転数よりも右側の
光学的不要域Aoを加工する際の回転数の方を若干速く
設定すると、傾斜して使用する工具12の収束差の影響
を抑制することができる。In this case, for example, the number of revolutions for machining the right optical unnecessary area Ao is set slightly faster than the number of revolutions of the tool 12 for machining the left optical unnecessary area Ao in FIG. Then, the influence of the convergence difference of the tool 12 used inclining can be suppressed.
【0064】また、加工装置10は、金型13の加工に
おいて、図示しない荷重付加機構により工具12に所定
の荷重を垂直方向に付加して、加工を行うようにしても
よい。In the processing of the mold 13, the processing device 10 may perform processing by applying a predetermined load to the tool 12 in the vertical direction by a load applying mechanism (not shown).
【0065】この場合、光学的有効域Aiにおいては、
荷重付加機構により、光学的有効域Aiを所望の加工精
度を得るのに最適な荷重、例えば、100gfに制御
し、光学的不要域Aoでは、荷重に対する除去深さの関
係を実験で求めた荷重、例えば、50gfに制御する。In this case, in the optically effective area Ai,
By the load applying mechanism, the optical effective area Ai is controlled to a load optimal for obtaining a desired processing accuracy, for example, 100 gf. In the optically unnecessary area Ao, the load obtained by experimentally determining the relationship between the load and the removal depth is measured. , For example, 50 gf.
【0066】この荷重の設定方法としては、例えば、一
般的に知られているPrestonの経験則を用いて設
定することができる。このPrestonの経験則は、
研磨量hを、金属材質や工具等による定数p、研磨圧
v、金型13と工具12の相対速度及び研磨時間(研磨
回数)から次式(1)で算出する。As a method of setting the load, for example, the load can be set using Preston's rule of thumb generally known. Preston's rule of thumb is:
The polishing amount h is calculated by the following equation (1) from a constant p based on a metal material or a tool, a polishing pressure v, a relative speed between the mold 13 and the tool 12, and a polishing time (polishing times).
【0067】h=k×p×v×t・・・(1) この荷重の切換は、境界線L上で行うようにしてもよ
い。H = k × p × v × t (1) The switching of the load may be performed on the boundary line L.
【0068】このように荷重付加機構により、光学的有
効域Aiにおいて、光学的有効域Aiを所望の加工精度
を得るのに最適な荷重に制御し、光学的不要域Aoで
は、荷重に対する除去深さの関係を実験で求めた荷重に
制御して、金型13の加工を行うと、金型13を、図4
に示した従来の加工装置で加工した金型1のように、境
界線L付近に溝3が形成されることなく、図3に示した
ように、境界線Lを挟んで、光学的有効域Aiから光学
的不要域Aoにより一層滑らかな加工面を高精度に形成
することができる。As described above, the load applying mechanism controls the optical effective area Ai in the optical effective area Ai to the optimum load for obtaining a desired processing accuracy, and the optical unnecessary area Ao sets the removal depth for the load. When the mold 13 is processed by controlling the relationship of the height to the load obtained by the experiment, the mold 13 is moved to the position shown in FIG.
As shown in FIG. 3, the groove 3 is not formed near the boundary line L as in the mold 1 processed by the conventional processing apparatus shown in FIG. A smoother processed surface can be formed with high precision from Ai to the optically unnecessary area Ao.
【0069】さらに、加工装置10で金型13を加工す
る場合、光学的不要域Aoの所定領域、例えば、境界線
Lを境として光学的不要域Aoの全ての領域を所定のマ
ジックインキでマスキング、あるいは、光学的不要域A
oのうち、加工開始位置Ps、方向切換位置Ph及び加
工終了位置Poを境としてその外側の光学的不要域Ao
を所定のマジックインキでマスキングしてもよい。Further, when the mold 13 is processed by the processing apparatus 10, a predetermined area of the optically unnecessary area Ao, for example, all areas of the optically unnecessary area Ao with the boundary line L as a boundary are masked with a predetermined magic ink. Or optically unnecessary area A
o, the optically unnecessary area Ao outside the processing start position Ps, the direction switching position Ph, and the processing end position Po
May be masked with a predetermined magic ink.
【0070】このマジックインキとしては、金型13の
工具12による加工量を減少させるとともに、光学的有
効域Aiでの加工に悪影響を与えず、加工後に容易に除
去できるものであれば、適宜使用することができる。As the magic ink, any ink can be used as long as it reduces the amount of processing by the tool 12 of the mold 13 and does not adversely affect the processing in the optically effective area Ai and can be easily removed after processing. can do.
【0071】このように光学的不要域Aoをマジックイ
ンキでマスキングすることにより、光学的不要域Aoで
の工具12による金型13の除去量をより一層減少させ
ることができ、金型13を、図4に示した従来の加工装
置で加工した金型1のように、境界線L付近に溝3が形
成されることなく、図3に示したように、境界線Lを挟
んで、光学的有効域Aiから光学的不要域Aoにより一
層滑らかな加工面を高精度に形成することができる。As described above, by masking the optically unnecessary area Ao with the magic ink, the removal amount of the mold 13 by the tool 12 in the optically unnecessary area Ao can be further reduced. Unlike the mold 1 processed by the conventional processing apparatus shown in FIG. 4, the groove 3 is not formed near the boundary line L, and as shown in FIG. From the effective area Ai to the optically unnecessary area Ao, a smoother processed surface can be formed with high precision.
【0072】なお、上記工具12の回転数の制御、工具
12への荷重の付加及びマジックインキでの光学的不要
域Aoのマスキングは、それぞれ2つの方法あるいは全
ての方法を組み合わせて行ってもよい。The control of the number of revolutions of the tool 12, the application of a load to the tool 12, and the masking of the optically unnecessary area Ao with magic ink may be performed by two methods or by a combination of all methods. .
【0073】〈実験例1〉上記第1の実施の形態と同様
の加工装置10を用いて金型13の研削加工を行った。
工具12としては、球状の研削砥石を用い、砥石には、
粒度♯8000のダイヤモンド砥粒を使用したものを用
いた。<Experimental Example 1> The mold 13 was ground by using the same processing apparatus 10 as in the first embodiment.
As the tool 12, a spherical grinding wheel is used.
The one using diamond abrasive grains having a particle size of ♯8000 was used.
【0074】この工具12を用いて、モータ11の回転
軸11a(工具12の回転軸)を所定角度傾斜させ、上
記金型13を図2に示したようなツールパス14で工具
12と金型13を相対移動させて、研削加工を行った。
このとき、工具12の回転数を、光学的有効域Aiで
は、2500rpmとし、光学的不要域Aoでは、30
0rpmとした。また、この工具12の回転数の切り換
えを、加工開始位置Ps、方向切換位置Ph及び加工終
了位置Poで、連続的に行った。Using the tool 12, the rotating shaft 11a of the motor 11 (the rotating shaft of the tool 12) is inclined by a predetermined angle, and the mold 13 is moved by the tool path 14 as shown in FIG. 13 was relatively moved to perform grinding.
At this time, the rotation speed of the tool 12 is 2500 rpm in the optically effective area Ai, and 30 in the optically unnecessary area Ao.
It was set to 0 rpm. The switching of the rotation speed of the tool 12 was continuously performed at the processing start position Ps, the direction switching position Ph, and the processing end position Po.
【0075】この実験の結果、金型13を、ヤトイを用
いることなく、上記図3に示したように、境界線L付近
に溝が形成されることなく、光学的有効域Aiから光学
的不要域Aoへと滑らかな高精度な研削加工を行うこと
ができた。As a result of this experiment, as shown in FIG. 3, no groove was formed near the boundary line L, and the mold 13 was not optically required from the optically effective area Ai. Smooth, high-precision grinding could be performed on the region Ao.
【0076】〈実験例2〉上記第1の実施の形態と同様
の加工装置10を用いて金型13の研削加工を行った。
工具12としては、遊離砥粒を保持可能な球状の発泡ポ
リウレタンを使用し、砥粒として、遊離砥粒である粒径
2μm以下の微細なダイヤモンドパウダーを使用した。<Experimental Example 2> The mold 13 was ground by using the same processing apparatus 10 as in the first embodiment.
As the tool 12, spherical polyurethane foam capable of holding free abrasive grains was used, and as the abrasive grains, fine diamond powder having a particle diameter of 2 μm or less, which is free abrasive grains, was used.
【0077】この工具12を用いて、モータ11の回転
軸11a(工具12の回転軸)を所定角度傾斜させ、上
記金型13を図2に示したようなツールパス14で工具
12と金型13を相対移動させて、研削加工を行った。Using this tool 12, the rotating shaft 11a of the motor 11 (the rotating shaft of the tool 12) is inclined at a predetermined angle, and the mold 13 is moved by the tool path 14 as shown in FIG. 13 was relatively moved to perform grinding.
【0078】このとき、工具12に荷重付加機構により
工具12に所定の荷重を垂直方向に付加して、加工を行
った。At this time, machining was performed by applying a predetermined load to the tool 12 in the vertical direction by the load applying mechanism.
【0079】付加する荷重としては、光学的有効域Ai
においては、光学的有効域Aiを所望の加工精度を得る
のに最適な荷重として、100gfを付加し、光学的不
要域Aoでは、特に、加工開始位置Ps、方向切換位置
Ph及び加工終了位置Poでは、上記式(1)式で求め
た荷重である50gfを付加した。The load to be applied is the optically effective area Ai
, 100 gf is added to the optically effective area Ai as an optimal load for obtaining desired processing accuracy. In the optically unnecessary area Ao, particularly, the processing start position Ps, the direction switching position Ph, and the processing end position Po Then, 50 gf, which is the load determined by the above equation (1), was added.
【0080】この実験の結果、金型13を、ヤトイを用
いることなく、上記図3に示したように、境界線L付近
に溝が形成されることなく、光学的有効域Aiから光学
的不要域Aoへと滑らかな高精度な研削加工を行うこと
ができた。As a result of this experiment, as shown in FIG. 3, no groove was formed near the boundary line L, and the optical mold 13 was not optically required from the optically effective area Ai without using a die. Smooth, high-precision grinding could be performed on the region Ao.
【0081】〈実験例3〉上記第1の実施の形態と同様
の加工装置10を用いて金型13の研削加工を行った。
工具12としては、遊離砥粒を保持可能な球状の発泡ポ
リウレタンを使用し、砥粒として、遊離砥粒である粒径
1μm以下の微細なダイヤモンドパウダーを使用した。<Experimental Example 3> Grinding of the mold 13 was performed using the same processing apparatus 10 as in the first embodiment.
As the tool 12, spherical polyurethane foam capable of holding free abrasive grains was used, and as abrasive grains, fine diamond powder having a particle diameter of 1 μm or less, which is free abrasive grains, was used.
【0082】さらに、研削加工する金型13の境界線L
を境とした光学的不要域Aoの全ての領域を上記マジッ
クインキでマスキングした。Further, the boundary line L of the mold 13 to be ground is
The entire area of the optically unnecessary area Ao from the boundary was masked with the above-mentioned magic ink.
【0083】そして、工具12を用いて、モータ11の
回転軸11a(工具12の回転軸)を所定角度傾斜さ
せ、上記マジックインキでマスキングした金型13を図
2に示したようなツールパス14で工具12と金型13
を相対移動させて、研削加工を行った。マジックインキ
により、光学的不要域Aoでの工具12による金型13
の除去量を減少させることができた。Then, using the tool 12, the rotating shaft 11a of the motor 11 (the rotating shaft of the tool 12) is inclined at a predetermined angle, and the mold 13 masked with the above-mentioned magic ink is used as a tool path 14 as shown in FIG. Tool 12 and mold 13
Was relatively moved to perform grinding. Mold 13 with tool 12 in optically unnecessary area Ao by magic ink
Could be reduced.
【0084】この実験の結果、金型13を、ヤトイを用
いることなく、上記図3に示したように、境界線L付近
に溝が形成されることなく、光学的有効域Aiから光学
的不要域Aoへと滑らかな高精度な研削加工を行うこと
ができた。As a result of this experiment, as shown in FIG. 3, no groove was formed near the boundary line L, and the mold 13 was not optically required from the optically effective area Ai. Smooth, high-precision grinding could be performed on the region Ao.
【0085】図4は、本発明の加工方法、加工装置、工
具及び金型の第2の実施の形態を示す図であり、図2
は、本発明の加工方法、加工装置、工具及び金型の第2
の実施の形態を適用した加工装置20の要部正面図であ
る。FIG. 4 is a view showing a processing method, a processing apparatus, a tool and a mold according to a second embodiment of the present invention.
The second of the processing method, processing apparatus, tool and mold of the present invention
It is a principal part front view of the processing apparatus 20 to which Embodiment 1 is applied.
【0086】図4において、加工装置20は、モータ2
1の回転軸21aの先端に工具22が取り付けられてお
り、工具22は、例えば、タイヤ形状の研削砥石が用い
られている。モータ21は、工具22をその回転軸21
aの周りに所定の回転速度で回転駆動する。なお、工具
22は、タイや形状に限るものではなく、例えば、球状
であってもよい。In FIG. 4, the processing device 20 includes a motor 2
A tool 22 is attached to the tip of one rotating shaft 21a, and the tool 22 is, for example, a tire-shaped grinding wheel. The motor 21 moves the tool 22 to its rotating shaft 21.
It is rotationally driven at a predetermined rotational speed around a. The tool 22 is not limited to a tie or a shape, and may be, for example, a sphere.
【0087】加工装置20は、工具22と図示しないテ
ーブル上に設置された加工対象である上記第1の実施の
形態と同様の金型13との相対位置を調整しながら、回
転する工具22により金型13を加工する。The processing apparatus 20 adjusts the relative position between the tool 22 and the mold 13 similar to that of the first embodiment, which is a processing object set on a table (not shown), by the rotating tool 22. The mold 13 is processed.
【0088】金型13は、上記第1の実施の形態と同様
に、樹脂レンズやミラー等の光学素子を作製するの場合
の金型として使用され、図2に示したように、光学的有
効域Aiと光学的不要域Aoが存在し、その境界が境界
線Lとなっている。The mold 13 is used as a mold for producing optical elements such as a resin lens and a mirror, as in the first embodiment, and as shown in FIG. An area Ai and an optically unnecessary area Ao exist, and the boundary between them is a boundary line L.
【0089】そして、工具22は、その工具軸であるモ
ータ21の回転軸21aが金型13の加工面に対して略
平行になるように配設されており、この状態において、
工具22は、金型13の光学的有効域Aiでの加工に関
与する有効域工具部22aと、金型13の光学的不要域
Aoでの加工に関与する不要域工具部22bと、を有し
ている。The tool 22 is disposed so that the rotating shaft 21a of the motor 21, which is the tool axis thereof, is substantially parallel to the machining surface of the mold 13. In this state,
The tool 22 has an effective area tool part 22a involved in machining of the mold 13 in the optically effective area Ai and an unnecessary area tool part 22b involved in machining of the mold 13 in the optically unnecessary area Ao. are doing.
【0090】この工具22は、その有効域工具部22a
が、光学的有効域Aiを研磨加工するのに適した切れ味
の砥石、例えば、砥粒の集中度が100(砥粒の体積比
率が25vol%)の砥石で形成されており、その不要
域工具部22bが、有効域工具部22aの切れ味よりも
所定量切れ味の落ちる砥石、例えば、砥粒の集中度が2
0(砥粒の体積比が5vol%)の砥石で形成されてい
る。工具22は、上記有効域工具部22aを真ん中に挟
んで、有効域工具部22aの両側に不要域工具部22b
が接合された状態で形成されている。The tool 22 has an effective area tool portion 22a.
However, it is formed of a sharpening stone suitable for polishing the optically effective area Ai, for example, a grinding stone having a concentration of abrasive grains of 100 (volume ratio of abrasive grains is 25 vol%). The part 22b has a sharpness of a predetermined amount less than the sharpness of the effective area tool part 22a, for example, the degree of concentration of abrasive grains is 2
It is formed with a grinding stone of 0 (volume ratio of abrasive grains is 5 vol%). The tool 22 includes an unnecessary area tool part 22b on both sides of the effective area tool part 22a with the effective area tool part 22a interposed therebetween.
Are formed in a joined state.
【0091】工具22は、上記有効域工具部22aと不
要域工具部22bの接合位置を、金型13の光学的不要
域Aoと工具22の不要域工具部22bが一致する位
置、すなわち、境界線Lに一致する位置に設定して、形
成されている。なお、有効域工具部22aと不要域工具
部22bの接合位置は、境界線Lに一致する位置に設定
するものに限るものではなく、適宜変更してもよい。The tool 22 determines the joining position of the effective area tool part 22a and the unnecessary area tool part 22b at the position where the optical unnecessary area Ao of the mold 13 and the unnecessary area tool part 22b of the tool 22 coincide, that is, the boundary. It is formed at a position corresponding to the line L. In addition, the joining position of the effective area tool part 22a and the unnecessary area tool part 22b is not limited to the one set at the position coinciding with the boundary line L, and may be changed as appropriate.
【0092】次に、本実施の形態の作用を説明する。加
工装置20は、上記第1の実施の形態と同様に、工具2
2で金型13の加工を行う際、工具22が金型13の外
周エッジに接触しない位置であって、かつ、光学的有効
域Aiの外側、すなわち、光学的不要域Aoで、工具2
2による金型13の加工の開始、終了、あるいは、加工
方向の切り換えを行って加工するすなわち、加工装置2
0は、工具22で金型13の加工を行う際、タイヤ形状
の工具22を、その回転軸11aを金型13の加工面と
略平行にさせて金型13に接触させるとともに、図2に
破線で示したようなツールパス14でタイヤ形状の工具
22の面方向(周方向と直角の方向)に、工具22と金
型13を相対移動させて金型13を工具22で加工す
る。Next, the operation of the present embodiment will be described. The processing device 20 includes a tool 2 as in the first embodiment.
When machining the mold 13 with the tool 2, the tool 2 is located at a position where the tool 22 does not contact the outer peripheral edge of the mold 13 and outside the optically effective area Ai, that is, at the optically unnecessary area Ao.
2 to start and end the processing of the mold 13 or switch the processing direction to perform processing, that is, the processing apparatus 2
0, when processing the mold 13 with the tool 22, the tire-shaped tool 22 is brought into contact with the mold 13 with the rotation axis 11 a of the tire 22 being substantially parallel to the processing surface of the mold 13, and FIG. The tool 13 is machined by the tool 22 by relatively moving the tool 22 and the mold 13 in a plane direction (a direction perpendicular to the circumferential direction) of the tire-shaped tool 22 by a tool path 14 indicated by a broken line.
【0093】具体的には、工具22による金型13の加
工を、加工開始位置Psから金型13の幅方向に開始
し、境界線Lよりも外側の右側の光学的不要域Aoであ
る方向切換位置Phまで加工を行うと、工具22と金型
13の相対移動方向を縦方向に変更して加工方向の切り
換えを行って、所定のピッチ分だけ縦方向に工具22と
金型13の相対位置を移動させ、当該位置を方向切換位
置Phとして工具22と金型13の相対移動方向を幅方
向に変更して、再度、工具22による金型13の加工を
行う。More specifically, machining of the mold 13 by the tool 22 is started from the machining start position Ps in the width direction of the mold 13 and is directed to the right side of the optically unnecessary area Ao outside the boundary line L. When the machining is performed up to the switching position Ph, the relative movement direction of the tool 22 and the mold 13 is changed to the vertical direction to switch the machining direction, and the relative movement of the tool 22 and the mold 13 is vertically shifted by a predetermined pitch. The position is moved, the position is set as the direction switching position Ph, the relative movement direction of the tool 22 and the mold 13 is changed in the width direction, and the machining of the mold 13 by the tool 22 is performed again.
【0094】工具22が金型13の左側の光学的不要域
Aoである方向切換位置Phまで加工を行うと、工具2
2と金型13の相対移動方向を縦方向に変更して加工方
向の切り換えを行って、所定のピッチ分だけ縦方向に工
具22と金型13の相対位置を移動させると、当該位置
を方向切換位置Phとして工具22と金型13の相対移
動方向を幅方向に変更して、再度、工具22による金型
13の加工を行う。When the tool 22 performs machining to the direction switching position Ph which is the optically unnecessary area Ao on the left side of the mold 13, the tool 2
When the relative movement direction of the tool 2 and the mold 13 is changed to the vertical direction and the processing direction is switched, and the relative position of the tool 22 and the mold 13 is moved in the vertical direction by a predetermined pitch, the position is changed to the direction. The relative movement direction of the tool 22 and the mold 13 is changed in the width direction as the switching position Ph, and the machining of the mold 13 by the tool 22 is performed again.
【0095】上記工具22と金型13の相対移動を図2
に示したツールパス14に沿って行って、工具22によ
る金型13の加工を順次行い、工具22と金型13の相
対位置が加工終了位置Poまでくると、加工を終了す
る。The relative movement between the tool 22 and the mold 13 is shown in FIG.
The tool 13 is sequentially machined by the tool 22 along the tool path 14 shown in (1). When the relative position between the tool 22 and the mold 13 reaches the machining end position Po, the machining is finished.
【0096】そして、上述のように、工具22は、有効
域工具部22aを真ん中に挟んで、有効域工具部22a
の両側に不要域工具部22bが接合された状態で形成さ
れており、その有効域工具部22aが、光学的有効域A
iを研磨加工するのに適した切れ味の砥石、例えば、砥
粒の集中度が100の砥石で形成され、また、その不要
域工具部22bが、有効域工具部22aの切れ味よりも
所定量切れ味の落ちる砥石、例えば、砥粒の集中度が2
0の砥石で形成されている。さらに、工具22は、金型
13の加工面を移動する際に、金型13の外周エッジに
接触しない位置をツールパス14として移動している。Then, as described above, the tool 22 is located between the effective area tool part 22a and the effective area tool part 22a.
The unnecessary area tool portion 22b is formed in a state where the unnecessary area tool portion 22b is joined to both sides of the optical effective area A.
i is formed of a grindstone having a sharpness suitable for polishing, for example, a grindstone having an abrasive concentration of 100, and the unnecessary area tool portion 22b is sharper than the effective area tool portion 22a by a predetermined amount. Grinding stones, for example, the concentration of abrasive grains is 2
It is formed with a 0 whetstone. Further, when the tool 22 moves on the processing surface of the mold 13, the tool 22 moves as a tool path 14 at a position that does not contact the outer peripheral edge of the mold 13.
【0097】したがって、金型13は、図4に示した従
来の加工装置で加工した金型1のように、境界線L付近
に溝3が形成されることなく、図3に示したように、境
界線Lを挟んで、光学的有効域Aiから光学的不要域A
oに滑らかな加工面を高精度に形成することができると
ともに、光学的不要域Aoの加工の除去量をより一層低
減することができる。Therefore, unlike the mold 1 machined by the conventional machining apparatus shown in FIG. 4, the mold 13 is not formed with the groove 3 near the boundary line L, as shown in FIG. From the optically effective area Ai to the optically unnecessary area A across the boundary line L.
It is possible to form a smooth machined surface with a high degree of accuracy and to further reduce the amount of removal of the machining of the optically unnecessary area Ao.
【0098】なお、本実施の形態においては、工具22
としては、上記ダイヤモンド砥粒の砥石に限るものでは
なく、例えば、有効域工具部22aを遊離砥粒を保持可
能な発泡ポリウレタンで形成し、不要域工具部22bを
遊離砥粒を保持しない非発泡ポリウレタンで形成して、
これらの有効域工具部22aと不要域工具部22bを接
合したものとし、砥粒として、例えば、粒径2μm以下
のダイヤモンドパウダーを使用してもよい。In this embodiment, the tool 22
For example, the effective area tool portion 22a is formed of foamed polyurethane capable of holding free abrasive grains, and the unnecessary area tool portion 22b is made of non-foamed material that does not hold free abrasive grains. Formed with polyurethane,
The effective area tool portion 22a and the unnecessary area tool portion 22b may be joined together, and, for example, diamond powder having a particle size of 2 μm or less may be used as abrasive grains.
【0099】〈実験例4〉上記第2の実施の形態と同様
の加工装置20を用いて金型13の研削加工を行った。
工具22としては、タイヤ形状の研削砥石を用い、砥石
として、粒度♯8000のダイヤモンド砥粒を用いると
ともに、その有効域工具部22aを砥粒の集中度100
にした砥石を用い、不要域工具部22bを砥粒の集中度
20にした砥石を用いた。<Experimental Example 4> The die 13 was ground by using the same processing apparatus 20 as in the second embodiment.
As the tool 22, a tire-shaped grinding wheel is used, and as the grinding wheel, diamond abrasive grains having a particle size of 0008000 are used.
A grindstone in which the unnecessary area tool portion 22b has a concentration of abrasive grains of 20 was used.
【0100】この工具22を用いて、モータ11の回転
軸11aを金型13の加工面に略平行にして、金型13
を図2に示したようなツールパス14で工具22と金型
13を相対移動させて、研削加工を行った。By using this tool 22, the rotating shaft 11a of the motor 11 is made substantially parallel to the machining surface of the
Was ground by moving the tool 22 and the mold 13 relative to each other in the tool path 14 as shown in FIG.
【0101】この実験の結果、光学的不要域Aoでの工
具22による金型13の除去量を減少させることがで
き、金型13を、ヤトイを用いることなく、上記図3に
示したように、境界線L付近に溝が形成されることな
く、光学的有効域Aiから光学的不要域Aoへと滑らか
な高精度な研削加工を行うことができた。As a result of this experiment, the amount of removal of the mold 13 by the tool 22 in the optically unnecessary area Ao can be reduced, and the mold 13 can be removed without using a toy as shown in FIG. Thus, smooth high-precision grinding from the optically effective area Ai to the optically unnecessary area Ao could be performed without forming a groove near the boundary line L.
【0102】〈実験例5〉上記第2の実施の形態と同様
の加工装置20を用いて金型13の研削加工を行った。
工具22としては、タイヤ形状のもの用いるとともに、
その有効域工具部22aを発泡ポリウレタンで形成し、
不要域工具部22bを非発泡ポリウレタンで形成して、
砥粒として、粒径2μm以下のダイヤモンドパウダーを
使用してもよい。<Experimental Example 5> Grinding of the mold 13 was performed by using the same processing apparatus 20 as in the second embodiment.
As the tool 22, a tire-shaped tool is used.
The effective area tool portion 22a is formed of polyurethane foam,
The unnecessary area tool part 22b is formed of non-foamed polyurethane,
Diamond powder having a particle diameter of 2 μm or less may be used as the abrasive.
【0103】この工具22を用いて、モータ11の回転
軸11a(工具12の回転軸)を金型13の加工面に略
平行にして、金型13を図2に示したようなツールパス
14で工具22と金型13を相対移動させて、研削加工
を行った。Using the tool 22, the rotating shaft 11a of the motor 11 (the rotating shaft of the tool 12) is substantially parallel to the processing surface of the mold 13, and the mold 13 is moved to the tool path 14 as shown in FIG. Then, the tool 22 and the mold 13 were relatively moved to perform a grinding process.
【0104】この実験の結果、光学的不要域Aoでの工
具22による金型13の除去量を減少させることがで
き、金型13を、ヤトイを用いることなく、上記図3に
示したように、境界線L付近に溝が形成されることな
く、光学的有効域Aiから光学的不要域Aoへと滑らか
な高精度な研削加工を行うことができた。As a result of this experiment, the removal amount of the mold 13 by the tool 22 in the optically unnecessary area Ao can be reduced, and the mold 13 can be removed without using a toy as shown in FIG. Thus, smooth high-precision grinding from the optically effective area Ai to the optically unnecessary area Ao could be performed without forming a groove near the boundary line L.
【0105】以上、本発明者によってなされた発明を好
適な実施の形態に基づき具体的に説明したが、本発明は
上記のものに限定されるものではなく、その要旨を逸脱
しない範囲で種々変更可能であることはいうまでもな
い。The invention made by the present inventor has been specifically described based on the preferred embodiments. However, the present invention is not limited to the above, and various modifications can be made without departing from the gist of the invention. It goes without saying that it is possible.
【0106】[0106]
【発明の効果】請求項1記載の発明の加工方法によれ
ば、所定の軸を中心として回転される工具と光学素子用
の金型を所定のツールパスに沿って相対移動させて、工
具の加工作用面で金型を加工するに際して、ツールパス
として、工具の加工作用面が金型の外周エッジに接触し
ない位置であって、かつ、金型の光学的な有効域外で、
加工の開始、加工方向の切り換え及び加工の終了を行う
移動経路を設定しているので、ヤトイを使用することな
く、短時間に加工して工具の損耗を抑制し、かつ、工具
にダメージを与えることを防止することができ、所望の
形状精度で効率的に金型を加工することができる。According to the working method of the present invention, the tool rotated about a predetermined axis and the mold for the optical element are relatively moved along a predetermined tool path, and When processing the mold with the working surface, as a tool path, the working surface of the tool is at a position where it does not contact the outer peripheral edge of the mold, and outside the optical effective area of the mold,
Since the movement path for starting the processing, switching the processing direction, and ending the processing is set, the processing is performed in a short time without using a toy, thereby suppressing tool wear and damaging the tool. Therefore, it is possible to efficiently process the mold with a desired shape accuracy.
【0107】請求項2記載の発明の加工装置によれば、
所定の軸を中心として回転される工具と光学素子用の金
型を所定のツールパスに沿って相対移動させて、工具の
加工作用面で金型を加工するに際して、ツールパスとし
て、工具の加工作用面が金型の外周エッジに接触しない
位置であって、かつ、金型の光学的な有効域外で、加工
の開始、加工方向の切り換え及び加工の終了を行う移動
経路を設定しているので、ヤトイを使用することなく、
短時間に加工して工具の損耗を抑制し、かつ、工具にダ
メージを与えることを防止することができ、所望の形状
精度で効率的に金型を加工することができる。According to the processing apparatus of the second aspect,
When a tool rotated around a predetermined axis and a mold for an optical element are relatively moved along a predetermined tool path to machine the mold on the working surface of the tool, the tool path is used as a tool path. Since the working surface is located at a position where it does not contact the outer peripheral edge of the mold and is outside the optically effective area of the mold, a movement path for starting the processing, switching the processing direction, and ending the processing is set. Without using yatoys,
The processing can be performed in a short time to suppress wear of the tool, prevent the tool from being damaged, and efficiently process the mold with a desired shape accuracy.
【0108】請求項3記載の発明の加工方法または加工
装置によれば、ツールパスに沿っての加工の開始、加工
方向の切り換え及び加工の終了に際して、工具の回転速
度を加工時に比較して減速させているので、加工の開
始、加工方向の切り換え及び加工の終了の際の工具によ
る金型の除去量を減少させることができ、金型の有効域
外での削りすぎで光学的な有効域が狭くなることを防止
して、金型をより一層良好な形状精度で加工することが
できる。According to the machining method or the machining apparatus according to the third aspect of the present invention, when starting machining along the tool path, switching the machining direction, and ending the machining, the rotational speed of the tool is reduced as compared with the machining. The amount of removal of the die by the tool at the start of processing, switching of the processing direction and the end of processing can be reduced, and the optical effective area is reduced due to excessive cutting outside the effective area of the mold. By preventing the mold from becoming narrow, the mold can be machined with better shape accuracy.
【0109】請求項4記載の発明の加工方法または加工
装置によれば、加工に際して工具に所定の荷重を付加し
て加工を行い、ツールパスに沿っての加工の開始、加工
方向の切り換え及び加工の終了に際して、荷重を加工時
よりも低減させているので、加工の開始、加工方向の切
り換え及び加工の終了の際の工具による金型の除去量を
減少させることができ、金型の有効域外での削りすぎで
光学的な有効域が狭くなることを防止して、金型をより
一層良好な形状精度で加工することができる。According to the machining method or the machining apparatus of the invention, the machining is performed by applying a predetermined load to the tool at the time of machining, starting machining along the tool path, switching the machining direction, and machining. Since the load is reduced at the end of the machining, the amount of removal of the mold by the tool at the start of machining, switching of the machining direction and at the end of machining can be reduced, and the outside of the effective area of the mold can be reduced. It is possible to prevent the optical effective area from being narrowed by excessive shaving, thereby processing the mold with even better shape accuracy.
【0110】請求項5記載の発明の加工方法または加工
装置によれば、金型の有効域外に所定のマスキングを施
しているので、加工の開始、加工方向の切り換え及び加
工の終了の際の工具による金型の除去量をより一層適切
に減少させることができ、金型の有効域外での削りすぎ
で光学的な有効域が狭くなることをより一層防止して、
金型をより一層良好な形状精度で加工することができ
る。According to the machining method or the machining apparatus according to the fifth aspect of the present invention, since the predetermined masking is performed outside the effective area of the mold, the tool is used at the time of starting the machining, switching the machining direction, and ending the machining. The amount of removal of the mold by the can be more appropriately reduced, further preventing that the optical effective area is narrowed by excessive shaving outside the effective area of the mold,
The mold can be processed with better shape accuracy.
【0111】請求項6記載の発明の加工方法または加工
装置によれば、工具を、金型の有効域の加工に関与する
有効域工具部と、金型の有効域外の加工に関与する不要
域工具部と、を備え、有効域工具部が有効域の加工に適
した所定の切れ味を有する部材で形成され、不要域工具
部が有効域工具部の切れ味よりも所定量切れ味の落ちる
部材で形成されたものとしているので、加工の開始、加
工方向の切り換え及び加工の終了の際の工具による金型
の除去量をより一層適切に減少させることができ、金型
の有効域外での削りすぎで光学的な有効域が狭くなるこ
とをより一層防止して、金型をより一層良好な形状精度
で加工することができる。According to the machining method or the machining apparatus of the invention described in claim 6, the tool is provided with an effective area tool portion involved in machining the effective area of the mold and an unnecessary area involved in machining outside the effective area of the mold. A tool part, and the effective area tool part is formed of a member having a predetermined sharpness suitable for processing of the effective area, and the unnecessary area tool part is formed of a member that is less sharp by a predetermined amount than the sharpness of the effective area tool part. Therefore, the amount of removal of the die by the tool at the start of processing, switching of the processing direction and at the end of processing can be more appropriately reduced, and excessive cutting outside the effective area of the die can be performed. It is possible to further prevent the optically effective area from being narrowed, and to process the mold with better shape accuracy.
【0112】請求項7記載の発明の加工方法または加工
装置によれば、砥粒として遊離砥粒を使用し、工具を、
金型の有効域の加工に関与する有効域工具部と、金型の
有効域外の加工に関与する不要域工具部と、を備え、有
効域工具部が遊離砥粒を保持可能な微細穴または繊維が
表面に存在する部材で形成され、不要域工具部が遊離砥
粒を保持可能な微細穴または繊維が表面に存在しない部
材で形成されたものとしているので、加工の開始、加工
方向の切り換え及び加工の終了の際の工具による金型の
除去量をより一層適切に減少させることができ、金型の
有効域外での削りすぎで光学的な有効域が狭くなること
をより一層防止して、金型をより一層良好な形状精度で
加工することができる。According to the processing method or the processing apparatus of the invention described in claim 7, free abrasive grains are used as abrasive grains, and a tool is used.
An effective area tool part involved in machining the effective area of the mold, and an unnecessary area tool part involved in machining outside the effective area of the mold, and the effective area tool part has fine holes or holes that can hold loose abrasive grains. Since the fiber is formed by the member on the surface and the unnecessary area tool part is formed by the fine hole capable of holding the loose abrasive or the member without the fiber on the surface, the processing is started and the processing direction is switched. And the amount of removal of the mold by the tool at the end of processing can be more appropriately reduced, and it is further prevented that the optical effective area is narrowed by excessive cutting outside the effective area of the mold. In addition, the mold can be processed with better shape accuracy.
【0113】請求項8記載の発明の工具によれば、所定
の軸を中心として回転されながら光学素子用の金型と所
定のツールパスに沿って相対移動されて、金型を加工す
るに際して、ツールパスとして、工具の加工作用面が金
型の外周エッジに接触しない位置であって、かつ、金型
の光学素子としての有効域外で、加工の開始、加工方向
の切り換え及び加工の終了を行う移動経路が設定され、
金型の有効域の加工に関与する有効域工具部と、金型の
有効域外の加工に関与する不要域工具部と、を備え、有
効域工具部が有効域の加工に適した所定の切れ味の部材
で形成され、不要域工具部が有効域工具部の切れ味より
も所定量切れ味を有する落ちる部材で形成されたものと
しているので、加工の開始、加工方向の切り換え及び加
工の終了の際の金型の除去量を減少させることができ、
ヤトイを使用することなく、短時間に加工して損耗やダ
メージを抑制しつつ、所望の形状精度で効率的に金型を
加工することができる。According to the tool of the present invention, when the mold is processed by being relatively moved along the predetermined tool path with the mold for the optical element while being rotated about the predetermined axis, As a tool path, the start of processing, the switching of the processing direction, and the end of processing are performed at a position where the working surface of the tool does not contact the outer peripheral edge of the mold and outside the effective area of the mold as an optical element. The travel route is set,
An effective area tool part involved in machining the effective area of the mold and an unnecessary area tool part involved in machining outside the effective area of the mold, the effective area tool part having a predetermined sharpness suitable for machining the effective area. Since the unnecessary area tool portion is formed by a falling member having a predetermined amount of sharpness greater than the sharpness of the effective area tool portion, the machining is started, the machining direction is switched, and the machining is terminated. The amount of mold removal can be reduced,
It is possible to efficiently process the mold with a desired shape accuracy while suppressing wear and damage by performing processing in a short time without using a toy.
【0114】請求項9記載の工具によれば、遊離砥粒を
使用した加工に使用され、工具を、有効域工具部が遊離
砥粒を保持可能な微細穴または繊維が表面に存在する部
材で形成され、不要域工具部が遊離砥粒を保持可能な微
細穴または繊維が表面に存在しない部材で形成されたも
のとしているので、加工の開始、加工方向の切り換え及
び加工の終了の際の工具による金型の除去量をより一層
適切に減少させることができ、ヤトイを使用することな
く、損耗やダメージを受けることが少なく、金型の有効
域外での削りすぎで光学的な有効域が狭くなることをよ
り一層防止しつつ、所望の形状精度でより一層効率的に
金型を加工することができる。According to the tool of the ninth aspect, the tool is used for machining using free abrasive grains, and the effective area tool portion is a member having fine holes or fibers on its surface capable of holding free abrasive grains. Since the formed and unnecessary area tool portion is formed of a member having no fine holes or fibers on the surface capable of holding loose abrasive grains, the tool at the start of processing, switching of the processing direction and the end of processing Can reduce the amount of mold removal more appropriately, reduce wear and damage without using a toy, and reduce the optical effective area by cutting too much outside the effective area of the mold It is possible to process the mold more efficiently with a desired shape accuracy while further preventing the die from forming.
【0115】請求項10記載の工具によれば、工具を、
有効域工具部を中心として、不要域工具部がその両脇に
接合されているものとしているので、加工の開始、加工
方向の切り換え及び加工の終了の際の金型の除去量をよ
り一層適切に減少させることができ、ヤトイを使用する
ことなく、短時間に加工して損耗やダメージを抑制しつ
つ、有効域での加工を高精度に行うことができるととも
に、有効域外での削りすぎで光学的な有効域が狭くなる
ことを防止して、所望の形状精度で効率的に金型を加工
することができる。According to the tool of the tenth aspect, the tool is
Unnecessary tool parts are assumed to be joined to both sides of the effective area tool part, so the amount of mold removal at the start of processing, switching of the processing direction and the end of processing is more appropriate It is possible to perform machining in the effective range with high precision while suppressing wear and damage by processing in a short time without using a toy, and using too much cutting outside the effective range. The mold can be efficiently processed with desired shape accuracy by preventing the optical effective area from becoming narrow.
【0116】請求項11記載の発明の金型によれば、所
定の軸を中心として回転される工具に対して所定のツー
ルパスに沿って相対移動して、工具の加工作用面で加工
するに際して、ツールパスとして、工具の加工作用面が
金型の外周エッジに接触しない位置であって、かつ、金
型の光学的な有効域外で、加工の開始、加工方向の切り
換え及び加工の終了を行う移動経路を設定して加工して
いるので、ヤトイを使用することなく、また、短時間の
加工で工具に損耗やダメージを与えることを防止するこ
とができるとともに、所望の形状精度で効率的に加工さ
れ、高精度な光学素子を成形することができる。According to the eleventh aspect of the present invention, when the tool is relatively moved along a predetermined tool path with respect to a tool rotated about a predetermined axis to perform machining on a machining operation surface of the tool. As a tool path, the start of the processing, the switching of the processing direction, and the end of the processing are performed at a position where the working surface of the tool does not contact the outer peripheral edge of the mold and outside the optically effective area of the mold. Since the machining is performed by setting the movement path, it is possible to prevent the tool from being worn or damaged by machining in a short time without using a toy, and efficiently with the desired shape accuracy. It can be processed to form a highly accurate optical element.
【図1】本発明の加工方法、加工装置、工具及び金型の
第1の実施の形態を適用した加工装置の要部正面図。FIG. 1 is a front view of a main part of a processing apparatus to which a first embodiment of a processing method, a processing apparatus, a tool, and a mold according to the present invention is applied.
【図2】図1の工具のツールパス及び光学的有効域と光
学的不要域を示す金型の平面図。FIG. 2 is a plan view of a mold showing a tool path and an optically effective area and an optically unnecessary area of the tool of FIG. 1;
【図3】図1の加工装置で研削加工した金型の正面断面
図。FIG. 3 is a front sectional view of a mold ground by the processing apparatus of FIG. 1;
【図4】本発明の加工方法、加工装置、工具及び金型の
第2の実施の形態を適用した加工装置の要部正面図。FIG. 4 is a main part front view of a processing apparatus to which a processing method, a processing apparatus, a tool, and a mold according to a second embodiment of the present invention are applied.
【図5】従来の加工装置で研磨加工した金型の正面断面
図。FIG. 5 is a front sectional view of a mold polished by a conventional processing apparatus.
10 加工装置 11 モータ 11a 回転軸 12 工具 13 金型 14 ツールパス Ai 光学的有効域 Ao 光学的不要域 Ps 加工開始位置 Ph 方向切換位置 Po 加工終了位置 20 加工装置 21 モータ 21a 回転軸 22 工具 22a 有効域工具部 22b 不要域工具部 Reference Signs List 10 processing device 11 motor 11a rotation axis 12 tool 13 mold 14 tool path Ai optically effective area Ao optically unnecessary area Ps processing start position Ph direction switching position Po processing end position 20 processing device 21 motor 21a rotating shaft 22 tool 22a effective Area tool part 22b Unnecessary area tool part
───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 3C049 AA03 AA07 AA11 AA16 CA02 CB01 3C058 AA07 AA09 AA11 BA02 BA04 BA05 BA07 BA09 BB06 CA01 CA03 CB01 CB05 ────────────────────────────────────────────────── ─── Continued on the front page F term (reference) 3C049 AA03 AA07 AA11 AA16 CA02 CB01 3C058 AA07 AA09 AA11 BA02 BA04 BA05 BA07 BA09 BB06 CA01 CA03 CB01 CB05
Claims (11)
ら工具と光学素子用の金型を所定のツールパスに沿って
相対移動させて、前記工具の加工作用面で前記金型を加
工する加工方法において、前記ツールパスとして、前記
工具の加工作用面が前記金型の外周エッジに接触しない
位置であって、かつ、前記金型の光学的な有効域外で、
前記加工の開始、加工方向の切り換え及び前記加工の終
了を行う移動経路を設定することを特徴とする加工方
法。1. A tool and a mold for an optical element are relatively moved along a predetermined tool path while rotating the tool about a predetermined axis, and the mold is machined on the working surface of the tool. In the machining method, as the tool path, the machining action surface of the tool is a position that does not contact the outer peripheral edge of the mold, and outside the optically effective area of the mold,
A processing method, comprising setting a movement path for starting the processing, switching the processing direction, and ending the processing.
ら前記工具と光学素子用の金型を所定のツールパスに沿
って相対移動させて、前記工具の加工作用面で前記金型
を加工する加工装置において、前記ツールパスとして、
前記工具の加工作用面が前記金型の外周エッジに接触し
ない位置であって、かつ、前記金型の光学的な有効域外
で、前記加工の開始、加工方向の切り換え及び前記加工
の終了を行う移動経路を設定することを特徴とする加工
装置。2. The method according to claim 1, wherein the tool and the mold for the optical element are relatively moved along a predetermined tool path while rotating the tool about a predetermined axis. In the processing device to perform, as the tool path,
The start of the machining, the switching of the machining direction, and the end of the machining are performed at a position where the working surface of the tool does not contact the outer peripheral edge of the mold and outside the optically effective area of the mold. A processing device for setting a movement route.
始、前記加工方向の切り換え及び前記加工の終了に際し
て、前記工具の回転速度を前記加工時に比較して減速さ
せることを特徴とする請求項1記載の加工方法または請
求項2記載の加工装置。3. The method according to claim 1, wherein at the start of the machining along the tool path, at the switching of the machining direction and at the end of the machining, the rotational speed of the tool is reduced as compared with the machining. The processing method according to claim 1 or the processing apparatus according to claim 2.
付加して前記加工を行い、前記ツールパスに沿っての前
記加工の開始、前記加工方向の切り換え及び前記加工の
終了に際して、前記荷重を前記加工時よりも低減させる
ことを特徴とする請求項1から請求項3のいずれかに記
載の加工方法または加工装置。4. The method according to claim 1, wherein said processing is performed by applying a predetermined load to said tool during said processing, and said load is changed at the start of said processing along said tool path, switching of said processing direction and ending of said processing. The processing method or the processing apparatus according to any one of claims 1 to 3, wherein the processing method or the processing apparatus is reduced from the processing time.
グを施すことを特徴とする請求項1から請求項4のいず
れかに記載の加工方法または加工装置。5. The processing method or apparatus according to claim 1, wherein predetermined masking is performed outside the effective area of the mold.
に関与する有効域工具部と、前記金型の前記有効域外の
加工に関与する不要域工具部と、を備え、前記有効域工
具部が前記有効域の加工に適した所定の切れ味を有する
部材で形成され、前記不要域工具部が前記有効域工具部
の切れ味よりも所定量切れ味の落ちる部材で形成されて
いることを特徴とする請求項1から請求項5のいずれか
に記載の加工方法または加工装置。6. The tool according to claim 1, further comprising: an effective area tool portion involved in machining the effective area of the mold, and an unnecessary area tool portion involved in machining the mold outside the effective area. The area tool part is formed of a member having a predetermined sharpness suitable for machining of the effective area, and the unnecessary area tool part is formed of a member that is less sharp by a predetermined amount than the sharpness of the effective area tool part. The processing method or the processing apparatus according to claim 1, wherein the processing method or the processing apparatus includes:
として遊離砥粒を使用し、前記工具は、前記金型の前記
有効域の加工に関与する有効域工具部と、前記金型の前
記有効域外の加工に関与する不要域工具部と、を備え、
前記有効域工具部が前記遊離砥粒を保持可能な微細穴ま
たは繊維が表面に存在する部材で形成され、前記不要域
工具部が前記遊離砥粒を保持可能な微細穴または繊維が
表面に存在しない部材で形成されていることを特徴とす
る請求項1から請求項5のいずれかに記載の加工方法ま
たは加工装置。7. The processing method or the processing apparatus uses loose abrasive grains as abrasive grains, and the tool includes an effective area tool part involved in processing the effective area of the mold, An unnecessary area tool part involved in machining outside the effective area,
The effective area tool portion is formed of a member having fine holes or fibers on the surface capable of holding the loose abrasive grains, and the unnecessary area tool section has fine holes or fibers capable of holding the free abrasive grains on the surface. The processing method or the processing apparatus according to any one of claims 1 to 5, wherein the processing method or the processing apparatus is formed of a member that is not used.
素子用の金型と所定のツールパスに沿って相対移動され
て、前記金型を加工する工具において、前記ツールパス
として、前記工具の加工作用面が前記金型の外周エッジ
に接触しない位置であって、かつ、前記金型の前記光学
素子としての有効域外で、前記加工の開始、加工方向の
切り換え及び前記加工の終了を行う移動経路が設定さ
れ、前記金型の前記有効域の加工に関与する有効域工具
部と、前記金型の前記有効域外の加工に関与する不要域
工具部と、を備え、前記有効域工具部が前記有効域の加
工に適した所定の切れ味の部材で形成され、前記不要域
工具部が前記有効域工具部の切れ味よりも所定量切れ味
を有する落ちる部材で形成されていることを特徴とする
工具。8. A tool for processing the mold by rotating relative to a mold for an optical element along a predetermined tool path while being rotated about a predetermined axis, wherein the tool path is used as the tool path. Movement for starting the processing, switching the processing direction, and ending the processing outside the effective area of the mold as the optical element, where the working surface does not contact the outer peripheral edge of the mold. A path is set, an effective area tool part involved in machining of the effective area of the mold, and an unnecessary area tool part involved in machining of the mold outside the effective area, wherein the effective area tool part is provided. A tool formed of a member having a predetermined sharpness suitable for machining of the effective area, and the unnecessary area tool portion being formed of a falling member having a predetermined amount of sharpness more than the sharpness of the effective area tool portion. .
用され、前記有効域工具部が前記遊離砥粒を保持可能な
微細穴または繊維が表面に存在する部材で形成され、前
記不要域工具部が前記遊離砥粒を保持可能な微細穴また
は繊維が表面に存在しない部材で形成されていることを
特徴とする請求項8記載の工具。9. The tool according to claim 1, wherein said tool is used for processing using loose abrasive grains, and said effective area tool portion is formed of a member having fine holes or fibers on its surface capable of holding said loose abrasive grains, and said unnecessary area. 9. The tool according to claim 8, wherein the area tool portion is formed of a member having no fine holes or fibers capable of holding the loose abrasive grains on the surface.
して、前記不要域工具部がその両脇に接合されているこ
とを特徴とする請求項8または請求項9記載の工具。10. The tool according to claim 8, wherein the unnecessary area tool part is joined to both sides of the tool centering on the effective area tool part.
対して所定のツールパスに沿って相対移動されて、前記
工具の加工作用面で加工される光学素子用の金型におい
て、前記ツールパスとして、前記工具の加工作用面が前
記金型の外周エッジに接触しない位置であって、かつ、
前記金型の光学的な有効域外で、前記加工の開始、加工
方向の切り換え及び前記加工の終了を行う移動経路が設
定されて加工されていることを特徴とする金型。11. A mold for an optical element which is relatively moved along a predetermined tool path with respect to a tool rotated about a predetermined axis and is machined on a working surface of the tool. As a path, a position where the working surface of the tool does not contact the outer peripheral edge of the mold, and
A mold, wherein a movement path for starting the machining, switching the machining direction, and ending the machining is set outside the optically effective area of the mold, and the machining is performed.
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