JP2001119186A - Shielding material and shielding structure for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shield an IC or a circuit block mounted on a circuit board for digital circuits or high frequency circuits, using a material having a flexible structure. SOLUTION: This shielding material 1 has a conductive layer 7, formed by coating or vacuum evaporating a conductive material on the surface of a flexible insulation film 6 and covering the conductive layer 7 surface with an insulative material. By forming the conductive layers 7 on the front and back sides of the insulation film 6, one conductive layer 7 can be used for a shield, which suppress unwanted radiations or spurious signals, and the other conductive layer 7 can be utilized for shielding, wiring, mounting of electronic components, etc., thus making possible adequate pattern designs and the increase in the mounting density.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shielding material and a shielding structure for an electronic component, and more particularly, to an electronic component used as a measure against unnecessary radiation and spurious emission from an electronic component such as a semiconductor device mounted on a circuit board. And a shielding material.

[0002]

2. Description of the Related Art Shielding of a semiconductor element such as a high-speed digital IC is important for suppressing unnecessary radiation and spurious emission from the semiconductor element or for preventing noise from entering the semiconductor element. However, in the case of a multi-pin IC, since the outer diameter is relatively large, the structure of the shield and the layout of the circuit board are restricted. 12 to 14 show a conventional example of a configuration for shielding a semiconductor element such as an IC mounted on a circuit board. The first embodiment shown in FIG.
Lead 14a extending below metal shield 14
Are inserted into through holes 2a formed in a circuit board 2 on which a semiconductor element 3 such as an IC is mounted, and connected by soldering or the like. In the second embodiment shown in FIG. 13, a bent piece 14b bent outward at the lower end of the metal shield 14 is connected to a shield connection land 2b provided on the circuit board 2. . In the third embodiment shown in FIG. 14, the lower half 14c of the metal shield 14 is attached to the circuit board 2, and the lid 14d, which is the upper half, is attached to the lower half 14c using elasticity. It is. In the conventional example described above, when shielding a circuit board, a conductive metal material is processed, and the circuit board is mounted by soldering or the like to a terminal of the circuit board. In addition, the wiring was connected to a circuit outside the shield through a gap between the shield and the inner layer of the multilayer substrate or a relief.

[0003]

However, a conventional general metal shield has a rectangular shape, and in a circuit or IC having many wirings, it is necessary to adjust the position of a contact portion between the metal shield and the circuit board. Yes, there are restrictions on the board layout. Also, the contact area with the circuit board made the wiring more complicated, and required a more expensive multilayer board.

[0004] The present invention has been made in view of such a point, and in digital circuits and high-frequency circuits, each I
C and the circuit block are shielded by using a material having a flexible structure, one of the two surfaces of the shield is set to GND or a power supply potential, and the other surface is laid out in a pattern layout, thereby shielding and wiring. It is an object of the present invention to provide a shielding material of an electronic component capable of forming a circuit or a circuit and a shielding structure thereof.

[0005]

Means for Solving the Problems The present invention has been made to solve the above problems, and a first technical means is to apply or deposit a conductive substance on at least one surface of an insulating film. In addition, the surface on which the conductive material is applied or deposited is covered with an insulating material.

According to a second technical means, in the first technical means, a conductive substance is applied or vapor-deposited on both front and back surfaces of the insulating film.

A third technical means is that, in the first or second technical means, when the semiconductor device is mounted on a circuit board, a relief of the conductive material is formed at a portion in contact with a wiring region of the circuit board, and The contact between the conductive material and the circuit board does not occur.

A fourth technical means is characterized in that, in the first or second technical means, holes are formed in a range in which a shielding performance can be ensured to enhance a heat radiation effect.

A fifth technical means is a shielding material for an electronic component in which a conductive substance is applied or deposited on at least one surface of an insulating film and the surface on which the conductive substance is applied or deposited is covered with the insulating substance. And surrounding the electronic component on the circuit board, and setting the conductive material of the shield material to a ground potential or a power supply potential.

A sixth technical means is to apply or deposit a conductive substance on both surfaces of an insulating film and to cover a circuit board with a shielding material of an electronic component in which the surface on which the conductive substance is applied or deposited is covered with an insulating substance. The above electronic component is surrounded, and the conductive material on one surface of the shield material is set to a ground potential, and the conductive material on the other surface is set to a power supply potential or used as a wiring.

A seventh technical means is to apply or deposit a conductive substance on both surfaces of an insulating film and to cover a circuit with a shielding material of an electronic component in which the surface on which the conductive substance is applied or deposited is covered with the insulating substance. An electronic circuit is formed by surrounding the electronic component on the substrate, setting the conductive material on one surface of the shield material to the ground potential, and mounting the electronic component on the other surface.

According to an eighth technical means, in the seventh technical means, the electronic component on the other surface is arranged so as to face the circuit board.

A ninth technical means is that a bare chip IC is provided on the inner surface.
Along with applying or depositing a conductive substance on the outer surface of the film-like substrate on which the electronic component on the circuit board is surrounded by a film-like package in which the surface on which the conductive substance is applied or deposited is covered with an insulating substance, The conductive material on the outer surface of the film-shaped substrate is set to a ground potential.

[0014] A tenth technical means is to apply or deposit a conductive substance on at least one surface of an insulating film above and below the hollowed hole of a circuit board having an electronic component mounted in the hollowed hole. A shielding material in which the surface on which the conductive material is applied or deposited is covered with an insulating material.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION The shielding material for an electronic component according to the present invention forms a layer of a conductive substance by applying a conductive substance on the surface of an insulating film or vapor-depositing a conductive substance. The surface on which the conductive material is applied or deposited is covered with an insulating material. The layer of the conductive material can be appropriately selected as needed, such as only the surface of the insulating film, only the back surface, or both the front and back surfaces. When covering both sides of the insulating film with a layer of conductive material,
Shielding is performed by sandwiching an insulating layer made of an insulating film by a conductive layer, and further wrapping a component requiring a shield by using a flexible material covered with an insulating material. In this case, one surface of the layer of the conductive material is set to the ground potential or the power supply potential, and the other surface is formed in advance by performing a pattern layout so as to form a circuit using the region while performing shielding. it can. In addition, since the shielding material is flexible and can be easily processed by cutting, bending, bonding, and the like, the shielding material is previously processed into a shape suitable for shielding. At the end of the shield, a terminal for connecting to the circuit board is prepared, and the portion is soldered to connect to a signal line or a power supply line. The wiring area of the circuit board creates a escape for the conductive material of the shield,
Avoid contact.

(Embodiment) FIG. 1 is a perspective view showing an embodiment of a shield structure for an electronic component according to the present invention. The shield material 1 is flexible, and a circuit board connection terminal 5 is provided at each end as appropriate. On the other hand, the circuit board 2 on which the electronic component 3 such as an IC is mounted is provided with a shield connection land 4 at a portion to be shielded. By forming the shield material 1 into an appropriate shape and connecting the circuit board connection terminal 5 and the shield connection land 4, the electronic component 3 is surrounded by the shield material 1 and the electronic component 3 is shielded. be able to.

FIG. 2 is a sectional view showing a first basic type of shield material and shield structure of an electronic component. In the first basic type shown in FIG. 2, the shield material 1 has a conductive layer 7 formed by applying or depositing a conductive material only on the inside of the insulating film 6. The end of the conductive layer 7 of the shield material 1 is connected to the ground potential or power supply potential of the circuit board 2 to shield the electronic components 3 such as semiconductor elements mounted on the circuit board 2. By utilizing the flexible properties of the shielding material 1,
It can be formed in a complicated shape as shown in FIG. 9 described later.

FIG. 3 shows a second basic type according to an embodiment of the present invention. The shielding material 1 has a structure in which the front and back surfaces of an insulating film 6 are sandwiched between conductive layers 7 and 7. By connecting the front and back conductive layers 7, 7 to the ground potential or the power supply potential, a shielding effect and a noise removing effect can be obtained. FIG. 11A shows an example in which the shield material 1 having the conductive layers 7 provided on both surfaces of the insulating film 6 is connected to a circuit board.
It is shown in (B). FIG. 11A shows an example in which the front surface of the insulating film 6 is set to the ground potential and the back surface is set to the power supply potential.
(B) shows an example in which the front surface is set to the power supply potential and the back surface is set to the ground potential. In the figure, 12 is a solid pattern to which the ground potential is supplied, and 13 is a circuit board connection terminal.

FIG. 4 shows that the conductive layer on the surface is used as the wiring 8 in the second basic type of the embodiment shown in FIG. 3, and a shield material which cannot be used in the conventional metal shield. Can be used as a wiring area, and wiring can be performed even on a complicated pattern that is difficult to be wired only on a circuit board. In addition to being used as the wiring 8, as shown in FIG. 5, an electronic component 9 such as a multilayer chip capacitor, a chip inductor, and a resistor can be mounted. In the case where the wiring 8 is a circuit relating to components in the shield material 1, it is also possible to set the ground potential or the power supply potential outside the insulating film 6 as shown in FIG. .

In addition, when the electronic component 3 mounted on the circuit board 2 is shielded by the film substrate 6a having the bare chip IC 10 mounted on the inner surface, the film substrate 6a is formed in the same manner as the case of the insulating film 6. By setting the outer surface (back surface) to the ground potential as shown in FIG. 7, a similar shield structure can be obtained. In this case, the bare chip IC 10 on the film substrate 6a and the electronic component 3 on the circuit board 2 can be shielded by the film substrate 6a.

As shown in FIG. 10, the present invention can be applied to a structure in which a cutout hole is provided in the circuit board 2 and an electronic component is mounted in the cutout hole. In this case, the shielding materials 1 and 1 are provided on both sides of the circuit board 2 so as to cover the hollow holes.
Is provided. And as each shield material,
The configuration shown in FIGS. 2 to 8 can be appropriately selected and used. By using the present invention, the surface of the ground potential and the surface of the power supply potential are connected in the shortest distance, so that the influence of the high-frequency current can be reduced. Regarding the temperature rise of the IC, as shown in FIG. 8, it is possible to improve the heat radiation effect by making holes 11 so that the film does not affect the performance.

[0022]

As apparent from the above description, the present invention has the following effects. (1) Since the shielding material has a structure in which the surface of the insulating film is covered with a conductive material and the insulating film is covered with the insulating material, the shielding material is flexible, and the shielding material is cut, bent, or bonded. Since it is possible to form a shield having a more complicated shape than a metal shield, it can be formed at a low cost and easily. . (2) Even relatively large electronic components such as ICs can be easily handled, and the degree of freedom in designing shielded electronic components on a circuit board is increased. (3) Since the outermost surface of the shielding material is covered with an insulating material, it can be installed without worrying about contact with other conductors when mounting on a circuit board. Mounting work becomes easy. (4) When the shielding material has a structure in which the front and back surfaces of the insulating film are covered with a conductive material and the insulating material is covered with the conductive material, one of the conductive layers is used as a shield for suppressing unnecessary radiation and spurious. In addition to using the conductive layer, the other conductive layer can be used for shielding, wiring, mounting of electronic components, and the like, so that appropriate pattern design can be performed and mounting density can be further increased.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a sectional view showing an embodiment which is a first basic type of the present invention.

FIG. 3 is a sectional view showing an embodiment which is a second basic type of the present invention.

FIG. 4 shows an embodiment of the second basic type of the present invention.
It is sectional drawing which shows the example which utilizes an outer conductive layer as wiring.

FIG. 5 shows a second basic type of the embodiment of the present invention.
FIG. 11 is a cross-sectional view illustrating an example in which wiring is provided on an outer conductive layer and an electronic component is mounted.

FIG. 6 shows an embodiment of the second basic type of the present invention.
It is sectional drawing which shows the example which utilizes an inside conductive layer as wiring.

FIG. 7 is a cross-sectional view showing an example in which a shielding material is a film-like substrate on which electronic components are mounted.

FIG. 8 is a cross-sectional view showing an example in which holes for heat dissipation are provided in a shield material.

FIG. 9 is a perspective view showing an example in which a shield material is formed in a complicated shape.

FIG. 10 is a cross-sectional view showing an example in which the present invention is applied to a circuit board having a hollow.

FIG. 11 is a plan view showing the relationship between an electrical connection between a shield material and a circuit board.

FIG. 12 is a longitudinal sectional view showing an example of a conventional electronic component shield structure.

FIG. 13 is a longitudinal sectional view showing another example of a conventional electronic component shield structure.

FIG. 14 is a longitudinal sectional view showing still another example of the conventional electronic component shield structure.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Shield material, 2 ... Circuit board, 3 ... Electronic components (I
C), 4: land for shield connection, 5: terminal for circuit board connection, 6: insulating film, 6a: film substrate, 7:
Conductive layer, 8: wiring, 9: electronic component, 10: bare chip I
C, 11: holes for heat radiation, 12: solid pattern, 13: terminals for connecting circuit boards, 14: metal shields.

Claims (10)

[Claims] 1. A shielding material for an electronic component, wherein a conductive substance is applied or deposited on at least one surface of an insulating film, and the surface on which the conductive substance is applied or deposited is covered with an insulating substance. 2. The shielding material for an electronic component according to claim 1, wherein a conductive substance is applied or vapor-deposited on both sides of the insulating film. 3. When mounting on a circuit board, a relief of the conductive substance is formed in a portion in contact with a wiring area of the circuit board so that contact between the conductive substance and the circuit board does not occur. The shielding material for an electronic component according to claim 1, wherein: 4. The shielding material for an electronic component according to claim 1, wherein holes are formed in a range in which shielding performance can be ensured to enhance a heat radiation effect. 5. A method for coating or depositing a conductive substance on at least one surface of an insulating film and covering a circuit board with an electronic component shielding material having a surface coated or deposited with the conductive substance covered with an insulating substance. An electronic component shield structure surrounding an electronic component, wherein the conductive material of the shield material is set to a ground potential or a power supply potential. 6. An electronic component on a circuit board using a shielding material for an electronic component in which a conductive substance is applied or vapor-deposited on both front and back surfaces of an insulating film and the surface on which the conductive substance is applied or vapor-deposited is covered with an insulating substance. Wherein the conductive material on one surface of the shield material is set to a ground potential, and the conductive material on the other surface is set to a power supply potential or used as a wiring. 7. An electronic component on a circuit board using a shielding material for an electronic component in which a conductive substance is applied or deposited on both front and back surfaces of an insulating film and the surface on which the conductive substance is applied or deposited is covered with an insulating substance. And a conductive material on one surface of the shield material is set to ground potential, and an electronic component is mounted on the other surface to form an electronic circuit. 8. The shield structure for an electronic component according to claim 7, wherein the electronic component on the other surface is arranged so as to face the circuit board. 9. A circuit in a film package in which a conductive material is applied or vapor-deposited on an outer surface of a film substrate on which a bare chip IC is mounted on an inner surface, and the surface on which the conductive material is applied or vapor-deposited is covered with an insulating material. An electronic component shield structure surrounding an electronic component on a substrate, wherein a conductive substance on an outer surface of the film-shaped substrate is set to a ground potential. 10. A conductive material is applied or deposited on at least one surface of an insulating film above and below the hollow hole of a circuit board having an electronic component mounted in the hollow hole, and the conductive material is coated or coated. A shield structure for electronic parts, wherein a shield material having a vapor-deposited surface covered with an insulating material is provided.