JP2001160569A - Semiconductor manufacturing apparatus and semiconductor manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To offer a semiconductor manufacturing apparatus which enables uniform sticking of a resin tape on which a wiring pattern for connecting internal terminals with external terminals is formed, to a semiconductor chip such as LSI and IC. SOLUTION: A bumping member, comprising a predetetmined depth of grooves 6 having a gratings shape is arranged on a stage 5. A resin tape on which a wiring pattern is formed and a semiconductor chip 3 are placed on the bumping member. When the substrate is pressed by a pressing member 4, only the bumping member under the semiconductor chip is pressed so as to fill the grooves, thereby pressing the resin tape uniformly.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus and a semiconductor manufacturing method, and more particularly to a semiconductor manufacturing apparatus and a semiconductor manufacturing method suitable for attaching a semiconductor chip and a tape on which a wiring pattern is formed.

[0002]

2. Description of the Related Art Conventionally, in order to bond a semiconductor chip such as an LSI or an IC with a tape provided with a wiring pattern connecting an internal terminal and an external terminal, a buffer material having a flat surface and a uniform thickness is used. I was using it. Here, a conventional semiconductor chip attaching apparatus will be described with reference to FIG. 4A and 4B are diagrams schematically showing a conventional semiconductor chip attaching device, wherein FIG. 4A is a cross-sectional view, and FIG. 4B is a diagram showing a pressure applied to a cushioning material.

[0003] As shown in FIG.
In order to attach a resin tape provided with a wiring pattern to the surface, a buffer material 1 having a flat surface and a uniform thickness is placed on the stage 5.
c, the semiconductor chip 3 temporarily fixed with the resin tape 2 is placed on the semiconductor chip 3 with the resin tape 2 side facing down, and the semiconductor chip 3 is pressed from above the semiconductor chip 3 using the pressing means 4. I was

[0004]

However, in such a conventional structure, the cushioning material 1c is deformed at the time of pressurization and the cushioning material 1c under the semiconductor chip 3 is pushed down, so that the cushioning material 1c around the semiconductor chip 3 is pressed. Soaring,
As a result, there is a problem that the pressure applied to the semiconductor chip 3 becomes uneven.

In particular, depending on the material, shape, and pressing strength of the cushioning material 1c, a gap 8 is generated between the outer peripheral portion of the semiconductor chip 3 and the cushioning material 1c, the pressure is reduced, and the bonding becomes insufficient. There was a problem that would. In such a case, bubbles 9 are generated between the outer peripheral portion of the semiconductor chip 3 in which the pressure is reduced and the resin tape 2, and the bubbles 9 are expanded by heating during mounting, and the semiconductor chip 3 and the resin tape 2 are separated from each other. However, there is a problem that a connection failure occurs.

Here, referring to FIG. 4B showing the distribution of the pressure applied to the cushioning material 1 c, it can be seen that the pressure at the portions corresponding to both ends of the semiconductor chip 3 has once decreased due to the formation of the gap 8. Understand. The horizontal axis in the figure indicates the position in the horizontal direction, and the vertical axis indicates the magnitude of the pressure applied to the resin tape 2.

The present invention has been made in view of the above problems, and a main object of the present invention is to provide a resin tape in which a wiring pattern connecting internal terminals and external terminals is formed on a semiconductor chip such as an LSI or IC. It is an object of the present invention to provide a semiconductor manufacturing apparatus and a semiconductor manufacturing method capable of uniformly bonding semiconductor devices.

[0008]

In order to achieve the above object, according to the present invention, in a first aspect, a sample placed on a fixed base is pressurized by a pressing means provided above the sample. In the pressing device that presses, a groove having a predetermined depth is formed in a lattice shape on the surface side in contact with the sample, at least between the fixing table and the sample, or at least one between the pressing unit and the sample. With the formed cushioning material, each region divided by the lattice-like grooves of the cushioning material is crushed so as to fill the grooves by applying pressure, thereby uniformly pressing the sample. .

According to a second aspect of the present invention, there is provided a pressurizing apparatus for pressurizing a sample placed on a fixed base by a pressurizing means provided above the sample in a second viewpoint. Or at least one between the pressurizing means and the sample, a cushioning material having projections of a predetermined height two-dimensionally arranged on a surface side in contact with the sample, The projections arranged one-dimensionally are crushed by pressure and flattened, thereby uniformly pressing the sample.

According to a third aspect of the present invention, in a third aspect, a tape on which a wiring pattern is formed and a semiconductor chip, which are mounted on a stage, are adhered to each other by being pressed by a pressing means provided above the tape. In the semiconductor manufacturing apparatus, between the stage and the tape, there is provided a cushioning material in which a groove of a predetermined depth is formed in a lattice shape on a surface side in contact with the tape, and the cushioning material is By pressing, the groove is elastically deformed so as to fill the groove.

According to a fourth aspect of the present invention, in a fourth aspect, a semiconductor device is provided in which a tape mounted on a stage and having a wiring pattern formed thereon and a semiconductor chip are pressed by a pressing means provided above the semiconductor chip. In the manufacturing apparatus, between the stage and the tape, there is provided a cushioning material in which projections of a predetermined height are two-dimensionally arranged on a surface side in contact with the tape, and the cushioning material is pressed by the pressing means. By
The protrusion is elastically deformed so as to push it apart.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor manufacturing apparatus according to the present invention
In a preferred embodiment, a cushioning material (1a in FIG. 2) in which grooves (6 in FIG. 2) having a predetermined depth are formed in a grid on a stage (5 in FIG. 2) is placed. A resin tape (2 in FIG. 2) on which a wiring pattern is formed and a semiconductor chip (3 in FIG. 2) are placed, and when pressure is applied from above by a pressing means (4 in FIG. 2), a buffer material under the semiconductor chip is used. Only by being crushed to fill the groove,
This is to press the resin tape uniformly.

When the cushioning member 1a of this configuration is used, as shown in FIG. 2, only the cushioning member 1a below the semiconductor chip 3 is deformed, and under the semiconductor chip 3, the gap of the groove 6 is filled by the deformation. Thus, the lower surface of the semiconductor chip 3 can be pressed evenly. Therefore, the resin tape 2 can be uniformly applied to the semiconductor chip 3 without the problem that the pressure around the semiconductor chip 3 decreases as in the related art and the bubbles 8 are generated between the semiconductor chip 3 and the resin tape 2. Can be attached to

[0014]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing an embodiment of the present invention;

[Embodiment 1] A semiconductor manufacturing apparatus according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing a configuration of a semiconductor manufacturing apparatus according to a first embodiment of the present invention. 2A and 2B are views showing a state in which a semiconductor chip and a resin tape are bonded to each other. FIG. 2A is a cross-sectional view showing a state before pressing, FIG. 2B is a cross-sectional view showing a state after pressing, (C) is a diagram showing the pressure applied to the resin tape.

First, the configuration of a semiconductor manufacturing apparatus according to a first embodiment of the present invention will be described with reference to FIG. 1. The semiconductor manufacturing apparatus according to the present embodiment includes a stage 5, a buffer 1a, and a pressing mechanism 4 And the cushioning material 1 placed on the stage 5
A is provided with a lattice-shaped groove 6. Further, a semiconductor chip 3 such as an LSI or an IC and a wiring pattern for connecting the internal terminal and the external terminal are provided on the buffer material 1a, and an adhesive is applied to a surface to be bonded to the semiconductor chip 3. Is installed.

Next, the operation of this embodiment will be described with reference to FIG. As shown in FIG.
The cushioning material 1a is arranged so that the groove 6 faces the upper surface, and the resin tape 2 and the semiconductor chip 3 are arranged thereon in this order. Then, as shown in FIG.
Pressure is applied from the upper surface of the semiconductor chip 3 by the pressurizing means 4 provided above the semiconductor chip 3.

The semiconductor chip 3 and the resin tape 2 come into close contact with each other,
When only the cushioning material 1a in the lower area of the semiconductor chip 3 is pushed down, the cushioning material 1a in that portion is deformed and spreads laterally, filling the gap of the groove 6. By filling the gaps of the grooves 6 in this manner, the cushioning material 1 a can uniformly push the entire lower surface of the resin tape 2, and the resin tape 2 can be stuck to the semiconductor chip 3 uniformly.

The pressure distribution at this time will be described with reference to FIG. The horizontal axis in the figure indicates the position in the horizontal direction, and the vertical axis indicates the magnitude of the pressure applied to the resin tape 2. FIG.
As shown in (c), the buffer 1a under the semiconductor chip 3
Are crushed and spread in the lateral direction, and the semiconductor chip 3 is uniformly
, The pressure drop at the end of the semiconductor chip 3 can be avoided.

Here, the buffer material 1a may be any material as long as it can be elastically deformed reversibly, and its material, the width and depth of the groove 6, etc. are determined according to conditions such as the size of the chip to be bonded and the applied pressure. It can be determined as appropriate. By optimizing the interval between the grooves 6, the resin tapes 2 can be bonded with a uniform pressure regardless of the shape of the semiconductor chip 3.

According to an experiment conducted by the inventor, when silicone rubber having a thickness of about 1 mm was used as the material of the buffer material 1a, thermocompression bonding was performed at a temperature of 260 ° C. and a pressure of 40 kgf / cm 2. As a result, the semiconductor chip 3 and the resin tape 2 were uniformly bonded.

Embodiment 2 Next, a semiconductor manufacturing apparatus according to a second embodiment of the present invention will be described with reference to FIG. 3A and 3B are views showing a state in which a semiconductor chip and a resin tape are bonded to each other. FIG. 3A is a cross-sectional view showing a state before pressing, FIG. 3B is a cross-sectional view showing a state after pressing, and FIG. () Is a diagram showing the pressure applied to the resin tape. The second embodiment is different from the first embodiment only in the surface structure of the cushioning material, and the other materials, manufacturing method, and the like are the same as those in the first embodiment.

The configuration of the semiconductor manufacturing apparatus according to the second embodiment of the present invention has a stage 5, a buffer 1b, and a pressure mechanism 4, and the buffer 1b placed on the stage 5 has Protrusions 7 arranged in a dimension are provided. Also, cushioning material 1b
A wiring pattern for connecting a semiconductor chip 3 such as an LSI or an IC and its internal and external terminals is provided on the
A resin tape 2 having an adhesive applied to a surface to be bonded to the semiconductor chip 3 is provided.

Next, the operation of this embodiment will be described with reference to FIG. As shown in FIG.
The buffer material 1b is arranged so that the protrusion 7 faces the upper surface, and the resin tape 2 and the semiconductor chip 3 are arranged thereon in this order. Thereafter, as shown in FIG. 3B, pressure is applied from above the semiconductor chip 3 by the pressurizing means 4 provided above the semiconductor chip 3.

The semiconductor chip 3 and the resin tape 2 come into close contact with each other,
When only the cushioning material 1b in the lower region of the semiconductor chip 3 is pushed down, the protrusion 7 at that portion is elastically deformed and spreads laterally, filling the recess around the protrusion 7 to have a flat shape. By filling the gaps of the recesses in this manner, the cushioning material 1
b can evenly press the entire lower surface of the resin tape 2,
The resin tape 2 can be uniformly attached to the semiconductor chip 3.

As shown in FIG. 3C, the pressure distribution at this time is such that the buffer material 1b under the semiconductor chip 3 is crushed and spreads in the lateral direction, so that the buffer material 1b comes into uniform contact with the semiconductor chip 3. In addition, it is possible to avoid the problem that the pressure drops at the end of the semiconductor chip 3.

Here, the cushioning material 1b may be any material as long as it can be elastically deformed reversibly, and its material, the shape of the protrusion 7, etc., depend on the size of the chip to be bonded, the applied pressure, and other conditions. It is the same as in the first embodiment that can be determined as appropriate.

[0028]

As described above, according to the semiconductor manufacturing apparatus of the present invention, the semiconductor chip and the resin tape can be uniformly bonded, and the connection reliability after mounting can be improved. Play.

The reason is that the cushioning material in the area divided by the groove or the projection is pushed out by pressurization, and the entire area of the semiconductor chip is uniformly contacted with the cushioning material and pressed. This is because no bubbles or the like are generated during the mounting, and a connection failure due to the bubbles rising due to heating during mounting can be prevented.

[Brief description of the drawings]

FIG. 1 is a perspective view schematically illustrating a configuration of a semiconductor manufacturing apparatus according to one embodiment of the present invention.

FIGS. 2A and 2B are diagrams for explaining functions of the semiconductor manufacturing apparatus according to one embodiment of the present invention, wherein FIGS.
(C) is a pressure distribution diagram.

FIGS. 3A and 3B are diagrams for explaining functions of the semiconductor manufacturing apparatus according to one embodiment of the present invention, in which FIGS.
(C) is a pressure distribution diagram.

4A and 4B are diagrams for explaining functions of a conventional semiconductor manufacturing apparatus, wherein FIG. 4A is a cross-sectional view and FIG. 4B is a pressure distribution diagram.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1a, 1b, 1c Buffer material 2 Resin tape 3 Chip 4 Pressure mechanism 5 Stage 6 Groove 7 Projection 8 Gap 9 Air bubble

Claims (8)

[Claims] 1. A pressurizing device for pressurizing a sample placed on a fixed table by a pressurizing means provided above the sample, wherein the pressurizing means is provided between the fixed table and the sample or the pressurizing means. And at least one between the sample and the sample, provided with a buffer material in which a groove of a predetermined depth is formed in a lattice shape on the surface contacting the sample, each of which is divided by the lattice-like groove of the buffer material A pressing device, wherein the sample is pressed uniformly by crushing an area to fill the groove by pressing. 2. A pressurizing apparatus for pressurizing a sample placed on a fixed base by a pressurizing means provided above the sample, wherein the pressurizing means is provided between the fixed base and the sample or the pressurizing means. At least one between the sample and the sample, provided with a cushioning material in which projections of a predetermined height are two-dimensionally arranged on the surface side in contact with the sample, the projections two-dimensionally arranged of the cushioning material, A pressing device, wherein the sample is pressed uniformly by being crushed and flattened by pressing. 3. A semiconductor manufacturing apparatus for bonding a tape, on which a wiring pattern is formed, and a semiconductor chip, which are mounted on a stage, to each other by pressing by a pressing means provided above the tape. Between the tape and the tape, a buffer material having a groove of a predetermined depth is formed in a lattice shape on the surface contacting the tape, and the buffer material fills the groove by the pressing of the pressing means. A semiconductor manufacturing apparatus characterized by being elastically deformed. 4. A semiconductor manufacturing apparatus for bonding a tape, on which a wiring pattern is formed, and a semiconductor chip, which are mounted on a stage, to each other by pressurizing the tape by a pressurizing means provided above the stage. Between the tape and the tape, there is provided a cushioning material in which projections of a predetermined height are two-dimensionally arranged on a surface side in contact with the tape, and the cushioning material pushes the projection by the pressing of the pressing means. A semiconductor manufacturing apparatus characterized by being elastically deformed so as to expand. 5. The semiconductor manufacturing apparatus according to claim 3, wherein a region of the buffer material where the groove or the protrusion is formed is larger than a contact surface between the semiconductor chip and the tape. 6. The semiconductor manufacturing apparatus according to claim 3, wherein said cushioning member is made of a member containing silicon rubber. 7. A semiconductor manufacturing method in which a tape and a semiconductor chip on which a wiring pattern is formed, which is mounted on a stage, are bonded by pressing with a pressing means provided above the semiconductor chip. Between the tape and the tape, a buffer material having a groove of a predetermined depth formed in a lattice shape on a surface side in contact with the tape is provided, and the pressing means is pressed so that the groove of the buffer material is filled. A semiconductor manufacturing method characterized by the above-mentioned. 8. A semiconductor manufacturing method for bonding a tape, on which a wiring pattern is formed, and a semiconductor chip, which are mounted on a stage, by pressing with a pressing means provided above the stage, wherein the stage and the semiconductor chip are bonded. A cushioning material is provided between the tape and the tape, the protrusion having a predetermined height being two-dimensionally arranged on a surface side in contact with the tape, and the cushioning material is crushed and flattened. A method for manufacturing a semiconductor, comprising pressing by a pressure means.