JP2000067742A - Barrier wall forming method for gas discharge panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a highly accurate barrier wall without generating chips or break-away, in a bulkhead forming method for a gas discharge panel. SOLUTION: In forming a bulkhead 22 for partitioning a discharge space of a gas discharge panel using sand-blast, the bulkhead is formed in a set of processes including a process in which a bulkhead material layer 22a is arranged on a glass substrate 11, which includes a glass material having a softening point lower than a given baking temperature for burning a sand-blast mask by heating and a glass material having a softening point higher than the baking the temperature, and a process in which the mask 30 made of a resist layer having a given pattern of opening is formed on the bulkhead material layer 22a, a sand-blast process is performed via the mask 30, and then the bulkhead material layer 22a and the mask 30 are simultaneously heated to burn the mask 30.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a gas discharge panel, and more particularly, to a surface discharge type plasma display panel (Plasma Display Panel).
1, hereinafter abbreviated as PDP).

2. Description of the Related Art Surface discharge type PDPs are increasingly used in the field of computer terminals and television image devices as thin full-color display devices, and there is a demand for higher definition in the market.

[0003]

2. Description of the Related Art FIG. 4 is an exploded perspective view showing a general surface discharge type PDP, and emits one of three primary colors, red (R), green (G) and blue (B), displayed in a matrix. The basic structure of a portion corresponding to one pixel dot EG including a unit light emitting area EU and three unit light emitting areas is shown.

In the surface discharge type PDP 9 shown in FIG.
On the inner surface of the transparent glass substrate 18 on the display surface side, a pair of display electrodes formed by laminating a transparent electrode 19 such as an ITO film or a Nesa film and a bus electrode 20 made of a metal layer for reducing its resistance. X and Y are provided, and a transparent dielectric layer 17 and a protective film 16 made of MgO are further provided.

On the other hand, on the inner surface of the glass substrate 11 on the back side, address electrodes A are arranged at regular intervals on the electrode underlayer 12 at right angles to the display electrodes X and Y, and are covered with a dielectric layer 13. I have. A plurality of stripe-shaped partitions 14 are provided on the dielectric layer 13 at a substantially intermediate position between the adjacent address electrodes and in parallel with the address electrodes. Discharge space 21 consisting of surface
Are provided with phosphor layers 15B, 15R, and 15G, and emit light when excited by ultraviolet rays emitted at the time of surface discharge between the display electrodes X and Y.

In the surface discharge type PDP 9 having the above structure, each unit light emitting area EU is divided for each scanning line by the display electrodes X and Y, and in the line direction (extending direction of the display electrodes X and Y) by the partition wall 14 and the like. It is divided into intervals. Further, in each unit light emitting region EU, a surface discharge between the display electrodes X and Y is selected to be displayed or non-display by a discharge between the address electrode A and the display electrode Y, and a phosphor continuous in the extending direction of the address electrode A is selected. A portion corresponding to the unit light emitting region EU among the layers 15B, 15R, and 15G can selectively emit light. Thus, a combination of red (R), green (G), and blue (B), which emit light in a line direction, can be selected to perform a full-color display of a surface discharge type PDP.

As a general method of manufacturing the partition wall 14, 3
Two methods are known. The first method is a method in which a paste-form partition material is screen-printed on a substrate to form a partition material layer in a predetermined shape, and then baking is performed to form the partition. In this method, the thickness of the partition wall material layer obtained by one screen printing is about 20 μm (after drying), and it is necessary to repeat printing several times to form the partition wall material layer of a predetermined thickness. . In addition, in the second and subsequent printings, the print mask alignment is performed on the surface having irregularities due to the previous printing. Therefore, when forming a partition material layer having a small partition wall width and a small width, the print mask alignment accuracy is limited. In addition, there is a problem that productivity is low and cost is high.

In a second method, a photosensitive resist layer is formed on a partition material layer previously formed on a substrate, and a mask for sandblasting having an opening corresponding to the shape of the partition is formed by mask exposure and development processing. After sandblasting is performed through the mask to grind and remove the partition material layer other than the partition portion, the sandblast mask is removed by spraying a stripping solution composed of an alkaline aqueous solution, and the partition material layer is baked to form the partition. Method (for example, see
0-69851).

In a third method, a photosensitive resist layer formed on a substrate is patterned to form an opening corresponding to the shape of a partition, and the opening is filled with a partition material to form a partition material layer. Thereafter, the photosensitive resist is removed using an alkaline stripper, and the partition wall material layer is baked to form partition walls (see, for example, JP-A-5-234514).

[0010]

The method of forming partitions by sandblasting is widely applied to PDPs having a partition width of about 90 μm or more.
It has been found that the following problem occurs in the step of peeling off the mask layer when manufacturing a high-definition partition wall of a degree or less.

The mask for sandblasting is formed by pattern exposure and development of the photosensitive resist layer as described above, and after the sandblasting is completed, the mask is removed by a wet stripping method such as spraying a stripping solution composed of an alkaline aqueous solution. .

However, when the width of the sandblasting mask is reduced due to higher definition, when the resist is stripped by a usual wet method, the stripping liquid penetrates into the partition material layer and the strength of the partition material layer is reduced. Defects such as chipping and peeling occur.

In order to solve the problem caused by the wet peeling of the resist layer as described above, in the baking step of the partition material layer, a method of removing the sand blast mask by heating is considered. In the case, the binder resin contained in the partition wall material is vaporized and disappears before the sand blast mask is burned out in the temperature rising process in the firing step, so that the strength of the partition wall material is weakened and is fixed to the partition wall material layer. Under the influence of the thermal deformation of the sandblasting mask, cracks or chips are generated in the partition walls.

On the other hand, such a problem of cracking or chipping similarly occurs in the above-described third method. The present invention has been made in view of the above-described problem, and has as its object to form a high-precision partition wall so that chipping or peeling does not occur.

[0015]

According to a first aspect of the present invention, when a partition for dividing a discharge space of a gas discharge panel is formed by using sandblast, a predetermined mask for burning and burning a sandblast mask on a substrate by heating. A step of disposing a partition material layer including a glass material having a softening point lower than the firing temperature and a glass material having a softening point higher than the firing temperature; and forming a resist layer on the partition material layer. Post-patterning, forming a mask having an opening of a predetermined pattern, and after performing sandblasting through the mask, heating the partition material layer and the mask simultaneously to burn off the mask; and It is characterized by including.

According to a second aspect of the present invention, in forming a partition for partitioning a discharge space of a gas discharge panel, a resist layer is formed on a substrate with a thickness corresponding to the height of the partition, and then patterning is performed. Performing, in the resist layer, a step of forming an opening corresponding to the shape of the partition wall, a glass material having a softening point lower than a predetermined firing temperature for burning out the resist layer by heating, and a temperature higher than the firing temperature. A step of filling the opening with a partition material containing a glass material having a high softening point; and simultaneously heating the filled partition material and the resist layer to burn out the resist layer. It is characterized by.

As described above, in the method of forming the partition wall of the gas discharge panel according to the present invention, the partition wall material contains a glass material having a softening point lower than the temperature at which the resist layer is burned off by heating. When heated and burned simultaneously with the material, the weakening of the partition wall material due to the vaporization of the binder resin contained in the partition wall material is reinforced by the melting of the glass material having a low softening point, and the partition wall due to the thermal deformation of the resist layer is formed. It is possible to form such that chipping or peeling does not occur.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A gas discharge panel 10 shown in FIG.
Is a surface discharge type PDP called a reflection type having a three-electrode structure, and a transparent glass substrate 18 and a transparent electrode 19 on the display surface side.
Display electrodes X and Y, on which a bus electrode 20 made of a metal layer having a small width is superimposed, a light-transmitting dielectric layer 17, a protective film 16 made of MgO, a rear glass substrate 11, a display electrode X, The partition wall 22 which partitions the address electrode A, the dielectric layer 13 and the discharge space 21 arranged orthogonally to Y and defines the discharge gap between the glass substrate 11 on the back side and the transparent glass substrate 18 on the display surface side. , And phosphor layers 15B, 15R, 15
G.

The barrier ribs 22 are provided on the dielectric layer 13 substantially in the middle between the address electrodes in parallel with the address electrodes. The width of the barrier ribs is about 50 μm, and the pitch between the barrier ribs is about 130 μm to 360 μm. , Thereby defining the unit light emitting area EU.

FIG. 1 is a diagram showing a process of the first embodiment, FIG. 2 is a diagram showing a process of the second embodiment, and FIG. 3 is a diagram showing a temperature profile in a firing process. As shown in FIG. 1 showing the process of the first embodiment, the address electrode A and the dielectric layer 13 are sequentially formed on the glass substrate 11 on the back side of the gas discharge panel 10 by a common process such as thick film printing. After that, the partition 22 is formed by the following steps using sandblasting. First, DuPont containing a glass material having a softening point lower than the firing temperature at which the sandblast mask is burned out and a glass material having a softening point higher than the firing temperature on the address electrode side surface of the glass substrate 11 on the back side. SB
The temperature of the TOS partition material sheet is 100 to 105 ° C. using a hot roll laminator, and the pressing pressure is 2 to 5 kg / c.
Thermocompression bonding is performed at m ² to form a partition wall material layer 22a having a thickness of about 100 to 150 μm, and then pre-baked at 350 to 500 ° C. (Step A).

When a paste-like partition material is used, a glass paste containing LS-0118 glass frit manufactured by Nippon Electric Glass Co., Ltd. is prepared and screen-printed using a metal mask to a thickness of 100 to 150 μm. Is formed. The glass paste contains a glass material which is lower than a temperature of about 480 ° C at which the sandblast mask is completely burned off and starts to soften at a temperature of about 300 to 400 ° C at which the binder resin contained in the partition wall material is burned down.

Next, a photosensitive resist film 30a having a thickness of about 30 .mu.m is applied to the surface of the partition wall material layer 22a at a temperature of about 105.degree.
Attach it at kg / cm ² and perform conventional pattern exposure and development to form a sandblasting mask 30 (steps BC).

Next, Si having an average particle size of 10 to 30 μm
C or glass beads, etc. injection amount 50-400g / mi
n, after sandblasting under the condition of the processing pressure of about 0.5 to 5 kg / cm ² (step D), the sandblasting mask 30 and the partition wall material layer 22a are simultaneously fired under the conditions of the temperature profile shown in FIG. 22 is formed.

In FIG. 3, point A (about 200 ° C.)
Is the point at which the binder resin contained in the partition wall material starts to burn off. As the binder resin burns down, the adhesion between the partition wall materials decreases and the brittleness of the partition wall material layer increases. As the temperature further rises, the binder resin gradually burns off and completely burns off at point C (about 400 ° C.). Point B is a temperature (320 to 350 ° C.) at which the glass material having a low softening point contained in the partition wall material starts to soften, and is further heated to about 40 ° C.
When the temperature reaches around 0 ° C., thermal deformation of the sand blast mask that causes the defect of the partition wall occurs. However, since a part of the glass material is already melted at the point B, the defect of the partition wall material layer can be prevented. .

When the temperature further rises and reaches a temperature near point D (about 480 ° C.), the sandblasting mask is completely burned out. When the temperature reaches point E exceeding 500 ° C., the glass material having a higher softening point is obtained. Is softened to strengthen the bond between the fillers in the partition wall material to form a partition wall having high strength.

Next, a second embodiment of the method for forming the partition walls of the gas discharge panel 10 will be described with reference to FIG. On the surface of the dielectric layer 13 covering the address electrodes of the glass substrate 11 on the back side,
Photosensitive resist film 30 having a thickness of about 30 to 50 μm
a at a temperature of about 100 to 1 using a hot roll laminator
Attach a plurality of layers at a temperature of 05 ° C. and a pressure of about 2 to 5 kg / cm ² , and adjust the total thickness to about 100 corresponding to the height of the partition material layer.
Then, a conventional pattern exposure and development treatment is performed to form an opening member 30 having an opening for filling the partition wall material (steps B to C).

Next, LS-0118 manufactured by NEC Corporation
A glass paste containing a glass frit is prepared, and the opening is completely filled by printing (step D). The glass paste contains a glass material which is lower than a temperature of about 480 ° C. at which the resist film is completely burned off and starts to soften at a temperature of about 300 to 400 ° C. at which the binder resin contained in the partition wall material is burned out.

Next, the opening member 30 and the partition wall material layer 22a are simultaneously heated under the conditions of the temperature profile illustrated in FIG. 3 to burn out the opening member and form the partition wall 22. The glass substrate 11 on the back side of the gas discharge panel 10 on which the partition walls are formed as described above is provided with predetermined components by a common process, and is opposed to the separately manufactured transparent glass substrate 18 on the display surface side via the partition walls 22. After disposing and hermetically sealing the peripheral portion of the substrate by fusing using a low melting point glass, the discharge space 21 is formed.
Is degassed and evacuated, and a gas discharge panel is manufactured through a series of steps of filling a discharge gas.

In this embodiment, the method of forming the partition used for the AC type surface discharge PDP shown in FIGS. 4 and 5 has been described. However, the present invention is limited to such an AC type surface discharge PDP. It is not something to be done. That is, DC
The present invention can be similarly applied to the formation of barrier ribs used in various types of gas discharge panels including PDPs of the discharge type, PDPs of the opposed discharge type, and the plasma addressed display device disclosed in, for example, JP-A-10-96901. is there.

[0030]

As described above in detail, according to the present invention, a high-definition, large-screen gas discharge panel having high-precision partition walls can be easily manufactured.

[Brief description of the drawings]

FIG. 1 is a view showing a process of a first embodiment.

FIG. 2 is a view showing a process of a second embodiment.

FIG. 3 is a diagram showing a temperature profile in a firing step.

FIG. 4 is an exploded perspective view showing a general surface discharge type PDP.

FIG. 5 is a cross-sectional view illustrating a main structure of a gas discharge panel.

[Explanation of symbols]

 Reference Signs List 9 surface discharge type PDP 10 gas discharge panel 11 glass substrate 22a partition material layer 14, 22 partition 15R, 15G, 15B, phosphor layer 30 sandblast mask, opening member

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Keiichi Bessai 4-1-1, Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa F-term in Fujitsu Limited (reference) 2H096 AA30 CA05 HA30 5C027 AA09 5C040 AA04 DD09 5C094 AA05 AA43 AA44 BA31 CA19 CA24 DA13 EA05 EB02 EC04 FA01 FA02 FB15 GB10

Claims (2)

[Claims] When a partition wall for partitioning a discharge space of a gas discharge panel is formed by using sandblast, a glass material having a softening point lower than a predetermined firing temperature at which a sandblast mask is burned off by heating is formed on a substrate. Disposing a partition material layer containing a glass material having a softening point higher than the firing temperature; and forming a resist layer on the partition material layer, performing patterning, and forming a mask having an opening of a predetermined pattern. And performing a sandblasting process through the mask, and then simultaneously heating the partition material layer and the mask to burn off the mask. Forming method. 2. A method for forming a partition for partitioning a discharge space of a gas discharge panel, comprising: forming a resist layer on a substrate with a thickness corresponding to the height of the partition, and then performing patterning; Forming an opening corresponding to the shape of the partition wall, a glass material having a softening point lower than a predetermined firing temperature for burning off the resist layer by heating, and a glass material having a softening point higher than the firing temperature A step of filling the opening with a partition material containing: and simultaneously heating the filled partition material and the resist layer to burn out the resist layer. Partition wall forming method.