JP3829554B2 - Manufacturing method of liquid crystal device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a liquid crystal device for manufacturing a liquid crystal device that displays an image such as letters, numbers, and figures by controlling the alignment of liquid crystal sealed between a pair of substrates.
[0002]
[Prior art]
In general, a liquid crystal device is formed by attaching an illuminating device such as a backlight or an accessory device such as a liquid crystal driving IC to a liquid crystal panel having a structure in which liquid crystal is sealed between a pair of substrates. A liquid crystal panel generally includes a first substrate on which a first electrode is formed and a second substrate on which a second electrode is formed bonded to each other with a sealing material, and a gap formed between the substrates, a so-called cell. It is formed by enclosing liquid crystal in the gap.
[0003]
As a method for attaching a liquid crystal driving IC or the like to a liquid crystal panel, a substrate overhanging portion that protrudes to the outside of the counterpart substrate is formed on one or both of a pair of substrates constituting the liquid crystal panel. A method is known in which a wiring connected to the first electrode and the second electrode is formed on the surface of the substrate extension, and a liquid crystal driving IC is connected to the wiring. For example, in a COG (Chip On Glass) type liquid crystal device, a liquid crystal driving IC is directly mounted on the surface of the substrate overhanging portion, and the bumps of the IC chip and the wiring on the substrate overhanging portion are conductively connected.
[0004]
Thus, with respect to the liquid crystal device having the substrate overhanging portion, it is necessary to prevent the occurrence of electrolytic corrosion, that is, corrosion, on the wiring formed on the surface of the substrate overhanging portion. Measures are taken such that the agent is adhered to the surface of the substrate overhanging portion, for example, coated to coat the wiring. Electrocorrosion means that an abnormal current flows through the wiring and the wiring is corroded and worn.For example, energization is performed with dirt attached to the wiring, or the wiring touches the outside air. This occurs due to energization in a state where the power is on.
[0005]
[Problems to be solved by the invention]
However, conventionally, when a protective agent is attached to the surface of the substrate overhanging portion of the liquid crystal device, for example, when the protective agent is applied, the protective agent is simply applied, and the height is limited to a certain value. It wasn't. For this reason, the adhesion height of the protective agent is increased, and there is a problem that a part of an electronic device using the liquid crystal device hits the protective agent.
[0006]
The present invention has been made in view of the above problems, and provides a method for manufacturing a liquid crystal device capable of depositing a protective agent for preventing electrolytic corrosion thinly and uniformly on the surface of a substrate overhanging portion. For the purpose.
[0007]
[Means for Solving the Problems]
(1) In order to achieve the above object, a method of manufacturing a liquid crystal device according to the present invention includes a liquid crystal sealed between a pair of substrates bonded to each other, and at least one substrate is stretched to the outside of the counterpart substrate. In the manufacturing method for manufacturing a liquid crystal device having a substrate overhanging portion to be extended and wiring is formed on the surface of the substrate overhanging portion, a protective agent for supplying a fluid protective agent to the surface of the substrate overhanging portion And a substrate tilting step of tilting the pair of substrates so that the protective agent supplied to the surface of the substrate overhanging portion flows toward a region where the pair of substrates are bonded to each other. To do.
[0008]
According to this method for manufacturing a liquid crystal device, the protective agent is made to flow on the substrate overhanging portion by utilizing the fluidity of the protective agent, so that the height of the protective agent supplied onto the substrate overhanging portion is uniform. It can be formed to a thin thickness. Moreover, this can be realized by a very simple process of simply tilting the substrate.
[0009]
Further, in a liquid crystal panel structure in which a pair of substrates are bonded together with a sealing material, it is usually difficult for a protective agent to adhere to a region in the vicinity of the sealing material in the substrate overhang portion, but according to the manufacturing method according to the present invention. Further, the protective agent can be distributed to the area very easily.
[0010]
(2) The method for manufacturing a liquid crystal device described in (1) above is applied to a liquid crystal device in which an IC chip is directly mounted on the surface of the substrate overhanging portion, that is, a COG (Chip On Glass) liquid crystal device. it can. In this type of liquid crystal device, the wiring that connects the electrodes constituting the liquid crystal display area and the terminals of the IC chip, that is, the bumps, is formed over a considerably wide area on the surface of the substrate extension. Therefore, if the present invention is applied to this COG type liquid crystal device, the wiring existing over a wide area can be covered with the protective agent having a uniform thin thickness.
[0011]
(3) When the liquid crystal device described in the above item (2), that is, a COG type liquid crystal device is manufactured using the manufacturing method according to the present invention, no protective agent is supplied between the IC chip and the substrate. The method can be adopted.
[0012]
In general, when supplying the protective agent to the surface of the substrate overhanging portion, as shown in FIG. 6, the dispenser 24 is moved as indicated by an arrow A while discharging a predetermined amount of the protective agent 18 to a narrow region by a so-called dispenser 24. . When such a protective agent supply method is employed, and when the discharge amount of the protective agent discharged from the dispenser 24 is relatively large, the protective agent is supplied between the IC chip and the substrate by the dispenser. In this case, the supply amount of the protective agent to the portion may be excessive. On the other hand, as described above, if the protective agent is not supplied between the IC chip and the substrate, such excessive supply of the protective agent can be prevented.
[0013]
(4) When supplying the protective agent to the liquid crystal device described in the above (2) or (3), that is, a COG type liquid crystal device, the surface of the substrate overhanging portion is viewed from the IC chip. In one side region and the other side region, the protective agent can be supplied while reciprocating the discharge port of the protective agent along a non-overlapping route between the vicinity of the substrate side edge and the vicinity of the IC chip. According to this method, the protective agent can be uniformly supplied to the substrate surface even when the discharge amount of the apparatus for discharging the protective agent is relatively small.
[0014]
(5) In the method for manufacturing a liquid crystal device according to the above (1) to (4), the protective agent may be a room temperature curable resin. As such a room temperature curable resin, for example, a silicon mold which is a resin containing silicon can be used. When a room temperature curable resin is used, the resin can be naturally cured without supplying a special resin curing step after the resin is supplied to the surface of the substrate overhanging portion.
[0015]
(6) In the method for manufacturing a liquid crystal device according to the above (1) to (4), the protective agent may be an ultraviolet curable resin. This method is advantageous because the protective agent can be cured after confirming the flow of the protective agent supplied onto the substrate overhanging portion.
[0016]
In the case of a COG type liquid crystal device, it is generally difficult to fill a portion between the IC chip and the substrate with a protective agent. However, if an ultraviolet curable resin is used as the protective agent, the portion This is advantageous because the protective agent can be cured after confirming the filling of the protective agent into the.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
First, prior to describing a method for manufacturing a liquid crystal device according to the present invention, a liquid crystal device manufactured using the method will be described with reference to a plan view of FIG. 1 and a cross-sectional view of FIG.
[0018]
The liquid crystal device 1 shown here has a pair of substrates 2 a and 2 b facing each other, and these substrates are bonded to each other by a sealing material 3. As shown in FIG. 2, a conductive material 4 is contained inside the sealing material 3. Further, a liquid crystal injection port 3a is formed in a part of the sealing material 3 as shown in FIG.
[0019]
In FIG. 2, the first substrate 2a has a substrate material 6a. On the liquid crystal side surface of the substrate material 6a, that is, the surface facing the second substrate 2b, for example, a first electrode 7a acting as a common electrode is predetermined. An overcoat layer 8a is formed thereon, and an alignment film 9a is further formed thereon. In FIG. 1, the overcoat layer 8a and the alignment film 9a are not shown for convenience. In FIG. 2, a polarizing plate 11a as an optical element is attached to the outer surface of the substrate material 6a.
[0020]
The second substrate 2b facing the first substrate 2a has a substrate material 6b, and the liquid crystal side surface of the substrate material 6b, that is, the surface facing the first substrate 6a is, for example, a second electrode 7b acting as a segment electrode. Are formed in a predetermined pattern, an overcoat layer 8b is formed thereon, and an alignment film 9b is further formed thereon. In FIG. 1, the overcoat layer 8b and the alignment film 9b are not shown for convenience. In FIG. 2, a polarizing plate 11b and a transflective plate 12 as optical elements are attached to the outer surface of the substrate material 6b. That is, in the liquid crystal device 1 of the present embodiment, the lower side surface of FIG. 2 is an image display surface.
[0021]
In addition, as an optical element provided in both or one side of the 1st board | substrate 2a and the 2nd board | substrate 2b, other elements, for example, a phase difference plate, a light diffusing plate, etc. can be considered as needed other than the above-mentioned thing. Further, the substrate materials 6a and 6b can be provided with other optical elements such as a color filter, if necessary.
[0022]
The substrate materials 6a and 6b are formed in a predetermined shape, for example, a rectangular shape or a square shape by using a hard light-transmitting material such as glass or the like, or a light-transmitting material having flexibility such as plastic. The first electrode 7a and the second electrode 7b are formed with a thickness of about 1000 angstroms by a transparent electrode such as ITO (Indium Tin Oxide), for example, and the overcoat layers 8a and 8b are made of, for example, silicon oxide, titanium oxide or The alignment film 9a and 9b are formed to a thickness of about 800 Å by using, for example, a polyimide resin.
[0023]
As shown in FIG. 1, the first electrode 7a is formed in a so-called stripe shape by arranging a plurality of linear patterns in parallel with each other. On the other hand, the second electrode 7b is also formed in a stripe shape by arranging a plurality of linear patterns parallel to each other so as to intersect the first electrode 7a. A plurality of points where these electrodes 7a and 7b intersect in a dot matrix form a pixel for displaying an image. An area partitioned by the plurality of pixels is a display area for displaying an image such as a character.
[0024]
As shown in FIG. 2, a plurality of spacers 13 are dispersed on the liquid crystal side surface of either the first substrate 2a or the second substrate 2b formed as described above. The sealing material 3 is provided on the liquid crystal side surface in a frame shape as shown in FIG. Further, a liquid crystal injection port 3 a is formed at an appropriate position of the sealing material 3.
[0025]
A uniform dimension held by the spacer 13, for example, a gap of about 5 μm, that is, a so-called cell gap is formed between the substrates 2a and 2b, and the liquid crystal 14 is injected into the cell gap through the liquid crystal injection port 3a. After completion of the above, the liquid crystal injection port 3a is sealed with resin or the like.
[0026]
In FIG. 1, the first substrate 2 a has a substrate protruding portion 2 c that extends outside the second substrate 2 b and further outwards from the sealing material 3. The first electrode 7a on the first substrate 2a extends directly to the substrate overhanging portion 2c to form a wiring 15. The second electrode 7b on the second substrate 2b is connected to the wiring 15 on the substrate overhanging portion 2c through the conductive material 4 (see FIG. 2) included in the sealing material 3. Reference numeral 20 denotes an external connection terminal for electrical connection with an external circuit (not shown).
[0027]
In reality, a large number of the electrodes 7a and 7b, the wiring 15 on the substrate overhanging portion 2c connected to them and the external connection terminals 20 are formed over the entire surface of each of the substrates 2a and 2b at very narrow intervals. In FIG. 1 and each figure to be described hereinafter, in order to show the structure in an easy-to-understand manner, those electrodes and the like are schematically shown at intervals wider than actual intervals, and some of the electrodes are not shown. Further, the electrodes 7a and 7b are not limited to being formed in a straight line, but may be formed as a pattern such as an appropriate character or figure.
[0028]
A liquid crystal driving IC 16 is directly mounted on the substrate extension 2c by an ACF (Anisotropic Conductive Film) 17 to form a so-called COG mounting structure. As shown in FIG. 2, the liquid crystal driving IC 16 has a plurality of terminals or bumps 21 on its active surface, that is, the lower surface of FIG.
[0029]
As is well known, the ACF 17 is a conductive polymer film that is used to electrically connect together a pair of terminals with anisotropy. For example, as shown in FIG. Alternatively, it is formed by dispersing a large number of conductive particles 19 in a thermosetting resin film 22.
[0030]
The substrate overhanging portion 2c and the liquid crystal driving IC 16 are thermocompression bonded with the ACF 17 interposed therebetween, that is, the liquid crystal driving IC 16 is bonded to the substrate overhanging portion 2c by applying pressure under heating. A connection having conductivity in one direction is realized between the wiring 15 on the substrate extension 2c and between the bumps 21 of the liquid crystal driving IC 16 and the external connection terminal 20 on the substrate extension 2c.
[0031]
In FIG. 1, a silicon mold 18 as a protective agent is attached to the surface of the substrate extension 2c. This silicon mold 18 is provided so as to cover all of the wiring 15 in order to prevent the wiring 15 on the substrate overhanging portion 2c from generating electric corrosion due to contact with outside air.
[0032]
As shown in FIG. 2, the second substrate 2 b has an extending portion 2 d that protrudes to the outside of the sealing material 3, so that the extending portion 2 d, between the first substrate 2 a and the second substrate 2 b, A recess 23 surrounded by the substrate overhang 2c and the sealing material 3 is formed. The silicon mold 18 is also filled in the recess 23 to cover the wiring 15 existing in the recess.
[0033]
In the liquid crystal device 1 configured as described above, a scanning voltage is applied to each of the first electrode 7a and the second electrode 7b for each row by the liquid crystal driving IC 16 and further to the other of the electrodes. By applying a data voltage based on the display image for each pixel, the light passing through each pixel portion selected by the application of both voltages is modulated, so that the outside of the substrate 2a or 2b, in the case of this embodiment Displays images such as letters and numbers on the outside of the substrate 2a.
[0034]
Hereinafter, a manufacturing method for manufacturing the liquid crystal device 1 having the above-described configuration will be described with reference to a process diagram shown in FIG.
[0035]
First, a large-sized substrate material having a size corresponding to a plurality of the first substrates 2a in FIG. 1 is formed of glass, plastic, etc., and in step A1 in FIG. To implement. Specifically, as shown in FIG. 4A, a well-known pattern forming method using ITO as a material, for example, a photolithography method, a first electrode 7a, a wiring 15 and a predetermined pattern are formed on the surface of the large format substrate material 6a ′. The external connection terminal 20 is formed. In FIG. 4 (a), only one region of the first substrate 2a of the large substrate material 6a ′ is shown.
[0036]
Next, the overcoat layer 8a (see FIG. 2) is formed on the surface of the large-format substrate material 6a ′ in FIG. 4A by offset printing using, for example, silicon oxide or titanium oxide (step A2 in FIG. 3). Then, for example, an alignment film 9a (see FIG. 2) is formed by offset printing using a polyimide resin as a material (step A3 in FIG. 3), and a rubbing process is performed in order to give the alignment film an orientation (see FIG. 3). Step A4 in FIG.
[0037]
Furthermore, the sealing material 3 is formed into a frame shape by, for example, screen printing using, for example, an epoxy resin (step A5 in FIG. 3), and the spacers 13 (see FIG. 2) are further dispersed (step A6 in FIG. 3). ). Thus, a large first substrate 2a ′ as shown in FIG. 4A is formed. In FIG. 4A, illustration of the overcoat layer and the alignment film is omitted for convenience.
[0038]
On the other hand, a large-sized substrate material having a size corresponding to a plurality of the size of the second substrate 2b in FIG. 1 is formed of glass, plastic, or the like. In step B1 of FIG. To implement. Specifically, as shown in FIG. 4B, a second electrode 7b having a predetermined pattern is formed on the surface of the large-sized substrate material 6b ′ by a well-known pattern forming method using ITO as a material, for example, a photolithography method. Note that FIG. 4B shows only one region of the second substrate 2b in the large substrate material 6b ′.
[0039]
Next, the overcoat layer 8b (see FIG. 2) is formed on the surface of the large-sized substrate material 6b ′ in FIG. 4B by offset printing using, for example, silicon oxide or titanium oxide (step B2 in FIG. 3). Then, for example, an alignment film 9b (see FIG. 2) is formed by offset printing using a polyimide resin as a material (step B3 in FIG. 3), and a rubbing process is performed to give the alignment film an alignment property (see FIG. 3). Step B4) in FIG. As a result, a large second substrate 2b ′ as shown in FIG. 4B is formed. In FIG. 4B, illustration of the overcoat layer and the alignment film is omitted for convenience.
[0040]
After the large first substrate 2a ′ (FIG. 4A) and the large second substrate 2b ′ (FIG. 4B) are manufactured as described above, in step C1 of FIG. 3, the large first substrate 2a ′ and the large large substrate 2a ′ are formed. The two substrates 2b ′ are laminated with the sealing material 3 interposed therebetween, and further bonded together, that is, pressed under heat, to bond the two substrates together. By this bonding, a large panel structure having a size including a plurality of liquid crystal panel structures which are main parts of the liquid crystal device 1 is formed. In this bonding, either the large first substrate 2a ′ in FIG. 4A or the large second substrate 2b ′ in FIG. 4B is turned over from the state shown in FIG. Bond to the substrate.
[0041]
After the large panel structure is manufactured as described above, the first breaking process is performed on the panel structure (process C2 in FIG. 3). Specifically, the large-sized first substrate 2a ′ constituting the panel structure is cut along the first cutting line L1a shown in FIG. 4A, while the large-sized second substrate 2b ′ is shown in FIG. The large substrate is cut along a first cutting line L1b shown in FIG.
[0042]
As a result, a plurality of medium-sized panel structures, that is, so-called strip-shaped panel structures, including a plurality of liquid crystal panel portions with the liquid crystal inlets 3a exposed to the outside are cut out. Then, after that, the liquid crystal 14 is injected into each liquid crystal panel portion through each liquid crystal injection port 3a, and after the injection is completed, the liquid crystal injection port 3a is sealed with resin (step C3 in FIG. 3).
[0043]
Thereafter, a second break is performed on the medium format panel structure in Step C4. Specifically, the first substrate and the second substrate constituting the medium format panel structure are cut along the second cutting line L2a in FIG. 4A and the second cutting line L2b in FIG. Accordingly, the liquid crystal device 1 shown in FIG. 2 that is not provided with the liquid crystal driving IC 16, the silicon mold 18 polarizing plates 11a and 11b, and the transflective plate 12 is divided one by one.
[0044]
Thereafter, the liquid crystal driving IC 16 is mounted on the surface of the substrate extension 2c using the ACF 17 (step C5), and the polarizing plates 11a and 11b are attached to the outer surfaces of the substrate materials 6a and 6b, respectively (step C6). Further, the transflective plate 12 is attached to the substrate on the side where no image is displayed, in the case of this embodiment, the outer surface of the second substrate 6b (step C7).
[0045]
Thereafter, in step C8, a supply step of a silicon mold as a protective agent is performed. Specifically, as shown in FIG. 5, the discharge port of the dispenser 24 for discharging the silicon mold 18 is disposed on the substrate overhanging portion 2c on one side region 2e when viewed from the liquid crystal driving IC 16 on the surface. While reciprocating along a non-overlapping path K1 between the side edge vicinity P1 and the IC chip vicinity P2, the silicon mold 18 is discharged from the discharge port and applied to the surface of the substrate extension 2c, that is, supplied.
[0046]
The interval G between the long side of the liquid crystal driving IC 16 and the end side of the second substrate 2b is, for example, about 0.5 mm to 1 mm, and about 0.8 mm on average. The end point of the ejection path K1 is a region having the above-described gap G between the long side of the liquid crystal driving IC 16 and the end side of the second substrate 2b, and has a predetermined dimension D from the end side of the liquid crystal driving IC 16. For example, it is set at a place about 2 mm inside.
[0047]
On the other hand, in the other one side region 2f of the surface of the substrate extension portion 2c as viewed from the liquid crystal driving IC 16, the dispenser 24 is reciprocated along a non-overlapping path K2 between the IC chip vicinity P2 and the substrate side edge vicinity P1. However, the silicon mold 18 is discharged from the discharge port of the dispenser 24. In consideration of the fact that the supply of the silicon mold related to the one side region 2f is continuously performed following the other one side region 2e, the discharge start points are the long side of the liquid crystal driving IC 16 and the end of the second substrate 2b. This is a region having a gap G between the side and the side of the liquid crystal driving IC 16, and is set at a predetermined dimension D, for example, about 2 mm. Then, the vicinity P1 of the substrate side edge is set as the discharge end point.
[0048]
In addition, it is a region having a gap G between the long side of the liquid crystal driving IC 16 and the end side of the second substrate 2b, and is between the discharge end point of the one side region 2e and the discharge start point of the other one side region 2f. In this region, the silicon mold 18 is not discharged.
[0049]
By the discharge process of the silicon mold 18 as described above, the silicon mold 18 is supplied to the surface of the substrate extension 2c around the liquid crystal driving IC 16. Note that the surface state of the silicon mold at this time does not have a strictly uniform thin thickness over the entire surface of the substrate overhanging portion 2c, and has unevenness according to the diameter of the discharge port of the dispenser 24. is doing.
[0050]
Thereafter, in step C9 of FIG. 3, as shown in FIG. 2, the pair of substrates 2a and 2b are applied to the surface of the substrate overhang portion 2c, that is, at an appropriate timing before the supplied silicon mold 18 is cured at room temperature. The entire liquid crystal device 1 is tilted at an angle θ so that the silicon mold 18 flows in the direction of arrow B toward the region where is bonded, in other words, toward the sealing material 3 sealing the liquid crystal 14.
[0051]
As a result, the silicon mold 18 supplied to the substrate overhanging portion 2c in step C8 flows as indicated by the arrow B according to the inclination angle θ, and is thinly and uniformly applied to the entire surface of the substrate overhanging portion 2c with a thickness of, for example, 100 μm or less. It spreads and covers all of the wiring 15 reliably. Moreover, the silicon mold 18 is reliably filled in the recess 23 surrounded by the substrate overhanging portion 2C, the extension portion 2d of the second substrate 2b and the sealing material 3 in FIG. 2, and the wiring 15 existing in the region is reliably filled. Cover.
[0052]
Thus, since the thickness of the silicon mold 18 attached to the surface of the substrate extension 2c can be formed very thin without difficulty, when the liquid crystal device 1 is incorporated in an electronic device such as a mobile phone or a portable information terminal, A wide space is formed at a location facing the substrate extension 2c, and various components can be arranged in the space as necessary.
[0053]
In FIG. 5, when the silicon mold 18 is supplied to the surface of the substrate overhanging portion 2c by the dispenser 24, it is a region having a gap G between the long side of the liquid crystal driving IC 16 and the end side of the second substrate 2b. The reason why the discharge of the silicon mold 18 from the dispenser 24 is temporarily stopped in the region between the region 2e and the other one-side region 2f is as follows.
[0054]
That is, when the discharge amount of the silicon mold 18 discharged from the dispenser 24 is relatively large, the silicon mold 18 is also applied to the narrow gap G portion between the long side of the liquid crystal driving IC 16 and the second substrate 2b by the dispenser 24. This is because if the silicon mold 18 is supplied, the supply amount of the silicon mold 18 to the portion may become excessive. On the other hand, as in this embodiment, the liquid crystal driving IC 16 and the second substrate 2b This is because such an excessive supply of the silicon mold 24 can be prevented if the silicon mold 18 is not supplied to the narrow region between them.
[0055]
(Other embodiments)
The present invention has been described with reference to the preferred embodiments. However, the present invention is not limited to the embodiments, and various modifications can be made within the scope of the invention described in the claims.
[0056]
For example, the process diagram shown in FIG. 3 is an example given to facilitate understanding of the present invention, and various processes other than those illustrated in FIG. 3 are added as necessary in the actual manufacturing process. You can do it.
[0057]
Further, in the embodiment of FIG. 3, the protective agent supplying step C8 and the substrate tilting step C9 are performed at the final stage after the polarizing plate sticking step C6 and the transflective reflector sticking step C7 are completed. Steps C8 and C9 can also be performed at an earlier stage.
[0058]
In the embodiment shown in FIG. 1, a silicon mold, that is, a room temperature curable resin, is used as the protective agent. However, other types of room temperature curable resins may be used as the protective agent, or a room temperature curable resin may be used. Instead of this, an ultraviolet curable resin can be used. The use of an ultraviolet curable resin is advantageous because the protective agent can be cured after confirming the flow of the protective agent supplied onto the substrate overhanging portion.
[0059]
Further, in the case of a COG type liquid crystal device having a structure in which an IC chip is directly mounted on a substrate overhanging portion, it is generally difficult to fill a portion between the IC chip and the substrate with a protective agent. However, if an ultraviolet curable resin is used as the protective agent, it is advantageous because the protective agent can be cured after the filling of the protective agent in the portion is confirmed.
[0060]
【The invention's effect】
According to the method for manufacturing a liquid crystal device according to the present invention, since the protective agent is caused to flow on the substrate overhanging portion using the fluidity of the protective agent, the height of the protective agent supplied onto the substrate overhanging portion is increased. Can be formed to a uniform thin thickness. Moreover, this can be realized by a very simple process of simply tilting the substrate.
[0061]
Further, in a liquid crystal panel structure in which a pair of substrates are bonded together with a sealing material, it is usually difficult for a protective agent to adhere to a region in the vicinity of the sealing material in the substrate overhang portion, but according to the manufacturing method according to the present invention. Further, the protective agent can be distributed to the area very easily.
[Brief description of the drawings]
FIG. 1 is a plan view showing a partially broken example of a liquid crystal device manufactured by using a method for manufacturing a liquid crystal device according to the present invention.
2 is a cross-sectional view showing a cross-sectional structure of the liquid crystal device of FIG.
FIG. 3 is a process diagram showing one embodiment of a method for producing a liquid crystal device according to the present invention.
4 is a plan view showing a part of a large-sized substrate formed during the manufacturing method of FIG. 3; FIG.
5 is a plan view for explaining a main process of the manufacturing method of FIG. 3; FIG.
FIG. 6 is a perspective view showing an example of a method for applying a protective agent.
[Explanation of symbols]
1 Liquid crystal device
2a, 2b substrate
2a ', 2b' large format board
2c Substrate overhang
2d board extension
2e, 2f One side area of substrate
3 Sealing material
7a, 7b electrode
14 Liquid crystal
15 Wiring
16 Liquid crystal drive IC
18 Silicon mold (protective agent)
23 Recessed part of substrate
24 Dispenser
D dimension
G interval
K1, K2 Silicon mold supply path
P1 Board side edge vicinity
Near P2 IC chip

Claims (6)

A liquid crystal in which liquid crystal is sealed between a pair of substrates bonded to each other, and at least one of the substrates has a substrate overhanging portion that protrudes to the outside of the counterpart substrate, and wiring is formed on the surface of the substrate overhanging portion In a manufacturing method for manufacturing a device,
A protective agent supplying step of supplying a fluid protective agent to the surface of the substrate overhang portion;
A substrate tilting step for tilting the pair of substrates so that the protective agent supplied to the surface of the substrate overhanging portion flows toward a region where the pair of substrates are bonded to each other. Production method. 2. The method of manufacturing a liquid crystal device according to claim 1, wherein an IC chip is directly mounted on a surface of the substrate extension portion. 3. The method of manufacturing a liquid crystal device according to claim 2, wherein no protective agent is supplied to a region between the IC chip and the counterpart substrate in the protective agent supplying step. 4. The protective agent discharge port according to claim 2 or claim 3, wherein one of the one side region and the other one side region of the surface of the substrate overhanging portion when viewed from the IC chip is arranged near the one side edge of the one substrate and the vicinity of the IC chip. A protective agent is supplied while reciprocating along a non-overlapping path between and a liquid crystal device. 5. The method of manufacturing a liquid crystal device according to claim 1, wherein the protective agent is a room temperature curable resin. 5. The method for manufacturing a liquid crystal device according to claim 1, wherein the protective agent is an ultraviolet curable resin.

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