JP3846128B2 - Work holding jig for plasma processing apparatus and plasma processing apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a work pressing attachment jig in a plasma processing apparatus used when mounting a work press in a plasma processing apparatus, and a plasma processing apparatus to which the mounting jig can be attached.
[0002]
[Prior art]
In the plasma processing apparatus, processing is performed by placing a workpiece such as a substrate on an electrode in a sealed space and generating electric discharge under reduced pressure. Since discharge is accompanied by heat generation, the temperature of the object to be processed rises in the process of continuing the vacuum process. When the workpiece is a thin substrate having a relatively small thickness with respect to the planar size, the workpiece is warped due to an increase in temperature, and the substrate is likely to rise from the upper surface of the electrode in the process. If a gap is generated between the substrate and the electrode surface due to floating, local discharge is generated in the gap and uniform processing is hindered.
[0003]
For this reason, when a thin substrate is used as an object, a means for pressing the substrate against the electrode is required so that no gap is formed between the substrate and the electrode. In the conventional vacuum processing apparatus, a pressing member for pressing the substrate against the electrode is provided in a vacuum processing chamber, and a pressing mechanism for driving the pressing member is provided. The pressing mechanism connects a pressing member in the processing chamber and a driving unit outside the processing chamber by a rod penetrating into the processing chamber. When a workpiece having a different shape / size is targeted, it is necessary to perform a setup change operation such as replacement / position adjustment of the pressing member in accordance with the workpiece.
[0004]
[Problems to be solved by the invention]
However, the conventional pressing mechanism requires a sealing portion that seals the gap at the position where the rod penetrates the processing chamber, so that the structure becomes complicated, and much effort and time are required when replacing and adjusting the pressing member. Needed. Furthermore, since it is difficult to confirm the state that the pressing member is actually pressing the workpiece against the electrode, trial and error work is required to adjust the position of the pressing member, and the correct position is not pressed However, there is a problem in that a problem such as accidentally covering a processing target part with a pressing member is likely to occur, resulting in a defective plasma processing.
[0005]
Therefore, an object of the present invention is to provide a workpiece pressing attachment jig and a plasma processing apparatus in a plasma processing apparatus capable of easily and accurately performing a setup change operation.
[0006]
[Means for Solving the Problems]
The work pressing attachment jig in the plasma processing apparatus according to claim 1, a lid member that is in close contact with the base portion to form a processing chamber that is a sealed space, and is disposed in the processing chamber and has an upper surface to be processed. Plasma processing comprising an electrode on which a workpiece is placed, and a workpiece presser that is detachably attached to the inside of the lid member and presses against the electrode by contacting the workpiece on the electrode while the lid member is in close contact with the base In the apparatus, there is a jig for attaching a work holder in a plasma processing apparatus used when the work holder is mounted on the inner side of the lid member, and the workpiece holder is formed on a transparent plate member and the plate member. And mark means that serves as a mark of an attachment position when attached to the inside of the lid member.
[0007]
The plasma processing apparatus according to claim 2, wherein a lid member is formed in close contact with the base portion to form a processing chamber that is a sealed space, and an electrode that is disposed in the processing chamber and on which an object to be processed is placed on an upper surface. And a work presser that is detachably attached to the inside of the lid member and that presses against the electrode by contacting the work on the electrode while the lid member is in close contact with the base. A workpiece pressing attachment jig used for mounting inside, a transparent plate-shaped member and marking means formed on the plate-shaped member and serving as a mark of the mounting position when the workpiece pressing is mounted inside the lid member A mounting means for mounting a mounting jig having
[0008]
According to the present invention, by using an attachment jig having a transparent plate member and marking means formed on the plate member and serving as a mark of the attachment position inside the lid member of the workpiece press, An appropriate position to be pressed can be accurately transferred to the lid member, and a setup change operation for adjusting the position of the workpiece pressing at the time of workpiece switching can be easily and accurately performed.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of a plasma processing apparatus according to an embodiment of the present invention, FIG. 2 is a side view of the plasma processing apparatus, FIG. 3 is an inverted perspective view of a lid member of the plasma processing apparatus, and FIG. FIG. 5 is a perspective view of a holding mechanism of the plasma processing apparatus, FIGS. 6 and 8 are partial cross-sectional views of the lid member of the plasma processing apparatus, and FIG. 7 is a part of the plasma processing apparatus. 9 and 10 are perspective views of the substrate pressing attachment jig of the plasma processing apparatus, FIG. 11 is a plan view of the substrate pressing attachment jig of the plasma processing apparatus, and FIGS. 12, 13, and 14. These are explanatory drawings of the mounting method of the mounting jig of the board | substrate holding | suppressing of the plasma processing apparatus.
[0010]
First, the structure of the plasma processing apparatus will be described with reference to FIGS. 1 and 2, an opening 2a is provided at the center of a base portion 2 disposed horizontally on the upper surface of a base 1, and an electrode 3 is provided in the opening 2a from below from an insulating member 3a. (FIG. 2). The upper surface of the electrode 3 serves as a mounting portion for mounting the substrate 4 to be processed. An exhaust hole 2b is provided in the base 2 at a position close to the opening 2a, and a seal member 5 is disposed outside the exhaust hole 2b so as to surround the opening 2a (see also FIG. 7). ).
[0011]
As shown in FIG. 2, a frame member 6 is erected at the end of the base 1, and a cylinder 8 is vertically arranged on the lower surface of the top plate 6a of the frame member 6 with the rod 8a facing downward. It is installed. In FIG. 1, the frame member 6 and the top plate 6a are not shown. A bracket 9 is coupled to the rod 8a, and a lid member 10 is attached to a rotary hinge mechanism 9a provided on the bracket 9 so as to be rotatable about a horizontal axis.
[0012]
By causing the rod 8a of the cylinder 8 to project and retract, the lid member 10 moves up and down on the base member 2, and when the lid member 4 is lowered, the lower end portion of the lid member 10 contacts the seal member 5 on the upper surface of the base member 2. (Refer to FIG. 7B). Thereby, the space enclosed by the electrode 3, the base member 2, and the cover member 10 is sealed, and the process chamber for performing a plasma process is formed.
[0013]
That is, the inside of the processing chamber is evacuated by vacuum suction through the exhaust hole 2 b in a state where the lid member 10 is in contact with the upper surface of the base member 2. Thereafter, a plasma generating gas is supplied from the tube member 11 connected to the upper surface of the lid member 10, and a high frequency voltage is applied between the electrode 3 and the lid member 10 by a high frequency power source 7 (see FIG. 7). Plasma discharge is generated in the processing chamber, and the plasma processing of the substrate 4 placed on the electrode 3 is performed.
[0014]
When the substrate 4 to be processed is thin, the substrate 4 is warped and easily lifts from the electrode 3 in the course of the plasma processing. Therefore, the lid member 10 serves as a work presser that presses the substrate 4 against the electrode 3 during the plasma processing. A pressing mechanism 20 having a plurality of substrate pressings is provided. The pressing mechanism 20 needs to adjust the position of the pressing member depending on the type of the substrate 4. The lid member 10 is freely rotatable by a rotary hinge mechanism 9a so that this adjustment work can be easily performed. As shown in FIG. Can access the inside of the lid member 10.
[0015]
Next, the pressing mechanism 20 provided on the lid member 10 will be described with reference to FIGS. 3 and 4 show a state in which the lid member 10 is inverted, and a pressing mechanism 20 is mounted on the back surface (upper surface in FIGS. 3 and 4) of the ceiling member 10b of the lid member 10. FIG. The holding mechanism 20 has a configuration in which various members for holding the substrate are attached to the top plate 21. The top plate 21 is fixed to the ceiling member 10b of the lid member 10 by a fixing means (not shown) such as a bolt.
[0016]
The holding mechanism 20 includes an abutting member (first abutting member) that abuts the substrate 4 in a linear or elongated surface shape, and includes four substrate pressing units 22 for pressing four sides of the rectangular substrate 4. (22A to 22C) and two types of pressing members including a substrate pressing pin 24 (second contact member) that contacts the substrate 4 in a point-like manner and locally presses the substrate 4 are provided. Thus, by providing two types of pressing members, the peripheral edge of the substrate 4 can be pressed all over and a specific position inside the substrate 4 can be selectively pressed. It is possible to easily realize a simple substrate pressing form.
[0017]
As shown in FIGS. 4 and 5, the substrate pressing unit 22 corresponds to the fixed substrate pressing unit 22A attached to the fixing position of the top plate 21 corresponding to one side of the substrate and the other three sides. There are movable substrate pressing units 22B and 22C which are attached to the top plate 21 so as to be adjustable in position, and are attached to the top plate 21 by bolts 23 and 28, respectively.
[0018]
As shown in FIG. 5, the substrate pressing units 22A, 22B, and 22C have plate-like base portions 25A, 25B, and 25C, and expansion / contraction portions each having a shaft that can be expanded and contracted by a spring provided in each of the base portions 25. 26A, 26B, and 26C, and contact portions 27A, 27B, and 27C that are coupled to the shaft ends of the respective expansion and contraction portions 26 and contact the substrate 4.
[0019]
When the contact portions 27A, 27B, and 27C are attached to the base portions 25A, 25B, and 25C via the extendable portions 26A, 26B, and 26C, as shown in FIG. 5, the outer end surfaces of the contact portions 27A, 27B, and 27C The horizontal position of the edge line EL1 indicating the vertical direction coincides with the horizontal position of the edge line EL2 indicating the end surfaces of the notches formed at the two ends of the base portions 25A, 25B, and 25C.
[0020]
That is, the edge line EL2 of the notch portion provided in the base portions 25A, 25B, and 25C is an alignment portion that indicates a positional relationship with the contact portions 27A, 27B, and 27C. By providing this alignment portion, when aligning the contact portions 27A, 27B, and 27C that contact the substrate 4, the edge line EL2 of the notch portions provided in the base portions 25A, 25B, and 25C is displayed on the top plate. 21 can be used as a reference for alignment on 21 and alignment work can be easily performed.
[0021]
The top plate 21 is provided with marks and holes that indicate a relative position with respect to the substrate 4 when the substrate 4 is placed on the electrode 3 during plasma processing. That is, a reference line 21d indicating the mounting direction and mounting center position of the substrate 4, mark lines 21e and 21f indicating the outlines of the substrates of the minimum size and the maximum size among the processing target substrates, and a large number of grid lines are provided. A tapped hole 21b indicating a section on the top plate 21 is provided. By using these marks and holes, the relative position of the substrate to be processed on the top plate 21 can be found easily and accurately.
[0022]
The position adjustment of the substrate pressing units 22B and 22C is performed by moving the base portions 25B and 25C along the long holes 21c provided in the top plate 21. As shown in FIG. 6, a long groove 14 is provided at a position corresponding to the long hole 21c of the top plate 21 on the lower surface of the ceiling member 10b, and a bolt 23 for fastening the base portions 25B and 25C and the top plate 21 is screwed together. The nut member 15 to be accommodated can be accommodated in the long groove 14 without interfering with the ceiling member 10b. At the time of position adjustment, the bases 25B and 25C can be moved along the long holes 21c by loosening the bolts 23, and the bolts 23 are tightened to fix the bases 25B and 25C to fix the board pressing units 22B and 22C. What is necessary is just to fix to the top plate 21.
[0023]
The substrate pressing pin 24 is mounted so as to be vertically expandable and contractable by a spring built in the holder 24a. By fixing the holder 24a to a plurality of tap holes 21b provided in a lattice shape on the top plate 21 by bolts 28. It is attached. The position of the substrate pressing pin 24 can be freely adjusted by selecting the position of the tap hole 21b on the ceiling 21 and using the adjustment allowance of the long hole provided in the holder 24a. In other words, the substrate pressing pin 24 is also attached to the inside of the lid member 10 so that the position thereof can be adjusted. In addition, tap holes 21 a for mounting a substrate pressing attachment jig, which will be described later, are provided at four corners of the top plate 21.
[0024]
FIG. 7 shows the lid member 10 in a state in which the positions of the substrate pressing unit 22B and the substrate pressing pins 24 are adjusted according to the substrate 4 to be processed. In FIG. 7 (a), the lid member 10 is aligned above the electrode 3. By lowering the lid member 10, the lower end of the lid member 10 is moved downward as shown in FIG. 7 (b). While being in contact with the base member 2, the contact portion 27 </ b> B of the substrate pressing unit 22 </ b> B and the substrate pressing pin 24 are in contact with the upper surface of the substrate 4. In this state, the contact portion 27B is pressed against the electrode 3 by the urging force of the spring built in the extendable portion 26B, and the substrate pressing pin 24 similarly presses the substrate 3 against the electrode 3. Lifting from the surface is prevented.
[0025]
FIG. 8 shows a cross section of a portion A shown in FIG. In FIG. 8, a groove 17 is provided in the center of the lower surface of the ceiling member 10 b of the lid member 10, and the groove 17 communicates with the pipe member 11 via a pipe joint 18. A gas ejection hole 21d corresponding to the position of the groove 17 is provided in the top plate 21 to which the substrate holder is attached fixed to the lower surface of the ceiling member 10b. The plasma generating gas supplied through the tube member 11 is supplied to the inside of the lid member 10 from the gas ejection hole 21d through the inside of the groove 17. By appropriately setting the formation range of the grooves 17 and the hole diameter / arrangement pattern of the gas ejection holes 21d, the plasma generating gas can be uniformly supplied to the surface of the substrate 4 placed in the processing chamber. .
[0026]
Next, a substrate pressing attachment jig will be described with reference to FIG. The mounting jig 30 shown in FIG. 9 is a transparent plate-like member made of a transparent material such as an acrylic plate, and the substrate pressing unit 22 and the substrate pressing pin 24 are fixed inside the lid member 10. It is used to easily adjust the position when attaching to the top plate 21.
[0027]
The mounting jig 30 is the same size as the top plate 21, and the tool insertion hole 30b is located at a position corresponding to the tap hole 21b provided on the top plate 21, and the tool insertion long hole 30c is located at a position corresponding to the long hole 21c. Is provided. The tool insertion hole 30b and the tool insertion long hole 30c are provided to enable the use of a tool such as a driver with the attachment jig 30 interposed.
[0028]
Reference numeral 30d shown on the surface of the mounting jig 30 is a reference line 30d indicating a positional correlation between the mounting jig 30 and the target substrate 4, and 30e and 30f are marks indicating the minimum size and the maximum size substrate 4, respectively. As a mark line (contour line of the substrate). These marks correspond to marks indicating relative positions with respect to the substrate 4 provided on the top plate 21, that is, the reference line 30d is the reference line 21d, and the mark lines 30e and 30f are the mark lines 21e and 21f. And correspond to each.
[0029]
The reference line 30d and the mark lines 30e and 30f are provided together with the substrate pressing unit 22 and the substrate pressing pin together with the tool insertion insertion hole 30b and the tool insertion slot 30c provided corresponding to the tap hole 21b and the long hole 21c. Marking means is provided as a guide for the mounting position when 24 is mounted inside the lid member 10.
[0030]
At the four corners of the mounting jig 30, mounting holes 30 a are provided corresponding to the positions of the tap holes 21 a of the top plate 21, and the mounting jig 30 includes the mounting holes 30 a and the tap holes 21 a of the top plate 21. It is attached to the top plate 21 using.
[0031]
Next, a method for attaching the substrate pressing unit 22 and the substrate pressing pin 24 to the lid member 10 using the mounting jig 30 will be described with reference to FIGS. In FIG. 10A, reference numeral 4 denotes a substrate to be processed. First, the substrate 4 is set on the mounting jig 30 with the surface to be processed being brought into contact with the mounting jig 30. At this time, the substrate 4 is aligned with a predetermined position of the mounting jig 30 as shown in FIG. This alignment is performed by aligning one end face of the substrate 4 and the center position with the reference line 30d. This position is selected according to the position where the substrate 4 is placed on the electrode 3 during plasma processing. When the substrate 4 is correctly aligned with the attachment jig 30, the substrate 4 is temporarily fixed to the attachment jig 30 with the adhesive tape 31.
[0032]
Next, the mounting jig 30 to which the substrate 4 is temporarily fixed is reversed. FIG. 11 shows the mounting jig 30 in this state. Since the mounting jig 30 is made of a transparent material, the substrate 4 can be viewed from the opposite surface through the mounting jig 30. In this state, a mark indicating the position of the substrate 4 and the pressing position of the substrate 4 is written on the mounting jig 30 with a marker or the like.
[0033]
In FIG. 11, marks 32 a and 32 b indicating the edge and corner portion of the substrate 4 and a mark 33 indicating a position selected as a site that does not hinder the substrate 4 from being locally pressed by the substrate pressing pins 24 are entered. An example is shown. As a result, the position of the substrate 4 in a state of being placed on the electrode 3 at the time of processing and the appropriate pressing position of the substrate 4 are transferred to the mounting jig 30.
[0034]
FIG. 12 shows a method of attaching the attachment jig 30 to the top plate 21 already fixed to the lid member 10 by using a spacer jig 35 provided with screw portions at both ends. Usually, at the time of this mounting operation, the placement of the substrate holders on the top plate 21 remains aligned when the previous position adjustment of the operation is performed. Therefore, in the alignment operation performed using the attachment jig 30 here, an operation of changing the previously aligned position to a new alignment position is performed.
[0035]
First, the threaded portion at one end of the spacer member 35 is screwed into the tap hole 21a of the top plate 21 and fixed. In this state, the mounting hole 30a of the mounting jig 30 is aligned with the opposite end of the spacer member 35, and the nut 36 is screwed into the threaded portion of the opposite end of the spacer member 35 and tightened. 21 is attached. FIG. 13 shows a state where the mounting is completed in this way. The length of the spacer member 35 is set such that a working space is ensured between the end portion of the lid member 10 and the mounting jig 30. It can be easily done.
[0036]
The substrate pressing alignment operation performed in this state will be described with reference to FIG. First, the position fixing of the substrate pressing unit 22 and the substrate pressing pin 24 fixed to the substrate whose position is to be adjusted at the previous work is released. This operation is performed by loosening the bolts 23 and 28 for fastening the base portion 25B and the holder 24a. The attachment jig 30 has tool insertion holes corresponding to the positions of the tap holes 21b and the bolt fixing long holes 21c. Since 30b and the tool insertion long hole 30c are provided, tools, such as a driver 37, can be used easily.
[0037]
When this operation is completed, the substrate pressing unit 22 and the substrate pressing pin 24 are aligned. That is, marks 32 a, 32 b, 33 corresponding to the target substrate 4 are previously written in the mounting jig 30 by the position transfer operation shown in FIG. The substrate pressing unit 22 and the substrate pressing pin 25 on the top plate 21 are aligned with the marks 32a, 32b, 33 while visually confirming the position. This alignment is performed by moving the substrate pressing unit 22 along the long hole 21c and by selecting the tap hole 21b for fastening the holder 24a.
[0038]
When aligning the substrate pressing unit 22, the edge line EL2 of the notch portion provided in the base portions 25A, 25B, and 25C serves as an alignment portion that indicates the positional correspondence with the contact portions 27A, 27B, and 27C. Therefore, when aligning the contact portions 27A, 27B, and 27C that contact the substrate 4, the edge line EL2 of the notch portions provided in the base portions 25A, 25B, and 25C is used as a reference for alignment. Can do. Since the positions of the bases 25A, 25B, and 25C on the top plate 21 can be easily recognized, the alignment operation of the substrate pressing unit 22 with respect to the top plate 21 can be performed accurately and easily.
[0039]
If the alignment is performed correctly, the base 25 of the substrate pressing unit 22 and the holder 24a of the substrate pressing pin 24 are fixed by tightening the bolts 23 and 28. This operation is also performed using the tool insertion hole 30b and the tool insertion long hole 30c provided in the attachment jig 30 in the same manner as the unlocking. Thereafter, it is confirmed that the positions of the substrate pressing unit 22 and the substrate pressing pins 25 after being fixed match the marks 32a, 32b, and 33 of the mounting jig 30. If it is confirmed that the alignment is correctly performed, the mounting jig 30 is removed from the top plate 21 by means opposite to the mounting, and the position adjustment operation of the substrate pressing is completed.
[0040]
In these operations, the operator can rotate the lid member 10 around the horizontal axis to a vertical posture and perform the operation with the back side of the lid member 10 facing the side (see FIG. 2). Easy to do. In the alignment operation, the operation can be performed while always confirming the position of the substrate transferred to the transparent attachment jig 30 and the substrate pressing position. For this reason, it is possible to accurately and easily perform the positioning operation of the substrate presser, which has been conventionally performed while repeating trial and error in a complicated procedure. Therefore, it is possible to prevent the occurrence of repetitive work due to trial and error at the time of alignment and plasma processing quality defects due to defective substrate pressing positions.
[0041]
【The invention's effect】
According to the present invention, the mounting jig having the transparent plate member and the mark means that is formed on the plate member and serves as a mark of the mounting position on the inside of the lid member of the work pressing member is used. An appropriate position for pressing the workpiece can be accurately transferred to the lid member, and a setup change operation for adjusting the position of the workpiece pressing at the time of switching the workpiece can be easily and accurately performed.
[Brief description of the drawings]
FIG. 1 is a perspective view of a plasma processing apparatus according to an embodiment of the present invention. FIG. 2 is a side view of the plasma processing apparatus according to an embodiment of the present invention. FIG. 4 is a partial perspective view of a lid member of a plasma processing apparatus according to an embodiment of the present invention. FIG. 5 is a perspective view of a holding mechanism of the plasma processing apparatus according to an embodiment of the present invention. FIG. 6 is a partial sectional view of a lid member of a plasma processing apparatus according to an embodiment of the present invention. FIG. 7 is a partial sectional view of a plasma processing apparatus according to an embodiment of the present invention. FIG. 9 is a partial cross-sectional view of a lid member of the plasma processing apparatus of the embodiment. FIG. 9 is a perspective view of a substrate pressing attachment jig of the plasma processing apparatus of the embodiment of the invention. Perspective view of the jig for mounting the substrate holder of the plasma processing equipment FIG. 11 is a plan view of a substrate pressing attachment jig of a plasma processing apparatus according to an embodiment of the present invention. FIG. 12 is a method of mounting a substrate pressing attachment jig of a plasma processing apparatus according to an embodiment of the present invention. Explanatory drawing [FIG. 13] Explanatory drawing of the mounting method of the substrate pressing attachment jig | tool of the plasma processing apparatus of one embodiment of this invention. [FIG. 14] Attaching the substrate pressing of the plasma processing apparatus of one embodiment of this invention. Illustration of jig mounting method [Explanation of symbols]
2 Base member 3 Electrode 4 Substrate 8 Cylinder 10 Lid member 20 Holding mechanism 21 Top plate 22, 22A, 22B, 22C Substrate holding unit 24 Substrate holding pin 25A, 25B, 25C Base 26A, 26B, 26C Extendable part 27A, 27B, 27C Contact part 30d Reference line 30e, 30f Mark EL1, EL2 Edge line

Claims (2)

A lid member that forms a process chamber that is in close contact with the base and forms a sealed space; an electrode that is disposed in the process chamber and on which an object to be processed is placed; and is detachable inside the lid member In a plasma processing apparatus provided with a work presser that comes into contact with the work on the electrode and presses against the electrode while the cover member is in close contact with the base, when the work presser is mounted inside the cover member A workpiece pressing attachment jig in the plasma processing apparatus used, a transparent plate-shaped member, and a marking means formed on the plate-shaped member and serving as a mark of the mounting position when the workpiece pressing is mounted inside the lid member; A jig for attaching a workpiece press in a plasma processing apparatus, comprising: A lid member that forms a processing chamber that is in close contact with the base and forms a sealed space; an electrode that is disposed in the processing chamber and on which an object to be processed is placed; and is detachable inside the lid member And a work presser that is attached to the base and is in contact with the work on the electrode and presses against the electrode. The work presser used when the work presser is mounted on the inner side of the lid member. A mounting means for mounting a mounting member having a transparent plate-shaped member and a marking means formed on the plate-shaped member and serving as a mark of a mounting position when the work presser is mounted inside the lid member A plasma processing apparatus is provided.

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