JP2001125508A - Method of producing electro-optic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of producing an electro-optical device by which electrolytic corrosion of wires on an extended part of a substrate can be completely prevented. SOLUTION: The electro-optic device 1 produced by this method is equipped with a pair of substrates 4a, 4b laminated by a sealing material 7, each substrate having an extended part 4c, 4d where wires 15a, 15b are formed, respectively. The method includes a process of sticking polarizing plates 6a, 6b to the surfaces of the substrates 4a, 4b, and a process of applying silicon molds 29a, 29b to cover the wires 15a, 15b on the surfaces of the extended parts 4c, 4d, respectively. The process of applying the silicon molds 29a, 29b is carried out prior to the sticking process of polarizing plates. Thereby, contaminant is prevented from remaining on the wires 15a, 15b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method for manufacturing an electro-optical device having a pair of substrates arranged to face each other.

[0002]

2. Description of the Related Art A liquid crystal device as an example of an electro-optical device generally includes a liquid crystal panel having a structure in which liquid crystal is sealed between a pair of substrates, a lighting device such as a backlight, and ancillary equipment such as a liquid crystal driving IC. It is formed by attaching. In general, a liquid crystal panel is configured such that a first substrate on which a first electrode is formed and a second substrate on which a second electrode is formed are bonded to each other with a sealant, and a gap formed between the substrates, a so-called cell It is formed by enclosing liquid crystal in the gap.

As a method for attaching a liquid crystal driving IC or the like to a liquid crystal panel, a substrate overhanging portion is formed on one or both of a pair of substrates constituting the liquid crystal panel so as to protrude outside a counterpart substrate. First and second electrodes inside the panel
Generally, a wiring connected to the electrode is formed on the surface of the overhang portion of the substrate, and a liquid crystal driving IC is connected to the wiring.

As a method of connecting such a liquid crystal driving IC, a COG (Chip On Glass) method, a C
OB (Chip On Board) method, COF (Chip On FPC (Fl
Various methods such as an exible printed circuit)) method are known.

The COG method is a mounting method in which a liquid crystal driving IC is directly connected to, ie, mounted on, the surface of a substrate overhang. The COB method is a mounting method in which a liquid crystal driving IC is mounted on a non-flexible substrate such as a glass epoxy substrate, and the non-flexible substrate is connected to a substrate overhang portion by an external substrate such as a heat seal. is there.

[0006] The COF method is an FPC (Flexible Printed).
Circuit), that is, a mounting method in which a liquid crystal driving IC is mounted on a flexible substrate, and the FPC is connected to a substrate overhang. For example, TAB (Tape Automated bondin
g: Automated tape mounting) technology on FPC using technology
TCP (Tape) formed by mounting a chip
Carrier Package) is considered as an example of the COF method.

With respect to the electro-optical device having the substrate overhang as described above, it is necessary to prevent the occurrence of electrolytic corrosion, that is, corrosion, on the wiring formed on the surface of the substrate overhang. , A protective agent such as a silicone mold adheres to the surface of the substrate overhang,
For example, measures have been taken to coat the wiring by coating. In addition, the electrolytic corrosion means that the wiring is corroded and worn by an abnormal current flowing through the wiring.For example, the wiring is energized in a state where the wiring is dirty, or the wiring is exposed to the outside air. This occurs due to the fact that power is supplied while the power is on.

[0008]

However, conventionally,
Even when the wiring on the substrate overhang is covered with the protective agent as described above, the electrolytic corrosion of the wiring cannot be completely prevented. According to experiments performed by the inventor, the following is considered to be a major cause for this.

That is, various optical members such as a polarizing plate, a retardation plate, and a light diffusing plate are attached to, for example, adhered to a panel structure in which liquid crystal is sandwiched between a pair of substrates, that is, a liquid crystal panel. Then, during the mounting operation, dirt easily adheres to the surface of the substrate overhang portion. In particular, when the optical member is mounted on the liquid crystal panel, the surface of the liquid crystal panel is often wiped and cleaned with a cleaning liquid. However, during the cleaning operation, dirt may remain on the surface of the substrate overhang.

[0010] In particular, the structure shown in FIG. 8, that is, the extending portion 54 in which the substrate 54 b on the other side of the substrate 54 a having the substrate extending portion 54 c projects outside the sealing material 57.
e, when the surface of the liquid crystal panel 50 is cleaned by wiping with a cleaning liquid, dirt and solvent of the cleaning liquid are transferred to the concave portion 52 surrounded by the substrate overhang portion 54c, the sealing material 57, and the extension portion 54e. It easily penetrates and remains there, and in this state, the substrate overhang 54c
When the protective agent is supplied to the surface of the electrode 55, dirt tends to remain on the electrode 55 existing in the concave portion 52.

As described above, in the conventional method of manufacturing an electro-optical device, the process of attaching a protective agent to the surface of the substrate overhang to prevent electrolytic corrosion involves applying an optical member such as a polarizing plate to a panel of the electro-optical device. I went after wearing it. in this case,
When attaching an optical member to the panel of the electro-optical device,
As described above, dirt easily adheres to the surface of the substrate overhang, and if a protective agent is subsequently applied onto the substrate overhang, dirt remains on the substrate overhang, which may cause electrolytic corrosion. It is considered to be a major cause.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a method of manufacturing an electro-optical device capable of almost completely preventing electrolytic corrosion of wiring on a substrate overhang. I do.

[0013]

(1) In order to achieve the above object, a method of manufacturing an electro-optical device according to the present invention comprises:
Manufacturing an electro-optical device including a pair of substrates bonded to each other, at least one of the substrates having a substrate overhanging portion overhanging to the outside of a counterpart substrate, and wiring being formed on a surface of the substrate overhanging portion. An optical member mounting step of mounting an optical member on at least one surface of the pair of substrates, and a protective agent attaching step of providing a protective agent on the surface of the substrate overhang to cover the wiring. And the protective agent attaching step is performed before the optical member attaching step.

The above-mentioned optical members are various elements mounted on a panel structure in which a liquid crystal is sandwiched between a pair of substrates, and examples thereof include a polarizing plate, a retardation plate, and a light diffusion plate. When these elements are mounted on the surface of the substrate, the surface of the substrate overhang is likely to get dirty.
In the present invention, the protective agent attaching step has already been performed at the time of this optical member mounting step, and the wiring on the substrate overhang is covered with the protective agent.

Therefore, even if an optical member such as a polarizing plate is attached to the substrate of the panel of the electro-optical device, even if dirt adheres to the overhang portion of the substrate, the dirt is directly applied to the wiring due to the presence of the protective agent. Therefore, the occurrence of electrolytic corrosion in the wiring can be almost completely prevented.

(2) In the method of manufacturing an electro-optical device according to the above (1), the optical member mounting step may include a cleaning process of cleaning a surface on which the optical member is mounted. Such a cleaning process is performed, for example, by wiping and cleaning the surface using a cleaning solution containing a solvent.

In such a cleaning process, the dirt contained in the solvent tends to remain on the surface of the substrate overhang portion.
If the optical member mounting step including such a cleaning process is performed after the protective agent attaching step according to the present invention, it is possible to reliably prevent dirt from directly touching the wiring on the substrate overhang.

(3) In the method of manufacturing an electro-optical device according to the above mode (1) or (2), it is preferable that a cleaning step of cleaning a surface of the substrate overhang is provided before the protective agent attaching step. . This makes it possible to remove dirt from the surface of the substrate overhang before attaching the protective agent.

(4) In the method of manufacturing an electro-optical device according to the above (3), the cleaning step is performed by immersing the surface of the substrate overhang portion in a cleaning tank storing a cleaning liquid, preferably an ultrasonic cleaning tank. It is desirable that this be done.
Although the cleaning step is not limited to such a specific processing method, if the immersion method as described above is adopted, dirt can be efficiently removed from the surface of the substrate overhang before the protective agent is applied. .

(5) In the method of manufacturing an electro-optical device according to the above (4), pure water can be used as the cleaning liquid. As the cleaning liquid, it is also possible to use a solvent having various properties other than the above, for example, a solvent having a property capable of decomposing an adhesive substance that adheres dirt to the surface of the substrate overhang portion. However, when pure water is used as the cleaning liquid, the operation can be performed without polluting the environment while ensuring sufficient cleaning performance for practical use.

(6) The method for manufacturing an electro-optical device according to the above item (1) or (2), that is, a method for manufacturing an electro-optical device that does not require a cleaning step prior to a step of attaching a protective agent, is a substrate. An external substrate mounting step of connecting an external substrate to the overhang and / or an IC mounting step of mounting an IC chip on the substrate overhang can be performed before the protective agent attaching step.

Here, the external substrate is a flexible wiring substrate which is formed by coating a resin for thermocompression bonding on a polymer film on which a pattern wiring is appropriately formed, and has an electrical and mechanical connection function. And a TCP formed by mounting an IC chip on an FPC (Flexible Printed Circuit) using TAB technology.

As described above, before the protective agent for preventing electrolytic corrosion is attached to the overhang portion of the substrate of the panel of the electro-optical device,
If an external substrate such as TCP is connected in advance to the substrate overhang portion, there is no fear that the protective agent will be erroneously attached to the region where the external substrate is connected in the subsequent attaching operation of the protective agent. , Work can be performed easily.

(7) The method of manufacturing the electro-optical device according to the above item (3), (4) or (5), that is, the electro-optic device which comprises a cleaning step prior to the step of attaching the protective agent. Regarding the method of manufacturing the device, an external substrate mounting step of connecting an external substrate to the substrate overhang and / or an IC mounting step of mounting an IC chip on the substrate overhang can be performed before the cleaning step.

As described above, before the cleaning step is performed, that is, before the protective agent for preventing electrolytic corrosion is attached to the substrate overhang portion of the panel of the electro-optical device, the substrate overhang portion such as TCP is applied to the substrate overhang portion. If you connect the board in advance,
Since there is no need to worry that the protective agent is erroneously attached to the region where the external substrate is connected in the subsequent attaching operation of the protective agent, the operation can be easily performed. Further, after the external substrate is connected to the substrate overhanging portion, a cleaning step is further performed, and then the protective agent is attached to the substrate overhanging portion, so that the contamination can be reliably prevented from remaining.

(8) Depending on the type of the electro-optical device,
As shown in FIG. 2 (a), the opposing substrate 4b facing the substrate 4a having the substrate overhang 4c may have an extension 4e extending outside the sealing material 7 for bonding the substrates together. For such a liquid crystal device, the protective agent 2
9a is an extension 4e, a substrate overhang 4c and a sealing material 7
It is desirable to fill also the recess 32a surrounded by.

[0027]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for manufacturing an electro-optical device according to the present invention will be described using a liquid crystal device as an example of the electro-optical device.

First, prior to describing a method of manufacturing a liquid crystal device according to the present invention, a liquid crystal device manufactured using the method will be described.

FIG. 1 shows an embodiment of the liquid crystal device. The liquid crystal device 1 shown here is formed by connecting, that is, mounting a liquid crystal driving IC 3a and a TCP 5 as an external substrate to a liquid crystal panel 2. In addition, on one surface of the liquid crystal panel 2, an illuminating device such as a backlight, a light reflecting plate (neither is shown), or the like is provided as necessary.

The liquid crystal panel 2 has a pair of substrates 4a and 4b facing each other, and these substrates are adhered to each other by a sealing material 7. These substrates 4
a and 4b are manufactured by forming electrodes and other necessary elements on a substrate material formed of a hard light-transmitting material such as glass or a flexible light-transmitting material such as plastic. .

In FIG. 2A, for example, a first electrode 9 acting as a common electrode is provided on the liquid crystal side surface of the substrate material 8a of the first substrate 4a, that is, the surface facing the second substrate 4b.
is formed in a predetermined pattern, an overcoat layer 11a is formed thereon, and an alignment film 12a is further formed thereon. Also, a polarizing plate 6a as an optical member is adhered to the outer surface of the substrate material 8a.

On the liquid crystal side surface of the substrate material 8b of the second substrate 4b facing the first substrate 4a, that is, on the surface facing the first substrate 4a, for example, a second electrode acting as a segment electrode is provided.
An electrode 9b is formed in a predetermined pattern, an overcoat layer 11b is formed thereon, and an alignment film 1 is further formed thereon.
2b is formed. A polarizing plate 6b as an optical member is adhered to the outer surface of the substrate material 8b.

The optical members provided on both or one of the first substrate 4a and the second substrate 4b include a polarizing plate 6
In addition to a and 6b, a retardation plate, a light diffusion plate and the like can be considered.
Further, the substrate materials 8a and 8b may be provided with other optical elements, for example, a color filter, if necessary.

The first electrode 9a and the second electrode 9b are formed to a thickness of about 1000 angstroms by a transparent electrode made of, for example, ITO (Indium Tin Oxide), and the overcoat layers 11a and 11b are made of, for example, silicon oxide or oxide. The alignment films 12a and 12b are formed to a thickness of about 800 angstroms by, for example, a polyimide resin.

As shown in FIG. 1, the first electrode 9a is formed by arranging a plurality of linear patterns in parallel with each other.
It is formed in a so-called stripe shape. On the other hand, the second electrode 9
b is also formed in a stripe shape by arranging a plurality of linear patterns parallel to each other so as to intersect the first electrode 9a. A plurality of points where these electrodes 9a and 9b intersect in a dot matrix form pixels for displaying an image. The area defined by the plurality of pixels is a display area for displaying an image such as an image or a character.

The first substrate 4a formed as described above
As shown in FIG. 2A, a plurality of spacers 13 are dispersed on one of the liquid crystal side surfaces of the second substrate 4b and the sealing material 7 on the liquid crystal side surface of one of the substrates, for example. It is provided in a frame shape as shown in FIG. 1 by printing or the like. A liquid crystal injection port 7a is formed in a part of the sealing material 7 as shown in FIG.

A spacer 13 is provided between the substrates 4a and 4b.
, A gap of about 5 μm, for example, a so-called cell gap is formed.
The liquid crystal 14 is injected into the cell gap through the through hole, and after the injection is completed, the liquid crystal injection port 7a is sealed with a resin or the like.

In FIG. 1, the first substrate 4a is the second substrate 4
The first electrode 9a on the first substrate 4a extends directly to the substrate overhang 4c to form a wiring 15a. Reference numeral 20 denotes an external connection terminal for making an electrical connection with an external circuit (not shown). Further, the second substrate 4b is the first substrate 4
The second electrode 9b on the second substrate 4b extends directly to the substrate overhang 4d to form a wiring 15b.

A large number of the electrodes 9a and 9b, the wirings 15a and 15b extending therefrom, and the external connection terminals 20 are actually formed at very narrow intervals over the entire surface of each of the substrates 4a and 4b. In FIGS. 1 and each of the drawings to be described below, the electrodes and the like are schematically illustrated at intervals wider than the actual intervals in order to clearly show the structure, and some of the electrodes are not illustrated. Further, the electrodes 9a and 9b formed in the region where the liquid crystal is sealed are not limited to being formed in a linear shape, but may be formed as a pattern such as an appropriate character or graphic.

As shown in FIG. 2A, the liquid crystal driving IC 3a has a plurality of terminals, that is, bumps 21, on its active surface (the lower surface of FIG. 2A). This liquid crystal drive IC
3a is mounted on the substrate overhang 4c by an ACF (Anisotropic Conductive Film) 17.

As is well known, the ACF 17 is a conductive polymer film used to electrically connect the pair of terminals together with anisotropy, for example, as shown in FIG.
As shown in (a), it is formed by dispersing a large number of conductive particles 19 in a thermoplastic or thermosetting resin film 22.

The substrate overhang 4c with the ACF 17 interposed therebetween
The liquid crystal driving IC 3a is bonded to the substrate overhang portion 4c by thermocompression bonding, that is, pressurizing under heating, and the liquid crystal driving IC 3a is pressed.
A connection having a unidirectional conductivity is realized between the substrate 1 and the wiring 15a on the substrate overhang 4c and between the bump 21 of the liquid crystal driving IC 3a and the external connection terminal 20 on the substrate overhang 4c.

In FIG. 1, TCP 5 is an IC structure formed by using TAB technology.
(Flexible Printed Circuit) 31 on which is formed
The liquid crystal driving IC 3b is formed by bonding, for example, gang bonding. FIG. 3 shows the liquid crystal device 1 of FIG.
Is seen from the back side. As can be seen from FIG. 3, the TCP 5 is a wire 30
5b, that is, connected to the second substrate 4b, that is, mounted. This implementation, as shown in FIG.
This can be performed using the ACF 17.

In FIG. 1, a silicon mold 29 as a protective agent is provided on the surface of the substrate overhang 4c of the first substrate 4a.
a is attached, for example, is applied. This silicon mold 2
Numeral 9a is provided so as to cover all of the wirings 15a on the substrate overhanging portion 4c in order to prevent the wirings 15a from being exposed to the outside air and thereby generating electrolytic corrosion.

As shown in FIG. 2 (a), the second substrate 4b has an extension 4e projecting outside the sealing material 7, so that there is a gap between the first substrate 4a and the second substrate 4b. , Extension 4
e, a recess 32a surrounded by the substrate overhang 4c and the sealing material 7 is formed. The silicon mold 29a also fills the recess 32a to cover the wiring 15a.

In FIG. 3, a silicon mold 29 as a protective agent is provided on the surface of the substrate overhang 4d of the second substrate 4b.
b is attached, for example, applied. This silicon mold 2
Numeral 9b is provided so as to cover all of the wirings 15b on the substrate overhanging portion 4d in order to prevent the wirings 15b from being exposed to the outside air and thereby generating electrolytic corrosion.

As shown in FIG. 2 (b), the first substrate 4a has an extension 4f projecting outside the sealing material 7, so that there is a gap between the first substrate 4a and the second substrate 4b. , Extension 4
f, a recess 32b surrounded by the substrate overhang 4d and the sealing material 7 is formed. The silicon mold 29b also fills the recess 32b to cover the wiring 15b.

In the liquid crystal device 1 configured as described above, the first electrodes 9a are provided by the liquid crystal driving ICs 3a and 3b.
Alternatively, a scanning voltage is applied to one of the second electrodes 9b for each row, and a data voltage based on a display image is applied to the other of the electrodes for each pixel. Modulates the light passing through each of the selected pixel portions, thereby displaying an image such as a character or a number on the outside of the substrate 4a or 4b.

Hereinafter, a manufacturing method for manufacturing the liquid crystal device 1 having the above configuration will be described with reference to the process chart shown in FIG.

First, as shown in FIG. 5, a first electrode is provided on each individual first substrate 4a of a large-sized first substrate 4a 'having a size corresponding to a plurality of first substrates 4a constituting the liquid crystal panel 2. 9a, the wiring 15a and the external connection terminal 20 are formed using ITO as a material by a known pattern formation method, for example, a photolithography method (step P1 in FIG. 4).

Next, the overcoat layer 11a (FIG. 2)
(See FIG. 4A) is formed on the surface of the large-sized first substrate 4a ′ in FIG. 5 by offset printing using, for example, silicon oxide or titanium oxide as a material (step P2 in FIG. 4). Then, an alignment film 12a (see FIG. 2A) is formed thereon by offset printing using, for example, a polyimide resin (step P3 in FIG. 4), and a rubbing process is performed to give the alignment film an orientation. (Step P4 in FIG. 4).

Further, a sealing material 7 is formed in a frame shape by screen printing using, for example, an epoxy resin as a material (step P5 in FIG. 4).
3 (see FIG. 2A) is dispersed (step P6 in FIG. 4).
Thus, a large-sized first substrate 4a 'as shown in FIG. 5 is formed. In FIG. 5, illustration of the overcoat layer and the alignment film is omitted for convenience.

On the other hand, as shown in FIG. 6, a second electrode is provided on each second substrate 4b of a large-sized second substrate 4b 'having a size corresponding to a plurality of second substrates 4b constituting the liquid crystal panel 2. The 9b and the wiring 15b are formed using ITO as a material by a well-known pattern forming method, for example, a photolithography method (step P11 in FIG. 4).

Next, the overcoat layer 11b (FIG. 2)
(A) is formed on the surface of the large-sized second substrate 4b 'in FIG. 6 by, for example, offset printing using, for example, silicon oxide or titanium oxide as a material (step P12 in FIG. 4). Then, an alignment film 12b (see FIG. 2A) is formed thereon by, for example, offset printing using, for example, a polyimide resin (Step P13 in FIG. 4), and rubbing is performed so that the alignment film has alignment. Perform processing (Step P in FIG. 4)
14). Thus, a large-sized second substrate 4b 'as shown in FIG. 6 is formed. In FIG. 6, illustration of the overcoat layer and the alignment film is omitted for convenience.

As described above, the large-format first substrate 4a '(FIG. 5)
After the large-size second substrate 4b '(FIG. 6) is manufactured, FIG.
In the process P21, the large first substrate 4a 'and the large second
The two substrates are bonded to each other by laminating the substrate 4b 'with the sealing material 7 interposed therebetween, and by further pressing, that is, pressing under heating. By this bonding, a large-sized panel structure including a plurality of liquid crystal panels 2 is formed. In addition, at the time of this bonding, FIG.
One of the large-sized first substrate 4a 'and the large-sized second substrate 4b' of FIG. 6 is attached to a mating large-sized substrate in a state where it is turned over from the state shown in FIG.

After the large panel structure is manufactured as described above, a first break step is performed on the panel structure (step P22 in FIG. 4). Specifically, the large-sized first substrate 4a 'constituting the panel structure is cut along the first cutting line L1a shown in FIG. 5, while the large-sized second substrate 4b' shown in FIG. 1 cutting line L1b
The large-sized substrate is cut along.

As a result, as shown in FIG. 7, a plurality of medium-sized panel structures 2 'in which the first strip-shaped substrate 4a "and the second strip-shaped substrate 4b" are bonded to each other are manufactured. Is done. The medium format panel structures 2 'have a structure in which a liquid crystal injection port 7a of each liquid crystal panel portion included therein is exposed to the outside. Thereafter, the liquid crystal 14 is injected into each liquid crystal panel through each liquid crystal injection port 7a, and after the injection is completed, the liquid crystal injection port 7a is sealed with a resin (step P23 in FIG. 4).

After that, in the process P24, a second break is performed on the medium-sized panel structure 2 '. In particular,
In FIG. 7, both the strip-shaped first substrate 4a ″ and the strip-shaped second substrate 4b ″ are cut along the second cutting line L2,
Thus, the liquid crystal panel 2 shown in FIG.
a, 6b, the liquid crystal driving IC 3a, and the one on which the TCP 5 is not mounted are cut one by one.

Thereafter, in FIG. 1, the liquid crystal driving IC 3a is directly mounted on the surface of the substrate overhang 4c of the first substrate 4a (Step P25 in FIG. 4), and further, the surface of the substrate overhang 4d of the second substrate 4b is exposed. Is electrically conductively connected to (step P26 in FIG. 4). Thereafter, the entire surface of the liquid crystal panel 2 or at least the surfaces of the substrate overhanging portions 4c and 4d are cleaned (step P27 in FIG. 4).

This cleaning can be performed, for example, by immersing at least the surfaces of the substrate overhangs 4c and 4d in a cleaning tank storing a cleaning liquid such as pure water or a solvent, preferably an ultrasonic cleaning tank. This cleaning removes dirt from the surfaces of the substrate overhangs 4c and 4d.

Thereafter, in step P28, a protective agent attaching step is performed. Specifically, in FIG.
By applying a protective agent, for example, a silicon mold 29a to the surface of the substrate overhang portion 4c by coating, the wiring 15a is covered with the silicon mold 29a and shielded from the outside air. At this time, the region where the external connection terminals 20 are located is not shielded by the silicon mold 29a. At this time, the silicon mold 29a is also filled in the recess 32a of FIG.

Further, in FIG. 3, by applying a silicon mold 29b as a protective agent to the surface of the substrate overhang 4d of the second substrate 4b by coating, the wiring 15b is covered with the silicon mold 29b, and this is exposed from the outside air. Shield. At this time, the silicon mold 29b is also filled in the recess 32b of FIG.

As described above, the silicon mold 29a is attached to the surface of the substrate overhang 4c of the first substrate 4a, and the silicon mold 29b is attached to the surface of the substrate overhang 4d of the second substrate 4b. The wirings 15a and 15b on the substrate overhanging portion can be prevented from contacting the outside air, thereby preventing the wirings 15a and 15b from being electrolytically eroded.

In this embodiment, the silicon mold 29a
Before applying the silicon mold 29b to the substrate, the corresponding area is cleaned in the step P27, so that dirt can be removed from the wirings 15a and 15b existing in the corresponding area, and thus, the occurrence of electrolytic corrosion Can be more reliably prevented.

After the step of attaching the protective agent using the silicon mold, in step P29, the first substrate 4a and the second substrate 4b of the liquid crystal panel 2 of FIG. 1 (however, the polarizing plates 6a and 6b are not yet mounted). The outer surfaces of the substrates are wiped and cleaned with a cleaning solution containing a solvent, and thereafter, polarizing plates 6a and 6b as optical members are mounted on the outer surfaces of the substrates by, for example, sticking. Thus, the liquid crystal device 1 shown in FIG. 1 is completed.

Generally, when the surfaces of the substrates 4a and 4b are wiped and cleaned with a cleaning solution containing a solvent, dirt may be carried to the substrate overhangs 4c and 4d by the solvent and remain there. In particular, dirt is easily entrained together with the solvent in the concave portion 32a of FIG. 2A and the concave portion 32b of FIG. 2B. Therefore, after attaching the polarizing plates 6a and 6b to the first substrate 4a and the second substrate 4b with wiping and washing using a solvent as in the related art, a silicon mold is attached to the surfaces of the substrate overhangs 4c and 4d. Then, the wirings 15a and 1
It is conceivable that these wirings are covered with the silicon mold while the dirt remains on 5b, so that the effect of preventing the occurrence of electrolytic corrosion by the silicon mold cannot be sufficiently exerted.

On the other hand, as in the present embodiment, the first substrate 4 of the polarizing plates 6a and 6b involves wiping and cleaning using a solvent.
a and mounting on the second substrate 4b (Steps P29 and P3
If a protective layer made of silicon mold is formed on the substrate overhangs 4c and 4d before performing step (0), it is possible to reliably prevent dirt from remaining on the wirings 15a and 15b. The occurrence of food can be reliably prevented.

(Other Embodiments) The present invention has been described with reference to the preferred embodiments. However, the present invention is not limited to the embodiments, and various modifications may be made within the scope of the invention described in the claims. Can be modified.

For example, in the embodiment of FIG. 1, with respect to the liquid crystal device 1 having the substrate overhangs 4c and 4d in two directions,
An IC chip is mounted on one substrate overhang 4c by the COG method, and an IC chip is mounted on the other substrate overhang 4d by the COF method.
The structure for mounting the chip has been exemplified. However, in place of this mounting structure, a COG type mounting structure is applied to both board overhangs, or a CO
The present invention also includes a case where an F-type mounting structure is applied. Further, a substrate overhang portion is provided only on one substrate 4a of the pair of substrates, and an electrode of the other substrate 4b is electrically connected to one substrate 4a via a sealing material or a vertical conductive material disposed near the sealing material. CO only on the substrate overhang 4c
The present invention includes a case where a mounting structure for mounting an IC chip by the G method or the COF method is applied.

In the above embodiment, the liquid crystal device in which the electrodes formed on the pair of substrates 4a and 4b facing each other cross each other, one electrode is a scanning electrode, and the other electrode is a signal electrode has been described. However, the present invention is not limited to this. A switching element such as a thin film diode and a pixel electrode are formed for each pixel on one of the substrates 4a, and one of a signal electrode or a scanning electrode formed together and the pixel is formed. An active matrix type liquid crystal device may be used in which a switching element is connected between the electrodes and the other of the signal electrode and the scanning electrode is formed on the other substrate 4b so as to intersect with the pixel electrode. Further, a scanning line and a signal line crossing each other are formed on one substrate 4a, and a switching element such as a thin film transistor and a pixel electrode are formed for each pixel, and the substrate 4a has a substrate overhang. An active matrix type liquid crystal device may be used.

The protective agent for covering the wiring on the substrate overhang is not limited to the silicon mold, but has an insulating property, has a viscosity when applied to the substrate overhang, and has a natural property after being attached. Or any material having the property of hardening by an appropriate curing treatment. As such a material, for example, an ultraviolet curable resin or the like can be considered other than the silicon mold.

Further, the optical member to be mounted on the liquid crystal panel after forming the protective layer on the substrate overhanging portion with a protective agent such as a silicon mold or the like is not limited to the polarizing plate as in the above embodiment, but may be any other type. A retardation plate, a light diffusion plate and the like can also be considered as such optical members.

Further, as the electro-optical device according to the present invention, in addition to the liquid crystal device, a pair of substrates such as a plasma display panel (PDP) and a field emission display (FED) are arranged to face each other. A self-luminous display device having a configuration in which an optical member is mounted on a substrate can be applied in the same manner as in the case of the liquid crystal device described above.

[0074]

According to the method of manufacturing an electro-optical device according to the present invention, when an optical member such as a polarizing plate is adhered to the surface of a panel substrate, a silicon mold or the like is already formed on the surface of the substrate overhang. A protective layer is formed by the protective agent, and the wiring on the substrate overhang is covered by the protective agent. Therefore, even if dirt adheres to the substrate overhang when attaching the optical member to the substrate, the dirt does not directly touch the wiring due to the presence of the protective agent. This can be almost completely prevented.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of a liquid crystal device manufactured by a method for manufacturing a liquid crystal device according to the present invention.

FIGS. 2A and 2B are cross-sectional views illustrating a cross-sectional structure of the liquid crystal device illustrated in FIG. 1; FIG. 2A is a cross-sectional structure taken along line AA in FIG. 1; The cross-sectional structure according to the line is shown.

FIG. 3 is a perspective view showing a state where the liquid crystal device shown in FIG. 1 is viewed from the back side.

FIG. 4 is a process chart showing one embodiment of a method for manufacturing a liquid crystal device according to the present invention.

5 is a plan view showing a large-sized first substrate which is a component used in the manufacturing method shown in FIG. 4;

6 is a plan view showing a large-sized second substrate which is a component used in the manufacturing method shown in FIG. 4;

FIG. 7 is a perspective view showing a medium-sized panel structure formed during the manufacturing method shown in FIG. 4;

FIG. 8 is a sectional view showing a main part of a structure of a general liquid crystal panel.

[Explanation of symbols]

 Reference Signs List 1 liquid crystal device 2 liquid crystal panel 3a, 3b liquid crystal driving IC 4a, 4b substrate 4c, 4d substrate overhang portion 4e, 4f extension portion 5 TCP (external substrate) 6a, 6b polarizing plate (optical member) 7 sealing material 7a liquid crystal injection Entrance 8a, 8b Substrate material 9a, 9b Electrode 14 Liquid crystal 15a, 15b Wiring 29a, 29b Silicon mold (protective agent) 32a, 32b Recess

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G09F 9/00 343 G09F 9/00 343D 346 346G F-term (Reference) 2H092 GA05 GA49 GA50 GA51 GA55 GA60 HA25 HA28 MA32 MA35 NA17 NA25 NA28 PA06 3B201 AA02 BB02 BB83 BB93 5C094 AA32 AA42 AA43 BA43 CA19 DA09 DB01 EA10 FB01 GB01 5G435 AA14 AA17 BB12 CC09 EE37 FF00 HH14 KK05

Claims (8)

[Claims] 1. An electric device comprising: a pair of substrates bonded to each other, at least one of the substrates having a substrate overhanging portion extending out of a counterpart substrate, and wiring formed on a surface of the substrate overhanging portion. In a manufacturing method for manufacturing an optical device, an optical member mounting step of mounting an optical member on at least one surface of the pair of substrates, and a protective agent covering the wiring on a surface of the substrate overhang portion. Providing a protective agent attaching step, wherein the protective agent attaching step is performed before the optical member attaching step. 2. The method for manufacturing an electro-optical device according to claim 1, wherein the optical member mounting step includes a cleaning process of cleaning a surface on which the optical member is mounted. 3. The method of manufacturing an electro-optical device according to claim 1, wherein a cleaning step of cleaning a surface of the substrate overhang is provided before the protective agent attaching step. 4. The method for manufacturing an electro-optical device according to claim 3, wherein the cleaning step is performed by immersing a surface of the substrate overhang portion in a cleaning tank storing a cleaning liquid. 5. The method according to claim 4, wherein the cleaning liquid is pure water. 6. The protective agent attaching step according to claim 1, wherein an external substrate mounting step of connecting an external substrate to the substrate overhanging part and / or an IC mounting step of mounting an IC chip on the substrate overhanging part are performed. A method for manufacturing an electro-optical device provided before the step (c). 7. The external board mounting step of connecting an external board to the substrate overhanging part and / or the IC mounting step of mounting an IC chip to the substrate overhanging part according to claim 3, 4, or 5. A method for manufacturing an electro-optical device provided before a cleaning step. 8. The at least one of claims 1 to 7, wherein a mating substrate facing the substrate having the substrate extending portion extends outward from a sealing material for bonding the substrates together. A protective agent, wherein the protective agent is filled in a recess surrounded by the extension, the substrate overhang, and the sealant.