JP2001110876A - Device and method for plasma treatment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and method for plasma treatment by which a substrate can be treated with plasma by surely clamping the substrate to an electrode in a state where the risk of abnormal discharge is low. SOLUTION: A plasma treatment device has a clamping mechanism 20 which is attached to the internal surface of a cap member forming a treatment chamber and clamp a substrate to an electrode being in contact with the substrate. The retaining mechanism 20 is provided with a substrate clamping unit 22 equipped with a contacting section 27 being in contact with the edge section of the substrate and substrate clamping pins 24 being in contact with the central part of the substrate in spots and are hung down in the inside of the cap member 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma processing apparatus for performing a plasma process on a workpiece.

2. Description of the Related Art In a plasma processing apparatus, processing is performed by placing a work such as a substrate on an electrode in a closed space and generating a discharge under reduced pressure. Since the discharge is accompanied by heat generation, the temperature of the processing target increases in the process of continuing the vacuum processing. When the work is a thin substrate or the like whose thickness is relatively small with respect to the plane size, the work is warped due to a rise in temperature, and the substrate is easily lifted from the upper surface of the electrode in the process. If a gap is formed between the substrate and the electrode surface due to the lifting, a local discharge is generated in the gap, thereby preventing uniform processing. For this reason, when a thin substrate is used as an object, means for pressing the substrate against the electrode so that no gap is formed between the substrate and the electrode is required. In a conventional vacuum processing apparatus, a pressing member for pressing a substrate against an electrode is provided in a vacuum processing chamber,
A pressing mechanism for driving the pressing member has been provided. This pressing mechanism needs to connect the pressing member inside the processing chamber and the drive unit outside the processing chamber by a rod penetrating the side wall or bottom surface of the chamber constituting the processing chamber.

However, the conventional holding mechanism requires a sealing portion for sealing the gap at a position where the rod penetrates through the processing chamber, which complicates the structure and increases the cost of the apparatus. It was an inviting factor. Further, the conventional pressing mechanism can press the edge of the substrate, but it is extremely difficult to press the center of the substrate. To explain the reason, a structure that connects the above-mentioned rod with a holding member that holds down the central portion of the substrate,
The substrate will be mounted in an overhanging direction from the edge to the center of the substrate.However, if plasma discharge is performed, abnormal discharge will occur between this overhanging structure and the electrode, making plasma processing impossible. Because it becomes. However, since the central portion of the substrate is liable to float, a mechanism for holding down the substrate, which is unlikely to cause abnormal discharge, has been desired. Therefore, an object of the present invention is to provide a plasma processing apparatus and a plasma processing method which have a simple structure, are unlikely to cause abnormal discharge, and can reliably hold down a substrate.

According to a first aspect of the present invention, there is provided a plasma processing apparatus, comprising: a lid member which is in close contact with a base portion to form a processing chamber which is a closed space; An electrode on which a target work is placed, and a work holder which is attached to the inside of the lid member and abuts against the work on the electrode in a state where the lid member is in close contact with the base portion and presses against the electrode. Work holding,
A first contact member attached to the inside of the lid member in a suspended state and abutting against the edge of the work; and a second contact member attached to the inside of the lid member in a suspended state and abutting on the central portion of the work.
And at least two types of contact members. The plasma processing apparatus according to claim 2 is the plasma processing apparatus according to claim 1, wherein the first contact member is
Contact the work in a linear or elongated surface. According to a third aspect of the present invention, there is provided the plasma processing apparatus according to the first aspect, wherein the second contact member abuts on the workpiece in a point-like manner. In the plasma processing method according to claim 4, a work is placed on an electrode mounted on a base, and a lid member is brought into close contact with the base to form a closed space for accommodating the work.
A plasma processing method for performing plasma processing of a work by generating plasma in the closed space, wherein first and second abutting members abutting on the work are attached to the inside of the base in a suspended state, When the lid member comes into close contact with the base, the first contact member presses the edge of the work against the electrode, and the second contact member presses the center of the work against the electrode. To generate plasma in a closed space. A plasma processing method according to a fifth aspect is the plasma processing method according to the fourth aspect, wherein the first abutting member abuts on the workpiece in a linear or elongated planar shape. A plasma processing method according to a sixth aspect is the plasma processing method according to the fourth aspect, wherein the second contact member abuts on the workpiece in a point-like manner. According to the present invention, since the plasma processing is performed by pressing the edge and the center of the work against the electrode by the pressing member provided in a state of being suspended from the lid member, the structure is simplified and abnormalities during the plasma processing are reduced. Discharge can be suppressed.

Embodiments of the present invention will now be described with reference to the drawings. 1 is a perspective view of a plasma processing apparatus according to an embodiment of the present invention, FIG. 2 is a side view of the plasma processing apparatus, FIG. 3 is an inverted perspective view of a lid member of the plasma processing apparatus, and FIG. Partial perspective view of a lid member of the device,
FIG. 5 is a perspective view of a pressing mechanism of the plasma processing apparatus, FIGS. 6 and 8 are partial cross-sectional views of a lid member of the plasma processing apparatus,
FIG. 7 is a partial sectional view of the plasma processing apparatus, and FIGS.
Is a perspective view of a jig for mounting the substrate holder of the plasma processing apparatus, FIG. 11 is a plan view of a jig for mounting the substrate holder of the plasma processing apparatus, and FIGS. 12, 13, and 14 are substrate holders of the plasma processing apparatus. It is explanatory drawing of the mounting method of the mounting jig. First, the structure of the plasma processing apparatus will be described with reference to FIGS. 1 and 2, an opening 2 is provided at the center of a base 2 horizontally disposed on the upper surface of a base 1.
a is provided in the opening 2a from below.
Are mounted via an insulating member 3a (FIG. 2). The upper surface of the electrode 3 is a mounting portion on which the substrate 4 to be processed is mounted. An exhaust hole 2b is provided in the base portion 2 at a position close to the opening 2a, and a sealing member 5 is provided outside the exhaust hole 2b so as to surround the opening 2a. ). As shown in FIG. 2, a frame member 6 is provided upright at an end of the base 1, and a cylinder 8 is disposed on a lower surface of a top plate 6 a of the frame member 6 so that the rod 8 a is disposed vertically downward. Has been established. In FIG. 1, the illustration of the frame member 6 and the top plate 6a is omitted. A bracket 9 is connected to the rod 8a, and a lid member 10 is mounted on a rotating hinge mechanism 9a provided on the bracket 9 so as to be rotatable around a horizontal axis. Rod 8 of cylinder 8
The cover member 10 moves up and down on the base member 2 by protruding and retracting a, and when the cover member 4 is lowered, the lower end of the cover member 10 contacts the seal member 5 on the upper surface of the base member 2 (FIG. 7). (B)). As a result, a space enclosed by the electrode 3, the base member 2, and the lid member 10 is sealed, and a processing chamber for performing plasma processing is formed. In the present embodiment, the cylinder 8 is a contact / separation mechanism for bringing the lid member 10 and the base member 2 into and out of contact with each other. As the contact / separation mechanism,
It is also possible to use a power source other than a cylinder, and it is also possible to adopt a configuration in which the base member 2 side is moved up and down to contact the lid member 10. In a state where the lid member 10 is in contact with the upper surface of the base member 2, by vacuum suction through the exhaust hole 2 b,
The inside of the processing chamber is evacuated. Thereafter, a gas for plasma generation is supplied from a tube member 11 connected to the upper surface of the lid member 10, and a high-frequency voltage is applied between the electrode 3 and the lid member 10 by a high-frequency power source 7 (see FIG. 7). Plasma discharge is generated in the processing chamber, and plasma processing of the substrate 4 placed on the electrode 3 is performed. When the substrate 4 to be processed is thin, the substrate 4 is warped in the process of plasma processing and easily rises from the electrode 3. Therefore, the lid member 10 is used as a work holder for pressing the substrate 4 against the electrode 3 during the plasma processing. A holding mechanism 20 provided with a plurality of substrate holders is provided. The holding mechanism 20 needs to adjust the position of the holding member depending on the type of the substrate 4. To facilitate this adjustment work, the lid member 10 is attached to the rotating hinge mechanism 9.
As shown in FIG. 2, the cover member 10 is rotatable so that an operator can access the inside of the cover member 10 from the side while the cover member 10 is rotated to a vertical position. Next, the pressing mechanism 20 provided on the lid member 10 will be described with reference to FIGS. FIGS. 3 and 4 show a state in which the lid member 10 is inverted, and a pressing mechanism 20 is mounted on the back surface (the upper surface in FIGS. 3 and 4) of the ceiling member 10 b of the lid member 10. The holding mechanism 20
Various members for holding the substrate are attached to the top plate 21, and the top plate 21 is fixed to the ceiling member 10b of the lid member 10 by fixing means (not shown) such as bolts. The pressing mechanism 20 includes four contact members (first contact members) that linearly or elongatedly contact the substrate 4 to hold four sides (edges) of the rectangular substrate 4. A board holding unit 22 (22A to 22C) and board holding pins 24 that abut on the board 4 in a point-like manner and locally hold the board 4
(A second contact member). As described above, by providing two types of contact members, it is possible to press down the edge of the substrate 4 and selectively press down a specific position inside the substrate 4, and to use various types of substrates corresponding to different types of substrates. It is possible to easily realize the pressing mode. As shown in FIGS. 4 and 5, the board holding unit 22 has a top plate 2 corresponding to one side of the board.
1. There are a fixed board holding unit 22A attached to the fixed position 1 and movable board holding units 22B and 22C attached to the top plate 21 so as to be position-adjustable corresponding to the other three sides. 28 attaches to the top plate 21. As shown in FIG. 5, the substrate holding units 22A, 22B, and 22C each have a plate-like base 25A, 25B, and 25C, and a telescopic part having a shaft that is provided on each of these bases 25 and that can be expanded and contracted by a built-in spring. 26A, 26B, 26C
And the contact portions 27A, 27B, and 27C that are connected to the shaft end of each of the expansion and contraction portions 26 and contact the substrate 4. These contact portions 27A, 27B, 27C (first
Contact member) is provided inside the cover member 10 with the elastic portions 26A, 2A.
6B, 26C, bases 25A, 25B, 25C and top plate 2
1 to be mounted in a suspended state. Contact part 27A,
In the state where 27B and 27C are attached to the bases 25A, 25B and 25C via the elastic portions 26A, 26B and 26C,
As shown in FIG. 5, the horizontal position of the edge line EL1 indicating the outer end surface of each of the contact portions 27A, 27B, and 27C is determined by the end surfaces of the cutouts formed at two places at both ends of the base portions 25A, 25B, and 25C. In the horizontal direction of the edge line EL2 indicating the position. That is, the bases 25A, 2
Edge line EL2 of the notch provided in 5B, 25C
Is a positioning unit that indicates the correspondence of the positions with the contact parts 27A, 27B, and 27C. By providing this alignment portion, the contact portions 27A and 2A that come into contact with the substrate 4 are provided.
When performing the alignment of the bases 25A, 2C,
Edge line EL2 of the notch provided in 5B, 25C
Can be used as a reference for positioning on the top plate 21, and the positioning operation can be easily performed. The top plate 21 is provided with a mark or a hole indicating a relative position with respect to the substrate 4 when the substrate 4 is placed on the electrode 3 during the plasma processing. That is, the reference line 21d indicating the mounting direction and the mounting center position of the substrate 4, and the mark lines 2 indicating the outlines of the minimum size and maximum size substrates among the processing target substrates, respectively.
1e, 21f, and a large number of tapped holes 21b provided in a lattice shape and indicating sections on the top plate 21 are provided. By using these marks and holes, the relative position of the substrate to be processed on the top plate 21 can be easily and accurately found. The position of the board holding units 22B and 22C is adjusted along the long hole 21c provided on the top plate 21 by the base 2.
This is performed by moving 5B and 25C. As shown in FIG. 6, a long hole 21 of a top plate 21 on the lower surface of the ceiling member 10b.
The nut member 15 into which the bolt 23 for fastening the bases 25B, 25C and the top plate 21 is screwed into the long groove 14 without interfering with the ceiling member 10b. It can be accommodated. At the time of position adjustment, the base 25 is loosened by loosening the bolt 23.
B and 25C can be moved along the elongated hole 21c, and the bases 25B and 25C may be fixed to the top plate 21 by tightening the bolts 23 to fix the board holding units 22B and 22C. The board holding pins 24 are attached to the top and bottom of the top plate 21 such that bolts 23, 2 are provided in a large number of tap holes 21b provided in a lattice shape by a spring built in the holder 24a.
Attach by fixing with 8. The board holding pin 24 is also mounted inside the lid member 10 in a suspended state by the holder 24 a and the top plate 21. Ceiling 2
By selecting the position of the tapped hole 21b on 1
Further, the position of the substrate holding pin 24 can be freely adjusted by utilizing the adjustment allowance for the elongated hole provided in the holder 24a. In other words, the substrate holding pins 24 are also mounted inside the lid member 10 so as to be adjustable in position.
At four corners of the top plate 21, tap holes 21a for mounting a mounting jig for a substrate press described later are provided. FIG. 7 shows the lid member 10 in a state where the positions of the substrate pressing unit 22B and the substrate pressing pins 24 are adjusted according to the substrate 4 to be processed. In FIG. 7A, the lid member 10 is positioned above the electrode 3, and by lowering the rear lid member 10, the lower end of the lid member 10 is lowered as shown in FIG. 7B. The contact portion 27B of the board holding unit 22B is brought into contact with the base member 2.
In addition, the substrate holding pins 24 come into contact with the upper surface of the substrate 4.
In this state, the contact portion 27B is moved by the biasing force of the spring built in the expansion / contraction portion 26B and the substrate holding pin 2
4 also presses the substrate 4 against the electrode 3,
This prevents the substrate 4 from rising from the surface of the electrode 3. As described above, by attaching the holding mechanism 20 for holding the substrate inside the lid member 10, the operation of bringing the lid member 10 and the base member 2 into contact with each other allows the substrate 4
Can be held down by the holding mechanism 20,
The structure can be greatly simplified. FIG. 8 shows FIG.
3A shows a cross section of a portion A shown in FIG. In FIG. 8, a groove 17 is provided at the center on the lower surface of the ceiling member 10b of the lid member 10.
Are provided, and the groove 17 communicates with the pipe member 11 via a pipe joint 18. A gas ejection hole 21d is provided on the top plate 21 for mounting the substrate holder fixed to the lower surface of the ceiling member 10b, corresponding to the position of the groove 17. The gas for plasma generation supplied through the pipe member 11
Is supplied from the gas ejection hole 21d to the inside of the lid member 10 through the inside of the cover member 10. By appropriately setting the formation range of the groove 17 and the hole diameter and arrangement pattern of the gas ejection holes 21d, the gas for plasma generation can be uniformly supplied to the surface of the substrate 4 placed inside the processing chamber. . In the state shown in FIG. 7B, when the inside of the processing chamber is evacuated and reduced in pressure, and a plasma generating gas is supplied to apply a high-frequency voltage to the inside of the processing chamber, plasma is generated in the processing chamber. Plasma treatment of the surface is performed. At this time, since the pressing mechanism 20 is mounted with the contact portions 27B (27A, 27C) and the substrate pressing pins 24 suspended from the lid member 10, abnormal discharge occurs between the pressing mechanism 20 and the electrode 3. The risk of starting can be kept low. Next, with reference to FIG. 9, a mounting jig for the substrate holder will be described. The mounting jig 30 shown in FIG. 9 is a transparent plate-shaped member made of a transparent material such as an acrylic plate, and the substrate holding unit 22 and the substrate holding pin 24 are fixed to the inside of the lid member 10. It is used to easily adjust the position when attaching to the top plate 21. The mounting jig 30 has the same size as the top plate 21, and has a tapped hole 21 b provided in the top plate 21.
The tool insertion hole 30b is located at a position corresponding to
A tool insertion slot 30c is provided at a position corresponding to c. The tool insertion hole 30b and the tool insertion slot 30c
It is provided to enable use of a tool such as a driver with the mounting jig 30 interposed.
30 d shown on the surface of the mounting jig 30 is a reference line 30 indicating a positional correlation between the mounting jig 30 and the target substrate 4.
d, and 30e and 30f are mark lines (substrate contour lines) as marks indicating the substrate 4 of the minimum size and the maximum size, respectively. These marks correspond to marks indicating a relative position with respect to the substrate 4 provided on the top plate 21, that is, the reference line 30d is a reference line 21d and a mark line 30d.
e and 30f correspond to the mark lines 21e and 21f, respectively. The reference line 30d and the mark lines 30e, 3
0f is a tool insertion hole 30b, a tool insertion long hole 3 provided corresponding to the above-described tap hole 21b and long hole 21c.
Along with Oc, it serves as a mark means serving as a guide for an attachment position when the board holding unit 22 and the board holding pin 24 are attached inside the lid member 10. At four corners of the mounting jig 30, mounting holes 30 a are provided corresponding to the positions of the tapped holes 21 a of the top plate 21.
Is mounted on the top plate 21 using the mounting holes 30a and the tapped holes 21a of the top plate 21. Next, a method of attaching the board holding unit 22 and the board holding pins 24 to the lid member 10 using the attachment jig 30 will be described with reference to FIGS. In FIG. 10A, 4
Is a substrate to be processed. First, the substrate 4 is set on the mounting jig 30 by bringing the surface to be processed into contact with the mounting jig 30. At this time, as shown in FIG.
Is positioned at a predetermined position of the mounting jig 30. This alignment is performed by using one end face of the substrate 4 and the center position as a reference line 3.
It is performed by adjusting to 0d. This position is selected according to the position where the substrate 4 is placed on the electrode 3 during the plasma processing. When the substrate 4 is correctly aligned with the mounting jig 30, the substrate 4 is temporarily fixed to the mounting jig 30 with the adhesive tape 31. Next, the mounting jig 30 to which the substrate 4 is temporarily fixed is inverted. FIG. 11 shows the mounting jig 30 in this state. Since the mounting jig 30 is made of a transparent material, the mounting jig 30
, The substrate 4 can be visually recognized from the opposite surface. Then, in this state, a mark indicating the position of the substrate 4 or the pressing position of the substrate 4 is written on the mounting jig 30 with a marker or the like. In FIG. 11, marks 32a and 32b indicating edges and corners of the substrate 4 and marks 33 indicating positions selected as portions which do not hinder the local pressing of the substrate 4 with the substrate pressing pins 24 are written. An example is shown.
As a result, the position of the substrate 4 placed on the electrode 3 at the time of processing and the appropriate holding position of the substrate 4 have been transferred to the mounting jig 30. FIG. 12 shows a method of attaching the mounting jig 30 to the top plate 21 already fixed to the lid member 10 by using the spacer jig 35 provided with screw portions at both ends. Usually, at the time of this mounting operation, the arrangement of the substrate holder on the top plate 21 remains in the state of being aligned at the time of the previous position adjustment of the operation. Therefore, the mounting jig 30
In the alignment work performed using the, the work of changing the previously adjusted position to a new alignment position is performed. First, a screw portion at one end of the spacer member 35 is screwed into the tapped hole 21a of the top plate 21 and fixed. In this state, the mounting hole 3 of the mounting jig 30 is
The mounting jig 30 is mounted on the top plate 21 by aligning 0a and screwing and tightening the nut 36 to the screw portion at the opposite end of the spacer member 35. FIG. 13 shows a state in which the mounting is completed in this way. Spacer member 3
The length of 5 is set such that a working space is secured between the end of the lid member 10 and the mounting jig 30, so that the necessary work can be easily performed in this state. You can do it. The positioning operation of the substrate pressing performed in this state will be described with reference to FIG. First, the position fixing of the substrate pressing unit 22 and the substrate pressing pins 24 fixed to the substrate to be position-adjusted during the previous operation is released. This work is performed on the base 25B and the holder 2
This is performed by loosening the bolts 23 and 28 for fastening the 4a. The mounting jig 30 has a tool insertion hole 30b and a tool insertion slot 30c corresponding to the positions of the tap holes 21b and the bolt fixing slots 21c. Is provided,
Tools such as the driver 37 can be easily used. When this operation is completed, the positioning of the substrate pressing unit 22 and the substrate pressing pins 24 is performed. That is, the marks 32a, 32b, and 33 corresponding to the target substrate 4 are previously written on the mounting jig 30 by the transfer operation shown in FIG. 11, and are visually recognized through the transparent mounting jig 30. The board holding unit 22 and the board holding pins 25 on the top plate 21 are aligned with the marks 32a, 32b, 33 while visually confirming the positions. This alignment is performed by moving the substrate holding unit 22 along the elongated hole 21c and by selecting the tap hole 21b for fastening the holder 24a. When positioning the substrate holding unit 22, the edge lines EL2 of the notches provided in the bases 25A, 25B, and 25C are brought into contact with the contact portions 27A and 27A.
The contact portions 27 </ b> A and 2 </ b> A contacting the substrate 4 because of the positioning portion indicating the positional relationship between the contact portions 27 </ b> B and 27 </ b> C.
When performing the alignment of the bases 25A, 2C,
Edge line EL2 of the notch provided in 5B, 25C
Can be used as a reference for alignment. Top plate 2
1, the positions of the bases 25A, 25B, 25C can be easily visually recognized.
Can be performed accurately and easily. When the positioning is correctly performed, the base 25 of the substrate pressing unit 22 and the holder 24a of the substrate pressing pins 24 are fixed by tightening the bolts 23 and 28. In this operation, the tool insertion hole 30b and the tool insertion slot 30c provided in the attachment
Perform using. Thereafter, the position after fixing the substrate holding unit 22 and the substrate holding pin 25 is the mounting jig 30.
It is confirmed that they match the marks 32a, 32b, 33. Then, when it is confirmed that the alignment is correctly performed, the mounting jig 30 is reversely mounted.
Is removed from the top plate 21 to complete the work of adjusting the position of the substrate holder. In these operations, the worker operates the lid member 1.
0 is rotated about a horizontal axis to a vertical position,
The work can be performed with the back side facing the side (see FIG. 2), and the work access can be easily performed. In addition, at the time of the alignment work, the work can be performed while always checking the position of the substrate transferred to the transparent mounting jig 30 and the substrate holding position. For this reason, the positioning operation of the substrate holder, which has conventionally been performed by repeating trial and error in a complicated procedure, can be performed accurately and easily. Therefore, repetitive work by trial and error at the time of alignment,
It is possible to prevent the occurrence of plasma processing quality failure due to the failure of the substrate holding position.

According to the present invention, the plasma processing is performed by pressing the edge and the center of the work against the electrode by the pressing member provided in a state of being hung on the lid member. It is possible to suppress occurrence of abnormal discharge during the plasma processing.

[Brief description of the drawings]

FIG. 1 is a perspective view of a plasma processing apparatus according to an embodiment of the present invention.

FIG. 2 is a side view of the plasma processing apparatus according to the embodiment of the present invention;

FIG. 3 is an inverted perspective view of a lid member of the plasma processing apparatus according to the embodiment of the present invention;

FIG. 4 is a partial perspective view of a lid member of the plasma processing apparatus according to one embodiment of the present invention.

FIG. 5 is a perspective view of a holding mechanism of the plasma processing apparatus according to the embodiment of the present invention;

FIG. 6 is a partial cross-sectional view of a lid member of the plasma processing apparatus according to one embodiment of the present invention.

FIG. 7 is a partial cross-sectional view of a plasma processing apparatus according to an embodiment of the present invention.

FIG. 8 is a partial cross-sectional view of a lid member of the plasma processing apparatus according to one embodiment of the present invention.

FIG. 9 is a perspective view of a jig for mounting a substrate holder of the plasma processing apparatus according to the embodiment of the present invention;

FIG. 10 is a perspective view of a jig for mounting a substrate holder of the plasma processing apparatus according to one embodiment of the present invention;

FIG. 11 is a plan view of a jig for mounting a substrate holder of the plasma processing apparatus according to one embodiment of the present invention;

FIG. 12 is an explanatory diagram of a mounting method of a mounting jig for a substrate holder of the plasma processing apparatus according to one embodiment of the present invention;

FIG. 13 is an explanatory diagram of a mounting method of a mounting jig for a substrate holder of the plasma processing apparatus according to one embodiment of the present invention;

FIG. 14 is an explanatory diagram of a mounting method of a mounting jig for a substrate holder of the plasma processing apparatus according to one embodiment of the present invention;

[Explanation of symbols]

 2 Base member 3 Electrode 4 Substrate 8 Cylinder 10 Cover member 20 Pressing mechanism 21 Top plate 22, 22A, 22B, 22C Substrate pressing unit 24 Substrate pressing pin 25A, 25B, 25C Base 26A, 26B, 26C Telescopic portion 27A, 27B, 27C Contact part 30d Reference line 30e, 30f Mark EL1, EL2 Edge line

Claims (6)

[Claims] A cover member which is in close contact with a base portion to form a processing chamber which is a closed space; an electrode which is disposed in the processing chamber and on which a workpiece to be processed is mounted on an upper surface; A work holder that is attached to the inside of the base member and abuts against the work on the electrode while the lid member is in close contact with the base portion and presses the work against the electrode.
A first contact member attached to the inside of the lid member in a suspended state and abutting against the edge of the work; and a second contact member attached to the inside of the lid member in a suspended state and abutting on the central portion of the work.
A plasma processing apparatus comprising at least two types of contact members. 2. The plasma processing apparatus according to claim 1, wherein said first contact member comes into contact with the workpiece in a linear or elongated plane. 3. The plasma processing apparatus according to claim 1, wherein said second contact member abuts on the workpiece in a point-like manner. 4. A work is placed on an electrode mounted on a base, a lid member is brought into close contact with the base to form a closed space for accommodating the work, and plasma is generated in the closed space to generate a work space. A plasma processing method for performing plasma processing, wherein first and second abutting members abutting on a workpiece are attached to the inside of the base in a suspended state, and the first and second abutting members are attached to the base when the lid member is in close contact with the base. The first contact member presses the edge of the work against the electrode, and the second contact member presses the center of the work against the electrode, and in this state, plasma is generated in the closed space. Plasma processing method. 5. The plasma processing method according to claim 4, wherein the first contact member contacts the workpiece in a linear or elongated plane. 6. The plasma processing method according to claim 4, wherein said second contact member abuts on the workpiece in a point-like manner.