JP2001155551A - Insulated wire - Google Patents
Insulated wireInfo
- Publication number
- JP2001155551A JP2001155551A JP33953699A JP33953699A JP2001155551A JP 2001155551 A JP2001155551 A JP 2001155551A JP 33953699 A JP33953699 A JP 33953699A JP 33953699 A JP33953699 A JP 33953699A JP 2001155551 A JP2001155551 A JP 2001155551A
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- insulated wire
- insulating film
- insulating
- ratio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Insulated Conductors (AREA)
- Processes Specially Adapted For Manufacturing Cables (AREA)
- Paints Or Removers (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、各種電気、電子機
器用のコイルの巻線などに好適に使用される絶縁電線に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insulated wire suitably used for winding coils of various electric and electronic devices.
【０００２】[0002]
【従来の技術】近年、たとえば自動車用などの各種電
気、電子機器の小型化、軽量化の傾向にともなって、こ
れらの機器に用いるコイルなどの部品についても、これ
までより小型、軽量で、しかも高性能を保ちつつ低コス
ト化することが要求されるようになってきた。そしてこ
の要求に対応するために、コイルを形成する巻線として
の絶縁電線（導体を絶縁皮膜で被覆したいわゆるエナメ
ル電線）を、これまでよりも小さいコアに、高密度でし
かも生産性をあげるべく高速で巻きつける必要が生じ、
巻きつけ時に、絶縁電線の絶縁皮膜が損傷するなどし
て、機器の電気特性が低下したり、あるいは生産の歩留
まりが低下したりするという問題が発生していた。2. Description of the Related Art In recent years, with the trend toward miniaturization and weight reduction of various electric and electronic devices, for example, for automobiles, components such as coils used in these devices have become smaller and lighter than ever. It has been required to reduce cost while maintaining high performance. In order to meet this demand, insulated wires (so-called enameled wires, whose conductors are covered with an insulating film) as windings forming coils are to be formed into smaller cores with higher density and higher productivity. It is necessary to wind at high speed,
At the time of winding, there has been a problem that the electrical characteristics of the device are reduced or the production yield is reduced due to damage of the insulating film of the insulated wire.
【０００３】そこでこの問題に対処するために、絶縁電
線の絶縁皮膜の(a) 機械的強度を向上させる、(b) 可と
う性を向上させる、(c) 表面の滑り性をよくする、(d)
導体との密着性を向上させる、といった対策が検討され
ている。[0003] In order to cope with this problem, (a) to improve the mechanical strength, (b) to improve the flexibility, (c) to improve the surface slipperiness, d)
Measures such as improving the adhesion to the conductor are being studied.
【０００４】たとえば 特開平６−１９６０２５号公
報には、ポリアミドイミド、ポリイミド、芳香族ポリア
ミドなどの耐熱性樹脂にて形成した絶縁皮膜の引張強
さ、引張弾性率、密着力、ピアノ線に対する静摩擦係数
などを、樹脂の分子設計によって所定の値に設定するこ
とにより、絶縁皮膜の耐加工性を向上させて、巻きつけ
時に損傷などが生じるのを抑制することが記載されてい
る。また 特開昭６２−５８５１９号公報には、あら
かじめ絶縁皮膜を被覆、形成した後の導体を、巻線の密
度を向上させるべく、圧延加工によって平角状に成形し
て平角巻線を製造するにあたり、圧延および熱処理によ
る絶縁皮膜の加工劣化と耐熱衝撃性の低下とを防止する
ために、絶縁皮膜を形成する絶縁塗料（ワニス）とし
て、ポリエーテルイミドに、ポリエステルイミドと、フ
ェノール系化合物で閉塞したポリイソシアネートブロッ
ク体とを添加したものを使用することが記載されてい
る。For example, Japanese Patent Application Laid-Open No. 6-196025 discloses that an insulating film formed of a heat-resistant resin such as polyamide imide, polyimide, or aromatic polyamide has a tensile strength, a tensile elastic modulus, an adhesive force, and a coefficient of static friction with a piano wire. It is described that, by setting such values to a predetermined value according to the molecular design of the resin, the processing resistance of the insulating film is improved, and the occurrence of damage or the like during winding is suppressed. Japanese Patent Application Laid-Open No. Sho 62-58519 discloses a method of manufacturing a rectangular winding by rolling a conductor after coating and forming an insulating film in advance into a rectangular shape by rolling to improve the density of the winding. In order to prevent the processing deterioration of the insulation film due to rolling and heat treatment and the reduction in thermal shock resistance, the insulation paint (varnish) for forming the insulation film was closed with polyetherimide, polyesterimide and a phenolic compound. It is described that a product to which a polyisocyanate block is added is used.
【０００５】さらに 特開昭５８−３４８２８号公報
には、ポリアミドイミドとポリエーテルイミドとをブレ
ンドすることによって、ポリエーテルイミドと同等の機
械的特性を持ち、しかも耐溶剤性、耐摩耗性、長期耐熱
性にすぐれた材料を得ることが示されている。Further, Japanese Patent Application Laid-Open No. 58-34828 discloses that blending polyamideimide and polyetherimide has mechanical properties equivalent to those of polyetherimide, and also has solvent resistance, abrasion resistance, and long-term durability. It is shown that a material having excellent heat resistance can be obtained.
【０００６】[0006]
【発明が解決しようとする課題】しかし、上記のうち
の技術では、前記(a)(c)(d)を考慮して絶縁皮膜を構成
しているものの、(b)の可とう性は必ずしも十分でな
い。また、の技術においては、ポリエーテルイミドの
可とう性と、ポリエステルイミドの耐熱性および導体に
対する密着性と、フェノール系化合物で閉塞したポリイ
ソシアネートブロック体のろう着性とを組合わせること
により、前述したように平角に圧延する際の絶縁皮膜の
加工劣化と耐熱衝撃性低下の問題を解決しているが、ポ
リエステルイミドの破断時伸びが十分ではないため、や
はり皮膜の可とう性が十分とはいえない。However, in the above technology, the insulating film is formed in consideration of the above (a), (c), and (d), but the flexibility of (b) is not necessarily obtained. not enough. Further, in the technique of the above, by combining the flexibility of the polyether imide, the heat resistance of the polyester imide and the adhesion to the conductor, and the brazing property of the polyisocyanate block blocked with a phenolic compound, As mentioned above, it solves the problems of processing deterioration and thermal shock resistance of the insulating film when rolling into a rectangular shape, but the elongation at break of polyesterimide is not enough, so the film flexibility is still not enough. I can't say.
【０００７】さらににおいて得られるブレンド材料
は、たとえば同公報の第II表にみるようにいずれもガラ
ス転移温度が低いために、高い耐熱性が要求される巻線
用の皮膜材料としては、耐熱性が不十分である。以上の
ように先行技術〜はいずれも、それぞれの技術レベ
ルでは所定の課題を解決していると考えられるものの、
高い耐熱性を保持しながらこれまでよりもさらにすぐれ
た耐加工性、すなわち圧延加工や巻線加工に対する耐性
を得るためには、十分な特性を有しているとは言えな
い。Further, the resulting blend materials have a low glass transition temperature as shown in, for example, Table II of the same publication. Is inadequate. As described above, all of the prior arts are considered to solve predetermined problems at their respective technical levels,
It cannot be said that it has sufficient characteristics in order to obtain more excellent processing resistance while maintaining high heat resistance, that is, resistance to rolling and winding.
【０００８】これは、上記の先行技術がいずれも、基本
的に単層構造で、種々の材料を組合わせることによって
絶縁皮膜に相異なる複数の特性を持たせようとしている
ところに、技術的な限界があるためと考えられる。そこ
で発明者らは、絶縁皮膜を積層構造とするとともに、各
層で樹脂の構成を違えて、それぞれの層に相異なる特性
を付与することによって、単層構造では得られないすぐ
れた特性を有する絶縁電線を製造することを検討した。[0008] This is because the prior arts described above are basically of a single-layer structure and are intended to give a plurality of different characteristics to an insulating film by combining various materials. It is considered that there is a limit. Therefore, the present inventors have made the insulating film into a laminated structure, and differed in the composition of the resin in each layer to give different characteristics to each layer, thereby providing an insulating material having excellent characteristics that cannot be obtained with a single-layer structure. Considering manufacturing electric wires.
【０００９】そして先に、ガラス転移温度が２５０℃以
上である樹脂からなる第１絶縁層と、ポリアミドイミド
に、ガラス転移温度１４０℃以上の熱可塑樹脂を配合し
た第２絶縁層とを、導体上にこの順に積層、被覆して積
層構造の絶縁皮膜を形成すると、高い耐熱性を保持しな
がら、これまでよりもさらにすぐれた耐加工性を有する
絶縁電線が得られることを見出したが、かかる構成で
は、たとえばコイル加工時に絶縁電線の端末を溶接など
によって接合する工程で、接合部付近の絶縁皮膜が接合
の熱によって発泡したり、あるいはその変色長さが長く
なったりして接合を妨げるという新たな問題を生じるこ
とが明らかとなった。First, a first insulating layer made of a resin having a glass transition temperature of 250 ° C. or higher and a second insulating layer formed by mixing a polyamideimide with a thermoplastic resin having a glass transition temperature of 140 ° C. or higher are formed by a conductor. By laminating and coating in this order on the above to form an insulating film having a laminated structure, it has been found that an insulated wire having more excellent workability than before can be obtained while maintaining high heat resistance. In the configuration, for example, in the step of joining the ends of the insulated wire by welding or the like during coil processing, the insulation film near the joint is foamed by the heat of the joint, or the discoloration length is increased, and the joining is prevented. It has been found that this creates new problems.
【００１０】本発明の目的は、厳しい圧延加工や巻線加
工などを行なっても皮膜に損傷などを生じないすぐれた
耐加工性と、ポリアミドイミドと同等の高い耐熱性とを
有し、しかも絶縁電線の端末を接合する工程で、接合部
付近の絶縁皮膜が接合の熱などによって発泡したり、あ
るいはその変色長さが長くなったりしないために接合性
にもすぐれた、新規な絶縁電線を提供することを目的と
している。An object of the present invention is to provide excellent workability in which a film is not damaged even when severe rolling or winding processing is performed, and high heat resistance equivalent to that of polyamide imide. In the process of joining the ends of electric wires, a new insulated wire with excellent jointability is provided because the insulating film near the joint does not foam due to the heat of the joint or its discoloration length does not increase. It is intended to be.
【００１１】[0011]
【課題を解決するための手段および発明の効果】上記課
題を解決するための、本発明の絶縁電線は、(1) 実質的
にポリアミドイミド、およびポリイミドのうちの少なく
とも一方からなる第１絶縁層と、(2) ポリアミドイミド
Ａに、ガラス転移温度１４０℃以上の熱可塑性樹脂Ｂ
を、重量比Ａ／Ｂで表してＡ／Ｂ＝７０／３０〜３０／
７０の割合で配合してなる第２絶縁層とをこの順に被
覆、積層することによって、導体上に、上記第１絶縁層
の膜厚Ｔ1と、第２絶縁層の膜厚Ｔ2との比Ｔ1／Ｔ2がＴ
1／Ｔ2＝５／９５〜４０／６０の範囲内で、かつ残留溶
剤量が絶縁皮膜総量の０．０５重量％以下である絶縁皮
膜を形成したことを特徴とするものである。Means for Solving the Problems and Effects of the Invention According to the present invention, there is provided an insulated wire comprising: (1) a first insulating layer substantially comprising at least one of polyamide imide and polyimide; And (2) a thermoplastic resin B having a glass transition temperature of 140 ° C. or more to polyamide-imide A.
Is expressed as a weight ratio A / B, and A / B = 70/30 to 30 /
By covering and laminating a second insulating layer formed at a ratio of 70 in this order, the thickness T 1 of the first insulating layer and the thickness T 2 of the second insulating layer are formed on the conductor. the ratio T 1 / T 2 is T
An insulating film having a ratio of 1 / T 2 = 5/95 to 40/60 and a residual solvent amount of 0.05% by weight or less of the total amount of the insulating film is formed.
【００１２】かかる本発明によって前記の課題を解決で
きる理由は、以下のとおりである。 1) 実質的にポリアミドイミド、およびポリイミドのう
ちの少なくとも一方からなり、耐熱性と、導体に対する
密着性とにすぐれた第１絶縁層の上に、ポリアミドイミ
ドを含有するため第１絶縁層との密着性にすぐれるとと
もに、当該ポリアミドイミドＡに対して、重量比Ａ／Ｂ
で表してＡ／Ｂ＝７０／３０〜３０／７０の割合で熱可
塑性樹脂Ｂを含有するため可とう性にもすぐれた第２絶
縁層を積層することにより、絶縁皮膜に、導体に対する
良好な密着性、および高い可とう性と、それによっても
たらされる、厳しい圧延加工や巻線加工に耐え得る高い
耐加工性とを付与することができる。 2) 上記のように第２絶縁層における熱可塑性樹脂の配
合量を規定し、かつ熱可塑性樹脂のガラス転移温度を１
４０℃以上とするとともに、第１および第２の絶縁層の
膜厚Ｔ1、Ｔ2の比Ｔ1／Ｔ2を５／９５〜４０／６０の範
囲とすることにより、上述した高い可とう性を維持しつ
つ、絶縁皮膜全体としての耐熱性を、ポリアミドイミド
と同等の高いレベルに保持することができる。The reason why the above-mentioned problems can be solved by the present invention is as follows. 1) The first insulating layer is substantially composed of at least one of polyamide imide and polyimide, and has heat resistance and excellent adhesion to a conductor. The adhesiveness is excellent and the weight ratio A / B to the polyamideimide A is
By laminating the second insulating layer which is excellent in flexibility because it contains the thermoplastic resin B in the ratio of A / B = 70/30 to 30/70, the insulating film has good Adhesion and high flexibility, and the resulting high work resistance that can withstand severe rolling and winding work can be provided. 2) As described above, the blending amount of the thermoplastic resin in the second insulating layer is specified, and the glass transition temperature of the thermoplastic resin is set to 1
The above-mentioned high flexibility is obtained by setting the ratio T 1 / T 2 of the thicknesses T 1 and T 2 of the first and second insulating layers in the range of 5/95 to 40/60 while maintaining the temperature at 40 ° C. or higher. The heat resistance of the entire insulating film can be maintained at a high level equivalent to that of polyamideimide while maintaining the properties.
【００１３】なお耐熱性は、後述する方法で測定された
熱軟化温度で評価され、本発明においては４００℃以上
であるのが好ましい。 3) 上記のように第１および第２の絶縁層の積層構造と
して導体に対する良好な密着性を確保し、また第２絶縁
層における熱可塑性樹脂の配合量を規定し、熱可塑性樹
脂のガラス転移温度を高くし、かつ第１および第２の絶
縁層の膜厚の比を規定して、絶縁皮膜全体としての耐熱
性をポリアミドイミドのレベルに保持するとともに、絶
縁皮膜全体の残留溶剤量を、絶縁皮膜総量の０．０５重
量％以下とすることにより、絶縁電線の端末を接合する
工程で、接合部付近の絶縁皮膜が接合の熱などによって
発泡したり、あるいはその変色長さが長くなったりする
のをこれまでよりも確実に防止して、その接合性を向上
することができる。つまり絶縁皮膜の接合性を向上する
ためには、発泡の原因である残留溶剤量の制御と、絶縁
皮膜自体の耐熱性、および導体に対する密着性を向上す
ることとが必要である。The heat resistance is evaluated based on a heat softening temperature measured by a method described later, and is preferably 400 ° C. or more in the present invention. 3) As described above, the laminated structure of the first and second insulating layers ensures good adhesion to the conductor, and defines the blending amount of the thermoplastic resin in the second insulating layer to determine the glass transition of the thermoplastic resin. The temperature is increased, and the ratio of the thicknesses of the first and second insulating layers is specified to maintain the heat resistance of the entire insulating film at the level of polyamideimide, and to reduce the residual solvent amount of the entire insulating film, By setting the total amount of the insulating film to 0.05% by weight or less, in the step of joining the ends of the insulated wire, the insulating film near the joint may foam due to the heat of the joint or the discoloration length thereof may be increased. This can be more reliably prevented than before, and the bondability can be improved. That is, in order to improve the bonding property of the insulating film, it is necessary to control the amount of the residual solvent that causes foaming, and to improve the heat resistance of the insulating film itself and the adhesion to the conductor.
【００１４】なお本明細書では残留溶剤量を、後述する
評価方法に基づいて、ガスクロマトグラフィーによって
測定した値でもって表すこととする。In this specification, the amount of residual solvent is represented by a value measured by gas chromatography based on an evaluation method described later.
【００１５】[0015]
【発明の実施の形態】以下に、本発明を説明する。本発
明の絶縁電線は、前記のように(1) 実質的にポリアミド
イミド、およびポリイミドのうちの少なくとも一方から
なる第１絶縁層と、(2) ポリアミドイミドに、ガラス転
移温度１４０℃以上の熱可塑性樹脂を配合してなる第２
絶縁層とをこの順に被覆、積層することによって、導体
上に、積層構造の絶縁皮膜を形成したものである。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below. As described above, the insulated wire according to the present invention includes: (1) a first insulating layer substantially composed of at least one of polyamide imide and polyimide; and (2) a polyamide imide having a glass transition temperature of 140 ° C. or higher. The second, which contains a plastic resin
An insulating film having a laminated structure is formed on the conductor by coating and laminating an insulating layer in this order.
【００１６】このうち(1)の第１絶縁層が、上記のよう
に実質的にポリアミドイミド、およびポリイミドのうち
の少なくとも一方からなるというのは、かかる第１絶縁
層が、樹脂分としてポリアミドイミド、および／または
ポリイミドを含有するが、第２絶縁層のように熱可塑性
樹脂を含有しないことを意味する。ただしこの記載は、
当該第１絶縁層が、たとえば着色剤などの、後述する各
種の添加剤を含有することを妨げるものではない。The reason why the first insulating layer (1) is substantially composed of at least one of polyamideimide and polyimide as described above is that the first insulating layer is made of polyamideimide as a resin component. And / or polyimide, but does not contain a thermoplastic resin like the second insulating layer. However, this statement
This does not prevent the first insulating layer from containing various additives described below, such as a coloring agent.
【００１７】上記第１絶縁層は、従来の単層構造の絶縁
皮膜と同様に、樹脂分としてポリアミドイミド、および
／またはポリイミドを含有する第１絶縁層用のワニスの
塗布、焼き付けによって形成される。かかる第１絶縁層
用のワニスのうち、樹脂分としてポリアミドイミドを含
有するものは、(A) ジイソシアネート成分と酸成分とを
重合させる、(B) ジアミン成分と酸成分とを反応させた
反応生成物を、さらに略等モル量のジイソシアネート成
分と重合させる、(C) 酸クロライドを含む酸成分とジア
ミン成分とを重合させる、などの従来公知の製造方法に
よって製造される。The first insulating layer is formed by applying and baking a varnish for the first insulating layer containing polyamideimide and / or polyimide as a resin component, similarly to the conventional insulating film having a single-layer structure. . Among the varnishes for the first insulating layer, those containing polyamideimide as a resin component include (A) polymerizing a diisocyanate component and an acid component, and (B) a reaction product obtained by reacting a diamine component and an acid component. The product is further polymerized with a substantially equimolar amount of a diisocyanate component, or (C) an acid component containing acid chloride and a diamine component are polymerized by a conventionally known production method.
【００１８】また、樹脂分としてポリイミドを含有する
第１絶縁層用のワニスは、(D) ジアミン成分と酸無水物
成分とを重合させる、などの、これも従来公知の製造方
法によって製造される。さらに樹脂分としてポリアミド
イミドとポリイミドの両方を含有するワニスは、上記両
者を配合するなどして製造される。第１絶縁層用のワニ
スのうち、ポリアミドイミド系のワニスの好適な例とし
ては、これに限定されないがたとえば、ジイソシアネー
ト成分としてのジフェニルメタンジイソシアネートと、
酸成分としてのトリメリット酸無水物とを使用して製造
されたもの〔具体例としては日立化成（株）製の商品名
ＨＩ−４００、ＨＩ−４０５，ＨＩ−４０６など〕があ
げられる。The varnish for the first insulating layer containing polyimide as a resin component is also manufactured by a conventionally known manufacturing method such as (D) polymerizing a diamine component and an acid anhydride component. . Further, a varnish containing both polyamideimide and polyimide as a resin component is produced by blending both of the above. Among the varnishes for the first insulating layer, preferred examples of the polyamideimide-based varnish include, but are not limited to, diphenylmethane diisocyanate as a diisocyanate component,
Those manufactured using trimellitic anhydride as an acid component (specific examples are HI-400, HI-405, HI-406 and the like, manufactured by Hitachi Chemical Co., Ltd.).
【００１９】また、ポリイミド系のワニスの好適な例と
しては、これに限定されないがたとえば、ジアミン成分
としてのジアミノジフェニルエーテルと、酸無水物成分
としてのピロメリット酸無水物とを使用して製造された
もの〔具体例としてはＩＳＴ社製の商品名ＰｙｒｅＭ
Ｌ、東レデュポン社製の商品名トレニースなど〕があげ
られる。第１絶縁層の上に積層、被覆される第２絶縁層
は、前記のようにポリアミドイミドＡに、ガラス転移温
度１４０℃以上の熱可塑性樹脂Ｂを、重量比Ａ／Ｂで表
してＡ／Ｂ＝７０／３０〜３０／７０の割合で配合して
なるものである。Preferred examples of the polyimide-based varnish include, but are not limited to, those prepared using diaminodiphenyl ether as a diamine component and pyromellitic anhydride as an acid anhydride component. [Example: PyreM (trade name, manufactured by IST)
L, Toray DuPont's trade name, Treeneis, etc.]. The second insulating layer, which is laminated and coated on the first insulating layer, is formed by adding a thermoplastic resin B having a glass transition temperature of 140 ° C. or more to polyamideimide A as described above and expressing the thermoplastic resin B at a weight ratio of A / B. B = 70/30 to 30/70.
【００２０】上記第２絶縁層を形成するポリアミドイミ
ドとしては、第１絶縁層で使用したのと同様のものがあ
げられる。また、上記ポリアミドイミドに配合される熱
可塑性樹脂としては、ガラス転移温度が１４０℃以上で
ある、従来公知の種々の熱可塑性樹脂が、いかなるもの
でも使用可能であるが、とくに伸び率が高いものが好ま
しい。かかる、ガラス転移温度１４０℃以上の熱可塑性
樹脂の例としては、たとえばポリエーテルイミド、ポリ
エーテルスルホン、ポリエーテルエーテルケトン、ポリ
エーテルケトン、ポリスルホン、ポリカーボネート、芳
香族ポリエステル（ポリアリレートなど）、芳香族ポリ
アミド、熱可塑性ポリイミドなどがあげられる。As the polyamideimide for forming the second insulating layer, the same polyamide imide as used for the first insulating layer can be used. Further, as the thermoplastic resin to be blended with the above-mentioned polyamide imide, conventionally known various thermoplastic resins having a glass transition temperature of 140 ° C. or higher can be used, and any of those can be used. Is preferred. Examples of such a thermoplastic resin having a glass transition temperature of 140 ° C. or higher include, for example, polyetherimide, polyethersulfone, polyetheretherketone, polyetherketone, polysulfone, polycarbonate, aromatic polyester (such as polyarylate), and aromatic polyester. Examples thereof include polyamide and thermoplastic polyimide.
【００２１】中でもとくにポリエーテルイミドやポリエ
ーテルスルホンは、ポリアミドイミドと組み合わせた際
に、耐熱性と、とくに平角巻線として使用すべく圧延加
工する際の耐加工性とにすぐれた第２絶縁層を形成でき
る上、コスト面でも有利であるため、ポリアミドイミド
に配合する熱可塑性樹脂として好適に使用される。上記
第２絶縁層における、ポリアミドイミドへの熱可塑性樹
脂の配合割合が前記の範囲に限定されるのは、以下の理
由による。In particular, polyetherimide or polyethersulfone is a second insulating layer which is excellent in heat resistance when combined with polyamideimide, and especially in rolling resistance for use as a rectangular winding. And is advantageous in terms of cost, so that it is suitably used as a thermoplastic resin to be mixed with polyamideimide. The reason why the mixing ratio of the thermoplastic resin to the polyamideimide in the second insulating layer is limited to the above range is as follows.
【００２２】すなわち熱可塑性樹脂の配合割合が前記の
範囲未満では、第２絶縁層の可とう性が低下するため
に、絶縁皮膜全体としての可とう性も低下する。このた
め、絶縁皮膜の耐加工性が低下して、厳しい圧延加工や
巻線加工などを行った際に損傷などを生じやすくなり、
機器の電気特性の低下、生産の歩留まりの低下といった
問題を生じる原因となる。一方、熱可塑性樹脂の配合割
合が前記の範囲を超えた場合には、絶縁皮膜の全体とし
ての耐熱性が低下して、前述した熱軟化温度４００℃以
上といった耐熱性の基準を満足することができないため
に、絶縁電線を、高い耐熱性が要求される巻線に使用す
ることができなくなる。また、絶縁電線の端末を接合す
る工程で、接合の熱などによって、接合部付近の絶縁皮
膜の変色長さが長くなって、絶縁電線の接合性が低下す
るという問題も生じる。That is, if the blending ratio of the thermoplastic resin is less than the above range, the flexibility of the second insulating layer is reduced, so that the flexibility of the entire insulating film is also reduced. For this reason, the processing resistance of the insulating film is reduced, and it is easy to cause damage when performing severe rolling processing or winding processing, etc.
This causes problems such as a decrease in the electrical characteristics of the device and a decrease in the production yield. On the other hand, when the mixing ratio of the thermoplastic resin exceeds the above range, the heat resistance of the entire insulating film is reduced, and the heat resistance standard such as the above-mentioned heat softening temperature of 400 ° C. or more may be satisfied. Therefore, the insulated wire cannot be used for a winding requiring high heat resistance. In addition, in the step of joining the ends of the insulated wires, the discoloration length of the insulating film near the joining portion becomes longer due to the heat of the joining, which causes a problem that the joining property of the insulated wires is reduced.
【００２３】なお、絶縁皮膜に高い耐加工性、耐熱性お
よび良好な接合性を付与することを考慮すると、上記第
２絶縁層における、ポリアミドイミドＡへの熱可塑性樹
脂Ｂの配合割合は、前記の範囲でもとくに重量比Ａ／Ｂ
で表してＡ／Ｂ＝６５／３５〜４５／５５程度であるの
が好ましく、Ａ／Ｂ＝６５／３５〜５５／４５程度であ
るのがさらに好ましい。第２絶縁層は、先の第１絶縁層
と同様にして形成される。すなわち樹脂分として、ポリ
アミドイミドに所定量の熱可塑性樹脂を配合した第２絶
縁層用のワニスを、先に第１絶縁層を形成した上に塗
布、焼き付けすることによって第２絶縁層が形成され
る。In consideration of imparting high processing resistance, heat resistance and good bonding properties to the insulating film, the mixing ratio of the thermoplastic resin B to the polyamideimide A in the second insulating layer is as follows. Especially in the range of A / B
A / B is preferably about 65/35 to 45/55, and more preferably A / B is about 65/35 to 55/45. The second insulating layer is formed in the same manner as the first insulating layer. That is, as a resin component, a varnish for a second insulating layer in which a predetermined amount of a thermoplastic resin is mixed with polyamide imide is applied on the first insulating layer first, and then baked to form a second insulating layer. You.
【００２４】かかる第２絶縁層用のワニスとしては、た
とえば(D) それぞれの樹脂を別個に溶剤に溶解した溶液
を混合する、(E) それぞれの樹脂を同時に同じ溶剤に溶
解して混合する、(F) 一方の樹脂を溶剤に溶解後、もう
一方の樹脂を添加して溶解、混合する、(G) 一方の樹脂
を溶解した後、その溶液中で、もう一方の樹脂を合成す
る、といった種々の方法によって製造したものが、いず
れも使用可能である。As the varnish for the second insulating layer, for example, (D) a solution in which each resin is separately dissolved in a solvent is mixed; (E) each resin is dissolved and mixed in the same solvent at the same time; (F) After dissolving one resin in a solvent, adding and dissolving and mixing the other resin, (G) dissolving one resin and synthesizing the other resin in the solution, etc. Any of those manufactured by various methods can be used.
【００２５】上記第１および第２の絶縁層の膜厚や、両
層を合計した、絶縁皮膜の全体としての膜厚は、それぞ
れ絶縁電線の用途、形状、寸法などに応じて、適宜の値
に設定することができる。ただし本発明においては、上
記第１および第２の絶縁層の膜厚Ｔ1、Ｔ2の比Ｔ 1／Ｔ2
が、前述したように５／９５〜４０／６０の範囲に限定
される。この理由は以下の通りである。The thickness of the first and second insulating layers,
The total thickness of the insulating film, which is the sum of the layers,
Appropriate value depending on the application, shape, dimensions, etc. of the insulated wire
Can be set to However, in the present invention,
The thickness T of the first and second insulating layers1, TTwoRatio T 1/ TTwo
However, as described above, it is limited to the range of 5/95 to 40/60
Is done. The reason is as follows.
【００２６】すなわち、上記の範囲よりも第１絶縁層の
占める割合が大きい場合には、絶縁皮膜の全体としての
可とう性が低下するため耐加工性も低下して、厳しい圧
延加工や巻線加工などを行った際に損傷などを生じやす
くなり、機器の電気特性の低下、生産の歩留まりの低下
といった問題を生じる原因となる。一方、上記の範囲よ
りも第２絶縁層の占める割合が大きい場合には、絶縁皮
膜の全体としての耐熱性が低下して、前述した熱軟化温
度４００℃以上といった耐熱性の基準を満足することが
できないために、絶縁電線を、高い耐熱性が要求される
巻線などの用途に使用できなくなるという問題を生じ
る。また、上記のように絶縁皮膜の耐熱性が低下する
上、第１絶縁層による、絶縁皮膜の導体への密着性を確
保する効果も不十分となるために、絶縁電線の端末を接
合する工程で、接合の熱などによって、接合部付近の絶
縁皮膜の変色長さが長くなって、絶縁電線の接合性が低
下するという問題も生じる。That is, when the proportion of the first insulating layer occupies a larger range than the above range, the flexibility of the insulating film as a whole is reduced, so that the processing resistance is also reduced. When processing or the like is performed, damage or the like is likely to occur, which causes problems such as a decrease in electrical characteristics of the device and a decrease in production yield. On the other hand, when the proportion of the second insulating layer occupies a larger range than the above range, the heat resistance of the entire insulating film is reduced, and the heat softening temperature of 400 ° C. or higher is satisfied. Therefore, there arises a problem that the insulated wire cannot be used for applications such as windings requiring high heat resistance. In addition, as described above, the heat resistance of the insulating film is reduced, and the effect of securing the adhesion of the insulating film to the conductor by the first insulating layer becomes insufficient. In addition, the discoloration length of the insulating film near the joint is increased due to the heat of the joint and the like, and there is a problem that the joining property of the insulated wire is reduced.
【００２７】なお、絶縁皮膜に高い耐加工性、耐熱性、
導体への密着性および良好な接合性を付与することを考
慮すると、第１および第２の絶縁層の膜厚Ｔ1、Ｔ2の比
Ｔ1／Ｔ2は、前記の範囲内でもとくに５／９５〜２５／
７５程度であるのが好ましく、１０／９０〜２０／８０
程度であるのがさらに好ましい。また前記のように第１
および第２の絶縁層の厚みはとくに限定されないが、そ
れぞれ０．００１〜０．１００ｍｍ程度であるのが好ま
しい。The insulating film has high work resistance, heat resistance,
In consideration of providing adhesion to the conductor and good bonding, the ratio T 1 / T 2 of the film thicknesses T 1 and T 2 of the first and second insulating layers should be within the above range, especially 5 / 95-25 /
It is preferably about 75, and 10/90 to 20/80
It is more preferable that the degree is about the same. Also, as mentioned above,
The thickness of the second insulating layer is not particularly limited, but is preferably about 0.001 to 0.100 mm.
【００２８】上記第１および第２の絶縁層はそれぞれ単
層構造であってもよいし、組成（たとえば第１絶縁層の
場合は使用しているポリアミドイミドやポリイミドの種
類や添加剤の量など、また第２絶縁層の場合は使用して
いるポリアミドイミドや熱可塑性樹脂の種類、両者の配
合割合、添加剤の量など）の異なる２層以上の積層構造
であってもよい。たとえば第１絶縁層が積層構造である
場合には、その合計の膜厚と、第２絶縁層の膜厚とが前
記の範囲内となるように、当該第１絶縁層を構成する各
層の厚みを調整すればよい。また同様に、第２絶縁層が
積層構造である場合には、その合計の膜厚と、第１絶縁
層の膜厚とが前記の範囲内となるように、当該第２絶縁
層を構成する各層の厚みを調整すればよい。The first and second insulating layers may each have a single-layer structure, or may have a composition (for example, in the case of the first insulating layer, the kind of polyamideimide or polyimide used, the amount of additive, etc.). In the case of the second insulating layer, a laminated structure of two or more layers having different types of polyamide imide or thermoplastic resin used, a mixing ratio of the two, an amount of the additive, and the like may be used. For example, when the first insulating layer has a laminated structure, the thickness of each layer constituting the first insulating layer is set so that the total thickness and the thickness of the second insulating layer are within the above-described ranges. Can be adjusted. Similarly, when the second insulating layer has a laminated structure, the second insulating layer is configured so that the total thickness thereof and the thickness of the first insulating layer are within the above-described ranges. The thickness of each layer may be adjusted.
【００２９】第１および第２の絶縁層には、前述したよ
うに、たとえば顔料、染料などの着色剤、無機または有
機のフィラー、潤滑剤などの各種の添加剤を、それぞれ
の層の特性を損なわない範囲で含有させることもでき
る。上記第１および第２の絶縁層からなる絶縁皮膜は、
導体と第１絶縁層との間にプライマー層を有していても
よいし、第２絶縁層の上、すなわち絶縁皮膜の最表層に
表面潤滑層を有していてもよい。As described above, the first and second insulating layers are provided with various additives such as coloring agents such as pigments and dyes, and inorganic or organic fillers and lubricants, to improve the characteristics of each layer. It can also be contained within a range that does not impair. The insulating film composed of the first and second insulating layers includes:
A primer layer may be provided between the conductor and the first insulating layer, or a surface lubricating layer may be provided on the second insulating layer, that is, on the outermost layer of the insulating film.
【００３０】かかる表面潤滑層は、たとえば流動パラフ
ィンや固形パラフィンなどを塗布したり、各種ワック
ス、ポリエチレン、フッ素樹脂、シリコーン樹脂などの
潤滑剤を第２絶縁層上に直接に製膜するか、あるいは製
膜性を有するバインダー樹脂で結着した状態で製膜する
ことによって形成される。絶縁皮膜は、その残留溶剤量
が、絶縁皮膜総量の０．０５重量％以下である必要があ
る。The surface lubricating layer may be formed by applying liquid paraffin, solid paraffin, or the like, or by forming a lubricant such as various waxes, polyethylene, fluororesin, or silicone resin directly on the second insulating layer, or It is formed by forming a film in a state of being bound with a binder resin having film forming properties. The amount of the residual solvent in the insulating film must be 0.05% by weight or less of the total amount of the insulating film.
【００３１】残留溶剤量がこの範囲を超えた場合には、
前述したように、絶縁皮膜が導体に対する良好な密着性
と高い耐熱性とを兼ね備えていたとしても、絶縁電線の
端末を接合する工程で、接合部付近の絶縁皮膜が接合の
熱などによって発泡しやすくなって、絶縁電線の接合性
が低下するという問題を生じる。なお絶縁皮膜の残留溶
剤量は、上記の範囲内でも０.０１重量％以下が好まし
く、小さければ小さいほど好ましい。とくに、残留溶剤
量が限りなく０％に近いのが理想的であるが、上記の範
囲内であれば、絶縁皮膜が発泡などを生じない、良好な
接合性を有する絶縁電線を製造することができる。When the amount of the residual solvent exceeds this range,
As described above, even if the insulating film has both good adhesion to the conductor and high heat resistance, in the process of joining the ends of the insulated wire, the insulating film near the joint is foamed due to the heat of the joint and the like. This causes a problem that the bonding property of the insulated wire is reduced. The amount of residual solvent in the insulating film is preferably 0.01% by weight or less even within the above range, and the smaller the amount, the more preferable. In particular, it is ideal that the amount of residual solvent is infinitely close to 0%. However, if it is within the above range, it is possible to produce an insulated wire having good bonding properties without causing an insulating film to foam. it can.
【００３２】絶縁皮膜の残留溶剤量を上記の範囲に調整
するには、当該絶縁皮膜を被覆、形成した絶縁電線を、
たとえば窒素などの不活性ガス雰囲気中で熱処理してや
ればよい。熱処理の条件はとくに限定されないが、２２
０℃以上の温度で５時間以上、熱処理するのが好まし
い。熱処理の温度がこれより低いか、または時間がこれ
より短い場合には熱処理が不十分で、絶縁皮膜の残留溶
剤量を、絶縁皮膜総量の０．０１重量％以下に抑えるこ
とができず、絶縁電線の端末を接合する工程で、接合部
付近の絶縁皮膜が接合の熱などによって発泡しやすくな
って、絶縁電線の接合性が低下するおそれがある。In order to adjust the amount of the residual solvent in the insulating film to the above range, the insulated wire coated and formed with the insulating film is
For example, heat treatment may be performed in an atmosphere of an inert gas such as nitrogen. The conditions of the heat treatment are not particularly limited.
The heat treatment is preferably performed at a temperature of 0 ° C. or more for 5 hours or more. If the heat treatment temperature is lower or the time is shorter than this, the heat treatment is insufficient, and the amount of the residual solvent in the insulating film cannot be suppressed to 0.01% by weight or less of the total amount of the insulating film. In the step of joining the ends of the electric wires, the insulating film near the joint becomes liable to foam due to the heat of the joining and the like, and the joining property of the insulated wire may be reduced.
【００３３】また上記絶縁皮膜は、その可とう性を考慮
すると、破断伸びが５０％以上であるのが好ましい。絶
縁皮膜を被覆、形成するための導体としては、銅やアル
ミニウムなどからなる、絶縁電線に通常に用いられる種
々の導体が、いずれも使用可能であるが、とくに酸素含
有量１０ｐｐｍ以下の低酸素銅にて形成された導体が、
好適に使用される。The insulating film preferably has an elongation at break of 50% or more in consideration of its flexibility. As the conductor for covering and forming the insulating film, any of various conductors usually used for insulated wires, such as copper and aluminum, can be used. In particular, low-oxygen copper having an oxygen content of 10 ppm or less can be used. The conductor formed by
It is preferably used.
【００３４】かかる低酸素銅製の導体を使用した場合に
は、絶縁電線の端末を接合する工程で、接合の熱などに
よって導体が加熱された際に、当該導体から発生するガ
ス（酸素）の量を著しく少なくできるので、導体上の絶
縁皮膜の発泡がさらに抑制されて、絶縁電線の接合性が
さらに向上するという利点がある。本発明の絶縁電線
は、その用途などに応じて、丸線などの従来公知の種々
の形状とすることができるが、とくに前述したように巻
線の密度を向上させるべく、絶縁皮膜を被覆、形成した
後の導体（通常は丸線）を、圧延加工によって平角状に
成形して平角巻線とするのが好ましい。When such a conductor made of low-oxygen copper is used, in the step of joining the ends of the insulated wire, when the conductor is heated by the heat of joining or the like, the amount of gas (oxygen) generated from the conductor is increased. Therefore, there is an advantage that the foaming of the insulating film on the conductor is further suppressed, and the joining property of the insulated wire is further improved. The insulated wire of the present invention can be formed into various conventionally known shapes, such as a round wire, depending on the application, etc. The formed conductor (usually a round wire) is preferably formed into a rectangular shape by rolling to form a rectangular winding.
【００３５】この際、本発明の構成によれば、前記のよ
うに絶縁皮膜が、導体への密着性および可とう性と、そ
れによってもたらされる圧延加工に対する耐性とにすぐ
れるために、当該圧延加工によって損傷したりしない
上、圧延加工後も、丸線と同様な可とう性試験に耐える
ことができる、すぐれた可とう性と、導体に対する良好
な密着性とを保持し、巻線加工に対する耐性にもすぐれ
るため、当該巻線加工時に損傷したりすることもない。
したがって本発明によれば、機器の電気特性の低下、生
産の歩留まりの低下といった問題を生じない良好な平角
巻線を得ることができる。At this time, according to the structure of the present invention, as described above, since the insulating film has excellent adhesion and flexibility to the conductor and the resulting resistance to the rolling process, the insulating film has to be rolled. In addition to being not damaged by processing, even after rolling, it can withstand the same flexibility test as round wire, retains excellent flexibility and good adhesion to conductors, and Since it has excellent resistance, it is not damaged during the winding process.
Therefore, according to the present invention, it is possible to obtain a good rectangular winding which does not cause problems such as a decrease in electrical characteristics of a device and a decrease in production yield.
【００３６】圧延加工の具体的な方法としては、上記の
ように絶縁皮膜を被覆、形成した後の導体（丸線）を、
たとえば圧延ローラによって文字通り圧延するか、ある
いはカセットローラーダイスに通して引き抜いて圧延す
るなどの方法があげられる。As a specific method of the rolling process, the conductor (round wire) after coating and forming the insulating film as described above is used.
For example, a method of literally rolling with a rolling roller, or a method of drawing by passing through a cassette roller die and rolling.
【００３７】[0037]
【実施例】以下に本発明を、実施例、比較例に基づいて
説明する。 実施例１ 酸素含有量３ｐｐｍの低酸素銅にて形成された、直径２
ｍｍφの丸線状の導体の上に、まず第１絶縁層用のワニ
スとしてのポリアミドイミドワニス〔前出の、日立化成
（株）製の商品名ＨＩ−４００〕を常法にて塗布、焼き
付けして、膜厚Ｔ1＝０．０１ｍｍの第１絶縁層を被
覆、形成した。The present invention will be described below based on examples and comparative examples. Example 1 Diameter 2 formed of low oxygen copper having an oxygen content of 3 ppm
First, a polyamide-imide varnish (trade name: HI-400, manufactured by Hitachi Chemical Co., Ltd.) as a varnish for the first insulating layer is applied and baked on a round conductor having a diameter of mmφ. Then, a first insulating layer having a film thickness T 1 = 0.01 mm was covered and formed.
【００３８】つぎに、上記と同じポリアミドイミドワニ
ス〔日立化成（株）製の商品名ＨＩ−４００、樹脂分含
量２５重量％〕２４０重量部と、熱可塑性樹脂としての
ポリエーテルイミド〔日本ジーイープラスチックス
（株）製の商品名ウルテム１０００、ガラス転移温度２
２０℃〕４０重量部とを配合するとともに、全体の樹脂
分含量が２０重量％になるように、Ｎ−メチル−２−ピ
ロリドンによって希釈して調製した第２絶縁層用のワニ
ス〔ワニス中に含まれるポリアミドイミドＡと、熱可塑
性樹脂（ポリエーテルイミド）Ｂとの配合割合（重量
比）Ａ／Ｂ＝６０／４０〕を、上記第１絶縁層の上に、
やはり常法にて塗布、焼き付けして、膜厚Ｔ2＝０．０
４ｍｍの第２絶縁層を被覆、積層して２層構造の絶縁皮
膜を形成した。両絶縁層の膜厚の比Ｔ1／Ｔ2＝２０／８
０であった。また、この時点での仕上り径は２．１ｍｍ
であった。Next, 240 parts by weight of the same polyamide imide varnish (trade name: HI-400, manufactured by Hitachi Chemical Co., Ltd., resin content 25% by weight), and polyetherimide as a thermoplastic resin [Nippon GE Plastics Co., Ltd.] Sutem Co., Ltd. product name Ultem 1000, glass transition temperature 2
20 ° C.] and a varnish for the second insulating layer [prepared by diluting with N-methyl-2-pyrrolidone so that the total resin content is 20% by weight. The mixing ratio (weight ratio) of the polyamideimide A and the thermoplastic resin (polyetherimide) B (A / B = 60/40) is included on the first insulating layer.
It is applied and baked in the usual manner, and the film thickness T 2 = 0.0
A 4 mm second insulating layer was coated and laminated to form an insulating film having a two-layer structure. Ratio of film thickness of both insulating layers T 1 / T 2 = 20/8
It was 0. The finished diameter at this point is 2.1 mm
Met.
【００３９】つぎに、上記のように絶縁皮膜を被覆、形
成した導体をカセットローラーダイスに通して引き抜き
くことで、縦方向および横方向から圧延したのち、窒素
中で２４０℃で６時間、熱処理して、絶縁電線としての
平角巻線を製造した。 実施例２〜７、比較例１、２ 第２絶縁層用のワニスにおけるポリアミドイミドＡと熱
可塑性樹脂（ポリエーテルイミド）Ｂとの配合割合（重
量比）Ａ／Ｂが８５／１５（比較例１）、７０／３０
（実施例２）、６５／３５（実施例３）、５５／４５
（実施例４）、５０／５０（実施例５）、４０／６０
（実施例６）、３０／７０（実施例７）、または１５／
８５（比較例２）となるように、ポリアミドイミドワニ
スに対するポリエーテルイミドの配合量を調整したこと
以外は実施例１と同様にして、絶縁電線としての平角巻
線を製造した。Next, the conductor coated with the insulating film as described above and formed was pulled out through a cassette roller die to be rolled in the longitudinal and lateral directions, and then heat-treated in nitrogen at 240 ° C. for 6 hours. Thus, a rectangular winding as an insulated wire was manufactured. Examples 2 to 7, Comparative Examples 1 and 2 The blending ratio (weight ratio) A / B of polyamideimide A and thermoplastic resin (polyetherimide) B in the varnish for the second insulating layer was 85/15 (Comparative Example). 1), 70/30
(Example 2), 65/35 (Example 3), 55/45
(Example 4), 50/50 (Example 5), 40/60
(Example 6), 30/70 (Example 7), or 15 /
A rectangular winding as an insulated wire was manufactured in the same manner as in Example 1 except that the blending amount of polyetherimide with respect to polyamideimide varnish was adjusted so as to be 85 (Comparative Example 2).
【００４０】実施例８、比較例３ 熱処理の条件を２００℃で６時間（比較例３）、または
２２０℃で６時間（実施例８）としたこと以外は実施例
１と同様にして、絶縁電線としての平角巻線を製造し
た。 実施例９ 導体として、酸素含有量２００ｐｐｍのタフピッチ銅に
て形成された、直径２ｍｍφの丸線状のものを使用した
こと以外は実施例１と同様にして、絶縁電線としての平
角巻線を製造した。Example 8, Comparative Example 3 Insulation was performed in the same manner as in Example 1 except that the heat treatment was performed at 200 ° C. for 6 hours (Comparative Example 3) or at 220 ° C. for 6 hours (Example 8). A rectangular winding as an electric wire was manufactured. Example 9 A rectangular winding as an insulated wire was manufactured in the same manner as in Example 1, except that a round wire having a diameter of 2 mm and formed of tough pitch copper having an oxygen content of 200 ppm was used as a conductor. did.
【００４１】比較例４ 実施例１で使用したのと同じ導体上に、前出のポリアミ
ドイミドワニスを常法にて塗布、焼き付けして、膜厚
０．０５ｍｍの単層構造の絶縁皮膜を被覆、形成したこ
と以外は実施例１と同様にして、絶縁電線としての平角
巻線を製造した。 比較例５ 実施例１で使用したのと同じ導体上に、実施例１で作製
した第２絶縁層用のワニスを常法にて塗布、焼き付けし
て、膜厚０．０５ｍｍの単層構造の絶縁皮膜を被覆、形
成したこと以外は実施例１と同様にして、絶縁電線とし
ての平角巻線を製造した。Comparative Example 4 On the same conductor as used in Example 1, the above-mentioned polyamideimide varnish was applied and baked in a usual manner to cover a single-layer insulating film having a thickness of 0.05 mm. A rectangular winding as an insulated wire was manufactured in the same manner as in Example 1 except that the wire was formed. Comparative Example 5 A varnish for the second insulating layer prepared in Example 1 was applied and baked on the same conductor as used in Example 1 by a conventional method to form a single-layer structure having a thickness of 0.05 mm. A rectangular winding as an insulated wire was manufactured in the same manner as in Example 1 except that the insulating film was covered and formed.
【００４２】実施例１０ 第１絶縁層の膜厚Ｔ1＝０．００５ｍｍ、第２絶縁層の
膜厚Ｔ2＝０．０４５ｍｍ、両絶縁層の膜厚の比Ｔ1／Ｔ
2＝１０／９０としたこと以外は実施例１と同様にし
て、絶縁電線としての平角巻線を製造した。 実施例１１ 第１絶縁層の膜厚Ｔ1＝０．０１５ｍｍ、第２絶縁層の
膜厚Ｔ2＝０．０３５ｍｍ、両絶縁層の膜厚の比Ｔ1／Ｔ
2＝３０／７０としたこと以外は実施例１と同様にし
て、絶縁電線としての平角巻線を製造した。Example 10 The thickness T 1 of the first insulating layer was 0.005 mm, the thickness T 2 of the second insulating layer was 0.045 mm, and the ratio T 1 / T between the thicknesses of the two insulating layers.
A rectangular winding as an insulated wire was manufactured in the same manner as in Example 1 except that 2 was set to 10/90. Example 11 The thickness T 1 of the first insulating layer was 0.015 mm, the thickness T 2 of the second insulating layer was 0.035 mm, and the ratio T 1 / T of the thickness of both insulating layers.
A rectangular winding as an insulated wire was manufactured in the same manner as in Example 1 except that 2 was set to 30/70.
【００４３】比較例６ 第１絶縁層の膜厚Ｔ1＝０．０２５ｍｍ、第２絶縁層の
膜厚Ｔ2＝０．０２５ｍｍ、両絶縁層の膜厚の比Ｔ1／Ｔ
2＝５０／５０としたこと以外は実施例１と同様にし
て、絶縁電線としての平角巻線を製造した。 実施例１２ 実施例１で使用したのと同じ導体上に、第１絶縁層用の
ワニスとしてのポリイミドワニス〔前出の、ＩＳＴ社製
の商品名ＰｙｒｅＭＬ〕を常法にて塗布、焼き付けし
て、膜厚Ｔ1＝０．０１ｍｍの第１絶縁層を被覆、形成
したこと以外は実施例１と同様にして、絶縁電線として
の平角巻線を製造した。Comparative Example 6 The thickness T 1 of the first insulating layer was 0.025 mm, the thickness T 2 of the second insulating layer was 0.025 mm, and the ratio T 1 / T between the thicknesses of the two insulating layers.
A rectangular winding as an insulated wire was manufactured in the same manner as in Example 1 except that 2 was set to 50/50. Example 12 On the same conductor as used in Example 1, a polyimide varnish (trade name: PyreML, manufactured by IST) as a varnish for the first insulating layer was applied and baked by an ordinary method. A rectangular winding as an insulated wire was manufactured in the same manner as in Example 1 except that a first insulating layer having a thickness T 1 = 0.01 mm was covered and formed.
【００４４】上記各実施例、比較例で作製した絶縁電線
（平角巻線）について、それぞれ下記の試験を行って、
その特性を評価した。 残留溶剤量の測定 絶縁電線を、炉温３５０℃の加熱炉に入れて３分放置し
た後、炉内に発生したガスをサンプリングし、ガスクロ
マトグラフィー（ＧＬサイエンス社製）にて溶剤量を定
量したのち、サンプル中の絶縁皮膜総量に対する割合を
計算して、残留溶剤量（重量％）とした。The following tests were carried out on the insulated wires (rectangular windings) produced in the above Examples and Comparative Examples, respectively.
Its properties were evaluated. Measurement of Residual Solvent Amount After placing the insulated wire in a heating furnace at a furnace temperature of 350 ° C. for 3 minutes, the gas generated in the furnace was sampled, and the amount of the solvent was determined by gas chromatography (GL Science). After that, the ratio to the total amount of insulating films in the sample was calculated, and the ratio was defined as the residual solvent amount (% by weight).
【００４５】引張試験 絶縁電線から導体をエッチング除去して残った絶縁皮膜
を、引張試験機を用いてゲージ長２０ｍｍ、引張速度１
０ｍｍ／分の条件で引張試験した際の破断伸び（％）を
求めた。 接合性試験 長さ１５０ｍｍの絶縁電線をサンプリングし、その両端
末を、それぞれ５ｍｍずつ皮膜剥離した。そして、一方
の端末を接地するとともにもう一方の端末の先端部に２
ｍｍの間隔をあけて溶接トーチを置き、１２０Ａで０．
２秒間、アーク放電させて、絶縁電線の端末を溶解させ
た。そして溶解部分の付近における絶縁皮膜の変色長さ
（ｍｍ）と、絶縁皮膜の発泡の有無とによって接合性を
評価した。なお試験に際しては、溶解部に、毎分およそ
１５リットルのＡｒガスを流した。Tensile test The insulating film remaining after the conductor was removed by etching from the insulated wire was removed using a tensile tester with a gauge length of 20 mm and a tensile speed of 1 mm.
The elongation at break (%) at the time of a tensile test at 0 mm / min was determined. Bonding test An insulated wire having a length of 150 mm was sampled, and both ends were peeled off by 5 mm each. Then, one terminal is grounded, and two terminals are attached to the tip of the other terminal.
The welding torch is placed at an interval of 120 mm, and is set to 0.
Arc discharge was performed for 2 seconds to dissolve the end of the insulated wire. Then, the bondability was evaluated based on the discoloration length (mm) of the insulating film in the vicinity of the melting portion and the presence or absence of foaming of the insulating film. At the time of the test, approximately 15 liters of Ar gas per minute was flowed through the dissolving portion.
【００４６】一般特性試験 日本工業規格ＪＩＳ Ｃ ３００３「エナメル銅線及び
エナメルアルミニウム線試験方法」にしたがって、エッ
チワイズ２ｍｍ、フラットワイズ２ｍｍ、熱軟化温度
（℃）、および絶縁破壊電圧（ｋＶ）を測定した。なお
エッチワイズ２ｍｍおよびフラットワイズ２ｍｍの評価
基準は下記の通りとした。 ○：絶縁皮膜に割れなし（可とう性良好） △：一部割れあり（可とう性やや不良） ×：割れあり（可とう性不良） 結果を表１、表２に示す。General property test According to Japanese Industrial Standards JIS C 3003 "Test method for enameled copper wire and enameled aluminum wire", etch width 2 mm, flat width 2 mm, heat softening temperature (° C.), and dielectric breakdown voltage (kV) were measured. did. The evaluation criteria for etch width 2 mm and flat width 2 mm were as follows. ：: No cracks in the insulating film (good flexibility) Δ: Some cracks (slightly poor flexibility) ×: Cracks (poor flexibility) The results are shown in Tables 1 and 2.
【００４７】[0047]
【表１】 [Table 1]
【００４８】[0048]
【表２】 [Table 2]
【００４９】両表より、ポリアミドイミドワニスにて単
層の絶縁皮膜を形成した比較例４は可とう性が悪く、ま
た第２絶縁層用のワニスにて単層の絶縁皮膜を形成した
比較例５は耐熱性が不充分であることが判明した。ま
た、第１および第２の絶縁層からなる２層構造の絶縁皮
膜を有していても、第２絶縁層における熱可塑性樹脂の
配合割合が本発明で規定した範囲未満であった比較例１
は可とう性が低下し、逆に熱可塑性樹脂の配合割合が本
発明で規定した範囲を超えた比較例２は可とう性と耐熱
性が低下することが判った。From both tables, Comparative Example 4 in which a single-layer insulating film was formed with a polyamide-imide varnish was inferior in flexibility, and Comparative Example in which a single-layer insulating film was formed with a varnish for the second insulating layer. 5 was found to have insufficient heat resistance. Comparative Example 1 in which the mixing ratio of the thermoplastic resin in the second insulating layer was less than the range specified in the present invention, even though the insulating film had a two-layer insulating film composed of the first and second insulating layers.
It was found that in Comparative Example 2 in which the flexibility ratio was lower than the range specified in the present invention, the flexibility and heat resistance were lower.
【００５０】また、絶縁皮膜の残留溶剤量が０．０５重
量％を超えた比較例３と、０.０５重量％以下であった
実施例８とから、残留溶剤量が多いほど接合性が低下す
ることが判った。さらに第１および第２の絶縁層の膜厚
比が、本発明で規定した範囲に比べて第１絶縁層の膜厚
が大きい方に外れた比較例６は可とう性と接合性が低下
することが判明した。Also, from Comparative Example 3 in which the amount of the residual solvent in the insulating film exceeded 0.05% by weight and Example 8 in which the amount of the residual solvent was 0.05% by weight or less, the larger the amount of the residual solvent, the lower the bondability. I found out. Further, in Comparative Example 6 in which the film thickness ratio of the first and second insulating layers was larger than the range specified in the present invention, the flexibility and the bondability were reduced. It has been found.
【００５１】これに対し、第１および第２の絶縁層から
なる２層構造の絶縁皮膜を有し、そのうち第２絶縁層に
おける熱可塑性樹脂Ｂの配合割合が、ポリアミドイミド
Ａに対する重量比Ａ／Ｂで表してＡ／Ｂ＝７０／３０〜
３０／７０の範囲内であるとともに、上記第１および第
２の絶縁層の、膜厚の比Ｔ1／Ｔ2＝５／９５〜４０／６
０の範囲内で、かつ残留溶剤量が絶縁皮膜総量の０．０
１重量％以下である実施例１〜１２はいずれも、圧延加
工して平角巻線とする際の耐加工性にすぐれる上、加工
後の可とう性、耐熱性、および接合性も良好であること
が確認された。On the other hand, it has an insulating film having a two-layer structure composed of the first and second insulating layers, and the mixing ratio of the thermoplastic resin B in the second insulating layer is such that the weight ratio A / polyamideimide A is A / B = 70 / 30-
Together is in the range of 30/70, the above-mentioned first and second insulating layers, the ratio of the thickness T 1 / T 2 = 5 / 95~40 / 6
0 and the amount of the residual solvent is 0.0% of the total amount of the insulating film.
Each of Examples 1 to 12 in which the content is 1% by weight or less has excellent workability when rolled into a rectangular winding, and also has good flexibility, heat resistance, and bonding properties after working. It was confirmed that there was.
【００５２】また各実施例を比較すると、重量比Ａ／Ｂ
＝６５／３５〜５５／４５の範囲内であるのが、とくに
接合性の点で好ましいこと、また導体の酸素濃度は１０
ｐｐｍ以下であるのが、やはり接合性の点で好ましいこ
とが判った。When comparing the examples, the weight ratio A / B
= 65/35 to 55/45 is preferable in particular from the viewpoint of bonding property.
It has been found that the content of not more than ppm is preferable in view of the joining property.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｃ０９Ｄ 179/08 Ｃ０９Ｄ 179/08 Ｃ Ｈ０１Ｂ 3/30 Ｈ０１Ｂ 3/30 Ｆ Ｇ 7/00 ３０３ 7/00 ３０３ 7/29 13/16 Ｆ 13/16 7/34 Ａ (72)発明者 山内 雅晃 大阪市此花区島屋一丁目１番３号 住友電 気工業株式会社大阪製作所内 (72)発明者 倉田 正春 名古屋市南区菊住一丁目７番10号 住友電 気工業株式会社名古屋製作所内 (72)発明者 浅井 洋光 愛知県刈谷市昭和町１丁目１番地 株式会 社デンソー内 (72)発明者 松原 慎一 愛知県刈谷市昭和町１丁目１番地 株式会 社デンソー内 (72)発明者 ▲高▼橋 誠 愛知県刈谷市昭和町１丁目１番地 株式会 社デンソー内 Ｆターム(参考） 4J038 DD062 DD132 DE002 DF052 DH042 DJ002 DJ021 DJ051 DK012 MA13 NA21 PB09 PC02 5G305 AA02 AB17 AB24 AB34 AB36 BA25 CA24 CA25 CA45 5G309 CA10 LA01 MA02 MA03 5G315 CA02 CA04 CB02 CC05 CC09 CD09 5G325 LA01 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) C09D 179/08 C09D 179/08 C H01B 3/30 H01B 3/30 F G 7/00 303 7/00 303 7/29 13/16 F 13/16 7/34 A (72) Inventor Masaaki Yamauchi 1-3-1 Shimaya, Konohana-ku, Osaka-shi In Osaka Works, Sumitomo Electric Industries, Ltd. (72) Inventor Masaharu Kurata Nagoya 1-7-10 Kikusumi, Minami-ku Sumitomo Electric Industries, Ltd.Nagoya Works 1-1-1 Showa-cho, Denshi Co., Ltd. DENSO Corporation (72) Inventor ▲ Taka ▼ Makoto Hashi 1-1-1, Showa-cho, Kariya City, Aichi Prefecture F-term (reference) 4J038 DD062 DD132 DE002 DF052 DH042 DJ002 DJ021 DJ051 DK012 MA13 NA21 PB09 PC02 5G305 AA02 AB17 AB24 AB34 AB36 BA25 CA24 CA25 CA45 5G309 CA10 LA01 MA02 MA03 5G315 CA02 CA04 CB02 CC05 CC09 CD09 5G325 LA01
Claims (7)
リイミドのうちの少なくとも一方からなる第１絶縁層
と、 (2) ポリアミドイミドＡに、ガラス転移温度１４０℃以
上の熱可塑性樹脂Ｂを、重量比Ａ／Ｂで表してＡ／Ｂ＝
７０／３０〜３０／７０の割合で配合してなる第２絶縁
層とをこの順に被覆、積層することによって、導体上
に、上記第１絶縁層の膜厚Ｔ1と、第２絶縁層の膜厚Ｔ2
との比Ｔ1／Ｔ2がＴ1／Ｔ2＝５／９５〜４０／６０の範
囲内で、かつ残留溶剤量が絶縁皮膜総量の０．０５重量
％以下である絶縁皮膜を形成したことを特徴とする絶縁
電線。(1) A first insulating layer substantially consisting of at least one of polyamide imide and polyimide, and (2) a polyamide resin A having a thermoplastic resin B having a glass transition temperature of 140 ° C. or higher. A / B = weight ratio A / B =
By covering and laminating a second insulating layer formed in a ratio of 70/30 to 30/70 in this order, the film thickness T 1 of the first insulating layer and the thickness of the second insulating layer Film thickness T 2
That the ratio T 1 / T 2 to T 1 / T 2 = 5/95 to 40/60, and the amount of residual solvent is 0.05% by weight or less of the total amount of the insulating film. An insulated wire characterized by the following.
と熱可塑性樹脂Ｂとの配合割合が、重量比Ａ／Ｂで表し
てＡ／Ｂ＝６５／３５〜４５／５５である請求項１記載
の絶縁電線。2. Polyamide-imide A in a second insulating layer.
2. The insulated wire according to claim 1, wherein the mixing ratio of the thermoplastic resin B and the thermoplastic resin B is A / B = 65/35 to 45/55 in terms of weight ratio A / B.
と熱可塑性樹脂Ｂとの配合割合が、重量比Ａ／Ｂで表し
てＡ／Ｂ＝６５／３５〜５５／４５である請求項２記載
の絶縁電線。3. Polyamide-imide A in a second insulating layer.
The insulated wire according to claim 2, wherein the mixing ratio of the thermoplastic resin B and the thermoplastic resin B is A / B = 65/35 to 55/45 in terms of weight ratio A / B.
厚Ｔ2との比Ｔ1／Ｔ2がＴ1／Ｔ2＝５／９５〜２５／７
５である請求項１記載の絶縁電線。4. The ratio T 1 / T 2 of the thickness T 1 of the first insulating layer to the thickness T 2 of the second insulating layer is T 1 / T 2 = 5/95 to 25/7.
5. The insulated wire according to claim 1.
素銅によって形成されている請求項１記載の絶縁電線。5. The insulated wire according to claim 1, wherein the conductor is formed of low oxygen copper having an oxygen content of 10 ppm or less.
求項１記載の絶縁電線。6. The insulated wire according to claim 1, wherein the elongation at break of the insulating film is 50% or more.
角巻線として使用すべく、圧延加工によって平角状に成
形してなる請求項１記載の絶縁電線。7. The insulated wire according to claim 1, wherein the conductor after coating and forming the insulating film is formed into a rectangular shape by rolling to use as a rectangular winding.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33953699A JP4245244B2 (en) | 1999-11-30 | 1999-11-30 | Insulated wire |
| US09/460,647 US6288342B1 (en) | 1998-12-15 | 1999-12-14 | Insulated wire |
| DE69920381T DE69920381T2 (en) | 1998-12-15 | 1999-12-15 | Insulated wire |
| EP99310124A EP1011107B1 (en) | 1998-12-15 | 1999-12-15 | Insulated wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33953699A JP4245244B2 (en) | 1999-11-30 | 1999-11-30 | Insulated wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001155551A true JP2001155551A (en) | 2001-06-08 |
| JP4245244B2 JP4245244B2 (en) | 2009-03-25 |
Family
ID=18328412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33953699A Expired - Fee Related JP4245244B2 (en) | 1998-12-15 | 1999-11-30 | Insulated wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4245244B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002109965A (en) * | 2000-10-03 | 2002-04-12 | Furukawa Electric Co Ltd:The | Insulation sheath electric conductor |
| JP2009164037A (en) * | 2008-01-09 | 2009-07-23 | Sumitomo Electric Wintec Inc | Insulated electric wire |
| JP2011003375A (en) * | 2009-06-18 | 2011-01-06 | Hitachi Cable Ltd | Insulated wire |
| JP2011154819A (en) * | 2010-01-26 | 2011-08-11 | Hitachi Cable Ltd | Insulated wire |
| WO2012043839A1 (en) | 2010-10-01 | 2012-04-05 | 古河電気工業株式会社 | Insulated wire |
| JP2012156011A (en) * | 2011-01-26 | 2012-08-16 | Toyota Motor Corp | Insulation conducting wire, and method for manufacturing insulation conducting wire |
| US8679628B2 (en) | 2009-06-18 | 2014-03-25 | Hitachi Cable, Ltd. | Insulated wire |
| EP3093855A4 (en) * | 2014-01-10 | 2017-06-21 | Furukawa Electric Co. Ltd. | Insulated electric wire, coil and electric/electronic device, and cracking prevention method for insulated electric wire |
| WO2022224486A1 (en) * | 2021-04-23 | 2022-10-27 | 住友電気工業株式会社 | Insulated wire |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107248431B (en) * | 2017-05-09 | 2019-01-25 | 佳腾电业（赣州）有限公司 | A kind of production technology of the flat enamel covered wire of high tenacity |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002109965A (en) * | 2000-10-03 | 2002-04-12 | Furukawa Electric Co Ltd:The | Insulation sheath electric conductor |
| JP4057230B2 (en) * | 2000-10-03 | 2008-03-05 | 古河電気工業株式会社 | Insulated conductor |
| JP2009164037A (en) * | 2008-01-09 | 2009-07-23 | Sumitomo Electric Wintec Inc | Insulated electric wire |
| JP2011003375A (en) * | 2009-06-18 | 2011-01-06 | Hitachi Cable Ltd | Insulated wire |
| US8679628B2 (en) | 2009-06-18 | 2014-03-25 | Hitachi Cable, Ltd. | Insulated wire |
| JP2011154819A (en) * | 2010-01-26 | 2011-08-11 | Hitachi Cable Ltd | Insulated wire |
| WO2012043839A1 (en) | 2010-10-01 | 2012-04-05 | 古河電気工業株式会社 | Insulated wire |
| JP2012156011A (en) * | 2011-01-26 | 2012-08-16 | Toyota Motor Corp | Insulation conducting wire, and method for manufacturing insulation conducting wire |
| EP3093855A4 (en) * | 2014-01-10 | 2017-06-21 | Furukawa Electric Co. Ltd. | Insulated electric wire, coil and electric/electronic device, and cracking prevention method for insulated electric wire |
| WO2022224486A1 (en) * | 2021-04-23 | 2022-10-27 | 住友電気工業株式会社 | Insulated wire |
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| Publication number | Publication date |
|---|---|
| JP4245244B2 (en) | 2009-03-25 |
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