JP2001170797A5 - - Google Patents

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Publication number
JP2001170797A5
JP2001170797A5 JP2000218046A JP2000218046A JP2001170797A5 JP 2001170797 A5 JP2001170797 A5 JP 2001170797A5 JP 2000218046 A JP2000218046 A JP 2000218046A JP 2000218046 A JP2000218046 A JP 2000218046A JP 2001170797 A5 JP2001170797 A5 JP 2001170797A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000218046A
Other languages
Japanese (ja)
Other versions
JP2001170797A (en
JP3849842B2 (en
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2000218046A external-priority patent/JP3849842B2/en
Priority to JP2000218046A priority Critical patent/JP3849842B2/en
Priority to TW089120637A priority patent/TW527253B/en
Priority to AT00964695T priority patent/ATE354451T1/en
Priority to DE60033552T priority patent/DE60033552T2/en
Priority to US10/089,067 priority patent/US6915944B1/en
Priority to AT06076345T priority patent/ATE408475T1/en
Priority to PCT/JP2000/006957 priority patent/WO2001024968A1/en
Priority to EP06076345A priority patent/EP1762329B1/en
Priority to DE60040311T priority patent/DE60040311D1/en
Priority to EP00964695A priority patent/EP1231016B1/en
Publication of JP2001170797A publication Critical patent/JP2001170797A/en
Publication of JP2001170797A5 publication Critical patent/JP2001170797A5/ja
Publication of JP3849842B2 publication Critical patent/JP3849842B2/en
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2000218046A 1999-10-05 2000-07-18 Flux for soldering, solder paste, electronic component device, electronic circuit module, electronic circuit device, and soldering method Expired - Lifetime JP3849842B2 (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP2000218046A JP3849842B2 (en) 1999-10-05 2000-07-18 Flux for soldering, solder paste, electronic component device, electronic circuit module, electronic circuit device, and soldering method
TW089120637A TW527253B (en) 1999-10-05 2000-10-04 Soldering flux, soldering paste and soldering process
PCT/JP2000/006957 WO2001024968A1 (en) 1999-10-05 2000-10-05 Soldering flux, solder paste and method of soldering
EP00964695A EP1231016B1 (en) 1999-10-05 2000-10-05 Soldering flux, solder paste and method of soldering
US10/089,067 US6915944B1 (en) 1999-10-05 2000-10-05 Soldering flux, solder paste and method of soldering
AT06076345T ATE408475T1 (en) 1999-10-05 2000-10-05 SOLDER, SOLDER PASTE AND SOLDERING PROCESSES
AT00964695T ATE354451T1 (en) 1999-10-05 2000-10-05 SOLDER, SOLDER PASTE AND SOLDERING PROCESSES
EP06076345A EP1762329B1 (en) 1999-10-05 2000-10-05 Soldering flux, soldering paste and method of soldering
DE60040311T DE60040311D1 (en) 1999-10-05 2000-10-05 Solder, solder paste and soldering process
DE60033552T DE60033552T2 (en) 1999-10-05 2000-10-05 SOLDERANT, SOLDER PASTE AND SOLDERING PROCESS

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11-284859 1999-10-05
JP28485999 1999-10-05
JP2000218046A JP3849842B2 (en) 1999-10-05 2000-07-18 Flux for soldering, solder paste, electronic component device, electronic circuit module, electronic circuit device, and soldering method

Publications (3)

Publication Number Publication Date
JP2001170797A JP2001170797A (en) 2001-06-26
JP2001170797A5 true JP2001170797A5 (en) 2005-12-15
JP3849842B2 JP3849842B2 (en) 2006-11-22

Family

ID=26555632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000218046A Expired - Lifetime JP3849842B2 (en) 1999-10-05 2000-07-18 Flux for soldering, solder paste, electronic component device, electronic circuit module, electronic circuit device, and soldering method

Country Status (1)

Country Link
JP (1) JP3849842B2 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10319888A1 (en) 2003-04-25 2004-11-25 Siemens Ag Solder material based on SnAgCu
JP2005072173A (en) * 2003-08-22 2005-03-17 Senju Metal Ind Co Ltd Electronic component and solder paste
TW200730288A (en) 2005-08-11 2007-08-16 Senju Metal Industry Co Lead free solder paste and application thereof
JP4535050B2 (en) * 2005-09-27 2010-09-01 パナソニック電工株式会社 Thermosetting resin composition and method for producing the same
JP5090349B2 (en) * 2006-08-04 2012-12-05 パナソニック株式会社 Bonding material, bonding part and circuit board
WO2008026588A1 (en) * 2006-08-28 2008-03-06 Panasonic Electric Works Co., Ltd. Thermosetting resin composition, method for producing the same and circuit board
JP5052857B2 (en) * 2006-10-13 2012-10-17 株式会社フジクラ Conductive composition, conductor using the same, and method for forming conductive circuit
JP5468199B2 (en) * 2006-11-22 2014-04-09 日立化成株式会社 Conductive adhesive composition, electronic component mounting substrate, and semiconductor device
WO2009044801A1 (en) 2007-10-03 2009-04-09 Hitachi Chemical Company, Ltd. Adhesive composition, electronic component-mounted substrate using the adhesive composition, and semiconductor device
JP5373464B2 (en) * 2008-04-23 2013-12-18 パナソニック株式会社 Conductive paste and mounting structure using the same
JP5464463B2 (en) * 2008-09-25 2014-04-09 パナソニック株式会社 Thermosetting resin composition and circuit board
CN101728354B (en) * 2008-10-27 2013-07-10 松下电器产业株式会社 Electronic device and manufacturing method for electronic device
JP5875867B2 (en) * 2009-10-15 2016-03-02 日立化成株式会社 Conductive adhesive, solar cell, manufacturing method thereof, and solar cell module
EP2669347A1 (en) * 2011-01-27 2013-12-04 Hitachi Chemical Company, Ltd. Electrically conductive adhesive composition, connector and solar cell module
JP5952849B2 (en) * 2014-03-25 2016-07-13 岡村製油株式会社 Flux and solder paste
KR102329367B1 (en) * 2018-06-22 2021-11-22 인듐 코포레이션 Prevention of Post Reflow Interconnect Failure of VIPPO Solder Joints by Utilization of Adhesive Materials

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