JP2001119196A - Electronic component mounting apparatus, recovering method thereof and recording medium with programs recorded therein - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus which produces high-density printed boards, using a single electronic component mounting unit, a recovering method thereof and a recording medium having recorded programs. SOLUTION: This electronic component mounting apparatus has forced recovery operation commands added to a component thickness varying parts of NC programs arranged previously in the ascending order of the component thickness and interprets commands, using control command interpreting means for controlling, so that recovery operation starts every time the component thickness changes. Thus it is possible to produce high-density printed wiring boards, using a single electronic component mounting unit and automate the arranging operation and the adding operation of the forced recovery operation commands which ware performed through manual programming, owing to provision of arranging means and the control command adding means.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus, a recovery method thereof, and a recording medium on which a program is recorded.

[0002]

2. Description of the Related Art As a conventional electronic component mounting apparatus, for example, there is the following one.

As a first conventional example, when there is a restriction in the mounting order of components, even if a state occurs in which the mounting order is different, mounting is performed without stopping the electronic component mounting apparatus itself and high density is achieved. An “electronic component mounting method” for performing a mounting operation is disclosed in Japanese Patent Application Laid-Open No. 05-129794.

As a second conventional example, an “electronic component mounting method” for efficiently performing a mounting operation of an electronic component mounting apparatus in which a plurality of electronic components are held by a plurality of suction nozzles and mounted on a circuit board.
Is disclosed in JP-A-10-322096.

[0005] As a third conventional example, when parts are interfered with each other when they are mounted in the reverse order, even if the parts cannot be mounted due to a suction error or the like, the parts interfere with each other. Japanese Patent Application Laid-Open No. 08-242093 discloses an "electronic component automatic mounting apparatus and mounting method" for preventing such a situation.

A basic hardware configuration of a conventional electronic component mounting apparatus will be described with reference to FIG. In FIG.
The hardware configuration of the conventional electronic component mounting apparatus includes an electronic component supply unit 1, a mounting unit 2, a printed board supply unit 3,
And a control unit 4.

The electronic component supply unit 1 includes an electronic component 11 and a Z
And a shaft drive unit 12.

The mounting section 2 includes a main shaft section 21, nozzle units (221 to 2212), an H-axis driving section 23,
It is composed of an axis driving unit 24, a line sensor 25, a component recognition camera 26, a θ2-axis driving unit 27, a discarding unit 28, and a θ3-axis driving unit 29.

The printed circuit board supply unit 3 includes an XY table 3
1, a printed circuit board 32, a Y-axis drive unit 33, an X-axis drive unit 34, and a board recognition camera 35.

The conventional electronic component mounting apparatus having the above configuration operates as follows. The electronic component 11 is mounted on the mounting space on the electronic component supply unit 1 in a state where the electronic component 11 is incorporated in the feeder unit (in FIG. 8, the electronic component 11 can be mounted from the first to the ninth, and the fifth is mounted). This shows a state in which the electronic component 11 is moving to the suction station position).

The printed board 32 is fixed on the XY table 31, and the coordinate origin position of the printed board 32 is recognized in advance by the board recognition camera 35. At the time of mounting, the Y-axis driving unit 33 is set so that the coordinate value specified by the control program from the NC control unit 45 becomes the mounting position in accordance with the rotation of the main shaft unit 21 of the mounting unit 2.
The position is determined by the driving of the X-axis driving unit 34.

The mounting section 2 includes a main shaft section 21 having an H-axis driving section 23.
And the 12 nozzle units (221 to 2212) mounted on the circumference are rotated clockwise by 30.
The electronic component 11 moves by moving in degrees and operating according to the operation stations (suction, θ1 rotation, component thickness measurement, component recognition, θ2 rotation, mounting, disposal, θ3 rotation) provided at the respective positions. Is carried out, and a series of processes up to mounting on the printed circuit board 32 are executed.

For example, referring to FIG.
Reference numeral 21 is currently located at the suction station, and in the next operation, rotates clockwise by 30 degrees and performs the θ1 rotation operation by the θ1 rotation station. The details of the operation in each station are shown below.

The suction station suctions the electronic component 11 supplied from the electronic component supply unit 1 by a suction nozzle attached to the tip of the nozzle unit.

The θ1 rotation station includes a θ1 axis driving unit 2
4 rotates the electronic component 11 in the mounting direction.

The component thickness measuring station measures the thickness of the electronic component 11 using the line sensor 25.

The component recognition station captures an image of the electronic component 11 using the component recognition camera 26.

The θ2 rotation station includes a θ2 axis driving unit 2
7 and the part recognition camera 2
A rotation operation is performed to correct the total amount of deviation in the rotation direction of the component suction position data obtained from 6. At the same time, the Y-axis drive unit 33 and the X-axis drive unit 34 move while totally correcting the shift amount in the X and Y directions of the suction position data of the component obtained from the component recognition camera 26.

The mounting station performs an operation of mounting the electronic component 11 at a predetermined position on the printed circuit board 32. It should be noted that, based on the component thickness measurement by the line sensor 25 and the component recognition by the component recognition camera 26, an operation is performed so that components determined as suction errors or recognition errors are not mounted.

The discarding station 28 discards a component determined as a suction error or a recognition error by the component thickness measurement by the line sensor 25 and the component recognition by the component recognition camera 26 in the disposal section 28.

The θ3 rotation station includes a θ3 axis driving unit 2
9 is performed to return the rotation angle of the suction nozzle to the coordinate origin position.

Next, the control unit 4 controls an MMI (Man Machine C).
ontorol) control unit 41 and MMC (Main Machine Controller)
l) Control unit 42, SC (Sequential Control) control unit 43, recognition unit 44, NC (Numerical Control) control unit 45, display 411, floppy disk drive 412, keyboard 413, floppy disk 414, , A recognition display 441.

The MMI control unit 41 has an interface function with the outside, and performs input / output and display of various data upon receiving a machine operation request from an operator.
, And receives operation information of the machine from the MMC control unit 42.

The display 411 is a display device for displaying various operation information of the machine.

The floppy disk drive 412 has N
It reads various programs and data such as a C program, a part library, and an array program, and performs a recording process.

The keyboard 413 is an input device for requesting various operations of the electronic component mounting apparatus itself.

The floppy disk (recording medium) 414 stores various programs and data such as an NC program, a part library, and an array program.

The MMC control unit 42 controls the entire operation of the electronic component mounting apparatus, sends operation instructions to each unit, and receives operation information (status report) from each unit.

The SC controller 43 sends the thickness information of the electronic component measured by the line sensor 25 to the MMC controller 42.

The recognizing unit 44 receives the image data from the component recognizing camera 26, and performs the image processing on the image data.
Send to control unit 42.

The display 441 is a component recognition camera 2
6 and a display device for displaying image data acquired by the board recognition camera 35.

The NC control unit 45 receives a control signal from the MMC control unit 42, and controls each axis driving unit (the Z-axis driving unit 12,
Y-axis drive unit 33, X-axis drive unit 34, H-axis drive unit 23, θ
1-axis drive unit 24, θ2-axis drive unit 27, discard unit 28, θ3
The shaft driving unit 29) is controlled.

Next, the software configuration and operation of the conventional electronic component mounting apparatus will be described below. Referring to FIG.
The software of the conventional electronic component mounting apparatus includes an MMI operation processing unit 5, an MMI recording device 6, and an MMC operation processing unit 7.
And an MMC recording device 8.

The MMI operation processing section 5 comprises operation processing means 51 and NC program analysis means 52.

The MMI recording device 6 has N as production information.
C program 61, array program 62, component library 63, and recovery count 64 as an operating condition
And

The MMC operation processing section 7 comprises a mounting operation processing means 71 and a recovery processing means 72.

The MMC recording device 8 stores the mounting operation data 81
And recovery data 82.

The conventional electronic component mounting apparatus having such a configuration operates as follows. The MMI recording device 6 stores the NC program 61, the array program 62, and the component library 63, which are recorded in advance on the floppy disk 414, in the floppy disk drive 4.
12 is read.

As the number of times of recovery 64, a number from 0 to 5 is input, and the recovery operation is executed with a set value of 1 or more.

When a mounting operation command is input, the MMI
The operation processing unit 51 of the arithmetic processing unit 5 analyzes the NC program 61 by the NC program analysis unit 52 and links the contents of the array program 62 and the component library 63 to each other. Send to The mounting operation processing means 71 records the mounting operation data 81 in the MMC recording device 8.

Next, when the operation processing means 51 sends a mounting operation instruction to the mounting operation processing means 71, the mounting operation processing means 71 starts the mounting operation in accordance with the contents of the mounting operation data 81. The mounting operation processing means 71 records the operation state of each step from suction to mounting and disposal of each component to the mounting operation data 81 as a mounted one as a mounted one, and discards the component due to a suction error or a recognition error. Is recorded in the recovery data 82 as not mounted if the number of recovery times is within the set value 64, and is recorded in the mounting operation data 81 as EOP (out of component) when the set value is exceeded, and the process waits for component replacement.

The recovery processing means 72 issues a recovery operation request to the mounting operation processing means 71 when the number of data in the recovery data 82 reaches a certain number, and causes the mounting data of the recovery operation to be interrupted into the unexecuted portion of the mounting operation data 81.

The mounting operation processing means 71 notifies the operation processing means 51 when all components have been mounted, and executes processing for ending the operation.

FIG. 10 is a diagram showing the shape of the printed circuit board 32 on which electronic components are to be mounted. Electronic components (1005 chip resistors and capacitors) are mounted at predetermined coordinate values in the order of the component numbers described in the drawing.

Note that the part numbers in FIG.
Is mounted with a chip resistor (component thickness 0.35), and component numbers 4 to 9 are mounted with chip capacitors (component thickness 0.5). The electronic components to be mounted are not limited to those described above.

FIG. 11 is a diagram showing a specific example of data recorded in the conventional MMI recording device 6. As shown in FIG. 11, an NC program 61 for mounting each electronic component on the printed board 32 shown in FIG. 10, an array program 62, and a component library 63 are provided in the MMI recording device 6.
Are read, and the number of recovery times is set to 5 in the operating condition 64. Thereby, the recovery is repeated up to five times.

When the operation is started, the operation processing means 51 sends the NC program 61, the array program 62, and the component library 6 to the NC program analyzing means 52.
3 and the information of the operating condition 64 are passed.

The NC program analysis means 52 links the information to form information of the mounting operation data 81,
It is sent to the mounting operation processing means 71.

The mounting operation processing means 71 records the received information in the mounting operation data 81 of the MMC recording device 8.

When the recording of the mounting operation data 81 is completed,
The mounting operation processing means 71 starts a specific mounting operation with reference to the mounting operation data 81.

FIG. 12 shows a specific example of mounting operation data 81 at the time of a conventional electronic component mounting operation.
In FIG. 12, the current suction station has an operation number 0.
015, and at the same time, the mounting station is operating with the data of operation number 0009. Data in which the value of the mounting result is -1 indicates a mounting error component, and the operation number 0002,
0003, 0009 indicates that a mounting error has occurred. The cause of the mounting error is that in which station the error occurred because the recognition result of the target operation number data (operation result of the component recognition station) and the thickness result (operation result of the component thickness measurement station) are -1. I can judge.

The recovery value of the operation number 0009 is 1, which indicates that the recovery operation has been performed by the recovery processing means 72, and the operation number 0
016 to 0018 indicate the inserted recovery operation data.

[0053]

However, in the conventional electronic component mounting apparatus, when the distance between adjacent electronic components on the printed circuit board is reduced, there is a problem that the mounted electronic component and the suction nozzle interfere with each other. For this reason, there is a problem that the interval between adjacent electronic components cannot be reduced to a certain value or more.

However, in a small and lightweight electronic device such as a cellular phone, how much the minimum adjacent distance can be reduced has become an important condition for improving the marketability such as the size (shape) and weight of the device. ing.

The minimum adjoining interval that can be mounted is restricted by the dimensions of the suction nozzle, the dimensions of the component to be mounted, the mounting accuracy of the electronic component mounting apparatus, and the like. Under specific conditions for mounting a component having a small component thickness, the mounted electronic component is most likely to come into contact with the suction nozzle.

For example, under the condition that an electronic component having a large component thickness is mounted adjacent to an electronic component having a small component thickness, interference between the nozzle and the electronic component does not occur. That's all we need to do.

In consideration of a mounting method that avoids interference between the nozzle and the electronic component and minimizes the interval between adjacent components, if the mounting order of the electronic components is arranged in advance in the ascending order of the component thickness by the NC program, the component can be obtained. It is conceivable that the mounting is performed in the order of the thickness.

However, in the electronic component mounting apparatus, since there is a recovery operation for re-mounting the mounting error component, it is assumed that the recovery operation of the component having a small component thickness occurs during the mounting of the component having a large component thickness. In such a case, it is understood that such measures are not enough.

As another method for solving this problem, a plurality of electronic component mounting apparatuses are connected and used, so that mounting of electronic components having different thicknesses can be divided by physically different machines. There is a method of wearing.

Although this method does not cause a problem as in the method of changing the mounting order, it requires a plurality of electronic component mounting apparatuses, and thus causes a new problem that a large capital investment is required.

An object of the present invention is to provide an electronic component mounting apparatus capable of producing a high-density printed circuit board with one electronic component mounting apparatus, a recovery method thereof, and a recording medium on which a program is recorded.

[0062]

According to an aspect of the present invention, there is provided an electronic component mounting apparatus for mounting an electronic component supplied by an electronic component supply unit on a circuit board. The electronic component mounting apparatus includes an NC program that specifies a forced recovery operation command, and a control command decoding unit that decodes the forced recovery operation command specified in the NC program as a control command;
Recovery operation executing means for executing a forced recovery operation based on the forced operation recovery operation command decoded by the control command decoding means.

According to a second aspect of the present invention, in the first aspect of the present invention, the electronic component mounting apparatus links the NC program with the array program and the component library, and in an ascending order of the thickness information of the electronic components in the component library. It is characterized by having alignment means for aligning, and control command adding means for adding a forced recovery operation command to a portion where the thickness of the electronic component changes in the NC program.

According to a third aspect of the present invention, there is provided a method of recovering an electronic component mounting apparatus for mounting an electronic component supplied by an electronic component supply unit on a circuit board, wherein the electronic component mounting apparatus transmits a forced recovery operation command. A control command decoding step for providing an NC program to be specified and decoding a forced recovery operation command specified in the NC program as a control command; and a forced recovery operation based on the forced operation recovery operation command decoded by the control command decoding step. And performing a recovery operation executing step.

According to a fourth aspect of the present invention, in the third aspect of the present invention, the recovery method of the electronic component mounting apparatus includes the step of:
An alignment step of linking the C program with the array program and the component library and aligning the electronic component thickness information in the component library in ascending order; and a forced recovery operation command for a portion of the NC program where the thickness of the electronic component changes. And a control command adding step of adding

According to a fifth aspect of the present invention, there is provided an electronic component mounting apparatus for mounting an electronic component supplied by an electronic component supply unit on a circuit board, wherein the electronic component mounting apparatus includes an NC for designating a forced recovery operation command. With a program, N
A control command decoding process for decoding a forced recovery operation command specified in the C program as a control command, and a recovery operation execution process for executing a forced recovery operation based on the forced operation recovery operation command decoded by the control command decoding process And a program for executing

According to a sixth aspect of the present invention, in the fifth aspect of the present invention, the electronic component mounting apparatus links the NC program with the array program and the component library, and in an ascending order of the thickness information of the electronic components in the component library. A program for executing an alignment process for aligning and a control command adding process for adding a forced recovery operation command to a portion where the thickness of an electronic component changes in the NC program is provided.

<Operation> The present invention includes the decoding of a control command and the execution of a forced recovery process. An operation is performed so that a recovery operation is forcibly executed by a control command (forced recovery operation command) in the NC program. I do.

Thus, by adding a compulsory recovery command to the part where the component thickness is changed, the NC program is arranged in the ascending order of the component thickness in advance.
Since the recovery operation can be completed independently between components with different thicknesses, it is not necessary to mount a thin electronic component after a thick electronic component, and the interference between the mounted electronic component and the suction nozzle is eliminated. It is possible to produce a high-density printed circuit board that does not depend on it.

Further, the present invention includes the alignment in the NC program and the addition of the control command, and the recovery operation can be automatically executed for each thickness of the electronic component without performing the manual programming operation.

[0071]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an electronic component mounting apparatus according to an embodiment of the present invention, a recovery method thereof, and a recording medium on which a program is recorded will be described in detail with reference to the accompanying drawings. The hardware configuration is the same as the conventional configuration shown in FIG. Therefore, the description of the same configuration is omitted.

FIG. 1 is a block diagram showing the software configuration of the electronic component mounting apparatus according to the first embodiment of the present invention. Although the configuration is almost the same as the conventional configuration shown in FIG.
The difference is that the has been added.

The control command decoding means 51 serves to inform the mounting operation processing means 71 when the control command of the forced recovery execution instruction is written in the NC program 61.

FIG. 2 is an example of an NC program in the electronic component mounting apparatus according to the first embodiment of the present invention.
In the conventional NC program shown in FIG. 11, the mounting order is not changed since the mounting order is already arranged in ascending order of component thickness, but is different in that a forced recovery execution instruction is added to NC number 0004.

FIG. 3 is an example of the mounting operation data 81 according to the first embodiment of the present invention. NC shown in FIG.
This is an example in which the mounting operation is performed according to the array program, the component library, and the operating conditions in FIG.
The order of mounting the electronic components on the printed circuit board is the same as in the conventional case, and mounting errors occur with the same component numbers.

At present, the suction station has the operation number 001.
5 and the mounting station is at operation number 0009. The operation numbers 0004 to 0009 are dummy data, and are added because the recovery value was 2 when the operation number 0003 performed the suction operation. Operation numbers 0010 and 0011 correspond to operation number 0003
Since the recovery value was 2 at the time of performing the mounting operation, the recovery operation occurred and was added. The operation numbers 0012 to 0017 are the operation number 0
Numeral 011 denotes dummy data added when the recovery value is 2 when the suction operation is performed.

Next, the overall operation of the electronic component mounting apparatus according to the first embodiment of the present invention will be described in detail. First, as shown in FIG. 3, an NC program is prepared in which the mounting order is arranged in ascending order of component thickness, and a forced recovery operation command is added to a portion where the component thickness changes. Here, the operating conditions of the array program and the component library remain as shown in FIG.

Referring to FIG. 1, according to an instruction from the operation processing means 51, the NC program analyzing means 52
The C program, array program, and component library are linked and passed to the mounting operation processing means 71. Here, the presence or absence of a forced recovery execution command is checked by the control command decoding means 53. By designating the recovery value of the data sent to 71 to 2, a forced recovery operation is instructed.

In FIG. 3, when the recovery value in the data is 2, the recovery operation method is different from the conventional method of interrupting the mounting operation data when the number of cases reaches a certain number. Until the mounting of the previous component and the recovery operation are completed, the system switches to a method in which the subsequent data is not mounted.

FIG. 4 is a flowchart showing a specific operation example of the mounting station in the electronic component mounting apparatus according to the first embodiment of the present invention. In FIG. 4, first, mounting operation data is searched to obtain information on a component to be mounted (step A1). When the thickness result and the recognition result are normal, mounting is performed (steps A2, A3, A4).
After the mounting, the number of mounting times is added by 1, the mounting result is set to 1, and the mounting operation data is updated (steps A5, A6,
A7). If the thickness result or recognition result is abnormal,
One is added to the number of times of recovery and compared with the upper limit of the number of times of recovery (steps A8 and A9). If the number of times of recovery is within the upper limit, the data of the failed component is added to the recovery data 82, the mounting result is updated by setting the mounting result to -1, and the processing is terminated (steps A10, A11, A7). If the number of recoveries exceeds the upper limit, the number of recoveries is set to 1
If the recovery upper limit is equal to or greater than 0, the EOP is set to 1 because the component has run out, and the process is similarly terminated (steps A12, A13, A14, A11, A7). Note that data with a negative recovery upper limit is dummy data that is not mounted.

FIG. 5 is a flowchart showing a specific operation example of the suction station in the electronic component mounting apparatus according to the first embodiment of the present invention. The mounting operation data is searched to obtain information on the component to be sucked (step B).
1). When the recovery upper limit is 0 or more, it is normal mounting data, and it is sucked. When it is smaller than 0, it is dummy data and it is not sucked (steps B2 and B3). If the sucked data is the final mounting data, the dummy data until the sucked electronic component is mounted is added, and the process ends (steps B4 and B6). This also applies to the case where the recovery value is set to 2 (step B).
5, B6).

First, in the operation of the suction station, FIG.
Steps B5 and B6 correspond to the operation numbers 0004 to 0009 and 0012 to 0 in FIG.
017 corresponds to the dummy data. The dummy data prevents the subsequent components from being sucked until the forced recovery operation is completed, thereby preventing the component mounting order from being changed.

FIG. 6 is a flowchart showing a specific operation example of the recovery processing means 72 in the electronic component mounting apparatus according to the first embodiment of the present invention. The mounting operation data is searched to obtain information on the component that has performed the mounting operation (step C1). If the mounting result is other than -1, the recovery data is searched, and if the number of data is smaller than 3, the processing ends without performing any processing (steps C2, C4, C4).
5). If the number of data is three or more, the recovery value is set to 1, the recovery data is read and added to the unsucked position of the mounting operation data (steps C7 and C8).
The same applies when the mounting result is -1 and the recovery value is 2 (steps C3, C7, C8).

Further, in the recovery processing means 72, the operation when the value of the number of times of recovery is 2, step C
3, C7 and C8 correspond to the recovery operation. In the specific example, the operation numbers 0010 and 00 in FIG.
When the data is added, there are only two pieces of recovery data yet, but the recovery operation has been performed by the forced recovery operation command processing.

According to the first embodiment of the present invention, the NC programs are arranged in ascending order of component thickness in advance,
By adding a forced recovery operation command to the part where the thickness of the part changes, there is no danger of the suction nozzle coming into contact with the thick part when mounting a thin part after a thick part. With this electronic component mounting apparatus, it is possible to mount a printed circuit board having a smaller interval between adjacent components than before.

Next, a second embodiment of the present invention will be described in detail with reference to the drawings. FIG. 7 is a block diagram showing a software configuration of the electronic component mounting apparatus according to the second embodiment of the present invention. In FIG. 7, as apparent from comparison with the conventional software configuration shown in FIG.
An aligning means 54 and a control command adding means 55 are added.

As a result, in the first embodiment of the present invention, it is possible to automate the alignment operation and the forced recovery command adding operation which rely on manual programming. By the processing on the mounting apparatus side, a recovery operation similar to that of the first embodiment of the present invention can be realized, and a printed circuit board with a small interval between adjacent components can be mounted.

The above-described embodiment is a preferred embodiment of the present invention, and various modifications can be made without departing from the spirit of the present invention.

[0089]

As is apparent from the above description, according to the electronic component mounting apparatus, the recovery method and the recording medium storing the program of the present invention, the alignment and forced recovery of the electronic component on the electronic component mounting apparatus side. Since the additional operation of the operation command is performed, the interval between components mounted on the printed circuit board can be reduced as compared with the related art without manually operating (adjusting) the NC program.

Further, according to the electronic component mounting apparatus, the recovery method and the recording medium on which the program is recorded according to the present invention, the printed circuit boards can be mounted in the ascending order of the component thickness without being affected by the recovery operation. This is because the provision of the forced recovery operation command and the control command decoding means makes it possible to switch the method of the recovery operation.

[Brief description of the drawings]

FIG. 1 is a block diagram illustrating a software configuration of an electronic component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a diagram showing an example of an NC program according to the embodiment of the present invention.

FIG. 3 is a diagram showing mounting operation data in the embodiment of the present invention.

FIG. 4 is a flowchart illustrating an operation example of a mounting station according to the embodiment of the present invention.

FIG. 5 is a flowchart illustrating an operation example of the suction station according to the embodiment of the present invention.

FIG. 6 is a flowchart illustrating an operation example of a recovery processing unit according to the embodiment of the present invention.

FIG. 7 is a block diagram illustrating a software configuration of an electronic component mounting apparatus according to a second embodiment of the present invention.

FIG. 8 is a block diagram illustrating a hardware configuration of a conventional electronic component mounting apparatus.

FIG. 9 is a block diagram showing a software configuration of a conventional electronic component mounting apparatus.

FIG. 10 is a plan view showing a specific example of a printed circuit board in a conventional electronic component mounting apparatus.

FIG. 11 is a diagram showing a specific example of an MMI recording device in a conventional electronic component mounting apparatus.

FIG. 12 is a diagram showing mounting operation data in a conventional electronic component mounting apparatus.

[Explanation of symbols]

Reference Signs List 5 MMI calculation processing unit 6 MMI recording device 7 MMC calculation processing unit 8 MMC recording device 12 Z-axis drive unit 23 H-axis drive unit 24 θ1-axis drive unit 25 Line sensor 26 Electronic component recognition camera 27 θ2-axis drive unit 28 Discard unit 29 θ3 axis drive unit 33 Y axis drive unit 34 X axis drive unit 35 Printed circuit board recognition camera 43 SC control unit (Sequential Control) 44 Recognition control unit 45 NC control unit (Numerical Control) 51 Operation processing unit 52 NC program analysis unit 53 Control Command decoding means 61 NC program 62 Array program 63 Parts library 64 Operating conditions (recovery times) 71 Mounting operation processing means 72 Recovery processing means 81 Mounting operation data 82 Recovery data 411 Display 412 Floppy disk drive or equivalent removable Disk device 413 keyboard 441 recognizes image display

Claims (6)

[Claims] 1. An electronic component mounting apparatus for mounting an electronic component supplied by an electronic component supply unit on a circuit board, wherein the electronic component mounting device includes an NC program that specifies a forced recovery operation command. Control command decoding means for decoding the forced recovery operation command specified in the NC program as a control command; and recovery for executing a forced recovery operation based on the forced operation recovery operation command decoded by the control command decoding means. An electronic component mounting apparatus, comprising: an operation execution unit. 2. An electronic component mounting apparatus, comprising: an aligning unit that links the NC program with an array program and a component library to align the electronic components in the component library in ascending order of thickness information; The electronic component mounting apparatus according to claim 1, further comprising: a control command adding unit that adds the forced recovery operation command to a portion where the thickness of the electronic component changes. 3. A recovery method for an electronic component mounting apparatus for mounting an electronic component supplied by an electronic component supply unit on a circuit board, wherein the electronic component mounting apparatus executes an NC program for specifying a forced recovery operation command. A control command decoding step of decoding the forced recovery operation command specified in the NC program as a control command, and performing a forced recovery operation based on the forced operation recovery operation command decoded by the control command decoding step. A recovery method for an electronic component mounting apparatus, comprising: performing a recovery operation performing step. 4. The recovery method of the electronic component mounting apparatus, wherein the NC program is linked with an array program and a component library, and the NC program is arranged in an ascending order of electronic component thickness information in the component library. 4. The method according to claim 3, further comprising: a control command adding step of adding the forced recovery operation command to a portion where the thickness of the electronic component changes. 5. An electronic component mounting apparatus for mounting an electronic component supplied by an electronic component supply unit on a circuit board, wherein the electronic component mounting apparatus includes an NC program that specifies a forced recovery operation command. A control command decoding process for decoding the forced recovery operation command specified in the NC program as a control command, and a recovery for executing a forced recovery operation based on the forced operation recovery operation command decoded by the control command decoding process. A recording medium recording a program, comprising: an operation execution process; and a program for executing the following. 6. The electronic component mounting apparatus according to claim 1, wherein the NC program is linked to an arrangement program and a component library, and the electronic component mounting apparatus arranges the electronic components in the component library in ascending order of thickness information. 6. The recording medium according to claim 5, further comprising: a control command adding process for adding the forced recovery operation command to a portion where the thickness of the electronic component changes.