WO2006038446A1

WO2006038446A1 - Card with built-in antenna and portable information device

Info

Publication number: WO2006038446A1
Application number: PCT/JP2005/017021
Authority: WO
Inventors: Hikaru Ikeda; Hiroyuki Asakura; Yasumi Imagawa; Mitsuhiro Sato; Hidenori Suzuki
Original assignee: Matsushita Electric Industrial Co., Ltd.
Priority date: 2004-10-01
Filing date: 2005-09-15
Publication date: 2006-04-13
Also published as: JPWO2006038446A1

Abstract

On one plane of a wiring board (14), a semiconductor package component (12) encapsulating a semiconductor element (11) is mounted, and on the other plane of the wiring board (14), an antenna (15) is mounted. A magnetic force line passing part (13) for actively passing through a magnetic force line composed of a magnetic body is inserted into a space between the semiconductor package component (12) and the wiring board (14). Since this structure reduces influence of the semiconductor element (11) on the antenna (15), a card with the built-in antenna can be easily reduced in sizes.

Description

Specification

Antenna built-in card and portable information device

Technical field

TECHNICAL FIELD [0001] The present invention relates to a card with a built-in antenna and a portable information device, and more specifically, a small card with a built-in antenna that realizes short-range communication using radio typified by contactless communication, and the card with a built-in antenna. The present invention relates to a card socket with built-in antenna and a portable information device.

Background art

[0002] As a conventional card with a built-in antenna, there is a card in which a non-contact communication function is built in an IC card such as a credit card (see Patent Document 1). In addition, there was an antenna built in the socket (see Patent Document 2).

FIG. 25 is a diagram for explaining a conventional antenna built-in card described in Patent Document 1.

In FIG. 25, the conventional card with a built-in antenna 110 includes a predetermined number of base material forming sheets 112, 113, and 115 stacked after IC substrate loading portion forming holes 112b, 113b, and 115b are formed in advance, A communication antenna 114c is disposed between the forming sheets 112, 113, and 115 and exchanges data without contact with an external device. Then, the connection terminals 114d at both ends of the communication antenna 114c are formed by the antenna sheet 114 exposed from the IC substrate loading portion formation hole 115b and the IC substrate loading portion formation holes 112b, 113b and 115b. IC mounting board 216 loaded in loading section 120a

FIG. 26 is a diagram for explaining a conventional antenna built-in card described in Patent Document 2. As shown in FIG.

In FIG. 26, a conventional antenna built-in card 210 is connected to a semiconductor device 203 formed by sealing a memory chip 201 storing programs and data and an IC chip 202 storing information, and the semiconductor device 203. A socket 204 with a built-in antenna 206 is provided. In this configuration, the data is transmitted from the antenna 206 via the I blue telegram socket 204 stored in the IC chip 202. Information transmitted from the antenna 206 is read and collated by a scanner in a non-contact manner, so that the semiconductor device 203 is adapted. Whether or not a force is detected is detected. This antenna built-in card 210 is used as a means for inspecting a semiconductor chip.

Patent Document 1: Japanese Patent Laid-Open No. 2001-101372 (Page 6, Figure 1)

Patent Document 2: Japanese Patent Laid-Open No. 2001-127217 (Page 8, Figure 1)

Disclosure of the invention

Problems to be solved by the invention

[0005] However, in the configuration of the conventional card 110 with a built-in antenna, the antenna and the semiconductor are provided inside the card. The antenna and the semiconductor are arranged at different locations on the card. . In the configuration of the conventional card with built-in antenna 210, the antenna is provided on the socket side instead of the card side including the communication processing function. For this reason, these conventional cards with built-in antennas have a problem that it is impossible to simultaneously realize the communication function of a single card and the miniaturization of the card.

[0006] Therefore, an object of the present invention is to provide a card with a built-in antenna that has been miniaturized by devising the arrangement of antennas, and a portable information device using the card with a built-in antenna.

Means for solving the problem

[0007] The present invention is directed to a card with a built-in antenna and a portable information device using the card with a built-in antenna. In order to achieve the above object, the antenna built-in card of the present invention is provided on a semiconductor package component having a semiconductor element incorporated therein, a wiring substrate on which the semiconductor package component is mounted, a mounting surface of the wiring substrate, or an inside thereof. And at least part of a region sandwiched between the semiconductor element and the antenna, and a line of magnetic force lines made of a magnetic material.

[0008] In order to make this configuration effective, it is preferable that the area occupied by the conductor pattern is 25% or less of the area where the magnetic lines of force pass in the area where the magnetic lines of force of the wiring board pass. . In addition, as a structure of the antenna built-in card, the magnetic field line passing portion may be embedded in the semiconductor knockout component, or may be inserted into the gap sandwiched between the semiconductor package component and the wiring board. Okay, then embedded in the wiring board. The invention's effect

[0009] According to the present invention, the influence of the semiconductor element on the antenna can be reduced by providing the magnetic force line passing portion. As a result, even if the antenna and the semiconductor element are mounted in a direction perpendicular to the magnetic field lines, the antenna performance can be sufficiently exerted, so that the card containing the antenna can be easily downsized. .

Brief Description of Drawings

[0010] FIG. 1A is a structural perspective view of an antenna built-in card according to a first embodiment of the present invention.

FIG. 1B is a cross-sectional view of the structure of the antenna built-in card according to the first embodiment of the present invention.

[FIG. 2A] FIG. 2A is a diagram illustrating the flow of magnetic lines of force in a structure without the magnetic line passing section 13.

[FIG. 2B] FIG. 2B is a diagram for explaining the flow of magnetic lines of force in a structure having a magnetic line of passage 13

[FIG. 3] FIG. 3 is a diagram for explaining a case where magnetic lines of force are blocked by a conductor pattern.

[FIG. 4] FIG. 4 is a diagram for explaining a difference in characteristics due to a difference in area where magnetic field lines are blocked.

FIG. 5 is another structural cross-sectional view of the antenna built-in card according to the first embodiment in which the position of the antenna 15 is changed.

FIG. 6 is another structural cross-sectional view of the antenna built-in card according to the first embodiment in which the position of the antenna 15 is changed.

FIG. 7A is a structural perspective view of an antenna built-in card according to a second embodiment of the present invention.

FIG. 7B is a structural cross-sectional view of the antenna built-in card according to the second embodiment of the present invention.

FIG. 8 is another structural cross-sectional view of the antenna built-in card according to the second embodiment in which the position of the antenna 15 is changed.

FIG. 9 is a cross-sectional view of another structure of the antenna built-in card according to the second embodiment in which the position of the antenna 15 is changed. [10A] FIG. 10A is a structural perspective view of the antenna built-in card according to the third embodiment of the present invention.

[10B] FIG. 10B is a structural cross-sectional view of the antenna built-in card according to the third embodiment of the present invention.

FIG. 11 is a cross-sectional view of another structure of the antenna built-in card according to the third embodiment in which the position of the antenna 15 is changed.

FIG. 12 is another structural cross-sectional view of the antenna built-in card according to the third embodiment in which the position of the antenna 15 is changed.

FIG. 13 is a diagram for explaining an example of use of the antenna built-in card of the present invention.

[FIG. 14] FIG. 14 is a diagram for explaining an advanced method of using the antenna built-in card of the present invention.

FIG. 15A is a perspective view illustrating the structure of a card with a built-in antenna and a card socket according to a fourth embodiment of the present invention.

FIG. 15B is a plan view for explaining the structure of the antenna built-in card and the card socket according to the fourth embodiment of the present invention.

FIG. 16 is a diagram for explaining a mechanism in which a communication distance is extended by the second antenna 43.

[17A] FIG. 17A is a perspective view for explaining the structure of the card with a built-in antenna and the card socket according to the fifth embodiment of the present invention.

[17B] FIG. 17B is a plan view for explaining the structure of the antenna built-in card and the card socket according to the fifth embodiment of the present invention.

FIG. 18A is a perspective view illustrating the structure of a card with a built-in antenna and a card socket according to a sixth embodiment of the present invention.

FIG. 18B is a plan view for explaining the structure of the card with a built-in antenna and the card socket according to the sixth embodiment of the present invention.

FIG. 19 is a perspective view illustrating the structure of a card with a built-in antenna and a card socket according to a seventh embodiment of the present invention.

FIG. 20 shows a card with a built-in antenna and a card socket according to each embodiment of the present invention. It is a perspective view explaining the other structure applied.

FIG. 21 is a perspective view illustrating another structure to which the antenna built-in card and the card socket according to each embodiment of the present invention are applied.

FIG. 22 is a perspective view for explaining another structure to which the antenna built-in card and the card socket according to each embodiment of the present invention are applied.

FIG. 23 is a perspective view for explaining another structure to which the antenna built-in card and the card socket according to each embodiment of the present invention are applied.

FIG. 24 is a perspective view illustrating another structure to which the antenna built-in card and the card socket according to each embodiment of the present invention are applied.

FIG. 25 is a structural sectional view of a conventional antenna with a built-in antenna.

FIG. 26 is a structural perspective view of another conventional antenna with a built-in antenna.

Explanation of symbols

1-3, 104 Card with built-in antenna

11 Semiconductor elements

12, 22 Semiconductor package parts

12a, 51 I / O terminal

13, 23, 33 Magnetic field line passage

14, 34 Wiring board

14a node,

14b Magnetic field line passing region

15, 50, 102, 105, 702, 1002, 1405 Antenna

34a Conductor pattern

40 memory card

41 Mobile information devices

42, 101, 701 card socket

52 switches

103, 703, 1421 slots

307, 407 reactance element Convex part of 510, 610 card socket

704 cards

1220 Magnetic material

1404 card adapter

BEST MODE FOR CARRYING OUT THE INVENTION

[First Embodiment]

1A and 1B are a perspective view and a cross-sectional view illustrating the structure of a card with a built-in antenna according to the first embodiment of the present invention. 1A and 1B, the antenna built-in card 1 according to the first embodiment includes a semiconductor package component 12, a magnetic force line passage portion 13, a wiring board 14, and an antenna 15. In this antenna built-in card 1, the semiconductor package component 12 is mounted on one side of the wiring board 14, and the antenna 15 is mounted on the other side, and the magnetic force line passing portion 13 is inserted into the gap between the semiconductor knocking component 12 and the wiring board 14. It is a structure.

[0013] The semiconductor package component 12 is a package component in which the semiconductor element 11 is housed, and a flat package is typical as its shape. The semiconductor package component 12 is mounted by connecting its input / output terminal 12a to the pad 14a on the wiring board 14. In this example, there is one semiconductor package component 12 mounted on the wiring board 14, but a plurality of semiconductor package components 12 may be mounted. Also, the number of semiconductor elements 11 housed in the semiconductor package component 12 may be two or more. As long as the semiconductor substrate 12 and the antenna 15 can be mounted on the wiring substrate 14, it does not matter whether the structure is a single layer or a multilayer. The antenna 15 is a wireless communication antenna that is electrically connected to the semiconductor element 11, and is mounted on the surface opposite to the surface of the wiring board 14 on which the semiconductor package component 12 is mounted. The magnetic force line passage portion 13 is a substance that actively passes magnetic force lines composed of a magnetic material, and may be attached to the wiring board 14 in a sheet shape, or may be applied to the wiring board 14 by vapor deposition. Also good. The first embodiment is characterized in that the magnetic force line passing portion 13 is provided in at least a part of a region sandwiched between the semiconductor element 11 and the antenna 15. By providing the magnetic force line passage portion 13 as described above, the following effects can be obtained. [0014] FIG. 2A is a diagram for explaining the flow of magnetic lines of force in a structure without the magnetic field line passing portion 13, and FIG. It is a figure explaining a flow.

In FIG. 2A, since the antenna 15 is simply provided under the semiconductor element 11 via the wiring substrate 14, the magnetic field lines are reflected by the semiconductor element 11 that can be regarded as a metal plate, and the magnetic field lines pass through the antenna 15. Disappear. For this reason, the performance of the antenna cannot be exhibited. On the other hand, in FIG. 2B, since the magnetic force line passing portion 13 is provided between the semiconductor element 11 and the antenna 15, the magnetic force lines can pass through the antenna 15 by passing through the magnetic force line passing portion 13. Therefore, the antenna performance without being affected by the semiconductor element 11 can be fully exhibited.

[0015] For the same reason, a conductor pattern such as a wiring pattern and a ground pattern existing on the wiring board 14 can also be regarded as a metal plate that reflects the lines of magnetic force. Therefore, it is desirable to minimize this conductor pattern in the region 14b (see FIG. 1A) through which the magnetic lines of force of the wiring board 14 pass. For verification purposes, insert metal plate B between the magnetic field line passing part 13 and antenna 15 of the structure of the card with a built-in antenna 1 while changing the occupied area d, and the maximum distance ratio that can communicate with the antenna A An experiment was conducted to measure the change in the (Fig. 3). As a result of this experiment, it was confirmed that sufficient performance can be achieved if the area (dZD) force occupied by the conductor pattern is 25% or less of the area 14b through which the magnetic field lines of the wiring board 14 pass (Fig. 4).

According to the antenna built-in card 1 according to the first embodiment, the influence of the semiconductor element 11 on the antenna 15 can be reduced by providing the line of magnetic force passage 13. As a result, even if the antenna 15 and the semiconductor element 11 are mounted in a direction perpendicular to the magnetic field lines, the performance of the antenna 15 can be fully exerted, so the card with a built-in antenna can be easily downsized. can do.

In the first embodiment, the case where the antenna 15 is mounted on the surface opposite to the surface of the wiring board 14 on which the semiconductor package component 12 is mounted has been described. However, this structure is an example, and if the magnetic force line passage portion 13 is provided in at least a part of the region sandwiched between the semiconductor element 11 and the antenna 15, the antenna 15 is connected to the wiring board as shown in FIG. 14 may be mounted on the same surface, and the antenna 15 is placed inside the wiring board 14 as shown in FIG. It may be embedded.

[Second Embodiment]

7A and 7B are a perspective view and a cross-sectional view illustrating the structure of the antenna built-in card according to the second embodiment of the present invention. 7A and 7B, the antenna built-in card 2 according to the second embodiment includes a semiconductor package component 22, a wiring board 14, and an antenna 15. This antenna built-in card 2 has a structure in which a semiconductor package component 22 is mounted on one surface of a wiring board 14 and an antenna 15 is mounted on the other surface.

The semiconductor package component 22 is a package component in which a magnetic force line passing portion 23 and a semiconductor element 11 are arranged in this order so as to face the mounting surface of the wiring board 14, and examples of the shape include a flat package and a chip size package. The semiconductor package component 22 is mounted by connecting its input / output terminal 12 a to the node 14 a on the wiring board 14. In this example, only one semiconductor package component 22 is mounted on the wiring board 14, but a plurality of semiconductor package components 22 may be mounted. Also, the number of semiconductor elements 11 incorporated in the semiconductor package component 22 may be two or more. The wiring board 14 and the antenna 15 are as described in the first embodiment. The magnetic force line passing portion 23 is a substance that actively passes the magnetic force lines formed of a magnetic material, and is embedded in the semiconductor package component 22. In addition to embedding the magnetic force line passing portion 23 in the semiconductor package component 22, it may be affixed in the form of a sheet, or may be applied by vapor deposition. The second embodiment is characterized in that the magnetic force line passing portion 23 is provided in at least a part of a region sandwiched between the semiconductor element 11 and the antenna 15. The effect obtained by providing the magnetic force line passing portion 23 is as described in the first embodiment.

[0020] According to the antenna built-in card 2 according to the second embodiment, the influence of the semiconductor element 11 on the antenna 15 can be reduced by providing the magnetic force line passing portion 23. As a result, even if the antenna 15 and the semiconductor element 11 are mounted in a direction perpendicular to the magnetic field lines, the performance of the antenna 15 can be fully exerted, so the card with a built-in antenna can be easily downsized. can do. Further, since the magnetic force line passing portion 23 is embedded in the semiconductor package component 22, further miniaturization and low cost can be expected.

In the second embodiment, the antenna 15 is mounted on the semiconductor package component 22. The case where it is mounted on the surface opposite to the surface of the printed wiring board 14 has been described. However, this structure is an example. For example, the antenna 15 may be mounted on the same surface of the wiring board 14 as shown in FIG. 8 (however, it is difficult with a chip size package), or the antenna as shown in FIG. 15 may be embedded in the wiring board 14.

[Third Embodiment]

10A and 10B are a perspective view and a cross-sectional view illustrating the structure of the antenna built-in card according to the third embodiment of the present invention. 10A and 10B, the antenna built-in card 3 according to the third embodiment includes a semiconductor package component 12, a wiring board 34, and an antenna 15. The antenna built-in card 3 has a structure in which the semiconductor package component 12 is mounted on one surface of the wiring board 34 and the antenna 15 is mounted on the other surface.

The semiconductor package component 12 and the antenna 15 are as described in the first embodiment. The magnetic force line passing portion 33 is a substance that actively passes the magnetic force lines that also constitute magnetic force, and is embedded in the wiring board 34. As long as the semiconductor package component 12 and the antenna 15 can be mounted on different surfaces, the wiring board 34 may have a single layer structure or a multilayer structure. The third embodiment is characterized in that the magnetic force line passing portion 33 is provided in at least a part of a region sandwiched between the semiconductor element 11 and the antenna 15. The effect obtained by providing the magnetic force line passage portion 33 is the same as described in the first embodiment.

[0024] According to the antenna built-in card 3 according to the third embodiment, the influence of the semiconductor element 11 on the antenna 15 can be reduced by providing the magnetic force line passing portion 33. As a result, even if the antenna 15 and the semiconductor element 11 are mounted in a direction perpendicular to the magnetic field lines, the performance of the antenna 15 can be fully exerted, so the card with a built-in antenna can be easily downsized. can do. Further, since the magnetic field line passing portion 33 is embedded in the wiring board 34, it can be easily realized by changing only part of the board manufacturing process, and further miniaturization and cost reduction can be expected.

In the third embodiment, the case where the antenna 15 is mounted on the surface opposite to the surface of the wiring board 34 on which the semiconductor package component 12 is mounted has been described. However, this structure is only an example, and a region where the magnetic field line passing portion 33 is sandwiched between the semiconductor element 11 and the antenna 15. For example, the antenna 15 may be embedded in the wiring board 34 as shown in FIG. In addition, as shown in FIG. 12, a conductor pattern 34a may be provided inside the wiring board 34 between the magnetic force line passing portion 33 and the semiconductor element 11. If this structure is used, the magnetic line force passes through the antenna 15 by the conductor pattern 34a, so that the wiring design on the wiring board 34 is free.

[0026] As a typical use example of the antenna built-in cards 1 to 3 described in the first to third embodiments, a memory card 40 represented by an SD card (registered trademark) or the like can be considered (FIG. 13). ). The memory card 40 is inserted into the card socket 42 provided in the portable information device 41 (mobile phone, digital camera, ETC terminal, AV device, etc.), so that the antenna built-in cards 1 to 3 are inserted. The provided function is introduced into the portable information device 41. By introducing the mobile information device 41 in this form to the mobile information device 41, it is not necessary to mount an antenna for wireless communication on the mobile information device 41, so that the mobile information device 41 can be easily designed and reduced in cost. Can do.

Depending on the portable information device 41, there may be a case where the antenna 15 inside the cards with built-in antennas 1 to 3 cannot be used. For example, there is a problem in the positional relationship of the card socket 42. Therefore, in this case, the input force terminal 51 to which the external antenna 50 can be connected and the switch 52 for switching between the internal antenna 15 and the external antenna 50 are newly provided in the antenna built-in force nodes 1 to 3, and When the memory card 40 is inserted into the portable information device 41 to be used, the external antenna 50 provided on the portable information device 41 side should be made available (FIG. 14).

[Embodiment 4]

In the antenna built-in cards 1 to 3 described in the first to third embodiments described above, the size of the built-in antenna is limited by the card size, so that the communication distance that can be secured is limited. Therefore, in the fourth and subsequent embodiments, an example will be described in which the communication distance that can be secured is extended by further using another antenna that induces a magnetic field in addition to the antenna built in the card. In particular, in the present invention, other antennas are incorporated in sockets (for example, corresponding to the card socket 42 in FIG. 13) into which the antenna built-in cards 1 to 3 are inserted. Make it easy to design. FIG. 15A and FIG. 15B are a perspective view and a plan view for explaining the structures of the antenna built-in card and the force socket according to the fourth embodiment of the present invention. In FIG. 15A, the antenna built-in card 104 is the antenna built-in card 1 to 3 described in the first to third embodiments, in which the first antenna 105 for wireless communication is built. The card socket 101 is a socket component that inserts the antenna built-in card 104 into the slot 103, and includes a second antenna 102 for wireless communication and a reactance element 307 for tuning the second antenna 102 to the communication frequency. To do. A typical second antenna 102 is composed of a single wire wound in a coil.

[0030] The first antenna 105 and the second antenna 102 are in the state shown in FIG. 15B in the horizontal position relative to the direction of the antenna line when the antenna built-in card 104 is inserted into the card socket 101. It is preferable to become. That is, the positional relationship is such that the first antenna 105 is arranged horizontally without overlapping the second antenna 102. With such a positional relationship, the effect of the second antenna 102 can be maximized. Note that there is no particular limitation on the positional relationship between the first antenna 105 and the second antenna 102 in the vertical direction with respect to the direction of the antenna line.

Next, the reason why the communication distance is extended by the structure of the antenna built-in card and the card socket according to the fourth embodiment will be described with further reference to FIG. FIG. 16 is a diagram for explaining a mechanism by which the communication distance is extended by the second antenna 102.

In the vicinity of the feeding antenna in the transmission part of wireless communication, the magnetic field strength becomes weaker as the feeding antenna force with the strongest magnetic field strength is further away. Here, if the second antenna 102 that is tuned to the communication frequency without power supply is installed in a place where the magnetic field strength is weak, an electromotive force is generated in the second antenna 102, and a new magnetic field is generated by the electromotive force. Therefore, as shown in FIG. 16, the strength of the magnetic field near the second antenna 102 is stronger than when the second antenna 102 is not present, and the first antenna 105 is placed in this strong magnetic field. The installation increases the communication distance because the magnetic field strength is strong even though the distance from the feeding antenna is long. In addition, since the reversibility holds even in the case of transmission, the reach distance is extended as in the case of reception.

[0032] According to the antenna built-in card and the card socket according to the fourth embodiment, the second By incorporating the antenna 102 in the card socket 101, it is not necessary to mount the second antenna 102 on the portable information device side when a card having a communication function is mounted on the portable information device. This facilitates the design of portable information devices and reduces the number of components by IJ.

[Fifth Embodiment]

FIG. 17A and FIG. 17B are a perspective view and a plan view for explaining the structures of the antenna built-in card and the force-feed socket according to the fifth embodiment of the present invention. In FIG. 17A, a card with a built-in antenna 104 is the card with built-in antenna 1 to 3 described in the first to third embodiments in which the first antenna 105 for wireless communication is built. The card socket 101 is a socket component that inserts the antenna built-in card 104 into the slot 103, and includes a second antenna 102 for wireless communication and a reactance element 307 for tuning the second antenna 102 to the communication frequency. To do.

[0034] The shape of the card socket 101 of the fifth embodiment is different from that of the fourth embodiment, and the upper part of the slot 103, that is, the side on which the second antenna 102 is mounted is convex in the card insertion direction 510. Sticks out. With this shape, even when the antenna built-in card 104 is inserted into the slot 103, a part of the antenna built-in card 104 is exposed outside the slot 103.

[0035] According to the card with a built-in antenna and the card socket according to the fifth embodiment, as shown in FIG. 17B, the first antenna 105 is horizontally arranged without overlapping the inside of the second antenna 102. The antenna built-in card 104 can be easily removed by using the exposed portion while maintaining the positional relationship.

[Sixth Embodiment]

18A and 18B are a perspective view and a plan view for explaining the structures of the antenna built-in card and the force-feed socket according to the sixth embodiment of the present invention. In FIG. 18A, the antenna built-in card 104 is the antenna built-in cards 1 to 3 described in the first to third embodiments, in which the first antenna 105 for wireless communication is built. The card socket 101 is a socket component for inserting the antenna built-in card 104 into the slot 103, and a reactance element for tuning the second antenna 102 and the second antenna 102 for wireless communication to the communication frequency. Built-in child 307.

The shape of the card socket 101 of the sixth embodiment is different from that of the fifth embodiment, and a part of the upper portion of the slot 103 protruding to the convex shape 610 is concave. The concave portion 611 is a cut-out portion where a finger is applied for insertion or extraction of the antenna built-in card 104. With this shape, even if the antenna built-in card 104 is inserted into the slot 103, a part of the antenna built-in card 104 is exposed outside the slot 103.

[0038] According to the card with a built-in antenna and the card socket according to the sixth embodiment, a part of the first antenna 105 overlaps the inside of the second antenna 102 as shown in FIG. 18B. Thus, the antenna built-in card 104 can be more easily removed by using the exposed portion while effectively drawing out the effect of the second antenna 102 by the structure in which the overlapping portion is minimized.

[Seventh Embodiment]

FIG. 19 is a perspective view for explaining the structure of a card with a built-in antenna and a card socket according to the seventh embodiment of the present invention. In FIG. 19, the antenna built-in card 104 is the antenna built-in card 1 to 3 described in the first to third embodiments, in which the first antenna 105 for wireless communication is built. The card socket 101 is a socket part for inserting the antenna built-in card 104 into the slot 103, and has a built-in reactance element 307 for tuning the second antenna 102 and the second antenna 102 for wireless communication to the communication frequency. To do. The card socket 101 has a magnetic material 1220 attached to each of three side surfaces (surfaces parallel to the magnetic field generation direction) other than the surface of the slot 103.

[0040] According to the card with a built-in antenna and the card socket according to the seventh embodiment, even if a metal part is disposed in the vicinity of the card socket 101, it is built into the card socket 101 due to the effect of the magnetic material 1220. It is possible to suppress the influence received by the second antenna 102.

[0041] The structures described in the fourth to seventh embodiments are merely examples, and can be modified as appropriate as follows.

(1) The reactance element 407 is mounted on the board side of the portable information device, and the card socket 101 and the reactance element 407 are connected via terminals 408 and 409 (see FIG. 20). This In this way, since the reactance element 407 can be adjusted freely, it is possible to cope with a shift in the tuning frequency of the second antenna 102 caused by the mounting state of the card socket 101 in the portable information device.

[0042] (2) The antenna built-in card 104 is designed so that the first antenna 105 is arranged on the contact terminal 206 side (see FIG. 21). If designed in this way, a component area such as a semiconductor mounted on the antenna built-in card 104 can be widened as compared with the case where the first antenna 105 is provided on the back surface of the contact terminal 206.

(3) The second antenna 1002 built in the card socket 101 is configured by arranging two or more coils wound in parallel (see FIG. 22; FIG. 22 shows three antennas Examples using 1002a-c are shown). By winding a plurality of wires in parallel in this way, the surface area per unit length of the antenna increases and the Q value of the antenna can be increased. Therefore, the effect of the second antenna 1002 can be maximized.

(4) When the card 704 inserted into the card socket 701 is provided with only an integrated circuit (IC) 708 having a communication function without incorporating an antenna, the integrated circuit 708 having a communication function is provided. And card socket 701 are connected via contact terminals 706, 707, 709 and 710 to perform wireless communication (see FIG. 23). In this case, it may be considered that the card 704 having only the integrated circuit 708 having the communication function is inserted into the card adapter 1404 having the third antenna 1405 and the force is inserted into the card socket 101. (See Figure 24). The above modifications (1) to (4) can be used in any combination. Industrial applicability

[0045] The present invention can be used for an antenna built-in card for short-distance communication using radio typified by non-contact communication, and is particularly useful when the antenna built-in card is desired to be miniaturized.

Claims

The scope of the claims

[1] A card with a built-in antenna,

A semiconductor package part in which a semiconductor element is embedded;

A wiring board for mounting the semiconductor package component;

An antenna provided on the mounting surface or inside of the wiring board;

A card with a built-in antenna, comprising: a magnetic line of force passage portion having a magnetic force provided in at least a part of a region sandwiched between the semiconductor element and the antenna.

[2] The antenna built-in card according to [1], wherein the magnetic field line passing portion is embedded in the semiconductor package component.

[3] The antenna built-in card according to [1], wherein the line of magnetic force passage is inserted into a space sandwiched between the semiconductor package component and the wiring board.

[4] The antenna built-in card according to claim 1, wherein the magnetic field line passing portion is embedded in the wiring board.

5. The antenna built-in card according to claim 1, wherein a region occupied by the conductor pattern is 25% or less of a region through which the magnetic lines of force pass in a region through which the magnetic lines of force of the wiring board pass.

6. The antenna built-in card according to claim 2, wherein a region occupied by the conductor pattern is 25% or less of a region through which the magnetic lines of force pass in a region through which the magnetic lines of force of the wiring board pass.

7. The antenna built-in card according to claim 3, wherein a region occupied by the conductor pattern is 25% or less of a region through which the magnetic lines of force pass in a region through which the magnetic lines of force of the wiring board pass.

8. The antenna built-in card according to claim 4, wherein a region occupied by the conductor pattern is 25% or less of a region through which the magnetic lines of force pass in a region through which the magnetic lines of force of the wiring board pass.

[9] A portable information device using the antenna built-in card according to claim 1.