JP2001118519A - Plasma display panel and method for manufacturing therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plasma display panel which enables easy uniform coating formation of a desired thickness in a surface at once and which allows high quality display at a low cost, and manufacturing method therefore. SOLUTION: A uniform coating formation of desired thickness in a surface is easily achieved at once by containing at least one of a thermosetting material and photosetting material in various kinds of thick-layer member.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel used for a display device or the like and a method of manufacturing the same, particularly to a process of forming a thick film.

[0002]

2. Description of the Related Art In recent years, a plasma display panel, which has attracted attention as a thin display device, has, for example, a configuration shown in FIG. The plasma display panel includes a front substrate 300 arranged opposite to each other.
And a back substrate 301. On the front substrate 300, display electrodes 302 and 303, a dielectric layer 304, and an MgO dielectric protection layer 305 are formed in this order.
An address electrode 306 and a dielectric layer 307 are formed on the rear substrate 301, and a partition 308 is further formed thereon. Then, a phosphor layer 309 is applied to a side surface of the partition wall 308.

[0003] Actually, the front substrate 300 and the rear substrate 3
01 is an address electrode 306 and display electrodes 302 and 3
Reference numerals 03 are arranged in a state where they are opposed to each other so that their longitudinal directions are orthogonal to each other. However, in FIG. 1, for convenience, the front substrate is shown rotated by 90 ° with respect to the rear substrate.

A discharge gas 310 (for example, a mixed gas of Ne—Xe) is provided between the front substrate 300 and the rear substrate 301.
Is sealed at a pressure of 500 Torr to 600 Torr. The discharge gas 310 is supplied to the display electrodes 302 and 30.
By generating an ultraviolet ray by discharging between the three layers and irradiating the ultraviolet ray to the phosphor layer 309, an image display including a color display can be performed.

For example, the partition 302 is a partition for forming a discharge cell by forming a minute discharge space for each color (R, G, B) of each pixel. Control can be performed for each cell, and erroneous discharge and erroneous display can be prevented. The size of the partition wall 308 is
Typically, in a 40-inch NTSC panel, the partition pitch is 360 μm per color, and the width of the partition top is 50 to 50 μm.
100 μm, and the height of the partition walls is 100 to 150 μm.

[0006] As a conventional partition wall forming method, first, a printing method of forming a partition wall using a screen printing technique,
After applying a photosensitive film layer on the applied partition material after applying the partition material to the front surface of the rear substrate, forming a predetermined pattern by a photographic method, and removing unnecessary portions of the partition material by sandblasting to obtain a photosensitive film. Peel off the film layer,
Thirdly, a sand blast method for forming a partition, and thirdly, a photo paste method for forming a partition by removing unnecessary portions by a photographic method after applying a photosensitive paste, and the like.

[0007]

However, each of these partition wall forming methods has its own problems. In particular, the partition wall material is applied on the dielectric layer 307 formed on the rear substrate 301 to form the partition wall. In this case, a desired thickness is formed uniformly and in-plane at a time for the purpose of cost reduction from a conventional method of coating and forming by a large number of repetitions.
The thickness of 300 μm) causes problems such as cracks and wrinkles in the coating film during drying in the drying step immediately after coating.

The same applies to the case where the dielectric layer 304 is formed on the front plate 300.

An object of the present invention is to provide a plasma display panel capable of forming a high-quality and high-precision thick film at low cost and enabling high-quality display. With the goal.

[0010]

The present invention is characterized in that the thick film formed on the substrate is a thick film material containing at least one of a photocurable and / or thermosetting material. .

In one embodiment, a pair of substrates includes:
An electrode, a protective layer, and a phosphor layer disposed between the pair of substrates, wherein the thick film is disposed between the pair of substrates, and the discharge space includes a gas. A medium is sealed, and ultraviolet light generated by the discharge of the gas medium is converted into visible light when the phosphor layer is irradiated, thereby emitting light.

The main composition of the material of the thick film is glass containing at least lead, glass not containing lead, an organic resin material, or an inorganic material such as alumina or silica. I do. Alternatively, chromium oxide or titanium oxide may be contained as a pigment component of the thick film coating material.

Further, the photo-curable and thermo-curable materials may be removed in the firing step.

[0014]

(First Embodiment) FIG. 2 is a partial sectional perspective view showing a main structure of an AC surface discharge type PDP according to an embodiment. In the drawing, the z direction corresponds to the thickness direction of the PDP, and the xy plane corresponds to a plane parallel to the PDP surface. As shown in the figure, the present PDP includes a front plate 101 and a rear plate 201 arranged with their main surfaces facing each other.

Front plate glass 1 serving as a substrate of front plate 101
02, a plurality of pairs of transparent electrodes 103 are arranged on one side thereof with the x direction as a longitudinal direction. Further, the transparent electrode 103
A bus electrode 104, which is sufficiently narrower than the transparent electrode 103 and has excellent conductivity, is laminated thereon. This transparent electrode 10
3 and the bus electrode 104 are subjected to surface discharge and the display electrode 107
Works as The front glass plate 102 on which the display electrodes 107 are disposed has a dielectric layer 1 over the entire glass surface.
The protective layer 106 is coated on the dielectric layer 105.

Back plate glass 2 serving as substrate of back plate 201
02, a plurality of address electrodes 203 are arranged on one side thereof in a stripe shape with the y-direction as a longitudinal direction, and a dielectric layer 204 is formed on the back plate glass 20 on which the address electrodes 203 are arranged.
2 is coated over the entire surface. This dielectric layer 204
On the upper side, a partition wall 205 is provided in accordance with the interval between the adjacent address electrodes 203. A phosphor layer 207 corresponding to one of RGB is formed on the surface of the adjacent partition wall 205 and the dielectric layer 204 therebetween.

The entire surface plate 101 and the rear surface plate 201 having such a configuration are arranged so that the longitudinal directions of the address electrode 203 and the display electrode 107 are opposed to each other so as to be orthogonal to each other. The peripheral part is adhered and sealed with sealing glass. A discharge gas (filled gas) composed of a rare gas component such as He, Xe, or Ne is filled between the double-sided plates 101 and 201 at a pressure of about 500 to 600 Torr. As a result, the adjacent partition 205
The space formed therebetween is a discharge space 208, and a region where a pair of adjacent display electrodes 107 and one address electrode 203 intersect with the discharge space 208 interposed therebetween is a cell for image display.

At the time of driving the PDP, in each cell, the address electrode 203 and the display electrode 107, and the pair of display electrodes 1
07 generate short-wavelength ultraviolet rays (wavelength of about 14).
7 nm), the phosphor layer 207 emits light, and an image is displayed. Here, the main feature of the PDP of the present invention and the method of manufacturing the PDP relates to at least the formation of the partition wall 205 and the dielectric layer 105.

Next, a method of manufacturing the present PDP will be specifically described.

(Preparation of Front Plate 101) Thickness: about 2.8 mm
A transparent electrode 103 having a thickness of about 3000 Å is formed in parallel with a conductive material such as ITO (Indium Tin Oxide) or SnO ₂ on the surface of a front plate glass 102 made of soda glass. Further, a bus electrode 104 composed of three layers of silver or chromium-copper-chromium is laminated on the transparent electrode 103 to form a display electrode 107. Known methods such as a screen printing method and a photolithography method can be applied to these electrodes.

Next, a lead-based glass paste is coated on the entire surface of the front glass plate 102 on which the display electrodes 107 have been formed, and baked to form a dielectric layer 1 having a thickness of about 20 to 30 μm.
05 is formed. Then, a protective film 106 made of magnesium oxide (MgO) having a thickness of about 1 μm is formed on the surface of the dielectric layer 105 by a vapor deposition method or a CVD method.

Thus, the front plate 101 is completed.

(Preparation of Back Plate 201) Thickness of about 2.6 mm
A conductive material containing silver as a main component is applied in a stripe pattern at regular intervals on the surface of a back plate glass 202 made of soda glass by a screen printing method.
An address electrode 203 of 0 μm is formed. In order to make the PDP manufactured here a 40-inch class high-definition television, the interval between two adjacent address electrodes 203 is set to about 0.2 mm or less.

Subsequently, a lead-based glass paste is coated and baked over the entire surface of the rear glass plate 202 on which the address electrodes 203 are formed, thereby forming a dielectric layer 204 having a thickness of about 20 to 30 μm.

The following steps include the features of the manufacturing method of the present invention. Here, the steps are (a) a first step: a partition film coating forming step, (b) a second step: a partition film drying step, (c) a third step: a photosensitive coating film pattern forming step, and (d) a step Four steps: a blasting step; and (e) a fifth step: a step of removing the photosensitive coating film will be sequentially described. 3 (a), (b), (c), (d), and (e) are panel cross-sectional views showing states of a first step, a second step, a third step, and a fourth step, respectively.

(A) First step: coating and forming step of a partition wall film A material which is hardened by heating is added to a paste mainly composed of the same lead-based glass material as the dielectric 402 and an inorganic material such as alumina as an aggregate. Is prepared. The paste is uniformly formed on the dielectric layer 402 by a die coating method or the like which can apply a thickness of about 200 to 300 μm at a time to form a partition film 404.

(B) Second step: partition wall film drying step After forming the partition wall film 404 on the substrate 403 as described above, the substrate is dried and hardened by placing the substrate on a hot plate 405 at about 130 ° C. Let it. Regarding the substrate heating method at this time, a uniform dried and cured state can be obtained even in an infrared (IR) furnace, a hot blast furnace, or the like. The drying temperature varies depending on the thermosetting material added to the paste.

(C) Third Step: Photosensitive Coating Film Pattern Forming Step A photosensitive coating film 406 is formed on the substrate 403 on which the partition wall film has been formed as described above. In the present embodiment, a photosensitive dry film resist (hereinafter, referred to as DFR) is used as the photosensitive coating film 406, and a 50 μm thick D
The FR is laminated.

Next, exposure is performed by irradiating ultraviolet light (UV light) using a photomask having a predetermined width and pitch. The exposure amount is optimized according to the pattern width and pitch of the photomask.

Next, development is performed using a developing solution of a 1% aqueous solution of sodium carbonate, and washing is performed immediately after development. After exposure and development, a groove (opening portion) 407 having a predetermined pattern in a stripe shape is formed in the DFR 106. The size of the groove 407 is typically such that the upper opening width is 80 μm and the pitch is 360 μm.

(D) Fourth Step: Blasting Step After forming the pattern of the groove 407, sand blasting is performed from above the substrate 403.
8 to change the abrasive (eg, glass bead material) 409 to Air
Flow rate 1500NL / min, abrasive supply 1500g /
The blast processing of the partition film 404 exposed on the groove 407 is performed on the substrate 403 under the condition of min. Note that, typically, the blasting is performed until all the partition film 404 in the groove 407 is removed by blasting to form the groove 410 (opening).

(E) Fifth Step: Stripping of Photosensitive Coating Film After forming the groove 410, the substrate 403 is stripped with a stripping solution, for example, 5
% Sodium hydroxide aqueous solution, D
The FR 406 is peeled off. As a result, a partition 411 having a predetermined shape is formed.

After the peeling and removal of the photosensitive skin film 406 is completed, the partition walls 411 are fired by using a firing furnace having a profile formed so that the peak temperature becomes about 550 ° C. Form. In this firing, the thermosetting material may be removed.

In the above manner, a desired thickness is formed uniformly and in-plane at a time (film thickness of 200 to 300 μm immediately after coating).
m), in the drying step immediately after coating, the partition walls can be easily formed without generating cracks or wrinkles in the coating film during drying. The same applies to the dielectric layer of the front plate.

[0035]

As described above, according to the present invention, by adding at least either a thermosetting material or a photocurable material to various thick film materials in a plasma display panel, high quality and high precision can be achieved at low cost. Since a thick film can be formed, it is possible to realize a plasma display panel that enables high-quality display at low cost.

[Brief description of the drawings]

FIG. 1 is a diagram schematically showing a configuration of a plasma display panel.

FIG. 2 is a partial cross-sectional perspective view showing a main configuration of an AC surface discharge type plasma display panel.

FIGS. 3A to 3E are cross-sectional views illustrating each step of a partition wall forming process using a thick film material according to an embodiment of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 101 front plate 102 front plate glass 103 transparent electrode 104 bus electrode 106 protective layer 107 display electrode 201 back plate 202 back plate glass 203 address electrode 204 dielectric layer 205 partition 206 partition top 207 phosphor layer 300 front substrate 301 rear substrate 302, 303 display Electrode 304 Dielectric layer 305 Dielectric protection layer 306 Address electrode 307 Dielectric layer 308 Partition 309 Phosphor layer 310 Discharge gas 400 Glass substrate 401 Address electrode 402 Dielectric layer 403 Substrate 404 Partition wall 405 Hot plate 406 Photosensitive coating 407 Groove 408 Blast nozzle 409 Abrasive 410 Groove 411 Partition

Continued on the front page (72) Inventor Hideki Ashida 1006 Kazuma Kadoma, Kazuma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. 5C027 AA05 AA09 5C040 FA01 FA04 GB03 GB14 GD07 GD09 GF02 GF18 GF19 JA17 JA28 KA10 KA11 KA15 KA16 MA23 MA25 MA26

Claims (28)

[Claims] 1. A plasma display panel having a thick film formed on a substrate, wherein the material of the thick film contains at least a photocurable material. 2. A plasma display panel having a thick film formed on a substrate, wherein the material of the thick film contains at least a thermosetting material. 3. A plasma display panel having a thick film formed on a substrate, wherein the material of the thick film contains at least a photocurable material and a thermosetting material. 4. The plasma display panel according to claim 1, wherein the material of the thick film is cured by ultraviolet rays. 5. The plasma display panel according to claim 2, wherein the material of the thick film is cured at room temperature or higher. 6. The semiconductor device further comprises a pair of substrates, an electrode disposed between the pair of substrates, a protective layer and a phosphor layer, wherein the thick film is provided between the pair of substrates. A gas medium is sealed in the discharge space, and ultraviolet light generated by the discharge of the gas medium is converted into visible light when irradiating the phosphor layer, thereby emitting light. The plasma display panel according to any one of claims 1 to 5, wherein: 7. The main composition of the material of the thick film is glass containing at least lead.
4. The plasma display panel according to any one of items 1 to 3. 8. The plasma display panel according to claim 1, wherein a main composition of the material of the thick film is glass containing no lead. 9. The plasma display panel according to claim 1, wherein a main composition of the material of the thick film includes at least an organic resin. 10. The plasma display panel according to claim 1, wherein a main composition of the material of the thick film includes at least alumina. 11. The plasma display panel according to claim 1, wherein a main composition of the material of the thick film contains at least silica. 12. The plasma display panel according to claim 1, wherein the material of the thick film includes chromium oxide or titanium oxide. 13. The plasma display panel according to claim 1, wherein the photocurable material is removed in a subsequent thick film baking step. 14. The plasma display panel according to claim 2, wherein the thermosetting material is removed in a subsequent thick film baking step. 15. The plasma display panel according to claim 3, wherein the photocurable material and the thermosetting material are removed in a subsequent thick film baking step. 16. A method of manufacturing a plasma display panel in which a thick film is formed on a substrate, wherein the material of the thick film includes at least a photocurable material, and includes a thick film forming step. Display panel manufacturing method. 17. A method for manufacturing a plasma display panel in which a thick film is formed on a substrate, wherein the material of the thick film includes at least a thermosetting material, and includes a thick film forming step. Display panel manufacturing method. 18. A method for manufacturing a plasma display panel in which a thick film is formed on a substrate, wherein the material of the thick film including the step of forming a thick film includes at least a photocurable and a thermosetting material. A method for manufacturing a plasma display panel, comprising the step of forming a thick film. 19. The thick film forming step includes at least one of a step of forming a dielectric layer on a substrate and a step of forming a partition layer into a predetermined pattern. 19. The method for manufacturing a plasma display panel according to any one of 16 to 18. 20. The method of manufacturing a plasma display panel according to claim 16, wherein a main composition of the material of the thick film is a glass containing at least lead. 21. The method of manufacturing a plasma display panel according to claim 16, wherein a main composition of the material of the thick film is glass containing no lead. 22. The method according to claim 16, wherein the main composition of the material of the thick film contains at least an organic resin.
9. The method for manufacturing a plasma display panel according to any one of items 8. 23. The method according to claim 16, wherein the main composition of the material of the thick film contains at least alumina.
9. The method for manufacturing a plasma display panel according to any one of items 8. 24. The method according to claim 16, wherein the main composition of the thick film material contains at least silica.
The method for manufacturing a plasma display panel according to any one of the above. 25. The method according to claim 16, wherein the material of the thick film includes chromium oxide or titanium oxide. 26. The method according to claim 16, wherein the photocurable material is removed in a subsequent thick film baking step. 27. The method according to claim 17, wherein the thermosetting material is removed in a subsequent thick film baking step. 28. The method according to claim 18, wherein the photocurable and thermosetting materials are removed in a subsequent thick film baking step.