JP2001162407A - Spindle shaft for tooling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent ionization of a semiconductor wafer after grinding and polishing work by generation of metal to generate troubles in super-high precision mirror surface work and flat work, to prevent generation of rust or abrasion in the metal, and to prevent troubles in improving precision in the super- high precision mirror surface work and flat work caused by atmospheric temperature change or differential temperature in heating by friction heat. SOLUTION: In this spindle shaft provided on the column of a machine tool for mainly grinding and polishing semiconductors elevatable and rotatable, and provided with a chuck at a lower end, or spindle shaft rotatably provided on a base of a machine tool and provided with a grinding or polishing plate at an upper end, the spindle shaft is formed of a composite body comprising metal and ceramic in which a molten aluminum alloy is set to penetrate a perform of ceramic grain under no pressure.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spindle shaft of a machine tool for grinding or polishing a semiconductor wafer serving as a substrate in a process of manufacturing a super LSI or the like. The present invention relates to a spindle shaft of a machine tool that can be applied to a semiconductor wafer that requires mirror processing and flat processing.

[0002]

BACKGROUND OF THE INVENTION Semiconductor wafers of this kind according to the present invention are:
It is used in electronic devices such as computers, OA devices, and integrated circuits such as mobile devices. Its development is progressing day by day. There has been a demand for ever-larger diameters and even higher-precision quality from the viewpoint of yield.

In addition, these semiconductor wafer devices are:
With the increase in density and the degree of integration, mass production of ultra LSIs (ULSI) of 64 megabytes or more has begun, and in recent years, ultra LSIs of 256 megabytes or 1 gigabyte, etc.
Is shifting to the age of.

[0004] In these circumstances, the diameter has been further increased from the viewpoint of productivity, and mass production of 12-inch semiconductor wafers has already started, and furthermore, 16-inch semiconductor wafers have been prototyped. In addition, further ultra-high-precision quality is required from the viewpoint of yield, and ultra-high-precision mirror finishing and flattening of both surfaces of a semiconductor wafer after slicing of a silicon ingot are indispensable.

[0005]

2. Description of the Related Art Conventionally, a spindle having a chuck at a lower end and a grinding or polishing plate at an upper end of a machine for performing grinding and polishing of a semiconductor wafer of this kind by a grinding machine, a lapping machine, a polishing machine or the like. The shaft was formed by processing a metal such as iron or stainless steel.

[0006]

However, metal ions are generated from the metal, and the semiconductor wafer after the grinding and polishing is ionized, which often causes obstacles to ultra-high precision mirror finishing and flattening. In addition to the occurrence of wear and abrasion, temperature changes in the atmosphere and expansion and contraction due to temperature differences such as heating due to frictional heat have become obstacles to the improvement of the precision of mirror finishing and flattening with ultra-high accuracy.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and as a result of diligent studies, it has been found that a semiconductor wafer is mainly ground,
A spindle shaft rotatably provided on a column of a machine tool to be polished and rotatably provided with a chuck at a lower end thereof, or a spindle shaft rotatably provided on a base of a machine tool and provided with a grinding or polishing plate at an upper end thereof, comprising: The shaft is formed of a composite of metal and ceramic in which a molten aluminum alloy is impregnated without pressure into a preform formed by molding ceramic grains.

Accordingly, an object of the present invention is to provide a spindle shaft for performing a grinding process and a polishing process without affecting a processing surface of a semiconductor wafer requiring ultra-high accuracy due to ionization.

[0009]

According to the present invention, since the spindle shaft of the machine tool is formed of a composite of metal and ceramic, metal ions and rust are not generated as in the case of metal, and the temperature in the atmosphere is further reduced. The influence of the temperature difference due to change and wear is small.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a spindle shaft of a machine tool according to the present invention will be described with reference to the drawings.

FIG. 1 is a schematic front view of a wrapping machine for explaining an embodiment of a spindle shaft of a machine tool according to the present invention.

The present invention mainly relates to a spindle shaft 1A.1 of a machine tool for grinding or polishing a semiconductor wafer serving as a substrate in a manufacturing process of a super LSI or the like. 1B, and more specifically, a spindle shaft 1A.1 of a machine tool that can be applied to a semiconductor wafer W requiring ultra-high-precision mirror processing and flat processing. 1B, wherein the spindle shaft 1A of the machine tool according to claim 1 mainly includes a semiconductor wafer W
Is a spindle shaft 1A provided on a base shaft 12 erected on a base 11 of a machine tool for vertically grinding and polishing, and rotatably provided on a column 13 and rotatably provided with a chuck 14 at a lower end. It is formed of a composite of metal and ceramic in which a molten aluminum alloy is impregnated into a molded preform without applying pressure.

A spindle shaft 1B of a machine tool according to a second aspect of the present invention is a spindle having a grinding or polishing plate 15 at its upper end which is rotatably provided on a base 11 of a machine tool for mainly grinding and polishing a semiconductor wafer W. Axis 1B,
The spindle shaft 1B is formed of a composite of metal and ceramic in which a molten aluminum alloy is impregnated without pressure into a preform formed by molding ceramic grains.

That is, as shown in FIG. 1, one of the spindle shafts 1A of the machine tool of the present invention is rotatably provided on a base shaft 12 erected on a base 11, as described by the lapping machine of the embodiment. Column 13 and column 1
The other spindle shaft 1 </ b> B is rotatably disposed on the base 11.

A chuck 14 is provided at the lower end of one of the spindle shafts 1A. A semiconductor wafer W which is a non-grinding or polishing work is attached to the lower surface of the chuck 14 by means such as vacuuming or water bonding. It is to be attached by.

Next, the semiconductor wafer W attached to the chuck 14 is rotated in the opposite direction by the lowering and rotation of the pindle shaft 1A, and the grinding or polishing plate 1 described later is rotated.
5 is wrapped by being pressed between the lapping table 5 and the wrapping table.

Further, the other spindle shaft 1B is connected to the base 11
A lapping table, which is a rotatable grinding or polishing plate 15 disposed at the upper end, is mechanically connected to a drive source motor (not shown) or the like and is rotated.

In this case, the chuck 14 or the grinding or polishing plate 15 is made of ceramic, and the spindle shaft 1A. 1B uses the composite of metal and ceramic of the present invention.

That is, the spindle shaft 1A. The material for forming the spindle shaft 1A.1B is a composite of metal and ceramic in which a molten aluminum alloy is impregnated into a preform formed of ceramic grains without applying pressure.
1B can withstand the strength sufficiently, and there is no generation of metal ions.

[0020]

According to the above construction, the spindle shaft of the machine tool of the present invention is formed of a composite of metal and ceramic in which a molten aluminum alloy is impregnated into a preform formed of ceramic grains without applying pressure. Therefore, it does not generate metal ions or rust as in the case of a metal, and furthermore, has little expansion and contraction due to a temperature change in the atmosphere and a temperature difference caused by heating of abrasion, and has an extremely significant effect. is there.

[Brief description of the drawings]

FIG. 1 is a schematic front view of a wrapping machine for explaining an embodiment of a spindle shaft of a machine tool according to the present invention.

[Explanation of symbols]

 W Semiconductor wafer 1A One spindle shaft 1B The other spindle shaft 11 Base 12 Base shaft 13 Column 14 Chuck 15 Grinding or polishing table

Claims (2)

[Claims] 1. A spindle shaft having a chuck provided at a lower end thereof and rotatably mounted on a column of a machine tool for grinding and polishing a semiconductor wafer, wherein the spindle shaft is formed of a preform formed of ceramic grains. A spindle shaft of a machine tool, wherein the spindle shaft is formed of a composite of a metal and a ceramic in which an alloy is impregnated without pressure. 2. A spindle shaft mainly rotatably provided on a base of a machine tool for grinding and polishing a semiconductor wafer, the spindle shaft having a grinding or polishing plate at an upper end, wherein the spindle shaft is a preform formed by forming ceramic grains. A spindle shaft of a machine tool, wherein the spindle shaft is formed of a composite of a metal and a ceramic in which a molten aluminum alloy is impregnated without pressure.