JP2001124958A - Method for connecting optical fiber and light-receiving semiconductor device - Google Patents

Method for connecting optical fiber and light-receiving semiconductor device

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Publication number
JP2001124958A
JP2001124958A JP30490699A JP30490699A JP2001124958A JP 2001124958 A JP2001124958 A JP 2001124958A JP 30490699 A JP30490699 A JP 30490699A JP 30490699 A JP30490699 A JP 30490699A JP 2001124958 A JP2001124958 A JP 2001124958A
Authority
JP
Japan
Prior art keywords
optical fiber
light
semiconductor device
transmitting body
receiving semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP30490699A
Other languages
Japanese (ja)
Inventor
Yasuhiro Koike
康博 小池
Shigeru Koshibe
茂 越部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP30490699A priority Critical patent/JP2001124958A/en
Publication of JP2001124958A publication Critical patent/JP2001124958A/en
Withdrawn legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a method for connecting optical fiber and light-receiving semiconductor device for reducing optical transmission loss. SOLUTION: A flexible light transmission body in a tape shape or a sheet shape is clamped and connected between the optical fiber, and a light-receiving semiconductor device and light transmission body is attached to the optical fiber directly or by using a jig. It is especially effective when the core diameter of the optical fiber is smaller than the light-receiving part of the light-receiving semiconductor device. For the light transmission body, it is preferable that a refractive index lie ±0.2 of within the refractive index of the optical fiber and it is preferable that it be at least one kind selected from among a silicone resin, an acrylic resin, an epoxy resin, a thermoplastic elastomer resin and the derivative of the resins whose hardness is JIS (A-type) 50 degrees or smaller.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、光ファイバと受光
半導体装置との光学的な接続方法に係わり、光通信接続
時の損失を低減する技術に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for optically connecting an optical fiber and a light receiving semiconductor device, and relates to a technique for reducing a loss at the time of optical communication connection.

【0002】[0002]

【従来の技術】光ファイバを用いた光伝送システムでの
受信は、光ファイバからの信号光を受光半導体装置が受
け電気信号に変換することにより情報が伝送される。受
信用半導体装置としてはフォトダイオード(PD)が主
に用いられている。
2. Description of the Related Art In an optical transmission system using an optical fiber, information is transmitted by receiving a signal light from the optical fiber by a light receiving semiconductor device and converting it into an electric signal. A photodiode (PD) is mainly used as a semiconductor device for reception.

【0003】このような光伝送システムにおける通信性
能は信号光の伝送効率に大きく影響され、光ファイバだ
けでなく接続部の伝送損失が通信性能を左右する。現在
の受信方法は光ファイバと受光半導体装置の間にレンズ
を介在させるものである。しかし、この構造は精密接続
が必要でコストが高く汎用性に乏しいだけでなく、レン
ズ面での反射により数dBから十数dBの接続損失が起
こるといった問題を抱えていた。
[0003] The communication performance of such an optical transmission system is greatly affected by the transmission efficiency of signal light, and the transmission loss not only of the optical fiber but also of the connecting portion affects the communication performance. The current receiving method involves interposing a lens between the optical fiber and the light receiving semiconductor device. However, this structure has a problem that not only the precision connection is required, the cost is high and the versatility is poor, but also a connection loss of several dB to several tens dB is caused by reflection on the lens surface.

【0004】本発明者は、この接続損失を低減するた
め、光ファイバと受光素子との間に反射面で囲まれた導
光路を有する導光体を介在させる結合構造(レンズレス
結合構造、特開平10−221573)を提案してい
る。しかし、本提案は従来のレンズ使用を前提とする受
光半導体装置と光ファイバの接続には有効ではなかっ
た。又、本発明者は、光ファイバと光ファイバの間に柔
軟な光透過体を挟持させる接続構造(ゲルパッド接続、
特開平10−111429)を提案している。しかし、
本提案も光ファイバ同士の接続にのみ焦点を当てたもの
であった。
In order to reduce this connection loss, the present inventor has proposed a coupling structure (lensless coupling structure, particularly a light guide having a light guide path surrounded by a reflection surface) between an optical fiber and a light receiving element. Kaihei 10-221573). However, this proposal is not effective for connecting a light receiving semiconductor device and an optical fiber on the assumption that a conventional lens is used. In addition, the present inventor has proposed a connection structure (gel pad connection,
Japanese Patent Laid-Open No. Hei 10-111429) has been proposed. But,
This proposal also focuses only on the connection between optical fibers.

【0005】本発明者は、さらなる実用化検討を鋭意行
ったところ従来の受光半導体装置と光ファイバを接続す
る場合にも、柔軟な光透過体を介在させることにより光
伝送損失が低減できることを見いだしたものである。特
に光透過体を取扱が容易なテープ状又はシート状とし、
光ファイバ側に直接又は治具を用いて密着させることに
より、簡便に光伝送効率を高めることを見いだしたもの
である。
The inventor of the present invention has made intensive studies for practical use, and has found that even when a conventional light receiving semiconductor device is connected to an optical fiber, the optical transmission loss can be reduced by interposing a flexible light transmitting member. It is a thing. In particular, the light transmitting body is made into a tape or sheet shape that is easy to handle,
It has been found that the optical transmission efficiency can be easily increased by directly or closely contacting the optical fiber with a jig.

【0006】[0006]

【発明が解決しようとする課題】本発明は、光ファイバ
と受光半導体装置の接続時における損失を低減する方法
である。
SUMMARY OF THE INVENTION The present invention is a method for reducing a loss in connecting an optical fiber and a light receiving semiconductor device.

【0007】[0007]

【課題を解決するための手段】本発明は、光ファイバと
受光半導体装置の間に簡便な柔軟透過体を密着介在させ
ることにより光伝送損失の低減を図る光伝送システムの
接続方法である。
SUMMARY OF THE INVENTION The present invention relates to a method of connecting an optical transmission system for reducing an optical transmission loss by closely interposing a simple flexible transmitting body between an optical fiber and a light receiving semiconductor device.

【0008】請求項1は、光透過体が粘着性を有するテ
ープ状又はシート状であることを特徴とする光伝送シス
テムの接続方法である。
A first aspect of the present invention is a connection method for an optical transmission system, wherein the light transmitting body is in the form of a tape or a sheet having adhesiveness.

【0009】請求項2は、光透過体を光ファイバ側に直
接又は治具等を使用して取り付けることを特徴とする請
求項1に記載の光伝送システムの接続方法である。
A second aspect of the present invention is the method for connecting an optical transmission system according to the first aspect, wherein the light transmitting body is attached to the optical fiber side directly or by using a jig or the like.

【0010】請求項3は、光ファイバのコア寸法が受光
半導体装置の受光部寸法より小さいことを特徴とする請
求項1又は請求項2に記載の光伝送システムの接続方法
である。
A third aspect of the present invention is the method for connecting an optical transmission system according to the first or second aspect, wherein the core dimension of the optical fiber is smaller than the dimension of the light receiving portion of the light receiving semiconductor device.

【0011】請求項4は、光透過体の屈折率が光ファイ
バの屈折率±0.2以内であることを特徴とする請求項
1から請求項3に記載の光伝送システムの接続方法。請
求項5は、光透過体が、硬度がJIS(A型)50度以
下のシリコーン系樹脂、アクリル系樹脂、エポキシ系樹
脂、熱可塑性エラストマー系樹脂、及びこれら樹脂の誘
導体から選ばれた少なくとも1種であることを特徴とす
る請求項1から請求項4に記載の光伝送システムの接続
方法である。
According to a fourth aspect of the present invention, there is provided the method for connecting an optical transmission system according to any one of the first to third aspects, wherein the refractive index of the light transmitting body is within ± 0.2 of the refractive index of the optical fiber. According to a fifth aspect of the present invention, the light transmitting body is at least one selected from a silicone resin, an acrylic resin, an epoxy resin, a thermoplastic elastomer resin and a derivative of these resins having a hardness of 50 degrees or less according to JIS (A type). The connection method for an optical transmission system according to any one of claims 1 to 4, wherein the connection method is a seed.

【0012】光ファイバと受光半導体装置とを直接接続
する場合、接続面に空気を巻き込むと光は反射、散乱及
び屈折等の現象で伝送損失を生じる。このため、接続面
に空気を巻き込まない工夫をすることが有効である。
When an optical fiber is directly connected to a light-receiving semiconductor device, if air is involved in the connection surface, light causes transmission loss due to phenomena such as reflection, scattering and refraction. For this reason, it is effective to take measures to prevent air from getting into the connection surface.

【0013】いつでもどこでも簡単に取り扱うことがで
きる光透過体の形状はテープ状又はシート状である。テ
ープ類を光ファイバ側に直接巻き付けたり治具に挟んで
取り付けることは一般家庭でも容易である。特に直接取
り付ける場合には光透過体は粘着性を有することが望ま
しい。また、光透過体は光ファイバ側に取り付けること
が好ましい。この理由は、光ファイバが光半導体装置に
比べて衝撃に対して強いこと、光半導体装置が電気信号
への変換付属部品と一体化されている場合が多いことに
よるものである。
The shape of the light transmitting body which can be easily handled anytime and anywhere is a tape shape or a sheet shape. It is easy for ordinary households to wrap the tapes directly around the optical fiber or to attach them with a jig. In particular, in the case of direct attachment, the light transmitting body desirably has adhesiveness. The light transmitting body is preferably attached to the optical fiber. The reason for this is that the optical fiber is more resistant to impacts than the optical semiconductor device, and that the optical semiconductor device is often integrated with an accessory for converting to an electric signal.

【0014】上記の接続構造は、光ファイバのコア寸法
が受光半導体装置の受光部寸法より小さい場合に特に有
効である。逆の場合、信号光は受光部以外にも伝送され
るため当然ながら損失が大きくなる。但し、通常は受光
半導体装置の受光部寸法(径)は、100μm以上10
00μm以下であり光ファイバの径より大きい場合が多
い(ファイバ径:数μm/石英〜数100μm/プラス
チック)。光ファイバの入手先としては、石英製は信越
化学工業、ポリメチルメタクリレート樹脂製はクラベ、
フッソ樹脂製は旭硝子といったメーカーを挙げることが
できる。又、受光半導体装置の入手先としては、日立製
作所、東芝、浜松ホトニクス等を挙げることができる。
The above connection structure is particularly effective when the core size of the optical fiber is smaller than the light receiving portion of the light receiving semiconductor device. In the opposite case, the signal light is transmitted to a portion other than the light receiving section, so that the loss naturally increases. However, the size (diameter) of the light receiving portion of the light receiving semiconductor device is usually 100 μm or more and 10
In many cases, the diameter is not more than 00 μm and larger than the diameter of the optical fiber (fiber diameter: several μm / quartz to several hundred μm / plastic). Optical fiber is available from quartz made by Shin-Etsu Chemical, polymethyl methacrylate resin made by Clave,
Manufacturers such as Asahi Glass can be cited as the products made of fluorine resin. In addition, as a source of the light receiving semiconductor device, Hitachi, Toshiba, Hamamatsu Photonics and the like can be mentioned.

【0015】光透過体は、柔軟であることが必要でその
硬度はJIS(A型)で50度以下が好ましく、特にJ
IS(D型)で60度以下が好ましい。硬すぎると接続
時の密着が不十分となり間隙を生じ、結果的に光伝送時
に損失をもたらす。これに適する樹脂類は、シリコーン
系、アクリル系、エポキシ系、熱可塑性エラストマー
系、及びこれらの誘導体を挙げることができる。市販品
は信越化学工業、東芝シリコーン、東亞合成、日本化
薬、旭化成等の製品カタログより選択することができ
る。又、これらメーカーで誘導体の製造も可能である。
(特開昭59−133220、特開昭62−16731
7、特開平3−22553、特開平10−17776、
特開平10−110102、特開平10−26182
1)。
The light transmitting body is required to be flexible, and its hardness is preferably not more than 50 degrees in JIS (A type).
It is preferably 60 degrees or less in IS (D type). If it is too hard, the adhesion at the time of connection will be insufficient and a gap will be created, resulting in a loss during optical transmission. Suitable resins include silicones, acrylics, epoxies, thermoplastic elastomers, and derivatives thereof. Commercial products can be selected from product catalogs such as Shin-Etsu Chemical Co., Toshiba Silicone, Toagosei, Nippon Kayaku, and Asahi Kasei. In addition, these manufacturers can also produce derivatives.
(JP-A-59-133220, JP-A-62-16731)
7, JP-A-3-22553, JP-A-10-17776,
JP-A-10-110102, JP-A-10-26182
1).

【0016】光透過体と光ファイバの屈折率はほぼ同じ
であることが好ましい。少なくとも、光透過体と光ファ
イバの屈折率差は±0.2以内が良く、差が大きすぎる
と反射等による光伝送損失を招く。光透過体の屈折率の
調整方法は公知となっている(例、POF CONFE
RENCE ’97、特開平11−43605)。
It is preferable that the refractive index of the light transmitting body is substantially the same as that of the optical fiber. At least, the difference in refractive index between the light transmitting body and the optical fiber is preferably within ± 0.2. If the difference is too large, light transmission loss due to reflection or the like is caused. A method for adjusting the refractive index of the light transmitting body is known (eg, POF CONFE).
RANCE '97, JP-A-11-43605).

【0017】図1は、本発明による接続方法の一例を示
す。接続方向の横から見た図であり、(1)は接続前、
(2)は接続後の状態を示す。光ファイバ1にテープ状
の柔軟光透明体2が巻き付けられている。3及び4は接
続用コネクター、5は受光半導体装置である。コネクタ
ー形状は数社より提案されており(例:PN型、SMI
型等)、従来のレシーバー接続用コネクターの光ファイ
バ側に本発明の柔軟透明体を巻き付け接続する方法であ
る。
FIG. 1 shows an example of a connection method according to the present invention. It is the figure seen from the side of the connection direction, (1) is before connection,
(2) shows the state after connection. A tape-shaped flexible optically transparent body 2 is wound around an optical fiber 1. 3 and 4 are connection connectors, and 5 is a light receiving semiconductor device. Connector shapes have been proposed by several companies (eg, PN type, SMI
And the like, and the flexible transparent body of the present invention is wound around the optical fiber side of a conventional connector for connecting a receiver.

【0018】図2は、本発明による接続方法の別の一例
を示す。1は光ファイバ、4はコネクター、5は受光半
導体装置である。柔軟光透過体2は治具23により光フ
ァイバに取り付けられている。尚、該治具はコネクター
と接続可能な形状をしている。光ファイバが破損した場
合には、光ファイバの破損部を切断し新しい部分に接続
部を作ることもできる。
FIG. 2 shows another example of the connection method according to the present invention. 1 is an optical fiber, 4 is a connector, and 5 is a light receiving semiconductor device. The flexible light transmitting body 2 is attached to the optical fiber by a jig 23. The jig has a shape connectable to a connector. If the optical fiber breaks, the broken part of the optical fiber can be cut to make a connection at a new part.

【0019】図3は、従来のレンズを使用した接続構造
の一例を示す図である。光ファイバ1と受光半導体装置
5とは石英製のボールレンズ30を介して光を伝送す
る。
FIG. 3 is a diagram showing an example of a connection structure using a conventional lens. The optical fiber 1 and the light receiving semiconductor device 5 transmit light through a ball lens 30 made of quartz.

【0020】[0020]

【実施形態】本発明の実施形態を説明する。本発明は、
光ファイバと受光半導体装置を柔軟な光透過体を介在さ
せ接続する方法である。光透過体はテープ状又はシート
状であり、これを光ファイバに巻き付け又は治具等によ
り取り付け受光半導体装置と密着接続を行うものであ
る。以下、実施例及び比較例にて具体的に説明する。
Embodiments of the present invention will be described. The present invention
This is a method of connecting an optical fiber and a light receiving semiconductor device with a flexible light transmitting member interposed therebetween. The light transmitting body is in a tape shape or a sheet shape, and is wound around an optical fiber or attached by a jig or the like to make close contact connection with the light receiving semiconductor device. Hereinafter, specific examples will be described with reference to examples and comparative examples.

【0021】[0021]

【実施例1】屈折率1.5、コア径0.5mmのポリメ
チルメタクリレート製光ファイバ(三菱レイヨン)に
0.2mm厚のシリコーンテープを巻き付け、金属封止
型のPD(受光部径0.8mm、浜松ホトニクス)と図
1のように接続した。この時の接続損失は0.2dBと
小さかった。又、シリコーンを介在させずに接続した場
合の損失は2.1dBであった。
Example 1 A 0.2 mm thick silicone tape was wound around an optical fiber made of polymethyl methacrylate (Mitsubishi Rayon) having a refractive index of 1.5 and a core diameter of 0.5 mm to form a metal-sealed PD (light receiving section having a diameter of 0.1 mm). 8 mm, Hamamatsu Photonics) as shown in FIG. The connection loss at this time was as small as 0.2 dB. In addition, the loss when connecting without interposing silicone was 2.1 dB.

【0022】シリコーンテープは、硬さがJIS(A)
20度の付加反応型シリコーン原料(信越化学工業)を
加熱硬化させたものであり、屈折率は1.43であっ
た。
The hardness of the silicone tape is JIS (A)
It was obtained by heating and curing a 20-degree addition reaction type silicone raw material (Shin-Etsu Chemical Co., Ltd.), and had a refractive index of 1.43.

【0023】[0023]

【実施例2】光ファイバをカッターナイフで切断し実施
例1同様に接続し、この場合の接続効率を測定したが接
続損失は同じ数値を示した。シリコーンが光ファイバの
凹凸に密着し界面反射による損失を防いだものと考えら
れる。又、シリコーンを介在させずに接続した場合の損
失は6.3dBであった。
Example 2 An optical fiber was cut with a cutter knife and connected in the same manner as in Example 1, and the connection efficiency in this case was measured. The connection loss showed the same value. It is considered that the silicone adhered to the irregularities of the optical fiber and prevented loss due to interfacial reflection. Further, the loss when the connection was made without the interposition of silicone was 6.3 dB.

【0024】[0024]

【実施例3】実施例1と同じ光ファイバ及びPDを用
い、アクリル変性エポキシ樹脂製のシートを介在させ図
2のように接続した。光透過体の特性はJIS(A)5
度、屈折率1.45、厚み0.2mmであった。本接続
部は光伝送時に0.3dBの損失を生じた。
Example 3 Using the same optical fiber and PD as in Example 1, they were connected as shown in FIG. 2 with an acrylic-modified epoxy resin sheet interposed. JIS (A) 5
Degree, refractive index 1.45 and thickness 0.2 mm. This connection caused a loss of 0.3 dB during optical transmission.

【0025】[0025]

【比較例1】シリコーンテープの硬さをJIS(A)5
5度とした以外は、実施例2と同様に実験した。この場
合の接続部光伝送損失は1.3dBであった。即ち、光
透過体が硬いため光ファイバとPDに隙間が生じ、接続
時に大きな伝送損失を招いたと考えられる。
Comparative Example 1 The hardness of a silicone tape was measured according to JIS (A) 5.
The experiment was performed in the same manner as in Example 2 except that the angle was set to 5 degrees. In this case, the optical transmission loss at the connection portion was 1.3 dB. That is, it is considered that a gap is formed between the optical fiber and the PD due to the rigidity of the light transmitting body, and a large transmission loss is caused during connection.

【0026】[0026]

【比較例2】硬さがJIS(A)10度のフッソ樹脂
(屈折率1.35、0.2mm厚、ダイキン)を用いた
以外は、実施例1同様に光ファイバと受光半導体装置を
接続した。この場合、PDに信号光は検出されなかっ
た。フッソ樹脂が信号光を反射し、PDにほとんど信号
光が伝送されなかったと考えられる。
Comparative Example 2 An optical fiber and a light-receiving semiconductor device were connected in the same manner as in Example 1 except that a JIS (A) 10-degree fluorine resin (refractive index: 1.35, 0.2 mm thick, Daikin) having a hardness of 10 degrees was used. did. In this case, no signal light was detected in the PD. It is considered that the fluorine resin reflected the signal light, and almost no signal light was transmitted to the PD.

【0027】[0027]

【比較例3】従来のレンズを使用する接続方法(図3)
にて、実施例1と同じ光ファイバ及びPDを用いて接続
効率を測定した。接続損失は1.1dBであった。
Comparative Example 3 Connection method using a conventional lens (FIG. 3)
, The connection efficiency was measured using the same optical fiber and PD as in Example 1. The connection loss was 1.1 dB.

【発明の効果】光ファイバと受光半導体装置を、本発明
の簡便な光透過体を使用し接続すると光通信時の光伝送
損失は極めて小さくなる。本発明の接続は容易であり、
一般家庭の人でも簡単にできるものである。即ち、本発
明は光通信システムの汎用性を高めるのに大きく寄与す
るものである。
When the optical fiber and the light receiving semiconductor device are connected by using the simple light transmitting body of the present invention, the optical transmission loss at the time of optical communication becomes extremely small. The connection of the present invention is easy,
It can be easily done by ordinary family members. That is, the present invention greatly contributes to increasing the versatility of the optical communication system.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明の接続方法の一つの例を示す図であ
る。
FIG. 1 is a diagram showing one example of a connection method according to the present invention.

【図2】 本発明の接続方法の一つの例を示す図であ
る。
FIG. 2 is a diagram showing one example of a connection method according to the present invention.

【図3】 従来の接続構造の一つの例を示す図である。FIG. 3 is a diagram showing one example of a conventional connection structure.

【符号の説明】[Explanation of symbols]

1 光ファイバ 2 光透過体 3、4 コネクター 5 受光半導体装置 23 治具 30 ボールレンズ REFERENCE SIGNS LIST 1 optical fiber 2 light transmitting body 3, 4 connector 5 light receiving semiconductor device 23 jig 30 ball lens

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H04B 10/12 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference)

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】光ファイバと受光半導体装置との間に柔軟
な光透過体を介在させ光学的に接続する方法であり、光
透過体がテープ状又はシート状であることを特徴とする
光伝送システムの接続方法。
1. A method of optically connecting a flexible light transmitting body between an optical fiber and a light receiving semiconductor device, wherein the light transmitting body is tape-shaped or sheet-shaped. How to connect the system.
【請求項2】光透過体を光ファイバ側に直接又は治具等
を使用して取り付けることを特徴とする請求項1に記載
の光伝送システムの接続方法。
2. The connection method for an optical transmission system according to claim 1, wherein the light transmitting body is attached to the optical fiber side directly or by using a jig or the like.
【請求項3】光ファイバのコア寸法が受光半導体装置の
受光部寸法より小さいことを特徴とする請求項1又は請
求項2に記載の光伝送システムの接続方法。
3. The connection method for an optical transmission system according to claim 1, wherein a core size of the optical fiber is smaller than a light receiving portion of the light receiving semiconductor device.
【請求項4】光透過体の屈折率が光ファイバの屈折率±
0.2以内であることを特徴とする請求項1から請求項
3に記載の光伝送システムの接続方法。
4. The method according to claim 1, wherein the refractive index of the light transmitting body is equal to the refractive index of the optical fiber.
4. The connection method for an optical transmission system according to claim 1, wherein the value is within 0.2.
【請求項5】光透過体が、硬度がJIS(A型)50度
以下のシリコーン系樹脂、アクリル系樹脂、エポキシ系
樹脂、熱可塑性エラストマー系樹脂、及びこれら樹脂の
誘導体から選ばれた少なくとも1種であることを特徴と
する請求項1から請求項4に記載の光伝送システムの接
続方法。
5. The light transmitting body according to claim 1, wherein the light transmitting body is at least one selected from silicone resins, acryl resins, epoxy resins, thermoplastic elastomer resins, and derivatives of these resins having a JIS (A type) hardness of 50 degrees or less. The connection method for an optical transmission system according to claim 1, wherein the connection method is a seed.
JP30490699A 1999-10-27 1999-10-27 Method for connecting optical fiber and light-receiving semiconductor device Withdrawn JP2001124958A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30490699A JP2001124958A (en) 1999-10-27 1999-10-27 Method for connecting optical fiber and light-receiving semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30490699A JP2001124958A (en) 1999-10-27 1999-10-27 Method for connecting optical fiber and light-receiving semiconductor device

Publications (1)

Publication Number Publication Date
JP2001124958A true JP2001124958A (en) 2001-05-11

Family

ID=17938729

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30490699A Withdrawn JP2001124958A (en) 1999-10-27 1999-10-27 Method for connecting optical fiber and light-receiving semiconductor device

Country Status (1)

Country Link
JP (1) JP2001124958A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005050273A1 (en) * 2003-11-19 2005-06-02 Tomoegawa Paper Co., Ltd. Optical connection structure and optical connection method
CN100456067C (en) * 2003-11-19 2009-01-28 株式会社巴川制纸所 Optical connection structure and optical connection method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005050273A1 (en) * 2003-11-19 2005-06-02 Tomoegawa Paper Co., Ltd. Optical connection structure and optical connection method
KR100820524B1 (en) * 2003-11-19 2008-04-11 가부시키가이샤 도모에가와 세이시쇼 Optical connection structure and optical connection method
US7422375B2 (en) * 2003-11-19 2008-09-09 Tomoegawa Paper Co., Ltd. Optical connection structure and optical connection method
KR100867261B1 (en) * 2003-11-19 2008-11-06 가부시키가이샤 도모에가와 세이시쇼 Optical connection structure and optical connection method
CN100456067C (en) * 2003-11-19 2009-01-28 株式会社巴川制纸所 Optical connection structure and optical connection method
CN102213801A (en) * 2003-11-19 2011-10-12 株式会社巴川制纸所 Optical connection structure and optical connection method
EP2418524A1 (en) * 2003-11-19 2012-02-15 Tomoegawa Paper Co., Ltd. Optical connection structure and optical connection method

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