JP2001167902A - Resistor and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resistor capable of restraining cutting cost of a substrate, and its manufacturing method. SOLUTION: This resistor consists of a substrate 11, a resistance layer 14 formed on an upper surface of the substrate 11, and a pair of upper surface electrode layers 15 arranged in both end portions of an upper surface of the resistance layer 14. The substrate 11 is composed of a resin based material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resistor used for various electronic devices, or a finely patterned multiple chip resistor and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, as electronic devices have been downsized, electronic components such as resistors used in electronic devices have been reduced in size and a plurality of independent elements have been used to increase the mounting density on printed circuit boards. There is an increasing demand for multiple units in one unit.

A conventional resistor is disclosed in Japanese Utility Model Laid-Open No. 4-3800.
The one described in No. 1 microfilter is known.

[0004] Here, as a resistor, a multiple chip resistor in which a plurality of independent resistive layers, which are one of the resistors, constitute one unit will be described.

Hereinafter, a conventional resistor and a method of manufacturing the same will be described with reference to the drawings.

FIG. 18A is a perspective view of a conventional resistor, and FIG. 18B is a sectional view taken along line EE.

In FIG. 18, reference numeral 1 denotes an insulating substrate made of alumina. Reference numeral 2 denotes two pairs of upper electrode layers provided at both ends of the upper surface of the insulating substrate 1. 3 is a pair of upper electrode layers 2
And two resistance layers provided so as to partially overlap each other.
At this time, the two resistance layers 3 are independent. Reference numeral 4 denotes a protective layer provided so as to cover the entire two resistive layers 3. 5
“a” denotes two pairs of side electrode layers provided on the side surface of the insulating substrate 1. Reference numeral 5b denotes a plating layer formed of nickel and solder plating provided on the surfaces of the two pairs of upper electrode layers 2 and the two side electrode layers 5a.

A method of manufacturing the conventional resistor having the above-described structure will be described below with reference to the drawings.

FIGS. 19 and 20 are process diagrams showing a conventional method for manufacturing a resistor.

First, FIG. 19A shows a sheet-like insulating substrate 8a for manufacturing a conventional resistor. The insulating substrate 8a has through holes 9 and vertical dividing grooves 10a.
Further, a horizontal dividing groove 10b is formed.

Next, as shown in FIG. 19 (b), a plurality of pairs of upper electrode layers 2 are printed on the upper surface of the sheet-like insulating substrate 8a, and a part of each pair of upper electrode layers 2 is further formed. Are formed by printing a plurality of resistive layers 3 so as to overlap the resistive layers.

Next, as shown in FIG. 20A, after a plurality of protective layers 4 are formed by printing so as to cover the whole of the plurality of resistive layers 3, a horizontal dividing groove 10b (shown in FIG. 18) is formed. And is divided into strip-shaped insulating substrates 8b.

Next, as shown in FIG. 20B, a side surface electrode layer 5a is formed by coating on the side surface of the strip-shaped insulating substrate 8b.

Thereafter, the strip-shaped insulating substrate 8b is divided along the vertical dividing grooves 10a to obtain individual insulating substrates (not shown).

Finally, as shown in FIG. 18 (a), the surfaces of the upper electrode layer 2 and the side electrode layer 5a are plated with nickel and then plated with solder so that the plating layer 5 is formed.
b to form a conventional resistor.

Further, the resistor has also been very miniaturized, and in recent years, a very small multi-unit type resistor having two elements built in 0.6 mm length × 0.8 mm width × 0.35 mm thickness. Containers are also being manufactured.

[0017]

The above-mentioned conventional resistor is
Since a sintered ceramic such as alumina is used as the substrate 1, dimensional variations occur in the substrate due to variations in the composition of the substrate and variations in the temperature during firing. In this case, it reaches about 0.5 mm).

When a resistor is manufactured using a substrate having this dimensional variation, it is necessary to prepare a large number of masks used for screen printing and replace the mask in accordance with the dimensional variation of the substrate. The process was complicated.

That is, if a mask used for screen printing for forming the upper electrode layer 2, the resistive layer 3, the protective layer 4, etc. is slightly displaced with respect to the substrate having dimensional variations, the formation position is displaced, resulting in a failure. Therefore, it is necessary to classify substrates having dimensional variations into fine dimensional ranks and to use masks used for screen printing such as the upper electrode layer 2, the resistive layer 3, and the protective layer 4 corresponding to each dimensional rank. (When dimensional ranks are classified at 0.05 mm intervals in the vertical and horizontal directions, dimensional classification of about 600 ranks or more is required). In particular, since the multiple chip resistor has a plurality of independent resistive layers in one unit, the top electrode layer, the resistive layer, and the protective layer have a very fine pattern shape, which is a very serious problem. Become.

Further, if the substrate is cut after screen printing of the upper electrode layer, the resistance layer, the protective layer, etc. in order to eliminate the above-mentioned complicated steps, it is not necessary to classify the substrate into dimensional ranks. If cutting is performed using a diamond-containing blade as in cutting a semiconductor silicon wafer, alumina is harder than a semiconductor silicon wafer, so the blade for dividing is very quickly worn. Has a problem that the cutting cost becomes large.

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a resistor and a method of manufacturing the same, which can reduce the cost of cutting a substrate.

[0022]

In order to achieve the above object, a resistor according to the present invention comprises a substrate, a resistance layer provided on the upper surface of the substrate, and both ends of the upper surface of the resistance layer. The substrate has a pair of upper electrode layers, and the substrate is made of a resin-based material. According to this configuration, the effect of reducing the cost of cutting the substrate can be obtained.

[0023]

DETAILED DESCRIPTION OF THE INVENTION The invention according to claim 1 of the present invention is directed to a substrate, a resistive layer provided on the upper surface of the substrate, and a pair of upper surface electrodes provided at both ends of the upper surface of the resistive layer. And the substrate is made of a resin-based material. According to this configuration, a substrate made of a resin-based material softer than alumina is used. , Thereby reducing the cost of cutting the substrate.

According to a second aspect of the present invention, the resistive layer is formed on the upper surface of an underlayer made of oxide provided on the upper surface of the substrate. Since an underlayer made of an oxide is formed on the upper surface of the substrate made of a hygroscopic resin-based material, penetration of moisture into the substrate can be reduced by the underlayer made of an oxide,
This has the effect of improving the moisture resistance of the substrate.

The third aspect of the present invention is characterized in that the substrate is made of a liquid crystal polymer. According to this configuration, the coefficient of thermal expansion of the substrate can be easily selected, so that the resistance layer and the printed circuit board can be used. The relationship with the coefficient of thermal expansion can be adjusted, thereby having the effect of preventing warpage of the substrate during use due to the difference in coefficient of thermal expansion.

According to a fourth aspect of the present invention, the pair of end face electrode layers provided on the end face of the substrate so as to be electrically connected to the pair of top face electrode layers and the surface of the end face electrode layer are formed. The external electrode layer made of a plating layer is characterized by being formed in a pair of notches provided at both ends of the substrate. According to this configuration, the end face electrode layer is formed on a substrate having no notch. It has an effect that the resistor including the end face electrode layer can be downsized as much as the end face electrode layer does not protrude from the substrate, than the provided one.

The invention according to claim 5 is characterized in that the end face electrode layer is made of a material composed of a metal powder and a resin.
Since it can be fired at a low temperature of 40 ° C., the effect of heat on the resistance layer can be suppressed, thereby having the effect of reducing the change in resistance during production.

According to a sixth aspect of the present invention, the upper surface of the external electrode layer is provided above the upper surface of the protective film. Since the upper surface of the external electrode contacts the printed circuit board even when the printed circuit board is oriented, it has an effect that mounting can be performed regardless of which of the upper and lower surfaces of the substrate is directed toward the printed circuit board.

The invention according to claim 7 is characterized in that the external electrode layer is not provided on the back surface of the substrate. According to this configuration, the back surface of the substrate is fixed by the suction pin of the automatic mounting machine. When the substrate is sucked and mounted on a printed circuit board with the upper surface side of the printed circuit board facing the printed circuit board, the stability at the time of suction is improved, and therefore, an effect that a high mounting rate can be secured.

According to an eighth aspect of the present invention, the external electrode layer is provided on the upper surface of the upper electrode layer. According to this structure, the contact area between the external electrode layer and the upper electrode layer is reduced. As a result, it is possible to suppress an increase in contact resistance during this period even when subjected to an environmental load such as a thermal shock.
Even when the resistance layer has a low resistance, the ratio of the increase in the contact resistance to the resistance value of the resistance layer can be reduced, so that the resistance change rate can be reduced.

According to a ninth aspect of the present invention, in the first aspect, the protective film provided so as to cover at least the resistance layer is made of an oxide.
And a second protective layer made of a resin formed on the upper surface of the first protective layer. According to this configuration, an oxidizing layer having excellent heat resistance is provided. A first protective layer made of a material and a second protective layer made of a resin having excellent moisture resistance.
Since the resistance layer is covered with the protective layer described above, the resistance layer is not affected by heat or moisture, thereby having the effect of reducing the rate of change in resistance during use.

According to a tenth aspect of the present invention, there is provided a substrate, a plurality of resistance layers provided on an upper surface of the substrate, and a plurality of pairs of upper surface electrodes provided at both ends of each upper surface of the plurality of resistance layers. A plurality of pairs of end face electrode layers provided on the end face of the substrate and a plurality of plating layers formed on the surface of the end face electrode layer so as to be electrically connected to the plurality of pairs of top face electrode layers. An external electrode layer, and a protective film provided so as to cover at least the plurality of resistance layers, wherein the substrate is made of a resin-based material, and a concave portion is provided at a portion of the end surface of the substrate located between the external electrode layers. According to this configuration, since a substrate made of a resin-based material softer than alumina is used, wear of the blade for cutting the substrate can be suppressed, and as a result, Reduce cutting costs In addition, in a multiple chip resistor having a plurality of independent resistance layers, the distance between the external electrode layers corresponding to the respective resistance layers at the end face of the substrate due to the recess is large, so that the external electrode layers This has the function of preventing the external electrode layers from contacting each other during the formation and electrically connecting the resistance layers from each other.

[0033] The invention according to claim 11 is a step of providing a base layer made of an oxide on a substrate made of a resin-based material,
Providing a resistive layer on the upper surface of the underlayer, providing a pair of upper electrode layers at both ends of the upper surface of the resistive layer, and electrically connecting the pair of upper electrode layers to the substrate. Providing a pair of end surface electrode layers formed on the end surfaces, forming an external electrode layer by providing a plating layer on the surfaces of the pair of end surface electrode layers, and forming a protective film so as to cover at least the resistance layer. According to this manufacturing method, since a substrate made of a resin-based material softer than alumina is used, wear of the substrate cutting blade during substrate cutting can be suppressed. This has the effect of reducing the cost of cutting the substrate.

According to a twelfth aspect of the present invention, the end face electrode layer is formed by curing a mixed paste composed of a metal powder and a resin.
According to this manufacturing method, the end face electrode layer 130 ° C. to 240 ° C.
Therefore, it is possible to suppress the influence of heat on the resistance layer, thereby reducing the change in resistance value during production.

According to a thirteenth aspect of the present invention, after the upper electrode layer and the resistance layer are formed by sputtering, they are each patterned into a predetermined shape by a photolithography method. The upper electrode layer and the resistive layer can be formed thinly, so that the substrate can be easily divided by vertical or horizontal grooves for division. In addition, since the resistive layer is patterned with high precision by a photolithography process, the effective area of the resistive layer can be increased. Is increased, whereby the rate of change in resistance can be reduced even when high power is applied.

According to a fourteenth aspect of the present invention, the underlayer and the protective film are formed by sputtering. According to this manufacturing method, the underlayer and the protective film can be formed densely. This makes it difficult for moisture to enter the resistance layer, thereby having the effect of stabilizing the resistance layer.

According to a fifteenth aspect of the present invention, a step of providing an underlayer on a substrate made of a resin-based material, a step of providing a plurality of resistance layers on an upper surface of the underlayer, and a step of providing an upper surface of the plurality of resistance layers Providing a plurality of pairs of upper surface electrode layers at both ends; a plurality of pairs of end surface electrode layers formed on an end surface of the substrate so as to be electrically connected to the plurality of pairs of upper surface electrode layers; Providing a plating layer on the surface of the layer to form an external electrode layer, and providing a protective film so as to cover at least the plurality of resistance layers; and a portion located between the external electrode layers on an end surface of the substrate According to this manufacturing method, since a substrate made of a resin-based material softer than alumina is used, wear of a substrate cutting blade can be suppressed. Substrate cutting In addition, in a multiple chip resistor having a plurality of independent resistive layers, the distance between the external electrode layers corresponding to each resistive layer at the end face of the substrate is increased due to the recess, so that the external electrode layer This has the function of preventing the external electrode layers from contacting each other during the formation and electrically connecting the resistance layers from each other.

According to a sixteenth aspect of the present invention, after providing at least the protective film, vertical and horizontal grooves for division are provided on the substrate so that a region corresponding to one resistor is continuously partitioned. According to this manufacturing method, the substrate is divided along the vertical and horizontal grooves for division to obtain a plurality of resistors. To divide the substrate after forming the electrode layer, protective film, etc.,
This eliminates the need to classify the substrate into dimensional ranks, thereby reducing the complexity of the process and eliminating the need to once divide the substrate into strips to form end face electrode layers and the like. A plurality of resistors can be obtained only by dividing the number of times, and as a result, the process can be simplified.

According to a seventeenth aspect of the present invention, the vertical and horizontal grooves for division are formed by a laser. According to this manufacturing method, only the portion irradiated with the laser can be reliably and rapidly formed. Since the vertical and horizontal grooves for division can be formed, it has an effect of improving productivity.

In the invention according to claim 18, a through hole is provided so as to straddle a portion to be a vertical groove of the substrate and not to cross a horizontal groove, and the through hole is filled with a conductor and the conductor is filled. The end face electrode layer is provided by being electrically connected to the upper electrode layer. According to this manufacturing method, the area corresponding to one resistor surrounded by the vertical groove and the horizontal groove is provided. Since the end face electrode layer can be formed inside, the resistor including the end face electrode layer is smaller than the one that the end face electrode layer does not protrude from the substrate, compared to the case where the substrate is divided into individual pieces and the end face electrode layer is provided. It has the effect of being able to.

According to a nineteenth aspect of the present invention, a through hole is provided so as to straddle a portion to be a vertical groove of a substrate and not to cross a horizontal groove, and an end face electrode layer is formed in the through hole by sputtering. According to this manufacturing method,
Since the end face electrode layer can be formed in a region corresponding to one resistor surrounded by the vertical groove and the horizontal groove, the end face electrode layer is formed more than the end face electrode layer provided after dividing the substrate into pieces. In addition to miniaturizing the resistor including the end face electrode layer as much as it does not protrude from the substrate, the end face electrode layer can be formed very thinly, so that the end face electrode layer surely enters the through hole, thereby stably This has an effect that an end face electrode layer can be provided.

According to a twentieth aspect of the present invention, the end face electrode layer is formed in the vertical or horizontal groove for division by sputtering. According to this manufacturing method, the end face electrode layer is extremely thin. Is formed, the end face electrode layer surely enters the divided groove, and thereby has an effect that the end face electrode layer can be stably provided.

According to a twenty-first aspect of the present invention, after attaching a sheet fixing material to a substrate, vertical grooves and horizontal grooves for division are provided on the substrate, and then the sheet fixing material is separated from the substrate. According to this manufacturing method, the substrate is divided, and when one of the vertical and horizontal grooves for division is provided, a positional shift occurs, and the other groove for division is moved to a predetermined position. Or when the substrate is divided, it is possible to prevent the individual resistors from being scattered apart, and to prevent the subsequent steps from being complicated.

According to a twenty-second aspect of the present invention, a sheet fixing material containing an adhesive having an ultraviolet curing property is used. According to this manufacturing method, the sheet is irradiated with ultraviolet rays. Since the adhesive force of the sheet fixing material can be eliminated at a high speed, the productivity can be improved. In addition, since the adhesive force of the sheet fixing material can be fundamentally eliminated, the sheet fixing material can be reliably separated from the substrate. It has the action of:

According to a twenty-third aspect of the present invention, the step of separating the sheet fixing material from the substrate is performed by irradiating an ultraviolet ray. Since the adhesive strength of the sheet fixing member can be easily eliminated, the sheet fixing member can be easily separated from the substrate.

(Embodiment 1) A resistor and a method of manufacturing the resistor according to Embodiment 1 will be described below with reference to the drawings.

FIG. 1A is a perspective view of a resistor according to the first embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along the line AA. In FIG. 1A, a plating layer 17 described later is omitted.

In FIGS. 1A and 1B, reference numeral 11 denotes a substrate, which has notches 12 at both ends, and is made of a resin material such as a resin, a resin compound, or a resin mixture. The shape of the notch 12 is substantially rectangular when viewed from above the substrate 11. Of course, other shapes such as a substantially semicircular shape may be used. A base layer 13 is provided on the upper surface of the substrate 11 and is made of an oxide containing alumina as a main component. 1
Reference numeral 4 denotes a resistance layer provided on the upper surface of the substrate 11 with a base layer 13 interposed therebetween. The material of the resistance layer 14 may be selected from ruthenium oxide, nickel-phosphorus, and the like depending on a target resistance value, a use, and the like.

When a liquid crystal polymer is used as the substrate 11, a liquid crystal polymer having an appropriate thermal expansion coefficient can be easily selected from liquid crystal polymers having different thermal expansion coefficients.
4 and the coefficient of thermal expansion of the printed circuit board can be adjusted, whereby the effect of preventing warpage of the substrate 11 during use due to the difference in the coefficient of thermal expansion can be obtained. In addition, the oxide containing alumina as a main component of the base layer 13 can reduce penetration of moisture into the substrate 11,
This is for obtaining the effect of improving the moisture resistance of the substrate 11 which is generally made of a resin-based material such as a liquid-absorbing liquid crystal polymer.

Reference numeral 15 denotes a pair of upper electrode layers, which are provided at both ends of the upper surface of the resistance layer 14 and are made of a gold-based material. Reference numeral 16 denotes a pair of end face electrode layers, which are formed in cutouts 12 provided at both ends of the substrate 11 so as to be electrically connected to the respective end faces of the resistance layer 14 and the top electrode layer 15. Consists of If a material composed of a metal powder and a resin is used as the conductor, the end face electrode layer can be fired at a low temperature of 130 ° C. to 240 ° C., so that the influence of heat on the resistance layer can be suppressed. In the resistance value can be reduced.

By forming the end face electrode layer 16 in the notches 12 provided at both ends of the substrate 11 in this manner, the end face electrode layer is provided more than a substrate having no notch provided with the end face electrode layer. The effect that the resistor including the end face electrode layer 16 can be reduced in size as much as the protrusion 16 does not protrude from the substrate 11 is obtained. In addition, the end face electrode layer 16 has the notch 1
2 is formed so as to fill the whole, and as a result, the cross-sectional area of the external electrode layer can be increased, so that the bonding strength with the printed board can be improved.

Reference numeral 17 denotes a plating layer, which is provided on the surface of the end face electrode layer 16 and a part of the upper surface of the upper electrode layer 15, and includes a nickel plating layer (barrier layer) 18 and a low melting point metal plating layer 1.
Consists of nine. A nickel plating layer 18 is formed on the surface of the end face electrode layer 16, and a low melting point metal plating layer 19 is formed on the surface of the nickel plating layer 18. Reference numeral 20 denotes an external electrode layer comprising an end face electrode layer 16 and a plating layer 17,
1 is formed on a part of the upper surface of the upper electrode layer 15, and is not provided on the back surface of the substrate 11. 21 is a protective film,
A first protective layer 22 provided so as to cover at least the resistance layer 14 and made of an oxide such as alumina or silica;
It comprises a second protective layer 23 made of a phenolic or epoxy resin. Further, a first protective layer 22 is formed on the upper surface of the resistance layer 14, and a second protective layer 23 is formed on the upper surface of the first protective layer 22.

Since the external electrode layer 20 is not provided on the back surface of the substrate 11, the back surface of the substrate 11 is sucked by the suction pins of the automatic mounting machine, and the upper surface of the substrate 11 faces the printed circuit board. In the case of mounting on a substrate, the stability at the time of suction is improved, and an effect that a high mounting rate can be secured can be obtained. A first protective layer 22 in which the protective film 21 is made of a heat-resistant oxide such as alumina or silica;
Second protective layer 2 made of phenolic or epoxy resin having moisture resistance and formed on the upper surface of first protective layer 22
3, the resistance layer 14 is covered with the protective film 21 having excellent heat resistance and moisture resistance, so that the resistance layer 14 does not need to be affected by heat or moisture. The effect that the rate of value change can be reduced is also obtained.
Further, by providing the external electrode layer 16 on the upper surface of the upper electrode layer 15, the contact area between the external electrode layer 20 and the upper electrode layer 15 is increased, so that even if an environmental load such as a thermal shock is applied, the contact resistance between them is reduced. This can suppress the increase of the contact resistance, and thus, even if the resistance layer 14 has a low resistance value, the ratio of the increase in the contact resistance to the resistance value of the resistance layer 14 can be reduced. .

The method of manufacturing the resistor according to the first embodiment of the present invention configured as described above will be described below with reference to the drawings.

FIGS. 2 to 8 are views showing a method of manufacturing the resistor according to the first embodiment of the present invention. In each of the figures, (b) is a top view, (a) is a cross-sectional view taken along the line BB of (b), and (d) and (f) are top views, and (c)
(E) is a sectional view taken along line BB of (d) and (f), respectively.

First, as shown in FIGS. 2A and 2B, a substrate 11 made of a resin-based material such as a resin, a resin compound, and a resin mixture is prepared (this substrate 11 has a plurality of resistors. This refers to a sheet-like substrate that is larger than one resistor for manufacturing. In order to obtain one resistor, the sheet-like substrate needs to be divided.)

The thickness of the substrate 11 is 0.05 mm to
0.25 mm is desirable. Since the substrate 11 is as thin as 0.25 mm or less, abrasion of the blade at the time of cutting the substrate can be suppressed small. However, when the thickness is less than 0.05 mm, the resistance layer 14
This makes it difficult to form the substrate 11 and makes it difficult to handle the substrate 11 itself.

Next, as shown in FIGS. 2C and 2D, an underlayer 1 made of an oxide such as alumina is formed on the upper surface of the substrate 11.
3 is provided.

Next, as shown in FIGS. 2E and 2F, the underlying layer 13 is patterned by a photolithography process.
At this time, an area other than an outer peripheral portion (a portion where a vertical groove 28 and a horizontal groove 29 to be described later are formed) of a region corresponding to one resistor (a portion having one independent resistance layer 14) is left. To

Next, as shown in FIGS. 3A and 3B, a resistance layer 14 is provided on the upper surface of the underlayer 13 and the substrate 11 on which the underlayer 13 is not provided by sputtering.

Next, as shown in FIGS. 3C and 3D, an upper electrode layer 15 made of a gold-based material is provided on the entire upper surface of the resistance layer 14 by sputtering. In addition, if necessary, the substrate 1
A back surface electrode may be provided on the back surface of one.

Next, as shown in FIGS. 3E and 3F, the upper electrode layer 15 is patterned by a photolithography method. At this time, one resistor (one independent resistance layer 1)
4) in the region corresponding to the resistance layer 14.
The upper surface electrode layer 15 is formed at both ends of the upper surface. Further, the upper electrode layer 15 is prevented from being continuous in a region corresponding to one resistor (a portion having one independent resistance layer 14).

Next, as shown in FIGS. 4A and 4B, the resistive layer 14 is patterned by a photolithography process, laser, or the like, as necessary, to obtain a target resistance value. Further, the resistive layer 14 is formed only on the upper surface of the underlying layer 13 other than the outer peripheral portion of the region corresponding to one resistor (the portion having one independent resistive layer 14). At this time, the resistive layer 14 and the upper surface electrode layer 15 formed on the upper surface of the resistive layer 14 are arranged so as to straddle the vertical groove 28 for division provided in a later step and not to straddle the horizontal groove 29.

As described above, after the upper electrode layer 15 and the resistance layer 14 are formed by sputtering and then patterned into a predetermined shape by the photolithography method, the upper electrode layer 15 and the resistance layer 14 can be formed thin. Therefore, in addition to the fact that the substrate 11 is easily divided by the dividing vertical grooves 28 or the horizontal grooves 29, the resist layer 14 is patterned with high precision by the photolithography process.
The effective area of the resistance layer 14 can be increased, whereby the effect that the rate of change in resistance can be reduced even when high power is applied can be obtained.

Next, as shown in FIGS.
Resistors (portion having one independent resistance layer 14)
In order to adjust the resistance between the upper electrode layers 15 in a region corresponding to the above, a trimming groove 24 is formed by laser trimming as necessary.

Next, as shown in FIGS. 4E and 4F, the upper electrode layer 15 is formed so that at least the resistance layer 14 is exposed.
A resist layer 25 is provided on a part of the upper surface by screen printing. Thereafter, 150 is applied so that the resist layer 25 becomes stable.
Curs at a temperature of 10 ° C. for 10 minutes.

Next, as shown in FIGS. 5A and 5B, the exposed resistive layer 14, a part of the upper electrode layer 15, and the upper surface of the resist layer 25 are formed on the exposed upper surface of a first layer made of an oxide such as alumina by sputtering. Is provided.

Next, as shown in FIGS. 5C and 5D, the resist layer 25 is lifted off, and the first protective layer 22 is patterned.

As described above, the underlayer 13 and the protective film 21
By forming at least the first protective layer 22 by sputtering, the underlayer 13 and the protective film 21 can be formed densely, so that it is difficult for moisture to enter the resistance layer 14, thereby stabilizing the resistance layer. The effect is obtained.

Next, as shown in FIGS. 5E and 5F, a second protective layer 23 made of resin is formed on the upper surface of the first protective layer 22.
Is provided by screen printing. After this, the second protective layer 2
3 is cured at a temperature of 180 ° C. for 30 minutes so as to be stable. At this time, the first protective layer 22 and the second protective layer 2
The protective film 21 made of 3 covers at least the resistance layer 14.

By providing the second protective layer 23 by screen printing, the second protective layer 23 can be formed at low cost.

Next, as shown in FIGS.
Resistors (portion having one independent resistance layer 14)
Through holes 26 at both ends of the substrate 11 in a region corresponding to
Is provided. That is, the through-hole 26 may extend over the dividing vertical groove 28 provided in a later step, and may not extend over the horizontal groove 29. The through-hole 26 corresponds to the notch 12 in FIG.

Next, as shown in FIGS. 6C and 6D, the end surface electrode layer 16 is provided by filling the through hole 26 with a mixed paste composed of a metal powder and a resin. This back end face electrode layer 1
The composition is cured at a temperature of 200 ° C. for 30 minutes so that No. 6 is stable. At this time, the end face electrode layers 16 are provided on both end faces of the substrate 11 so as to be electrically connected to the respective end faces of the resistance layer 14 and the upper face electrode layer 15.

As described above, the through hole 2 is formed so as to extend over the portion of the substrate 11 which will become the vertical groove 28 and not to extend over the horizontal groove 29.
6 is provided, the through hole 26 is filled with a conductor, and is electrically connected to the upper electrode layer 15 to provide the end face electrode layer 16. As a result, one end surrounded by the vertical groove 28 and the horizontal groove 29 is formed. The end face electrode layer 16 is provided in a region corresponding to the resistor.
Therefore, the size of the resistor including the end face electrode layer 16 can be reduced by the amount that the end face electrode layer 16 does not protrude from the substrate 11 as compared with the case where the end face electrode layer 16 is provided after the substrate 11 is divided into individual pieces. it can.

Further, since the end face electrode layer 16 was formed in the through hole 26 by curing a mixed paste composed of a metal powder and a resin, the end face electrode layer 16 was formed at a temperature of 130 ° C. to 24 ° C.
The firing can be performed at a low temperature of 0 ° C., whereby the effect of heat on the resistance layer 14 can be suppressed, and the effect of reducing the change in resistance during production can be obtained.

Instead of filling the through hole 26 with the conductor made of metal powder and resin as described above, the end face electrode layer 16 may be provided by sputtering. At this time,
In addition to the above-described effects, even if the through hole 26 is small, the end face electrode layer 16 can be formed very thin, so that the end face electrode layer 16 reliably enters the through hole 26, thereby stably stabilizing the end face electrode layer 16. Can be expected.

Next, as shown in FIGS. 6 (e) and 6 (f), the sheet fixing material 27 provided with an adhesive having an ultraviolet curing property on one surface is applied to the entire lower surface of the substrate 11, and the adhesive is applied to the substrate 1.
After attaching so as to contact with 1, a vertical groove 2 for division
8 is provided. At this time, the resistance layer 14, the upper electrode layer 15,
The end face electrode layer 16 extends over the vertical groove 28.

Next, as shown in FIGS. 7A and 7B, horizontal grooves 29 for division are provided. At this time, the resistance layer 14, the upper electrode layer 15, and the end face electrode layer 16 are prevented from straddling the lateral groove 29.

Of course, after providing the last component (in this case, the protective film 21) of the constituent elements such as the resistance layer 14 and the upper electrode layer 15, the vertical groove 28 and the horizontal groove 29 for division are formed and the substrate is formed. Dividing the substrate 11 is more efficient than dividing the substrate 11 and providing each component one by one.

The vertical grooves 28 and the horizontal grooves 29 for division are provided by a dicing process or by irradiating an excimer laser. In addition, if an excimer laser is used, only the portion irradiated with the laser can be reliably and rapidly separated into the vertical grooves 2 for division.
Since the groove 8 and the lateral groove 29 can be formed, the productivity is improved.

The dividing vertical groove 28 and the horizontal groove 29 are formed in the substrate 11 and a part of the sheet fixing member 27. Of course, the vertical groove 28 and the horizontal groove 29 for division are formed halfway of the substrate 11, and then the substrate 11 is formed by a dicing method or the like.
May be divided to obtain a plurality of individual resistors.

As described above, instead of filling the through-hole 26 with the conductor made of metal powder and resin, or providing the end face electrode layer 16 by sputtering, the through-hole 26 is divided without forming the through-hole 26. The end face electrode layer 16 may be provided in the vertical grooves 28 and the horizontal grooves 29 by sputtering. At this time, since the end face electrode layer 16 can be formed very thinly, the end face electrode layer 16 can surely enter the divided groove,
The end face electrode layer 16 can be stably provided.

Next, as shown in FIGS. 7 (c) and 7 (d), the sheet fixing member 27 is separated from the substrate 11 by irradiating ultraviolet rays, and the substrate 11 is separated along the vertical grooves 28 and the horizontal grooves 29 for division. Divide into a plurality of individual resistors.

As described above, the sheet fixing member 27 is attached to the substrate 11.
Is attached, a vertical groove 28 and a horizontal groove 29 for division are provided on the substrate 11, and then the sheet fixing member 27 is separated from the substrate 11 to divide the substrate 11. When one of the groove 28 and the lateral groove 29 is provided, a positional shift occurs, and the other dividing groove cannot be provided at a predetermined position. When the substrate 11 is divided, individual resistors This has the effect of preventing the vessels from being scattered apart and complicating subsequent steps. Further, since the sheet fixing material 27 containing an adhesive having an ultraviolet curing property is used, the adhesive force of the sheet fixing material 27 can be eliminated at high speed by irradiating the ultraviolet rays, thereby improving the productivity. In addition, since the adhesive strength of the sheet fixing material 27 can be fundamentally eliminated, the sheet fixing material 27
Can be separated. Further, the sheet fixing member 27 is removed from the substrate 11.
Is performed by irradiating ultraviolet rays, so that the adhesive force of the sheet fixing member 27 can be easily eliminated by irradiating the ultraviolet rays, whereby the sheet fixing member 27 can be easily separated from the substrate 11. .

Finally, as shown in FIGS. 8A and 8B,
Surface of end face electrode layer 16 and exposed top electrode layer 1
5, a plating layer 17 including a nickel plating layer 18 and a low melting point metal plating layer 19 is provided.

Since the resistor according to the first embodiment of the present invention uses the substrate 11 made of a resin-based material softer than alumina, the wear of the blade for cutting the substrate can be suppressed. The effect that the cutting cost can be suppressed can be obtained.

Further, since the substrate 11 is divided after the formation of the upper surface electrode layer 15, the resistance layer 14, the end surface electrode layer 16, the protective film 21, and the like, it is not necessary to classify the substrate 11 into dimensional ranks. The effect that complexity is eliminated is also obtained.

Further, the substrate 11 is divided after forming the upper surface electrode layer 15, the resistance layer 14, the end surface electrode layer 16, the protective film 21 and the like, and the substrate 11 is once formed into a strip shape to form the end surface electrode layer 16 and the like. There is no need to split,
It is possible to obtain a plurality of individual resistors only by dividing the resistor once, thereby obtaining an effect that the process can be simplified.

In FIG. 7 and FIG. 8, a plurality of two-piece independent resistors (portions having one independent resistive layer 14) connected by the lateral groove 29 can be obtained. However, as shown in FIG. 1, a plurality of resistors each having one independent resistance layer 14 may be obtained by the lateral groove 29. Of course, the above-described effect is obtained by connecting two or more resistors having one independent resistive layer, such as a resistor having one independent resistive layer and a resistor in Embodiment 2 described later. (Multiple chip resistors in which a plurality of independent resistive layers form one unit).

(Embodiment 2) Hereinafter, a resistor and a method of manufacturing the same according to Embodiment 2 will be described with reference to the drawings.

FIG. 9A is a perspective view of a resistor according to the second embodiment of the present invention, and FIG. 9B is a cross-sectional view taken along the line CC. FIG. 9A omits a protective film 21 described later. Further, the resistor according to the second embodiment of the present invention is a multiple chip resistor in which a plurality of independent resistance layers, which are one kind of the resistor, are formed as one unit.

9 (a) and 9 (b), reference numeral 11 denotes a substrate having concave portions 30 at both ends and made of a resin material such as a resin, a resin compound, and a resin mixture. The shape of the recess 30 is substantially semicircular when viewed from above the substrate 11. Of course, other shapes such as a rectangular shape may be used. A base layer 13 is provided on the upper surface of the substrate 11 and is made of an oxide containing alumina as a main component. Reference numeral 14 denotes a plurality of resistance layers, which are provided on the upper surface of the substrate 11 with the base layer 13 interposed therebetween. The material of the resistance layer 14 may be selected from ruthenium oxide, nickel-phosphorus, and the like depending on a target resistance value, a use, and the like. The plurality of resistance layers 14 are independent of each other and are arranged in parallel with each other.

When a liquid crystal polymer is used as the substrate 11, it is possible to easily select a liquid crystal polymer having an appropriate thermal expansion coefficient from liquid crystal polymers having different thermal expansion coefficients.
4 and the coefficient of thermal expansion of the printed circuit board can be adjusted, whereby the effect of preventing warpage of the substrate 11 during use due to the difference in the coefficient of thermal expansion can be obtained. In addition, the oxide containing alumina as a main component of the base layer 13 can reduce penetration of moisture into the substrate 11,
This is for obtaining the effect of improving the moisture resistance of the substrate 11 which is generally made of a resin-based material such as a liquid-absorbing liquid crystal polymer.

Reference numeral 15 denotes a plurality of pairs of upper electrode layers.
4 are provided at both ends of the upper surface and are made of a gold-based material. 1
Reference numeral 6 denotes a plurality of pairs of end surface electrode layers, a pair of resistance layers 14 corresponding to the pair of end surface electrode layers 16 and a pair of upper surface electrode layers 1 respectively.
5 is formed so as to be electrically connected to each end face, and is made of a conductor. If a material composed of a metal powder and a resin is used as the conductor, the end face electrode layer can be fired at a low temperature of 130 ° C. to 240 ° C., so that the influence of heat on the resistance layer can be suppressed. In the resistance value can be reduced.

Reference numeral 17 denotes a plurality of plating layers.
6, a nickel plating layer (barrier layer) 18 and a low-melting metal plating layer 19 are provided on a part of the upper surface of each upper electrode layer 15 corresponding to the surface of the electrode 6 and the end surface electrode layers 16. Further, a nickel plating layer 18 is formed on the surface of each end face electrode layer 16, and a low melting point metal plating layer 19 is formed on the surface of the nickel plating layer 18. Reference numeral 20 denotes a plurality of external electrode layers, and each external electrode layer 20 includes the end face electrode layer 16 and the plating layer 17.
Are formed on the end surface of the substrate 11 and a part of the upper surface of the upper electrode layer 15, and are not provided on the back surface of the substrate 11. In addition, the above-described concave portion 30 is formed in a portion located between the external electrode layers 20 on the end surface of the substrate 11. Reference numeral 21 denotes a protective film which is provided so as to cover at least all the resistive layers 14, and includes a first protective layer 22 made of an oxide such as alumina or silica, and a second protective layer 23 made of a phenol or epoxy resin. It is configured. Further, a first protective layer 22 is formed on the upper surface of each resistance layer 14, and a second protective layer 23 is formed on the upper surface of the first protective layer 22. The upper surface of each external electrode layer 20 is provided above the upper surface of the protective film 21.

Since the external electrode layer 20 is not provided on the back surface of the substrate 11 as described above, the back surface of the substrate 11 is sucked by the suction pins of the automatic mounting machine, and the upper surface of the substrate 11 faces the printed circuit board. In the case of mounting on a substrate, the stability at the time of suction is improved, and an effect that a high mounting rate can be secured can be obtained. A first protective layer 22 in which the protective film 21 is made of a heat-resistant oxide such as alumina or silica;
Second protective layer 2 made of phenolic or epoxy resin having moisture resistance and formed on the upper surface of first protective layer 22
3, the resistance layer 14 is covered with the protective film 21 having excellent heat resistance and moisture resistance, so that the resistance layer 14 does not need to be affected by heat or moisture. The effect that the rate of value change can be reduced is also obtained.
Further, by providing the external electrode layer 16 on the upper surface of the upper electrode layer 15, the contact area between the external electrode layer 20 and the upper electrode layer 15 is increased, so that even if an environmental load such as a thermal shock is applied, the contact resistance between them is reduced. This can suppress the increase of the contact resistance, and thus, even if the resistance layer 14 has a low resistance value, the ratio of the increase in the contact resistance to the resistance value of the resistance layer 14 can be reduced. .

Further, since the concave portion 30 is formed in a portion located between the external electrode layers 20 on the end face of the substrate 11, the concave portion 30 is formed.
In the multiple chip resistor in which a plurality of independent resistance layers such as the resistor according to the second embodiment of the present invention constitute one unit, a recess is provided between each external electrode layer 20 corresponding to each resistance layer 14. Due to 30, the distance at the end face of the substrate 11 (not the creepage distance) is increased, so that when the external electrode layers 20 are formed, the external electrode layers 20 contact each other and the resistive layers 14 are electrically connected. The effect that it can be prevented is obtained.

Further, the upper surface of the external electrode layer 20 is
1, the upper surface of the substrate 11 is directed toward the printed circuit board, and the upper surface of the external electrode 20 is in contact with the printed circuit board. The effect that it becomes possible is also obtained.

The method of manufacturing the resistor according to the second embodiment of the present invention configured as described above will be described below with reference to the drawings.

FIGS. 10 to 16 show a second embodiment of the present invention.
FIG. 4 is a diagram showing a method of manufacturing the resistor in FIG. In each of the drawings, (b) is a top view, (a) is a cross-sectional view taken along the line DD of (b), and (d) and (f) are top views in the same manner.
(C) and (e) are sectional views taken along line DD of (d) and (f), respectively.

First, as shown in FIGS. 10A and 10B,
A substrate 11 made of a resin-based material such as a resin, a resin compound, and a resin mixture is prepared (this substrate 11 is a sheet-like substrate larger than one resistor in order to manufacture a plurality of resistors. In order to obtain one resistor, it is necessary to divide this sheet-shaped substrate.)

Next, as shown in FIGS. 10 (c) and 10 (d),
An underlayer 13 made of an oxide such as alumina is provided on the upper surface of the substrate 11.

Next, as shown in FIGS. 10 (e) and 10 (f),
The underlying layer 13 is patterned by a photolithography method. At this time, one resistor (one independent resistance layer 1)
4 except for the outer peripheral portion (the portion where a vertical groove 28 and a horizontal groove 29 for division to be described later are formed).

Next, as shown in FIGS. 11A and 11B,
A resistance layer 14 is provided on the upper surface of the base layer 13 and the substrate 11 on which the base layer 13 is not provided by sputtering.

Next, as shown in FIGS. 11C and 11D,
An upper electrode layer 15 made of a gold-based material is provided on the entire upper surface of the resistance layer 14 by sputtering. Note that a back surface electrode may be provided on the back surface of the substrate 11 as needed.

Next, as shown in FIGS. 11E and 11F,
The upper electrode layer 15 is patterned by a photolithography method. At this time, in a region corresponding to one resistor (a portion having one independent resistance layer 14), the resistance layer 1
4 The upper electrode layer 15 is formed on both ends of the upper surface. Further, the upper electrode layer 15 is prevented from being continuous in a region corresponding to one resistor (a portion having one independent resistance layer 14).

Next, as shown in FIGS. 12A and 12B,
The resistance layer 14 is patterned by a photolithography method or a laser as necessary to obtain a target resistance value. Further, the resistive layer 14 is formed only on the upper surface of the underlying layer 13 other than the outer peripheral portion of the region corresponding to one resistor (the portion having one independent resistive layer 14). At this time, the resistive layer 14 and the upper surface electrode layer 15 formed on the upper surface of the resistive layer 14 are arranged so as to straddle the vertical groove 28 for division provided in a later step and not to straddle the horizontal groove 29.

As described above, after the upper electrode layer 15 and the resistance layer 14 are formed by sputtering, they are patterned into a predetermined shape by the photolithography method, whereby the upper electrode layer 15 and the resistance layer 14 can be formed thin. Therefore, in addition to the fact that the substrate 11 is easily divided by the dividing vertical grooves 28 or the horizontal grooves 29, the resist layer 14 is patterned with high precision by the photolithography process.
The effective area of the resistance layer 14 can be increased, whereby the effect that the rate of change in resistance can be reduced even when high power is applied can be obtained.

Next, as shown in FIGS. 12C and 12D,
If necessary, a trimming groove 24 is formed by laser trimming in order to adjust a resistance value between the upper electrode layers 15 in a region corresponding to one resistor (a portion having one independent resistive layer 14). .

Next, as shown in FIGS. 12 (e) and 12 (f),
At least the upper electrode layer 1 is exposed so that at least the resistance layer 14 is exposed.
The first resist layer 25a is provided on a part of the upper surface of the substrate 5 by screen printing. Thereafter, the first resist layer 25a is cured at a temperature of 150 ° C. for 10 minutes so as to be stable.

Next, as shown in FIGS. 13A and 13B,
A first protective layer 22 made of an oxide such as alumina is provided on the exposed resistive layer 14, a part of the upper electrode layer 15, and the upper surface of the first resist layer 25a by sputtering.

Next, as shown in FIGS. 13C and 13D,
The first resist layer 25a is lifted off, and the first protective layer 22 is patterned.

As described above, the underlayer 13 and the protective film 21
By forming at least the first protective layer 22 by sputtering, the underlayer 13 and the protective film 21 can be formed densely, so that it is difficult for moisture to enter the resistance layer 14, thereby stabilizing the resistance layer. The effect is obtained.

Next, as shown in FIGS. 13 (e) and 13 (f),
Second protective layer 2 made of resin on the upper surface of first protective layer 22
3 is provided by screen printing. Thereafter, the second protective layer 23 is cured at a temperature of 180 ° C. for 30 minutes so as to be stable. At this time, the first protective layer 22 and the second protective layer 2
3 is formed on at least all of the resistance layers 14.
Cover.

As described above, by providing the second protective layer 23 by screen printing, the second protective layer 23 can be formed at low cost.

Next, as shown in FIGS. 14A and 14B,
The second resist layer 3 covers at least the protective film 21.
1 is provided.

Next, as shown in FIGS. 14C and 14D,
After attaching a sheet fixing material 27 provided with an adhesive having ultraviolet curing properties on one surface to the entire lower surface of the substrate 11 so that the adhesive contacts the substrate 11, a vertical groove 28 for division is provided. . At this time, the resistance layer 14, the upper electrode layer 1
5. The end face electrode layer 16, which will be described later, straddles the vertical groove.

Next, as shown in FIGS. 14 (e) and (f),
The end face electrode layer 16 is provided by sputtering so as to cover the second resist layer 31, the upper electrode layer 15, and the vertical groove 28 exposed on the upper surface of the substrate 11. At this time, the end face electrode layer 16 enters the vertical groove 28.

Since the end face electrode layer 16 is formed in the vertical groove 28 for division by sputtering as described above, the end face electrode layer 16 can be formed very thinly. As a result, the effect that the end face electrode layer 16 can be stably provided can be obtained.

Next, as shown in FIGS. 15A and 15B,
The second resist layer 31 is lifted off, and all the protective films 2 are removed.
Expose one.

Next, as shown in FIGS. 15C and 15D,
A horizontal groove 29 for division is provided. At this time, the resistance layer 14, the upper electrode layer 15, and the end face electrode layer 16 are prevented from straddling the lateral groove 29.

The vertical grooves 28 and the horizontal grooves 29 for division are provided by a dicing method or by irradiating an excimer laser. In addition, if an excimer laser is used, only the portion irradiated with the laser can be reliably and rapidly separated into the vertical grooves 2 for division.
Since the groove 8 and the lateral groove 29 can be formed, the productivity is improved.

The dividing vertical groove 28 and the horizontal groove 29 are formed in the substrate 11 and a part of the sheet fixing member 27. Of course, vertical grooves 28 and horizontal grooves 29 for division are formed halfway in the substrate 11, and then the substrate 11 is formed by a dicing method or the like.
May be divided to obtain a plurality of resistors.

As described above, the dividing vertical grooves 28,
Instead of providing the end face electrode layer 16 in the lateral grooves 29 by sputtering, the through hole 26 is filled with a conductor made of a metal powder and a resin or sputtered, as in the resistor according to the first embodiment of the present invention. An end face electrode layer 16 may be provided. At this time, since the end face electrode layer 16 can be formed in a region corresponding to one resistor surrounded by the vertical groove 28 and the horizontal groove 29, the end face electrode layer 16 is provided after dividing the substrate 11 into pieces. The end face electrode layer 16 is
The resistor including the end face electrode layer 16 can be miniaturized by an amount not protruding from 1. Further, the end face electrode layer 16 is
If formed so as to fill the whole (corresponding to the notch portion 12), the cross-sectional area of the external electrode layer 20 can be increased, so that the bonding strength with the printed board can be improved.

When the through-hole 26 is provided and the end face electrode layer 16 is provided in this portion, the notch 12 and the concave portion 30 are formed on the end face of the substrate 11.

Next, as shown in FIGS. 15 (e) and (f),
Between the regions corresponding to one resistor (the portion having one independent resistance layer 14), the concave portion 3 is formed so as to include the lateral groove 29.
0 is provided. At this time, the recess 30 prevents regions corresponding to one resistor (a portion having one independent resistance layer 14) from separating from each other.

Next, as shown in FIGS. 16A and 16B,
The sheet fixing member 27 is separated from the substrate 11 by irradiating ultraviolet rays, and the substrate 11 is divided along a vertical groove 28 for division and a horizontal groove 29 where the concave portion 30 is not formed, and divided into a plurality of resistors.

The number of independent resistance layers 14 included in one unit can be selected by defining the position of the lateral groove 29 in which the concave portion 30 is provided.

As described above, the sheet fixing member 27 is attached to the substrate 11.
Is attached, a vertical groove 28 and a horizontal groove 29 for division are provided on the substrate 11, and then the sheet fixing member 27 is separated from the substrate 11 to divide the substrate 11. When one of the groove 28 and the lateral groove 29 is provided, a positional shift occurs, and the other dividing groove cannot be provided at a predetermined position. When the substrate 11 is divided, individual resistors This has the effect of preventing the vessels from being scattered apart and complicating subsequent steps. Further, since the sheet fixing material 27 containing an adhesive having an ultraviolet curing property is used, the adhesive force of the sheet fixing material 27 can be eliminated at high speed by irradiating the ultraviolet rays, thereby improving the productivity. In addition, since the adhesive strength of the sheet fixing material 27 can be fundamentally eliminated, the sheet fixing material 27
Can be separated. Further, the sheet fixing member 27 is removed from the substrate 11.
Is performed by irradiating ultraviolet rays, so that the adhesive force of the sheet fixing member 27 can be easily eliminated by irradiating the ultraviolet rays, whereby the sheet fixing member 27 can be easily separated from the substrate 11. .

Finally, as shown in FIGS. 16C and 16D, the nickel plating layer 18 and the low melting point metal plating layer 19 are formed on the surface of the end face electrode layer 16 and the upper surface of the exposed upper electrode layer 15. Is provided.

At this time, the upper surface of each external electrode layer 20 is set to be higher than the upper surface of the protective film 21.

FIG. 17 is a cross-sectional view showing a state in which the resistor according to the second embodiment of the present invention is mounted on a printed board 32 with the upper surface of the board 11 facing the printed board 32.

Normally, the external electrodes are mounted in such a manner that the lower surface of the substrate faces the printed circuit board and the external electrodes are in contact with the printed circuit board.
As is clear from FIG. 17, even when the upper surface of the substrate 11 faces the printed circuit board, the upper surface of the external electrode 20 contacts the printed circuit board 32 via the solder 33 for mounting. It can be mounted on the printed circuit board side. Such an effect can be applied to a resistor having one independent resistance layer or a multiple chip resistor having a plurality of independent resistance layers as one unit.

Since the resistor according to the second embodiment of the present invention uses the substrate 11 made of a resin material softer than alumina, the wear of the blade for cutting the substrate can be suppressed. The effect that the cutting cost can be suppressed can be obtained.

Further, since the substrate 11 is divided after the formation of the upper electrode layer 15, the resistance layer 14, the end face electrode layer 16, the protective film 21, and the like, it is not necessary to classify the substrate 11 into dimensional ranks. The effect that complexity is eliminated is also obtained.

Further, the substrate 11 is divided after the formation of the upper electrode layer 15, the resistance layer 14, the end face electrode layer 16, the protective film 21, and the like. There is no need to split,
It is possible to obtain a plurality of individual resistors only by dividing the resistor once, thereby obtaining an effect that the process can be simplified.

Although the resistor according to the second embodiment of the present invention has been described with reference to a multiple chip resistor in which two independent resistance layers are formed as one unit, three independent resistance layers are used. Needless to say, the same effect can be obtained with the multiple chip resistor described above.

[0138]

As described above, the resistor of the present invention comprises a substrate, a resistance layer provided on the upper surface of the substrate, and a pair of upper electrode layers provided at both ends of the upper surface of the resistance layer. The substrate is made of a resin-based material. According to this configuration, since a substrate made of a resin-based material softer than alumina is used, wear of the blade for cutting the substrate is suppressed. As a result, an effect that the cost for cutting the substrate can be suppressed can be obtained.

[Brief description of the drawings]

FIG. 1A is a perspective view of a resistor according to a first embodiment of the present invention. FIG. 1B is a cross-sectional view of the resistor taken along line AA.

FIGS. 2A to 2F are diagrams showing a method of manufacturing the resistor.

FIGS. 3A to 3F are diagrams showing a method of manufacturing the resistor.

FIGS. 4A to 4F are diagrams showing a method of manufacturing the resistor.

5 (a) to 5 (f) are views showing a method of manufacturing the same resistor.

FIGS. 6A to 6F are diagrams showing a method of manufacturing the resistor.

FIGS. 7A to 7D are diagrams showing a method of manufacturing the resistor.

8 (a) and 8 (b) are diagrams showing a method of manufacturing the same resistor.

9A is a perspective view of a resistor according to a second embodiment of the present invention, and FIG. 9B is a cross-sectional view of the resistor taken along line CC.

10 (a) to 10 (f) are views showing a method for manufacturing the same resistor.

11 (a) to 11 (f) are views showing a method for manufacturing the same resistor.

12 (a) to 12 (f) are views showing a method of manufacturing the same resistor.

FIGS. 13A to 13F are diagrams showing a method of manufacturing the resistor.

14A to 14F are views showing a method of manufacturing the same resistor.

FIGS. 15A to 15F are diagrams showing a method of manufacturing the same resistor.

FIGS. 16A to 16D are views showing a method of manufacturing the resistor.

FIG. 17 is a cross-sectional view showing a state where the resistor is mounted on a printed circuit board and the upper surface side of the circuit board is directed toward the printed circuit board;

18A is a perspective view of a conventional resistor, and FIG. 18B is a cross-sectional view of the resistor taken along line EE.

FIGS. 19A and 19B are diagrams showing a method of manufacturing the same resistor.

FIGS. 20A and 20B are diagrams showing a method of manufacturing the same resistor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Substrate 12 Notch 13 Underlayer 14 Resistance layer 15 Top electrode layer 16 End electrode layer 17 Plating layer 20 External electrode layer 21 Protective film 22 First protective layer 23 Second protective layer 26 Through hole 27 Sheet fixing material 28 Vertical groove 29 Horizontal groove 30 Recess

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E032 BA11 BB13 CA02 CC03 CC07 CC14 CC16 CC18 TA11 TB02 5E033 AA01 BB02 BC08 BE02 BE04 BF05 BG02 BH02 BH03

Claims (23)

[Claims] 1. A semiconductor device comprising: a substrate; a resistance layer provided on an upper surface of the substrate; and a pair of upper electrode layers provided on both ends of an upper surface of the resistance layer. A resistor characterized by becoming. 2. The resistor according to claim 1, wherein the resistor layer is formed on an upper surface of an oxide underlayer provided on the upper surface of the substrate. 3. The resistor according to claim 1, wherein the substrate is made of a liquid crystal polymer. 4. An external electrode layer comprising a pair of end surface electrode layers provided on the end surface of the substrate so as to be electrically connected to the pair of upper surface electrode layers, and a plating layer formed on a surface of the end surface electrode layer. 2. The resistor according to claim 1, wherein a pair of cutouts are formed at both ends of the substrate. 5. The resistor according to claim 4, wherein the end face electrode layer is made of a material composed of a metal powder and a resin. 6. The resistor according to claim 4, wherein the upper surface of the external electrode layer is provided above the upper surface of the protective film. 7. The resistor according to claim 4, wherein the external electrode layer is not provided on the back surface of the substrate. 8. The resistor according to claim 4, wherein the external electrode layer is provided on the upper surface of the upper electrode layer. 9. A first protection layer made of an oxide, wherein the protection film is provided so as to cover at least the resistance layer, and a second protection layer made of a resin formed on an upper surface of the first protection layer. 2. The resistor according to claim 1, wherein the resistor comprises: 10. A substrate, a plurality of resistance layers provided on an upper surface of the substrate, a plurality of pairs of upper electrode layers provided on both ends of each upper surface of the plurality of resistance layers, A plurality of external electrode layers including a plurality of pairs of end surface electrode layers provided on an end surface of the substrate so as to be electrically connected to the upper surface electrode layer and a plating layer formed on a surface of the end surface electrode layer; A resistor is formed of a resin material, and a recess is formed in a portion of the end face of the substrate located between the external electrode layers. 11. A step of providing an underlayer made of an oxide on a substrate made of a resin-based material, a step of providing a resistance layer on an upper surface of the underlayer, and a pair of upper electrodes on both ends of an upper surface of the resistance layer. Providing a layer, providing a pair of end surface electrode layers formed on the end surface of the substrate so as to be electrically connected to the pair of upper surface electrode layers, and plating the surfaces of the pair of end surface electrode layers. A method of manufacturing a resistor, comprising: providing a layer to form an external electrode layer; and providing a protective film so as to cover at least the resistance layer. 12. The method for manufacturing a resistor according to claim 11, wherein the end face electrode layer is formed by curing a mixed paste composed of a metal powder and a resin. 13. The method according to claim 11, wherein after the upper electrode layer and the resistance layer are formed by sputtering, they are patterned into a predetermined shape by a photolithography method.
A method for manufacturing the resistor as described in the above. 14. The method according to claim 11, wherein the underlayer and the protective film are formed by sputtering. 15. A step of providing an underlayer on a substrate made of a resin-based material, a step of providing a plurality of resistance layers on an upper surface of the underlayer, and a plurality of pairs of upper surfaces on both ends of the upper surfaces of the plurality of resistance layers. Providing an electrode layer, a plurality of pairs of end surface electrode layers formed on the end surface of the substrate, and a plating layer on the surface of the end surface electrode layer so as to be electrically connected to the plurality of pairs of upper surface electrode layers. Providing a step of forming an external electrode layer, and a step of providing a protective film so as to cover at least the plurality of resistance layers, wherein forming a concave portion in a portion located between the external electrode layers on an end surface of the substrate. Characteristic method of manufacturing a resistor. 16. A vertical groove and a horizontal groove for division are provided on a substrate so that a region corresponding to one resistor is continuously partitioned after providing at least a protective film. 16. The method of manufacturing a resistor according to claim 11, wherein the substrate is divided along the horizontal groove and a plurality of resistors are obtained. 17. The method according to claim 16, wherein the vertical and horizontal grooves for division are formed by laser. 18. A through hole is provided so as to straddle a portion to be a vertical groove of the substrate and not to straddle the horizontal groove. The through hole is filled with a conductor, and the conductor is electrically connected to the upper electrode layer. 17. The method for manufacturing a resistor according to claim 16, wherein the end face electrode layer is provided by being connected. 19. The substrate according to claim 16, wherein a through-hole is provided so as to straddle a portion to be a vertical groove of the substrate and not to cross a horizontal groove, and an end face electrode layer is formed in said through-hole by sputtering. Method of manufacturing resistors. 20. The method of manufacturing a resistor according to claim 16, wherein the end face electrode layer is formed in the vertical groove or the horizontal groove for division by sputtering. 21. After attaching a sheet fixing material to a substrate,
17. The method for manufacturing a resistor according to claim 16, wherein a vertical groove and a horizontal groove for division are provided on the substrate, and then the substrate is divided so as to separate the sheet fixing material from the substrate. 22. The method for manufacturing a resistor according to claim 21, wherein an adhesive having an ultraviolet curing property is used as the sheet fixing material. 23. The method according to claim 22, wherein the step of separating the sheet fixing material from the substrate is performed by irradiating ultraviolet rays.