JP2001156228A - Semiconductor device with cooler and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device with a cooler, which can perform efficiently cooling, and its manufacturing method. SOLUTION: This semiconductor device with a cooler has cooling element blocks 3, each of which is composed of a peltier element, etc., built in a substrate 2 of semiconductor devices 1 being located in alternate order. Each of the cooling element blocks 3 is a dummy pattern which is formed on the substrate 2 at the same time as the semiconductor devices 1 and functions partly or entirely as a cooling element.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor device with a cooling device and a method for manufacturing the semiconductor device with a cooling device.

[0002]

2. Description of the Related Art Semiconductor devices generate heat when energized. As a result, an increase in the temperature leads to a failure such as a decrease in the operation speed, and furthermore to a destruction of the device itself. In order to avoid this, the device is blown by a fan, provided with cooling fins, or a combination thereof to promote heat dissipation. However, in these methods, the cooling efficiency is poor, so that the fans and fins become large in order to cope with a large amount of heat generation, which has been an obstacle to downsizing the set.

By the way, as a path through which heat generated by the device is radiated, the heat resistance of the heat radiating path to the substrate in which the device is formed and in direct contact is the smallest, and the amount of heat radiated by this path is dominant. Therefore, cooling the substrate enhances the heat dissipation performance of the device. On the other hand, Japanese Patent Application Laid-Open No. 61-82450 discloses a technique in which a cooling element such as a Peltier element is brought into contact with a substrate to enhance heat radiation performance.

[0004]

However, in the prior art described in the above-mentioned publication, since the cooling element is in contact with the substrate, there is a problem that the heat resistance at the contact portion is high and cooling cannot be performed efficiently.

SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a semiconductor device with a cooling device and a method for manufacturing the semiconductor device with a cooling device, which can efficiently perform cooling.

[0006]

According to a first aspect of the present invention, there is provided a semiconductor device with a cooling device in which a semiconductor device is cooled by a cooling element, wherein the semiconductor device is provided with a substrate. In addition, the cooling element,
The cooling element and the semiconductor device are formed so as to be adjacent to each other in the substrate.

According to a second aspect of the present invention, there is provided a semiconductor device with a cooling device in which a semiconductor device is cooled by a cooling element, wherein the semiconductor device is formed on a substrate on which the semiconductor device is formed. The cooling element is formed on the back surface side of the portion where the cooling is performed.

According to a third aspect of the present invention, a cooling capacity of the cooling element is controlled based on a temperature of the semiconductor device.

According to a fourth aspect of the present invention, the cooling capacity of the cooling element is set in advance based on a previously derived heat generation amount per unit time of the semiconductor device.

[0010] According to a fifth aspect of the present invention, the cooling capacity of the cooling element is controlled based on the power consumption of the semiconductor device.

According to a sixth aspect of the present invention, the cooling capacity of the cooling element is controlled based on an operation state of the semiconductor device.

According to a seventh aspect of the present invention, there is provided a method of manufacturing a semiconductor device with a cooling device in which a semiconductor device is cooled by a cooling element, wherein the semiconductor device is formed on a substrate. A part or all of the formed dummy pattern is formed so as to function as the cooling element.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 is a diagram schematically showing a configuration of a semiconductor device with a cooling device (such as an arithmetic unit or a memory) according to Embodiment 1 of the present invention. As shown in FIG. 1, this semiconductor device includes a semiconductor device 1 for realizing the function (function as an arithmetic unit or a memory) of the semiconductor device, and the semiconductor device 1.
Are formed, and a plurality of cooling element blocks 3 formed in the substrate 2. Here, each cooling element block 3 includes at least one (here, a plurality of) cooling elements (here, Peltier elements). Note that the semiconductor device 1 in the present invention is a concept including one element element such as a transistor and a functional block constituted by the plurality of element elements. In this embodiment, the semiconductor device 1 is the latter. Means the function block.

The semiconductor device 1 and the cooling element block 3 are arranged on the same surface of the substrate 2 so as to be adjacent to each other (here, alternately). As a result, heat generated by the semiconductor device 1 is efficiently transmitted to the cooling element block 3 via the substrate 2, and the cooling of the semiconductor device 1 by the cooling element block 3 is performed efficiently.

The formation of the cooling element block 3 is performed as follows. Generally, with the advancement of the device manufacturing process, it is necessary to form a pattern (dummy pattern) irrelevant to the function of the device on the substrate 2. For example,
In the CMP (Chemical Mechanical Polishing) process, the amount of etching locally varies depending on the density of the pattern in the chip.
By providing a dummy pattern in a region where the semiconductor device 1 is not formed on the substrate 1,
The pattern density on the substrate 2 is made uniform.

Therefore, in this embodiment, the cooling element block 3 is formed by focusing on the dummy pattern and forming a part or all of the dummy pattern so as to function as a cooling element.

As described above, according to this embodiment,
Substrate 2 on which semiconductor device 1 is built and in direct contact
Since the cooling element block 3 is formed integrally with the semiconductor device 1 (that is, the cooling element block 3 is provided on the same plane as the semiconductor device 2), the semiconductor device 1 and the cooling element block 3 The heat resistance of the heat radiation path between the cooling element block 3 and the cooling element block 3 can be reduced.
Thereby, the semiconductor device 1 can be efficiently cooled.

Further, since the cooling element blocks 3 are alternately arranged in the substrate 2 so that the cooling element blocks 3 and the semiconductor devices 1 are adjacent to each other, the cooling element blocks 3 Is provided, whereby the semiconductor device 1 can be efficiently and uniformly cooled.

Further, since part or all of the dummy pattern formed with the formation of the semiconductor device 1 is formed as a cooling element, the cooling element block 3 is formed with the formation of the semiconductor device 1. Accordingly, the manufacturing process of the semiconductor device with a cooling device can be simplified, and the semiconductor device with a cooling device can be manufactured without significantly increasing the manufacturing cost.

Further, since the cooling element is formed by using the dummy pattern, the cooling element can be formed by effectively utilizing the space that has not functioned on the substrate 2, whereby the size of the semiconductor device can be reduced. Can be achieved.

Further, by improving the cooling efficiency of the cooling element, the cooling fan can be reduced in size or omitted, whereby the size and the noise of the semiconductor device can be reduced.

In this embodiment, the semiconductor devices 1 and the cooling element blocks 3 are alternately arranged on the substrate 1, but as a modification, as shown in FIG. 2 may be arranged in the periphery.

Embodiment 2 FIG. FIG. 3 is a diagram schematically showing a configuration of a semiconductor device with a cooling device according to a second embodiment of the present invention. In the configuration of FIG. 3, portions corresponding to the configuration of FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

In the semiconductor device according to this embodiment, the cooling element block 3 is formed on the back side of the portion of the substrate 2 where the semiconductor device 1 is formed. For this reason, the thermal resistance of the heat radiation path between the semiconductor device 1 and the cooling element block 3 is reduced, and the heat radiation path is simplified from the upper surface side to the lower surface side of the substrate 2 to improve the heat radiation effect.

As described above, according to this embodiment,
Substrate 2 on which semiconductor device 1 is built and in direct contact
In addition, since the cooling element block 3 is integrally formed, the thermal resistance of the heat radiation path between the semiconductor device 1 and the cooling element block 3 via the substrate 2 can be reduced, and the cooling element block 3 The semiconductor device 1 can be efficiently cooled.

Further, since the cooling element block 3 is disposed on the back surface side of the substrate 2 where there is room in space, a large number of cooling elements can be disposed, and the cooling element block 3 can be mounted on the semiconductor device 1. Is disposed on the back side of the portion of the substrate 2 on which the cooling element block 3 is formed.
The heat resistance between the semiconductor device 1 and the semiconductor device 1 can be reduced, and the heat radiation path can be simplified in one direction, so that the heat radiation effect can be improved, and thereby the cooling can be performed efficiently.

Further, by improving the cooling efficiency of the cooling element block 3, the cooling fan can be reduced in size or omitted, whereby the semiconductor device can be reduced in size and noise.

Embodiment 3 FIG. 4 is a diagram schematically showing a configuration of a semiconductor device with a cooling device according to Embodiment 3 of the present invention. In this semiconductor device, first and second two temperature sensors 1 are added to the semiconductor device according to the first embodiment.
1 and 12, and based on the measurement results of the two temperature sensors 11 and 12, the cooling capacity of each cooling
Is controlled by the control unit 13 shown in FIG.
Note that the control unit 13 may be provided separately from the semiconductor device.
Alternatively, when the semiconductor device is a CPU or the like and has an arithmetic function, the function of the control unit 13 may be provided to the semiconductor device.

As shown in FIG. 1, the first temperature sensor 11 is disposed, for example, on the substrate 2 (for example, on the periphery of the substrate 2), and the temperature of the substrate 2 (ie, the temperature of the semiconductor device 1). Has been detected. The second temperature sensor 12 corresponds to FIG.
As shown in (1), it is disposed on the outer peripheral portion of the package 4 of the semiconductor device (for example, disposed on a heat sink such as a radiation fin provided on the outer peripheral portion of the package 4 via a resin molded body or the like). The temperature around the semiconductor device is detected.

Although the first temperature sensor 11 is provided on the substrate 1 here, the first temperature sensor 11 may be located at any position in the package as long as the temperature of the semiconductor device 1 can be substantially detected. Temperature sensor 11 may be provided. Also,
Here, the second temperature sensor 12 is disposed on the outer peripheral portion of the package 4. However, if the peripheral temperature of the semiconductor device can be detected, the second temperature sensor 12 is disposed at a position away from the package 4. May be provided.

The controller 13 controls the temperature of the semiconductor device 1 detected by the first temperature sensor 11 so as to be substantially equal to the ambient temperature detected by the second temperature sensor 12 or the ambient temperature. The cooling capacity of each cooling element block 3 is controlled by adjusting the amount of electric power supplied to each cooling element block 3 so that the temperature becomes a predetermined set temperature higher by a predetermined temperature. As a result, the semiconductor device 1 is efficiently cooled so that the semiconductor device 1 is not cooled excessively and dew condensation occurs on the semiconductor device 1 and waste of power consumption does not occur. It should be noted that the cooling element can be said to be suitable for this application because the cooling capacity can be efficiently and easily controlled as compared with a method of transporting the refrigerant.

Here, considering the cooling efficiency of the semiconductor device 1 first, the cooling element block 3 is set so that the temperature of the semiconductor device 1 becomes substantially equal to or slightly higher than the ambient temperature. When the main purpose is to suppress the power consumption of the cooling element block 3, the temperature of the semiconductor device 1 can be set high within a range that does not adversely affect the semiconductor device 1. Good.

As described above, according to this embodiment,
The same effect as that of the first embodiment can be obtained, and the cooling capacity of the cooling element block 3 is set so that the temperature of the semiconductor device 1 becomes substantially equal to the peripheral temperature of the semiconductor device, or is set to be lower than the peripheral temperature. Since the temperature is controlled to be a predetermined set temperature that is higher by the temperature, the temperature of the semiconductor device 1 can be maintained at an appropriate temperature, and it is possible to prevent dew condensation from occurring in the semiconductor device 1 and to unnecessarily increase the temperature. Cooling is prevented, and power can be saved.

In this embodiment, the case where the invention according to this embodiment is applied to the semiconductor device shown in FIG. 1 has been described. However, the invention according to this embodiment is shown in FIG. 2 or FIG. It may be applied to the semiconductor device shown.

Embodiment 4 FIG. In the semiconductor device with a cooling device according to the fourth embodiment, assuming the device configuration shown in FIG. 1, FIG. 2 or FIG. 3, the cooling capacity of the cooling element block 3 is reduced per unit time of the semiconductor device 1 derived in advance. Is set in advance on the basis of the heat generation amount.

That is, the temperature of the semiconductor device 1 is determined by the balance between the amount of heat generated by the device 1 per unit time and the amount of heat absorbed by the cooling element block 3 per unit time. If the heat absorption is larger than the heat generation, the temperature of the semiconductor device 1 becomes lower than the ambient temperature. Semiconductor device 1
Can be known in advance by measurement or the like. Therefore, if the amount of heat absorbed (that is, cooling capacity) is set in accordance with this, the temperature of the semiconductor device 1 will not fall below the ambient temperature, and Don't worry. When the heat dissipation is prioritized by adjusting the cooling capacity of the cooling element block 3, the temperature of the semiconductor device 1 is set to be substantially equal to or slightly higher than the ambient temperature. When priority is given to power saving, it is preferable to set the cooling capacity of the cooling element block 3 to a lower level as long as there is no problem.

As described above, according to this embodiment,
Since the cooling capacity of the cooling element block 3 is set in advance based on the amount of heat generated per unit time of the semiconductor device 1 derived in advance, the same effect as that of the second embodiment is obtained, and the temperature is measured. Since there is no need, there is no need to secure an installation position for installing the temperature sensor on the semiconductor device, and the shape of the substrate 2 and the semiconductor device 1
There is an advantage that there is no restriction due to the positional relationship between the sensor and the temperature sensor 1.

Embodiment 5 In the semiconductor device with a cooling device according to the fifth embodiment, assuming the device configuration shown in FIG. 1, FIG. 2 or FIG. 3, the cooling capacity of the cooling element block 3 is reduced as shown in FIG. The control unit 22 controls the power consumption of the semiconductor device 1 detected by the control unit 21. Note that the control unit 22 may be provided separately from the semiconductor device, or when the semiconductor device is a CPU or the like and has an arithmetic function, the function of the control unit 22 may be provided in the semiconductor device. .

Here, since the heat value of the semiconductor device 1 is closely related to the power consumption, if the power consumption is detected and the cooling capacity of the cooling element block 3 is controlled according to the detection result, This is preferable because it can promptly respond to a temporal change in the calorific value of the semiconductor device 1. Further, if the amount of heat absorption (that is, cooling capacity) is controlled in accordance with the amount of heat generated corresponding to the detected power consumption of the semiconductor device 1, the temperature of the semiconductor device 1 does not drop below the ambient temperature, and there is no concern about dew condensation. . When the heat dissipation is prioritized by adjusting the cooling capacity of the cooling element block 3, the temperature of the semiconductor device 1 is set to be substantially equal to or slightly higher than the ambient temperature. When priority is given to power saving, it is preferable to set the cooling capacity of the cooling element block 3 to a lower level as long as there is no problem.

As a method of detecting the power consumption of the semiconductor device 1 by the power consumption detecting section 21, the following method can be considered. First, a method of actually detecting the power consumption of the entire semiconductor device 21 by detecting a supply current or the like per unit time to the semiconductor device 21 can be considered. Second, a supply current per unit time supplied to some element elements (for example, one of a plurality of terminals) of the semiconductor device 21 is detected, and the semiconductor device 1 is detected based on the detection result. A method of calculating the total power consumption can be considered.

As a method of controlling the cooling capacity of the cooling element block 3, a method of increasing / decreasing the cooling capacity in conjunction with an increase / decrease of the power consumption of the semiconductor device 1 and a method of controlling the power consumption of the semiconductor device 1 to exceed a predetermined level. There is a method of increasing the cooling capacity only when the power supply state continues for a predetermined time, and keeping the cooling capacity low during other periods, thereby reducing power consumption. This latter method can be advantageously applied to portable information processing equipment that requires power saving.

As described above, according to this embodiment,
By controlling the cooling capacity of the cooling element block 3 based on the power consumption of the semiconductor device 1, the same effect as in the fourth embodiment can be obtained, and the power consumption can be detected faster than the temperature detection. Therefore, the control based on the power consumption has an advantage that the response is faster than the control based on the temperature, whereby the control of the cooling capacity of the cooling element block 3 can be performed with higher accuracy.

Embodiment 6 FIG. In the semiconductor device with a cooling device according to the sixth embodiment, assuming the device configuration shown in FIG. 1, FIG. 2 or FIG. 3, the cooling capacity of the cooling element block 3 is reduced as shown in FIG. The control unit 32 controls the operation state of the semiconductor device detected by the control unit 31. The control unit 32
May be provided separately from the semiconductor device, or when the semiconductor device is a CPU or the like and has an arithmetic function,
The semiconductor device may have the function of the control unit 32.

Here, the heat generation amount of the semiconductor device 1 tends to increase as the operation frequency increases, and is closely related to the operation state such as the operation frequency. Therefore, if the operation state is detected and the cooling capacity of the cooling element block 3 is controlled in accordance with the detection result, it is possible to quickly respond to the time change of the calorific value of the semiconductor device 1, which is preferable. Further, if the amount of heat absorption (that is, cooling capacity) is controlled in accordance with the amount of heat generation corresponding to the detected operating state of the semiconductor device 1, the temperature of the semiconductor device 1 does not drop below the ambient temperature, and there is no concern about dew condensation. . When the heat dissipation is prioritized by adjusting the cooling capacity of the cooling element block 3, the temperature of the semiconductor device 1 is set to be substantially equal to or slightly higher than the ambient temperature. When priority is given to power saving, it is preferable to set the cooling capacity of the cooling element block 3 to a lower level as long as there is no problem.

As a method of detecting the operating state of the semiconductor device 1 by the operating state detecting section 31, the following method is conceivable. As a first method, the operation state is detected by counting the number of accesses to the semiconductor device 1 per unit time, and the cooling capacity of the cooling element block 3 is increased with the increase in the detected number of accesses per unit time. A method of increasing is conceivable. As a second method, the operation state is detected by counting the number of operations per unit time of the whole or a part of the semiconductor device 1, and the cooling element block is increased with the increase in the detected number of operations per unit time. The method of increasing the cooling capacity of No. 3 can be considered.

As described above, according to this embodiment,
By controlling the cooling capacity of the cooling element block 3 based on the operating state of the operating state such as the operating frequency of the semiconductor device 1, the same effect as in the fourth embodiment can be obtained, and the operating state of the semiconductor device 1 is detected. Can be performed at a higher speed than temperature detection, so that the control based on the operating state has the advantage that the response is faster than the control based on the temperature, thereby controlling the cooling capacity of the cooling element with higher accuracy. be able to.

Modified example. As a modification of the third to sixth embodiments, an internal power supply in which an information processing device such as a personal computer (in particular, a portable information processing device) in which the semiconductor device is installed is driven by an internal power supply such as a battery or a battery. Mode, or an external power supply mode driven by an external power supply such as a household outlet or a vehicle battery.
The control units 13, 22, and 32 of the cooling element block 3 operate the cooling element block 3 in the normal mode in which cooling takes precedence in the external power mode, while suppressing power consumption in the internal power mode to prevent consumption of the internal power. The cooling element block 3 may be operated in the power saving mode. As a result, it is possible to appropriately control the cooling capacity according to the type of the power supply.

Here, switching between the two operation modes of the cooling element block 3 by the control unit 13 is performed by the control unit 1.
3, 22, and 32, but instead of providing the discriminating means, an operation switch for operating mode switching is provided, and the control unit 1 responds to an input from the operation switch.
3, 22, 32 may switch the mode.

[0049]

According to the first aspect of the present invention, the cooling element is integrally formed on the substrate on which the semiconductor device is formed and which is in direct contact with the substrate (ie, on the same plane as the semiconductor device). Cooling element)
The heat resistance of the heat radiation path between the semiconductor device and the cooling element via the substrate can be reduced, and the semiconductor device can be efficiently cooled by the cooling element.

Further, since the cooling element is arranged in the substrate such that the cooling element and the semiconductor device are adjacent to each other, the cooling element is provided in the vicinity of the semiconductor device. And it can be cooled uniformly.

Further, since the cooling element is formed integrally with the substrate, for example, a part or all of the dummy pattern formed along with the formation of the semiconductor device is formed as a cooling element. A cooling element can be formed along with the formation, whereby the manufacturing process of the semiconductor device with a cooling device can be simplified, and the semiconductor device with a cooling device can be manufactured without significantly increasing the manufacturing cost. Can be.

Further, by improving the cooling efficiency by the cooling element, the cooling fan can be reduced in size or omitted, whereby the semiconductor device can be reduced in size and noise.

According to the second aspect of the present invention, since the cooling element is integrally formed with the substrate on which the semiconductor device is formed and which is in direct contact with the substrate, the semiconductor device and the cooling element are interposed via the substrate. The heat resistance of the heat radiating path can be reduced, and the cooling device can efficiently cool the semiconductor device.

Further, since the cooling elements are disposed on the back side of the substrate where there is room in space, many cooling elements can be disposed and the cooling elements can be disposed on the substrate on which the semiconductor device is formed. Since it is arranged on the back side of the part, the thermal resistance between the cooling element and the semiconductor device can be reduced, and the heat radiation effect can be improved by simplifying the heat radiation path in one direction. Thereby, cooling can be performed efficiently.

Further, by improving the cooling efficiency of the cooling element, the size of the cooling fan can be reduced or omitted, whereby the size and the noise of the semiconductor device can be reduced.

According to the third aspect of the present invention, since the cooling capacity of the cooling element is controlled based on the temperature of the semiconductor device, the temperature of the semiconductor device can be maintained at an appropriate temperature. In addition to preventing the occurrence of dew condensation, it is possible to prevent excessive cooling and to save power.

According to the fourth aspect of the present invention, since the cooling capacity of the cooling element is set in advance based on the amount of heat generated per unit time of the semiconductor device derived in advance,
An effect similar to that of the third aspect is obtained.

As a further effect, in the present invention, since it is not necessary to measure the temperature, it is not necessary to secure an installation position for installing the temperature sensor on the semiconductor device, and it is not necessary to secure the shape of the substrate, the temperature of the semiconductor device and the temperature. There is an advantage that there is no restriction due to the arrangement relationship with the sensor.

According to the fifth aspect of the present invention, since the power consumption of the semiconductor device and the heat generation amount are closely related, the cooling capacity of the cooling element is controlled based on the power consumption of the semiconductor device. Thus, the same effect as the third aspect of the invention can be obtained.

As a further effect, power consumption can be detected at a higher speed than temperature detection, so that control based on power consumption has an advantage that response is faster than control based on temperature. The control of the cooling capacity of the cooling element can be performed with higher accuracy.

Further, according to the present invention, since it is not necessary to perform temperature measurement, it is not necessary to secure an installation position for installing the temperature sensor on the semiconductor device, and it is also necessary to arrange the shape of the substrate and the arrangement of the semiconductor device and the temperature sensor. It has the advantage of not being restricted by relationships.

According to the sixth aspect of the present invention, since the operation state such as the operation frequency of the semiconductor device is closely related to the heat generation amount, the cooling capacity of the cooling element is determined based on the operation state of the semiconductor device. By performing the control, the same effect as the third aspect of the invention can be obtained.

As a further effect, the detection of the operation state of the semiconductor device can be performed at a higher speed than the detection of the temperature, so that the control based on the operation state has an advantage that the response is faster than the control based on the temperature. Thereby, the control of the cooling capacity of the cooling element can be performed with higher accuracy.

Further, in the present invention, since it is not necessary to perform temperature measurement, it is not necessary to secure an installation position for installing the temperature sensor on the semiconductor device, and it is also necessary to arrange the substrate and the arrangement of the semiconductor device and the temperature sensor. It has the advantage of not being restricted by relationships.

According to the seventh aspect of the present invention, since the cooling element is integrally formed with the substrate on which the semiconductor device is formed and which is in direct contact with the semiconductor device, the cooling element is formed between the semiconductor device and the cooling element via the substrate. The heat resistance of the heat radiation path can be reduced, and the cooling device can efficiently cool the semiconductor device.

Further, since a part or all of the dummy pattern formed along with the formation of the semiconductor device is formed as a cooling element, the cooling element may be formed along with the formation of the semiconductor device. Thus, the manufacturing process of the semiconductor device with a cooling device can be simplified, and the semiconductor device with a cooling device can be manufactured without a large increase in manufacturing cost.

Further, since the cooling element is formed by using the dummy pattern, the cooling element can be formed by effectively utilizing the space that has not functioned on the substrate, thereby reducing the size of the semiconductor device. Can be achieved.

[Brief description of the drawings]

FIG. 1 is a diagram schematically illustrating a configuration of a semiconductor device with a cooling device according to Embodiment 1 of the present invention;

FIG. 2 is a diagram schematically showing a modification of the semiconductor device with a cooling device of FIG. 1;

FIG. 3 is a diagram schematically illustrating a configuration of a semiconductor device with a cooling device according to a second embodiment of the present invention;

FIG. 4 is a diagram schematically illustrating a configuration of a semiconductor device with a cooling device according to a third embodiment of the present invention;

5 is a block diagram partially showing an electrical configuration of the semiconductor device with a cooling device of FIG. 4;

FIG. 6 is a block diagram partially showing an electrical configuration of a semiconductor device with a cooling device according to a fifth embodiment of the present invention;

FIG. 7 is a block diagram partially showing an electrical configuration of a semiconductor device with a cooling device according to a sixth embodiment of the present invention;

[Explanation of symbols]

Reference Signs List 1 semiconductor device, 2 substrate, 3 cooling element block, 4 package, 11, 12 temperature sensor, 13
Control unit, 21 power consumption detection unit, 22 control unit, 31
Operation state detection unit, 32 control unit.

Claims (7)

[Claims] 1. A semiconductor device with a cooling device for cooling a semiconductor device by a cooling element, wherein the cooling element is provided on a substrate on which the semiconductor device is built, and the cooling element and the semiconductor are provided in the substrate. A semiconductor device with a cooling device, wherein the semiconductor device is formed so as to be adjacent to a device. 2. A semiconductor device with a cooling device, wherein cooling of a semiconductor device is performed by a cooling element, wherein the cooling element is provided on a back surface side of a portion where the semiconductor device is formed on a substrate on which the semiconductor device is formed. A semiconductor device with a cooling device, characterized in that: 3. The semiconductor device with a cooling device according to claim 1, wherein a cooling capacity of the cooling element is controlled based on a temperature of the semiconductor device. 4. The cooling device according to claim 1, wherein the cooling capacity of the cooling element is set in advance based on a calorific value per unit time of the semiconductor device derived in advance. Attached semiconductor device. 5. The semiconductor device with a cooling device according to claim 1, wherein the cooling capacity of the cooling element is controlled based on power consumption of the semiconductor device. 6. The semiconductor device with a cooling device according to claim 1, wherein a cooling capacity of the cooling element is controlled based on an operation state of the semiconductor device. 7. A method for manufacturing a semiconductor device with a cooling device, wherein a semiconductor device is cooled by a cooling element, wherein a part or all of a dummy pattern formed as the semiconductor device is formed on a substrate. A method for manufacturing a semiconductor device with a cooling device, wherein the semiconductor device is formed so as to function as the cooling element.