JP2001170797A5 - - Google Patents
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- JP2001170797A5 JP2001170797A5 JP2000218046A JP2000218046A JP2001170797A5 JP 2001170797 A5 JP2001170797 A5 JP 2001170797A5 JP 2000218046 A JP2000218046 A JP 2000218046A JP 2000218046 A JP2000218046 A JP 2000218046A JP 2001170797 A5 JP2001170797 A5 JP 2001170797A5
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Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000218046A JP3849842B2 (en) | 1999-10-05 | 2000-07-18 | Flux for soldering, solder paste, electronic component device, electronic circuit module, electronic circuit device, and soldering method |
TW089120637A TW527253B (en) | 1999-10-05 | 2000-10-04 | Soldering flux, soldering paste and soldering process |
PCT/JP2000/006957 WO2001024968A1 (en) | 1999-10-05 | 2000-10-05 | Soldering flux, solder paste and method of soldering |
EP00964695A EP1231016B1 (en) | 1999-10-05 | 2000-10-05 | Soldering flux, solder paste and method of soldering |
US10/089,067 US6915944B1 (en) | 1999-10-05 | 2000-10-05 | Soldering flux, solder paste and method of soldering |
AT06076345T ATE408475T1 (en) | 1999-10-05 | 2000-10-05 | SOLDER, SOLDER PASTE AND SOLDERING PROCESSES |
AT00964695T ATE354451T1 (en) | 1999-10-05 | 2000-10-05 | SOLDER, SOLDER PASTE AND SOLDERING PROCESSES |
EP06076345A EP1762329B1 (en) | 1999-10-05 | 2000-10-05 | Soldering flux, soldering paste and method of soldering |
DE60040311T DE60040311D1 (en) | 1999-10-05 | 2000-10-05 | Solder, solder paste and soldering process |
DE60033552T DE60033552T2 (en) | 1999-10-05 | 2000-10-05 | SOLDERANT, SOLDER PASTE AND SOLDERING PROCESS |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11-284859 | 1999-10-05 | ||
JP28485999 | 1999-10-05 | ||
JP2000218046A JP3849842B2 (en) | 1999-10-05 | 2000-07-18 | Flux for soldering, solder paste, electronic component device, electronic circuit module, electronic circuit device, and soldering method |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2001170797A JP2001170797A (en) | 2001-06-26 |
JP2001170797A5 true JP2001170797A5 (en) | 2005-12-15 |
JP3849842B2 JP3849842B2 (en) | 2006-11-22 |
Family
ID=26555632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000218046A Expired - Lifetime JP3849842B2 (en) | 1999-10-05 | 2000-07-18 | Flux for soldering, solder paste, electronic component device, electronic circuit module, electronic circuit device, and soldering method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3849842B2 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10319888A1 (en) | 2003-04-25 | 2004-11-25 | Siemens Ag | Solder material based on SnAgCu |
JP2005072173A (en) * | 2003-08-22 | 2005-03-17 | Senju Metal Ind Co Ltd | Electronic component and solder paste |
TW200730288A (en) | 2005-08-11 | 2007-08-16 | Senju Metal Industry Co | Lead free solder paste and application thereof |
JP4535050B2 (en) * | 2005-09-27 | 2010-09-01 | パナソニック電工株式会社 | Thermosetting resin composition and method for producing the same |
JP5090349B2 (en) * | 2006-08-04 | 2012-12-05 | パナソニック株式会社 | Bonding material, bonding part and circuit board |
WO2008026588A1 (en) * | 2006-08-28 | 2008-03-06 | Panasonic Electric Works Co., Ltd. | Thermosetting resin composition, method for producing the same and circuit board |
JP5052857B2 (en) * | 2006-10-13 | 2012-10-17 | 株式会社フジクラ | Conductive composition, conductor using the same, and method for forming conductive circuit |
JP5468199B2 (en) * | 2006-11-22 | 2014-04-09 | 日立化成株式会社 | Conductive adhesive composition, electronic component mounting substrate, and semiconductor device |
WO2009044801A1 (en) | 2007-10-03 | 2009-04-09 | Hitachi Chemical Company, Ltd. | Adhesive composition, electronic component-mounted substrate using the adhesive composition, and semiconductor device |
JP5373464B2 (en) * | 2008-04-23 | 2013-12-18 | パナソニック株式会社 | Conductive paste and mounting structure using the same |
JP5464463B2 (en) * | 2008-09-25 | 2014-04-09 | パナソニック株式会社 | Thermosetting resin composition and circuit board |
CN101728354B (en) * | 2008-10-27 | 2013-07-10 | 松下电器产业株式会社 | Electronic device and manufacturing method for electronic device |
JP5875867B2 (en) * | 2009-10-15 | 2016-03-02 | 日立化成株式会社 | Conductive adhesive, solar cell, manufacturing method thereof, and solar cell module |
EP2669347A1 (en) * | 2011-01-27 | 2013-12-04 | Hitachi Chemical Company, Ltd. | Electrically conductive adhesive composition, connector and solar cell module |
JP5952849B2 (en) * | 2014-03-25 | 2016-07-13 | 岡村製油株式会社 | Flux and solder paste |
KR102329367B1 (en) * | 2018-06-22 | 2021-11-22 | 인듐 코포레이션 | Prevention of Post Reflow Interconnect Failure of VIPPO Solder Joints by Utilization of Adhesive Materials |
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2000
- 2000-07-18 JP JP2000218046A patent/JP3849842B2/en not_active Expired - Lifetime