JP2001155852A - Electric field light emitting lamp - Google Patents
Electric field light emitting lampInfo
- Publication number
- JP2001155852A JP2001155852A JP33252599A JP33252599A JP2001155852A JP 2001155852 A JP2001155852 A JP 2001155852A JP 33252599 A JP33252599 A JP 33252599A JP 33252599 A JP33252599 A JP 33252599A JP 2001155852 A JP2001155852 A JP 2001155852A
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- back electrode
- transparent electrode
- lead
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005684 electric field Effects 0.000 title abstract 3
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 238000009413 insulation Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 89
- 239000000853 adhesive Substances 0.000 description 17
- 230000001070 adhesive effect Effects 0.000 description 17
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 14
- 229910052799 carbon Inorganic materials 0.000 description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 230000003014 reinforcing effect Effects 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は液晶のバックライト
等に好適する電界発光灯に関し、特に、リード接続部の
補強強度を向上させた信頼性の高い電界発光灯に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroluminescent lamp suitable for a liquid crystal backlight or the like, and more particularly to a highly reliable electroluminescent lamp in which the reinforcement strength of a lead connection portion is improved.
【０００２】[0002]
【従来の技術】従来の電界発光灯30は、例えば図６の要
部斜視図に示す構造を有し、図７に示す工程により製造
されている。すなわち、図６、図７において、ＰＥＴ等
の透明フィルム31上にＩＴＯ等の透明電極32が蒸着、ス
パッタ等により形成され（図７（ａ））、透明電極32上
に集電帯形成領域32aを除く形状で、防湿コーティング
したＺｎＳ蛍光体を樹脂バインダ中に分散させた発光層
33がスクリーン印刷等で形成され（図７（ｂ））、発光
層33上にこれと同一形状でチタン酸バリウム粉を樹脂バ
インダ中に分散させた反射絶縁層34が印刷形成され（図
７（ｃ））、反射絶縁層34の延在部（裏面電極側リード
形成領域）の上に樹脂からなる絶縁層35が印刷形成され
ている（図７（ｄ））。反射絶縁層34上にこれより小さ
い形状でカーボンからなる裏面電極36が印刷形成され、
裏面電極36の一部は絶縁層35上へ延在され、裏面電極側
リード接続部36aとなっている（図７（ｅ））。また、
透明電極32上の集電帯形成領域32aには、カーボン、銀
等の集電帯37が形成されている。集電帯37がカーボンの
場合は、裏面電極36と同時にスクリーン印刷できる。集
電帯37が銀等の場合は、裏面電極36と別工程で形成され
る。次いで、透明電極側リード接続部37aと裏面電極側
リード接続部36aを露出させる形状で、樹脂からなるオ
ーバーコート層38が印刷形成される（図７（ｆ））。次
いで、リード39、40が導電性接着剤を介してそれぞれ透
明電極側リード接続部37a、裏面電極側リード接続部36a
に熱圧着して接続される（図７（ｇ））。最後に、透明
電極側リードと裏面電極側リードの各形成領域、及びオ
ーバコート層38の周縁凸部38a、38b上にまたがって絶縁
性のヒートシールテープ41が接着剤層（図示しない）を
介して熱圧着され（図７（ｈ））、電界発光灯30を得
る。なお、ヒートシールテープ41は、リード39、40の接
続強度を向上させるための補強手段である。ところで、
絶縁層35は、裏面電極側リード接続部周辺の発光層の不
要発光を防止するために、また、電極間の絶縁低下を防
止するために必要なものであり、ポリエステル、エポキ
シ等の比誘電率が５以下の低比誘電率材料が好適する。2. Description of the Related Art A conventional electroluminescent lamp 30 has, for example, a structure shown in a perspective view of a main part in FIG. 6, and is manufactured by a process shown in FIG. 6 and 7, a transparent electrode 32 of ITO or the like is formed on a transparent film 31 of PET or the like by vapor deposition, sputtering or the like (FIG. 7A), and a current collecting band forming region 32a is formed on the transparent electrode 32. Light-emitting layer in which ZnS phosphor coated with moisture-proof is dispersed in a resin binder
33 is formed by screen printing or the like (FIG. 7B), and a reflective insulating layer 34 in which barium titanate powder is dispersed in a resin binder in the same shape as this is printed and formed on the light emitting layer 33 (FIG. 7 (B)). c)), an insulating layer 35 made of resin is printed and formed on the extended portion (the back electrode side lead forming area) of the reflective insulating layer 34 (FIG. 7D). A back electrode 36 made of carbon in a smaller shape is formed by printing on the reflective insulating layer 34,
A part of the back electrode 36 extends on the insulating layer 35 to form a back electrode side lead connection portion 36a (FIG. 7E). Also,
A current collecting band 37 made of carbon, silver, or the like is formed in the current collecting band forming region 32a on the transparent electrode 32. When the current collecting band 37 is made of carbon, screen printing can be performed simultaneously with the back electrode 36. When the current collecting band 37 is made of silver or the like, it is formed in a step different from that of the back electrode 36. Next, an overcoat layer 38 made of resin is formed by printing in a shape exposing the transparent electrode side lead connection portion 37a and the back surface electrode side lead connection portion 36a (FIG. 7F). Next, the leads 39 and 40 are respectively connected to the transparent electrode side lead connection portion 37a and the back electrode side lead connection portion 36a via the conductive adhesive.
Is connected by thermocompression bonding (FIG. 7 (g)). Lastly, an insulating heat seal tape 41 is provided on the transparent electrode side lead and the back electrode side lead formation region, and over the peripheral protrusions 38a and 38b of the overcoat layer 38 via an adhesive layer (not shown). Thermocompression bonding (FIG. 7 (h)) to obtain an electroluminescent lamp 30. The heat seal tape 41 is a reinforcing means for improving the connection strength between the leads 39 and 40. by the way,
The insulating layer 35 is necessary to prevent unnecessary light emission of the light emitting layer around the lead connection portion on the back electrode side and to prevent insulation deterioration between the electrodes. Is preferably a low relative dielectric constant material of 5 or less.
【０００３】[0003]
【発明が解決しようとする課題】ところで、上記の従来
の電界発光灯30では、オーバコート層38は樹脂であり表
面が滑らかであるため、オーバコート層38の周縁凸部38
a、38bに対するヒートシールテープ41の接着強度が弱
く、さらに裏面電極側リードの周辺でも、樹脂からなる
絶縁層35とヒートシールテープ41が接するので、ヒート
シールテープ41の接着強度が弱いという問題があった。
このため、リード接続に対するヒートシールテープ41に
よる補強効果が不十分となり、リード39、40が外れやす
いという問題があった。また、ヒートシールテープ41の
下地にあらかじめ接着剤層を形成しておくことにより、
ヒートシールテープ41の接着強度を向上できるが、材
料、工数がかかりコストが増加するという問題もあっ
た。また、絶縁層35の段差で裏面電極のカーボンが断線
するという問題もあった。In the above-described conventional electroluminescent lamp 30, the overcoat layer 38 is made of resin and has a smooth surface.
The adhesive strength of the heat-sealing tape 41 to the a and 38b is weak, and the insulating layer 35 made of resin and the heat-sealing tape 41 are in contact with each other also around the back electrode side lead. there were.
For this reason, the reinforcing effect of the heat seal tape 41 on the lead connection becomes insufficient, and there is a problem that the leads 39 and 40 are easily detached. Also, by forming an adhesive layer in advance on the base of the heat seal tape 41,
Although the adhesive strength of the heat seal tape 41 can be improved, there is a problem that the material and the number of steps are increased and the cost is increased. In addition, there is also a problem that carbon of the back electrode is disconnected due to a step of the insulating layer 35.
【０００４】そこで、本発明は、上記の問題を解決する
ためになされたもので、その主たる目的はヒートシール
テープの接着強度を向上させて、リードの接続強度を補
強し、リードの剥離を防止した安価で信頼性の高い電界
発光灯を提供することである。Accordingly, the present invention has been made to solve the above problems, and its main purpose is to improve the bonding strength of a heat seal tape, reinforce the connection strength of a lead, and prevent the separation of a lead. To provide an inexpensive and highly reliable electroluminescent lamp.
【０００５】[0005]
【課題を解決するための手段】本発明の電界発光灯は、
透明電極上に集電体が形成され、該集電体を回避した形
状で透明電極上に発光層、反射絶縁層、裏面電極が積層
して形成され、前記集電体と前記裏面電極とにリードが
接続された電界発光灯において、前記集電体、両リード
接続部、前記裏面電極のリード接続部周辺の反射絶縁層
を回避した形状で樹脂からなるオーバーコート層が形成
され、前記オーバーコート層が形成されていない領域に
絶縁性ヒートシールテープが熱圧着されていることを特
徴とする。この構成により、ヒートシールテープの下地
が樹脂からなるオーバーコート層よりも接着強度の大き
い材料で構成されるので、新規に接着剤層を介在させる
ことなくヒートシールテープの接着強度を向上できる。
この結果、リードの接続強度が補強され、リードの剥離
が防止された信頼性の高い安価な電界発光灯を提供する
ことができる。An electroluminescent lamp according to the present invention comprises:
A current collector is formed on the transparent electrode, and a light-emitting layer, a reflective insulating layer, and a back electrode are stacked and formed on the transparent electrode in a shape avoiding the current collector, and formed on the current collector and the back electrode. In an electroluminescent lamp to which leads are connected, an overcoat layer made of a resin is formed in a shape avoiding the reflective insulating layer around the current collector, both lead connection portions, and the lead connection portion of the back electrode, and the overcoat is formed. An insulating heat seal tape is thermocompression-bonded to a region where no layer is formed. According to this configuration, since the base of the heat seal tape is made of a material having higher adhesive strength than the overcoat layer made of resin, the adhesive strength of the heat seal tape can be improved without newly interposing an adhesive layer.
As a result, it is possible to provide a reliable and inexpensive electroluminescent lamp in which the connection strength of the lead is reinforced and the separation of the lead is prevented.
【０００６】また、本発明の電界発光灯は、透明電極上
に集電体が形成され、該集電体を回避した形状で透明電
極上に発光層、反射絶縁層、裏面電極が積層して形成さ
れ、これらの発光層、反射絶縁層、裏面電極はあらかじ
め透明電極の一部に形成された絶縁層上に延在して形成
されており、前記集電体と前記裏面電極とにリードが接
続された電界発光灯であって、前記集電体、両リード接
続部、前記裏面電極のリード接続部周辺の反射絶縁層を
回避した形状で樹脂からなるオーバーコート層が形成さ
れ、前記オーバーコート層が形成されていない領域に絶
縁性ヒートシールテープが熱圧着されていることを特徴
とする。この構成により、裏面電極側リード接続部周辺
の発光層の不要発光を防止できると共に、リードの接続
強度が補強され、リードの剥離が防止された信頼性の高
い安価な電界発光灯を提供することができる。In the electroluminescent lamp of the present invention, a current collector is formed on a transparent electrode, and a light emitting layer, a reflective insulating layer, and a back electrode are laminated on the transparent electrode in a shape avoiding the current collector. The light emitting layer, the reflective insulating layer, and the back electrode are formed so as to extend on an insulating layer formed in advance on a part of the transparent electrode, and leads are provided on the current collector and the back electrode. The connected electroluminescent lamp, wherein an overcoat layer made of a resin is formed in a shape avoiding the reflective insulating layer around the current collector, both lead connection portions, and the lead connection portion of the back electrode, and the overcoat is formed. An insulating heat seal tape is thermocompression-bonded to a region where no layer is formed. With this configuration, it is possible to prevent unnecessary light emission of the light emitting layer around the back electrode side lead connection portion, to provide a highly reliable and inexpensive electroluminescent lamp in which the connection strength of the lead is reinforced and the separation of the lead is prevented. Can be.
【０００７】また、前記の本発明の電界発光灯は、裏面
電極のリード接続部周辺の反射絶縁層の面積が裏面電極
のリード接続部の面積よりも大きいことを特徴とする。
この構成により、ヒートシールテープとの接着強度が最
も大きい反射絶縁層の面積が大きくなるので、ヒートシ
ールテープの接着強度がさらに向上する。この結果、リ
ードの接続強度がさらに補強され、リードの剥離が防止
された信頼性の高い安価な電界発光灯を提供することが
できる。Further, the above-mentioned electroluminescent lamp according to the present invention is characterized in that the area of the reflective insulating layer around the lead connection of the back electrode is larger than the area of the lead connection of the back electrode.
With this configuration, the area of the reflective insulating layer having the largest adhesive strength with the heat seal tape is increased, so that the adhesive strength of the heat seal tape is further improved. As a result, it is possible to provide a reliable and inexpensive electroluminescent lamp in which the connection strength of the lead is further reinforced and the peeling of the lead is prevented.
【０００８】[0008]
【発明の実施の形態】本発明の電界発光灯の実施の形態
について図１及び図２を参照しながら説明する。図１
は、本発明の電界発光灯1の構造を示す要部斜視図であ
り、図２は製造工程の一例を示す要部平面図である。図
１、図２において、厚さ７５〜１８８μｍのＰＥＴ等の
透明フィルム2上に、厚さ数千ナのＩＴＯからなる透明電
極3が蒸着、スパッタ等により形成され（図２
（ａ））、透明電極3の一部（裏面電極側リード形成領
域）にエポキシ樹脂等の低比誘電率の絶縁層4が厚さ１
０〜３０μｍ印刷形成されている（図２（ｂ））。絶縁
層4は、裏面電極側リード周辺部の不要発光を防止する
ため、及び発光層、反射絶縁層の下地を強固にするため
に形成される。透明電極3上に集電帯形成領域3aを除く
形状で、防湿コーティングしたＺｎＳ蛍光体（例えば、
SYLVANIA蛍光体Type20）を樹脂バインダ中に分散させた
厚さ３０〜５０μｍの発光層5がスクリーン印刷等で形
成され、発光層5の一部は絶縁層4上へ延在されている
（図２（ｃ））。絶縁層4と重なる部分の発光層5の形状
は絶縁層4よりも若干小さめである。これは発光層5の延
在部が発光しないようにするためである。発光層5上に
チタン酸バリウム粉を樹脂バインダ中に分散させた厚さ
１０〜３０μｍの反射絶縁層6が発光層と同一形状で印
刷形成され、反射絶縁層6の一部も絶縁層4上へ延在され
ている（図２（ｄ））。反射絶縁層6上にこれより小さ
い形状でカーボンペーストからなる厚さ１０〜３０μｍ
の裏面電極7が印刷形成され、裏面電極7の一部は延在さ
れ、裏面電極側リード接続部7aとなっている。反射絶縁
層6の延在部6aは、裏面電極側リード接続部7aよりも十
分に面積が大きい。この構成の効果については後で説明
する。透明電極3上の集電帯形成領域3aには、カーボン
ペースト、銀ペースト等からなる厚さ１０〜３０μｍの
集電帯8が形成されている。集電帯8がカーボンペースト
の場合は、裏面電極7と同時にスクリーン印刷できる。
集電帯8が銀の場合は、裏面電極7と別工程で形成される
（図２（ｅ））。次いで、集電帯形成領域3a、集電帯
8、透明電極側リード接続部8a、反射絶縁層延在部6a、
裏面電極側リード接続部7aを回避してこれらを露出させ
る形状で、ポリエステル等の樹脂からなる厚さ１０〜３
０μｍのオーバーコート層9が印刷形成される（図２
（ｆ））。次いで、リード39、40が導電性接着剤を介し
てそれぞれ透明電極側リード接続部8a、裏面電極側リー
ド接続部7aに熱圧着して接続される（図２（ｇ））。リ
ード接続部7a、8aがカーボンペーストの場合、カーボン
ペースト上の一部に銀ペーストからなる導電ランドを形
成し、この導電ランド上にリードを接続してもよい。最
後に、オーバーコート層9が形成されず露出している集
電帯形成領域3a、集電帯8、透明電極側リード接続部8
a、反射絶縁層延在部6a、裏面電極側リード接続部7a、
リード39、40上にまたがって絶縁性のヒートシールテー
プ10（例えば、商品名TC7907N、ソニーケミカル（株）
製）が熱圧着され（図２（ｈ））、電界発光灯1が完成
する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an electroluminescent lamp according to the present invention will be described with reference to FIGS. FIG.
1 is a perspective view of a main part showing a structure of an electroluminescent lamp 1 of the present invention, and FIG. 2 is a plan view of a main part showing an example of a manufacturing process. 1 and 2, a transparent electrode 3 made of ITO having a thickness of several thousand nm is formed on a transparent film 2 made of PET or the like having a thickness of 75 to 188 μm by vapor deposition, sputtering, or the like (FIG. 2).
(A)), an insulating layer 4 having a low relative dielectric constant such as epoxy resin is formed on a part of the transparent electrode 3 (a back electrode side lead forming area) to a thickness of 1;
It is printed and formed from 0 to 30 μm (FIG. 2B). The insulating layer 4 is formed in order to prevent unnecessary light emission around the back electrode side lead and to strengthen the base of the light emitting layer and the reflective insulating layer. A moisture-proof coated ZnS phosphor (eg, excluding the current-collecting band forming region 3a) on the transparent electrode 3 (for example,
A luminescent layer 5 having a thickness of 30 to 50 μm in which a SYLVANIA phosphor (Type 20) is dispersed in a resin binder is formed by screen printing or the like, and a part of the luminescent layer 5 is extended onto the insulating layer 4 (FIG. 2). (C)). The shape of the light emitting layer 5 in a portion overlapping with the insulating layer 4 is slightly smaller than that of the insulating layer 4. This is to prevent the extending portion of the light emitting layer 5 from emitting light. A reflective insulating layer 6 having a thickness of 10 to 30 μm in which barium titanate powder is dispersed in a resin binder is printed and formed on the light emitting layer 5 in the same shape as the light emitting layer, and a part of the reflective insulating layer 6 is also formed on the insulating layer 4. (FIG. 2D). A thickness of 10 to 30 μm made of carbon paste in a smaller shape on the reflective insulating layer 6
The back electrode 7 is formed by printing, and a part of the back electrode 7 is extended to form a back electrode side lead connection portion 7a. The extension 6a of the reflective insulating layer 6 has a sufficiently larger area than the rear electrode side lead connection 7a. The effect of this configuration will be described later. In the current-collecting band forming region 3a on the transparent electrode 3, a current-collecting band 8 made of carbon paste, silver paste or the like and having a thickness of 10 to 30 μm is formed. When the current collector zone 8 is a carbon paste, screen printing can be performed simultaneously with the back electrode 7.
When the current collecting band 8 is silver, it is formed in a step different from that of the back electrode 7 (FIG. 2E). Next, the current collecting band forming area 3a, the current collecting band
8, transparent electrode side lead connection portion 8a, reflective insulating layer extension portion 6a,
A shape that exposes the back electrode side lead connection portions 7a while avoiding them, and has a thickness of 10 to 3 made of a resin such as polyester.
A 0 μm overcoat layer 9 is formed by printing (FIG. 2).
(F)). Next, the leads 39 and 40 are connected to the transparent electrode side lead connection portion 8a and the back electrode side lead connection portion 7a by thermocompression bonding via a conductive adhesive (FIG. 2 (g)). When the lead connecting portions 7a and 8a are made of carbon paste, conductive lands made of silver paste may be formed on a part of the carbon paste, and leads may be connected to the conductive lands. Finally, the current-collecting band forming region 3a where the overcoat layer 9 is not formed and is exposed, the current-collecting band 8, and the transparent electrode-side lead connection portion 8
a, the reflective insulating layer extension 6a, the back electrode side lead connection 7a,
Insulating heat-sealing tape 10 (eg, TC7907N, Sony Chemical Co., Ltd.) over leads 39 and 40
(FIG. 2 (h)), and the electroluminescent lamp 1 is completed.
【０００９】次に、図３、図４、図５は、それぞれ図２
（ｈ）に示す本発明の電界発光灯の平面図のＡ−Ａ線、
Ｂ−Ｂ線、Ｃ−Ｃ線に沿う要部拡大断面図である。図３
に示すように、集電帯形成領域では、ヒートシールテー
プ10の接着面は、ＩＴＯ等の透明電極3とカーボン等の
集電帯8とに接着している。また、図４に示すように、
裏面電極側リード接続部では、ヒートシールテープ10の
接着面は、カーボン等の裏面電極7とリード40とに接着
している。また、図５に示すように、反射絶縁層延在部
6aでは、ヒートシールテープ10の接着面は、反射絶縁層
6に接着している。このように、本発明の電界発光灯1の
特徴は、ヒートシールテープ10の接着面の大部分が、樹
脂からなるオーバーコート層9とは接着せず、オーバー
コート層9よりも接着強度の大きい反射絶縁層、カーボ
ン等の裏面電極、集電帯、ＩＴＯ等の透明電極等と接着
していることである。ヒートシールテープ10の接着強度
は下地の材料によって異なり、概略、樹脂（オーバーコ
ート層）＜ＩＴＯ＜カーボン、銀＜反射絶縁層の順で大
きくなる。したがって、本発明の電界発光灯1は、従来
の電界発光灯30に比べてヒートシールテープの接着強度
が大きいので、リードの接着を補強する効果が大きく、
リードの剥がれを防止できるのである。Next, FIG. 3, FIG. 4 and FIG.
(H) line AA of a plan view of the electroluminescent lamp of the present invention,
It is a principal part expanded sectional view which follows the BB line and the CC line. FIG.
As shown in the figure, in the current collecting band forming area, the bonding surface of the heat seal tape 10 is bonded to the transparent electrode 3 such as ITO and the current collecting band 8 such as carbon. Also, as shown in FIG.
In the back electrode side lead connection portion, the bonding surface of the heat seal tape 10 is bonded to the back electrode 7 made of carbon or the like and the lead 40. In addition, as shown in FIG.
6a, the adhesive surface of the heat seal tape 10 is a reflective insulating layer
Glued to 6. Thus, the feature of the electroluminescent lamp 1 of the present invention is that most of the adhesive surface of the heat seal tape 10 does not adhere to the overcoat layer 9 made of a resin, and has a larger adhesive strength than the overcoat layer 9. It is adhered to a reflective insulating layer, a back electrode such as carbon, a current collecting band, a transparent electrode such as ITO, and the like. The adhesive strength of the heat seal tape 10 differs depending on the material of the base, and generally increases in the order of resin (overcoat layer) <ITO <carbon, silver <reflective insulating layer. Therefore, the electroluminescent lamp 1 of the present invention has a larger adhesive strength of the heat sealing tape than the conventional electroluminescent lamp 30, so that the effect of reinforcing the adhesion of the lead is large,
This can prevent the lead from peeling off.
【００１０】ヒートシールテープの補強効果を大きくす
るためには、ヒートシールテープと接着する反射絶縁層
の面積を大きくすることが望ましい。したがって、図２
（ｅ）、（ｆ）において、反射絶縁層延在部6aの面積
は、裏面電極側リード接続部7aの面積よりも極力大きく
することが望ましい。同様に、集電帯8の面積は、集電
帯形成領域3aの面積よりも極力大きくすることが望まし
い。[0010] In order to increase the reinforcing effect of the heat seal tape, it is desirable to increase the area of the reflective insulating layer adhered to the heat seal tape. Therefore, FIG.
In (e) and (f), the area of the reflective insulating layer extension 6a is desirably as large as possible than the area of the back electrode side lead connection 7a. Similarly, it is desirable that the area of the current collecting band 8 be as large as possible than the area of the current collecting band forming region 3a.
【００１１】ところで、絶縁層4は、裏面電極側リード
接続部周辺すなわち反射絶縁層延在部6aの発光層の不要
発光を防止するために必要なものであり、エポキシ等の
比誘電率が５以下の低比誘電率材料が好適する。従来の
電界発光灯では、同様の効果を得るために図６、図７に
示したように、反射絶縁層延在部を絶縁層35で被覆して
いたが、この構造ではヒートシールテープの接着面が絶
縁層35と接するためにヒートシールテープの接着強度が
低下するという問題があった。本発明では、発光層5と
透明電極3との間に発光層延在部より若干はみ出して絶
縁層4を形成するので、ヒートシールテープ10が絶縁層4
のはみ出し部と接する面積は極めて小さく、ヒートシー
ルテープ10の接着強度を向上できる。さらに、絶縁層4
を発光層5の下層に形成したことにより、発光層5、反射
絶縁層6の下地を強固にできるため、裏面電極側リード4
0を熱圧着する際に、発光層、反射絶縁層などが押圧さ
れて薄くなり絶縁性が低下することを防止できる。ま
た、熱圧着条件を高温、長時間に強化できるので、リー
ドの接続強度をさらに向上できる。さらに、絶縁層4の
段差が、その上に発光層、反射絶縁層を塗布することに
よって緩和されるので、段差での裏面電極のカーボン膜
の断線を防止できる。The insulating layer 4 is necessary to prevent unnecessary light emission from the light emitting layer in the vicinity of the lead connection portion on the back electrode side, that is, in the reflective insulating layer extension 6a. The following low dielectric constant materials are preferred. In a conventional electroluminescent lamp, as shown in FIGS. 6 and 7, the extending portion of the reflective insulating layer is covered with the insulating layer 35 in order to obtain the same effect. Since the surface is in contact with the insulating layer 35, there is a problem that the adhesive strength of the heat seal tape is reduced. In the present invention, since the insulating layer 4 is formed between the light emitting layer 5 and the transparent electrode 3 so as to protrude slightly from the light emitting layer extending portion, the heat seal tape 10
The area in contact with the protruding portion is extremely small, and the adhesive strength of the heat seal tape 10 can be improved. In addition, insulation layer 4
Is formed under the light emitting layer 5, the bases of the light emitting layer 5 and the reflective insulating layer 6 can be firmly formed.
When thermocompression bonding of 0 is performed, it is possible to prevent the light emitting layer, the reflective insulating layer, and the like from being pressed to be thin and the insulating property from being reduced. Further, since the thermocompression bonding conditions can be strengthened at a high temperature for a long time, the connection strength of the leads can be further improved. Furthermore, since the step of the insulating layer 4 is reduced by applying a light emitting layer and a reflective insulating layer thereon, disconnection of the carbon film of the back electrode at the step can be prevented.
【００１２】[0012]
【発明の効果】本発明の電界発光灯は、透明電極上に集
電体が形成され、該集電体を回避した形状で透明電極上
に発光層、反射絶縁層、裏面電極が積層して形成され、
前記集電体と前記裏面電極とにリードが接続された電界
発光灯において、前記集電体、両リード接続部、前記裏
面電極のリード接続部周辺の反射絶縁層を回避した形状
で樹脂からなるオーバーコート層が形成され、前記オー
バーコート層が形成されていない領域に絶縁性ヒートシ
ールテープが熱圧着されていることを特徴とする。この
構成により、ヒートシールテープの下地が樹脂からなる
オーバーコート層よりも接着強度の大きい材料で構成さ
れるので、ヒートシールテープの接着強度が向上する。
この結果、リードの接続強度が補強され、リードの剥離
が防止された信頼性の高い安価な電界発光灯を提供する
ことができる。According to the electroluminescent lamp of the present invention, a current collector is formed on a transparent electrode, and a light emitting layer, a reflective insulating layer, and a back electrode are laminated on the transparent electrode in a shape avoiding the current collector. Formed,
In an electroluminescent lamp in which a lead is connected to the current collector and the back electrode, the current collector, both lead connection portions, and a resin are formed in a shape avoiding a reflective insulating layer around a lead connection portion of the back electrode. An overcoat layer is formed, and an insulating heat seal tape is thermocompression-bonded to a region where the overcoat layer is not formed. With this configuration, the adhesive strength of the heat seal tape is improved because the base of the heat seal tape is made of a material having higher adhesive strength than the overcoat layer made of resin.
As a result, it is possible to provide a reliable and inexpensive electroluminescent lamp in which the connection strength of the lead is reinforced and the separation of the lead is prevented.
【図１】 本発明の実施の形態の電界発光灯の要部組立
斜視図FIG. 1 is an assembled perspective view of a main part of an electroluminescent lamp according to an embodiment of the present invention.
【図２】 図１の電界発光灯の製造方法を説明するため
の平面図FIG. 2 is a plan view for explaining a method of manufacturing the electroluminescent lamp of FIG.
【図３】 図２（ｈ）のＡ−Ａ線に沿う要部拡大断面図FIG. 3 is an enlarged sectional view of a main part along the line AA in FIG. 2 (h).
【図４】 図２（ｈ）のＢ−Ｂ線に沿う要部拡大断面図FIG. 4 is an enlarged sectional view of a main part taken along line BB of FIG. 2 (h).
【図５】 図２（ｈ）のＣ−Ｃ線に沿う要部拡大断面図FIG. 5 is an enlarged sectional view of an essential part taken along line CC of FIG. 2 (h).
【図６】 従来の電界発光灯の要部組立斜視図FIG. 6 is an assembled perspective view of a main part of a conventional electroluminescent lamp.
【図７】 図６の電界発光灯の製造方法を説明するため
の平面図FIG. 7 is a plan view for explaining a method of manufacturing the electroluminescent lamp of FIG. 6;
1 電界発光灯 2 透明フィルム 3 透明電極 4 絶縁層 5 発光層 6 反射絶縁層 7 裏面電極 8 集電帯 9 オーバーコート層 10 ヒートシールテープ 39、40 リード 1 Electroluminescent lamp 2 Transparent film 3 Transparent electrode 4 Insulating layer 5 Light emitting layer 6 Reflective insulating layer 7 Back electrode 8 Current collecting band 9 Overcoat layer 10 Heat seal tape 39, 40 Lead
Claims (3)
を回避した形状で透明電極上に発光層、反射絶縁層、裏
面電極が積層して形成され、前記集電体と前記裏面電極
とにリードが接続された電界発光灯であって、前記集電
体、両リード接続部、前記裏面電極のリード接続部周辺
の反射絶縁層を回避した形状で樹脂からなるオーバーコ
ート層が形成され、前記オーバーコート層が形成されて
いない領域に絶縁性ヒートシールテープが熱圧着されて
いることを特徴とする電界発光灯。1. A current collector is formed on a transparent electrode, and a light-emitting layer, a reflective insulating layer, and a back electrode are laminated on the transparent electrode in a shape avoiding the current collector. An electroluminescent lamp in which a lead is connected to the back electrode, wherein the current collector, both lead connection portions, and an overcoat layer made of resin in a shape avoiding a reflective insulating layer around the lead connection portion of the back electrode. Wherein an insulating heat seal tape is thermocompression bonded to a region where the overcoat layer is not formed.
を回避した形状で透明電極上に発光層、反射絶縁層、裏
面電極が積層して形成され、これらの発光層、反射絶縁
層、裏面電極はあらかじめ透明電極の一部に形成された
絶縁層上に延在して形成されており、前記集電体と前記
裏面電極とにリードが接続された電界発光灯であって、
前記集電体、両リード接続部、前記裏面電極のリード接
続部周辺の反射絶縁層を回避した形状で樹脂からなるオ
ーバーコート層が形成され、前記オーバーコート層が形
成されていない領域に絶縁性ヒートシールテープが熱圧
着されていることを特徴とする電界発光灯。2. A current collector is formed on the transparent electrode, and a light-emitting layer, a reflective insulating layer, and a back electrode are laminated on the transparent electrode in a shape avoiding the current collector. The reflective insulating layer and the back electrode are formed so as to extend on an insulating layer formed in advance on a part of the transparent electrode, and are an electroluminescent lamp in which leads are connected to the current collector and the back electrode. hand,
An overcoat layer made of resin is formed in a shape avoiding the reflective insulating layer around the current collector, both lead connection portions, and the lead connection portion of the back electrode, and an insulating property is formed in a region where the overcoat layer is not formed. An electroluminescent lamp, wherein a heat seal tape is thermocompression bonded.
の面積は、裏面電極のリード接続部の面積よりも大きい
ことを特徴とする請求項１又は請求項２に記載の電界発
光灯。3. The electroluminescent lamp according to claim 1, wherein the area of the reflective insulating layer around the lead connection of the back electrode is larger than the area of the lead connection of the back electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33252599A JP3542019B2 (en) | 1999-11-24 | 1999-11-24 | Electroluminescent lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33252599A JP3542019B2 (en) | 1999-11-24 | 1999-11-24 | Electroluminescent lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001155852A true JP2001155852A (en) | 2001-06-08 |
| JP3542019B2 JP3542019B2 (en) | 2004-07-14 |
Family
ID=18255905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33252599A Expired - Fee Related JP3542019B2 (en) | 1999-11-24 | 1999-11-24 | Electroluminescent lamp |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3542019B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005529450A (en) * | 2001-12-24 | 2005-09-29 | サン−ゴバン グラス フランス | Method for producing multilayer element including transparent surface electrode and electroluminescent light emitting element |
| KR100989566B1 (en) * | 2001-12-24 | 2010-10-25 | 쌩-고벵 글래스 프랑스 | Laminated panel assembly and method for using a functional element combined with a laminated panel assembly |
-
1999
- 1999-11-24 JP JP33252599A patent/JP3542019B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005529450A (en) * | 2001-12-24 | 2005-09-29 | サン−ゴバン グラス フランス | Method for producing multilayer element including transparent surface electrode and electroluminescent light emitting element |
| KR100989566B1 (en) * | 2001-12-24 | 2010-10-25 | 쌩-고벵 글래스 프랑스 | Laminated panel assembly and method for using a functional element combined with a laminated panel assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3542019B2 (en) | 2004-07-14 |
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