JP2001118980A - Hybrid integrated circuit device and plate-type coil - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a hybrid integrated circuit device which is inexpensive and high in mounting density. SOLUTION: Film capacitors 3 and 4 out of electronic parts mounted on a hybrid integrated circuit device become large in size, so that the film capacitors 3 and 4 are each formed like a plate, and the plate-like film capacitors 3 and 4 are made to serve as the lid of a package 5 of a hybrid integrated circuit device 1. That is, the film capacitors 3 and 4 which function as a part of the package 5 are mounted on the hybrid integrated circuit device 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device in which various electronic components are arranged in a package, and a plate-type coil suitable for use in the hybrid integrated circuit device.

[0002]

2. Description of the Related Art Conventionally, a hybrid integrated circuit device has a structure in which various electronic components such as a wound coil, a film capacitor, an electrolytic capacitor, and an IC (chip) are packaged. Also, for this electronic component (winding coil, film capacitor, electrolytic capacitor, etc.), insert the lead wire for extracting the electrode into the through hole provided on the circuit board and solder it, or weld it to the metal terminal in the package. Is implemented.

FIG. 9 shows an example of a hybrid integrated circuit device 61, which includes a film capacitor 62 and an IC (chip).
63 is arranged in the package 64. For more information,
The package 64 of the hybrid integrated circuit device 61 includes a metal case 65, a resin case 66, and a lid 67.
A circuit board 68 is adhered to the metal case 65, and an IC (chip) 63 is mounted on the circuit board 68.
A film capacitor 62 is adhered to the metal case 65, and the film capacitor 62 is provided with a lead wire 69 for taking out an electrode. Then, the lead wire 69 is welded to a metal terminal 70 provided on the resin case 66, and the metal terminal 70 is electrically connected to an IC (chip) 63 via wiring or the like.

[0004] A metal case 65, a resin case 66 and a lid 67 constituting the package 64 are joined by an adhesive 71, and the inside of the package 64 is sealed. Thereby, the moisture resistance and the like are secured, and the electronic components 62 and 63 in the package 64 are protected.

[0005]

However, when the electronic components are arranged in a package, the ratio of the electronic components to the mounting space in the package increases. Specifically, in the hybrid integrated circuit device 61 shown in FIG. 9, the size of the film capacitor 62 is large, which hinders the miniaturization of the hybrid integrated circuit device 61.

The present invention has been made in view of the above problems, and a first object of the present invention is to provide a hybrid integrated circuit device which can be mounted at low cost and with high density. A second object is to provide a plate-type coil suitable for use in a hybrid integrated circuit device.

[0007]

According to the first aspect of the present invention, a part of a package is constituted by a plate-shaped electronic component. That is,
An electronic component having a package function is mounted.
In this case, a space for disposing the plate-shaped electronic components in the package becomes unnecessary. Therefore,
The size of the product can be reduced, and the material cost of the package material can be reduced. As a result, it is possible to provide a low-cost hybrid integrated circuit device capable of high-density mounting.

According to the second aspect of the present invention, a part of the package is constituted by a plurality of electronic parts integrally formed in a plate shape. That is, an electronic component having the function of the package is mounted. Also in this case, a space for arranging a plurality of electronic components in the package becomes unnecessary. Therefore, the size of the product can be reduced, and the material cost of the package material can be reduced. as a result,
It is possible to provide a low-cost hybrid integrated circuit device capable of high-density mounting.

More specifically, if the cover or bottom plate of the package is formed by plate-like electronic components as in the third aspect of the present invention, the size of the hybrid integrated circuit device can be reduced.

Further, if the package lid or the bottom plate is constituted by a plurality of electronic components integrally formed in a plate shape, the size of the hybrid integrated circuit device can be reduced.

According to the fifth aspect of the present invention, a capacitor or a coil having a relatively large size among various electronic components mounted on the hybrid integrated circuit device is formed in a plate shape, and the plate-shaped capacitor or the coil is formed. The coil constitutes a part of the package. as a result,
The size of the hybrid integrated circuit device can be reduced.

According to the sixth aspect of the present invention, a part of the plate-shaped member is formed by extending the conductor pattern into both the front and back surfaces of the plate-shaped member made of a ferromagnetic material and the plurality of through holes. It is wound in a spiral shape. The plate-type coil thus configured is suitable for use in the hybrid integrated circuit device according to any one of the first to fifth aspects.

According to the seventh aspect of the present invention, the through-holes are arranged on concentric circles having different radii (for example, circles indicated by radii r1 and r2 in FIG. 8), whereby an annular core portion (for example, Reference numeral 52a) in FIG. 8 is configured. As described above, by adopting a configuration in which the conductor pattern is wound around the annular core portion, leakage of magnetic flux lines can be prevented, and energy loss can be reduced.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) A first embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a hybrid integrated circuit device 1 according to the present embodiment. FIG. 1 shows a hybrid integrated circuit device 1.
2 is a sectional view taken along line AA of FIG. The hybrid integrated circuit device 1 is used as a component of an engine controller that controls an automobile engine.

As shown in FIG. 2, the hybrid integrated circuit device 1
Mounts an IC (chip) 2 and film capacitors 3 and 4 as various electronic components. The package 5 of the hybrid integrated circuit device 1 includes a metal case 6, a resin case 7,
And film capacitors 3 and 4 of the plate type. That is, in the hybrid integrated circuit device 1,
The two plate-type capacitors 3 and 4 constituting the lid of the package 5 are mounted on the upper part in a state of being stacked.

A circuit board 10 is bonded to the metal case 6 with an adhesive 11a, and various electronic components such as the IC 2 are mounted on the circuit board 10. In addition, metal case 6
Above, a resin case 7 is joined by an adhesive 11b. The resin case 7 has metal terminals 12, 13, 1 for connecting to the film capacitors 3, 4.
4, 15 (see FIG. 1) and external terminals 16 for connection to the outside are provided. Metal terminals 12, 13, 14,
Reference numeral 15 is connected to an electronic component such as the IC 2 via a wire 17 made of aluminum or the like and a wiring 18 formed on the circuit board 10.

The film capacitor 3 includes an insulating layer 3a,
It has a structure in which conductive layers 3b and 3c serving as a pair of counter electrodes are provided, and conductive layers (electrodes) 3b and 3c are stacked with an insulating layer 3a interposed therebetween. The thickness of the plate-shaped laminate is, for example, about 2 mm. Similarly, the film capacitor 4 includes an insulating layer 4a and a conductive layer 4 serving as a pair of counter electrodes.
b, 4c, and a conductive layer (electrode) 4 with an insulating layer 4a interposed therebetween.
b, 4c are laminated. The thickness of the plate-shaped laminate is, for example, about 2 mm.

In the plan view of FIG. 1, electrodes 3b, 3c are seen from opposite side surfaces of a film capacitor 3 having a square plate shape.
Are drawn out (exposed), and the electrodes 4b and 4c are drawn out (exposed) from the side of the film capacitor 4 stacked on the film capacitor 3 that is different from the electrode extraction surface of the capacitor 3. ).

Then, as shown in FIG. 2, the end of the conductive layer (electrode) 3b of the film capacitor 3 is
1a is connected to the metal terminal 12 via its electrode 3
The end of the conductive layer (electrode) 3c disposed between the terminals b is connected to the metal terminal 13 via a conductive adhesive 21b. Similarly, the conductive layer (electrode) 4 of the film capacitor 4
b is connected to the metal terminal 14 via the conductive adhesive 21c (see FIG. 1), and the end of the conductive layer (electrode) 4c disposed between the electrodes 4b is connected to the conductive adhesive 21d ( 1 (see FIG. 1).

When mounting the film capacitors 3 and 4, first, the film capacitors 3 and 4 are inserted into the resin case 7, and the periphery of the film capacitor 3 is attached to the resin case 7 using an adhesive 22. Glue. This allows
The sealed state inside the package 5 is ensured. After that, the electrodes 3b, 3c, 4b, 4c and the metal terminals 12, 13, 1
The film capacitors 3, 4 are connected to the metal terminals 12, 13, 14, 15 by pouring a conductive adhesive (for example, a silver-epoxy adhesive) 21 into the joint with the metal terminals 4, 5.

The insulating layers 3a and 4a are made of, for example, various plastic films such as polyethylene terephthalate (PET) and polyester, and are formed of conductive layers (electrodes).
3b, 3c, 4b, 4c are made of, for example, aluminum or the like. Also, the electrodes 3b, 3 of the film capacitors 3, 4
The bonding of the metal terminals 12, 13, 14, and 15 to the metal terminals c, 4b, 4c may be performed using another bonding material such as solder instead of the conductive adhesive 21.

As described in detail above, this embodiment has the following features. (1) Among the electronic components mounted on the hybrid integrated circuit device 1, the film capacitors 3 and 4 whose size is increased are formed in a plate shape, and the film capacitors 3 and 4 are not disposed in the space in the package 5. , As a lid of the package 5 (part of the package). In this case, in the package 5, the film capacitors 3,
Space for arranging 4 is unnecessary. Therefore, the size of the hybrid integrated circuit device 1 can be reduced, and the material cost of the package material, the circuit board 10, and the like can be reduced. As a result, it is possible to provide the hybrid integrated circuit device 1 capable of high-density mounting at low cost. In particular, when mounted on an automobile, the occupied space is limited, but this is useful.

(2) Since the film capacitors 3 and 4 of the present embodiment are mounted by injecting the conductive adhesive 21, the conventional film capacitors are mounted by welding the lead wires 69 as shown in FIG. The mounting becomes easier as compared with the film capacitor 62 in the form.

(3) By mounting the two plate-type film capacitors 3 and 4 on top of each other, a predetermined strength as a lid can be secured. In this case, since the electrodes 3b, 3c, 4b, 4c of the two film capacitors 3, 4 are connected to separate metal terminals 12, 13, 14, 15, respectively, a predetermined circuit formed on the circuit board 10 is formed. Film capacitors 3 and 4 can be connected separately.

Although the present embodiment has been embodied in the film capacitors 3 and 4, it may be embodied in, for example, an electrolytic capacitor. (Second Embodiment) Next, a second embodiment of the present invention will be described, focusing on differences from the first embodiment. FIG. 3 is a cross-sectional view of the hybrid integrated circuit device 31 according to the present embodiment. In the configuration of the present embodiment, the same components as those in the above-described first embodiment are denoted by the same reference numerals in the drawings, and the description is simplified.

As shown in FIG. 3, the hybrid integrated circuit device 31
The package 32 is composed of a plate-shaped film capacitor 33, a resin case 7, and a resin lid 34. That is, in the present embodiment, the plate-shaped film capacitor 33 is used as the bottom plate of the package 32.

More specifically, a circuit board 10 on which electronic components such as the IC 2 are mounted and a resin case 7 are joined to the film capacitor 33 by an adhesive 11. In the resin case 7, metal terminals 35 and external terminals 16 connected to the metal terminals 35 are provided. The metal terminal 35 is connected to a wiring 18a on the circuit board 10 via a wire 17a made of aluminum or the like. The wires 18b and 18c on the circuit board 10 are wires 17
b, 17c are connected to pad portions 36a, 36b formed on the film capacitor 33. The pads 36a, 36b are connected to the electrodes 33a, 33b by conductive materials 38a, 38b. That is, the electrodes 33a and 33b inside the film capacitor 33
8a and 38b, the pad portion 36
a, 36b, and wires 17b, 17c, etc., and are connected to electronic components such as IC2 on the circuit board 10.

As described above, according to the present embodiment, the package 32 is formed by the plate-shaped film capacitor 33.
, The size of the hybrid integrated circuit device 31 can be reduced, and the cost of materials such as package materials can be reduced. That is, it is possible to provide the hybrid integrated circuit device 31 that can be mounted at a low cost and with a high density.

(Third Embodiment) Next, a third embodiment of the present invention will be described, focusing on differences from the first embodiment. FIG. 4 is a cross-sectional view of the hybrid integrated circuit device 41 according to the present embodiment. However, the description of the same configuration as that of the above-described first embodiment will be simplified by attaching the same symbols. In the present embodiment, the film capacitor 3 in the first embodiment is replaced with a plate coil 42. Hereinafter, the configuration of the plate-type coil 42 will be described in detail.

As shown in FIG. 4, a plate type coil 42 also serving as a lid of the package 5 is provided with a coil body 43.
And a mold resin (for example, an epoxy-based resin) 44 that covers the surface thereof. The plate-type coil 42 of the present embodiment has a thickness of 2 to 5 mm,
The width and length are formed in a size of about 5 to 20 mm.

Here, the configuration of the coil body 43 will be described with reference to FIGS. FIG. 5 is a perspective view of the coil main body 43, and FIG. 6 is a plan view of the coil main body 43. Also,
FIG. 7 is a sectional view taken along line BB of FIG.

The coil main body 43 shown in FIG. 5 includes a substrate 45 as a plate-like member. The substrate 45 is formed by forming a ceramic containing a ferromagnetic material (eg, ferrite) into a rectangular shape. . A spiral conductive pattern 46 is formed on the ceramic substrate 45.

More specifically, as shown in FIG. 6, a plurality of through holes 47a and 47b are formed in a ceramic substrate 45 by two straight lines L1 and L2 parallel to the longitudinal direction of the ceramic substrate 45 (the X direction shown in FIG. 6). It is provided at a predetermined interval W above. The through holes 47a and 47b are
For example, it is formed with a diameter of 0.2 to 1 mm. Then, as shown in FIG. 7, the through holes 47a, 4a
Conductor patterns 46 are formed on the wall surface 7b and on both front and back surfaces of the ceramic substrate 45.

As shown in FIG. 6, a conductor pattern 46a formed on the surface (upper surface in FIG. 7) of the ceramic substrate 45 is formed.
Extends from the through hole 47a toward the through hole 47b. That is, the through holes 47a, 47
It extends in the Y direction in FIG. The conductor pattern 46b formed on the back surface (the lower surface in FIG. 7) of the ceramic substrate 45 is formed of two conductor patterns 46 on the front surface.
a is extended between the through holes 47a and 47b so as to connect a. When the conductor pattern 46 is formed in this manner, the substantially bar-shaped core portion 45 is formed by the conductor pattern 46.
a will be wound. Then, the conductor pattern 46
Is energized, a magnetic flux passing through the core portion 45a is generated. The ends of the conductor pattern 46 are connected to a pair of electrodes 48a and 48b (see FIG. 6) formed on the opposing side surfaces of the ceramic substrate 45, respectively.

At the time of manufacture, in order to form a conductive pattern 46 on one surface (for example, the surface) of the ceramic substrate 45 and the wall surface of the through hole 47, a paste-like conductive material is applied from one surface (the surface) side. Print, dry and bake. Subsequently, a conductive material is similarly printed from the other surface (for example, the back surface) side of the ceramic substrate 45, and drying and firing are performed. Thus, a spiral (spiral) conductive pattern 46 is formed on the ceramic substrate 45. Thereafter, the front and back surfaces of the ceramic substrate 45 are covered with the mold resin 44 (see FIG. 4) to form the plate coil 42. And
As shown in FIG. 4, when the plate-type coil 42 is mounted on the hybrid integrated circuit device 41, the pair of electrodes 48
a, 48b are connected to the metal terminals 12, 13 via the conductive adhesives 21a, 21b.

In the method of forming the conductor pattern 46 as described above, a conductor pattern of any shape can be formed in the same forming step. That is, in the coil body 43, the conductor pattern 46 winds the substantially rod-shaped core portion 45a, but is not limited to this. For example,
Like a coil main body 51 shown in FIG. 8, a conductor pattern 53 may be embodied in a substantially ceramic substrate 52 having a substantially annular shape wound around a core portion 52a.

More specifically, in the coil body 51 shown in FIG.
Two concentric circles having different diameters (radius r
1> r2), a plurality of through holes 54a and 54b are provided. The same number of through holes 54 are formed on the outer circle (radius r1) and the inner circle (radius r2).
a and 54b are provided. The conductor pattern 53a formed on the front side of the ceramic substrate 52 is different from the through hole 54a provided on the outer circle (radius r1) through the through hole 54 provided on the inner circle (radius r2).
b. That is, the conductor pattern 53a on the front side extends radially between the through holes 54a and 54b from the center O of the circle (radius r1, r2). Also,
The conductor pattern 53b on the back side of the ceramic substrate 52 is 2
It extends between the through holes 54a and 54b to connect the conductor pattern 53a on the front side of the book.

When the conductor pattern 53 is formed as described above, the conductor pattern 53 is substantially spirally wound around the annular core portion 52a. When the conductor pattern 53 is energized, a magnetic flux passing through the annular core portion 52a is generated. The ends of the conductor pattern 53 are connected to a pair of electrodes 55a and 55b formed on the opposing side surfaces of the ceramic substrate 52, respectively.

At the time of manufacturing, the coil body 51 is also replaced with the ceramic substrate 52 after the formation of the conductor pattern 53.
Are coated with mold resin to form a plate coil. When the plate-type coil is mounted on the hybrid integrated circuit device, the pair of electrodes 5
5a and 55b are connected to metal terminals via a conductive adhesive. In the plate-type coil having the conductor pattern 53 formed as described above, the leakage of the magnetic flux passing through the annular core portion 52a during energization is prevented, so that the efficiency is improved without energy loss.

In the coil bodies 43 and 51, 1
Although one coil is formed on one ceramic substrate 45, 52, a plurality of coils may be formed on one ceramic substrate 45, 52.

As described in detail above, this embodiment has the following features. (1) Among the electronic components mounted on the hybrid integrated circuit device 41, the film capacitor 4 and the coil 42 whose sizes are increased are formed in a plate shape, and the film capacitor 4 and the coil 42 are mounted as a lid of the package 5.
In this case, a space for disposing the film capacitor 4 and the coil 42 in the package 5 becomes unnecessary, and the size of the hybrid integrated circuit device 41 can be reduced.

(2) Plate type coil 42 of this embodiment
Then, the core portions 45a, 52a, which are part of the ceramic substrates 45, 52 containing a ferromagnetic material, are
Winded by 53. Thus, the plate type coil 4
By forming 2, the inductance can be increased. In addition, in the plate-type coil 42, the cross-sectional area of the core portions 45a and 52a wound by the conductor patterns 46 and 53 is changed, or the number of turns of the conductor patterns 46 and 53 is changed, thereby changing the plate-type coil 42. Can be changed. The inductance can also be changed by changing the amount of ferromagnetic material contained in the ceramic substrates 45 and 52 or by using another magnetic material having a different magnetic susceptibility. Therefore, it is possible to form the plate coil 42 having an arbitrary inductance without changing the shape.

(3) As shown in FIG. 8, if the core portion 52a wound by the conductor pattern 53 is formed in an annular shape, leakage of magnetic flux lines is prevented, so that energy loss can be reduced. The present invention can be embodied in the following forms other than the above.

In the above embodiments, the plate-shaped film capacitors 3, 4, 33 or the plate type coil 42 are mounted as the lid or the bottom plate of the package, but these electronic components 3, 4, 33, 42 are mounted. May be mounted on another portion, for example, on the side wall of the package. Further, the plate-shaped electronic component may be partially bent.

In the first and third embodiments, a part of the package is constituted by two plate-shaped electronic components (film capacitors 3 and 4 or film capacitor 4 and plate coil 42). The number of electronic components is not limited to this, and may be one or three or more.

The electrodes 3b, 3c, 4b, 4c of the two electronic components (film capacitors 3, 4 or film capacitor 4, plate coil 42) are connected to separate metal terminals 12, 13, 14, 15. , But is not limited to this. For example, in the hybrid integrated circuit device 1 shown in FIGS. 1 and 2, the metal terminals 12 and 14 are deleted and the electrodes 3 b and 2 b of the two film capacitors 3 and 4 are removed.
4b may be directly connected using a conductive adhesive. In this case, a series circuit of the film capacitor 3 and the film capacitor 4 can be configured. Similarly, the metal terminals 12 and 13 may be omitted, and the metal terminals 14 may be connected to the electrodes 3b and 4b of the film capacitors 3 and 4, and the metal terminal 15 may be connected to the electrodes 3c and 4c of the film capacitors 3 and 4. In this case, a parallel circuit of the film capacitor 3 and the film capacitor 4 can be configured.

In the first and third embodiments, a part of the package is formed by stacking the plate-shaped film capacitors 3, 4, 33 or the plate-type coil 42, but as follows. Is also good. Specifically, a plurality of electronic components (capacitors or coils) are integrally formed in a plate shape, thereby constituting a part of a package. Even in this case, a space for disposing a plurality of electronic components in the package becomes unnecessary. Therefore, the size of the product can be reduced, and the material cost of the package material can be reduced. As a result, at low cost,
A hybrid integrated circuit device capable of high-density mounting can be provided. Further, each electronic component can be connected inside a member integrally formed in a plate shape.

The hybrid integrated circuit devices 1, 31, 41 may be embodied as components of an ignition device other than the engine controller. Of course, the present invention may be embodied in products other than automobile parts.

The plate-type coil 42 does not necessarily need to be used as a part of the package of the hybrid integrated circuit devices 1, 31, 41. For example, the plate-type coil 42 is mounted on a circuit board in the same manner as ordinary electronic components. Is also good.

[Brief description of the drawings]

FIG. 1 is a plan view of a hybrid integrated circuit device according to a first embodiment.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a sectional view showing a hybrid integrated circuit device according to a second embodiment.

FIG. 4 is a sectional view showing a hybrid integrated circuit device according to a third embodiment.

FIG. 5 is a perspective view of a plate-type coil.

FIG. 6 is a plan view of a plate-type coil.

FIG. 7 is a sectional view taken along line BB of FIG. 6;

FIG. 8 is a plan view of another plate-type coil.

FIG. 9 is a sectional view showing a conventional hybrid integrated circuit device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Hybrid integrated circuit device, 2 ... IC, 3, 4 ... Film capacitor, 5 ... Package, 31 ... Hybrid integrated circuit device
32: Package, 33: Film capacitor, 41 ...
Hybrid integrated circuit device, 42: plate-type coil, 45: ceramic substrate as plate-shaped member, 45a: core portion, 46: conductor pattern, 47a, 47b: through hole, 52: ceramic substrate as plate-shaped member, 5
2a: core part, 53: conductor pattern, 54a, 54b ...
Through holes, L1, L2 ... straight lines.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01G 4/40 H01G 4/40 A F term (Reference) 5E070 AA01 AA05 AB01 BA11 BA14 BB01 CB06 CB13 CB17 DA01 DA11 DB02 DB08 EA01 EA02 EB03 5E082 AA01 AB03 BB10 BC39 DD08 DD09 DD11 EE24 FG36 GG08 HH02 HH06 HH11

Claims (7)

[Claims] 1. A hybrid integrated circuit device in which various electronic components are arranged in a package, wherein a part of the package is constituted by plate-shaped electronic components. 2. A hybrid integrated circuit device in which various electronic components are arranged in a package, wherein a part of the package is constituted by a plurality of electronic components integrally formed in a plate shape. 3. The hybrid integrated circuit device according to claim 1, wherein the electronic component forms a lid or a bottom plate of a package. 4. The hybrid integrated circuit device according to claim 2, wherein a lid or a bottom plate of a package is constituted by the plurality of electronic components integrally formed in a plate shape. 5. The hybrid integrated circuit device according to claim 1, wherein said electronic component is a capacitor or a coil. 6. A plate-shaped member made of a ferromagnetic material and having a plurality of through-holes, extending on both front and back surfaces of the plate-shaped member and inside the through-hole, and forming a part of the plate-shaped member in a spiral shape. A plate type coil comprising: a conductor pattern to be wound. 7. The plate-type coil according to claim 6, wherein the through-holes are arranged on concentric circles having different radii to form an annular core portion.