JP2001129494A - Apparatus for supplying treating liquid - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the occurrence of abnormality in parts such as valves interposed in a pipeline route by the inflow of a second treating liquid into the pipeline route for supplying a first treating liquid to a substrate in the apparatus for supplying treating liquid which supplies the first treating liquid having relatively low temperature and low reactivity and the second treating liquid having relatively high temperature or high reactivity to the substrate. SOLUTION: In this apparatus for supplying treating liquid, a branch part B1 between a first pipeline L1 which is connected in a flow passage with a pure water (first treating liquid) supply source and a second pipeline L2 which is connected in a flow passage with a treating vessel 30 is disposed on the side of a first supply source 10 from a confluent part B2a between a third pipeline L3 which is connected in a flow passage with an ozonic water (second treating liquid) supply source 24 and the second pipeline L2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat panel display (FPD) such as a semiconductor substrate or a substrate for a liquid crystal display.
The present invention relates to a processing liquid supply device that supplies a plurality of processing liquids to various substrates such as a substrate for play and a substrate for a photomask.

[0002]

As one of a conventional process liquid supply apparatus, the lower the processing tank 70 for storing pure water, a processing liquid TL such hot and ozone water (O ₃ water) as shown in FIG. 4 Is known that supplies a processing liquid from above and supplies pure water in a shower form from above. The processing liquid supply device includes a pipe 51 that connects a pure water supply source 50 provided as equipment in a semiconductor manufacturing plant and a processing liquid supply pipe (not shown) provided in a processing tank 70.
A pipe 60 branches off from the pipe 51, and the pipe 60 is connected to a shower nozzle 62 in a flow path. In the middle of the pipe 50, a pipe 54 connected to the ozone water supply source 53 and a pipe 57 connected to the hot water supply source 56 are connected. In addition, each pipe 51, 54, 5
Valves 52, 55, 58, 59, and 61 for opening and closing the respective flow paths are provided in the middle of 7, 60, respectively. The drainage mechanism 80 drains the processing liquid TL in the processing tank 70 out of the processing tank 70.

Further, according to the processing liquid supply apparatus described above, by controlling the open / close state of each of the valves 52, 55, 58, 59, 61, pure water, ozone water and ozone water are supplied from the processing liquid supply pipe in the processing tank 70. Hot water is supplied appropriately, and the substrate W carried into the processing tank 70 is immersed in a processing liquid (pure water, ozone water, or hot water). Also, the shower nozzle 60
Then, pure water is appropriately supplied into the processing tank 70.

[0004]

However, according to the processing liquid supply apparatus described above, when pure water is supplied from the shower nozzle 62, ozone water or hot water remaining in the pipe 51 flows toward the pipe 60. Mix in water. Due to the heat of the mixed hot water, the diameter of the orifice in the valve 61 increases, the flow rate of the pure water supplied from the shower nozzle 60 increases, and pure water containing hot water or ozone water scatters outside the processing tank 70, causing the processing tank 70 to flow. This causes a problem of causing a failure of the substrate processing apparatus including the above. Also, the valve 61 is gradually damaged by the oxidizing power of the ozone water mixed into the pure water,
There is a problem that pure water including ozone water and hot water leaks out from the valve 61 and causes a failure of the substrate processing apparatus.

The above problem can be solved by making the valve 61 the same as the valves 55, 58, and 59 provided with measures against heat and acid. However, valves provided with measures against heat and acid are expensive. This causes another problem that the cost of the processing liquid supply device increases. An object of the present invention is to provide a first processing solution having relatively low reactivity and relatively low temperature, such as pure water at normal temperature, and a relatively high temperature, such as hot water or ozone water, without increasing the apparatus cost in view of the above-described parts. In a processing liquid supply device for supplying a second processing liquid or a highly reactive second processing liquid to a substrate disposed in the substrate processing apparatus, a pipe path for supplying the first processing liquid to the substrate is An object of the present invention is to prevent the occurrence of an abnormality in a component such as a valve interposed in the piping path due to the flow of the second processing liquid.

[0006]

According to a first aspect of the present invention, there is provided an apparatus for supplying a first processing liquid having a relatively low temperature and low reactivity to a substrate disposed in a substrate processing apparatus. And a second supply means for sequentially supplying the second treatment liquid having a relatively high temperature or the second treatment liquid having a high reactivity and the first treatment liquid to the substrate. A liquid supply device, a first pipe connecting a first supply source, which is a supply source of the first processing liquid, and a first supply unit, and a first pipe;
A second pipe for connecting the first supply source and the second supply means in a flow path, and a third pipe for connecting the second supply source, which is a supply source of the second processing liquid, and the second pipe in a flow path, A junction of the second pipe and the third pipe is provided in the substrate processing apparatus, and the flow path of the first pipe and the flow paths of the second pipe and the third pipe are separated in the substrate processing apparatus. It is characterized by having. According to the present invention, since the flow path of the first pipe and the flow paths of the second pipe and the third pipe are separated in the substrate processing apparatus, the first pipe in which the second processing liquid is mixed into the first pipe. Processing liquid does not flow.

According to a second aspect of the present invention, there is provided a first supply means for supplying a relatively low-temperature and low-reactivity first processing liquid to a substrate, and a relatively high-temperature second processing liquid or a highly reactive second processing liquid. A processing liquid supply device comprising: a second supply unit configured to sequentially supply the processing liquid and the first processing liquid to the substrate;
A first pipe for connecting the first supply source and the first supply means, which are supply sources of the processing liquid, in a flow path, a second pipe for connecting the first supply source and the second supply means in a flow path, A third pipe for connecting a second supply source, which is a liquid supply source, and a second pipe is provided, and the first pipe and the second pipe are branched at a predetermined branch portion. Second

[0008] It is characterized in that it is located closer to the first supply source than the junction of the pipe and the third pipe. According to the present invention, the second
The first processing liquid in which the second processing liquid is prevented from flowing from the junction of the pipe and the third pipe toward the branch between the first pipe and the second pipe, and the second processing liquid is mixed into the first pipe Does not flow.

According to a third aspect of the present invention, in the processing liquid supply device according to the first or second aspect, the first supply means is means for discharging the second processing liquid into the processing tank. The second supply means includes a first processing liquid and a second processing liquid in a processing tank for immersing the substrate in the first processing liquid or the second processing liquid.
It is a means for sequentially supplying a processing liquid.

According to a fourth aspect of the present invention, in the processing liquid supply apparatus according to any one of the first to third aspects, the first processing liquid
When the supply means supplies the first processing liquid to the substrate, a relatively large flow rate of the first processing liquid flows through the first pipe, and
A relatively small flow rate of the first processing liquid flows through the first pipe when there is no substrate to which the first processing liquid is to be supplied.
A flow control valve for controlling the flow rate of the first processing liquid is interposed in the first pipe.

[0011]

Preferred embodiments of the present invention will be described below with reference to the drawings. <First Embodiment> FIG. 1 is a schematic diagram for explaining a first embodiment which is one of the embodiments of the present invention. In FIG. 1, a plurality of substrates W are stored in a processing tank 30 of a substrate processing apparatus 90.
Are arranged in parallel with each other along a direction penetrating the paper by a support member (not shown) arranged therein. An outer tank 32 for temporarily receiving a processing liquid TL such as pure water, hot water, ozone water (O ₃ water), etc., which overflows from the processing tank 30 is attached to the upper outer periphery of the processing tank 30. Drain pipes L5 and L for draining the processing liquid TL out of the respective tanks are provided in the processing tank 30 and the outer tank 32.
6 are connected to the respective channels. A valve 40 for opening and closing the flow path is interposed in the drainage pipe L6, and the timing for draining the processing liquid TL in the processing tank 30 is controlled by controlling the opening and closing of the valve 40.

Next, the structure of a processing liquid supply mechanism (processing liquid supply device) for supplying a processing liquid to the processing tank 30 will be described. The processing liquid supply mechanism includes a pure water supply source 10 provided as equipment of a semiconductor manufacturing plant outside a substrate processing apparatus 90 having a processing tank 30 and the like, and a processing water supply mechanism 10 disposed above the processing tank 30 and And a first pipe L1 for connecting a flow path to a nozzle 16 for discharging pure water in a shower shape. The first pipe L1 is provided with a valve 14 for opening and closing the flow path and a flow control valve 12 for adjusting the flow rate of pure water flowing through the flow path. The flow control valve 12 can automatically change the diameter of the orifice provided therein according to an electric signal. In FIG. 1, the boundary between the inside of the substrate processing apparatus 90 and the outside of the apparatus 90 is indicated by a dashed line.

The processing liquid supply mechanism includes a pure water supply source 10 and a processing liquid supply pipe 3 disposed in the processing tank 30.
3 is provided with a second pipe L2 for connecting the flow path to the second pipe L3. Second pipe L
The valve 2 is provided with valves 21 and 22 for opening and closing the flow path and a filter 23 for purifying the processing liquid (pure water, hot water, ozone water) flowing through the flow path. In the middle of the second pipe L2, a third pipe L3 connected to the ozone water supply source 24 in a flow path.
And the fourth pipe L4, which is connected to the hot water supply source 26, is connected to each other. Valves 25 and 27 for opening and closing the flow paths are provided in the respective pipes L3 and L4. The first pipe L1 and the second pipe L2 correspond to the first pipe and the second pipe of the present invention, and the third pipe L3 or the fourth pipe L
Reference numeral 4 corresponds to a third pipe of the present invention.

Each of the valves 14, 21, 22, 25,
The control of opening and closing of the substrates 27 and 40 is performed by a control unit (not shown) including a known microcomputer including a CPU, a ROM, a RAM, and the like provided in the substrate processing apparatus 90.

Although the first pipe L1 and the second pipe L2 are connected to the pure water supply source 10 in a flow path, they need not be connected to the same pure water supply source. It may be connected in a flow path. Further, the substrate processing apparatus 90
Outside, the first pipe L1 and the second pipe L2 may be branched from a pipe connected to a pure water supply source. The ozone water supply source 24 and the hot water supply source 26 are provided outside the substrate processing apparatus 90 as factory equipment, and the substrate processing apparatus 90 is provided as one of the mechanisms provided in the substrate processing apparatus 90.
In some cases.

Next, an example of the operation of the first embodiment will be described.
This will be described with reference to the flowchart shown in FIG. First, in step S1, the valve 22 and the valve 27 are opened by a control signal from a control unit (not shown), and the other valves 1 and 2 are opened.
4, 21, 25, and 40 are closed, and hot water of, for example, 60 ° C. or higher is supplied from the hot water supply source 26 into the processing tank 30 via the fourth pipe L4, the second pipe L2, and the submerged pipe 33. The warm water supplied into the processing tank 30 gradually increases its water level, and then overflows from the upper end of the processing tank 30 toward the outer tank 32. The warm water that has overflowed into the outer tank 32 is drained out of the substrate processing apparatus 90 via the drain pipe L5.

Next, in step S2, the valves 22 and 25 are opened and the other valves 14, 21, 27 and 40 are closed according to a control signal from the control unit.
From the ozone water supply source 24 to the third pipe L3 and the second pipe L
A predetermined amount of ozone water having oxidizing power is supplied into the processing tank 30 through the second tank 2.

In step S3, a plurality of substrates W are transferred to a support member (not shown) disposed above the processing tank 30 by a substrate carry-in / out mechanism (not shown). The support member that has received the plurality of substrates W descends into the processing bath 30, carries the plurality of substrates W into the processing bath 30, and immerses the substrate W in ozone water for a predetermined time. By immersing the substrate W in ozone water in this manner, the substrate W
Organic substances attached to the surface of the substrate are removed by the oxidizing power of ozone water.

In step S4, the valve 40 is opened, the other valves 14, 21, 22, 25 and 27 are closed, and the ozone water in the processing tank 30 is quickly drained. When the ozone water in the processing tank 30 is almost completely drained, the valve 4
0 is closed. When step S4 is performed as a process subsequent to step S6 described later, the pure water in the processing tank 30 is drained.

In step S5, the valve 14 is opened and the orifice diameter in the flow control valve 12 is opened, and pure water at room temperature is discharged from the nozzle 16 toward the substrate W in the processing tank 30 in a shower shape. . This nozzle 16
The valves 21 and 22 are opened at the same time as the pure water is supplied from the processing tank 3 via the second pipe L2 and the submerged pipe 33.
From below 0, pure water at normal temperature is supplied. At this time, the valves 25 and 27 are closed. Pure water supplied into the processing tank 30 from the nozzle 16 and the submerged pipe 33 is supplied to the processing tank 3.
After overflowing from the upper end of the outer tank 32 to the outer tank 32, the liquid is drained through the drain pipe L5.

In step S6, it is determined whether or not the water washing of the substrate W in steps S4 and S5 has been completed. As this determination method, for example, it is determined whether or not the number of repetitions of step S4 and step S5 stored in the ROM in the control unit has been reached. If it is determined that the washing process has not been completed, the processes from step S4 to step S6 are repeated. This step S4
To S6 is generally called a quick dump rinse (QDR) process.

If it is determined in step 6 that the water washing process has been completed, the process proceeds to step S7. In step S7, a plurality of substrates W in the processing tank 30 are unloaded by lifting and lowering the support member and moving the substrate loading and unloading mechanism in the reverse procedure of step S3.

In step S8, it is determined whether there is a substrate W (next lot) to be processed next. If there is a next lot, the processing from step S1 is repeated. If there is no next lot, the process proceeds to step S9 and the substrate processing apparatus 9
For 0, etc., the standby state is maintained until the next lot occurs.

The orifice diameter in the flow control valve 12 is reduced in each step other than when pure water is discharged from the nozzle 16 in step S5. That is, in steps S1 to S9 excluding step S5,
A small amount of pure water always flows down from the nozzle 16. As a result, pure water is prevented from staying in the first pipe L1, the flow control valve 12, the valve 14, and the nozzle 16 provided in the first pipe L1. By preventing the pure water from staying in this way, bacteria are generated in the stayed pure water, and this pure water is supplied from the nozzle 16 to the substrate W in step S5 to adversely affect the processing of the substrate W. Can be prevented.

<Second Embodiment> Next, a second embodiment which is another embodiment of the present invention will be described. FIG. 3 shows the second
FIG. 2 is a schematic diagram for explaining the embodiment, in which components denoted by the same reference numerals as those shown in FIG. 1 are the same as those described in the first embodiment, and will be described in detail below. Detailed description is omitted.

In the second embodiment, unlike the first embodiment, the first pipe L1 and the second pipe L2 are branched at a branch B1 in the substrate processing apparatus 90. This branch B1
Is closer to the pure water supply source 10 than the junction B2a where the second pipe L2 and the third pipe L3 join and the junction B2b where the second pipe L2 and the fourth pipe L4 join. Is set. Note that the branch portion B1 corresponds to the branch portion described in claim 2 of the present invention, and the junction B2a or the junction B2b
Corresponds to the junction according to claim 2 of the present invention.

As described above, the first pipe L1 and the second pipe L2 are located closer to the pure water supply source 10 than the respective junctions B2a and B2b.
Is provided, ozone water from the ozone water supply source 24 or hot water from the hot water supply source 26 can be prevented from flowing into the first pipe L1. Further, by closing the valve 21 provided between the junction B2a or the junction B2b and the branch B1 when the valve 25 or the valve 27 is opened, ozone water or hot water flows to the first pipe L1. Inflow can be more reliably prevented.

As shown in FIG. 3, the branch part B1 and the junction B2
a and B2b need not be provided in the substrate processing apparatus 90;
Both of these junctions B2a and B2b are connected to the substrate processing apparatus 9
0 or one of them is provided in the substrate processing apparatus 90.
It may be provided outside.

The operation of the second embodiment is the same as the operation of the first embodiment shown in the flowchart of FIG.

<Other Embodiments> In each of the above-described embodiments, room temperature pure water is used as the first treatment liquid of the present invention,
As one of the processing liquids, warm water of 60 ° C. or higher is exemplified, but the respective temperature ranges are not limited thereto. In other words, whether the processing liquid is the first processing liquid or the second processing liquid is defined by whether or not the processing liquid has a temperature range that adversely affects components such as valves provided in the first pipe of the present invention. The processing liquid at a given temperature is the second processing liquid, and the processing liquid at a temperature that does not adversely affect is the first processing liquid.

In each of the above embodiments, the second processing liquid of the present invention is exemplified by hot water and ozone water, but is not limited thereto. For example, a strongly alkaline chemical solution, a strongly acidic chemical solution, a high-temperature chemical solution, or the like may be used as the second processing liquid.

[0032]

As described above in detail, according to the first aspect of the present invention, the flow path of the first pipe and the flow paths of the second pipe and the third pipe are separated in the substrate processing apparatus. This prevents the first processing liquid mixed with the second processing liquid from flowing into the first pipe. As a result, it is possible to prevent an abnormality caused by the second processing liquid from occurring in a component such as a valve provided in the first pipe.

According to the second aspect of the present invention, the flow of the second processing liquid from the junction of the second pipe and the third pipe toward the branch between the first pipe and the second pipe is suppressed, The first processing liquid mixed with the second processing liquid can be prevented from flowing into the first pipe. As a result, it is possible to prevent an abnormality caused by the second processing liquid from occurring in a component such as a valve provided in the first pipe.

According to the third aspect of the present invention, since the occurrence of an abnormality caused by the second processing liquid in parts such as a valve provided in the first pipe is prevented, the first supply means can be used to prevent the inside of the processing tank from being damaged. , The second processing liquid can always be discharged accurately.

According to the fourth aspect of the present invention, since an abnormality caused by the second processing liquid is prevented from occurring in the flow control valve interposed in the first pipe, the flow from the first supply means can be prevented. The amount of the first processing liquid to be supplied can be accurately adjusted. In particular, it is possible to prevent the first processing liquid from being supplied more than necessary when supplying a small amount of the first processing liquid from the first supply means, and as a result, the first processing liquid is supplied to an undesired area such as outside the processing tank. Can be prevented from scattering and adhering.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a first embodiment of the present invention.

FIG. 2 is a flowchart illustrating an operation of the first embodiment.

FIG. 3 is a schematic diagram showing a second embodiment of the present invention.

FIG. 4 is a schematic diagram showing a conventional processing liquid supply device.

[Explanation of symbols]

 L1 First pipe L2 Second pipe L3 Third pipe L4 Fourth pipe 10 Pure water supply 16 Nozzle 24 Ozone water supply 26 Hot water supply 30 Processing tank B1 Branch B2a, B2b Merge

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3B201 AA03 AB08 AB42 BB04 BB82 BB93 BB98 CB15 3J071 AA12 BB14 BB15 CC03 DD26 FF11 4G068 AA06 AB11 AC05 AC13 AD03 AF01 5F043 DD07 DD10 EE07 EE10 EE25 EE29 EE31

Claims (4)

[Claims] A first supply unit configured to supply a first processing liquid having a relatively low temperature and a low reactivity to a substrate disposed in the substrate processing apparatus; And a second supply unit for sequentially supplying the second processing liquid and the first processing liquid to the substrate, wherein the first processing liquid and the first processing liquid are supplied to the substrate. A first pipe for connecting the first supply means to the flow path, a second pipe for connecting the first supply source and the second supply means to the flow path, a second supply source which is a supply source of the second processing liquid, and a second supply source. A third pipe for connecting the two pipes with each other, a junction of the second pipe and the third pipe is provided in the substrate processing apparatus, and a flow path of the first pipe, the second pipe, and the third pipe are provided. A processing liquid supply device, wherein a flow path of a pipe is separated in the substrate processing apparatus. 2. A first supply means for supplying a relatively low-temperature and low-reactivity first processing liquid to a substrate; a relatively high-temperature second processing liquid or a highly reactive second processing liquid; A processing liquid supply device comprising: a second supply means for sequentially supplying a processing liquid to the substrate; a first liquid supply apparatus comprising: a first supply source serving as a first processing liquid supply source; A pipe, a second pipe connecting the first supply source and the second supply means in a flow path, a third pipe connecting the second supply source serving as a supply source of the second processing liquid and the second pipe in a flow path, The first pipe and the second pipe are branched at a predetermined branch portion,
This branch portion is more first than the junction of the second pipe and the third pipe.
A processing liquid supply device, which is provided on a supply source side. 3. The processing liquid supply device according to claim 1, wherein the first supply means is means for discharging a second processing liquid into a processing tank, and the second supply means is A processing liquid supply device, comprising: means for sequentially supplying a first processing liquid and a second processing liquid into a processing tank for immersing a substrate in the first processing liquid or the second processing liquid. 4. The processing liquid supply device according to claim 1, wherein the first supply means is provided on the substrate.
A relatively large flow rate of the first processing liquid flows through the first pipe when the processing liquid is supplied, and a relatively small flow rate of the first processing liquid flows when the substrate to which the first processing liquid is to be supplied does not exist. A processing liquid supply device, wherein a flow control valve for adjusting a flow rate of a first processing liquid is provided in the first pipe so as to flow through one pipe.