JP2001127217A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component of a structure, wherein information on a program soft version housed in a semiconductor device can be simply confirmed and a confirmation of an exchange of the semiconductor deice with other seniconductor device can be performed easily and reliably. SOLUTION: An electronic component is provided with a semiconductor device 3 which is formed by sealing a memory chip 1 house with programs and data and an IC chip 2 housed with information on an ID, a socket 4 which is connected with this device 3, and an antenna 6 which is connected with the device 3 via the socket 4 and communicates the information on an ID housed in the chip 2 with a scanner in a non-contact state. The information being housed in the chip 2 in the device 3 is transmitted from the antenna 6 to read the information by the scanner in a non-contact state, and whether the device 3 is a compatible one or is an incompatible one can be detected by the collation of this read information.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device in which program software for electronic equipment such as a computer is stored, and an electronic component comprising a socket for connecting the semiconductor device.

[0002]

2. Description of the Related Art Electronic devices such as computers are controlled by program software. This program software is a semiconductor device mounted inside a computer or a control device (hereinafter, referred to as a computer), for example, a memory chip (PROM, EPROM, EEP).
ROM, a non-volatile memory such as a ferroelectric memory). Most of the above-mentioned program software controls a computer and a peripheral system of the main body in series. However, if the connection of the peripheral device connected to the computer is changed, a new device is connected, or the operation procedure is changed, the contents of the program software are changed and the version is upgraded.
And, these version upgrades must be performed on a single computer or on all computers operating as equivalent systems, but since they are often distributed,
It is often done individually for each computer or memory chip.

[0003]

However, when a certain portion is individually upgraded, the device may not operate normally unless the version of the other portion of the entire system is compatible. However, in conventional electronic devices, such version information cannot be confirmed by a simple method, and it is often found that the version is not compatible only after a malfunction or an unintended operation occurs, There was a problem that extra time was required until discovery.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and can easily confirm version information of program software stored in a semiconductor device, and can easily and reliably confirm replacement of a semiconductor device. It is an object of the present invention to provide an electronic component that can be used.

[0005]

An electronic component according to a first aspect of the present invention is a semiconductor device formed by sealing a memory chip 1 storing programs and data and an IC chip 2 storing ID information. 3, a socket 4 to which the semiconductor device 3 is connected, and the semiconductor device 3 through the socket 4.
And an antenna 6 connected to the scanner 5 and communicating the ID information stored in the IC chip 2 with the scanner 5 in a non-contact manner.

According to a second aspect of the present invention, in the first aspect, the antenna 6 is provided on the socket 4.

According to a third aspect of the present invention, in the second aspect, the outer dimensions of the socket 4 are formed to be larger than the outer dimensions of the semiconductor device 3.

According to a fourth aspect of the present invention, in the first to third aspects, the antenna 6 is provided at a position where the antenna 6 and the semiconductor device 3 do not overlap in the communication direction of the antenna 6. .

A fifth aspect of the present invention is characterized in that, in the second to fourth aspects, the antenna 6 is provided inside the socket 4.

A sixth aspect of the present invention is characterized in that, in any of the second to fourth aspects, the antenna 6 is provided on the surface of the socket 4.

According to a seventh aspect of the present invention, in the sixth aspect, the antenna 6 is formed by printing a conductor on the surface of the socket 4.

An eighth aspect of the present invention is characterized in that, in the sixth aspect, the antenna 6 is formed by providing a winding coil on the surface of the socket 4.

According to a ninth aspect of the present invention, in the second to eighth aspects, the socket 4 is formed by including the connecting portion 8 to which the semiconductor device 3 is connected and the antenna portion 9 in which the antenna 6 is provided. The antenna part 9 is formed to be freely bent with respect to the part 8.

According to a tenth aspect of the present invention, there is provided the first or fourth aspect.
, Wherein the antenna 6 is formed separately from the socket 4 and the antenna 6 is connected to the socket 4.

[0015] The invention of claim 11 is the invention of claims 1 to 1
At 0, a power supply terminal 11a connected to the power supply 10 is provided on the IC chip 2, a power supply connection terminal 12a connected to the power supply terminal 11a is provided on the socket 4, and the power supply 10 is connected to the power supply connection terminal 12a. It is characterized by comprising.

[0016]

Embodiments of the present invention will be described below.

FIG. 1 shows an embodiment of the present invention. In a semiconductor device 3, a memory chip 1 and an IC chip 2 are sealed in a package 16 and connected to the memory chip 1 and the IC chip 2. Plurality of terminals 11
Are provided so as to protrude from the package 16. Memory chip 1 is PROM, EPRO
M, an EEPROM, a ferroelectric memory, or other non-volatile memory.
Various programs and data for operating the PU are stored. The IC chip 2 includes a control unit, a modulation / demodulation unit,
Formed of an integrated circuit having a memory unit,
ID information is stored in the memory unit. The memory portion of this IC chip 2 is composed of PROM, EPROM, EEPROM
If it is formed of a nonvolatile memory such as M or ferroelectric memory, the memory contents can be stored without using a backup power supply for the memory contents. The memory chip 1 and the IC chip 2 are electrically connected independently to the terminals 11 by bump bonding, wire bonding bonding, pattern bonding, or the like. The terminal 11 is formed by a lead or a pin of a lead frame.

FIG. 2 shows an example of a semiconductor device 3 in which a memory chip 1 and an IC chip 2 are mounted on a COB (Chip O
n board 17, the COB is mounted on an alumina base 18, and terminals 11 formed from a lead frame are provided so as to protrude from the base 18, and the memory chip 1 and the IC chip 2 are mounted on the COB 17. Through terminal 1
1 with a bonding wire 19 and COB
A glass seal lid 20 is mounted on the base 18 so as to cover the bases of the terminals 17 and the terminals 11, and the memory chip 1 and the IC chip 2 are sealed in the package 16 composed of the base 18 and the lid 20. The semiconductor device 3 is assembled.

The socket 4 has a main body made of a resin molded product 7 and is formed by insert molding the resin molded product 7 with a plurality of connection terminals 12. The connection terminals 12 are provided in a number corresponding to the positions corresponding to the terminals 11 of the semiconductor device 3, and each connection terminal 12 protrudes downward from the cylindrical receiving portion 21 opened on the upper surface of the socket 4. The connection terminal 12 can be formed by, for example, a lead frame.
Then, insert molding is performed on the resin molded product 7 formed in a square frame shape, and 13.56 MHz or 1
An antenna 6 that resonates at a frequency such as 25 KHz is provided integrally. The antenna 6 can be formed as a loop antenna formed by winding a conductive wire 6b such as a copper wire in a loop coil shape as shown in FIG. It is connected to the antenna connection terminal 12c.

The socket 4 formed as described above is mounted and fixed on a substrate 23 formed of a printed wiring board. As shown in FIG. 1, a through hole 24 is provided in the board 23 corresponding to the connection terminal 12 of the socket 4. The insertion portion 22 of the connection terminal 12 is inserted into the through hole 24 and soldered, so that The substrate 2 is electrically connected to the circuit of FIG.
4, the socket 4 is mounted. The semiconductor device 3 is mounted on the upper surface of the socket 4 by inserting and connecting the terminal 11 of the semiconductor device 3 to the receiving portion 21 of the connection terminal 12 of the socket 4, and the semiconductor device 3 is connected to the substrate 23 via the socket 4. It can be implemented in Here, of the terminals 11 of the semiconductor device 3, the terminals 11 b connected to the memory chip 1
Of the connection terminals 12 of the semiconductor device 3 is electrically connected to the circuit of the substrate 23 via the connection terminals 12b of the socket 4 for the substrate. It is. Semiconductor device 3
The terminal 11c for the antenna connected to the IC chip 2 of the terminals 11 is connected to the connection terminal 12c for the antenna among the connection terminals 12 of the socket 4, and the IC chip 2 is connected via the connection terminal 12c for the antenna. The antenna 4 is connected to the antenna 6 provided on the socket 4.

By attaching the semiconductor device 3 to the socket 4 as described above, when the IC chip 2 of the semiconductor device 3 and the antenna 6 are connected, the ID information stored in the memory section of the IC chip 2 is transmitted to the antenna 6. And the transmitted ID information can be received and read by the scanner 5 formed as a reader / writer. This communication is performed according to the same principle as that of a non-contact IC card having no power supply. That is, the scanner 5 is called by an electromagnetic wave, and the electromagnetic wave forms an induced electromagnetic field. When the scanner 5 is brought close to the antenna 6 to such an extent that the antenna 6 is located in the induction electromagnetic field, an electromotive force is generated in the antenna 6 by electromagnetic induction. Using the electromotive force as a power source, the IC chip 2 receives and inputs the question data transmitted from the scanner 5 from the antenna 6, calls the ID information stored in the memory unit by the function of the control unit, and calls this ID information. The response information can be transmitted from the antenna 6, and the transmitted ID information can be received and read by the scanner 5.

The substrate 23 on which the semiconductor device 3 is mounted by the socket 4 as described above is used as it is or incorporated in a computer while being covered with the case 25. A CPU for controlling the operation of the computer is mounted on the board 23. The computer operates properly based on the programs and data stored in the memory chip 1 of the semiconductor device 3 so that the computer can operate properly. It has become.

Then, forgetting to remove the semiconductor device 3 in which the memory chip 1 of the suitable version is sealed from the substrate 23 and replace it with the semiconductor device 3 in which the new version of the memory chip 1 is sealed, to upgrade the version. However, it is difficult to judge from the appearance whether the semiconductor device 3 is suitable or not.

Therefore, in the present invention, the ID information stored in the IC chip 2 built in the semiconductor device 3 is transmitted from the antenna 6 as described above, and the transmitted ID information is as shown in FIG. By reading the information in a non-contact manner by the scanner 5 and collating the read ID information, it is possible to detect whether or not the semiconductor device 3 is suitable or incompatible, and to easily find it. That is, the ID information stored in the IC chip 2 is unique to the semiconductor device 3 equipped with the compatible memory chip 1, and the ID information read by the scanner 5 is unique to the semiconductor device 3. Thus, it can be confirmed that the regular memory chip 1 is stored. When the ID information read by the scanner 5 is not unique to the semiconductor device 3 or when the ID information cannot be received by the scanner 5, the semiconductor device 3 in which the appropriate memory chip 1 is sealed is Since there is no such device, it is possible to find out that the semiconductor device 3 has been replaced with an incompatible semiconductor device 3. The IC of the semiconductor device 3
In addition to ID information such as a serial number,
By writing various types of information, version management of programs and data of the memory chip 1 and maintenance management of the manufacturer, date of manufacture, and contact information of the semiconductor device 3 can also be performed.

FIG. 5 shows another example of the semiconductor device 3, in which the memory chip 1 is connected to the terminals 11b of the terminals 11.
When the IC chip 2 is connected to the remaining terminals 11 and the IC chip 2 is connected to the pair of power supply terminals 11a and the pair of antenna terminals 11c of the remaining terminals 11, is there. The terminal 11b of the semiconductor device 3 is inserted and connected to the receiving portion 21 of the board connection terminal 12b of the connection terminal 12 provided in the socket 4, and the power supply terminal 11a is connected to the power supply connection terminal 12a of the connection terminal 12. The antenna terminal 11c is inserted into the receiving portion 21 and is connected to the connection terminal 1.
2 is connected to the receiving portion 21 of the antenna connection terminal 12c. Terminal 12c for antenna
The antenna 6 is connected as described above, and the antenna 6 is connected to the IC chip 2 by connecting and attaching the semiconductor device 3 to the socket 4, but the power supply connection terminal 12a The power supply 10 is connected to the power supply 10. The power supply 10 is connected to the IC chip 2 by connecting and attaching the semiconductor device 3 to the socket 4 so that power can be supplied to the IC chip 2.

FIG. 6 shows various examples of the power supply 10. FIG. 6A shows a case where a battery 10a such as a paper battery or a button battery is provided as a power supply 10 on a substrate 23, and an electric wire 27 is provided.
Thus, the battery 10a is connected to the power supply connection terminal 12a of the socket 4. FIG. 6B shows the substrate 23
The backup battery 10b mounted on the top for memory backup is used as the power source
In this configuration, the backup battery 10b is connected to the power supply connection terminal 12a of the socket 4. FIG.
(C) is a power supply connector 10c for supplying power to the substrate 23.
Is used as the power supply 10, and the power supply connector 10 c is connected to the power supply connection terminal 12 a of the socket 4 by the circuit pattern 36 formed on the substrate 23. In this case, since the power supplied to the substrate 23 can be used as it is, there is no need to use a battery.
There is no worry about battery life.

As described above, by connecting the power supply 10 to the IC chip 2 of the semiconductor device 3, power can be supplied for driving the IC chip 2 and for communication from the antenna 6. As described above, when the ID information is communicated from the IC chip 2 by the electromotive force due to electromagnetic induction, the communication distance is short because the electromotive force is small, and the scanner 5 is connected to the antenna
Although communication is not possible unless the distance is short, the power can be supplied from the power source 10 in this manner, communication can be performed with large power, and the communication distance can be extended. This also enables the scanner 5 to receive and read the ID information.

When the antenna 6 is provided in the socket 4, the main body of the socket 4 is formed of the resin molded product 7 as described above, and the antenna 6 is inserted into the resin molded product 7. , So that the external appearance of the socket 4 cannot be distinguished from that conventionally used. If the antenna 6 is provided inside the socket 4 in this manner, the antenna 6 will not be disconnected during handling during manufacture or inspection, and the socket 4 will be easy to handle. It is.

When the antenna 6 is provided in the socket 4, the conductive wire 4a such as a copper wire or the like is arranged in a loop along the outer periphery of the socket 4 as shown in FIG. The antenna 6 can be formed such that the upper and lower directions of the socket 4 are in the communication direction (indicated by the arrow A), and communication can be performed in the upper and lower directions of the socket 4. Also, as shown in FIG. 7B, by providing a conductive wire 4a such as a copper wire on the side surface of the socket 4 in a loop shape, the side direction of the socket 4 corresponds to the communication direction (indicated by the arrow A). The antenna 6 can be formed, and communication can be performed in the side direction of the socket 4.

FIG. 8 shows another example of the embodiment of the present invention. In the embodiment of FIG. 1 and the like described above, the semiconductor device 3 and the socket 4 are formed to have the same planar outer shape and dimensions so that the semiconductor device 3 and the socket 4 are vertically aligned and overlap. In the embodiment of FIG. 8, the outer dimensions of the plane of the socket 4 are formed larger than the outer dimensions of the plane of the semiconductor device 3, and the outer periphery of the four circumferences of the socket 4 protrudes outside the semiconductor device 3. It is.
The antenna 6 is provided along the outer peripheral portion of the socket 4. As described above, the external dimensions of the socket 4 are
The size of the antenna 6 provided in the socket 4 can be increased by forming the outer dimensions of the antenna 4 larger than the external dimension of the socket 4. The area through which the magnetic field from the scanner 5 passes can be increased, and the communication distance can be extended. Can be done.

In the embodiment shown in FIG. 9, one side of the socket 4 is formed so as to protrude integrally from the semiconductor device 3 so that the external dimensions of the socket 4 are formed larger than the external dimensions of the semiconductor device 3. In addition, the antenna 6 is provided on the overhang portion 28 of the socket 4. By providing the antenna 6 on the projecting portion 28 of the socket 4 in this manner, the antenna 6 and the semiconductor device 3 can be prevented from overlapping in the communication direction of the antenna 6 (indicated by the arrow A).

In the embodiment shown in FIG. 10, a projecting portion 28 is integrally provided on one side of the socket 4 and a rising piece 29 is integrally provided vertically at the tip of the projecting portion 28, and the antenna 6 is attached to the rising piece 29. It is provided. By providing the antenna 6 on the rising piece 29 at the tip of the projecting portion 28 of the socket 4 in this manner, the antenna 6 and the semiconductor device 3 are prevented from overlapping in the communication direction of the antenna 6 (indicated by the arrow A). When covering the substrate 23 on which the semiconductor device 3 is mounted in the case 25, the antenna 6 can be arranged close to and parallel to the side surface of the case 25.
The communication by the scanner 5 can be easily performed from outside the scanner 5.

In the embodiments shown in FIGS. 9 and 10, the antenna 6 and the semiconductor device 3 are arranged so as not to overlap in the communication direction of the antenna 6 (indicated by the arrow A). By preventing the antenna 6 and the semiconductor device 3 from overlapping each other, it is possible to reduce the influence of the electromagnetic wave from the antenna 6 on the memory chip 1 and the IC chip 2 of the semiconductor device 3, and to malfunction the semiconductor device 3. Can be prevented.

In the embodiment shown in FIG. 11, the height of the overhang portion 28 on one side of the socket 4 is formed to be greater than the thickness of the semiconductor device 3 mounted on the upper surface of the socket 4, and the upper end of the overhang portion 28 A loop-shaped antenna 6 is provided. A magnetic body 30 such as ferrite is inserted into the overhang portion 28 so as to be arranged at the center of the loop-shaped antenna 6. In this device, the antenna 6 and the semiconductor device 3 can be prevented from overlapping in the communication direction of the antenna 6 (indicated by the arrow A), and the communication distance of the antenna 6 can be extended by the action of the magnetic body 30. Further, when covering the substrate 23 on which the semiconductor device 3 is mounted in the case 25, the antenna 6 provided on the upper surface of the overhanging portion 28 can be arranged close to and parallel to the upper surface of the case 25. The communication by the scanner 5 can be easily performed from outside.

In the embodiment shown in FIG. 12, the semiconductor device 3 can be mounted in the socket 4 by forming the socket 4 larger than the semiconductor device 3. 12 (a) and 12 (b), the socket 4 is formed in a U-shape with a downward opening in cross section to provide accommodation chambers 31 which are open on both sides, and project from the lower ends of both sides to the inside of the accommodation chamber 31. Flange pieces 32 are provided and connection terminals 12 are provided on each of the flange pieces 32, so that the semiconductor device 3 can be fitted into the housing chamber 31 and attached to the socket 4. And FIG.
In FIG. 12, the antenna 6 is provided on the upper surface of the socket 4, and in FIG. 12B, the antenna 6 is provided on the side surface of the socket 4. 12 (c) and 12 (d), the socket 4 is provided with a housing chamber 31 having an opening on the upper surface.
The connection terminal 12 is provided in the socket 4 at the bottom of the accommodation room 31, and the semiconductor device 3 can be fitted in the accommodation room 31 by being fitted in the accommodation room 31. In FIG. 12 (c), the antenna 6 is provided on the upper surface of the socket 4 so as to surround the housing chamber 31, and in FIG. 12 (d), the antenna 6 is provided on the side surface of the socket 4.

Next, in the embodiment of FIG. 13, the antenna 6 is provided on the surface of the socket 4. That is, in the example of FIG. 13A, the antenna 6 is formed by printing a conductor ink 6a such as a conductive paste on the side peripheral surface of the socket 4 in a coil pattern.
In the example of (b), the antenna 6 is formed by printing the conductor ink 6a on the upper surface (or the lower surface) of the socket 4 in a coil pattern along the outer periphery. In the example of FIG. 13C, the antenna 6 is formed by printing a conductor ink 6a on one side surface of the socket 4 in a coil pattern. In both cases, both ends of the antenna 6 are connected to the antenna connection terminal 12c of the connection terminals 12, and FIGS. 13 (a) and 13 (b)
13C, the upper and lower directions of the socket 4 correspond to the communication direction of the antenna 6 (indicated by an arrow A), and in FIG. 13C, the side direction of the socket 4 corresponds to the communication direction of the antenna 6 (indicated by an arrow A). . When a conductive paste composed of a conductive powder and a binder resin is used as the conductive ink 6a, it is preferable to use a silver paste from the viewpoint of good conductivity. By providing the antenna 6 on the surface of the socket 4 in this way, the existing socket 4 can be used as it is.
The system can be changed to a system having security only by replacing the semiconductor device 3 having the IC chip 2 storing the ID information.

In the embodiment shown in FIG. 14, the antenna 6 is provided on the surface of the socket 4 using a conductive wire 6b such as a copper wire.
Can be used as it is. That is, in the example of FIG. 14A, the antenna 6 is formed by a winding coil by winding a conductive wire 6b around the upper and lower surfaces and side surfaces of the end of the socket 4.
In the example of (b), the conductive wire 6b is wound around the entire periphery of the side surface of the socket 4 to form the antenna 6 with a winding coil. Both are conductive wires 6b
Are the connection terminals 12c for the antenna of the connection terminals 12.
The conductive wire 6 b can be fixed to the socket 4 by the adhesive 35. FIG.
4 (a), the side direction of the socket 4 is the antenna 6
14B, the upper and lower directions of the socket 4 are the communication directions of the antenna 6 (shown by an arrow A) in FIG. 14B.

FIG. 15 shows another example of the embodiment of the present invention. As shown in FIG. 15 (a), the socket 4 is connected to the connection section 8 and the antenna section 9, and the connection section 8 and the antenna section 9 are connected. Are formed integrally with the flat portion of the resin molded product 7 from the connecting portion 38 between the connecting portion 38 and the boundary between the connecting portion 8 and the connecting portion 38 and the boundary between the connecting portion 38 and the antenna portion 9 on one or both sides thereof. A bending groove 39 is provided. The connection section 8 is provided with a connection terminal 12, and the antenna section 9 is provided with a loop-shaped antenna 6. Both ends of the antenna 6 are connected to each other through the connection section 38. Connection terminal 12c. The antenna 6 can be formed inside or on the surface of the antenna unit 9.

In the socket 6 thus formed, the semiconductor device 3 can be mounted on the connecting portion 8 by inserting the terminal 11 into the receiving portion 21 of the connecting terminal 12 and connecting the terminal 11.
The socket 6 can be bent by the bending groove 39. As shown in FIG. 15B, the angle of the antenna section 9 with respect to the connection section 8 to which the semiconductor device 3 is attached can be changed. By adjusting the angle, the communication direction of the antenna 6 provided in the antenna unit 9 is changed to the scanner 5.
Can be set in a direction suitable for communication by the user. Further, by bending the antenna section 9 away from the connection section 8, the attachment and detachment of the semiconductor device 3 to and from the connection section 8 are facilitated, and the antenna section 9 is moved so that the antenna section 9 approaches a place where communication with the scanner 5 is desired. Can be bent.

In each of the above embodiments, the antenna 6 is provided integrally with the socket 4. However, in the embodiment shown in FIG. 16, the antenna 6 is formed separately from the socket 4, and both ends of the antenna 6 are connected. Connection terminal 12 of socket 4 with electric wire 37
Of the antennas is connected to the antenna connection terminal 12c. By forming the antenna 6 separately from the socket 4 in this manner, the antenna 6 can be kept away from the semiconductor device 3 attached to the socket 4.
It is possible to reduce the influence of the electromagnetic wave from the antenna 6 on the memory chip 1 and the IC chip 2 of the semiconductor device 3 and to prevent the semiconductor device 3 from malfunctioning. The antenna 6 can be provided on, for example, a substrate 23 on which the socket 4 is mounted.

In the embodiment shown in FIG. 17, when covering the substrate 23 on which the semiconductor device 3 is mounted in the case 25, the antenna 6 is provided on the upper surface of the case 25. Communication is facilitated.

[0042]

As described above, the electronic component according to the first aspect of the present invention is a semiconductor device formed by sealing a memory chip storing programs and data, and an IC chip storing ID information. The semiconductor device includes a socket connected thereto, and an antenna connected to the semiconductor device via the socket and communicating ID information stored in the IC chip with the scanner in a non-contact manner. The ID information transmitted from the antenna is read out by a scanner in a non-contact manner, and the read ID information is collated, whereby the version information of the program software stored in the semiconductor device can be easily confirmed. Can be easily and reliably confirmed. Further, it is possible to detect whether the semiconductor device is genuine or incompatible, and when the semiconductor device has been replaced with an incompatible one, it is possible to easily and surely confirm that fact. In addition, the antenna is connected to the semiconductor device via the socket, and there is no need to incorporate the antenna into the semiconductor device, so that the semiconductor device does not need to be formed in a large size and the semiconductor device can be manufactured at low cost. It is.

According to the second aspect of the present invention, since the antenna is provided in the socket, the antenna can be integrated with the socket, and the handling of the antenna is facilitated.

According to the third aspect of the present invention, since the outer dimensions of the socket are formed to be larger than the outer dimensions of the semiconductor device, the size of the antenna provided in the socket can be increased, and the communication distance can be increased. From this point, the ID information can be read by the scanner.

According to the fourth aspect of the present invention, since the antenna is provided at a position where the antenna and the semiconductor device do not overlap in the communication direction of the antenna, the electromagnetic wave from the antenna affects the memory chip and the IC chip of the semiconductor device. It is possible to prevent the semiconductor device from malfunctioning.

According to the fifth aspect of the present invention, since the antenna is provided inside the socket, it is possible to prevent the presence of the antenna from being known from the outside, and to read the ID information from the antenna in a non-contact manner. The system can prevent the user from noticing that the system is capable of determining the authenticity of the semiconductor device, and can enhance security.

According to the sixth aspect of the present invention, since the antenna is provided on the surface of the socket, the antenna can be provided by using the existing socket as it is. It is easy to change to a system that can read and determine the authenticity of the semiconductor device.

According to the seventh aspect of the present invention, since the antenna is formed by printing a conductor on the surface of the socket, the antenna can be easily formed by printing the conductor.

According to the invention of claim 8, the antenna is formed by providing a winding coil on the surface of the socket. Therefore, the antenna can be easily formed by winding a wire around the socket to form a winding coil. Is what you can do.

According to a ninth aspect of the present invention, the socket is provided with a connection portion to which the semiconductor device is connected and an antenna portion provided with an antenna, and the antenna portion is formed to be freely bent with respect to the connection portion. Therefore, the direction of communication of the antenna provided on the antenna unit can be set to a direction suitable for communication by the scanner by bending the antenna unit.

According to the tenth aspect of the present invention, since the antenna is formed separately from the socket and the antenna is connected to the socket, the antenna can be kept away from the semiconductor device attached to the socket. Electromagnetic waves are used for memory chips and ICs in semiconductor devices.
The influence on the chip can be reduced, and malfunction of the semiconductor device can be prevented.

According to an eleventh aspect of the present invention, the power supply terminal connected to the power supply is provided on the IC chip, the power supply connection terminal connected to the power supply terminal is provided on the socket, and the power supply is connected to the power supply connection terminal. Therefore, power for driving the IC chip and communication for the antenna can be supplied from the power supply to the IC chip of the semiconductor device, and the communication distance can be extended by this power.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an example of an embodiment of the present invention.

FIG. 2 is a cross-sectional view of an example of an embodiment of a semiconductor device of the present invention.

FIG. 3 is a perspective view of an example of an antenna provided in the socket of the present invention.

FIG. 4 is a perspective view showing an example of an embodiment of the present invention.

FIG. 5 is an exploded perspective view showing an example of the embodiment of the present invention.

FIG. 6 shows an example of an embodiment of the present invention,
(A), (b), (c) is a perspective view, respectively.

FIG. 7 illustrates an example of an embodiment of the present invention.
(A), (b) is a perspective view.

FIG. 8 is a perspective view showing an example of an embodiment of the present invention.

FIG. 9 is a perspective view showing an example of an embodiment of the present invention.

FIG. 10 is a perspective view showing an example of an embodiment of the present invention.

FIG. 11 is a perspective view showing an example of an embodiment of the present invention.

FIG. 12 shows an example of the embodiment of the present invention, and (a), (b), (c), and (d) are perspective views.

FIG. 13 shows an example of the embodiment of the present invention, and (a), (b), and (c) are perspective views.

14 shows an example of an embodiment of the present invention, and (a) and (b) are perspective views. FIG.

FIGS. 15A and 15B show an example of an embodiment of the present invention, wherein FIG. 15A is a perspective view and FIG. 15B is a front view.

FIG. 16 is a perspective view showing an example of an embodiment of the present invention.

FIG. 17 is a perspective view showing an example of an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Memory chip 2 IC chip 3 Semiconductor device 4 Socket 5 Scanner 6 Antenna 7 Resin molding 8 Connection part 9 Antenna part 10 Power supply 11 Terminal 12 Connection terminal part

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat ゛ (Reference)

Claims (11)

[Claims] 1. A semiconductor device formed by sealing a memory chip storing programs and data and an IC chip storing ID information, a socket to which the semiconductor device is connected, and a semiconductor device via the socket. Connected to I
An electronic component, comprising: an antenna for communicating ID information stored in a C chip with a scanner in a non-contact manner. 2. The electronic component according to claim 1, wherein the antenna is provided in the socket. 3. The electronic component according to claim 2, wherein the external dimensions of the socket are formed larger than the external dimensions of the semiconductor device. 4. The electronic component according to claim 1, wherein the antenna is provided at a position where the antenna and the semiconductor device do not overlap in a communication direction of the antenna. 5. The electronic component according to claim 2, wherein an antenna is provided inside the socket. 6. The electronic component according to claim 2, wherein an antenna is provided on a surface of the socket. 7. The electronic component according to claim 6, wherein the antenna is formed by printing a conductor on the surface of the socket. 8. The electronic component according to claim 6, wherein an antenna is formed by providing a winding coil on a surface of the socket. 9. A socket, comprising: a connection portion to which a semiconductor device is connected; and an antenna portion provided with an antenna, wherein the antenna portion is formed to be freely bent with respect to the connection portion. An electronic component according to any one of claims 2 to 8. 10. The electronic component according to claim 1, wherein the antenna is formed separately from the socket and the antenna is connected to the socket. 11. An IC chip comprising a power supply terminal connected to a power supply, a socket provided with a power supply connection terminal connected to the power supply terminal, and a power supply connected to the power supply connection terminal. The electronic component according to claim 1.