JP2001144144A - Film carrier tape for mounting electronic component, manufacturing method therefor, film carrier tape package body for mounting the electronic component and preserving/transfer method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce shift in the total pitch width of an inner lead in storage/ transfer. SOLUTION: In a film carrier tape for mounting electronic components, a prescribed wiring pattern formed of conductive metal foil is formed on the surface of an insulating film. A solder resist is applied to the wiring pattern by leaving a lead part and the lead part is plated. The film carrier tape for mounting electronic components has humidification history, where humidity is kept to the condition of 60%±5% after the lead part is plated. The tape is further closed and stored in a water impermeable package body.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a TAB (Tape Automated
The present invention relates to a film carrier tape for mounting an electronic component such as a bonding tape, a method for manufacturing the same, a film carrier tape package for mounting an electronic component, and a method using the package. More particularly, the present invention relates to a film carrier tape for mounting electronic components, in which bonding failure is less likely to occur when mounting electronic components, a method for manufacturing the same, a packaged film carrier tape for mounting electronic components, and a method for using the package. .

[0002]

2. Description of the Related Art Conventionally, film carrier tapes for mounting electronic components, such as TAB tapes, have been used for mounting electronic components such as semiconductors on electronic devices. And
The performance and size and weight of electronic devices on which such semiconductors are mounted are increasing at a tremendous pace. In addition to the necessity, mounting technology for mounting electronic components such as semiconductors having a large capacity on electronic devices has become very important. That is, when the capacity of an electronic component such as a semiconductor increases, the number of electrodes increases, and accordingly, the number of leads of the TAB tape needs to be increased. And because of the demand for smaller and lighter, TA
It is necessary to form very thin leads on the B tape, and attempts are being made to reduce the lead width of the inner leads to ten and several micrometers or less.

[0003] In such a TAB tape, a metal foil is attached to an insulating film in which sprinket holes, device holes, and the like are formed, and a photoresist is applied on the metal foil to form the photoresist into a desired shape. After exposing and removing unnecessary portions and masking, etching with a metal to etch the metal foil into a desired pattern, removing the masking agent, and further applying a solder resist except for the formed lead portion, It is manufactured by forming, for example, a eutectic with a bump of a device such as tin on a lead portion and performing metal plating for bonding the device.

FIG. 1 shows an example of the TAB tape thus formed. As shown in FIG. 1, device holes 21, outer lead holes 22,
A sprinkle hole 23 and the like are formed, and a predetermined wiring pattern 14 is formed on the surface of the insulating film 10. One end of the wiring pattern 14 forms an inner lead 15 extending into the device hole 21, and the other end of the wiring pattern 14 extends over the outer lead hole 22.
, And a test pad 17 is formed at the tip thereof.

As shown in FIG. 2, the bump electrode 25 of an electronic component 26 such as a semiconductor is brought into contact with the inner lead 15 formed so as to extend to the device hole 15 of the TAB tape formed as described above. The electronic components 26 can be mounted by batch welding.
By the way, in the TAB tape used in this way, a polyimide film is used as an insulating film.

The polyimide forming this insulating film has a hygroscopicity of about 1 to 3%, and the dimensions of the polyimide change due to moisture absorption. The amount of water absorbed by the polyamide film varies daily depending on the TAB tape manufacturing conditions, storage conditions, weather conditions, and the like. Therefore, even if the same wiring pattern is formed, the position of the inner leads is slightly shifted. Can be seen. That is, when the humidity changes by 1%, the TAB tape changes by about 20 ppm in total pitch width. The average humidity in winter is 40% and the average humidity in summer is 8%.
If it is 0%, for example, if a TAB tape is manufactured in winter and this TAB tape is used in summer, this 40%
Due to the humidity difference, the total pitch width, which is the width of the portion where the inner leads are formed, is, for example, 2 cm (20000 μm).
In the case of the TAB tape of m), the calculated value changes by a maximum of 16 μm. When mounting electronic components on a TAB tape, such a total pitch width is adjusted by, for example, applying tension, but the total pitch width that can be adjusted when mounting electronic components is such that the total pitch width is 2 cm. For a TAB tape, the limit is about 5 μm. In conventional TAB tapes with a wide pitch, by mounting electronic components while correcting the total pitch as described above,
It was possible to contact the bump of the electronic component at the position of the inner lead. However, with a recent fine pitch TAB tape, electronic components cannot be normally mounted using a TAB tape having a total pitch width exceeding 250 ppm with respect to a design value.

[0007] By the way, even if the TAB tape is manufactured normally, the fluctuation of the total pitch width of the TAB tape causes the insulating film to become wet in the atmosphere as described above in the process of storing or transferring the TAB tape. It is also caused by absorbing Conventionally, a TAB tape has been subjected to a plating treatment on a lead portion or the like, and then subjected to a heating treatment, sealed in a packaging bag formed of a plastic film such as polyolefin, and held and transported. The plastic film used here has moisture permeability, and the humidity in the packaging bag tends to change during transportation or storage.
It is thought that the total pitch width of the tape would have varied in various ways depending on the packaging.

[0008] In the conventional TAB tape, the total pitch width rarely becomes a problem during storage or transfer, but in recent fine-pitch TAB tapes, the total pitch width during storage or transfer is low. The probability that electronic components cannot be mounted due to the fluctuation of the electronic components is increasing.

[0009]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a film carrier tape for mounting electronic components having a small variation in the total pitch width, and a method for manufacturing such a film carrier tape for mounting electronic components. Further, a storage / transfer method capable of suppressing fluctuations in the total pitch width due to changes in humidity even during storage or transfer of an electronic component mounting film carrier tape having a small fluctuation in the total pitch width as described above is provided. It is intended to be.

Another object of the present invention is to provide a package of a film carrier tape for mounting electronic components, which is suitable for such storage and transfer.

[0011]

SUMMARY OF THE INVENTION In a film carrier tape for mounting electronic parts of the present invention, a predetermined wiring pattern made of a conductive metal foil is formed on the surface of an insulating film, and a solder resist is left on the wiring pattern while leaving a lead portion. An electronic component mounting film carrier tape which is coated and whose leads are plated, wherein the electronic component mounting film carrier tape has a humidity of 60% ± 5% after plating the leads. Characterized by having a humidity control history held in

The film carrier tape for mounting electronic parts of the present invention forms a predetermined wiring pattern by etching a conductive metal foil attached to a surface of an insulating film;
A method for producing a film carrier tape for mounting an electronic component, comprising: applying a solder resist on the wiring pattern while leaving a lead portion, and then plating the lead portion. After plating on the lead portions, the film carrier tape for mounting electronic components can be manufactured by maintaining the humidity at 60% ± 5%.

Further, in the film carrier tape package for electronic component mounting of the present invention, a predetermined wiring pattern made of a conductive metal foil is formed on the surface of the insulating film, and a solder resist has a lead portion on the wiring pattern. The package is coated with an electronic component mounting film carrier tape, which has been coated with the lead portion and the lead portion is plated, and the electronic component mounting film carrier tape is
After the lead portion is plated, the film carrier tape for mounting electronic components has a humidity control history maintained at a humidity of 60% ± 5%, and has a water-impermeable property in which air inside is replaced with an inert gas. It is characterized by being enclosed in a packaging bag.

Further, in the method for storing and transferring a film carrier tape for mounting electronic parts according to the present invention, a predetermined wiring pattern made of a conductive metal foil is formed on a surface of an insulating film, and a solder resist is formed on the wiring pattern. A method for storing and transferring an electronic component mounting film carrier tape in which a lead portion is applied and the lead portion is plated, wherein the electronic component mounting film is plated after the lead portion. Carrier tape at humidity 6
0% ± 5%, then sealed in a water-impermeable packaging bag in which the air inside has been replaced with inert gas.
It is characterized by being transported.

The film carrier tape for mounting electronic parts of the present invention has a humidity control history maintained at a humidity of 60% ± 5% after plating. The film carrier tape for mounting electronic components obtained by plating the leads and the like in this way is housed in, for example, a humidity control chamber, and the amount of moisture contained in the film carrier tape for mounting electronic components, particularly, the insulating film. Is packaged by controlling the humidity within a certain range, the amount of change in the total lead width with respect to the change in humidity of the film carrier tape for mounting electronic components can be reduced.

In particular, the film carrier tape for mounting electronic parts having the humidity control history as described above is sealed in a water-impermeable packaging bag by replacing the air inside the packaging bag with an inert gas. Accordingly, until the package is opened, the contained electronic component mounting film carrier tape can be held in a state immediately after the humidity control. When stored or transferred in a water-impermeable packaging bag in this manner, the film carrier tape for mounting electronic components of the present invention can be stably maintained regardless of external conditions.

[0017]

DETAILED DESCRIPTION OF THE INVENTION Next, a film carrier tape for mounting electronic parts, a method for manufacturing the same, a package, and a method for storing and transporting the same according to the present invention will be specifically described with reference to the drawings. In the drawings shown in the present invention, common members are assigned common numbers. As shown in FIGS. 1 to 3, the electronic component mounting film carrier tape of the present invention has a predetermined wiring pattern 14 made of a conductive metal foil formed on the surface of an insulating film 10.
A solder resist 18 is applied on the substrate, leaving the lead portions 15 and 16, and the lead portions 15 and 16 are plated.

The insulating film 10 is made of a flexible resin film. In addition, the insulating film 10 has chemical resistance that is not affected by such a chemical because it comes into contact with an acid or the like at the time of etching, and has heat resistance that does not deteriorate even by heating during bonding. Examples of such a flexible resin film include glass epoxy, BT resin, polyester, polyamide, and polyimide. Particularly, in the present invention, it is preferable to use a film made of polyimide.

Examples of the polyimide film forming the insulating film 10 include a wholly aromatic polyimide synthesized from pyromellitic dianhydride and an aromatic diamine, and a synthetic film formed from biphenyltetracarboxylic dianhydride and an aromatic diamine. Wholly aromatic polyimide having a biphenyl skeleton. Particularly, in the present invention, a wholly aromatic polyimide having a biphenyl skeleton (eg, trade name: Upilex, manufactured by Ube Industries, Ltd.) is preferably used. The thickness of the insulating film 10 is usually 25 to 125.
μm, preferably in the range of 50 to 75 μm. When polyimide is used as such an insulating film, this polyimide film has a water absorption of about 1 to 3%, and the polyimide film expands when the polyimide film absorbs water as described above.

The insulating film 10 used in the present invention includes:
When the device hole 21, the sprocket hole 23, the outer lead hole 22, and the bent portion are provided,
Flex slits and the like are formed at the bending positions by punching. The wiring pattern 14 is formed on the insulating film 1 on which the predetermined holes 21, 22, 23,.
0 is formed by etching a metal foil attached to at least one surface of the metal foil. The metal foil is attached to at least one surface of the insulating film 10 with or without using an adhesive. When the metal foil is attached using an adhesive, the adhesive layer 12 is formed using an insulating adhesive.

The adhesive used here must have properties such as heat resistance, chemical resistance, adhesive strength and flexibility. Examples of the adhesive having such properties include an epoxy-based adhesive, a polyimide-based adhesive, and a phenol-based adhesive. Such an adhesive may be modified with a urethane resin, a melamine resin, a polyvinyl acetal resin, or the like, or the epoxy resin itself may be modified with a rubber. Such adhesives are usually heat-curable.

The thickness of the adhesive layer 12 is usually 8 to 23 μm.
m, preferably in the range of 10 to 21 μm. When the metal foil is attached to the insulating film 10 as described above, the metal foil can be attached without using an adhesive. The adhesive layer 12 may be provided by applying an adhesive to the surface of the insulating film 10, or may be provided by applying an adhesive to the surface of the metal foil.

The metal foil used in the present invention has conductivity, and examples of such a metal foil include a copper foil and an aluminum foil. In particular, in the present invention, it is preferable to use a copper foil as the metal foil. Copper foil used as a metal foil in the present invention includes an electrolytic copper foil and a rolled copper foil, and any of the copper foils can be used in the present invention. In producing the tape, it is preferable to use an electrolytic copper foil as the metal foil.

As the electro-deposited copper foil used here, an electro-deposited copper foil having a thickness usually used for manufacturing a film carrier tape for mounting electronic components can be used, but a TAB tape having a fine pitch is manufactured. For this purpose, an electrolytic copper foil having an average thickness of usually 6 to 150 μm, preferably 6 to 75 μm, particularly preferably 9 to 75 μm, more preferably 9 to 50 μm is used. By using the electrolytic copper foil having such an average thickness, inner leads having a narrow pitch can be easily formed.

The process up to the production of this base film is a dry process, and since the metal foil is heated under pressure when attaching it to the insulating film, the photoresist is applied through this process. The moisture content of the base film (laminated body of insulating film and metal foil (hereinafter, also referred to as “base film”)) until the desired wiring pattern is exposed is 60% ± 5% humidity. %, Which is almost the same as humidity control.

A photoresist is applied to the base film thus formed, a predetermined wiring pattern is baked on the photoresist, unnecessary photoresist is removed, and a predetermined pattern is formed on the metal foil surface of the base film. Using this pattern as a masking material, the metal foil is etched. That is, a phytoresist is applied to the surface of the metal foil of the base film, and a predetermined wiring pattern is exposed and baked to form a soluble portion and an insoluble portion in the aqueous medium. By removing with
A masking material made of an insoluble photoresist can be formed on the surface of the metal foil. Here, the masking material made of an insoluble photoresist may be formed from a photoresist that is cured by exposure,
Conversely, after exposure using a photoresist that can be dissolved in a specific solvent such as an aqueous medium by exposure, the photoresist is formed by removing a portion of the photoresist solubilized by the specific solvent. Can also.

When the base film masked by the photoresist is brought into contact with an etching solution, the metal foil of the unmasked portion elutes, and the metal foil of the masked portion remains on the insulating film. A wiring pattern made of the metal foil that has not been eluted is formed on the film. As the etchant used here, an acidic etchant which is already usually used can be used.

In the wiring pattern thus formed, the pitch width of the inner leads is usually 30 to 60.
μm, preferably 35 to 55 μm, and the present invention is highly useful for such a fine pitch film carrier tape for mounting electronic components. In addition, the masking material (insoluble photoresist) after etching in this way
Can be removed by washing with, for example, an alkaline washing solution.

In the case of a device hole, an outer lead hole or the like, the metal foil in such a hole portion is etched by the infiltration of an etching solution from the back surface as it is, so that the insulating film usually penetrates in the thickness direction. When the holes are formed, it is preferable to apply a protective resin to the through holes from the back surface of the base film to prevent the metal foil from being eluted from the back surface.

In the present invention, after a predetermined wiring pattern is formed as described above, a solder resist is applied except for the tip of the inner lead 15 and the tip of the outer lead 16 to be plated in the next step. The solder resist coating liquid used in the present invention is a coating liquid having a relatively high viscosity in which a curable resin is dissolved or dispersed in an organic solvent.

The curable resin contained in the solder resist coating solution of the present invention includes an epoxy resin, an elastomer modified epoxy resin, a urethane resin, an elastomer modified urethane resin, a polyimide resin and an elastomer modified polyimide resin. It is preferable that the resin contains at least one resin component selected from the group consisting of a product. In particular, it is preferable to use a modified elastomer. This elastomer modification is carried out by mixing an epoxy resin, urethane resin or polyimide resin with an elastomer component and modifying the mixture, and copolymerizing a monomer forming an epoxy resin, a urethane resin or a polyimide resin with a monomer forming an elastomer. Although there is a method, any modified elastomer can be used in the present invention. In particular, the modified elastomer formed by a method of imparting elasticity to a resin as a main component by copolymerizing a monomer forming the elastomer is used. It is particularly preferred to use a substance.

In the present invention, in addition to the resin components described above, the solder resist coating solution usually contains a curing accelerator, a filler, an additive, a thixotropic agent, a solvent, and the like. Can be added. Further, in order to improve the properties such as flexibility of the solder resist layer, fine particles having elasticity such as rubber fine particles can be blended.

Such a solder resist coating solution can be applied using a screen printing technique. The solder resist coating solution is applied except for portions that are usually plated in the next step, such as inner lead portions and outer lead portions. The average coating thickness of such a solder resist is usually 1 to 100 μm, preferably 5 to 100 μm.
〜40 μm.

After applying the solder resist in this manner,
Normally, the solder resist is cured by heating. After the solder resist is applied while leaving the lead portion in this way, the lead portion exposed from the solder resist is plated. Such plating treatments include tin plating treatment, gold plating treatment, nickel plating treatment, silver plating treatment, solder plating treatment, and the like. In the present invention, these treatments can be used alone or in combination. Particularly, in the present invention, tin plating is preferable.

For example, in the case of tin plating, tin plating may be performed in a plurality of stages. Whisker generation can be prevented by performing tin plating stepwise in this manner. Further, the above shows an embodiment in which tin plating treatment is performed after coating and curing the solder resist, but after forming a thin tin plating layer on the formed wiring pattern, a solder resist can be applied and further tin plating can be performed. .

The tin plating layer is formed by a method such as electroless tin plating or electric tin plating. The initial tin plating layer thus formed is usually substantially made of tin, but may contain other metals as long as the characteristics of the tin plating layer are not impaired. The average thickness of the tin plating layer is preferably in the range of 0.1 to 0.6 μm. By forming a tin plating layer with such a thickness, when bonding the inner lead to the bump of the device, an appropriate amount of eutectic is supplied from the gold forming the bump and tin of the lead, and excessive eutectic Can be prevented from being short-circuited in the inner lead portion due to the supply of the liquid.

The film carrier tape for mounting electronic parts of the present invention is obtained by forming a film carrier tape for mounting electronic parts obtained by forming a plating layer
% ± 5%. In particular, in the present invention, the humidity is 60% ± 5%, the temperature is 20 to 100 ° C., preferably 22 to 100 ° C.
It is desirable that the temperature is maintained at 30 ° C. for 1 to 60 hours, preferably 5 to 50 hours. Under these humidity control conditions, it is sufficient to hold for a relatively long time at a low temperature and for a relatively short time at a high temperature. That is, in the method of the present invention, the film is held in the insulating film (preferably a polyimide film) of the film carrier tape for mounting electronic components by maintaining the film at a predetermined temperature and a predetermined time under the condition of 60% ± 5% humidity as described above. A certain amount of water is produced.

By controlling the humidity under the condition of 60% ± 5% humidity as described above, the deviation width of the total pitch shown in detail in FIG.
Usually, it is within the range of ± 0.0225%. For example, in the case of a film carrier tape for mounting electronic components having a total pitch width of a design value of 20000 μm (2 cm) and a pitch width of 50 μm, the allowable deviation width of the total pitch width is as follows:
It is about ± 4 μm with respect to the design value.
It is virtually impossible to mount the electronic component while eliminating such a shift in the total pitch width in the mounting process of the electronic component. Therefore, the deviation width of the total pitch is within a range of ± 0.0225% with respect to the design value, preferably ± 0.02%.
It is desirable that the total pitch of the film carrier tape for mounting electronic components according to the present invention is controlled within the above range by applying the humidity control step as described above. be able to.

It is preferable that the film carrier tape for mounting electronic parts of the present invention having the humidity control history maintained in the range of 60% ± 5% of humidity is packed so as to maintain the humidity control state. And in this invention, it is preferable to accommodate the film carrier tape for electronic component mounting which has a humidity control history as described above in a water-impermeable packaging bag. Such a water-impermeable package is preferably formed using a laminated film of a resin having low moisture permeability and another resin, a composite film in which metals are laminated, or a metal-deposited composite film.

Examples of the resin used here include polyolefin, polyester, polyamide, polyvinyl chloride and the like. When a laminated film is produced using such a resin, a resin having low moisture permeability (for example, polyamide) is used as a low moisture permeable resin on at least one surface, preferably both surfaces, of polyester, polyolefin or the like. Normal resin is laminated. Such a laminated film has two or more layers, and may be a laminate of three or more layers.

As a material for forming the moisture-impermeable packaging bag, a composite film of a resin and a metal is highly useful. Examples of metals used here are aluminum, tin,
Zinc and copper can be mentioned. Examples of the synthetic resin forming the composite film with the metal include polyolefin, polyester, and polyamide.
A metal foil can be formed from the above-mentioned metals, and this metal foil can be laminated with a resin, or a metal can be deposited on a resin film.

A film carrier tape for mounting electronic components having a humidity control history maintained at a humidity of 60% ± 5% is sealed in a packaging bag formed of the above-described moisture-impermeable resin. At this time, the air present in the moisture-impermeable packaging bag is replaced with an inert gas such as nitrogen or argon, and the electronic component mounting film carrier tape is sealed. In addition,
It is desirable that the humidity of the inert gas used here is also controlled within the range of 60% ± 5%. By introducing the inert gas into the packaging bag in this manner, the air present in the packaging bag is replaced by the inert gas, and the inside of the packaging bag becomes an inert gas atmosphere. Therefore, by storing and sealing the film carrier tape for mounting electronic components in the inert gas atmosphere thus formed, the inside of the packaging bag can be maintained at the same humidity of 60% ± 5% as the humidity control condition. At the same time, oxidation deterioration of the film carrier tape for mounting electronic components can be prevented.

The film carrier tape for mounting electronic components wound up together with the spacer on the reel is housed in a packaging bag in which an inert gas has been introduced and the air inside has been replaced with the inert gas, and then the packaging has been carried out while leaving the vent hole. Seal the tape inlet of the bag with a method such as heat sealing, then insert the gas outlet tube into the gas outlet to remove excess inert gas in the packaging bag, and finally pull out the gas outlet while removing the gas outlet tube. Is sealed by heat sealing or the like, so that the film carrier tape for mounting electronic components can be sealed in a packaging bag.

As described above, the electronic component mounting film carrier tape having a humidity control history maintained at a humidity of 60% ± 5% and a small amount of inert gas are contained in the electronic component mounting film carrier tape package of the present invention. And the packaging bag is impermeable to moisture, so that the humidity inside the package does not fluctuate due to changes in external humidity. Therefore, it is not particularly necessary to separately add a desiccant or a humectant inside the package of the present invention.

The electronic component mounting film carrier tape of the present invention hermetically sealed in the packaging bag as described above can be stably stored as it is hermetically sealed in the packaging bag. That is, the film carrier tape for mounting electronic components tightly housed in such a packaging bag is not affected by the external humidity, and the inside of the packaging bag is kept at a constant humidity. Does not fluctuate. Also, the transfer is not similarly affected by the external humidity. Therefore, since there is no need to perform refrigerated transportation, which has been partially performed in the past, the transportation cost is also significantly reduced.

[0046]

The film carrier tape for mounting electronic parts according to the present invention has a humidity control history maintained at a humidity of 60% ± 5% after the completion of the plating step. By including the film carrier tape in the water-impermeable packaging together with the inert gas, the fluctuation width of the total pitch in the electronic component mounting film carrier tape can be reduced. Therefore, by using the film carrier tape for mounting electronic components of the present invention, the leads and the bump electrodes coincide with each other, and the defective mounting rate of the electronic components is reduced.

Further, when the film carrier tape for mounting electronic components is stored and transported by using a package in which the film carrier tape for mounting electronic components of the present invention is placed in a water-impermeable packaging bag, the state of the outside air, especially humidity Since the total pitch of the film carrier tape for mounting electronic components of the present invention does not change depending on the change, the film carrier tape can be stably stored and transported without using any special storage facility or transportation means.

In particular, the film carrier tape for mounting electronic components of the present invention is extremely useful as a fine pitch film carrier tape having a narrow pitch width.

[0049]

Next, the present invention will be described in more detail with reference to examples of the present invention, but the present invention is not limited to these examples.

[0050]

Example 1 Device holes and sprocket holes were formed in a 75 μm thick polyimide film by punching. Then, on this polyimide film surface,
An epoxy adhesive was applied, and a copper foil having a thickness of 18 μm was adhered. Furthermore, apply a photoresist on this copper foil,
The photoresist was exposed and etched to form a wiring pattern on the copper foil. The designed total pitch width of the inner leads of the formed wiring pattern is 20000 μm, and the pitch width of each lead is 50 μm.
m.

After applying a urethane solder resist to the wiring pattern thus formed, the solder resist was hardened by heating to a temperature of 80 to 140 ° C. stepwise over 2.5 hours and heating. After the solder resist layer is formed in this manner, the film is transferred to an electroless tin plating layer, and the surface of the wiring pattern (inner lead and outer lead) on which the solder resist is not applied is coated with a surface having a thickness of 0.1 mm.
A tin plating layer was formed with a thickness of 2 μm.

After forming the tin plating layer, the TAB tape was kept at a temperature of 120 ° C. for one hour. A part of the TAB tape thus manufactured was cut out to obtain Sample 1. Next, this TAB tape was transferred to a humidity control chamber conditioned at a humidity of 60% ± 5% and a temperature of 25 ° C. ± 2 ° C., and was held for 48 hours. After 24 hours, remove this TAB tape,
When measuring the total pitch width of the inner lead,
20002 μm, and the deviation width of the total pitch from the design value was 2 μm, that is, 0.01%.

Next, as described above, the humidity was 60% ± 5%,
A TAB tape having a humidity control history maintained at a temperature of 25 ° C. ± 2 and a time of 48 hours is put into a moisture-impermeable packaging bag made of an aluminum-evaporated polyester film together with nitrogen gas, and a part of the TAB tape is taken in and out. After heat sealing the opening, a suction hose was inserted from an unsealed portion to suck excess nitrogen gas, and then the suction opening was heat sealed.

The TAB tape sealed in the moisture-impermeable packaging bag as described above was kept at room temperature for 6 months. During this time, the room humidity varied between 30-80%. After 6 months, remove the TAB tape from the moisture-permeable packaging bag,
When measuring the total pitch width of the inner lead,
20004 μm, and the deviation width of the total pitch from the design value was 4 μm, that is, 0.02%.

From the above results, it was found that the fluctuation of the total pitch width of the inner leads before and after placing in the moisture-impermeable packaging bag was extremely small. For comparison, the total pitch deviation width was measured for Sample 1 which was collected before being placed in the humidity control chamber and left as it was in the room.
The total pitch is 19988 μm, and the deviation width of the total pitch from the design value is 122 μm, that is, 0.06 μm.
%Met.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating an example of a film carrier tape for mounting electronic components.

FIG. 2 is a diagram illustrating a state of leads and bump electrodes when a device is mounted on a film carrier tape for mounting electronic components.

FIG. 3 is a diagram showing a cross section of the film carrier tape for mounting electronic components of the present invention.

FIG. 4 is a diagram showing a total pitch of inner leads.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Insulating film 15 ... Inner lead 16 ... Outer lead 21 ... Device hole 22 ... Outer lead hole 23 ... Spricket hole 25 ... Bump electrode 26 ... Electronic components

Claims (18)

[Claims] 1. A predetermined wiring pattern made of a conductive metal foil is formed on a surface of an insulating film, a solder resist is applied on the wiring pattern except for a lead portion, and the lead portion is plated. A film carrier tape for mounting electronic components, characterized in that the film carrier tape for mounting electronic components has a humidity control history maintained at a humidity of 60% ± 5% after plating a lead portion. Electronic component mounting film carrier tape. 2. The electronic component mounting film carrier tape according to claim 1, wherein the film carrier tape has a humidity control history maintained for 1 to 60 hours at a humidity of 60% ± 5% and a temperature of 25 to 100 ° C. 2. The film carrier tape for electronic component mounting according to claim 1. 3. A deviation of a total pitch of an inner lead portion extending into a device hole formed in the insulating film is ± 0.0225 with respect to a design value.
2. The electronic component mounting film carrier tape according to claim 1, wherein the content is in the range of%. 4. The electronic component according to claim 1, wherein a pitch width of an inner lead provided to extend into a device hole formed in the insulating film is within a range of 10 to 60 μm. Film carrier tape for mounting. 5. The film carrier tape according to claim 1, wherein the insulating film is a polyimide film. 6. The conductive metal foil has an average thickness of 5 to 70.
2. The film carrier tape for mounting electronic parts according to claim 1, wherein the film carrier tape is a μm electrolytic copper foil. 7. The electronic component mounting according to claim 1, wherein the electronic component mounting film carrier tape is sealed in a moisture-impermeable packaging bag in which the air inside is replaced with an inert gas. Film carrier tape. 8. A predetermined wiring pattern is formed by etching a conductive metal foil attached to a surface of an insulating film;
A method for producing a film carrier tape for mounting an electronic component, comprising: applying a solder resist on the wiring pattern while leaving a lead portion, and then plating the lead portion. 3. A method for manufacturing a film carrier tape for mounting electronic components, comprising: holding the film carrier tape for mounting electronic components at a humidity of 60% ± 5% after plating the lead portion of (1). 9. The film carrier tape according to claim 8, wherein the film carrier tape for mounting electronic components is maintained at a humidity of 60% ± 5% and a temperature of 25 to 100 ° C. for 1 to 60 hours. A method for manufacturing a film carrier tape for mounting electronic components. 10. A deviation of a total pitch of an inner lead portion provided to extend into a device hole formed in the insulating film is ± 0.022 with respect to a design value.
9. The method for producing a film carrier tape for mounting electronic parts according to claim 8, wherein the content is within a range of 5%. 11. The electronic component according to claim 8, wherein a pitch width of an inner lead extending into a device hole formed in the insulating film is within a range of 30 to 60 μm. Manufacturing method of film carrier tape for mounting. 12. The method according to claim 7, wherein the insulating film is a polyimide fill. 13. The conductive metal foil having an average thickness of 6 to 1
9. An electrolytic copper foil having a thickness of 50 μm.
The method for producing a film carrier tape for mounting electronic components according to the above item. 14. The electronic component mounting device according to claim 8, wherein the electronic component mounting film carrier tape is sealed in a moisture-impermeable packaging bag in which the air inside is replaced with an inert gas. A method for manufacturing a film carrier tape. 15. A predetermined wiring pattern made of a conductive metal foil is formed on the surface of the insulating film, a solder resist is applied on the wiring pattern except for a lead portion, and the lead portion is plated. A packaging body including the electronic component mounting film carrier tape, wherein the electronic component mounting film carrier tape has a humidity control history of 60% ± 5% after plating a lead portion. Wherein the electronic component mounting film carrier tape is enclosed in a water-impermeable packaging bag in which the air inside has been replaced with an inert gas. . 16. The package according to claim 15, wherein said water-impermeable packaging bag is formed of a plastic composite film having a metal layer. 17. A predetermined wiring pattern made of a conductive metal foil is formed on a surface of an insulating film, a solder resist is applied on the wiring pattern except for a lead portion, and the lead portion is plated. A method for storing and transferring the obtained electronic component mounting film carrier tape, wherein after plating the lead portion, the electronic component mounting film carrier tape is maintained at a humidity of 60% ± 5%, A method for storing and transferring a film carrier tape for mounting electronic components, wherein the method is sealed and stored and transferred in a water-impermeable packaging bag in which the air inside is replaced with an inert gas. 18. The method as claimed in claim 17, wherein the water-impermeable packaging bag is formed of a plastic composite film having a metal layer. .